A multi-silicon wafer positioning mechanism

Abstract

A multi-silicon wafer positioning mechanism relates to the field of solar cell positioning. The multi-silicon wafer positioning mechanism includes a support plate for silicon wafers, at least one longitudinal positioning mechanism and at least one transverse positioning mechanism; the longitudinal positioning mechanism includes a longitudinal end fixing block arranged at intervals along the length direction of the support plate, at least one longitudinal slider and a longitudinal end slider, the longitudinal end fixing block and the longitudinal end slider are respectively connected with at least one first swing pin, the longitudinal slider is connected with at least two first swing pins, and when the longitudinal slider and the longitudinal end slider move, the first swing pins are respectively pressed against the ends of at least two silicon wafers arranged at intervals along the length direction of the support plate; the transverse positioning mechanism includes at least one transverse positioning plate that can move along the width direction of the support plate to push the side of the silicon wafer. The multi-silicon wafer positioning mechanism provided by the present application can quickly and efficiently position one or two rows of silicon wafers.

Description

Technical Field

[0001] The present application relates to the field of solar cell positioning, and in particular to a multi-silicon wafer positioning mechanism. Background Art

[0002] In the production of photovoltaic modules using multi-busbar technology, silicon wafer halves are often used as the main component, and the busbar references between the halves are required to be consistent.

[0003] At present, cameras are generally used in conjunction with XYθ adjustment platforms to ensure that the gate lines of half wafers are aligned. A camera is required between every two half wafers, and an XYθ adjustment platform is required under each half wafer. When the gate lines of multiple half wafers need to be positioned and aligned at one time, the cost increases greatly. Another half-wafer alignment method is to achieve the positioning effect by moving the silicon wafer to the edge in two directions. The positioning accuracy of this method is relatively low. Summary of the invention

[0004] The purpose of the present application is to provide a multi-silicon wafer positioning mechanism, which can quickly and efficiently position pairs of silicon wafers, has a simple and reliable structure and is low in cost.

[0005] The embodiment of the present application is implemented as follows:

[0006] The embodiment of the present application provides a multi-silicon wafer positioning mechanism, which includes a support plate for supporting silicon wafers, at least one longitudinal positioning mechanism and at least one lateral positioning mechanism;

[0007] The longitudinal positioning mechanism comprises a longitudinal moving assembly and a longitudinal end fixing block arranged at intervals along the length direction of the support plate, at least one longitudinal slider and a longitudinal end slider, the longitudinal moving assembly is used to drive the longitudinal slider and the longitudinal end slider to move along the length direction of the support plate, the longitudinal end fixing block and the longitudinal end slider are respectively connected with at least one first swing pin, the longitudinal slider is respectively connected with at least two first swing pins arranged at intervals along the width direction of the support plate, the tops of the first swing pins are respectively swingably extended to the top of the support plate, when the longitudinal slider and the longitudinal end slider move along the length direction of the support plate, the corresponding first swing pins are respectively pressed against the ends of the silicon wafers arranged at intervals along the length direction of the support plate; the tops of the longitudinal slider and the longitudinal end fixing block are respectively connected with limiting blocks, the support plate is respectively provided with limiting holes for each limiting block to pass through, the limiting holes are used to limit the range of movement of the limiting blocks along the length direction of the support plate;

[0008] The lateral positioning mechanism includes at least one lateral positioning plate, which is configured to be movable to push the side of the silicon wafer to move along the width direction of the support plate.

[0009] In some optional embodiments, the longitudinal end fixing block and the longitudinal end slider are respectively connected to at least two first swing pins arranged at intervals along the width direction of the support plate, and the longitudinal slider is respectively connected to at least four first swing pins arranged at intervals along the width direction of the support plate.

[0010] In some optional embodiments, at least one of the longitudinal end fixing block, the longitudinal slider and the longitudinal end slider is connected to a first adjusting screw corresponding to the first pendulum needle one by one, and the first adjusting screw is sleeved with a first spring that presses against the corresponding first pendulum needle, and the first spring is used to push the corresponding first pendulum needle to swing and press against the silicon wafer.

[0011] In some optional embodiments, two adjacent first swing pins on the same longitudinal slider are staggered along the length direction of the support plate.

[0012] In some optional embodiments, the longitudinal moving assembly includes a guide rail fixed to the support plate, a driving shaft arranged parallel to the guide rail, and a driving cylinder for driving the driving shaft to move along the length direction of the support plate. The longitudinal end slider is connected to the driving shaft and slidably connected to the guide rail. The longitudinal slider is slidably connected to the guide rail and the driving shaft. The driving shaft is also provided with at least one pair of fixing rings corresponding to the longitudinal sliders one by one, and the pair of fixing rings are respectively arranged on both sides of the corresponding longitudinal sliders; the driving shaft is also provided with a third spring corresponding to the longitudinal sliders one by one, one end of the third spring presses against the corresponding longitudinal slider, and the other end presses against a corresponding fixing ring away from the longitudinal end fixing block; the limiting length of each limiting hole gradually increases as it moves away from the longitudinal end fixing block.

