Slide and glue spraying structure for hollow structure chip glue spraying

Abstract

The application discloses a slide for spraying photoresist on a hollow-structured chip and a spraying structure, and the slide comprises a horizontally arranged circular slide body, and a plurality of vertically arranged supporting columns are uniformly distributed on the slide body, the area of each supporting column is smaller than the gap formed by the hollow-structured chips which are arranged at intervals on a wafer to be supported, and the heights of all the supporting columns protruding from the slide body are consistent and are 0.05-0.15 mm. The slide can not only effectively reduce photoresist diffraction, but also uniformly support the wafer, reduce the occurrence of wafer cracking, and improve the yield of chip production.

Description

TECHNICAL FIELD

[0001] The present application belongs to the field of MEMS device photoetching, and particularly relates to a carrier sheet and a glue spraying structure for hollow structure chip glue spraying. BACKGROUND

[0002] The development trend of MEMS devices is higher and higher precision requirements and smaller and smaller size. The existing MEMS devices such as Figure 1 As shown in the figure, a plurality of hollow structure chips 2 are uniformly and spacedly arranged on a wafer 1.

[0003] For the hollow structure chip on the wafer, electrodes are usually made on the front surface, back surface and side surface of the chip, that is, photoresist is coated on the front surface, back surface and side surface of the chip as a protective layer during etching. However, the hollow structure chip cannot be coated with conventional spin-on photoresist, so spray coating is usually used. At present, a circular carrier sheet is used to support the wafer, and then glue is sprayed. However, during the photoresist spraying process, due to the small size of the photoresist droplets, a part of the photoresist will be diffracted to the back surface under the action of the airflow during the front surface spraying. The diffracted photoresist will affect the shape of the electrode after exposure, causing device failure. In addition, the annular carrier sheet cannot uniformly support the wafer, especially during the thin sheet etching process, the wafer is prone to breakage due to uneven stress, and the airflow during glue spraying will exacerbate the cracking, reducing the yield of chip production. SUMMARY

[0004] In view of the above problems existing in the prior art, the purpose of the present application is to provide a carrier sheet and a glue spraying structure for hollow structure chip glue spraying. The carrier sheet can not only effectively reduce photoresist diffraction, but also uniformly support the wafer, reduce the occurrence of cracking, and improve the yield of chip production.

[0005] The technical solution of the present application is as follows:

[0006] The carrier sheet for hollow structure chip glue spraying comprises a horizontally arranged circular carrier body, a plurality of vertically arranged support columns are uniformly distributed on the carrier body, the area occupied by each support column is smaller than the gap formed by the uniformly spaced hollow structure chips on the wafer to be supported, and the heights of all support columns protruding from the carrier body are consistent and are 0.05-0.15mm.

[0007] Further, the support columns are in the form of a hemisphere, a cylinder or a multi-layer cylinder.

[0008] Further, the support columns are made by a spot welding machine.

[0009] The glue spraying structure for the hollow structure chip glue spraying comprises a wafer and hollow structure chips uniformly and intervally distributed on the wafer, and further comprises the aforementioned carrier sheet, the wafer is horizontally placed above the carrier sheet, and all the supporting columns on the carrier sheet body are arranged on the wafer corresponding to the gaps between the hollow structure chips, so that the wafer is supported.

[0010] Compared with the prior art, the present application has the following beneficial effects:

[0011] The supporting columns on the carrier sheet body are uniformly distributed, and compared with the existing ring-shaped carrier sheet, the wafer can be uniformly supported, so that the wafer will not be damaged due to uneven stress, and the occurrence of chipping is reduced; the contact area of the carrier sheet and the wafer can also be effectively reduced, so as to avoid damaging the back surface of the wafer. At the same time, the influence of airflow on the wafer during the glue spraying process can also be avoided, thereby being beneficial to improving the yield of chip production.

[0012] In addition, the supporting column is limited to 0.05-0.15mm, and through experimental verification, at this height, not only can the wafer be supported, but also during the process of spraying photoresist on the front surface of the hollow structure chip, the photoresist generally will not diffract to the back surface of the hollow structure chip, so as to avoid the device failure caused by photoresist diffraction, and further improve the yield of chip production. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 -Structure diagram of wafer and hollow structure chip.

[0014] Figure 2 -Structure diagram of carrier sheet.

[0015] Figure 3 -Production process of supporting column.

[0016] Figure 4 -Structure diagram of glue spraying structure.

[0017] Among them: 1-wafer; 2-hollow structure chip; 3-carrier sheet body; 4-supporting column. DETAILED DESCRIPTION

[0018] The present application will be further described in detail below in combination with the drawings and specific embodiments.

