A semiconductor chip mounter with dual functions of eutectic and dispensing

Abstract

The present invention discloses a semiconductor placement machine with dual functions of eutectic and dispensing in the semiconductor field, comprising a working disk fixedly mounted on a frame, substrate loading and unloading mechanisms, dispensing mechanisms, chip loading mechanisms and eutectic mechanisms arranged in sequence along the circumference of the working disk, a first rotating shaft mounted on the working disk, and a tray fixedly mounted on the first rotating shaft through a connecting rod; the eutectic mechanism comprises a heating eutectic bin fixedly mounted on the working disk, and a first exhaust port and a protective gas injection port are opened at the upper end of the heating eutectic bin; the dispensing mechanism comprises a dispensing head, a heat preservation layer is arranged on the bin wall of the dispensing head, a spiral heat preservation pipe is arranged in the heat preservation layer, one end of the heat preservation pipe is connected to the first exhaust port through a heat exhaust pipe, and the other end is connected to the second exhaust port arranged on the dispensing head. The present invention can switch between dispensing and eutectic methods at will for solidification. The heating gas during eutectic is used to keep the dispensing head warm to avoid solidification of the colloid in the dispensing head.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chips, in particular to a semiconductor chip mounter with dual functions of eutectic and glue dispensing. Background Art

[0002] In the packaging process of semiconductor devices such as ICs and LEDs, patch is an extremely important link. It is a process that accurately places surface mount components on PCB pads by moving the placement head. The current patch methods mainly include dispensing and eutectic. In the prior art, semiconductor eutectic and dispensing integrated patch machines have appeared. This type of equipment can switch between eutectic and dispensing. However, in actual use, switching between processes takes a long time, which increases the overall working time. In addition, when switching from the eutectic process to the dispensing process, the dispensing colloid may solidify due to the long-term non-operation of the dispensing head, which may cause the dispensing colloid to solidify, resulting in dispensing failure and unqualified products; heating before dispensing to keep it flowing wastes energy on the one hand, and prolongs the process time on the other hand, affecting efficiency. Summary of the invention

[0003] The technical problem of the present invention is to provide a semiconductor placement machine with dual functions of eutectic and dispensing. The present invention can realize rapid switching between eutectic process and dispensing process, and when adopting the eutectic process, the heated gas discharged during eutectic is used to insulate the non-working dispensing head to avoid solidification of the colloid, so that when switching from the eutectic process to the dispensing process, the dispensing mechanism can work immediately without preheating, thereby reducing the overall time of the process and improving efficiency.

[0004] To achieve the above-mentioned object, the present invention provides the following technical solution: a semiconductor placement machine with dual functions of eutectic and dispensing, comprising a working plate fixedly mounted on a frame, a substrate loading and unloading mechanism, a dispensing mechanism, a chip loading mechanism and a eutectic mechanism are sequentially arranged along the circumference of the working plate, a first rotating shaft is rotatably mounted on the working plate; trays are arranged at intervals along the circumference of the first rotating shaft, and the trays are fixedly mounted on the first rotating shaft through a connecting rod;

[0005] The dispensing mechanism comprises a dispensing head fixedly mounted on a working disk, a squeezing plate is vertically slidably pressed in the dispensing head, a squeezing column is fixedly mounted on the squeezing plate, the squeezing column is a hollow structure, and the squeezing column is a through-shaped glue filling pipe, and a fourth spring is arranged between the squeezing column and the dispensing head along the sliding direction of the squeezing plate;

[0006] The eutectic mechanism comprises a heating eutectic bin fixedly mounted on a working disk, a heating pre-pressing plate is vertically slidably mounted on the eutectic bin, a first spring is arranged between the heating pre-pressing plate and the heating eutectic bin, and a first exhaust port and a protective gas injection port are opened at the upper end of the heating eutectic bin;

[0007] A heat-insulating layer is arranged on the warehouse wall of the dispensing head, a spiral heat-insulating pipe is arranged in the heat-insulating layer, one end of the heat-insulating pipe is connected to the first exhaust port through a heat exhaust pipe, and the other end is connected to the second exhaust port arranged on the dispensing head.