[0013] In some optional embodiments, a release mechanism is further included, wherein the release mechanism is used to drive each first pendulum needle pressing against the end of the silicon wafer to stop pressing against the silicon wafer, the release mechanism includes at least one rotating shaft, a release motor for driving the rotating shaft to rotate, and a plurality of pendulum blocks sleeved on the rotating shaft, the pendulum blocks correspond one-to-one to the first pendulum needles and are provided with angled bosses, and when the pendulum blocks rotate with the rotating shaft, the angled bosses push the corresponding first pendulum needles to continue swinging to stop pressing against the silicon wafer.

[0014] In some optional embodiments, the lateral positioning mechanism also includes at least one group of intermediate positioning blocks provided on the top of the support plate, each group of intermediate positioning blocks is arranged at intervals along the length direction of the support plate, and the lateral positioning plate is configured to push one side of the silicon wafer to move along the width direction of the support plate when moving, and to press a group of intermediate positioning blocks against the other side of the silicon wafer.

[0015] In some optional embodiments, the lateral positioning mechanism includes two lateral positioning plates, which are configured to move toward each other to press against the opposite sides of at least one pair of silicon wafers, and to enable a group of intermediate positioning blocks to press against the adjacent sides of at least one pair of silicon wafers.

[0016] In some optional embodiments, the transverse positioning plate is connected to at least two second pendulum pins arranged at intervals along the length direction of the support plate, and the top of the second pendulum pins can be swung to extend above the support plate; when the transverse positioning plate moves along the width direction of the support plate, the corresponding second pendulum pin presses against one side of the silicon wafer.

[0017] In some optional embodiments, the transverse positioning plate is connected to a second adjusting screw corresponding one-to-one to the second swing needle, and the second adjusting screw is sleeved with a second spring for pressing the corresponding second swing needle.

[0018] The beneficial effects of the present application are as follows: the multi-silicon wafer positioning mechanism provided by the present application includes a support plate for supporting silicon wafers, at least one longitudinal positioning mechanism and at least one transverse positioning mechanism; the longitudinal positioning mechanism includes a longitudinal moving assembly and a longitudinal end fixing block arranged at intervals along the length direction of the support plate, at least one longitudinal slider and a longitudinal end slider, the longitudinal moving assembly is used to drive the longitudinal slider and the longitudinal end slider to move along the length direction of the support plate, the longitudinal end fixing block and the longitudinal end slider are respectively connected with at least one first swing pin, the longitudinal slider is respectively connected with at least two first swing pins arranged at intervals along the width direction of the support plate, the tops of the first swing pins are respectively swingably extended to the top of the support plate, when the longitudinal slider and the longitudinal end slider move along the length direction of the support plate, the corresponding first swing pins are respectively swing-pressed against the ends of the silicon wafers arranged at intervals along the length direction of the support plate; the tops of the longitudinal slider and the longitudinal end fixing block are respectively connected with limit blocks, the support plate is respectively provided with limit holes for each limit block to pass through, the limit holes are used to limit the range of movement of the limit blocks along the length direction of the support plate; the transverse positioning mechanism includes at least one transverse positioning plate, the transverse positioning plate is configured to be movable to push the side of the silicon wafer to move along the width direction of the support plate. The multi-silicon wafer positioning mechanism provided in the embodiment of the present application can quickly and efficiently position pairs of silicon wafers. Fewer components are required in the mechanism, and the actions required for positioning are few and simple. It has the advantages of low debugging workload, fast response time, and easy maintenance. Compared with the camera combined with the XYθ adjustment platform method, it can greatly reduce costs, and the low-cost advantage will be further expanded as the number of positioned silicon wafers increases. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 A schematic diagram of the structure of a multi-silicon wafer positioning mechanism provided in an embodiment of the present application;

[0021] Figure 2 A schematic diagram of the structure of the multi-silicon wafer positioning mechanism provided in an embodiment of the present application when the support plate is omitted;

[0022] Figure 3 A schematic diagram of the partial structure of a longitudinal positioning mechanism in a multi-silicon wafer positioning mechanism provided in an embodiment of the present application;

[0023] Figure 4 for Figure 3 A schematic diagram of a local enlarged structure;

[0024] Figure 5 A schematic diagram of the partial structure of the rotating shaft and the swing block of the release mechanism and the corresponding first swing needle in the multi-silicon wafer positioning mechanism provided in an embodiment of the present application;

[0025] Figure 6 A schematic diagram of the structure of the connection between the first positioning head, the first swing pin and the first adjusting screw in the multi-silicon wafer positioning mechanism provided in an embodiment of the present application;

[0026] Figure 7 A schematic cross-sectional structure diagram of the connection between the first positioning head, the first swing needle and the first adjustment screw in the multi-silicon wafer positioning mechanism provided in an embodiment of the present application.

