Antenna package

Abstract

The various embodiments of this disclosure generally relate to antenna packages. One package includes an upper layer mounted to a lower layer. The upper layer includes a stack formed of insulating layers and conductive elements and includes a first conductive track for an antenna. A plastic element is rested on the stack. A first cavity is defined within the plastic element. A second conductive track for the antenna is located on a wall of the plastic element (e.g., in or adjacent to the first cavity). A second cavity is also defined within a plastic element surrounding the first cavity. A third conductive track for the antenna is located on a wall of the plastic element (e.g., in the second cavity). A third cavity is defined between the upper and lower layers, and an integrated circuit chip is mounted within the third cavity and electrically connected to the antenna.

Description

[0001] priority

[0002] This application claims priority to French Application No. 2105186, filed on May 18, 2021, the contents of which are incorporated, in their entirety, to the maximum extent permitted by law. Technical Field

[0003] This disclosure generally relates to electronic devices, and more specifically, to devices including antennas located in a package and methods of manufacturing the same. Background Technology

[0004] An antenna is a component used to transmit (transmitter) or receive (receiver) electromagnetic waves. Antennas are a fundamental component of radio systems. Summary of the Invention

[0005] One embodiment provides a package comprising: a stack in an upper layer, the stack including an insulating layer and a conductive element; an element made of plastic resting on the stack and defining a first cavity; and an antenna including a first conductive track in the stack and a second conductive track on a sidewall of the first cavity of the element.

[0006] Another embodiment provides a method for manufacturing a package, the method comprising, in order to form an upper layer, forming a stack including an insulating layer and a conductive element, and including a first conductive track forming part of an antenna; forming an element made of plastic, the element being placed on the stack and defining a first cavity between the element and the stack; and forming a second conductive track placed on the wall of the element.

[0007] According to one embodiment, the first cavity is filled with a first material with a dielectric constant of less than 20.

[0008] According to one embodiment, the package defines a second cavity surrounding the first cavity.

[0009] According to one embodiment, the second cavity is separated from the first cavity by a wall that extends the entire height of the first cavity and rests on the stack.

[0010] According to one embodiment, the second cavity includes a third conductive track extending along at least one sidewall of the second cavity.

[0011] According to one embodiment, the third conductive track includes a first portion extending from the stack on the second wall of the element and a second portion extending on the bottom of the second cavity.

[0012] According to one embodiment, the second portion of the third conductive track is coplanar with the plane of the second conductive track.

[0013] According to one embodiment, the second portion of the third conductive track extends in a plane different from the plane of the second conductive track.

[0014] According to one embodiment, the third conductive track is electrically coupled to the first conductive track.

[0015] According to one embodiment, the second cavity is filled with a second material that is different from the first material that fills the first cavity.

[0016] According to one embodiment, the method includes filling a first cavity and a second cavity with a first material and a second material, respectively, after forming the element.

[0017] According to one embodiment, the package includes a lower layer attached to the upper layer and defining a third cavity between the upper layer and the lower layer.

[0018] According to one embodiment, the package includes a fourth conductive track extending into the stack between the first conductive track and the third cavity.

[0019] According to one embodiment, the element is made of a thermoplastic material doped with a non-conductive inorganic metal compound.

[0020] According to one embodiment, the element is formed by a laser direct structuring method. Attached Figure Description

[0021] The foregoing features and advantages, as well as other features and advantages, will be described in detail in the following description of specific embodiments, which are given by way of illustration rather than limitation.

[0022] Figure 1 This is a cross-sectional view of one embodiment of an electronic device;

[0023] Figure 2 This is a cross-sectional view of another embodiment of the electronic device;

[0024] Figure 3 This is a cross-sectional view of another embodiment of the electronic device;

[0025] Figure 4 This is a cross-sectional view of another embodiment of the electronic device;

[0026] Figure 5 This is a cross-sectional view of another embodiment of the electronic device; and

[0027] Figure 6 Indicated for manufacturing Figure 1 An example of a method as part of an embodiment. Detailed Implementation

[0028] In the various figures, the same features are indicated by the same reference numerals. In particular, common structural and / or functional features in various embodiments may have the same reference numerals and may be arranged with the same structure, dimensions, and material properties.