[0008] As a further scheme of the present invention, the present invention includes a switching mechanism, which is used to lift the pallet for dispensing and eutectic when the pallet moves to the bottom of the dispensing mechanism and the bottom of the eutectic mechanism; a fixed column is fixedly installed under the pallet, and the fixed column is vertically slidably installed on the connecting rod, a second spring is arranged between the pallet and the connecting rod, and a lifting plate is fixedly installed below the fixed column; a lifting assembly is arranged below the dispensing mechanism and the eutectic mechanism, and the lifting assembly is used to lift the pallet upward when the pallet moves to the bottom of the dispensing mechanism and the eutectic mechanism.

[0009] As a further scheme of the present invention, the lifting mechanism includes two hinged rods hinged on the frame in the middle, the middle parts of the two hinged rods are hinged on the same second rotating shaft, and the second rotating shaft is rotatably mounted on the frame; a sliding groove is opened on the lifting plate, one end of the two hinged rods is slidably mounted on the sliding groove, and the other end is rollingly connected with two cams fixedly mounted on the third rotating shaft respectively; the third rotating shaft is horizontally arranged and key-connected and mounted on the frame; the third rotating shaft has two states a1 and a2: a1: the cam located below the dispensing mechanism is rollingly connected to the hinged rod, and the cam located below the eutectic mechanism is not connected to the hinged rod; a2: the cam located below the dispensing mechanism is not connected to the hinged rod, and the cam located below the eutectic mechanism is rollingly connected to the hinged rod; a switching component is fixedly mounted on the third rotating shaft, and the switching component is used to control the third rotating shaft to switch between a1 and a2.

[0010] As a further solution of the present invention, the switching assembly includes a switching block fixedly mounted on the third rotating shaft, and two limit plates are fixedly arranged on the frame, and the limit plates are located on both horizontal sides of the switching block, and the limit plates are used to limit the horizontal movement of the switching block; wedge surfaces are provided at both ends of the switching block; a switching column is vertically arranged below the third rotating shaft, and the switching column is vertically slidably mounted on the frame, and a spring is arranged between the switching column and the frame.

[0011] As a further scheme of the present invention, the present invention includes a first gear fixedly mounted on a first rotating shaft, the first gear meshing with an incomplete gear arranged next to it, and the tooth number ratio of the incomplete gear to the first gear is 1:4; the incomplete gear is fixedly mounted on a fourth rotating shaft, the fourth rotating shaft is rotatably mounted on a frame, the fourth rotating shaft is externally connected to a power supply, and the fourth rotating shaft is synchronously connected to the third rotating shaft through a synchronous belt.

[0012] As a further solution of the present invention, a stirring column is key-connected and installed on the outer edge of the extrusion plate surface, a first synchronous wheel is key-connected and installed on the extrusion column, a fifth rotating shaft is rotatably installed on the working disk, a second synchronous wheel synchronously connected to the first synchronous wheel is fixedly installed on the fifth rotating shaft, a second gear is fixedly installed on the fifth rotating shaft, a third gear is fixedly installed on the first rotating shaft, and the second gear is meshed with the third gear.

[0013] As a further solution of the present invention, a driving ring is fixedly mounted on the extrusion column, a wedge surface is provided on the outer peripheral edge of the driving ring, a driving column is vertically slidably mounted on the working disk, the driving column is located below the dispensing mechanism, and a driving rod is also horizontally slidably mounted on the working disk, when the driving column moves vertically upward, the driving rod is driven to move horizontally through the wedge surface, and the driving rod is driven to move vertically downward through the wedge surface when it moves horizontally.

[0014] Compared with the prior art, the present invention has the following beneficial effects:

[0015] 1. The present invention can realize the rapid switching between the eutectic process and the dispensing process, and when the eutectic process is adopted, the heated gas discharged during the eutectic process is used to keep the non-working dispensing head warm to avoid solidification of the colloid, so that when switching from the eutectic process to the dispensing process, the dispensing mechanism can work immediately without preheating, thereby reducing the overall time of the process flow and improving efficiency.

