Stripping device and method for preparing display panel

Abstract

The present invention provides a stripping device and a method for preparing a display panel, wherein the method for preparing a display panel comprises the following steps: providing a panel to be processed, wherein the panel to be processed comprises a carrier substrate and a flexible display panel arranged on the carrier substrate; performing laser scanning processing on the panel to be processed; performing oscillation processing on the panel to be processed after the laser scanning processing; and separating the carrier substrate and the flexible display panel of the panel to be processed after the oscillation processing. The method for preparing a display panel is simple to operate, and can effectively reduce the stripping point defects occurring during the separation process of the carrier substrate and the flexible display panel, thereby improving the stripping yield of the flexible display panel.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a stripping device and a method for preparing a display panel. Background Art

[0002] At present, most of the flexible device manufacturing processes are to coat a layer of colloid (such as polyimide, PI) on a carrier substrate (such as glass), and then make a flexible display panel on the colloid. Therefore, after the flexible display panel is prepared, it needs to be peeled off from the carrier substrate. There are currently two main peeling methods, one is the mechanical peeling method, and the other is the laser peeling method. Among them, the laser peeling method is more convenient for mass production and is currently more widely used. Its principle is: the panel to be processed is irradiated by a laser generator, and the colloid PI between the flexible display panel and the carrier substrate is carbonized under the action of laser energy, thereby reducing the viscosity between the flexible display panel and the carrier substrate, and then the carrier substrate is removed under the action of external force (such as a suction cup), so that the flexible display panel and the carrier substrate can be peeled off. In the process of peeling, the traditional method is prone to peeling point defects, which in turn affects the quality and service life of the flexible display panel. Therefore, it is urgent to develop a method that can realize the peeling of the carrier substrate on the basis of reducing or avoiding damage to the flexible display panel, so as to improve the peeling yield and improve the quality of the flexible display panel. Summary of the invention

[0003] Based on this, it is necessary to provide a peeling device and a method for preparing a display panel. The method for preparing a display panel is simple to operate and can effectively reduce peeling point defects occurring during the separation process of a carrier substrate and a flexible display panel, thereby improving the peeling yield of the flexible display panel.

[0004] A method for preparing a display panel comprises the following steps:

[0005] Providing a panel to be processed, the panel to be processed comprising a carrier substrate and a flexible display panel arranged on the carrier substrate;

[0006] Performing laser scanning on the panel to be processed;

[0007] Performing an oscillation treatment on the panel to be processed after the laser scanning treatment;

[0008] The carrier substrate of the panel to be processed and the flexible display panel that have been subjected to the oscillation treatment are separated.

[0009] In some embodiments, in the oscillation treatment step, an ultrasonic generator is used to perform the oscillation treatment, and the frequency of the ultrasonic generator is 28 to 40 KHz.

[0010] In some embodiments, in the oscillation treatment step, the panel to be processed is fixed on the peeling platform by vacuum adsorption, and the peeling platform passes through the ultrasonic generator in the first direction at a speed of 30 to 100 mm / s, and when the peeling platform passes through the ultrasonic generator, the distance between the ultrasonic generator and the panel to be processed in the second direction is 3 to 5 mm;

[0011] Wherein, the second direction is a direction perpendicular to the first direction;

[0012] The vacuum degree of the vacuum adsorption is -80KPa to -50KPa.

[0013] In some embodiments, in the step of laser scanning, the laser scanning is performed on the interface between the carrier substrate of the panel to be processed and the flexible display panel using a laser; wherein the frequency of the laser is 300 to 600 Hz, and the energy density of the laser is 180 to 240 mj / cm 2 .

[0014] In some embodiments, the flexible display panel includes a connection layer and a flexible display function layer sequentially stacked on the carrier substrate;

[0015] The connecting layer is a sacrificial layer, and the energy density of the laser radiation is 220-240 mj / cm 2 ;or

[0016] The connecting layer is a polyimide film, and the energy density of the laser radiation is 180-220 mj / cm 2 .

