Vibration meter sensor and measuring instrument

Abstract

The present invention discloses a vibrometer sensor, comprising a probe, a probe holder, and a housing body, which are sequentially assembled. A PCB mounting cavity is formed between the probe holder and the housing body, and a PCB board is disposed in the PCB mounting cavity. A circuit device for the vibrometer sensor is printed on the PCB board, and the probe and the PCB board are structurally conductively connected. Also disclosed is a measuring instrument having the vibrometer sensor. The present invention replaces the quartz crystal or artificially polarized ceramic structures of traditional piezoelectric vibrometers with a vibrometer sensor supplemented by a circuit device and a mechanical structure design. The vibrometer sensor has high measurement sensitivity, a low resonant frequency, and is not susceptible to acoustic interference. It also has a wide frequency response range, outputs a voltage signal, has strong anti-interference and impact resistance, a long service life, and a low production cost, which is only 1 / 5 of that of a piezoelectric vibrometer sensor. The manufacturing process is simple, and the sensor can be widely used in vibrometer products.

Description

Technical Field

[0001] The present invention relates to the technical field of sensors, and in particular to a vibration meter sensor and a measuring instrument. Background Art

[0002] Currently, the vast majority of vibrometers on the market use piezoelectric accelerometer sensors, which utilize the piezoelectric effect of quartz crystals and artificially polarized zircon (PZT) ceramics. Piezoelectric accelerometers have high output impedance, weak charge output signals, low sensitivity, and susceptibility to electromagnetic interference from the space environment. Furthermore, because they are made of piezoelectric crystals or ceramic materials, they generally have a medium response frequency (10 kHz) and a high resonant frequency, making them susceptible to acoustic interference. Quartz crystals and ceramic materials also suffer from poor impact resistance, fragility, short service life, high cost, and complex manufacturing processes. As the core components of the entire vibrometer, the quartz crystal and artificially polarized zircon are often in direct contact with the measured surface, making them susceptible to damage as vibration intensity increases. They also suffer from poor anti-interference and low sensitivity. Furthermore, existing accelerometer sensors, due to their simple structure and lack of internal voltage stabilization and filtering components, lack a stable power supply signal, and are therefore unable to output an acceleration voltage signal with high measurement accuracy and interference immunity, resulting in certain measurement limitations.

[0003] Therefore, the present invention focuses on improving the performance of the sensor by changing the structure and internal circuit of the sensor. Summary of the Invention

[0004] In order to overcome the above technical problems, the present invention discloses a vibration meter sensor and a measuring instrument.

[0005] The technical solution adopted by the present invention to achieve the above-mentioned purpose is:

[0006] A vibration meter sensor comprises a probe, a probe bracket and a housing body which are assembled in sequence;

[0007] A PCB mounting cavity is formed between the probe bracket and the housing body, and a PCB board is arranged in the PCB mounting cavity;

[0008] A circuit device for a vibration meter sensor is printed on the PCB board, and the probe is conductively connected to the PCB board structure.

[0009] The vibrometer sensor described above, wherein the probe bracket includes an integrally formed probe mounting end and a PCB mounting end, the probe mounting end is assembled with the probe, the PCB mounting end is provided with a PCB mounting slot, and the PCB mounting end is assembled with the housing body by a locking nut;

[0010] A PCB fixing bracket is adaptively provided in the housing body, and the PCB installation cavity is formed between the PCB installation groove and the PCB fixing bracket.

[0011] The above-mentioned vibrometer sensor, wherein the shell body includes an integrally formed bracket mounting end and a locking end, a first through hole and a second through hole are respectively provided through the bracket mounting end and the locking end, the PCB mounting end is passed through the first through hole, and a locking cover body is assembled and provided on the second through hole.

[0012] In the above-mentioned vibration meter sensor, the PCB fixing bracket includes a positioning seat, and a first limit mounting seat and a second limit mounting seat arranged parallel to the positioning seat, and the PCB mounting cavity is formed between the PCB mounting groove, the first limit mounting seat and the second limit mounting seat.

[0013] In the above-mentioned vibration meter sensor, a rubber ring for abutting against the housing body is provided around the first limit mounting seat and the second limit mounting seat.