[0016] 2. The present invention fixes the dispensing head and drives the substrate to move up close to the dispensing head to avoid frequent oscillation of the dispensing head and improve the accuracy of dispensing. The present invention uses a cam to slowly lift the tray and slowly approach the dispensing mechanism and the eutectic mechanism to avoid collision and displacement of the substrate due to excessive speed, thereby ensuring the quality of the patch. The present invention can change the distance between the tray and the dispensing mechanism and the eutectic mechanism by replacing the cam.

[0017] 3. The present invention utilizes the rotation of the tray to drive the stirring column in the dispensing head to stir the colloid when the process is switched to avoid solidification; when the tray is stationary, the stirring column stops stirring to avoid affecting the dispensing of the dispensing head. The present invention utilizes the upward movement of the tray to drive the dispensing head to dispense glue, which has a close fit and improves efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for describing the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0019] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0020] Figure 2 This is a structural schematic diagram of the present invention without the substrate loading and unloading mechanism and the chip loading and unloading mechanism;

[0021] Figure 3 For the present invention Figure 2 The enlarged structural diagram at A in the middle;

[0022] Figure 4 For the present invention Figure 2 Enlarged structural diagram of point B in the middle

[0023] Figure 5 It is a structural schematic diagram of the dispensing mechanism and the working plate of the present invention;

[0024] Figure 6 It is a schematic diagram of the structure of the switching mechanism of the present invention when viewed from the top and side;

[0025] Figure 7 It is a structural schematic diagram of the glue dispensing mechanism of the present invention.

[0026] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0027] 1-working plate, 2-substrate loading and unloading mechanism, 3-glue dispensing mechanism, 4-chip loading mechanism, 5-eutectic mechanism, 11-first rotating shaft, 12-tray, 13-connecting rod, 31-glue dispensing head, 32-extrusion plate, 33-extrusion column, 34-glue filling pipeline, 35-insulation layer, 36-insulation pipeline, 37-heat exhaust pipeline, 38-second exhaust port, 39-fourth spring, 51-heating eutectic chamber, 52-heating pre-pressing plate, 53-first spring, 54-first exhaust port, 55-protective gas injection port, 61-fixed Column, 62-second spring, 63-lifting plate, 64-hinge rod, 65-second rotating shaft, 66-sliding groove, 67-cam, 68-third rotating shaft, 71-switching block, 72-limiting plate, 73-switching column, 75-first gear, 76-incomplete gear, 77-fourth rotating shaft, 78-synchronous belt, 81-stirring column, 82-first synchronous wheel, 83-fifth rotating shaft, 84-second synchronous wheel, 85-second gear, 86-third gear, 91-driving ring, 92-driving column, 93-driving rod. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] See also Figure 1-7 The present invention provides a semiconductor placement machine with dual functions of eutectic and glue dispensing, comprising a working disk 1 fixedly mounted on a frame, a substrate loading and unloading mechanism 2, a glue dispensing mechanism 3, a chip loading mechanism 4 and a eutectic mechanism 5 are sequentially arranged along the circumference of the working disk 1, a first rotating shaft 11 is rotatably mounted on the working disk 1; trays 12 are arranged at intervals along the circumference of the first rotating shaft 11, and the trays 12 are fixedly mounted on the first rotating shaft 11 through a connecting rod 13;

[0030] The dispensing mechanism 3 includes a dispensing head 31 fixedly mounted on the working disk 1, a squeezing plate 32 is vertically slidably pressed in the dispensing head 31, a squeezing column 33 is fixedly mounted on the squeezing plate 32, the squeezing column 33 is a hollow structure, and the squeezing column 33 is provided with a through-shaped glue filling pipe 34, and a fourth spring 39 is provided between the squeezing column 33 and the dispensing head along the sliding direction of the squeezing plate 32;

[0031] The eutectic mechanism 5 comprises a heating eutectic chamber 51 fixedly mounted on the working disk 1, a heating pre-pressing plate 52 is vertically slidably mounted on the eutectic chamber, a first spring 53 is arranged between the heating pre-pressing plate 52 and the heating eutectic chamber 51, and a first exhaust port 54 and a protective gas injection port 55 are opened at the upper end of the heating eutectic chamber 51;

[0032] An insulation layer 35 is provided on the warehouse wall of the dispensing head 31, and a spiral insulation pipe 36 is provided in the insulation layer 35. One end of the insulation pipe 36 is connected to the first exhaust port 54 through a heat exhaust pipe 37, and the other end is connected to a second exhaust port 38 provided on the dispensing head 31.