[0017] A stripping device, comprising:

[0018] A peeling platform, the peeling platform is used to fix the panel to be processed, the panel to be processed includes a carrying substrate and a flexible display panel arranged on the carrying substrate;

[0019] A laser generator, the laser generator is used to perform laser scanning processing on the panel to be processed;

[0020] An oscillator, the oscillator is used to oscillate the panel to be processed after the laser scanning process;

[0021] A separation mechanism is used to separate the carrier substrate of the panel to be processed and the flexible display panel after the oscillation treatment.

[0022] In some embodiments, the stripping device further includes a driving mechanism, wherein the driving mechanism is connected to the stripping platform and is used to drive the stripping platform to move along the first direction.

[0023] In some embodiments, the stripping platform is a vacuum adsorption platform.

[0024] In some embodiments, the oscillator is an ultrasonic generator.

[0025] In some embodiments, the driving mechanism is used to drive the stripping platform to pass through the ultrasonic generator along a first direction, and is used to control the stripping platform to pass through the ultrasonic generator so that the distance between the ultrasonic generator and the panel to be processed in a second direction is 3 to 5 mm, and the second direction is a direction perpendicular to the first direction.

[0026] In some embodiments, the separation mechanism includes: a mechanical arm and a suction cup connected to the mechanical arm, the suction cup is used to absorb the supporting substrate, and the supporting substrate and the flexible display panel are separated under the action of the mechanical arm.

[0027] The preparation method of the display panel described above first performs radiation treatment on the panel to be processed, carbonizes the PI between the carrier substrate and the flexible display panel, and then performs an oscillation treatment, using the oscillation to make the carbonized particles perform movements such as pulling, drifting, and sliding, thereby effectively reducing the adhesion between the carrier substrate and the flexible display panel, which is beneficial to the separation of the carrier substrate and the flexible display panel. Therefore, the above method can achieve the separation of the carrier substrate and the flexible display panel without increasing the laser energy, reduce the peeling point defects that occur during the separation of the carrier substrate and the flexible display panel, and thus effectively reduce the damage to the flexible display panel during the peeling process, improve the peeling yield of the flexible display panel, and achieve the purpose of improving the quality of the flexible display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 A flowchart of manufacturing a flexible display panel according to an embodiment of the present invention;

[0029] Figure 2 A diagram of a flexible display panel with a peeling point defect;

[0030] Figure 3 A schematic diagram of an oscillation process according to an embodiment of the present invention;

[0031] Figure 4 A schematic diagram of a stripping device according to an embodiment of the present invention;

[0032] Figure 5This is a schematic diagram of a process in which a platform is moved to an oscillator for oscillation treatment during the process of preparing a flexible display panel using a peeling device according to an embodiment of the present invention.

[0033] Description of reference numerals:

[0034] 10: Stripping equipment;

[0035] 100: Panel to be processed;

[0036] 101: Flexible display panel;

[0037] 102: a carrier substrate;

[0038] 200: laser generator;

[0039] 300: Oscillator;

[0040] 400: Separation mechanism;

[0041] 500: Stripping platform;

[0042] 600: first track;

[0043] 700: Film sticking device. DETAILED DESCRIPTION

[0044] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively below, and preferred embodiments of the present invention are provided. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0045] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0046] See also Figure 1 According to an embodiment of the present invention, a method for manufacturing a display panel is provided, comprising the following steps:

[0047] S110 : providing a panel 100 to be processed, wherein the panel 100 to be processed includes a carrier substrate 102 and a flexible display panel 101 disposed on the carrier substrate 102 .

[0048] It is understandable that the panel 100 to be processed in the present invention refers to a flexible display panel that needs to be peeled off, which can be any flexible display panel in the art, and is not particularly limited here. In addition to the carrier substrate 102 and the flexible display panel 101, it can also include other structural layers acceptable in the art, as long as it does not conflict with the purpose of the invention of the present invention, and is not particularly limited here, and should be understood to be within the scope of protection of the present invention. In some embodiments, the carrier substrate 102 is a glass substrate; in some embodiments, the flexible display panel 101 is an OLED.

[0049] It is understandable that the carrier substrate 102 and the flexible display panel 101 are bonded together by polyimide (PI) 103, and after laser scanning, the viscosity is reduced or even lost. The specific type of PI 103 is not particularly limited here, and it can be any acceptable polyimide in the art.