[0027] In the figure: 100, support plate; 110, first opening; 120, limit hole; 130, second opening; 140, turn pin; 150, elastic stop point; 200, longitudinal positioning mechanism; 210, longitudinal end fixing block; 220, longitudinal slider; 230, longitudinal end slider; 240, first positioning head; 250, first swing needle; 260, first adjusting screw; 270, first spring; 280, limit block; 290, longitudinal moving assembly; 291 , guide rail; 292, drive shaft; 293, drive cylinder; 294, fixing ring; 295, third spring; 300, lateral positioning mechanism; 310, lateral positioning plate; 320, intermediate positioning block; 330, second positioning head; 340, second pendulum needle; 350, second adjusting screw; 360, slide cylinder; 400, release mechanism; 410, rotating shaft; 420, release motor; 430, pendulum block; 440, angled boss; 500, silicon wafer. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0029] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0030] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0031] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the product of the application is usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0032] In addition, the terms "horizontal", "vertical", "overhanging" and the like do not mean that the components are required to be absolutely horizontal or overhanging, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0033] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0034] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0035] The characteristics and performance of the multi-silicon wafer positioning mechanism of the present application are further described in detail below in conjunction with the embodiments.

[0036] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7 As shown, the embodiment of the present application provides a multi-silicon wafer positioning mechanism, which includes a support plate 100 for supporting silicon wafers, a longitudinal positioning mechanism 200 and a corresponding transverse positioning mechanism 300 provided below the support plate 100, for positioning one or two rows of silicon wafers 500;

[0037] In other optional embodiments, the multi-silicon wafer positioning mechanism may also include more than two longitudinal positioning mechanisms 200 and more than two transverse positioning mechanisms 300. Each longitudinal positioning mechanism 200 may be arranged sequentially along the length direction or width direction of the support plate 100, or may be arranged according to other plans. Each longitudinal positioning mechanism 200 and its corresponding transverse positioning mechanism 300 may be used to position one or two rows of silicon wafers 500.

[0038] In the multi-silicon wafer positioning mechanism provided in this embodiment, the longitudinal positioning mechanism 200 includes a longitudinal end fixing block 210 arranged at intervals along the length direction of the support plate 100, two longitudinal sliders 220 (two longitudinal sliders 220 are shown as an example in the accompanying drawings, and in other optional embodiments, the number of longitudinal sliders 220 can also be one or more) and a longitudinal end slider 230, and a longitudinal moving component 290 for driving each longitudinal slider 220 and the longitudinal end slider 230 to move along the length direction of the support plate 100; in other optional embodiments, the longitudinal positioning mechanism 200 can also include longitudinal end fixing blocks 210 arranged at intervals along the length direction of the support plate 100, more than one longitudinal slider 220 and longitudinal end slider 230, wherein the number of longitudinal sliders 220 corresponds to the number of each row of silicon wafers 500 positioned, and when the number of longitudinal sliders 220 is one or more, a row or two rows of silicon wafers containing two or two silicon wafers 500 can be positioned.

[0039] In some optional embodiments, the longitudinal end fixing block 210 and the longitudinal end slider 230 are respectively connected to at least one first swing pin 250, and the longitudinal slider 220 is respectively connected to at least two first swing pins 250 arranged at intervals along the width direction of the support plate 100, and the tops of the first swing pins 250 can be swingably extended to the top of the support plate 100. When the longitudinal slider 220 and the longitudinal end slider 230 move along the length direction of the support plate 100, the corresponding first swing pins 250 are respectively pressed against the ends of the silicon wafer 500 arranged at intervals along the length direction of the support plate 100; the tops of the longitudinal slider 220 and the longitudinal end fixing block 210 are respectively connected to the limiting blocks 280, and the support plate 100 is respectively provided with limiting holes 120 for each limiting block 280 to pass through, and the limiting holes 120 are used to limit the range of movement of the limiting blocks 280 along the length direction of the support plate 100.

[0040] In some optional embodiments, the lateral positioning mechanism 300 includes at least one lateral positioning plate 310, which is configured to be movable to push the side of the silicon wafer 500 to move along the width direction of the support plate 100. The lateral positioning of the silicon wafer 500 only requires a pushing portion such as a lateral positioning plate to push the silicon wafer 500 to move horizontally, and then another blocking portion is provided to limit the limit point of the movement of the silicon wafer or another movable pushing portion is provided to push the silicon wafer 500 in the opposite direction to achieve lateral positioning. This lateral positioning mechanism 300 can adopt both existing technologies and the specific embodiments listed below.

[0041] Through the multi-silicon wafer positioning mechanism proposed in this application, multiple silicon wafers 500 can be positioned at one time, and the positioning reference is not affected by the deviation of the outer dimensions of the silicon wafer 500. Fewer components are required in the mechanism, fewer and simpler actions are required for positioning, lower debugging workload, faster response time, and easier maintenance. Compared with the camera combined with the XYθ adjustment platform method, the cost is greatly reduced, and this advantage will be further expanded as the number of silicon wafers to be positioned increases.