[0014] In the above-mentioned vibrometer sensor, the circuit device includes a sensor chip, a signal conditioning unit and a signal transmission unit that are electrically connected, and the signal transmission unit extends from the PCB fixing bracket.

[0015] The above-mentioned vibrometer sensor, wherein the signal conditioning unit includes a first filter, a voltage stabilizer, a second filter, a third filter and a fourth filter;

[0016] The signal transmission unit is sequentially connected in series with the first filter, the voltage stabilizer, the second filter, the third filter, the sensor chip and the fourth filter through leads, and the signal transmission unit is externally connected to a power supply module.

[0017] In the above-mentioned vibrometer sensor, pins 2 and 3 of the sensor chip are electrically connected to the third filter, pin 7 of the sensor chip is electrically connected to the fourth filter, and pins 10, 11, 12 and 14 of the sensor chip are grounded.

[0018] In the above-mentioned vibrometer sensor, the sensor chip is a MEMS accelerometer chip or a gyroscope chip.

[0019] A measuring instrument with a vibrometer sensor comprises the above-mentioned vibrometer sensor.

[0020] The beneficial effects of the present invention include the following:

[0021] (1) The present invention replaces the quartz crystal or artificially polarized ceramic structure of the traditional piezoelectric vibrometer with the circuit device and the vibrometer sensor supplemented by the mechanical structure design. Compared with the traditional piezoelectric vibrometer sensor, it has the following advantages: high measurement sensitivity, some of which are as high as 100mV / g; low resonant frequency, not easily affected by sound wave interference; wide frequency response range, some of which are as high as 15kHz; output is a voltage signal, with strong anti-interference ability; strong impact resistance and long service life; low production cost, only 1 / 5 of that of the piezoelectric vibrometer sensor; simple production process, and can be widely used in vibrometer products;

[0022] (2) The probe, probe holder and housing body are designed to be a detachable connection structure, which is convenient for quick installation and replacement of corresponding components, thereby improving the assembly flexibility and reliability of the sensor; wherein, the PCB mounting cavity is specifically divided to ensure that the PCB board is firmly installed, thereby avoiding damage to the PCB board under high vibration intensity, thereby causing defects such as poor anti-interference ability and low sensitivity of the sensor, and the probe holder is optimized to be installed with the probe at one end and the PCB board at the other end, thereby improving the installation reliability of the PCB board, facilitating the direct transmission of the measurement signal to the micro-mechanical electronic system integrated chip, greatly optimizing the conversion efficiency of the vibration signal and the electrical signal, and avoiding the problem of electromagnetic interference from the space environment;

[0023] (3) The first filter C101, the voltage stabilizer U1, the second filter C102, and the third filter C103 are sequentially provided at the input end of the sensor chip S1 to provide a stable power signal supply to the sensor chip S1 after performing power signal filtering, power signal voltage stabilization, and power signal secondary filtering on the power signal output by the power module. The fourth filter C104 is provided at the output end of the sensor chip S1 to filter the acceleration voltage signal processed and output by the sensor chip S1 and then output it to the next stage for processing, so as to facilitate the measurement of the static acceleration of gravity and the dynamic acceleration generated by movement, impact or vibration in the tilt sensing application. The output sensitivity is high and the voltage signal has strong anti-interference ability. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The present invention will be further described below with reference to the accompanying drawings and examples.

[0025] Figure 1 Schematic diagram of the front view of the vibration meter sensor of the present invention;

[0026] Figure 2 Schematic diagram of the explosion of the vibration meter sensor in the present invention;

[0027] Figure 3 is a front view schematic diagram of a measuring instrument having a vibrometer sensor according to the present invention;

[0028] Figure 4 FIG. 4 is a circuit diagram of the circuit device of the present invention. DETAILED DESCRIPTION

[0029] The present invention is further described below by means of specific examples to make the technical solution of the present invention easier to understand and grasp, rather than to limit the present invention.