[0033] The present invention can realize the rapid switching between the eutectic process and the dispensing process. The specific workflow is as follows Figure 1As shown, when the present invention is working, the substrate is first placed on the tray 12 at the substrate loading and unloading mechanism 2, and then the first rotating shaft 11 drives the disk to rotate and passes through the glue dispensing mechanism 3, the chip loading mechanism 4 and the eutectic mechanism 5 in sequence, and then returns to the substrate loading and unloading mechanism 2 for unloading. When the glue dispensing process is adopted, the glue dispensing mechanism 3 is started and the eutectic mechanism 5 is closed, so that the substrate is glued at the glue dispensing mechanism 3, the chip is mounted at the chip loading mechanism 4, the eutectic mechanism 5 does not work, and the substrate loading and unloading mechanism 2 is unloaded to complete the entire mounting process. When switching to the eutectic process, the eutectic mechanism 5 is started, the glue dispensing mechanism 3 is closed, so that the substrate does not work at the glue dispensing mechanism 3, the chip is placed at the chip loading mechanism 4, the substrate and the chip are eutectically fixed at the eutectic mechanism 5, and the substrate loading and unloading mechanism 2 is unloaded to complete the entire mounting process.

[0034] When the eutectic process is switched to the dispensing process, the colloid in the dispensing head 31 may solidify due to long-term non-operation. In the eutectic process of the present invention, although the dispensing head 31 is not working, the eutectic process needs to inject protective gas, heat the eutectic welding, and exhaust gas during solidification. Figure 5 , Figure 7 As shown, the present invention first sets a heat preservation layer 35 in the dispensing head 31 to keep the colloid in the dispensing head 31 warm, and then Figure 3 , Figure 4 That is, the first exhaust port 54 located on the heated eutectic chamber 51 is connected to the insulation layer 35 through the heat exhaust pipe 37, and the heated gas discharged during eutectic is discharged into the insulation layer 35 to heat the colloid in the dispensing head 31 to prevent the colloid from solidifying. After the heated gas is transported through the insulation pipe 36, it is discharged from the second exhaust port 38 on the dispensing head 31. An air valve is installed at the first exhaust port 54. The present invention sets the insulation pipe 36 in a spiral shape in order to increase the heat exchange area and improve the heating effect. The present invention can realize the rapid switching between the eutectic process and the dispensing process, and when the eutectic process is adopted, the heated gas discharged during the eutectic is used to insulate the non-working dispensing head 31 to prevent the colloid from solidifying, so that when switching from the eutectic process to the dispensing process, the dispensing mechanism 3 can work immediately without preheating, thereby reducing the overall time of the process flow and improving efficiency.

[0035] As a further scheme of the present invention, the present invention includes a switching mechanism, which is used to lift the tray 12 for dispensing and eutectic when the tray 12 moves to the bottom of the dispensing mechanism 3 and the bottom of the eutectic mechanism 5; a fixed column 61 is fixedly installed under the tray 12, and the fixed column 61 is vertically slidably installed on the connecting rod 13, and a second spring 62 is arranged between the tray 12 and the connecting rod 13, and a lifting plate 63 is fixedly installed below the fixed column 61; a lifting assembly is arranged below the dispensing mechanism 3 and the eutectic mechanism 5, and the lifting assembly is used to lift the tray 12 upward when the tray 12 moves to the bottom of the dispensing mechanism 3 and the eutectic mechanism 5.