[0042] Among them, when the multi-wafer positioning mechanism positions a row of silicon wafers 500, the longitudinal end fixing block 210 and the longitudinal end slider 230 are respectively connected to a first swing pin 250, and the longitudinal slider 220 is respectively connected to two first swing pins 250 arranged at intervals along the width direction of the support plate 100. When the multi-wafer positioning mechanism positions two rows of silicon wafers 500, the longitudinal end fixing block 210 and the longitudinal end slider 230 are respectively connected to two first swing pins 250 arranged at intervals along the width direction of the support plate 100, and the longitudinal slider 220 is respectively connected to four first swing pins 250 arranged at intervals along the width direction of the support plate 100. If the multi-wafer positioning mechanism positions more than two rows of silicon wafers 500, the number of first swing pins 250 is greater.

[0043] Taking the multi-silicon wafer positioning mechanism in this embodiment as an example to simultaneously position two rows of silicon wafers 500 (each row includes 3 silicon wafers 500), the longitudinal end fixing blocks 210 and the longitudinal end sliders 230 located at both ends of the support plate 100 are respectively connected to two first positioning heads 240 arranged at intervals along the width direction of the support plate 100, and the two longitudinal sliders 220 located in the middle of the support plate 100 are respectively connected to four first positioning heads 240 arranged at intervals along the width direction of the support plate 100; the top of each first pendulum needle 250 respectively penetrates the top surface of the corresponding first positioning head 240 and extends to the top of the support plate 100; when the longitudinal slider 220 and the longitudinal end slider 230 move along the length direction of the support plate 100, the top of each first pendulum needle 250 is pressed against one end of the silicon wafer 500 arranged at intervals along the length direction of the support plate 100; at least one first positioning head 240 ( That is, at least one of the longitudinal end fixing block 210, the longitudinal slider 220 and the longitudinal end slider 230 is respectively connected with a first adjusting screw 260 corresponding to the first swing pin 250, and the first adjusting screw 260 is sleeved with a first spring 270 that presses against the corresponding first swing pin 250. The first spring 270 is used to push the corresponding first swing pin 250 to swing against the silicon wafer 500. Due to the provision of the first spring 270, the possibility of the silicon wafer 500 being broken due to the hard contact between the silicon wafer 500 and the first swing pin 250 can be reduced when the multi-silicon wafer is positioned; each first positioning head 240 is respectively connected to a first swing pin 250 that can swing along a vertical plane through a rotating pin 140, and the axis of the rotating pin 140 connected to each first positioning head 240 extends along the width direction of the support plate 100; the support plate 100 is respectively provided with eight first openings 110 for the first swing pin 250 to pass through and move.

[0044] Among them, when the first adjusting screw 260 and the first spring 270 are connected to some of the first positioning heads 240 in the longitudinal end fixing block 210, the longitudinal slider 220 and the longitudinal end slider 230, for example, when one of the two ends of each silicon wafer 500 has a first adjusting screw 260 and a first spring 270, the possibility of breakage caused by hard contact between the silicon wafer 500 and the first pendulum needle 250 can be prevented.

[0045] In other optional embodiments, the number of first pendulum pins 250 that can swing along the vertical plane connected to the longitudinal end fixing block 210 and the longitudinal end slider 230 can be one or more, and the number of first pendulum pins 250 that can swing along the vertical plane connected to the longitudinal slider 220 can be two or more. Among them, when the first adjustment screws 260 and the first springs 270 are connected to all the first positioning heads 240 in the longitudinal end fixing block 210, the longitudinal slider 220 and the longitudinal end slider 230, the positioning of multiple silicon wafers 500 based on their centers can be achieved at the same time.

[0046] Furthermore, when multiple silicon wafers 500 are positioned simultaneously with the center of the silicon wafer 500 as a reference, the two adjacent first positioning heads 240 on the same longitudinal slider 220 are staggered along the length direction of the support plate 100, which can ensure that when each longitudinal slider 220 moves, the two adjacent first swing pins 250 connected thereto respectively swing against the ends of the silicon wafers 500 spaced apart in the length direction of the two support plates 100 without interfering with each other, thereby ensuring positioning accuracy.

[0047] Furthermore, in order to ensure the positioning effect, the first pendulum needles 250 at both ends of the same silicon wafer 500 are located on the same straight line extending along the length direction to ensure the positioning accuracy of the first pendulum needle 250 connected to the first positioning head 240 located on the same straight line when the longitudinal slider 220 and the longitudinal end slider 230 move and when they swing and press against the end of the silicon wafer 500.

[0048] Further, among them, Figure 2 The first swing pin 250 of the longitudinal end slider 230 in the first row and the first swing pin 250 on the adjacent longitudinal slider 220 that is collinear with it position the first silicon wafer 500 in the first row; another first swing pin 250 on the longitudinal slider 220 close to the longitudinal end slider 230 and the first swing pin 250 on the adjacent longitudinal slider 220 (close to the longitudinal end fixing block 210) that is collinear with it position the second silicon wafer 500; the remaining first swing pin 250 of the longitudinal slider 220 close to the longitudinal end fixing block 210 and the first swing pin 250 on the longitudinal end fixing block 210 in the first row position the third silicon wafer 500. This arrangement can save space.

