Recess depth measurement method, device, equipment and storage medium

Abstract

The application discloses a recess depth measurement method, device and equipment and a storage medium, and belongs to the technical field of vehicles. According to input component parameters, a deformation nephogram of a component to be measured is obtained; a plurality of pit measurement points corresponding to the component to be measured are selected based on the deformation nephogram; a plurality of reference surface reference points are determined according to the plurality of pit measurement points; a target reference plane is determined according to the plurality of reference surface reference points; and the recess depth of the component to be measured is determined according to the plurality of pit measurement points and the target reference plane. By inputting the coordinates of key nodes of each recess position, the automatic calculation of the recess depth size is realized in combination with the model after deformation, the efficiency is improved, and the calculated pit depth is closer to the real state.

Description

Technical Field

[0001] This invention relates to the field of vehicle technology, and in particular to a method, apparatus, device, and storage medium for measuring dent depth. Background Technology

[0002] With the rapid development of China's automotive industry, people's understanding of automobiles is constantly improving, and their requirements for the appearance quality of body panels are also increasing. Furthermore, the Chinese automotive market has a huge potential customer base, leading to increasingly fierce competition among OEMs. Shortening product development cycles and improving development efficiency have become goals pursued by OEMs. Consequently, OEMs are placing greater emphasis on research into the mechanisms and prediction methods for dents in body panels.

[0003] In existing technologies, many OEMs lack a direct analytical method for determining the depth of hood dents. They rely instead on design experience and the structural layout of benchmark vehicles, including the positions of influencing factors such as reinforcing patches, adhesive dots, and buffer blocks. When problems arise during the prototype stage, they can only resort to continuous verification and countermeasures, resulting in numerous and lengthy interventions and a significant amount of inefficient and repetitive work, severely impacting vehicle development costs, quality, and efficiency. Some OEMs have proposed quantifying dent dimensions using relative deformation of the outer panel and measurements of the chord height, but neither method accurately reflects the actual depth of the dent.

[0004] The above content is only used to help understand the technical solution of the present invention and does not represent an admission that the above content is prior art. Summary of the Invention

[0005] The main objective of this invention is to provide a method, apparatus, device, and storage medium for measuring the depth of a depression, aiming to solve the technical problems of low efficiency and inability to accurately reflect the actual depth of a depression in the prior art.

[0006] To achieve the above objectives, the present invention provides a method for measuring the depth of a depression, the method comprising the following steps:

[0007] The deformation cloud map of the component under test is obtained based on the input component parameters;

[0008] Based on the deformation cloud map, select multiple pit measurement points corresponding to the component under test;

[0009] Multiple reference points for reference surfaces are determined based on the multiple pit measurement points;

[0010] The target reference plane is determined based on the plurality of reference plane reference points;

[0011] The depth of the indentation of the component under test is determined based on multiple indentation measurement points and the target reference plane.

[0012] Optionally, the plurality of pit measurement points include at least the highest points of the pit edges;

[0013] The step of determining multiple reference points for a reference surface based on multiple pit measurement points includes:

[0014] Take the highest point of any pit edge as the reference pit edge highest point, and obtain N auxiliary reference points corresponding to the reference pit edge highest point within a preset range, where N≥1;

[0015] Multiple reference points are selected from the N auxiliary reference points based on a preset distance.

[0016] Optionally, the plurality of reference plane reference points include a first reference plane reference point, a second reference plane reference point, and a third reference plane reference point;

[0017] The process of selecting multiple reference points from the N auxiliary reference points based on a preset distance includes:

[0018] The distance between each of the N auxiliary reference points and the highest point of the edge of the reference pit is obtained respectively, and the auxiliary reference point with the smallest distance difference between the distance and the first preset distance is taken as the first reference surface reference point;

[0019] Obtain the distance between each of the remaining N-1 auxiliary reference points and the first reference surface reference point, and take the auxiliary reference point with the smallest distance difference between the distance and the second preset distance as the second reference surface reference point;

[0020] Obtain the distance between each of the remaining N-2 auxiliary reference points and the second reference surface reference point, and find the two auxiliary reference points with the smallest distance difference between the distance and the second preset distance. Then, select the third reference surface reference point from the two auxiliary reference points based on the third preset distance.

[0021] Optionally, the step of selecting a third reference surface point from the two auxiliary reference points based on a third preset distance includes:

[0022] The distances between each auxiliary reference point and the first reference surface reference point are obtained respectively, and the auxiliary reference point with the smallest distance difference between the distances is taken as the third reference surface reference point.

[0023] Optionally, the plurality of reference plane reference points include a first reference plane reference point, a second reference plane reference point, and a third reference plane reference point;

[0024] The process of selecting multiple reference points from the N auxiliary reference points based on a preset distance includes:

[0025] The distance between each of the N auxiliary reference points and the highest point of the edge of the reference pit is obtained respectively, and the auxiliary reference point with the smallest distance difference between the distance and the first preset distance is taken as the first reference surface reference point;

[0026] Calculate the first symmetrical reference point corresponding to the first reference surface reference point based on the highest point of the edge of the reference pit;

[0027] Obtain the distance between each of the remaining N-1 auxiliary reference points and the first symmetrical reference point, and take the auxiliary reference point with the smallest distance as the second reference plane reference point;

[0028] Obtain the distance between each of the remaining N-2 auxiliary reference points and the second reference surface reference point, and obtain a number of auxiliary reference points with the smallest distance difference between the distance and the second preset distance. Also obtain the distance between each auxiliary reference point and the highest point of the edge of the reference pit or the first reference surface reference point, and take the auxiliary reference point with the smallest distance difference between the distance and the second preset distance as the third reference surface reference point.

