Computing device and its installation method

Abstract

This disclosure relates to a computing device and a method for mounting the same. The method for mounting the computing device includes mounting a first assembly of a chassis side panel on a chassis base plate, the first assembly including a first opening and a groove at the bottom of the first opening; mounting at least one set of heat dissipation pipes of a cooling system above the chassis base plate, the at least one set of heat dissipation pipes including a first set of heat dissipation pipes, at least a portion of the first set of heat dissipation pipes being located in the groove at the bottom of the first opening of the first assembly; and mounting a second assembly of the chassis side panel in the first opening, the second assembly having a groove at its bottom, the groove at the bottom of the first opening of the first assembly and the groove at the bottom of the second assembly forming a passage for the first set of heat dissipation pipes to pass through.

Description

Technical Field

[0001] This disclosure relates to the field of autonomous driving technology, and in particular to a computing device and a method for installing the same. Background Technology

[0002] With the development of autonomous driving technology, autonomous vehicles have already been applied in logistics, freight, and passenger transport. When driving, autonomous vehicles typically perceive external road information through their own sensors, such as radar and cameras. Then, autonomous driving computing devices (such as servers) perform calculations to make decisions and plans for the vehicle's driving, ultimately controlling the vehicle to drive according to these decisions and plans.

[0003] Servers in autonomous vehicles are typically limited by vehicle space, resulting in a finite size. These servers often have components mounted externally on the chassis, requiring connections to corresponding components inside the chassis. Since server chassis are generally assembled using screws, side panels through which components pass become weak points in the chassis. Vibration during server operation can cause resonance and other phenomena, potentially leading to server malfunctions. Summary of the Invention

[0004] This invention provides a computing device and a method for installing the computing device, which solves the problem of malfunctions caused by random vibrations during the operation of the computing device.

[0005] The present invention provides, in one aspect, a method for installing a computing device, comprising:

[0006] A first assembly for mounting a chassis side panel on the chassis base plate, the first assembly including a first opening, the first assembly having a groove at the bottom of the first opening;

[0007] At least one set of heat dissipation pipes of a heat dissipation system are installed above the chassis bottom plate, the at least one set of heat dissipation pipes including a first set of heat dissipation pipes, at least a portion of the first set of heat dissipation pipes being located in a groove at the bottom of the first opening of the first component;

[0008] A second component of the chassis side panel is installed in the first opening. The second component has a groove at its bottom. The groove at the bottom of the first opening of the first component and the groove at the bottom of the second component form a passage for the passage of the first set of heat pipes.

[0009] In another aspect, the present invention provides a computing device comprising:

[0010] A chassis, the chassis including a base plate, multiple side plates and a cover plate;

[0011] The heat dissipation system includes at least a first set of heat pipes.

[0012] At least one of the plurality of side panels includes a first component and a second component.

[0013] The first component includes a first opening, and the first component has a groove at the bottom of the first opening.

[0014] The second component is located in the first opening, and the bottom of the second component has a groove.

[0015] The groove at the bottom of the second component and the groove at the bottom of the first opening form a passage for the passage of the first set of heat dissipation pipes.

[0016] According to the computing device and its installation method according to embodiments of the present invention, a side panel of the chassis includes at least a first component and a second component. The first component includes a first opening, and the second component is located in the first opening. Both the bottom of the first opening and the bottom of the second component have grooves. The grooves of the second component and the grooves of the first component form a passage for heat dissipation pipes, thereby solving the problem of failures caused by random vibrations during the operation of the computing device (e.g., a server).

[0017] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0018] Figure 1 This is an exploded view of a portion of the structure of a computing device according to an embodiment of this application.

[0019] Figure 2 This is a schematic diagram of the structure of a computing device according to an embodiment of this application.

[0020] Figure 3 This is a schematic diagram of a portion of a heat dissipation system according to an embodiment of this application.

[0021] Figures 4A-4D This is an exploded view of the structure of a side plate according to an embodiment of this application.

[0022] Figure 5-1 2 is a structural schematic diagram of the installation process of a computing device according to an embodiment of this application.

[0023] Figure 13 This is a flowchart of a computing device installation method according to an embodiment of this application. Detailed Implementation

[0024] To make the technical problems solved by the present invention, the technical solutions adopted, and the technical effects achieved clearer, the technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0025] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are merely some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0026] In this disclosure, the term "multiple" means two or more, unless otherwise stated. In this disclosure, the term "and / or" describes the relationship between related objects, encompassing any one of the listed objects and all possible combinations thereof. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship.

[0027] In this disclosure, unless otherwise stated, the terms "first," "second," etc., are used to distinguish similar objects and are not intended to limit their positional, temporal, or importance relationships. It should be understood that such terms are interchangeable where appropriate so that the embodiments of the invention described herein can be implemented in ways other than those illustrated or described herein.

[0028] Furthermore, the terms “comprising” and “having”, and any variations thereof, are intended to cover non-exclusive inclusion, such that a process, method, system, product, or apparatus that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, system, product, or apparatus.

[0029] Figure 1 This is an exploded view of a portion of the structure of the computing device according to an embodiment of the present invention (excluding components of the cooling system located outside the chassis). Figure 1 As shown, the computing device 100 includes a base plate 201, one or more side plates (e.g., side plates 202, 203, 600, etc.), and a cover plate ( Figure 1A chassis 200 (not shown) is constructed to house components of the computing device and provide environmental protection for these components. The motherboard of the computing device 100 can be installed in the chassis. Components such as a Central Processing Unit (CPU), memory, graphics card, sound card, network card, or communication card can be installed or plugged into the motherboard. The graphics card may have a Graphics Processing Unit (GPU). The communication card may be, for example, a Controller Area Network (CAN) card. Due to the limited area on the motherboard, directly installing or plugging these components onto the motherboard would greatly limit the number of components that can be installed or plugged into the motherboard. Therefore, according to some embodiments of this application, some of these components, such as graphics cards, sound cards, network cards, or communication cards, may not be directly installed or plugged into the motherboard, but rather mounted on a support structure and connected to the motherboard via adapter cables, thus allowing for the installation of more components in the computing device. The computing device 100 may also include one or more cooling systems for dissipating heat from components that generate heat. Some of the cooling systems may also be mounted on the support structure.