[0049] In this embodiment, the longitudinal moving assembly 290 includes a guide rail 291 fixed to the bottom surface of the support plate 100, a drive shaft 292 arranged parallel to the guide rail 291, and a drive cylinder 293 for pushing the drive shaft 292 to move along the length direction of the support plate 100. The guide rail 291 and the drive shaft 292 both extend along the length direction of the support plate 100. The longitudinal end slider 230 is slidably connected to the guide rail 291 and fixedly connected to the drive shaft 292. The two longitudinal sliders 220 are respectively slidably connected to the guide rail 291 and are slidably sleeved. On the driving shaft 292, a pair of fixing rings 294 corresponding to the longitudinal end slider 230 and two pairs of fixing rings 294 corresponding to the longitudinal slider 220 are also provided on the driving shaft 292. The pair of fixing rings 294 corresponding to the longitudinal end slider 230 are located on both sides thereof. The driving shaft 292 is also respectively provided with two third springs 295 corresponding to the longitudinal slider 220. One end of the third spring 295 presses against the corresponding longitudinal slider 220, and the other end presses against the corresponding fixing ring 294 away from the longitudinal end fixing block 210.

[0050] The limiting holes 120 extend along the length direction of the support plate 100 to limit the movement range of the limiting block 280 along the length direction of the support plate 100 , and the limiting length of each limiting hole 120 gradually increases as it moves away from the longitudinal end fixing block 210 .

[0051] In order to make the distance between each silicon wafer 500 the required distance (not the distance between the silicon wafers 500 when they are initially placed, but smaller than the distance when the silicon wafers 500 are placed) after each silicon wafer 500 is positioned, the length of the limiting hole 120 is designed to change gradually. Furthermore, in order to make the longitudinal slider 220 and the longitudinal end slider 230 move synchronously in the limiting holes 120 of different lengths, a pair of fixing rings 294 and a third spring 295 are provided on the driving shaft 292 for use in conjunction. The function of the third spring 295 is to make the limiting block 280 on a certain longitudinal slider 220 unable to move further when the limiting hole 120 reaches the limit position, while the driving shaft 292 can still continue to push other longitudinal sliders 220 to move.

[0052] Furthermore, in order to facilitate the removal of the silicon wafer 500 after the positioning of the silicon wafer 500 is completed, the first pendulum needle 250 can be further opened. The multi-silicon wafer positioning mechanism provided in this embodiment also includes a release mechanism 400. The release mechanism 400 is used to drive the first pendulum needles 250 that swing and press the ends of the silicon wafer 500 to rotate to stop pressing the silicon wafer 500. The release mechanism 400 includes two rotating shafts 410, two release motors 420 respectively used to drive the two rotating shafts 410 to rotate, and sixteen pendulum blocks 430 corresponding to the first pendulum needles 250. Eight pendulum blocks 430 are fixedly sleeved on each rotating shaft 410. The top of the pendulum block 430 has an angled boss 440. When each pendulum block 430 rotates with the rotating shaft 410, it pushes the corresponding first pendulum needle 250 to swing through the angled boss 440, so that the corresponding first pendulum needle 250 continues to swing and further open to stop pressing the end of the silicon wafer 500.

[0053] When multiple silicon wafers 500 are positioned with their centers as reference, each first positioning head 240 is provided with a first adjusting screw 260 and a first spring 270, and at the end of positioning, the first pendulum pins 250 at both ends of the same silicon wafer 500 swing in opposite directions, so that all the first pendulum pins 250 can be further opened at the same time after the rotation shaft 410 rotates, such as Figure 5 As shown, the angled bosses 440 on the adjacent swing blocks 430 corresponding to the same longitudinal slider 220 for positioning the same row of silicon wafers 500 are arranged opposite to each other.

[0054] The lateral positioning mechanism 300 also includes at least one group of intermediate positioning blocks 320 disposed on the top of the support plate 100, and each group of intermediate positioning blocks 320 are arranged at intervals along the length direction of the support plate 100. The lateral positioning plate 310 is configured to push one side of the silicon wafer 500 to move along the width direction of the support plate 100 when moving, and to make a group of intermediate positioning blocks 320 press against the other side of the silicon wafer. In this embodiment, the lateral positioning mechanism 300 includes a group of six intermediate positioning blocks 320 disposed on the top of the support plate 100; wherein the intermediate positioning blocks 320 can be fixed stop points or fixed stop blocks in various forms, and their purpose is to limit the lateral positioning of the silicon wafer 500. Only one group of intermediate positioning blocks 320 is needed to realize the positioning of two rows of silicon wafers 500. This structure is compact and can also meet the positioning requirements.

[0055] Furthermore, the transverse positioning mechanism 300 includes two transverse positioning plates 310 symmetrically arranged on both sides of the longitudinal positioning mechanism 200, six intermediate positioning blocks 320, and a transverse moving assembly for driving the two transverse positioning plates 310 to move toward or away from each other, and the transverse moving assembly is a slide cylinder 360; the six intermediate positioning blocks 320 are arranged on the top surface of the support plate 100 and are arranged at intervals along the length direction of the support plate 100, and every two intermediate positioning blocks 320 are used to block and position the adjacent side of a pair of silicon wafers 500 arranged at intervals along the support plate 100. When positioning two rows of silicon wafers 500, two transverse positioning plates 310 are required to respectively position the opposite sides of the two rows of silicon wafers 500 transversely.