[0029] Optionally, the plurality of pit measurement points include the highest point of the pit edge and the lowest point of the pit;

[0030] The step of determining the indentation depth of the component under test based on multiple indentation measurement points and the target reference plane includes:

[0031] Obtain the distance between the highest point of each pit edge and the target reference plane, and the distance between the lowest point of each pit and the target reference plane;

[0032] The average distance is calculated based on the distance between the highest point of each pit edge and the target reference plane;

[0033] The depth of the indentation of the component under test is calculated based on the mean distance and the distance between the lowest point of the indentation and the target reference plane.

[0034] Optionally, after determining the indentation depth of the component under test based on the plurality of indentation measurement points and the target reference plane, the method further includes:

[0035] The indentation depth of the component under test is compared with a preset indentation depth threshold.

[0036] If the dent depth of the component under test is greater than the preset dent depth threshold, then the component under test is determined to have a dent.

[0037] Furthermore, to achieve the above objectives, the present invention also proposes a device for measuring the depth of a depression, the device comprising:

[0038] The module is used to obtain the deformation cloud map of the part under test based on the input part parameters;

[0039] The filtering module is used to select multiple pit measurement points corresponding to the component under test based on the deformation cloud map;

[0040] The filtering module is also used to determine multiple reference points of the reference surface based on the multiple pit measurement points;

[0041] The calculation module is used to determine the target reference plane based on the plurality of reference plane reference points;

[0042] The calculation module is also used to determine the indentation depth of the component under test based on the multiple indentation measurement points and the target reference plane.

[0043] Furthermore, to achieve the above objectives, the present invention also proposes a dent depth measuring device, the dent depth measuring device comprising: a memory, a processor, and a dent depth measuring program stored in the memory and running on the processor, the dent depth measuring program being configured to implement the dent depth measuring method as described above.

[0044] In addition, to achieve the above objectives, the present invention also proposes a storage medium storing a dent depth measurement program, which, when executed by a processor, implements the dent depth measurement method as described above.

[0045] This invention obtains a deformation cloud map of the component under test based on input component parameters; selects multiple pit measurement points corresponding to the component under test based on the deformation cloud map; determines multiple reference planes based on the multiple pit measurement points; determines a target reference plane based on the multiple reference planes; determines the pit depth of the component under test based on the multiple pit measurement points and the target reference plane; and, combined with the deformed model, automatically calculates the pit depth by inputting the coordinates of key nodes at each pit location, thus improving efficiency and making the calculated pit depth closer to the actual state. Attached Figure Description

[0046] Figure 1 This is a schematic diagram of the structure of the indentation depth measuring device in the hardware operating environment involved in the embodiments of the present invention;

[0047] Figure 2 This is a flowchart illustrating the first embodiment of the indentation depth measurement method of the present invention;

[0048] Figure 3This is a schematic diagram of a hand model in one embodiment of the indentation depth measurement method of the present invention;

[0049] Figure 4 This is a schematic diagram of node coordinates in one embodiment of the depression depth measurement method of the present invention;

[0050] Figure 5 This is a stress cloud diagram in one embodiment of the indentation depth measurement method of the present invention;

[0051] Figure 6 This is a displacement contour plot in one embodiment of the depression depth measurement method of the present invention;

[0052] Figure 7 This is a schematic diagram illustrating the definition of three points A, B, and C in a method for measuring the depth of a depression according to the present invention, and the quantification method of the depression depth.

[0053] Figure 8 This is a schematic diagram of the overall morphology of the dent on the outer panel of the hood in one embodiment of the dent depth measurement method of the present invention;

[0054] Figure 9 This is a schematic diagram showing a partial detail of a dent in the outer panel of the hood in one embodiment of the dent depth measurement method of the present invention;

[0055] Figure 10 This is a schematic diagram of cross section aa in one embodiment of the indentation depth measurement method of the present invention;

[0056] Figure 11 This is a flowchart illustrating the second embodiment of the indentation depth measurement method of the present invention;

[0057] Figure 12 This is a schematic diagram of the reference surface definition points in one embodiment of the depression depth measurement method of the present invention;

[0058] Figure 13 This is a schematic diagram illustrating the acquisition of the first reference surface reference point using the clockwise method in one embodiment of the depression depth measurement method of the present invention;

[0059] Figure 14 This is a schematic diagram illustrating the acquisition of the second and third reference plane reference points using a clockwise method in one embodiment of the depression depth measurement method of the present invention.

[0060] Figure 15 This is a schematic diagram of the first reference plane reference point and the acquisition of the first symmetrical reference point in an embodiment of the depression depth measurement method of the present invention;

[0061] Figure 16 This is a schematic diagram illustrating the acquisition of the second and third reference plane reference points using the symmetry method in one embodiment of the depression depth measurement method of the present invention.