[0036] The present invention requires the switching mechanism to work so that the device can switch between the eutectic process and the dispensing process. The ordinary dispensing method requires the dispensing head 31 to move up and down to approach the substrate and then dispense the glue. In this way, the dispensing head 31 may cause displacement deviation and glue leakage due to vibration during the frequent upward movement. Figure 1 , Figure 6 As shown, when the tray 12 moves to the bottom of the dispensing mechanism 3 and the eutectic mechanism 5, the tray 12 is lifted upward by the lifting assembly to lift the lifting plate 63, and the lifting plate 63 moves upward to drive the tray 12 to move up through the fixed column 61, close to the dispensing mechanism 3 and the eutectic mechanism 5, and the second spring 62 is compressed at this time; when the dispensing and eutectic are completed, the tray 12 moves downward to reset under the restoring force of the second spring 62, and then the tray 12 moves to the downward movement station. The present invention fixes the dispensing head 31, and by driving the substrate to move up close to the dispensing head 31, the frequent oscillation of the dispensing head 31 is avoided, thereby improving the accuracy of dispensing.

[0037] As a further solution of the present invention, the lifting mechanism includes two hinged rods 64 whose middle parts are hinged on the frame, and the middle parts of the two hinged rods 64 are hinged on the same second rotating shaft 65, and the second rotating shaft 65 is rotatably mounted on the frame; the lifting plate 63 is provided with a sliding groove 66, one end of the two hinged rods 64 is slidably mounted on the sliding groove 66, and the other end is respectively rollingly connected with two cams 67 fixedly mounted on the third rotating shaft 68; the third rotating shaft 68 is horizontally arranged and key-connected to the frame; the The third rotating shaft 68 has two states, a1 and a2: a1: the cam 67 located below the dispensing mechanism 3 is rollingly connected to the articulated rod 64, and the cam 67 located below the eutectic mechanism 5 is not connected to the articulated rod 64; a2: the cam 67 located below the dispensing mechanism 3 is not connected to the articulated rod 64, and the cam 67 located below the eutectic mechanism 5 is rollingly connected to the articulated rod 64; a switching component is fixedly installed on the third rotating shaft 68, and the switching component is used to control the third rotating shaft 68 to switch between a1 and a2.

[0038] The lifting action of the lifting mechanism needs to be lifted slowly, so that the tray 12 slowly approaches the dispensing mechanism 3 and the eutectic mechanism 5, to avoid collision and substrate displacement caused by too fast speed, resulting in unqualified patch. Figure 6 As shown, when the present invention is lifted, the third rotating shaft 68 rotates to drive the cam 67 to rotate, and the cam 67 rotates to push down one end of the hinged rod 64, so that the other end of the hinged rod 64 slowly moves upward and slides in the sliding groove 66 at the lower end of the lifting plate 63, slowly lifting the lifting plate 63. At this time, the second spring 62 is compressed to play a buffering role to avoid excessive speed. The present invention is provided with a hinged rod 64 below the dispensing mechanism 3 and the eutectic mechanism 5. When the dispensing process is adopted, the third rotating shaft 68 is driven to slide horizontally, so that the cam 67 located below the dispensing mechanism 3 is rollingly connected with the hinged rod 64, and the cam 67 located below the eutectic mechanism 5 is not connected with the hinged rod 64, so that the tray 12 will be lifted up for patching when it is below the dispensing mechanism 3, and remain at a low position and stationary when it is below the eutectic mechanism 5. When the eutectic process is adopted, the third rotating shaft 68 is driven again to slide horizontally in the opposite direction, so that the cam 67 located below the dispensing mechanism 3 is not connected to the hinge rod 64, and the cam 67 located below the eutectic mechanism 5 is rollingly connected to the hinge rod 64, so that the tray 12 will be lifted up when it is below the eutectic mechanism 5 to perform eutectic, and remain at a low position and stationary when it is below the dispensing mechanism 3. The present invention adopts the cam 67 so that the tray 12 can be slowly lifted up and slowly approach the dispensing mechanism 3 and the eutectic mechanism 5, avoiding collision and displacement of the substrate due to excessive speed, thereby ensuring the quality of the patch. The present invention can change the contact distance between the tray 12 and the dispensing mechanism 3 and the eutectic mechanism 5 by replacing the cam 67.