[0030] The computing device may include one or more support structures, which may include brackets and / or support beams for supporting various circuit boards, heat sinks, power supplies, hard drives, and / or cover plates. The brackets and support beams may be made of metallic materials (e.g., aluminum). The support structures may be fixed to the chassis's base plate (or lower support structure) and / or side plates, supporting the components mounted thereon above the motherboard, thus greatly increasing the freedom of component placement within the computing device.

[0031] For example, such as Figure 1As shown, support structure 210 includes multiple brackets 211 and multiple support beams 212. Support structure 210 can be used, for example, to support the hard drive of computing device 100. Support structure 220 includes multiple brackets and multiple support beams, and can be fixed to the underlying support structure (e.g., support structure 210), the bottom plate of the chassis, and / or the side plate of the chassis. Support structure 220 can be used, for example, to support the graphics card and part of the cooling system of computing device 100. Support structure 230 includes multiple brackets 231 and multiple support beams 232, and can be fixed to the underlying support structure (e.g., support structure 210, support structure 220), the bottom plate of the chassis, and / or the side plate of the chassis. Support structure 230 can be used, for example, to support the graphics card of computing device 100 (according to some embodiments of this application, computing device 100 may include multiple graphics cards). The support structure 240 includes multiple brackets 241 and multiple support beams 242, and can be fixed to the bottom support structure (support structure 210, support structure 220, support structure 230), the bottom plate of the chassis, and / or the side plate of the chassis. A plate, for example, 250 can be fixed to the support structure 240. The plate 250 can be a generally rectangular metal plate (e.g., an aluminum plate). According to embodiments of this application, the computing device 100 also has multiple sets of L-shaped fasteners, which, in conjunction with the support structure, reinforce the components of the computing device 100 or the side plate of the chassis.

[0032] The computing device 100 also includes a power supply (hereinafter referred to as the power supply) (not shown in the figure), which may be, for example, a battery, a disposable battery, or a rechargeable battery. The power supply may be installed on the tablet 250. It is used to power the components in the computing device 100, such as the motherboard, cooling system, graphics card, sound card, network card, hard drive, and / or CAN card.

[0033] Figure 2 This is a schematic diagram of the structure of a computing device according to an embodiment of this application, specifically showing some components of the heat dissipation system outside the chassis 200. Figure 3 This is a schematic diagram of a heat dissipation system according to an example embodiment of this application. To clearly illustrate the structure of the heat dissipation system, in... Figure 3 The chassis is not shown. Furthermore, in... Figure 3 For simplicity, only [the text] is shown. Figure 1 Part of the heat pipe, but not shown. Figure 1 All heat pipes in the middle (e.g.) Figure 1 (The fourth group of heat pipes 324). To make the relative positions of the components in the computing device 100 clearer... Figure 2 and 3The diagram shows a first axis X, a second axis Y, and a third axis Z that are perpendicular to each other. At least one component in the chassis 200 is a heat-generating element 210, which may include a CPU, a GPU, etc., and the cooling system can dissipate heat from these heat-generating elements 210.

[0034] refer to Figure 2 as well as Figure 3 and combined Figure 1 The heat dissipation system 300 includes at least one heat sink 400, a plurality of heat pipes 320, and a cooling device 330. These heat sinks 400 and heat pipes 320 are disposed within the chassis 200. Each of the heat-generating elements 210 may be provided corresponding to at least one of the heat sinks 400. In some embodiments, the number and type of the heat-generating elements 210 and the heat sinks 400 can be configured according to actual needs. The heat sinks 400 may be provided, for example, in a one-to-one correspondence with the heat-generating elements 210, or multiple heat sinks 400 may be provided for one heat-generating element 210, depending on actual needs; the present invention is not limited thereto.

[0035] In some embodiments, such as Figure 1 As shown, the heat pipes 320 are divided into multiple groups, such as the first group of heat pipes 321, the second group of heat pipes 322, the third group of heat pipes 323, and the fourth group of heat pipes 324. The corresponding heat sink 400 may include a first heat sink, a second heat sink, a third heat sink, and a fourth heat sink. The first group of heat pipes 321 can be used with the first heat sink to cool, for example, a GPU. The second group of heat pipes 322 can be used with the second heat sink to cool, for example, a CPU. The third group of heat pipes 323 and the fourth group of heat pipes 324 can, for example, be used with the third and fourth heat sinks respectively to cool, for example, another GPU.

[0036] In some embodiments, the heat pipe 320 has a first end and a second end. The first end is, for example, the heat pipe 320 at... Figure 3 The middle end faces the direction of the arrow on the second axis Y, and the second end is, for example, heat pipe 320. Figure 2 The end furthest from the direction of the arrow on the second axis Y. The first end of the heat pipe 320 is connected to the heat sink 400. The second end of the heat pipe 320 is connected to the cooling device 330. The side panel 600 of the chassis 200 (see...) Figure 1 It may have a passage for the heat pipe, and the second end of the heat pipe 320 is connected to the cooling device 330 through the passage of the chassis side panel.

[0037] In some embodiments, the heat dissipation system 300 is used to dissipate heat from at least one heat-generating element within the chassis 200. Specifically, the coolant of the cooling device 330 dissipates heat from the heat-generating element 210 through the heat pipe 320 and the heat sink 400.

[0038] According to embodiments of this application, the heat-generating element corresponding to the heat sink 400 is, for example, a graphics processing unit (GPU) or a central processing unit (CPU). Specifically, in some embodiments, the computing device 100 can be equipped with different numbers of CPUs, graphics processing units, or other types of components according to actual needs, and the number and arrangement of the heat sink 400 and the arrangement of the corresponding heat pipes 320 can be adjusted accordingly. This invention does not limit this.