[0050] S120: performing laser scanning processing on the panel 100 to be processed.

[0051] By performing laser scanning processing on the panel 100 to be processed (such as Figure 1 A laser generator 200 is used for laser scanning processing), so that the PI between the supporting substrate 102 and the flexible display panel 101 is carbonized 103a, and combined with subsequent oscillation processing, the flexible display panel 101 and the supporting substrate 102 can be separated on the basis of reducing the damage to the flexible display panel 101.

[0052] In some embodiments, the laser frequency of the laser scanning is 300-600 Hz. In some embodiments, the scanning speed of the laser scanning satisfies the following formula: radiation speed = (1-overlap rate) * laser frequency * short axis width. In some embodiments, the overlap rate is 50-85%. In some embodiments, the short axis width is 0.25 mm or 0.4 mm.

[0053] In some embodiments, in the step of laser scanning, a laser is used to perform laser scanning on the interface between the carrier substrate of the panel to be processed and the flexible display panel; further, the energy density of the laser scanning is 180 to 240 mj / cm 2 ; Furthermore, the energy density of the laser scanning is 180mj / cm 2 、185mj / cm 2 、190mj / cm 2 、195mj / cm 2 、200mj / cm 2 、205mj / cm 2 、210mj / cm 2 、215mj / cm 2 、220mj / cm2 、225mj / cm 2 、230mj / cm 2 、235mj / cm 2 or 240mj / cm 2 . The technicians of the present invention found in their research that during the laser scanning process, if the laser energy is too low, it will make it difficult to separate the flexible display panel 101 and the carrier substrate 102. If the laser energy is too high, it will cause irreversible damage to the flexible display panel 101. In addition, the PI carbonization is too serious, and a lot of carbon ash is formed, which is not conducive to the subsequent film lamination process. The energy is too large, the energy consumption is also large, and the production cost is high. Therefore, by controlling the laser scanning energy within the above range and combining it with the subsequent oscillation treatment, the above problems can be effectively alleviated or avoided, and the production cost can be reduced on the basis of improving the peeling yield.

[0054] In some embodiments, the flexible display panel includes a connection layer and a flexible display function layer stacked in sequence on a carrier substrate; further, the connection layer is a sacrificial layer, and the energy density of the laser scanning is 220-240 mj / cm 2 When a sacrificial layer is provided between the carrier substrate and the flexible display functional layer, the sacrificial layer can reduce or avoid contact between the laser and the flexible display functional layer, and reduce the probability of damage to the flexible display functional layer. Therefore, the laser radiation energy can be appropriately increased, which is beneficial to the separation of the flexible display panel 101 and the carrier substrate 102. In some embodiments, the sacrificial layer is a metal oxide; further, the thickness of the sacrificial layer is 10 to 30 μm.

[0055] In some embodiments, the connecting layer is a polyimide film, and the energy density of the laser scanning is 180-220 mj / cm 2 When the flexible display panel 101 and the carrier substrate 102 are in direct contact without a sacrificial layer, appropriately reducing the laser energy can effectively reduce the damage to the flexible display panel 101 during the laser irradiation process.

[0056] S130: performing an oscillation process on the panel 100 to be processed after the laser scanning process.

[0057] The technical personnel of the present invention have found in their research that in the process of separating the flexible display panel 101 and the carrier substrate 102, the conventional laser lift-off technology may cause a lift-off point defect (such as Figure 2The specific reasons are as follows: a. When the laser energy is insufficient, the flexible display panel at the point defect position is separated from the carrier substrate, resulting in permanent damage to the devices in this area due to the relatively large adhesion between the flexible display panel and the carrier substrate at this position, that is, the bonding force between the devices is less than the adhesion between the flexible display panel and the carrier substrate; b. The flexible display panel at the peeling point defect position forms a gel due to uneven film forming temperature control during the production process; after the gel is formed, a larger laser energy is required for laser peeling to make it easy to separate from the carrier substrate; c. The polyimide solution during the production of the flexible display panel is not filtered clean, resulting in a gel-like state during film formation or foreign matter at this location during film formation, which also requires greater energy to separate it from the carrier substrate.