[0030] Example: See Figures 1 to 4 The present embodiment provides a vibration meter sensor 1, which includes a probe 11, a probe bracket 12 and a housing body 14 that are assembled in sequence;

[0031] A PCB mounting cavity is formed between the probe bracket 12 and the housing body 14 , and a PCB board 15 is disposed in the PCB mounting cavity;

[0032] A circuit device for a vibration meter sensor is printed on the PCB board 15 , and the probe 11 is structurally conductively connected to the PCB board 15 .

[0033] Preferably, the probe bracket 12 includes an integrally formed probe mounting end and a PCB mounting end, the probe mounting end is assembled with the probe 11, the PCB mounting end is provided with a PCB mounting slot, and the PCB mounting end is locked and assembled with the housing body 14 via a locking nut 13;

[0034] A PCB fixing bracket 16 is adaptively provided in the housing body 14 , and the PCB mounting cavity is formed between the PCB mounting slot and the PCB fixing bracket 16 . Specifically, the PCB fixing bracket 16 is generally made of metal and processed into the required shape and size, and cooperates with the probe bracket 12 to fix the PCB board 15 .

[0035] Specifically, the probe 11, probe bracket 12 and shell body 14 are designed to be a detachable connection structure, which is convenient for rapid installation and replacement of corresponding components, thereby improving the assembly flexibility and reliability of the sensor; wherein, the PCB mounting cavity is specifically divided to ensure that the PCB board 15 is firmly installed, thereby avoiding damage to the PCB board 15 under high vibration intensity, thereby causing defects such as poor anti-interference ability and low sensitivity of the sensor, and the probe bracket 12 is optimized to install the probe 11 at one end and the PCB board 15 at the other end, which can improve the installation reliability of the PCB board 15, facilitate the direct transmission of the measurement signal to the circuit device, greatly optimize the conversion efficiency of the vibration signal and the electrical signal, and avoid the problem of electromagnetic interference from the space environment.

[0036] Specifically, the probe bracket 12 is generally made of metal material and processed into the required shape and size, generally but not limited to aluminum alloy, stainless iron, stainless steel and other materials, and is used to fix the probe 11 and the PCB board 15. The processing method is CNC turning or mold forming, and some materials need to be surface treated to prevent oxidation and rust.

[0037] Preferably, the shell body 14 includes an integrally formed bracket mounting end and a locking end, and a first through hole and a second through hole are respectively provided through the bracket mounting end and the locking end, the PCB mounting end is inserted into the first through hole, and a locking cover 18 is assembled and provided in the second through hole; specifically, the shell body 14 is generally made of metal material and processed into the required shape and size to form the outer shell of the entire sensor. The material of the shell body 14 is metal, plastic and other materials, and the processing method is CNC turning (gonging) or mold forming, and some materials need to be surface treated to prevent oxidation and rust.

[0038] Specifically, a first external thread is provided around the outer peripheral surface of the locking cover body 18, and a first internal thread is provided in the second through hole corresponding to the first external thread. The use of threaded connection can improve assembly flexibility and reliability; the locking cover body 18 is generally made of but not limited to aluminum alloy, stainless iron, stainless steel, plastic and other materials, and the processing method is CNC turning or mold forming, and some materials need to be surface treated to prevent oxidation and rust.

[0039] Furthermore, the PCB fixing bracket 16 includes a positioning seat, and a first limiting mounting seat and a second limiting mounting seat arranged parallel to the positioning seat. The PCB mounting cavity is formed between the PCB mounting groove, the first limiting mounting seat and the second limiting mounting seat. The first limiting mounting seat and the second limiting mounting seat stably clamp the PCB board 15, which can improve the assembly stability and positioning accuracy of the PCB board 15 and avoid damage to the PCB board 15 under high vibration intensity. Specifically, the PCB fixing bracket 16 is generally made of, but not limited to, aluminum alloy, stainless steel, stainless steel, plastic and other materials, and is processed by CNC turning (gonging) or mold forming. Some materials require surface treatment to prevent oxidation and rust.

[0040] Furthermore, a rubber ring 17 for abutting against the shell body 14 is provided around the first limit mounting seat and the second limit mounting seat; specifically, the rubber ring 17 is made of rubber in the required size and shape, and is used to seal and fasten the PCB board 15 and the PCB fixing bracket 16. The processing method is mold molding or the like. Parameters such as rubber hardness are not specified, and parameters such as lifespan and aging are not specified.