[0039] In some embodiments, each of the heat sinks 400 is connected to at least one heat pipe 320, or to a group of heat pipes. Coolant from the cooling device 330 flows through the heat pipes 320 and the heat sinks 400 to dissipate heat from the heat-generating element. For example, one heat sink 400 may be connected to two, three, four, or fewer heat pipes 320. However, in other embodiments, an appropriate number of heat pipes 320 may be connected to a single heat sink 400 as needed. In some embodiments, the heat pipes 320 may also be fixed to and connected to the heat sink 400 by fasteners.

[0040] Please refer to Figure 2 and Figure 3 The cooling device 330 includes a liquid tank 332, a pump 334, pipes 335, a radiator 336, and a fan assembly 337. The liquid tank 332 stores coolant, while the pump 334, mounted on the liquid tank 332, pressurizes the coolant. Pipes 335 connect the liquid tank 332 and the second end of the radiator 320. Specifically, the coolant pressurized by the pump 334 sequentially enters the heat sinks 400 through pipes 335 and radiator 320. Coolant from the heat sinks 400 sequentially enters the liquid tank 332 through radiator 320 and pipes 335.

[0041] In some embodiments, the heat sink 336 is connected between the second end of the heat sink 320 and the liquid tank 332 via a conduit 335 to cool the coolant. A fan assembly 337 is configured on the heat sink 336 to achieve better cooling. Specifically, the fan assembly 337 can be, for example, a double-layer fan wall, with the heat sink 336 sandwiched between these two fan walls. The arrangement of the fan assembly 337 and the heat sink 336 can meet high-power cooling requirements, providing sufficient airflow and speed to dissipate heat from the coolant. However, in some embodiments, the fan assembly 337 can also be a single-layer or multi-layer fan wall. The number and arrangement of fans in the fan assembly 337 can also be adjusted according to actual cooling needs, and the present invention is not limited thereto.

[0042] In some embodiments, the cooling system 300 further includes a distributor 340 and at least one quick connector 350. Lines 335 are connected to the distributor 340 via these quick connectors 350 and are connected to a second end of the heatsink 320 via the distributor 340. Specifically, the distributor 340 diverts coolant from the lines 335 into the heatsink 320. Due to the arrangement of the distributor 340, the number of lines 335 can be, for example, less than or equal to the number of heatsinks 320.

[0043] In some embodiments, pipeline 335 includes a first pipeline 335A, a second pipeline 335B, a third pipeline 335C, and a fourth pipeline 335D. The first pipeline 335A connects to the pump 334 and the heat sink 320; the second pipeline 335B connects to the heat sink 320 and the radiator 336; the third pipeline 335C connects to the radiator 336 and the liquid tank 332; and the fourth pipeline 335D connects to the liquid tank 332 and the pump 334. Specifically, coolant from the liquid tank 332 is pressurized in the pump 334 and enters the heat sink 320 via the first pipeline 335A. The coolant then dissipates heat from the heat-generating element 210 via the heat sinks 320 and the heat sinks 400, and enters the second pipeline 335B via the heat sinks 320. The coolant then flows through the second line 335B and the radiator 336 into the third line 335C, where the radiator 336 and the fan assembly 337 further dissipate heat from the coolant. The coolant entering the third line 335C then flows back to the coolant tank 332 for circulation.

[0044] In this embodiment, the heating element 210, the heat sink 400, and the heat pipe 320 are disposed inside the chassis 200, while the cooling device 330 is disposed outside the chassis 200. The first end of the heat pipe 320 is connected to the heat sink 400, and the second end of the heat pipe 320 is connected to the cooling device 330. The coolant in the cooling device 330 dissipates heat from the heating element 210 through the heat pipe 320 and the heat sink 400, thus enabling rapid liquid cooling of the heating element 210 and ensuring its stable operation.

[0045] In some embodiments, the heat pipe 320 is, for example, a metal pipe, such as a copper pipe, or may be made of, for example, a non-metallic material that facilitates thermal conductivity. The conduit 335 may be, for example, a flexible hose, so that the liquid tank 332, pump 334, radiator 336 and fan assembly 337 can be positioned in a suitable relative position to the chassis 200 as needed.

[0046] In some embodiments, a radiator that does not require coolant can be used instead of heat sink 40. In this case, the liquid tank 332, pump 334, and pipeline 335 in the cooling device 330 can be omitted, and the heat pipe 320 passes through the chassis and connects directly to the heat sink 336. That is, heat dissipation can be achieved by transferring heat from the radiator to the heat sink 336 through the heat pipe without using coolant.

[0047] However, the inventors of this application have discovered that, because the heat dissipation pipes pass through the side panel of the chassis, in a vibrating environment, especially in a vehicle-mounted environment, the structure of this side panel is not stable enough and is prone to resonance and other phenomena, which may cause server malfunctions and unstable server operation. To solve this problem, according to an embodiment of this application, one side panel of the chassis 200 can be composed of multiple side panel assemblies, and some side panel assemblies have grooves that form passages for the heat dissipation pipes. One end of the heat dissipation pipe is connected to the cooling device through these passages in the side panel.

[0048] Figure 4A This is a structural schematic diagram of a side panel of the chassis 200 according to an embodiment of this application, as shown below. Figure 4A As shown, and with reference Figure 1 The side panel 600 of the chassis 200 may include multiple side panel assemblies. Those skilled in the art will understand that side panel 600 can be any side panel of the chassis, such as the rear or front panel. Side panel 600 may include, for example, a first assembly 610, a second assembly 620, a third assembly 640, and a fourth assembly 630. It should be noted that, although... Figure 4A Four components of the side panel 600 are shown; however, those skilled in the art will understand that the side panel 600 may have more or fewer components.