[0058] That is to say, the peeling point defect is mainly caused by the fact that the flexible display panel 101 is not easy to separate from the carrier substrate 102 at this position, which causes the device to separate and permanently fail. Therefore, the peeling point defect position can be easily peeled by increasing the energy during laser peeling, but increasing the laser energy will cause the following problems: 1) Increasing the laser energy means that during the laser peeling process, the flexible display panel (such as OLED device) needs to withstand greater heat, and high heat will lead to high temperature. Since the flexible display panel has been film-formed at this time, the high temperature will have a greater impact on the life of the flexible display panel 101, thereby reducing the life of the flexible display panel 101; 2) Increasing the laser energy will make the colloid carbonization between the flexible display panel 101 and the carrier substrate 102 more serious, and the carbon ash formed by carbonization will accumulate more, which is not conducive to subsequent film lamination; 3) Increasing the laser energy will accelerate the consumption of the laser head, and the cost of the laser head is extremely high, increasing the equipment cost.

[0059] Based on this, the technicians of the present invention innovatively perform an oscillation treatment on the panel 100 to be processed after the laser scanning treatment, and use the oscillation to make the carbonized particles perform movements such as pulling, drifting, sliding, etc. (such as Figure 3 As shown), the adhesive force between the flexible display panel 101 and the carrier substrate 102 can be effectively reduced, which is beneficial to the separation of the flexible display panel 101 and the carrier substrate 102. The separation of the flexible display panel 101 and the carrier substrate 102 can be achieved without increasing the laser energy, thereby effectively reducing the damage to the flexible display panel 101 during the peeling process and increasing the service life of the flexible display panel, especially for large-size flexible OLEDs. The effect is particularly significant.

[0060] In some embodiments, in step S130, an ultrasonic generator 300 is used for oscillation processing; further, the frequency of the ultrasonic generator is 28 to 40 KHz; further, the frequency of the ultrasonic generator is 29 KHz, 30 KHz, 31 KHz, 32 KHz, 33 KHz, 34 KHz, 35 KHz, 36 KHz, 37 KHz, 38 KHz, 39 KHz or 40 KHz.

[0061] It is understandable that the ultrasonic generator 300 in step S130 can adopt any existing ultrasonic generator as long as it can achieve the purpose of the invention. For example, an ultrasonic amplifier with different cross-sectional widths inside, after the gas (such as air) enters from the inlet, it is subjected to amplification treatment with multiple different cross-sectional widths, so that the gas expands rapidly at the outlet, thereby emitting ultrasonic waves and realizing the purpose of oscillation.

[0062] In some embodiments, the panel to be processed moves in the first direction at a speed of 30 to 100 mm / s relative to the ultrasonic generator; further, the relative speed is 50 to 100 mm / s; further, the relative speed is 50 mm / s, 55 mm / s, 60 mm / s, 65 mm / s, 70 mm / s, 75 mm / s, 80 mm / s, 85 mm / s, 90 mm / s, 95 mm / s or 100 mm / s.

[0063] In some embodiments, in step S130, the panel to be processed is fixed on the peeling platform by vacuum adsorption, and the peeling platform passes through the ultrasonic generator along the first direction at a speed of 30 to 100 mm / s, and when the peeling platform passes through the ultrasonic generator, the distance between the ultrasonic generator and the panel to be processed in the second direction (ultrasonic gap) is 3 to 5 mm, and the second direction is a direction perpendicular to the first direction.

[0064] Furthermore, the stripping platform moves along a first direction, and a central axis of an emission port of the ultrasonic generator is perpendicular to the first direction, so as to improve the uniformity of the ultrasonic oscillation treatment and improve the treatment effect.

[0065] Furthermore, the peeling platform moves along the first track, the first track extends in the first direction, the ultrasonic generator is arranged next to the first track, and the emission port of the ultrasonic generator is facing the first track; further, the distance (gap) between the ultrasonic generator and the first track in the second direction is 3-5mm, and the second direction is a direction perpendicular to the first direction.