[0062] Figure 17This is a flowchart illustrating the third embodiment of the indentation depth measurement method of the present invention;

[0063] Figure 18 This is a schematic diagram of the solver interface in one embodiment of the depression depth measurement method of the present invention;

[0064] Figure 19 This is a structural block diagram of the first embodiment of the indentation depth measuring device of the present invention.

[0065] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0066] It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of the invention.

[0067] Reference Figure 1 , Figure 1 This is a schematic diagram of the depression depth measurement device structure in the hardware operating environment involved in the embodiments of the present invention.

[0068] like Figure 1 As shown, the depression depth measuring device may include: a processor 1001, such as a central processing unit (CPU), a communication bus 1002, a user interface 1003, a network interface 1004, and a memory 1005. The communication bus 1002 is used to enable communication between these components. The user interface 1003 may include a display screen or an input unit such as a keyboard; optionally, the user interface 1003 may also include a standard wired interface or a wireless interface. The network interface 1004 may optionally include a standard wired interface or a wireless interface (such as a Wireless-Fidelity (Wi-Fi) interface). The memory 1005 may be a high-speed random access memory (RAM) or a stable non-volatile memory (NVM), such as a disk drive. The memory 1005 may also optionally be a storage device independent of the aforementioned processor 1001.

[0069] Those skilled in the art will understand that Figure 1 The structure shown does not constitute a limitation on the indentation depth measuring device and may include more or fewer components than shown, or combine certain components, or have different component arrangements.

[0070] like Figure 1As shown, the memory 1005, which serves as a storage medium, may include an operating system, a network communication module, a user interface module, and a depression depth measurement program.

[0071] exist Figure 1 In the dent depth measuring device shown, the network interface 1004 is mainly used for data communication with the network server; the user interface 1003 is mainly used for data interaction with the user; the processor 1001 and the memory 1005 in the dent depth measuring device of the present invention can be set in the dent depth measuring device, and the dent depth measuring device calls the dent depth measuring program stored in the memory 1005 through the processor 1001 and executes the dent depth measuring method provided in the embodiment of the present invention.

[0072] This invention provides a method for measuring the depth of a depression, referring to... Figure 2 , Figure 2 This is a flowchart illustrating the first embodiment of a method for measuring the depth of a depression according to the present invention.

[0073] In this embodiment, the method for measuring the depth of the depression includes the following steps:

[0074] Step S10: Obtain the deformation cloud map of the component under test based on the input component parameters.

[0075] In this embodiment, the executing entity can be the indentation depth measuring device, which has functions such as data processing, data communication, and program execution. The indentation depth measuring device can be a terminal device such as a computer, or other devices with similar functions; this embodiment does not limit this. For ease of explanation, this embodiment uses an indentation depth measuring device as an example.

[0076] It should be noted that, in existing technologies, many OEMs lack a direct analytical method for determining the depth of hood dents. Instead, they rely on design experience and the structural layout of benchmark vehicles, including the positions of influencing factors such as reinforcing patches, adhesive dots, and buffer blocks. When problems arise during the prototype stage, they can only resort to continuous verification and countermeasures, resulting in numerous and lengthy countermeasures, leading to a large amount of inefficient and repetitive work, severely impacting vehicle development costs, quality, and efficiency. Some OEMs have proposed quantifying dent dimensions using relative deformation of the outer panel and chord height measurements, but neither method accurately reflects the actual depth of the dent.

[0077] To address the aforementioned technical issues, this embodiment simplifies the stress model of the hood outer panel to establish a positive CAE detection method for hood outer panel dent depth. This allows for the identification of defects and proactive countermeasures at the digital stage, resulting in higher efficiency. For post-processing after CAE detection, a new dent depth quantification method consistent with actual detection methods is proposed. This method can improve the relative depth accuracy of local dents to 1 μm, compared to the current 0.1 mm, achieving micrometer-level precision. Finally, considering the large number of mesh nodes on the hood outer panel and the potential for numerous dent locations, the computational load is significant. To improve computational efficiency, a general-purpose VBA solver is developed, which automatically calculates the dent depth by inputting the coordinates of key nodes at each dent location.

[0078] In this specific implementation, the stress on the hood assembly is first simplified, and a CAE analytical model is established to obtain the following results: Figure 3 The force model shown applies constraints to the hinge base and hood lock cylinder positions, and applies loads to the rubber strip positions, resulting in a hood plate retention model. Here, F1 / F2 / F4 are the rubber strip reaction forces, F3 is the buffer block reaction force, and G is the weight of the hood assembly, including the final assembly. Input component parameters include, but are not limited to, material grade, thickness, rubber strip reaction force, and buffer block reaction force (RUB). After inputting these parameters, the corresponding output results can be obtained, including the node coordinates after the hood outer panel deformation, as follows: Figure 4 As shown in the diagram. The stress and deformation displacement contour plots of the outer hood panel are as follows. Figure 5 and Figure 6 As shown. The theoretical analysis of the indentation depth quantification logic yields points P1, P2, and P3 defining the equation of the reference plane, establishing the equation of the reference plane S. The distances from the indentation edges A and C and the deepest point B to the reference plane S are calculated, ultimately determining the indentation depth. Based on the theoretical indentation depth quantification logic, a VBA solver is built. By inputting the coordinates of the indentation location nodes, the indentation depth is automatically calculated. The obtained indentation depth is compared with the target value of 35μm. If the depth is greater than 35μm, an indentation is identified, requiring further action; otherwise, no indentation is identified.