[0049] The side panel 600 may include a first surface and a second surface opposite to the first surface. The first surface of the side panel 600 may be formed by the first surfaces of each side panel assembly, namely the first surfaces of the first assembly 610, the second assembly 620, the third assembly 640, and the fourth assembly 630. The second surface of the side panel 600 may be formed by the second surfaces of each side panel assembly, namely the second surfaces of the first assembly 610, the second assembly 620, the third assembly 640, and the fourth assembly 630.

[0050] It should be noted that Figure 4A The first surface of the first component 610 is shown, but the second surface is shown for the second component 620, the third component 640 and the fourth component 630, so as to clearly show the structure of the edges of these side panel components.

[0051] The first component 610 of the side panel 600 is generally flat and includes one or more openings, such as openings 611 and 612. Each opening may have one or more recesses. For example, as Figure 4A As shown, each of the openings 611 and 612 has a groove 613 at its bottom. Figure 4A In the example, opening 612 has a groove not only at the bottom but also at the step 617, while opening 611 has grooves only at the bottom, but not at the step. The grooves are used to fix the heat dissipation pipes of the heat dissipation system, and the number of grooves is determined according to the number of heat dissipation pipes in the heat dissipation system.

[0052] In some embodiments, the first component 610 has a recessed edge 615 adjacent to the opening, the thickness of which is less than the thickness of the other portions (i.e., the body portion) of the first component 610. The edge 615 may have one or more holes 616 (also referred to as fixing holes or mounting holes) perpendicular to the […]. Figure 4A The direction of the paper extends, that is, perpendicular to the surface of the first component 610, or perpendicular to the surface of the side plate 600.

[0053] In some embodiments, the step portion 617 within the opening 611 has a parallel to Figure 4A The hole is oriented in the direction of the paper surface (i.e., parallel to the surface of the first component 610, or parallel to the surface of the side plate 600).

[0054] In some embodiments, the upper edge of the first component 610 has a shoulder 618 near the openings 611 and 612, similar to the step 617 of the opening 611, and the shoulder 618 also has a parallel to Figure 4A The hole is oriented in the direction of the paper surface (i.e., parallel to the surface of the first component 610, or parallel to the surface of the side plate 600).

[0055] In some embodiments, the main body of the first component has a plurality of holes 614 for fixing a bracket, support beam, fastener, base plate or other side plate of the computing device.

[0056] The second component 620 is generally flat. The second component 620 has a first portion corresponding to an opening (e.g., opening 611) of the first component 610, such as the lower portion of opening 611. The second component 620 also has one or more recesses 623 at its bottom. The second component 620 also has one or more recesses 624 at its top.

[0057] In some embodiments, the second component 620 has one or more recessed edges 625, the thickness of which is less than the thickness of the other portions (i.e., the body portion) of the second component 620. One or more holes 626 may be present in the edge 625, these holes being perpendicular to... Figure 4AThe direction of the paper extends, that is, perpendicular to the surface of the second component 620, or perpendicular to the surface of the side plate 600.

[0058] In some embodiments, the second component 620 has a shoulder 627, which also has a parallel to... Figure 4A Hole 629 is oriented in the direction of the paper surface (i.e., parallel to the surface of the second component 620, or parallel to the surface of the side plate 600).

[0059] In some embodiments, when the second component 620 is mounted onto the first component 610, the edge 625 of the second component 620 overlaps with a portion of the edge 615 of the first component 610, while the hole 626 of the edge 625 aligns with a portion of the hole 616 of the edge 615, and the hole 629 of the shoulder 627 aligns with the corresponding hole 659 of the stepped portion 617 of the opening 611 (see...). Figure 4B The holes allow for alignment, enabling the second component 620 to be secured relative to the first component 610 using fasteners (e.g., screws). Furthermore, when the second component 620 is mounted onto the first component 610, the groove 623 on the bottom of the second component aligns with a corresponding groove on the bottom of the opening 611 for securing the heat sink. In some embodiments, a shock-absorbing pad is also provided between the groove and the heat sink.

[0060] The third component 640 is generally flat. The third component 640 has a shape corresponding to an opening (e.g., opening 612) in the first component 610. The third component 640 also has one or more recesses 643 at its bottom. Figure 4A In the example, the third component 640 has a groove at the bottom and also a groove at the step 647.

[0061] In some embodiments, the third component 640 has one or more recessed edges 645, the thickness of which is less than the thickness of the other portions of the third component 640 (i.e., the body portion). One or more holes 646 may be present in the edge 645, these holes being perpendicular to... Figure 4A The direction of the paper extends, that is, perpendicular to the surface of the third component 640, or perpendicular to the surface of the side plate 600.

[0062] In some embodiments, the third component 640 has a shoulder 648, which also has a parallel to Figure 4A Hole 649 is oriented in the direction of the paper surface (i.e., parallel to the surface of the third component 640, or parallel to the surface of the side plate 600).

[0063] In some embodiments, when the third component 640 is mounted onto the first component 610, the edge 645 of the third component 640 overlaps with a portion of the edge 615 of the first component 610 (i.e., overlaps with the edge 615 at the opening 612), while the hole 646 of the edge 645 aligns with the hole 616 of the edge 615, and the hole 649 of the shoulder 648 aligns with the corresponding hole 658 of the shoulder 618 (see...). Figure 4B The holes are aligned so that the third component 640 can be secured relative to the first component 610 using fasteners (e.g., screws). Furthermore, when the third component 640 is mounted onto the first component 610, the grooves 643 on the bottom and stepped portion 647 of the third component 640 are aligned with the corresponding grooves 613 on the bottom of the opening 612 and stepped portion 617 of the first component 610 for securing the heat sink. In some embodiments, a shock-absorbing pad is also provided between the groove and the heat sink.

[0064] In some embodiments, the main body of the third component 640 has a plurality of holes, some of which 644 are used to fix the bracket, support beam, fastener, base plate or other side plate of the computing device, and some of which 641 are used for ventilation.