[0041] Furthermore, a third through hole for the lead wire to pass through is provided through the positioning seat, thereby improving the installation reliability of the lead wire and avoiding the transmission of electrical signals affected by higher vibration intensity.

[0042] Furthermore, a second external thread is provided around the outer circumference of the shell body 14, and the locking nut 13 is adaptively provided with a second internal thread corresponding to the second external thread. The threaded connection can improve assembly flexibility and reliability.

[0043] Specifically, at least two sets of locking nuts are provided transversely through the shell body 14 , and the locking nuts are used to fix the PCB fixing bracket 16 when the PCB fixing bracket 16 is installed in the shell body 14 , thereby further preventing the PCB board 15 from loosening.

[0044] Furthermore, a fourth through hole is provided through the locking nut 13 for the PCB mounting end to pass through. The aperture of the fourth through hole is smaller than the outer diameter of the PCB mounting end, ensuring that the locking nut 13 firmly locks the PCB mounting end and the shell body 14. Specifically, the locking nut 13 is made of metal, plastic and other materials, and is processed by CNC turning or mold forming. Some materials need to be surface treated to prevent oxidation and rust.

[0045] Preferably, the probe 11 includes an integrally formed detection end, a limiting end and an assembly end, a third external thread is provided around the outer peripheral surface of the assembly end, and the probe mounting end is adaptively provided with a third internal thread corresponding to the third external thread. The use of threaded connection can improve assembly flexibility and reliability; specifically, the probe 11 is a measuring probe, which is generally made of metal material and processed into the required shape and size of the probe 11, generally but not limited to aluminum alloy, stainless iron, stainless steel and other materials, used in different measurement environments, and the processing method is CNC turning or mold forming, and some materials need to be surface treated to prevent oxidation and rust.

[0046] Furthermore, an installation limiting protrusion is provided around the limiting end, which facilitates limiting the installation depth of the probe 11 on the one hand, and facilitates hand-held installation and removal of the probe 11 on the other hand.

[0047] Preferably, the circuit device comprises a sensor chip S1, a signal conditioning unit and a signal transmission unit that are electrically connected;

[0048] The signal conditioning unit includes a first filter C101, a voltage stabilizer U1, a second filter C102, a third filter C103 and a fourth filter C104;

[0049] The signal transmission unit is connected in series with the first filter C101, the voltage regulator U1, the second filter C102, the third filter C103, the sensor chip S1 and the fourth filter C104 in sequence through leads. The signal transmission unit is externally connected to a power supply module; specifically, the power supply module is an external DC single power supply;

[0050] Pins 2 and 3 of the sensor chip S1 are electrically connected to the third filter C103 , pin 7 of the sensor chip S1 is electrically connected to the fourth filter C104 , and pins 10 , 11 , 12 and 14 of the sensor chip S1 are grounded.

[0051] Specifically, the first filter C101, the voltage stabilizer U1, the second filter C102, and the third filter C103 are sequentially arranged at the input end of the sensor chip S1 to provide a stable power signal supply to the sensor chip S1 after performing power signal filtering, power signal voltage stabilization, and power signal secondary filtering on the power signal output by the power module. The output end of the sensor chip S1 is provided with the fourth filter C104 to filter the acceleration voltage signal processed and output by the sensor chip S1 and then output it to the next stage for processing, which is convenient for measuring the static acceleration of gravity in tilt sensing applications, as well as the dynamic acceleration generated by motion, impact or vibration. The output sensitivity is high and the voltage signal has strong anti-interference ability.

[0052] Preferably, the sensor chip S1 is a MEMS accelerometer chip or a gyroscope chip; the sensor chip is a complete acceleration measurement system that implements an open-loop acceleration measurement architecture, and its output signal is an analog voltage proportional to acceleration. The chip can measure data such as the static acceleration of gravity in tilt sensing applications, and the dynamic acceleration generated by motion, impact or vibration; specifically, the sensor chip S1 is a polysilicon surface micromechanical structure built on a silicon wafer, and the polysilicon spring suspends the structure on the wafer surface and provides resistance to acceleration force; the deflection of the micromechanical structure is measured using a differential capacitor, which consists of an independent fixed plate and a plate attached to the moving mass, and the fixed plate is driven by a 180° out-of-phase square wave; during measurement, the acceleration causes the moving mass to offset, causing the differential capacitor to lose balance, thereby generating a sensor output with an amplitude proportional to the acceleration, and then phase-sensitive demodulation technology is used to determine the magnitude and direction of the acceleration.