[0079] It should be further noted that in this embodiment, the morphology of the deformed outer hood panel is illustrated with a wavy line. A recess is formed between points A, B, and C, as shown below. Figure 7 As shown. Point A is defined as the highest point of the pit's edge, point B as the lowest point of the pit, point C as the highest point of another pit's edge, and point B' as a point on the straight line connecting A and C. Theoretically, A-B'-C is set as a plane, and the pit depth is 0. A measurement reference plane S is defined through point A, and the pit depth H can be approximately obtained as shown in Formula 1.

[0080] H=HB-HB′≈HB-(HA+HC) / 2 (1)

[0081] Where HB' is the distance from point B' to the measurement reference plane S, HA is the distance from point A to the measurement reference plane S, HC is the distance from point C to the measurement reference plane S, and HB is the distance from point B to the measurement reference plane S.

[0082] It should be noted that, according to Formula 1, to obtain the pit depth H, the distances HA, HB, and HC from points A, B, and C to the measurement reference plane S are required. Any plane S can be represented by the following plane equation, as shown in Formula 2.

[0083] S:Dx+Ey+Fz+G=0 (2)

[0084] Among them, D, E, F and G are constants.

[0085] Furthermore, the distance h from any point P(x1, y1, z1) to plane S can be obtained using the following equation for the distance from a point to a plane, as shown in Formula 3. The sign of the calculated value indicates the position of point P relative to the normal direction of the plane; positive indicates the same direction, and negative indicates the opposite direction.

[0086]

[0087] The coordinates of points A, B, and C are known. Substituting them into Formula 3 yields HA, HB, and HC. Therefore, the final equation of the reference plane S needs to be obtained. Thus, if the depth of the depression needs to be measured, the reference plane S must be determined first.

[0088] Furthermore, in determining the reference plane S, this embodiment uses three points that are not on the same straight line to define the plane. Given three points P1(x1, y1, z1), P2(x2, y2, z2), and P3(x3, y3, z3), the normal vector of the plane is obtained using Formula 4. Formulas 5, 6, 7, and 8 yield constants A, B, C, and D, respectively. Thus, plane S can be fully defined according to formula 2.

[0089]

[0090] D=(y2-y1)*(z3-z1)-(y3-y1)*(z2-z1) (5)

[0091] E=(z2-z1)*(x3-x1)-(z3-z1)*(x2-x1) (6)

[0092] F=(x2-x1)*(y3-y1)-(x3-x1)*(y2-y1) (7)

[0093] G = -Dx1 - Ey1 - Fz1 (8)

[0094] It should be noted that in order to determine the reference plane S, three points P1, P2 and P3 on the plane are needed, which are the multiple reference plane reference points in this embodiment.

[0095] Step S20: Select multiple pit measurement points corresponding to the component under test based on the deformation cloud map.

[0096] It should be noted that the morphology of the pit can be visually obtained through the deformation cloud map. Depending on the length direction of the pit, a cross-section along the X or Y direction is selected. The following example uses the Y-direction cross-section aa; the overall morphology of the pit is as follows: Figure 8 As shown, Figure 9 Here is a larger image of the dent area. Figure 10 The diagram shows section aa. A, B, and C are the measurement points for the pit described in this embodiment.

[0097] Step S30: Determine multiple reference points for the reference surface based on the multiple pit measurement points.

[0098] In practice, multiple reference points can be determined based on the measurement points of the pits, such as... Figure 9 P1, P2, and P3 shown are the reference points of the datum surface obtained with A as the reference.

[0099] Step S40: Determine the target reference plane based on the plurality of reference plane reference points.

[0100] In the specific implementation, Figure 9 and Figure 10 The surface S shown is the target reference plane obtained based on the reference points P1, P2 and P3 of the reference surface.

[0101] Step S50: Determine the depth of the depression in the component to be measured based on the plurality of depression measurement points and the target reference plane.

[0102] In practice, after determining the target reference plane, the distance between each pit measurement point and the target reference plane can be obtained based on the coordinates of the pit measurement points. Then, the pit depth can be calculated according to Formula 1 above.

[0103] This embodiment obtains a deformation cloud map of the component under test based on the input component parameters; selects multiple pit measurement points corresponding to the component under test based on the deformation cloud map; determines multiple reference planes based on the multiple pit measurement points; determines a target reference plane based on the multiple reference planes; determines the pit depth of the component under test based on the multiple pit measurement points and the target reference plane; and, combined with the deformed model, automatically calculates the pit depth by inputting the coordinates of key nodes at each pit location, improving efficiency and making the calculated pit depth closer to the real state.

[0104] refer to Figure 11 , Figure 11 This is a flowchart illustrating a second embodiment of a method for measuring the depth of a depression according to the present invention.

[0105] Based on the first embodiment described above, step S30 in the depression depth measurement method of this embodiment specifically includes:

[0106] Step S301: Take the highest point of any pit edge as the reference pit edge highest point, and obtain N auxiliary reference points corresponding to the reference pit edge highest point within a preset range.