[0065] The fourth component 630 is generally flat. The fourth component 630 has a second portion corresponding to the shape of an opening (e.g., opening 611) of the first component 610, such as the upper part of opening 611. The fourth component 630 also has one or more recesses 633 at its bottom.

[0066] In some embodiments, the fourth component 630 has one or more recessed edges 635, the thickness of which is less than the thickness of the other portions of the fourth component 630 (i.e., the body portion). One or more holes 636 may be present in the edge 635, these holes being perpendicular to... Figure 4A The direction of the paper extends, that is, perpendicular to the surface of the fourth component 630, or perpendicular to the surface of the side plate 600.

[0067] In some embodiments, the fourth component 630 has a shoulder 638, which also has a parallel to Figure 4A Hole 639 is oriented in the direction of the paper surface (i.e., parallel to the surface of the fourth component 630, or parallel to the surface of the side plate 600).

[0068] In some embodiments, when the fourth component 630 is mounted onto the first component 610, the edge 635 of the fourth component 630 overlaps with a portion of the edge 615 of the first component 610, while the hole 636 of the edge 635 aligns with a portion of the hole 616 of the edge 615, and the hole 639 of the shoulder 638 aligns with the corresponding hole 658 of the shoulder 618 of the first component 610 (see...). Figure 4BThe holes are aligned so that the fourth component 630 can be secured relative to the first component 610 using fasteners (e.g., screws). Furthermore, when the fourth component 630 is mounted onto the first component 610, the groove 633 on the bottom of the fourth component 630 aligns with the corresponding groove 624 on the top of the second component 620 to secure the heat sink. In some embodiments, a shock-absorbing pad is also provided between the groove and the heat sink.

[0069] Figure 4B The structure of the first component 610 as viewed from the second surface and the structure of the first component 610 as viewed from each side are shown. Figure 4B The left side 650 of the first component 610 includes a plurality of holes 651 through which fasteners (e.g., screws) can be used to secure the first component 610 relative to side plate 202 or side plate 203. The right side 652 of the first component 610 includes a plurality of holes 653 through which fasteners (e.g., screws) can be used to secure the first component 610 relative to side plate 202 or side plate 203 through which fasteners (e.g., screws) can be used to secure the first component 610 relative to side plate 202 or side plate 203. The lower side 654 of the first component 610 includes a plurality of holes 655 through which fasteners (e.g., screws) can be used to secure the first component 610 relative to the base plate through which fasteners (e.g., screws) can be used to secure the first component 610 relative to the base plate. Figure 4B The reference numeral 656 in the figure reflects the structure of the first component 610 as viewed from the top side, i.e., a top view of the first component 610, which includes a plurality of holes. Hole 657 is located on the upper side of the first component 610, and hole 659 is located on the step 617 of the opening 611. Hole 658 is located on the shoulder of the first component 610. The first component 610 can be secured relative to the cover plate using fasteners (e.g., screws) through hole 657 and holes on the edge of the cover plate 204 (see Figure 12). Fasteners (e.g., screws) can be used through hole 659 and hole 629 on the shoulder 627 of the second component 620 (see Figure 12). Figure 4A The second component 620 is secured relative to the first component 610. Fasteners (e.g., screws) are used to secure the third and fourth components relative to the first component 610 through holes in the shoulders of the third and fourth components and holes 658 in the shoulder of the first component 610.

[0070] Figure 4C and Figure 4D These are schematic diagrams of the first component 610 viewed from different angles, showing the positions of the holes on each side of the first component 610. Figure 4C Multiple holes 653 on the right side 652 of the first component 610, multiple holes 657 on the upper side of the first component 610, multiple holes 659 on the stepped portion of the first component 610, and multiple holes 658 on the shoulder of the first component 610 are shown. Figure 4CA plurality of holes 653 on the right side 652 of the first component 610 and a plurality of holes 655 on the lower side 654 of the first component 610 are shown.

[0071] It should also be noted that, in this application, the various holes on the chassis used for fixing can also be collectively referred to as fixing holes or mounting holes.

[0072] Figure 13 This is a flowchart illustrating a method for installing a computing device according to an embodiment of the present invention (particularly the installation of a side panel of a computing device chassis). Refer below for... Figure 13 and combined Figure 5-1 2. The computing device installation method of the embodiments of this application will be described in detail.

[0073] In step 1301, the first component of the chassis side panel is installed on the chassis base plate.

[0074] like Figure 5 As shown, the first component 610 of the side plate 600 is mounted on the base plate 201.

[0075] The first component 610 is generally flat and includes one or more openings, such as openings 611 and 612. Each opening may have one or more recesses. For example, as Figure 4A As shown, each of the openings 611 and 612 has a groove 613 at its bottom. Figure 4A In the example, opening 612 has a groove not only at the bottom but also at the step 617, while opening 611 has grooves only at the bottom, but not at the step. The grooves are used to fix the heat dissipation pipes of the heat dissipation system, and the number of grooves is determined according to the number of heat dissipation pipes in the heat dissipation system.

[0076] In some embodiments, the first component 610 has a recessed edge 615 adjacent to the opening, the thickness of which is less than the thickness of the other portions (i.e., the body portion) of the first component 610. One or more holes 616 may be present in the edge 615, these holes being perpendicular to... Figure 6 The direction of the paper extends, that is, perpendicular to the surface of the first component 610, or perpendicular to the surface of the side plate 600.

[0077] In some embodiments, the step portion 617 within the opening 611 has a parallel to Figure 4A The hole is oriented in the direction of the paper surface (i.e., parallel to the surface of the first component 610, or parallel to the surface of the side plate 600).

[0078] In some embodiments, the upper edge of the first component 610 has a shoulder 618 near the openings 611 and 612, similar to the step 617 of the opening 611, and the shoulder 618 also has a parallel to Figure 4AThe hole is oriented in the direction of the paper surface (i.e., parallel to the surface of the first component 610, or parallel to the surface of the side plate 600).