[0066] In some embodiments, the movement speed of the peeling platform is 50-100 mm / s; further, the movement speed is 50 mm / s, 55 mm / s, 60 mm / s, 65 mm / s, 70 mm / s, 75 mm / s, 80 mm / s, 85 mm / s, 90 mm / s, 95 mm / s or 100 mm / s.

[0067] In some embodiments, the peeling platform is a vacuum adsorption platform, and a vacuum adsorption hole is provided on the vacuum adsorption platform for vacuum adsorption of the panel to be processed, and then the panel to be processed is fixed on the peeling platform to reduce the fluttering of the panel to be processed during the oscillation process, or the damage to the flexible display panel caused by the premature separation of the supporting substrate and the flexible display panel.

[0068] It is understandable that the vacuum adsorption platform of the present invention refers to a platform that uses vacuum adsorption to fix the carrier, and can be any existing vacuum adsorption platform, as long as it does not conflict with the purpose of the present invention. In some embodiments, the vacuum adsorption platform includes: a platform and a vacuum generator (such as an oil pump or a mechanical pump, etc.), and a through hole is opened on the platform. Under the action of the vacuum generator, the panel to be processed placed on the vacuum adsorption platform is acted on through the through hole, so that the panel to be processed is adsorbed on the platform. In some embodiments, the vacuum degree of the vacuum generator is -80KPa to -50KPa. That is, the vacuum degree of vacuum adsorption between the panel to be processed and the peeling platform is -80KPa to -50KPa.

[0069] S140: separating the carrier substrate of the panel to be processed after the oscillation treatment and the flexible display panel.

[0070] It is understandable that the separation in step S140 refers to separating the carrier substrate and the flexible display panel, and the two are not connected to each other, that is, they are not in direct contact and are not connected through other connection layers. Specifically: the carrier substrate can be removed, and the flexible display panel can also be removed. Preferably, the carrier substrate is removed to facilitate subsequent operations of the flexible display panel and reduce damage to the flexible display panel caused by the moving operation. For example, a moving mechanism with a vacuum suction cup can be used to adsorb on the carrier substrate, and then the carrier substrate can be removed by using the effect of vacuum adsorption to expose the flexible display panel to facilitate subsequent operations (such as film application).

[0071] like Figure 4As shown, one embodiment of the present invention provides a stripping device 10, including: a laser generator (LLO) 200, an oscillator 300, a separation mechanism 400 and a stripping platform 500; the stripping platform 500 is used to fix the panel to be processed 100, and the panel to be processed 100 includes a supporting substrate and a flexible display panel arranged on the supporting substrate; the laser generator 200 is used to perform laser scanning processing on the panel to be processed 100; the oscillator 300 is used to oscillate the panel to be processed after the laser scanning processing; the separation mechanism 400 is used to separate the supporting substrate and the flexible display panel of the panel to be processed after the oscillation processing.

[0072] In some embodiments, the stripping device 10 further includes a driving mechanism, which is connected to the stripping platform and is used to drive the stripping platform to move along the first direction.

[0073] In some embodiments, the stripping platform 500 is a vacuum adsorption platform, and a vacuum adsorption hole is provided on the vacuum adsorption platform for vacuum adsorption of the panel to be processed, thereby fixing the panel to be processed on the stripping platform; in some embodiments, the oscillator 300 is an ultrasonic generator. Further, the stripping device also includes a first track 600, the stripping platform 500 moves along the first track 600, the first track 600 extends in the first direction X, the ultrasonic generator 300 is arranged beside the first track 600, and the emission port of the ultrasonic generator 300 faces the first track 600; further, as Figure 5 As shown, the distance d (gap) between the ultrasonic generator 300 and the first track 600 in the second direction Y is 3 to 5 mm, so that when the peeling platform 500 passes through the ultrasonic generator 300, the distance (ultrasonic gap) between the ultrasonic generator 300 and the panel to be processed 100 in the second direction is 3 to 5 mm, wherein the second direction is a direction perpendicular to the first direction.

[0074] In some embodiments, the separation mechanism (Delami) includes a robotic arm and a suction cup connected to the robotic arm, the suction cup is used to absorb the carrier substrate, and the carrier substrate and the flexible display panel are separated under the action of the robotic arm.