[0107] In this specific implementation, a 5mm grid is used. After determining the coordinates of the pit measurement points, the highest point of any pit edge is taken as the reference pit edge highest point, and N auxiliary references corresponding to the reference pit edge highest point within a preset range are obtained. The coordinates of each point in the grid are known. For example, after determining the coordinates of pit measurement points A, B, and C, the highest point of the pit edge A is taken as the reference pit edge highest point, and the distance between this point and other points in the grid is calculated. Then, within a range of 25mm, N auxiliary reference points closest to the highest point of the pit edge A are obtained. In this embodiment, N can be 64, but it can also be set to other values ​​according to actual needs. This embodiment does not impose any restrictions on this.

[0108] Step S302: Select multiple reference points from the N auxiliary reference points based on a preset distance.

[0109] In specific implementation, after obtaining N auxiliary reference points, this embodiment further filters out multiple reference surface reference points based on a preset distance, for example... Figure 12 As shown, A is the highest point of the pit edge, and P1, P2 and P3 are reference points of the datum plane.

[0110] It should be noted that in this embodiment, the distance between each of the N auxiliary reference points and the highest point of the reference pit edge is obtained, and the auxiliary reference point with the smallest difference between the distance and the first preset distance is taken as the first reference surface reference point. In this embodiment, the first preset distance can be set to 25mm. After obtaining the distance between each of the N auxiliary reference points and the highest point of the reference pit edge, the auxiliary reference point with the smallest difference between the distance and the first preset distance is found, that is, the auxiliary reference point among the N auxiliary reference points that is closest to 25mm from the highest point of the reference pit edge. This point is the first reference surface reference point. For example, assuming N is 64, then from the 64 auxiliary reference points, the auxiliary reference point P1 with the closest distance to the highest point A of the reference pit edge is found to be 25mm. P1 is the first reference surface reference point. Figure 13 As shown.

[0111] Furthermore, after determining the first reference surface, in this embodiment, the second and third reference surface reference points can be determined using a clockwise method or a symmetrical method.

[0112] In this specific implementation, the clockwise method will be used as an example. Specifically, after determining the first reference point, this embodiment further obtains the distance between each of the remaining N-1 auxiliary reference points and the first reference point, and selects the auxiliary reference point with the smallest difference between the distance and the second preset distance as the second reference point. In this embodiment, the second preset distance can be set to... That is, after obtaining the distances between each of the N-1 auxiliary reference points and the first reference surface reference point, the auxiliary reference point with the smallest difference between its distance and the second preset distance is found, which is the N-1 auxiliary reference points closest to the first reference surface reference point. The auxiliary reference point is the second reference plane reference point. For example, assuming N is 64, then the point closest to the first reference plane reference point P1 is found from the remaining N-1, or 63 auxiliary reference points. The auxiliary reference point P2 is the second reference plane reference point.

[0113] After determining the second reference plane reference point, this embodiment further obtains the distance between each of the remaining N-2 auxiliary reference points and the second reference plane reference point. In this embodiment, the second preset distance can be set to... That is, after obtaining the distances between each of the N-2 auxiliary reference points and the second reference surface reference point, the two auxiliary reference points with the smallest distance difference between their distances and the second preset distance are found; in other words, the two auxiliary reference points that are closest to the second reference surface reference point among the N-2 auxiliary reference points. Auxiliary reference points are used. It is important to emphasize that in this embodiment, two auxiliary reference points can be found, and then a third reference plane reference point is selected from these two auxiliary reference points based on a third preset distance. For example, assuming N is 64, the auxiliary reference points with the closest distance to the second reference plane reference point P2 are found from the remaining N-2, or 62 auxiliary reference points. Two auxiliary reference points, P3 and P3', are used. Then, a third reference point is selected from P3 and P3'. Specifically, in this embodiment, the distances between these two auxiliary reference points and the first reference point are calculated, and the auxiliary reference point with the smallest difference between its distance and a third preset distance is selected as the third reference point. In this embodiment, the third preset distance can be set to 50mm. For example, the distances between P3 and P3' and the first reference point P1 are calculated, denoted as d1 and d2 respectively. Assuming that the difference between d1 and the third preset distance is the smallest, that is, the distance between P3 and P1 is closer to 50mm, then P3 is the third reference point. The process of determining the second reference point P2 and the third reference point P3 is as follows: Figure 14 As shown.

[0114] Furthermore, this embodiment will use the symmetry method as an example for explanation. After determining the first reference plane reference point, this embodiment can calculate the first symmetrical reference point corresponding to the first reference plane reference point. The first reference plane reference point and the first symmetrical reference point are symmetrical about the highest point of the edge of the reference pit, such as... Figure 15 As shown. Next, in this embodiment, the distance between each of the remaining N-1 auxiliary reference points and the first symmetrical reference point is obtained, and the auxiliary reference point with the smallest distance is taken as the second reference plane reference point. For example, assuming N is 64, the auxiliary reference point P2 closest to the first symmetrical reference point P1' is determined from the remaining N-1, i.e., 63 auxiliary reference points, and this P2 is the second reference plane reference point.