[0079] The first component 610 of the side plate 600 can be secured relative to the base plate 201, side plate 202, and side plate 203 using fasteners (such as screws). For further reinforcement, the first component 610 can also be further secured relative to the base plate 201 using, for example, an L-shaped first set of fasteners 261.

[0080] According to some embodiments of this application, before, after, or simultaneously with the installation of the first component 610, such as Figure 5 As shown, side panels 202 and 203, a motherboard (not shown), and a support structure 210 are mounted on the chassis base plate 201. The motherboard may have components such as a CPU and memory. The support structure 210 includes a bracket 211 and a support beam 212, and components such as a hard drive 281 may be mounted on the support structure 210.

[0081] In some embodiments of this application, the chassis base plate 201 and the side plates 202 and 203 may be an integral structure.

[0082] In step 1302, at least one set of heat pipes of the heat dissipation system is installed above the chassis base plate.

[0083] For example, such as Figure 6 As shown, and in combination Figure 1 The system can accommodate a first set of heat pipes 321, a second set of heat pipes 322, and a third set of heat pipes 323. It also includes corresponding support structures, heat sinks (e.g., a first heat sink, a second heat sink, and a third heat sink), and a circuit board with heat-generating components (e.g., a graphics card with a CPU). The first set of heat pipes 321 can work with the first heat sink to cool, for example, the GPU. The second set of heat pipes 322 can work with the second heat sink to cool, for example, the CPU. The third set of heat pipes 323 can work with the third heat sink to cool, for example, another heat-generating component, the GPU. The first set of heat pipes 321, the second set of heat pipes 322, and the third set of heat pipes 323 can be positioned relative to the recesses in the first component 610, meaning at least a portion of each set of heat pipes 321, 322, and 323 is located within a recess in the first component 610.

[0084] The first heat pipe 321, the second heat pipe 322, the third heat pipe 323, the first heat sink, the second heat sink, and the third heat sink, as well as the corresponding circuit board (e.g., a graphics card with a GPU), can be supported by a support structure 220 (see...). Figure 1 It is mounted on top of the motherboard. Expansion cards (such as graphics cards) can be connected to the motherboard via cables.

[0085] In step 1303, the second component of the chassis side panel is installed in the first opening.

[0086] The second component 620 is generally flat. The second component 620 has a first portion corresponding to an opening (e.g., opening 611) of the first component 610, such as the lower portion of opening 611. The second component 620 also has one or more recesses 623 at its bottom. The second component 620 also has one or more recesses 624 at its top.

[0087] In some embodiments, the second component 620 has one or more recessed edges 625, the thickness of which is less than the thickness of the other portions (i.e., the body portion) of the second component 620. One or more holes 626 may be present in the edge 625, these holes being perpendicular to... Figure 4A The direction of the paper extends, that is, perpendicular to the surface of the second component 620, or perpendicular to the surface of the side plate 600.

[0088] In some embodiments, the second component 620 has a shoulder 627, which also has a parallel to... Figure 6 Hole 629 is oriented in the direction of the paper surface (i.e., parallel to the surface of the second component 620, or parallel to the surface of the side plate 600).

[0089] like Figure 7 As shown, and in combination Figure 4A and Figure 4B When the second component 620 is installed, its edge 625 overlaps with a portion of the edge 615 of the first component 610, and the hole 626 of the edge 625 aligns with a portion of the hole 616 of the edge 615. The hole 629 of the shoulder 627 aligns with the corresponding hole 659 of the stepped portion 617 of the opening 611. This allows the second component 620 to be secured relative to the first component 610 using fasteners (e.g., screws) through these holes. Furthermore, when the second component 620 is mounted onto the first component 610, the groove 623 at the bottom of the second component aligns with the corresponding groove at the bottom of the opening 611, forming a passage for the first set of heat dissipation pipes 321 and for securing the first set of heat dissipation pipes 321. In some embodiments, a shock-absorbing pad is also provided between the groove and the heat dissipation pipe. In this application, the term "passage" is also referred to as a through hole or channel.

[0090] In some embodiments, while installing the second component 620, or before or after, a second set of fasteners, such as L-shaped fasteners 262, may be used to further secure the first component 610 relative to the side plates 202 and 203 and the support beam of the support structure 220.

[0091] Figure 8 yes Figure 7A partially enlarged view of the structure shows the structure of the shoulder 627 of the second component 620, especially the hole 629 of the shoulder 627.

[0092] In step 1304, install the additional heat pipes of the heat dissipation system (i.e., the fourth set of heat pipes).

[0093] For example, such as Figure 9 As shown, and in combination Figure 1 A fourth heat pipe 324 can be installed. A corresponding support structure 230, a corresponding heatsink (e.g., a corresponding fourth heatsink), and a circuit board with a heat-generating element (e.g., a graphics card with a CPU) are also installed. The fourth heat pipe 324 can work with the fourth heatsink to cool, for example, a heat-generating element like the GPU. This circuit board (e.g., the graphics card) can be connected to the motherboard via a cable. The fourth heat pipe 324 can be positioned relative to a recess on the top of the second component 620, meaning at least a portion of the fourth heat pipe 324 is located within the recess on the top of the second component 620.

[0094] The fourth heat pipe 324, the fourth heat sink, and the corresponding board (such as the graphics card) can be supported on the motherboard by the support structure 230.

[0095] Subsequently, support structure 240 can be installed on support structure 230, and a third set of fasteners 263 in the form of an L-shape can be fixed on first component 610.

[0096] In step 1305, the third and fourth components of the side panel are installed.

[0097] The third component 640 is generally flat. The third component 640 has a shape corresponding to an opening (e.g., opening 612) in the first component 610. The third component 640 also has one or more recesses 643 at its bottom. Figure 4A In the example, the third component 640 has a groove at the bottom and also a groove at the step 647.