[0075] In some embodiments, the stripping equipment also includes a film pasting device (BP Lami) 700, which is used to perform film pasting on the flexible display panel from which the carrying substrate has been peeled off. After the separation mechanism moves the carrying substrate away, the platform is moved to the film pasting device for film pasting under the action of the driving mechanism, thereby realizing automatic and continuous production.

[0076] The stripping device has a simple structure and can realize automatic continuous production, and has a high stripping yield, which can effectively improve the service life of the flexible display panel.

[0077] An embodiment of the present invention provides a method for preparing a flexible display panel using the above-mentioned peeling device, comprising the following steps:

[0078] S210: providing the above-mentioned stripping device;

[0079] The stripping equipment is as described above and will not be described in detail here.

[0080] S220: Control the stripping device so that the stripping device performs a stripping operation according to the following steps:

[0081] S221: fixing the panel to be processed on a stripping platform of a stripping device;

[0082] S222: the panel to be processed fixed on the peeling platform is first subjected to laser scanning by a laser generator, and then subjected to oscillation by an oscillator;

[0083] S223: Control the separation mechanism to separate the carrier substrate of the panel to be processed and the flexible display panel after the oscillation treatment.

[0084] The laser scanning process in step S222 is as described in step S120, and the oscillation process is as described in step S130, which will not be described in detail here. In some embodiments, in step S221, the flexible display panel is brought close to the carrier of the peeling platform.

[0085] The present invention is described below with reference to specific embodiments. It should be noted that the following embodiments are merely illustrative and should not be construed as limiting the present invention.

[0086] Example 1

[0087] The stripping device of this embodiment includes a vacuum adsorption platform, a laser generator, an ultrasonic generator, a driving mechanism and a separation mechanism; the vacuum adsorption platform is used to fix the panel to be processed, and the panel to be processed includes a carrier substrate and a flexible display panel arranged on the carrier substrate; the driving mechanism is used to control the movement of the platform; the laser generator is used to perform laser scanning processing on the panel to be processed; the ultrasonic generator is used to perform oscillation processing on the panel to be processed; the separation mechanism is used to separate the carrier substrate and the flexible display panel of the panel to be processed; wherein, the vacuum degree of the vacuum generator of the vacuum adsorption platform is -80KPa to -50KPa. That is, the vacuum degree of vacuum adsorption between the panel to be processed and the stripping platform is -80KPa to -50KPa.

[0088] How to do it:

[0089] (1) Fixing the panel to be processed on the vacuum adsorption platform of the stripping equipment;

[0090] (2) controlling the driving mechanism so that the panel to be processed fixed on the platform is first subjected to laser scanning treatment by the laser generator (LLO) and then subjected to oscillation treatment by the oscillator; wherein the operating parameters of the laser radiation and oscillation treatment are shown in Table 1, wherein the ultrasonic velocity in Table 1 refers to the movement velocity of the panel to be processed relative to the ultrasonic generator in a first direction, and the ultrasonic gap refers to the distance between the ultrasonic generator and the panel to be processed in a second direction when the vacuum adsorption platform passes through the ultrasonic generator, wherein the second direction is a direction perpendicular to the first direction;

[0091] (3) Controlling the separation mechanism (Delami) to separate the carrier substrate of the panel to be processed and the flexible display panel after the oscillation treatment.

[0092] Embodiments 2 to 5

[0093] It is basically the same as Example 1, except that the parameters of the oscillation process are different, please see Table 1 for details.

[0094] Comparative Example 1

[0095] The same as Example 1, except that the oscillation treatment step is omitted, and the operating parameters of the laser irradiation are set to 200 mj / cm 2 , Reprate is set to 300HZ, Over lap is set to 75%. ED represents energy density, RepRate represents repetition rate, and Over Lap represents overlap rate.