[0056] Furthermore, each lateral positioning plate 310 is respectively provided with six second positioning heads 330 arranged at intervals along the length direction of the support plate 100, and each second positioning head 330 is connected to a swingable second pendulum pin 340 through a rotating pin, and the top of the second pendulum pin 340 penetrates and extends to the top of the support plate 100; when the two lateral positioning plates 310 move toward each other, the top of the corresponding second pendulum pin 340 swings to press against the opposite side of a pair of silicon wafers 500, and pushes the silicon wafer 500 so that each two middle positioning blocks 320 respectively press against the adjacent side of a pair of silicon wafers 500; wherein, the second pendulum pin 340 is a pushing component, which can push the silicon wafer 500 to move and position. The second positioning head 330 is connected to a second adjusting screw 350 corresponding to the second pendulum pin 340, and the second adjusting screw 350 is sleeved with a second spring pressing against the corresponding second pendulum pin 340. Since the width of each silicon wafer 500 cannot be guaranteed to be the same, the second adjusting screw 350 is sleeved with a second spring pressing against the corresponding second pendulum pin 340 to ensure that the second pendulum pin 340 swings to adapt to silicon wafers 500 of different sizes and moves along the width direction for positioning, so as to prevent the situation where one of the second pendulum pins 340 contacts the silicon wafer 500 while the other silicon wafers 500 have not yet contacted the second pendulum pin 340, and then continues to push the second pendulum pin 340, so that the second pendulum pin 340 that has already contacted the silicon wafer 500 hard squeezes the silicon wafer 500 to damage the silicon wafer 500; the axis of the rotating pin connected to each second positioning head 330 extends along the length direction of the support plate 100, and the support plate 100 is respectively provided with twelve second openings 130 for the second pendulum pins 340 to pass through and move.

[0057] In other optional embodiments, the number of second swing pins 340 that can swing along the vertical plane connected to the transverse positioning plate 310 can also be one or more, as long as at least one second swing pin 340 is provided on each side to press against the two sides of the pair of silicon wafers 500 that need to be positioned. Preferably, at least two second swing pins 340 are provided on each side between the longitudinal end fixing block 210 and the longitudinal slider 220 and between two adjacent longitudinal sliders 220 to press against the two sides of the pair of silicon wafers 500 that need to be positioned.

[0058] In this embodiment, the structures of the first positioning head 240, the first pendulum needle 250, the first adjusting screw 260 and the first spring 270 are basically the same as the structures of the second positioning head 330, the second pendulum needle 340, the second adjusting screw 350 and the second spring. The only difference is that when the first pendulum needle 250 swings along the vertical plane, it presses against the end of the silicon wafer 500 supported by the support plate 100, and when the second pendulum needle 340 swings along the vertical plane, it presses against the side of the silicon wafer 500 supported by the support plate 100.

[0059] In other optional embodiments, the number of intermediate positioning blocks 320 provided in the middle part of the top surface of the support plate 100 can also be two or more, and they are arranged one-to-one with the longitudinal positioning mechanism 200; in other optional embodiments, the number of intermediate positioning blocks 320 contained in each intermediate positioning block 320 can also be one, two or more, and it is only necessary to ensure that the adjacent side of a pair of silicon wafers 500 arranged laterally at intervals along the support plate 100 has at least one intermediate positioning block 320 for blocking and positioning; preferably, the adjacent side of a pair of silicon wafers 500 arranged laterally at intervals along the support plate 100 has two or more intermediate positioning blocks 320 for blocking and positioning.

[0060] In this embodiment, the tops of the first swing pin 250 and the second swing pin 340 are provided with elastic stop points 150 for convenient pressing and positioning. In other optional embodiments, the elastic stop points 150 may not be provided.

[0061] The multi-silicon wafer positioning mechanism provided in the embodiment of the present application is used to simultaneously perform positioning operations on two rows of six silicon wafers, i.e., three pairs of silicon wafers 500. The specific operating principle is as follows:

[0062] Three pairs (a total of 6 pieces) of silicon wafers 500 are placed in two rows and three columns on the support plate 100 for support, and a pair of silicon wafers 500 is arranged between the longitudinal end fixing block 210 and the longitudinal slider 220, between two adjacent longitudinal sliders 220, and between the longitudinal slider 220 and the longitudinal end slider 230, and each pair of silicon wafers 500 is arranged on both sides of a group of middle positioning blocks 320 on the top surface of the support plate 100, so as to perform positioning operation;