[0115] Then, continue calculating the distance between each of the remaining N-2 auxiliary reference points and the second reference surface reference point. Select the auxiliary reference points with the smallest difference between this distance and the second preset distance. Finally, calculate the distance between these auxiliary reference points and the highest point of the reference pit edge or the first reference surface reference point, and select the auxiliary reference point with the smallest difference between this distance and the second preset distance as the third reference surface reference point. That is, the auxiliary reference point closest to the highest point of the reference pit edge or the first reference surface reference point is selected as the third reference point. For example, assuming N is 64, the auxiliary reference point closest to the second reference surface reference point is determined from the remaining N-2 (62) auxiliary reference points. Auxiliary reference points are then selected, and finally, the points closest to the highest point of the datum pit edge or the first datum plane reference point are chosen from these auxiliary reference points. The auxiliary reference point is used as the third datum reference point. The process of determining the second datum reference point P2 and the third datum reference point P3 is as follows: Figure 16 As shown.

[0116] In this embodiment, after determining the first reference surface reference point, the second and third reference surface reference points are obtained using a clockwise or symmetrical method. By filtering through different preset distances, more accurate and reasonable reference surface reference points can be obtained, thereby constructing a more accurate reference surface and directly improving the accuracy of depression depth measurement.

[0117] refer to Figure 17 , Figure 17 This is a flowchart illustrating a third embodiment of a method for measuring the depth of a depression according to the present invention.

[0118] Based on the first embodiment described above, a third embodiment of the present invention for measuring the depth of a depression is proposed. In this embodiment, step S50 specifically includes:

[0119] Step S501: Obtain the distance between the highest point of each pit edge and the target reference plane, and the distance between the lowest point of the pit and the target reference plane.

[0120] In practical implementation, after determining the target reference plane, this embodiment calculates the distances between the highest points of each pit edge and the target reference plane, as well as the distances between the lowest points of each pit and the target reference plane, based on the known coordinates of the highest points of the pit edges and the coordinate system of the lowest points of the pits. For example, assuming the highest points of the pit edges are A and C, and B is the lowest point of the pit, the distances between the highest points of the pit edges A and C and the target reference plane can be calculated as HA and HC, respectively, and the distance between the lowest point of the pit B and the target reference plane is HB.

[0121] Step S502: Calculate the average distance based on the distance between the highest point of each pit edge and the target reference plane.

[0122] Step S503: Calculate the depth of the depression of the component under test based on the mean distance and the distance between the lowest point of the depression and the target reference plane.

[0123] In a specific implementation, this embodiment calculates the average distance between the highest point of each pit edge and the target reference plane, for example, (HA+HC) / 2.

[0124] In practice, the depth of the dent in the component under test can be calculated based on the average distance and the distance between the lowest point of the dent and the target reference plane. For example, H = HB - (HA + HC) / 2, and the calculated H is the dent depth.

[0125] It should be noted that, in order to quickly obtain the pit depth result in this embodiment, a pit depth dimension solver was developed using VBA based on the above calculation method. The solver interface is shown below. Figure 18 As shown. Simply enter the coordinates of points A, B, and C directly associated with the pit, and the depth of the pit can be obtained directly.

[0126] Furthermore, after calculating the indentation depth, this embodiment compares the calculated indentation depth with a preset indentation depth threshold. If the calculated indentation depth is greater than the preset indentation depth threshold, it is determined that the component under test has an indentation; otherwise, it is determined that the component under test does not have an indentation. The preset indentation depth threshold can be set to 35μm, or it can be set to other values ​​according to actual detection requirements. This embodiment does not impose any restrictions on this.

[0127] In this embodiment, the distance between the highest point of each pit edge and the target reference plane, and the distance between the lowest point of the pit and the target reference plane are obtained; the average distance is calculated based on the distance between the highest point of each pit edge and the target reference plane; and the pit depth of the component under test is calculated based on the average distance and the distance between the lowest point of the pit and the target reference plane. This allows for the measurement of the actual pit depth of the steel truss. A solver is also developed to further improve the efficiency of pit depth acquisition.

[0128] Furthermore, embodiments of the present invention also propose a storage medium storing a dent depth measurement program, wherein when the dent depth measurement program is executed by a processor, it implements the steps of the dent depth measurement method described above.

[0129] Since this storage medium adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be repeated here.

[0130] Reference Figure 19 , Figure 19 This is a structural block diagram of the first embodiment of the indentation depth measuring device of the present invention.

[0131] like Figure 19 As shown, the indentation depth measuring device proposed in this embodiment of the invention includes:

[0132] Module 10 is used to obtain the deformation cloud map of the component under test based on the input component parameters.

[0133] The filtering module 20 is used to select multiple pit measurement points corresponding to the component to be tested based on the deformation cloud map.

[0134] The filtering module 20 is also used to determine multiple reference points of the reference surface based on the multiple pit measurement points.

[0135] The calculation module 30 is used to determine the target reference plane based on the plurality of reference plane reference points.

[0136] The calculation module 30 is also used to determine the depth of the depression of the component to be measured based on the plurality of depression measurement points and the target reference plane.