[0053] Specifically, the types of the sensor chip S1 include but are not limited to piezoelectric, piezoresistive, capacitive, etc. The number of axes of the sensor chip S1 is single-axis, dual-axis, triple-axis and multi-axis, etc. The installation method of the sensor chip S1 is generally surface mount installation, and rarely pin installation. The chip is soldered to the PCB board by reflow soldering.

[0054] Preferably, the signal transmission unit includes a first lead VDD, a second lead OUT and a third lead GND, the first lead VDD is electrically connected to the power supply module and the positive pole of the first filter C101, the second lead OUT is electrically connected to the positive pole of the fourth filter C104, and the third lead GND is grounded; specifically, the first lead VDD, the second lead OUT and the third lead GND are general cable lead wires or output devices such as terminal blocks.

[0055] Preferably, the voltage stabilizer U1 includes an input terminal IN, an output terminal OUT and a ground terminal GND. The input terminal IN and the output terminal OUT are electrically connected to the positive pole of the first filter C101 and the positive pole of the second filter C102, respectively, and the ground terminal GND is grounded. Specifically, the selection of the voltage stabilizer U1 depends on the power supply conditions. If the conditions are met, the device can be omitted. If the conditions are insufficient, the device needs to be set.

[0056] Preferably, the first filter C101, the second filter C102, the third filter C103 and the fourth filter C104 are all capacitive filters or inductive filters.

[0057] Specifically, the negative electrodes of the first filter C101 , the second filter C102 , the third filter C103 and the fourth filter C104 are grounded.

[0058] Preferably, the voltage regulator U1 is an LDO low dropout voltage regulator U1 or a DC-DC converter.

[0059] Specifically, the PCB board 15 is made of commonly used PCB material, generally but not limited to FR-4, and can be a multi-layer board or a single-layer board with different thicknesses. The device assembly method is surface mounting or pin welding, etc. In order to increase the fixing reliability, it is usually necessary to add glue and fix it with a bracket.

[0060] Furthermore, by replacing the quartz crystal or artificially polarized ceramic structures of a traditional piezoelectric vibrometer with the circuit device and the vibrometer sensor supplemented by the mechanical structure design, the vibrometer sensor of this embodiment has the following advantages compared to traditional piezoelectric vibrometer sensors: high measurement sensitivity, with some reaching up to 100 mV / g; low resonant frequency, not easily affected by acoustic interference; wide frequency response range, with some reaching up to 15 kHz; output as a voltage signal, with strong anti-interference capability; strong impact resistance and long service life; low production cost, only 1 / 5 of that of a piezoelectric vibrometer sensor; simple manufacturing process, and can be widely used in vibrometer products.

[0061] The vibration meter sensor of the present invention has the following advantages:

[0062] (1) The present invention replaces the quartz crystal or artificially polarized ceramic structure of the traditional piezoelectric vibrometer with the circuit device and the vibrometer sensor supplemented by the mechanical structure design. Compared with the traditional piezoelectric vibrometer sensor, it has the following advantages: high measurement sensitivity, some of which are as high as 100mV / g; low resonant frequency, not easily affected by sound wave interference; wide frequency response range, some of which are as high as 15kHz; output is a voltage signal, with strong anti-interference ability; strong impact resistance and long service life; low production cost, only 1 / 5 of that of the piezoelectric vibrometer sensor; simple production process, and can be widely used in vibrometer products;