[0039] As a further solution of the present invention, the switching assembly includes a switching block 71 fixedly mounted on the third rotating shaft 68, and two limit plates 72 are fixedly arranged on the frame, and the limit plates 72 are located on both horizontal sides of the switching block 71, and the limit plates 72 are used to limit the horizontal movement of the switching block 71; wedge surfaces are provided at both ends of the switching block 71; a switching column 73 is vertically arranged below the third rotating shaft 68, and the switching column 73 is vertically slidably mounted on the frame, and a spring is arranged between the switching column 73 and the frame.

[0040] like Figure 2As shown, the specific switching method of the present invention is that when it is necessary to switch to the dispensing process, the third rotating shaft 68 is driven to move to the left, so that the cam 67 is rollingly connected with the hinged rod 64 located below the dispensing mechanism 3, so that when the third rotating shaft 68 rotates, the cam 67 drives the tray 12 at the dispensing mechanism 3 to move up and close to the dispensing mechanism 3, so as to facilitate dispensing; at this time, the switching block 71 will be limited by the switching column 73 and the limiting plate 72 on the left, so that the cam 67 is continuously connected to the hinged rod 64 to avoid falling off; similarly, when it is necessary to switch to the eutectic process, the third rotating shaft 68 is driven to move to the right, and the switching block 71 drives the switching column 73 to extend and retract through the wedge surface. At this time, the cam 67 is rollingly connected to the hinged rod 64 located below the eutectic mechanism 5, so that when the third rotating shaft 68 rotates, the cam 67 drives the tray 12 at the eutectic mechanism 5 to move up and close to the eutectic mechanism 5 to facilitate the eutectic; at this time, the switching block 71 will be limited by the switching column 73 and the limiting plate 72 on the right, so that the cam 67 is continuously connected to the hinged rod 64 to avoid falling off.

[0041] As a further scheme of the present invention, the present invention includes a first gear 75 fixedly mounted on the first rotating shaft 11, the first gear 75 is meshed with an incomplete gear 76 arranged next to it, and the gear ratio of the incomplete gear 76 to the first gear 75 is 1:4; the incomplete gear 76 is fixedly mounted on a fourth rotating shaft 77, the fourth rotating shaft 77 is rotatably mounted on the frame, the fourth rotating shaft 77 is externally connected to a power supply, and the fourth rotating shaft 77 is synchronously connected to the third rotating shaft 68 through a synchronous belt 78.

[0042] The rotation of the tray 12 of the present invention and the lifting of the lifting mechanism need to be coordinated in time to ensure accuracy and efficiency. Figure 2 , Figure 6 As shown, when the present invention is working, the external power source drives the fourth rotating shaft 77 to rotate, and the fourth rotating shaft 77 rotates one circle to drive the tray 12 to switch a work station. When the fourth rotating shaft 77 rotates, the present invention drives the third rotating shaft 68 to rotate through the synchronous belt 78, and the third rotating shaft 68 rotates to drive the cam 67 to rotate. Figure 6 As shown, the synchronous wheel of the third rotating shaft 68 of the present invention is key-connected and installed on the third rotating shaft 68. When the first rotating shaft 11 rotates, the non-convex part of the cam 67 is connected to the hinge rod 64; when the first rotating shaft 11 is stationary, the convex part of the cam 67 is connected to the hinge rod 64, and the cam 67 rotates to drive the tray 12 to lift up.

[0043] As a further solution of the present invention, a stirring column 81 is key-connected and installed on the outer edge of the extrusion plate 32, a first synchronous wheel 82 is key-connected and installed on the extrusion column 33, a fifth rotating shaft 83 is rotatably installed on the working disk 1, a second synchronous wheel 84 synchronously connected to the first synchronous wheel 82 is fixedly installed on the fifth rotating shaft 83, a second gear 85 is fixedly installed on the fifth rotating shaft 83, a third gear 86 is fixedly installed on the first rotating shaft 11, and the second gear 85 is meshed with the third gear 86.