[0063] When the positioning operation is in progress, the longitudinal moving assembly 290 is first used to drive the longitudinal end slider 230 and the two longitudinal sliders 220 to move toward the longitudinal end fixing block 210, so that the longitudinal end fixing block 210, the two longitudinal sliders 220 and the first swing pin 250 that can swing along the vertical plane connected to the longitudinal end slider 230 are used to swing and press the two ends of each silicon wafer 500 for positioning. Specifically, the cylinder rod of the control driving cylinder 293 is extended to push the driving shaft 292 to move along the length direction of the support plate 100 toward the longitudinal end fixing block 210. When the driving shaft 292 moves, the corresponding third spring 295 is pushed to move through the connected fixing ring 294, and then the longitudinal end slider 230 and the two longitudinal sliders 220 are pushed to move along the length direction of the support plate 100 toward the longitudinal end fixing block 210 through the third spring 295, so that the longitudinal end slider 230 and the first swing pin 250 connected to the first positioning head 240 on the two longitudinal sliders 220 are swung to press the end of the silicon wafer 500 and push the silicon wafer 500 moves toward the longitudinal end fixing block 210 until the longitudinal end slider 230 and the limit blocks 280 connected to the tops of the two longitudinal sliders 220 respectively move to the end points along the corresponding limit holes 120 opened on the support plate 100. At this time, the longitudinal end fixing block 210, the two longitudinal sliders 220 and the first swing pin 250 that can swing along the vertical plane connected to the longitudinal end slider 230 respectively swing and press the two ends of each silicon wafer 500 for positioning, wherein the two first swing pins 250 on the longitudinal end fixing block 210 are respectively pressed against the two ends of each silicon wafer 500 for positioning. One swing pin 250 swings and presses one end of the first pair of silicon wafers 500, and the four first swing pins 250 on the two longitudinal sliders 220 swing and press the two adjacent ends of the first pair of silicon wafers 500 and the second pair of silicon wafers 500 and the two adjacent ends of the second pair of silicon wafers 500 and the third pair of silicon wafers 500, respectively. The two first swing pins 250 respectively arranged on the longitudinal end sliders 230 swing and press one end of the third pair of silicon wafers 500, thereby completing the longitudinal positioning operation of positioning the three pairs of silicon wafers 500 at the center of the silicon wafers 500;

[0064] Then, the slide cylinder 360 of the lateral moving assembly is used to drive the two lateral positioning plates 310 to move toward each other, that is, toward the middle positioning block 320, so that the second swing pins 340 connected to the two lateral positioning plates 310 and capable of swinging along the vertical plane swing and press one side of each silicon wafer 500 for positioning, and a group of middle positioning blocks 320 provided in the middle of the top surface of the support plate 100 press and position the other side of each silicon wafer 500, thereby completing the lateral positioning operation of the three pairs of silicon wafers 500; at this time, the mechanical arm can be used to drive the suction cup to absorb the silicon wafer 500 for movement;

[0065] The release mechanism 400 is used to release the pressing force of each first pendulum needle 250 on the two ends of the silicon wafer 500 for swinging and pressing to position, so as to facilitate the movement of the positioned silicon wafer 500. Specifically, the two release motors 420 are controlled to drive the two corresponding rotating shafts 410 to rotate, thereby driving the pendulum block 430 fixedly mounted on the rotating shaft 410 to rotate, so that when the pendulum block 430 rotates around the axis of the rotating shaft 410, the beveled boss 440 arranged on the top pushes the corresponding first pendulum needle 250 to swing, so that the corresponding first pendulum needle 250 swings and stops pressing the end of the silicon wafer 500, thereby releasing the swinging pressure of the first pendulum needle 250 on the end of the silicon wafer 500, so as to facilitate the operator to move the positioned silicon wafer 500.

[0066] The silicon wafer 500 described in this embodiment may be a silicon wafer or a half silicon wafer.

[0067] The multi-silicon wafer positioning mechanism provided by the present application uses a mechanical positioning method to achieve simultaneous positioning of multiple silicon wafers 500 at one time, which can effectively reduce costs. Fewer components are required in the mechanism, fewer and simpler actions are required for positioning, lower debugging workload, faster response time, and easier maintenance. Compared with the camera combined with the XYθ adjustment platform method, the cost is greatly reduced, and this advantage will be further expanded as the number of positioned silicon wafers increases.

[0068] At the same time, by setting the adjusting screw and spring corresponding to each pendulum needle, the positioning reference can be the center of the silicon wafer.

[0069] In addition, during positioning, because the limiting holes with gradually changing sizes are set, and because the spacing between silicon wafers can be guaranteed by the size of the limiting holes, not only can the spacing between two adjacent silicon wafer halves be reduced, but also the spacing between silicon wafers after final positioning can be made to be the required distance, which is especially suitable for scenes with small spacing. During longitudinal positioning, the pendulum pins on both sides of the silicon wafer are equipped with springs for clamping and positioning at the same time, so the positioning reference is not affected by the deviation of the external dimensions of the silicon wafer.

[0070] The embodiments described above are part of the embodiments of the present application, rather than all of the embodiments. The detailed description of the embodiments of the present application is not intended to limit the scope of the present application for protection, but merely represents the selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present application.