[0137] This embodiment obtains a deformation cloud map of the component under test based on the input component parameters; selects multiple pit measurement points corresponding to the component under test based on the deformation cloud map; determines multiple reference planes based on the multiple pit measurement points; determines a target reference plane based on the multiple reference planes; determines the pit depth of the component under test based on the multiple pit measurement points and the target reference plane; and, combined with the deformed model, automatically calculates the pit depth by inputting the coordinates of key nodes at each pit location, improving efficiency and making the calculated pit depth closer to the real state.

[0138] In one embodiment, the plurality of pit measurement points include at least the highest points of the pit edges;

[0139] The filtering module 20 is further configured to take the highest point of any pit edge as the reference pit edge highest point and obtain N auxiliary reference points corresponding to the reference pit edge highest point within a preset range, where N≥1; and filter out multiple reference surface reference points from the N auxiliary reference points based on a preset distance.

[0140] In one embodiment, the plurality of reference plane reference points include a first reference plane reference point, a second reference plane reference point, and a third reference plane reference point;

[0141] The filtering module 20 is further configured to: obtain the distance between each of the N auxiliary reference points and the highest point of the edge of the reference pit; and select the auxiliary reference point with the smallest difference between the distance and the first preset distance as the first reference surface reference point; obtain the distance between each of the remaining N-1 auxiliary reference points and the first reference surface reference point; and select the auxiliary reference point with the smallest difference between the distance and the second preset distance as the second reference surface reference point; obtain the distance between each of the remaining N-2 auxiliary reference points and the second reference surface reference point; obtain the two auxiliary reference points with the smallest difference between the distance and the second preset distance; and filter out the third reference surface reference point from the two auxiliary reference points based on the third preset distance.

[0142] In one embodiment, the filtering module 20 is further configured to obtain the distance between each auxiliary reference point and the first reference surface reference point, and to take the auxiliary reference point with the smallest distance difference between the distance and the third preset distance as the third reference surface reference point.

[0143] In one embodiment, the plurality of reference plane reference points include a first reference plane reference point, a second reference plane reference point, and a third reference plane reference point;

[0144] The filtering module 20 is further configured to: obtain the distance between each of the N auxiliary reference points and the highest point of the edge of the reference pit; and take the auxiliary reference point with the smallest difference between the distance and the first preset distance as the first reference surface reference point; calculate the first symmetrical reference point corresponding to the first reference surface reference point based on the highest point of the edge of the reference pit; obtain the distance between each of the remaining N-1 auxiliary reference points and the first symmetrical reference point; take the auxiliary reference point with the smallest distance as the second reference surface reference point; obtain the distance between each of the remaining N-2 auxiliary reference points and the second reference surface reference point to obtain a plurality of auxiliary reference points with the smallest difference between the distance and the second preset distance; obtain the distance between each auxiliary reference point and the highest point of the edge of the reference pit or the first reference surface reference point; and take the auxiliary reference point with the smallest difference between the distance and the second preset distance as the third reference surface reference point.

[0145] In one embodiment, the plurality of pit measurement points include a plurality of the highest points of the pit edges and the lowest points of the pits;

[0146] The calculation module 30 is further configured to obtain the distance between the highest point of each pit edge and the target reference plane, and the distance between the lowest point of the pit and the target reference plane; calculate the average distance based on the distance between the highest point of each pit edge and the target reference plane; and calculate the pit depth of the component under test based on the average distance and the distance between the lowest point of the pit and the target reference plane.

[0147] In one embodiment, the indentation depth measuring device further includes a judgment module;

[0148] The judgment module is used to compare the dent depth of the component under test with a preset dent depth threshold; if the dent depth of the component under test is greater than the preset dent depth threshold, it is determined that the component under test has a dent.

[0149] It should be understood that the above are merely illustrative examples and do not constitute any limitation on the technical solutions of the present invention. In specific applications, those skilled in the art can make settings as needed, and the present invention does not impose any restrictions on this.

[0150] It should be noted that the workflow described above is merely illustrative and does not limit the scope of protection of this invention. In practical applications, those skilled in the art can select some or all of the workflow to achieve the purpose of this embodiment according to actual needs, and no restrictions are imposed here.

[0151] In addition, for technical details not described in detail in this embodiment, please refer to the indentation depth measurement method provided in any embodiment of the present invention, which will not be repeated here.

[0152] Furthermore, it should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or system. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or system that includes that element.

[0153] The sequence numbers of the above embodiments of the present invention are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.

[0154] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as read-only memory (ROM) / RAM, magnetic disk, optical disk) and includes several instructions to cause a terminal device (which may be a mobile phone, computer, server, or network device, etc.) to execute the methods described in the various embodiments of the present invention.

[0155] The above are merely preferred embodiments of the present invention and do not limit the scope of the patent. Any equivalent structural or procedural transformations made based on the description and drawings of the present invention, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of the present invention.