[0019] Reference Figure 1 , Figure 2 and Figure 4The application discloses a carrier sheet for spraying glue on a hollow structure chip, which comprises a horizontally arranged circular carrier body 3, and a plurality of vertically arranged supporting columns 4 are uniformly distributed on the carrier body 3, wherein the area occupied by each supporting column 4 is smaller than the gap formed by the hollow structure chips 2 arranged at intervals on a wafer 1 to be supported, and the heights of all the supporting columns 4 protruding from the carrier body 3 are consistent and are 0.05-0.15 mm.

[0020] Firstly, the supporting columns herein serve as small supporting points, and the supporting columns on the carrier body are uniformly distributed, so that the wafer can be uniformly supported, the wafer will not be damaged due to uneven stress, and the influence of airflow on the wafer during the spraying process can be avoided, thereby improving the yield of chip production.

[0021] Secondly, the supporting columns are limited to 0.05-0.15 mm, and it is verified through experiments that, at this height, the wafer can be supported, and during the process of spraying photoresist on the front surface of the hollow structure chip, the photoresist will not be diffracted to the back surface of the hollow structure chip, thereby avoiding the device failure caused by photoresist diffraction and further improving the yield of chip production. This is similar to holding an umbrella in the rain, and if the height of the umbrella is too high, raindrops will float under the umbrella.

[0022] Thirdly, compared with the existing ring-shaped carrier sheet, the wafer is supported by the supporting columns, so that the contact area of the carrier sheet and the wafer can be effectively reduced, and damage to the back surface of the wafer can be avoided.

[0023] In specific implementation, the supporting columns 4 are in a hemispherical, cylindrical or multi-layer cylindrical structure.

[0024] If the supporting columns are in a hemispherical structure, the arc surface of the supporting columns is used to support the wafer. The supporting columns are manufactured by using the ball planting function of a spot welding machine, and the thickness and shape are controlled by applying a constant pressure to the top surface of the supporting columns. Figure 3 As shown in the drawing, the steps are as follows: first, a metal film is plated on the carrier body by using a magnetron sputtering film plating machine, then two virtual lines passing through the center of the circle and being perpendicular to each other are drawn on the carrier body, a first supporting column is planted at the intersection of the two lines, and a constant pressure is applied to the supporting column to control the thickness and shape; second, a circle is drawn with the position of the first supporting column as the center and with 2 / 5 of the radius of the carrier as the radius, and second to fifth supporting columns are uniformly planted on the circle; third, a circle is drawn with the position of the first supporting column as the center and with 4 / 5 of the radius of the carrier as the radius, and sixth to thirteenth supporting columns are uniformly planted on the circle. The supporting columns planted on the metal film have sufficient adhesion, and will not fall off under normal operation and cleaning, and can be repeatedly used.

[0025] Referring to Figure 4The glue spraying structure for the hollow structure chip glue spraying comprises a wafer 1, hollow structure chips 2 uniformly and intervally distributed on the wafer 1, and a carrier as described above, wherein the wafer 1 is horizontally placed above the carrier, and all the supporting columns 3 on the carrier body 3 are arranged on the wafer 1 corresponding to the gaps between the hollow structure chips 2, so as to support the wafer 1.

[0026] Finally, it should be noted that the above embodiments of the present application are only examples for illustration, and are not intended to limit the embodiments of the present application. For those skilled in the art, other different forms of changes and variations can be made on the basis of the above description. Here, all the embodiments cannot be exhausted. Any obvious changes or variations derived from the technical solutions of the present application still fall within the protection scope of the present application.

Claims

1. A carrier for spraying adhesive onto a hollowed-out chip, characterized in that, The wafer includes a horizontally arranged circular substrate (3), on which several vertically arranged support columns (4) are evenly distributed. The area occupied by each support column (4) is smaller than the gap formed by the spaced hollow structure chips (2) on the wafer (1) to be supported. All support columns (4) protrude from the substrate (3) at the same height and are 0.05~0.15mm.

2. The carrier for spraying adhesive onto a hollowed-out chip according to claim 1, characterized in that, The support column (4) has a hemispherical, cylindrical or multi-layered cylindrical structure.

3. The carrier for spraying adhesive onto a hollowed-out chip according to claim 2, characterized in that, The support column is made using a spot welding machine.

4. A spray adhesive structure for spraying adhesive onto hollow structure chips, comprising a wafer (1) and hollow structure chips (2) uniformly spaced on the wafer (1), characterized in that, It also includes the carrier as described in any one of claims 1 to 3, wherein the wafer (1) is placed horizontally above the carrier, and all the support pillars (4) on the carrier body (3) are provided on the wafer (1) corresponding to the gap between the hollow structure chips (2), thereby achieving support for the wafer (1).

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