[0096] Performance Testing

[0097] The peeling effects of Examples 1 to 5 were tested and scored, and the test results are shown in Table 1, where * indicates poor, ** indicates average, *** indicates good, and **** indicates very good;

[0098] Standard: *: Number of peeling black spots ≥ 20EA (pieces);

[0099] **: 10EA≤ peeling black spots<20EA;

[0100] ***: 5EA≤ peeling black spots<10EA;

[0101] ****: peeling black spot number <5EA;

[0102] Table 1

[0103]

[0104] (In Table 1, ED represents energy density, RepRate represents repetition rate, and Over Lap represents overlap rate)

[0105] It can be seen from Table 1 that the method of the present invention has a better peeling effect than that of Comparative Example 1, which indicates that the oscillation treatment can effectively reduce the peeling point defects occurring during the separation of the supporting substrate and the flexible display panel; and the ultrasonic velocity, ultrasonic frequency and ultrasonic gap have an influence on the peeling effect, preferably the ultrasonic velocity is 50-100 mm / s, the ultrasonic frequency is 40 KHz, and the ultrasonic gap is 3 mm.

[0106] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0107] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A method for preparing a display panel, characterized in that: The following steps are involved: Providing a panel to be processed, the panel to be processed comprising a carrier substrate and a flexible display panel arranged on the carrier substrate; The panel to be processed is subjected to laser scanning processing. In the step of laser scanning processing, the interface between the carrier substrate of the panel to be processed and the flexible display panel is subjected to laser scanning processing by using laser; wherein the frequency of the laser is 300-600 Hz, and the energy density of the laser is 180-240 mj / cm 2 ; The panel to be processed after the laser scanning process is subjected to an oscillation process, wherein an ultrasonic generator is used to perform the oscillation process, and the frequency of the ultrasonic generator is 28 to 40 kHz. The panel to be processed is fixed on a peeling platform by vacuum adsorption, and the peeling platform passes through the ultrasonic generator at a speed of 50 to 100 mm / s along a first direction, and when the peeling platform passes through the ultrasonic generator, the distance between the ultrasonic generator and the panel to be processed in a second direction is 3 mm to 5 mm; wherein the second direction is perpendicular to the first direction; The carrier substrate of the panel to be processed and the flexible display panel that have been subjected to the oscillation treatment are separated.

2. The preparation method according to claim 1, characterized in that: The vacuum degree of vacuum adsorption between the panel to be processed and the stripping platform is -80KPa to -50KPa.

3. The preparation method according to claim 1, characterized in that: The flexible display panel comprises a connection layer and a flexible display function layer which are sequentially stacked on the carrier substrate; The connecting layer is a sacrificial layer, and the energy density of the laser is 220-240 mj / cm 2 ;or The connecting layer is a polyimide film, and the energy density of the laser is 180-220 mj / cm 2 .

4. A stripping device, characterized in that: include: A peeling platform, the peeling platform is used to fix the panel to be processed, the panel to be processed includes a carrying substrate and a flexible display panel arranged on the carrying substrate; A laser generator is used to perform laser scanning on the panel to be processed. The laser frequency of the laser scanning in the laser generator is 300-600 Hz and the energy density is 180-240 mj / cm 2 ; An oscillator, the oscillator is used to oscillate the panel to be processed after the laser scanning process, the oscillator is an ultrasonic generator, and the frequency of the ultrasonic generator is 28 to 40 KHz; A separation mechanism, the separation mechanism is used to separate the carrier substrate of the panel to be processed and the flexible display panel after the oscillation treatment; A driving mechanism, wherein the driving mechanism is connected to the stripping platform and is used to drive the stripping platform to move along a first direction. The driving mechanism is used to drive the stripping platform to pass through the ultrasonic generator along the first direction, and the stripping platform moves in the first direction at a speed of 50 to 100 mm / s relative to the ultrasonic generator. The driving mechanism is used to control the stripping platform to pass through the ultrasonic generator so that the distance between the ultrasonic generator and the panel to be processed in a second direction is 3 to 5 mm, and the second direction is a direction perpendicular to the first direction.

5. The stripping device according to claim 4, characterized in that The stripping platform is a vacuum adsorption platform.

6. The stripping device according to claim 4 or 5, characterized in that: The separation mechanism comprises: A mechanical arm and a suction cup connected to the mechanical arm, wherein the suction cup is used to absorb the supporting substrate and separate the supporting substrate and the flexible display panel under the action of the mechanical arm.

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