Claims

1. A method for measuring the depth of a depression, characterized in that, The method for measuring the depth of the indentation includes: The deformation cloud map of the component under test is obtained based on the input component parameters; Based on the deformation cloud map, multiple pit measurement points corresponding to the component under test are selected, and the multiple pit measurement points include at least multiple highest points of the pit edge; Multiple reference points are determined based on the multiple pit measurement points, including a first reference point, a second reference point, and a third reference point; The target reference plane is determined based on the plurality of reference plane reference points; The depth of the indentation of the component under test is determined based on multiple indentation measurement points and the target reference plane; The step of determining multiple reference points for a reference surface based on multiple pit measurement points includes: Take the highest point of any pit edge as the reference pit edge highest point, and obtain N auxiliary reference points corresponding to the reference pit edge highest point within a preset range, where N≥1; Selecting multiple reference points from the N auxiliary reference points based on a preset distance includes: obtaining the distance between each of the N auxiliary reference points and the highest point of the edge of the reference pit, and selecting the auxiliary reference point with the smallest difference between the distance and a first preset distance as the first reference point; obtaining the distance between each of the remaining N-1 auxiliary reference points and the first reference point, and selecting the auxiliary reference point with the smallest difference between the distance and a second preset distance as the second reference point; obtaining the distance between each of the remaining N-2 auxiliary reference points and the second reference point, obtaining the two auxiliary reference points with the smallest difference between the distance and the second preset distance, and selecting a third reference point from the two auxiliary reference points based on a third preset distance.

2. The method for measuring the depth of a depression as described in claim 1, characterized in that, The step of selecting a third reference surface point from the two auxiliary reference points based on a third preset distance includes: The distances between each auxiliary reference point and the first reference surface reference point are obtained respectively, and the auxiliary reference point with the smallest distance difference between the distances is taken as the third reference surface reference point.

3. The method for measuring the depth of a depression as described in claim 1, characterized in that, The process of selecting multiple reference points from the N auxiliary reference points based on a preset distance includes: The distance between each of the N auxiliary reference points and the highest point of the edge of the reference pit is obtained respectively, and the auxiliary reference point with the smallest distance difference between the distance and the first preset distance is taken as the first reference surface reference point; Calculate the first symmetrical reference point corresponding to the first reference surface reference point based on the highest point of the edge of the reference pit; Obtain the distance between each of the remaining N-1 auxiliary reference points and the first symmetrical reference point, and take the auxiliary reference point with the smallest distance as the second reference plane reference point; Obtain the distance between each of the remaining N-2 auxiliary reference points and the second reference surface reference point, and obtain a number of auxiliary reference points with the smallest distance difference between the distance and the second preset distance. Also obtain the distance between each auxiliary reference point and the highest point of the edge of the reference pit or the first reference surface reference point, and take the auxiliary reference point with the smallest distance difference between the distance and the second preset distance as the third reference surface reference point.

4. The method for measuring the depth of a depression as described in claim 1, characterized in that, The multiple pit measurement points include the highest point of the pit edge and the lowest point of the pit; The step of determining the indentation depth of the component under test based on multiple indentation measurement points and the target reference plane includes: Obtain the distance between the highest point of each pit edge and the target reference plane, and the distance between the lowest point of each pit and the target reference plane; The average distance is calculated based on the distance between the highest point of each pit edge and the target reference plane; The depth of the indentation of the component under test is calculated based on the mean distance and the distance between the lowest point of the indentation and the target reference plane.

5. The method for measuring the depth of a depression as described in any one of claims 1 to 4, characterized in that, After determining the indentation depth of the component under test based on multiple indentation measurement points and the target reference plane, the method further includes: The indentation depth of the component under test is compared with a preset indentation depth threshold. If the dent depth of the component under test is greater than the preset dent depth threshold, then the component under test is determined to have a dent.

6. A device for measuring the depth of a depression, characterized in that, The indentation depth measuring device includes: The module is used to obtain the deformation cloud map of the component under test based on the input component parameters; The filtering module is used to select multiple pit measurement points corresponding to the component under test based on the deformation cloud map, wherein the multiple pit measurement points include at least multiple highest points of the pit edges; The filtering module is also used to determine multiple reference surface points based on the multiple pit measurement points, the multiple reference surface points including a first reference surface point, a second reference surface point and a third reference surface point; The calculation module is used to determine the target reference plane based on the plurality of reference plane reference points; The calculation module is also used to determine the indentation depth of the component under test based on the multiple indentation measurement points and the target reference plane; The filtering module is further configured to take the highest point of any pit edge as the reference pit edge highest point and obtain N auxiliary reference points corresponding to the reference pit edge highest point within a preset range, where N≥1; Selecting multiple reference points from the N auxiliary reference points based on a preset distance includes: obtaining the distance between each of the N auxiliary reference points and the highest point of the edge of the reference pit, and selecting the auxiliary reference point with the smallest difference between the distance and a first preset distance as the first reference point; obtaining the distance between each of the remaining N-1 auxiliary reference points and the first reference point, and selecting the auxiliary reference point with the smallest difference between the distance and a second preset distance as the second reference point; obtaining the distance between each of the remaining N-2 auxiliary reference points and the second reference point, obtaining the two auxiliary reference points with the smallest difference between the distance and the second preset distance, and selecting a third reference point from the two auxiliary reference points based on a third preset distance.

7. A device for measuring the depth of a depression, characterized in that, The indentation depth measuring device includes: a memory, a processor, and an indentation depth measuring program stored in the memory and running on the processor, the indentation depth measuring program being configured to implement the indentation depth measuring method as described in any one of claims 1 to 5.

8. A storage medium, characterized in that, The storage medium stores a dent depth measurement program, which, when executed by a processor, implements the dent depth measurement method as described in any one of claims 1 to 5.

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