Claims

1. A multi-silicon wafer positioning mechanism, characterized in that: It includes a support plate for supporting a silicon wafer, at least one longitudinal positioning mechanism and at least one transverse positioning mechanism; The longitudinal positioning mechanism comprises a longitudinal moving assembly and a longitudinal end fixing block arranged at intervals along the length direction of the support plate, at least one longitudinal slider and a longitudinal end slider, the longitudinal moving assembly is used to drive the longitudinal slider and the longitudinal end slider to move along the length direction of the support plate, the longitudinal end fixing block and the longitudinal end slider are respectively connected with at least one first swing pin, the longitudinal slider is respectively connected with at least two first swing pins arranged at intervals along the width direction of the support plate, the tops of the first swing pins are respectively swingably extended to the top of the support plate, when the longitudinal slider and the longitudinal end slider move along the length direction of the support plate, the corresponding first swing pins are respectively pressed against the ends of the silicon wafers arranged at intervals along the length direction of the support plate; the tops of the longitudinal slider and the longitudinal end fixing block are respectively connected with limiting blocks, the support plate is respectively provided with limiting holes for each of the limiting blocks to pass through, the limiting holes are used to limit the range of movement of the limiting blocks along the length direction of the support plate; The lateral positioning mechanism includes at least one lateral positioning plate, and the lateral positioning plate is configured to be movable to push the side of the silicon wafer to move along the width direction of the support plate.

2. The multi-silicon wafer positioning mechanism according to claim 1, characterized in that: The longitudinal end fixing block and the longitudinal end sliding block are respectively connected with at least two of the first swing pins arranged at intervals along the width direction of the support plate, and the longitudinal sliding block is respectively connected with at least four of the first swing pins arranged at intervals along the width direction of the support plate.

3. The multi-silicon wafer positioning mechanism according to claim 1, characterized in that: The longitudinal end fixing block, the longitudinal slider and at least one of the longitudinal end sliders are connected with a first adjusting screw corresponding to the first pendulum needle one by one, and the first adjusting screw is sleeved with a first spring that presses against the corresponding first pendulum needle, and the first spring is used to push the corresponding first pendulum needle to swing and press against the silicon wafer.

4. The multi-silicon wafer positioning mechanism according to claim 1, characterized in that: Two adjacent first swing pins on the same longitudinal sliding block are staggered along the length direction of the supporting plate.

5. The multi-silicon wafer positioning mechanism according to claim 1, characterized in that: The longitudinal moving assembly includes a guide rail fixed to the support plate, a driving shaft arranged parallel to the guide rail, and a driving cylinder for driving the driving shaft to move along the length direction of the support plate, the longitudinal end slider is connected to the driving shaft and slidably connected to the guide rail, the longitudinal slider is slidably connected to the guide rail and the driving shaft, and the driving shaft is also provided with at least one pair of fixing rings corresponding to the longitudinal sliders one by one, and a pair of the fixing rings are respectively arranged on both sides of the corresponding longitudinal sliders; the driving shaft is also provided with a third spring corresponding to the longitudinal sliders one by one, one end of the third spring presses against the corresponding longitudinal slider, and the other end presses against a corresponding fixing ring away from the longitudinal end fixing block; the limiting length of each limiting hole gradually increases as it moves away from the longitudinal end fixing block.

6. The multi-silicon wafer positioning mechanism according to claim 1, characterized in that: It also includes a release mechanism, which is used to drive each of the first pendulum needles pressing against the end of the silicon wafer to stop pressing against the silicon wafer, and the release mechanism includes at least one rotating shaft, a release motor for driving the rotating shaft to rotate, and a plurality of pendulum blocks sleeved on the rotating shaft, the pendulum blocks correspond to the first pendulum needles one by one and are provided with angled bosses, and when the pendulum blocks rotate with the rotating shaft, they push the corresponding first pendulum needles to continue swinging through the angled bosses to stop pressing against the silicon wafer.

7. The multi-silicon wafer positioning mechanism according to claim 1, characterized in that: The lateral positioning mechanism also includes at least one group of intermediate positioning blocks arranged on the top of the support plate, and each group of the intermediate positioning blocks is arranged at intervals along the length direction of the support plate. The lateral positioning plate is configured to push one side of the silicon wafer to move along the width direction of the support plate when moving, and to make a group of the intermediate positioning blocks press against the other side of the silicon wafer.

8. The multi-silicon wafer positioning mechanism according to claim 7, characterized in that: The lateral positioning mechanism includes two lateral positioning plates, which are configured to move toward each other to press against the opposite sides of at least one pair of silicon wafers, and to make a group of intermediate positioning blocks press against the adjacent sides of at least one pair of silicon wafers respectively.

9. The multi-silicon wafer positioning mechanism according to any one of claims 1 to 8, characterized in that: The transverse positioning plate is connected to at least two second pendulum pins arranged at intervals along the length direction of the support plate, and the tops of the second pendulum pins can be swingably extended to above the support plate; when the transverse positioning plate moves along the width direction of the support plate, the corresponding second pendulum pin presses against one side of the silicon wafer.

10. The multi-silicon wafer positioning mechanism according to claim 9, characterized in that: The transverse positioning plate is connected with second adjusting screws corresponding to the second swing pins one by one, and the second adjusting screws are sleeved with second springs pressing against the corresponding second swing pins.

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