[0044] like Figure 5 As shown, when the first rotating shaft 11 drives the tray 12 to rotate, the third gear 86 fixedly mounted on the first rotating shaft 11 rotates, driving the second gear 85 meshing therewith to rotate, the second gear 85 rotates to drive the fifth rotating shaft 83 to rotate, the second rotating shaft 65 drives the second synchronous wheel 84 to rotate, and then drives the first synchronous wheel 82 to rotate. The first synchronous wheel 82 rotates to drive the extrusion column 33 to rotate, and the extrusion column 33 rotates to drive the stirring column 81 to stir the colloid in the dispensing head 31, further preventing the colloid from solidifying.

[0045] As a further solution of the present invention, a driving ring 91 is fixedly installed on the extrusion column 33, and a wedge surface is opened on the outer peripheral edge of the driving ring 91. A driving column 92 is vertically slidably installed on the working disk 1. The driving column 92 is located below the dispensing mechanism 3. A driving rod 93 is also horizontally slidably installed on the working disk 1. When the driving column 92 moves vertically upward, it drives the driving rod 93 to move horizontally through the wedge surface. The horizontal movement of the driving rod 93 drives the driving ring 91 to move vertically downward through the wedge surface.

[0046] like Figure 5 As shown, when the tray 12 below the dispensing mechanism 3 moves upward, the upward movement of the tray 12 drives the driving column 92 to move upward, and the driving column 92 moves upward to drive the driving rod 93 to move horizontally through the wedge surface to squeeze the driving ring 91, and drives the driving ring 91 to move downward. The driving ring 91 is fixedly installed on the squeezing column 33, so that the squeezing column 33 moves downward, thereby causing the squeezing plate 32 to move downward to dispense glue. The present invention utilizes the upward movement of the tray 12 to drive the dispensing head 31 to dispense glue, and the fit is tight, which improves efficiency.

Claims

1. A semiconductor chip mounter with dual functions of eutectic and dispensing, characterized in that: The invention comprises a working disk (1) fixedly mounted on a frame, wherein a substrate loading and unloading mechanism (2), a glue dispensing mechanism (3), a chip loading mechanism (4) and a eutectic mechanism (5) are sequentially arranged along the circumference of the working disk (1), and a first rotating shaft (11) is rotatably mounted on the working disk (1); trays (12) are arranged at intervals along the circumference of the first rotating shaft (11), and the trays (12) are fixedly mounted on the first rotating shaft (11) via connecting rods (13); The glue dispensing mechanism (3) comprises a glue dispensing head (31) fixedly mounted on the working disk (1), a squeezing plate (32) vertically slidingly pressed inside the glue dispensing head (31), a squeezing column (33) fixedly mounted on the squeezing plate (32), the squeezing column (33) being a hollow structure, the squeezing column (33) being a through-shaped glue filling pipe (34), and a fourth spring (39) being arranged between the squeezing column (33) and the glue dispensing head along the sliding direction of the squeezing plate (32); The eutectic mechanism (5) comprises a heating eutectic bin (51) fixedly mounted on a working disk (1), a heating pre-pressing plate (52) vertically slidably mounted on the eutectic bin, a first spring (53) being arranged between the heating pre-pressing plate (52) and the heating eutectic bin (51), and a first exhaust port (54) and a protective gas injection port (55) being provided at the upper end of the heating eutectic bin (51); A heat-insulating layer (35) is provided on the wall of the dispensing head (31), a spiral heat-insulating pipe (36) is provided in the heat-insulating layer (35), one end of the heat-insulating pipe (36) is connected to the first exhaust port (54) through a heat exhaust pipe (37), and the other end is connected to a second exhaust port (38) provided on the dispensing head (31).

2. A semiconductor chip mounter with dual functions of eutectic and dispensing according to claim 1, characterized in that: The invention comprises a switching mechanism, wherein the switching mechanism is used to lift up the tray (12) for glue dispensing and eutectic formation when the tray (12) moves to the bottom of the glue dispensing mechanism (3) and the bottom of the eutectic mechanism (5); a fixed column (61) is fixedly installed below the tray (12), and the fixed column (61) is vertically slidably installed on the connecting rod (13); a second spring (62) is arranged between the tray (12) and the connecting rod (13); and a lifting plate (63) is fixedly installed below the fixed column (61); a lifting assembly is arranged below the glue dispensing mechanism (3) and the eutectic mechanism (5), and the lifting assembly is used to lift up the tray (12) when the tray (12) moves to the bottom of the glue dispensing mechanism (3) and the eutectic mechanism (5).