[0098] In some embodiments, the third component 640 has one or more recessed edges 645, the thickness of which is less than the thickness of the other portions of the third component 640 (i.e., the body portion). One or more holes 646 may be present in the edge 645, these holes being perpendicular to... Figure 4A The direction of the paper extends, that is, perpendicular to the surface of the third component 640, or perpendicular to the surface of the side plate 600.

[0099] In some embodiments, the third component 640 has a shoulder 648, which also has a parallel to Figure 4A Hole 649 is oriented in the direction of the paper surface (i.e., parallel to the surface of the third component 640, or parallel to the surface of the side plate 600).

[0100] The fourth component 630 is generally flat. The fourth component 630 has a second portion corresponding to the shape of an opening (e.g., opening 611) of the first component 610, such as the upper part of opening 611. The fourth component 630 also has one or more recesses 633 at its bottom.

[0101] In some embodiments, the fourth component 630 has one or more recessed edges 635, the thickness of which is less than the thickness of the other portions of the fourth component 630 (i.e., the body portion). One or more holes 636 may be present in the edge 635, these holes being perpendicular to... Figure 4A The direction of the paper extends, that is, perpendicular to the surface of the fourth component 630, or perpendicular to the surface of the side plate 600.

[0102] In some embodiments, the fourth component 630 has a shoulder 638, which also has a parallel to Figure 4A Hole 639 is oriented in the direction of the paper surface (i.e., parallel to the surface of the fourth component 630, or parallel to the surface of the side plate 600).

[0103] like Figure 10 As shown, and in combination Figure 4A and Figure 4B When installing the third component 640 and the fourth component 630, the edge 645 of the third component 640 overlaps with a portion of the edge 615 at the opening 612 of the first component 610, while the hole 646 of the edge 645 aligns with a portion of the hole 616 of the edge 615, and the hole 649 of the shoulder 648 aligns with the corresponding hole 658 of the shoulder 618. This allows the third component 640 to be secured relative to the first component 610 using fasteners (e.g., screws) through these holes. Furthermore, when the third component 640 is installed onto the first component 610, the groove 643 at the bottom and step 647 of the third component 640 aligns with the corresponding groove 613 at the bottom and step 617 of the opening 612 of the first component 610, forming a passage for the passage of the second set of heat sinks 322 and the third set of heat sinks 323, and for securing the second set of heat sinks 322 and the third set of heat sinks 323. In some embodiments, a shock-absorbing pad is also provided between the groove and the heat sink.

[0104] Simultaneously, the edge 635 of the fourth component 630 overlaps with a portion of the edge 615 at the opening 611 of the first component 610, the hole 636 of the edge 635 aligns with a portion of the hole 616 of the edge 615, and the hole 639 of the shoulder 638 aligns with the corresponding hole 658 of the shoulder 618 of the first component 610. This allows the fourth component 630 to be secured relative to the first component 610 using fasteners (e.g., screws) through these holes. Furthermore, when the fourth component 630 is mounted onto the first component 610, the groove 633 at the bottom of the fourth component 630 aligns with the groove 624 at the top of the second component, forming a passage for the fourth set of heat dissipation pipes 324 and for securing the fourth set of heat dissipation pipes 324. In some embodiments, a shock-absorbing pad is also provided between the groove and the heat dissipation pipe.

[0105] In some embodiments of this application, a fourth set of fasteners 264, for example in the shape of an L, may be fixed to the third component 640.

[0106] Then, the plate 250 is fixed to the support structure 240, the third set of fasteners 263, and the fourth set of fasteners 264, and a fifth set of fasteners is fixed to at least one component of the first component 610, the third component 640, and the fourth component 630, for example, as... Figure 11 The fifth set of fasteners 265, for example, L-shaped, can be fixed to the first component 610 and the third component 640.

[0107] After installing the power supply onto the flat panel 250 and connecting the corresponding cables, the cover plate 204 and side plate 205 can be installed, such as... Figure 12A As shown. These panels can be secured relative to each other using fasteners (e.g., screws) through holes in the individual panels (bottom, side, and cover) and / or fasteners (e.g., fifth set of fasteners 265) of the chassis.

[0108] Figure 12B and Figure 12C The details show the securing between some of the chassis panels. For example... Figure 12B As shown, fasteners (e.g., screws) can be used through holes 675 on the edge of the base plate 201 and holes 655 on the lower side 654 of the first component 610 (see...). Figure 4B Secure the first component 610 relative to the base plate. Fasteners (e.g., screws) can be used through holes 673 on the edge of the side plate 202 and holes 653 on the right side face 652 of the first component 610 (see...). Figure 4B Fix the first component 610 relative to the side plate 202. For example... Figure 12C As shown, fasteners (e.g., screws) can be used through holes 671 on the edge of side plate 203 and holes 651 on the left side surface 650 of the first component 610 (see...). Figure 4BThe first component 610 is secured to the opposite side plate 203. Fasteners (e.g., screws) can be used through holes 677 on the edge of the cover plate 204 and holes 657 on the upper side of the first component 610 (see...). Figure 4B The corresponding holes on the first, third, and fourth components secure the first, third, and fourth components relative to the cover plate 204.

[0109] According to the embodiments of this application, because the side panel of the chassis through which the heat pipe passes is reinforced, the computing device structure is stable in vibration environments, especially in vehicle-mounted vibration environments, which can reduce or even eliminate resonance and other phenomena, thus avoiding problems caused by vibration. Moreover, in conventional servers, the heat dissipation equipment is installed inside the chassis. According to this application, the heat pipe of the computing device passes through a side panel, allowing the cooling device to be installed outside the chassis, preventing water leakage inside the chassis due to vibration.

[0110] While exemplary embodiments or examples of this disclosure have been described with reference to the accompanying drawings, it should be understood that the exemplary discussions above are not intended to be exhaustive or to limit the invention to the specific forms disclosed. Many modifications and variations are possible based on the teachings above. Therefore, the subject matter disclosed should not be limited to any single embodiment or example described herein, but should be interpreted in accordance with the breadth and scope of the appended claims.