[0063] (2) The probe, probe holder and housing body are designed to be a detachable connection structure, which is convenient for quick installation and replacement of corresponding components, thereby improving the assembly flexibility and reliability of the sensor; wherein, the PCB mounting cavity is specifically divided to ensure that the PCB board is firmly installed, thereby avoiding damage to the PCB board under high vibration intensity, thereby causing defects such as poor anti-interference ability and low sensitivity of the sensor, and the probe holder is optimized to be installed with the probe at one end and the PCB board at the other end, thereby improving the installation reliability of the PCB board, facilitating the direct transmission of the measurement signal to the micro-mechanical electronic system integrated chip, greatly optimizing the conversion efficiency of the vibration signal and the electrical signal, and avoiding the problem of electromagnetic interference from the space environment;

[0064] (3) The first filter C101, the voltage stabilizer U1, the second filter C102, and the third filter C103 are sequentially provided at the input end of the sensor chip S1 to provide a stable power signal supply to the sensor chip S1 after performing power signal filtering, power signal voltage stabilization, and power signal secondary filtering on the power signal output by the power module. The fourth filter C104 is provided at the output end of the sensor chip S1 to filter the acceleration voltage signal processed and output by the sensor chip S1 and then output it to the next stage for processing, so as to facilitate the measurement of the static acceleration of gravity and the dynamic acceleration generated by movement, impact or vibration in the tilt sensing application. The output sensitivity is high and the voltage signal has strong anti-interference ability.

[0065] The above description is merely a preferred embodiment of the present invention and does not constitute any form of limitation to the present invention. Any person skilled in the art can, without departing from the scope of the present invention, utilize the above-disclosed technical means and technical content to make many possible variations and modifications to the present invention, or modify it into equivalent embodiments with equivalent variations. Therefore, any equivalent variations made in accordance with the shape, structure, and principle of the present invention that do not depart from the content of the present invention's technical solution should be included in the scope of protection of the present invention.

Claims

1. A vibration meter sensor, characterized in that It includes a probe, a probe bracket and a housing body which are assembled in sequence; A PCB mounting cavity is formed between the probe bracket and the housing body, and a PCB board is arranged in the PCB mounting cavity; A circuit device for a vibration meter sensor is printed on the PCB board, and the probe is conductively connected to the PCB board structure; The probe bracket includes an integrally formed probe mounting end and a PCB mounting end, the probe mounting end is assembled with the probe, the PCB mounting end is provided with a PCB mounting slot, and the PCB mounting end is assembled with the housing body by a locking nut; A PCB fixing bracket is adaptively provided in the housing body, and the PCB mounting cavity is formed between the PCB mounting groove and the PCB fixing bracket; The PCB fixing bracket includes a positioning seat, and a first limiting mounting seat and a second limiting mounting seat arranged parallel to the positioning seat. The PCB mounting cavity is formed between the PCB mounting groove, the first limiting mounting seat and the second limiting mounting seat.

2. The vibrometer sensor according to claim 1, wherein: The shell body includes an integrally formed bracket mounting end and a locking end, and a first through hole and a second through hole are respectively provided through the bracket mounting end and the locking end. The PCB mounting end is inserted into the first through hole, and a locking cover body is assembled and provided in the second through hole.

3. The vibrometer sensor according to claim 2, wherein: A rubber ring for abutting against the shell body is provided around the first limit mounting seat and the second limit mounting seat.

4. The vibrometer sensor according to claim 3, wherein: The circuit device includes a sensor chip, a signal conditioning unit, and a signal transmission unit that are electrically connected. The signal transmission unit extends from the PCB fixing bracket.

5. The vibrometer sensor according to claim 4, characterized in that The signal conditioning unit includes a first filter, a voltage stabilizer, a second filter, a third filter and a fourth filter; The signal transmission unit is sequentially connected in series with the first filter, the voltage stabilizer, the second filter, the third filter, the sensor chip and the fourth filter through leads, and the signal transmission unit is externally connected to a power supply module.

6. The vibrometer sensor according to claim 5, characterized in that Pins 2 and 3 of the sensor chip are electrically connected to the third filter, pin 7 of the sensor chip is electrically connected to the fourth filter, and pins 10, 11, 12, and 14 of the sensor chip are grounded.

7. The vibrometer sensor according to claim 6, wherein: The sensor chip is a MEMS accelerometer chip or a gyroscope chip.

8. A measuring instrument having a vibrometer sensor, characterized in that It comprises the vibrometer sensor according to any one of claims 1 to 7.

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