3. A semiconductor chip mounter with dual functions of eutectic and dispensing according to claim 2, characterized in that: The lifting assembly comprises two hinged rods (64) whose middle parts are hinged on the frame, and the middle parts of the two hinged rods (64) are hinged on the same second rotating shaft (65), and the second rotating shaft (65) is rotatably mounted on the frame; the lifting plate (63) is provided with a sliding groove (66), one end of the two hinged rods (64) is slidably mounted on the sliding groove (66), and the other end is rollingly connected to two cams (67) fixedly mounted on the third rotating shaft (68); the third rotating shaft (68) is horizontally arranged and key-connected to the frame; the third rotating shaft (68) has There are two states, a1 and a2: a1: the cam (67) located below the dispensing mechanism (3) is rollingly connected to the hinged rod (64), and the cam (67) located below the eutectic mechanism (5) is not connected to the hinged rod (64); a2: the cam (67) located below the dispensing mechanism (3) is not connected to the hinged rod (64), and the cam (67) located below the eutectic mechanism (5) is rollingly connected to the hinged rod (64); a switching component is fixedly mounted on the third rotating shaft (68), and the switching component is used to control the third rotating shaft (68) to switch between a1 and a2.

4. The semiconductor chip mounter with dual functions of eutectic and dispensing according to claim 3, characterized in that: The switching assembly comprises a switching block (71) fixedly mounted on the third rotating shaft (68); two limit plates (72) are fixedly mounted on the frame; the limit plates (72) are located on two horizontal sides of the switching block (71); the limit plates (72) are used to limit the horizontal movement of the switching block (71); wedge surfaces are provided at both ends of the switching block (71); a switching column (73) is vertically arranged below the third rotating shaft (68); the switching column (73) is vertically slidably mounted on the frame; a spring is arranged between the switching column (73) and the frame.

5. The semiconductor chip mounter with dual functions of eutectic and dispensing according to claim 4, characterized in that: The invention comprises a first gear (75) fixedly mounted on a first rotating shaft (11), the first gear (75) meshing with an incomplete gear (76) arranged beside the first gear (75), the gear ratio of the incomplete gear (76) to the first gear (75) being 1:4; the incomplete gear (76) fixedly mounted on a fourth rotating shaft (77), the fourth rotating shaft (77) rotatably mounted on a frame, the fourth rotating shaft (77) being externally connected to a power source, and the fourth rotating shaft (77) being synchronously driven and connected with the third rotating shaft (68) via a synchronous belt (78).

6. The semiconductor chip mounter with dual functions of eutectic and dispensing according to claim 5, characterized in that: A stirring column (81) is key-connected and installed on the outer edge of the extrusion plate (32); a first synchronous wheel (82) is key-connected and installed on the extrusion column (33); a fifth rotating shaft (83) is rotatably installed on the working disk (1); a second synchronous wheel (84) synchronously connected to the first synchronous wheel (82) is fixedly installed on the fifth rotating shaft (83); a second gear (85) is fixedly installed on the fifth rotating shaft (83); a third gear (86) is fixedly installed on the first rotating shaft (11); and the second gear (85) is meshed with the third gear (86).

7. The semiconductor chip mounter with dual functions of eutectic and dispensing according to claim 6, characterized in that: A driving ring (91) is fixedly mounted on the extrusion column (33), and a wedge surface is formed on the outer peripheral edge of the driving ring (91). A driving column (92) is vertically slidably mounted on the working disk (1), and the driving column (92) is located below the dispensing mechanism (3). A driving rod (93) is also horizontally slidably mounted on the working disk (1). When the driving column (92) moves vertically upward, it drives the driving rod (93) to move horizontally through the wedge surface. When the driving rod (93) moves horizontally, it drives the driving ring (91) to move vertically downward through the wedge surface.

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