Claims

1. A method for installing a computing device, comprising: A first assembly for mounting a chassis side panel on the chassis base plate, the first assembly including a first opening, the first assembly having a groove at the bottom of the first opening; At least one set of heat dissipation pipes of a heat dissipation system are installed above the chassis bottom plate, the at least one set of heat dissipation pipes including a first set of heat dissipation pipes, at least a portion of the first set of heat dissipation pipes being located in a groove at the bottom of the first opening of the first component; A second component of the chassis side panel is installed in the first opening. The second component has a groove at its bottom. The groove at the bottom of the first component and the groove at the bottom of the second component form a passage for the passage of the first set of heat pipes. The first component includes a first stepped portion in the first opening, the first stepped portion including a hole extending in a direction parallel to the surface of the first component; the second component includes a shoulder portion, the shoulder including a hole extending in a direction parallel to the surface of the second component. The second component for mounting the chassis side panel in the first opening includes aligning the hole in the first step portion with the hole in the shoulder portion of the second component.

2. The method according to claim 1, wherein, Both the first and second components have recessed edges. The second component for mounting the chassis side panel in the first opening includes aligning at least a partially recessed edge of the first component with a recessed edge of the second component.

3. The method according to claim 1, wherein, The first component further includes a second opening, and the first component includes a second step portion in the second opening. The first component has grooves at the bottom of the second opening and at the second step portion. The at least one set of heat pipes further includes a second set of heat pipes and a third set of heat pipes. Among them, at least one set of heat pipes for installing the cooling system above the chassis bottom plate includes: A second set of heat pipes and a third set of heat pipes of the heat dissipation system are installed above the bottom plate of the chassis, such that at least a portion of the second set of heat pipes is located in the groove at the bottom of the second opening, and at least a portion of the third set of heat pipes is located in the groove of the second step.

4. The method according to claim 3, further comprising: A third component for mounting the chassis side panel is installed in the second opening. The third component includes a third step portion and has grooves at both the bottom and the third step portion. The grooves of the third component and the grooves at the bottom and the second step portion form a passage for the passage of the second set of heat pipes and the third set of heat pipes.

5. The method according to claim 1, wherein, The second component has a groove on its top, and the method further includes: The fourth set of heat dissipation pipes of the heat dissipation system is installed, and at least a portion of the fourth set of heat dissipation pipes is located in a groove on the top of the second component.

6. The method according to claim 5, further comprising: A fourth component of the chassis side panel is installed in the first opening, wherein the bottom of the fourth component has a groove, and the groove at the bottom of the fourth component and the groove at the top of the second component form a passage for the passage of the fourth set of heat pipes.

7. The method according to claim 6, in, The first component includes a shoulder in the first opening, and the shoulder in the first opening includes a hole extending in a direction parallel to the surface of the first component. The fourth component includes a shoulder portion, the shoulder portion of which includes a hole extending in a direction parallel to the surface of the fourth component. The fourth component for mounting the chassis side panel in the first opening includes aligning the hole on the shoulder of the first component in the first opening with the hole on the shoulder of the fourth component.

8. The method according to claim 6, wherein, Both the first and fourth components have recessed edges. The fourth component for mounting the chassis side panel in the first opening includes aligning at least a partially recessed edge of the first component with a recessed edge of the fourth component.

9. A computing device, comprising: A chassis, the chassis including a base plate, multiple side plates and a cover plate; The heat dissipation system includes at least a first set of heat pipes. At least one of the plurality of side panels includes a first component and a second component. The first component includes a first opening, and the first component has a groove at the bottom of the first opening. The second component is located in the first opening, and the bottom of the second component has a groove. The groove at the bottom of the second component and the groove at the bottom of the first opening form a passage for the passage of the first set of heat dissipation pipes. The first component includes a first step portion in the first opening, the first step portion including a hole extending in a direction parallel to the surface of the first component, the second component includes a shoulder portion, the shoulder including a hole extending in a direction parallel to the surface of the second component, and the hole of the first step portion is aligned with the hole of the shoulder portion of the second component.

10. The computing device according to claim 9, in, Both the first component and the second component have recessed edges, and at least part of the recessed edge of the first component overlaps with the recessed edge of the second component.

11. The computing device according to claim 9, in, The first component further includes a second opening, the first component having a second stepped portion in the second opening, and the first component having grooves at the bottom of the second opening and in the second stepped portion. The heat dissipation system also includes a second set of heat pipes and a third set of heat pipes.

12. The computing device according to claim 11, in, The at least one side plate further includes a third component, the third component including a third step portion, the third component having grooves at both the bottom and the third step portion, the grooves of the third component forming a passage for the passage of the second set of heat dissipation pipes and the third set of heat dissipation pipes with the grooves at the bottom of the second opening and the second step portion.

13. The computing device according to claim 12, in, The first component further includes a shoulder in the second opening, the shoulder in the second opening of the first component including a hole extending in a direction parallel to the surface of the first component. The third component further includes a shoulder portion, the shoulder portion of which includes a hole extending in a direction parallel to the surface of the third component. The hole in the shoulder of the first component's second opening is aligned with the hole in the shoulder of the third component.

14. The computing device according to claim 12, in, Both the first and third components have recessed edges, and at least part of the recessed edge of the first component overlaps with the recessed edge of the third component.

15. The computing device according to claim 9, wherein, The second component has a groove on its top, and the heat dissipation system also includes a fourth set of heat pipes. The at least one side plate further includes a fourth component, the fourth component having a groove at its bottom, the groove at the bottom of the fourth component and the groove at the top of the second component forming a passage for the passage of the fourth set of heat dissipation pipes.

16. The computing device according to claim 15, wherein, Both the first and fourth components have recessed edges, and the recessed edge of the first component at least partially overlaps with the recessed edge of the fourth component.

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