[0029] For clarity, only the operation and elements that can be used to understand the embodiments described herein are shown and described in detail.

[0030] Unless otherwise stated, when referring to two elements connected together, it means that there is no direct connection of any intermediate element other than a conductor, and when referring to two elements coupled together, it means that the two elements can be connected or they can be coupled via one or more other elements.

[0031] In the following disclosure, unless otherwise indicated, when referring to absolute positional qualifiers such as the terms “front,” “back,” “top,” “bottom,” “left,” “right,” etc., or relative positional qualifiers such as the terms “above,” “below,” “higher,” “lower,” etc., or for directional qualifiers such as “horizontal,” “vertical,” etc., refer to the orientation shown in the accompanying drawings.

[0032] Unless otherwise stated, the expressions “about,” “probably,” “basically” and “approximately” indicate within 10%, and preferably within 5%.

[0033] Figure 1 This is a cross-sectional view of one embodiment of electronic device 10. Device 10 is an antenna device, and more specifically, an antenna (“AiP”) in a package.

[0034] Device 10 includes an integrated circuit chip 12. Chip 12 is housed within a package. Therefore, chip 12 is protected by the package. Antenna 14 is coupled to chip 12 to allow the chip to transmit or receive signals through antenna 14.

[0035] The package includes, for example, a support (lower layer) 16. The support 16 is, for example, a semiconductor substrate that includes, for example, electronic components or a stack of insulating layers including conductive tracks.

[0036] The package also includes an upper layer 18. The upper layer 18 and the lower layer 16 are attached to each other by conductive elements 20. For example, the upper layer 18 and the lower layer 16 are soldered together by solder balls to form the sidewalls of the package. The solder balls allow, for example, electrical connections between the lower and upper layers. Thus, the cavity 22 in which the chip 12 is located is defined between the lower and upper layers and within a metal ring formed by the conductive elements 20.

[0037] Alternatively, chip 12 can be located at another location within the package. For example, chip 12 can be located within stack 24, in other words, it can be composed of layers of stack 24.

[0038] The upper layer 18 includes a stack 24 of layers. For example, the stack 24 forms an interconnect network including insulating layers and conductive tracks. For example, the stack 24 includes insulating or dielectric layers, such as insulating or dielectric layers of different dielectric materials. For example, the stack 24 includes a lower layer 26 of a first dielectric material, i.e., closest to the lower layer 16. The stack 24 includes an intermediate layer 28 resting on the layer 26 of a second dielectric material. The second material is preferably different from the first material. The stack 24 includes an upper layer 30 resting on, for example, the layer 28 of the first dielectric material.

[0039] For example, stack 24 includes metal posts 32 flush with the underside of the insulating layer closest to support 16, i.e., the layer closest to cavity 22. Support 16 includes metal posts 34 flush with its upper surface (i.e., the surface closest to cavity 22), located opposite posts 32. Studs 32 and 34 allow electrical connection between the upper and lower layers via balls 20. For example, balls 20 are located between each post 32 and its corresponding post 34.

[0040] Antenna 14 includes an antenna structure comprising, for example, one or more metal layers 36 or metal tracks in a stack 24, preferably between the upper layers 30. Figure 1 In the example shown, only one layer 36 is illustrated. Layer 36 is coupled to chip 12, for example, via conductive track 38 located in stack 24. This allows chip 12 to activate layer 36 to transmit or receive signals. Layer 36 is also coupled to ground, for example, via track 38.

[0041] For example, stack 24 includes a metal track 40 surrounded by a lower layer 26, the metal track 40 extending opposite to chip 12, preferably extending opposite to the entire chip 12. The track 40 forms a protective shield for chip 12. The track 40 is located between layer 36 and chip 12. According to another embodiment, where chip 12 is not located opposite layer 36, track 40 may not be present.

[0042] The upper layer 18 also includes an upper element 42. Element 42 rests on the stack 24. Element 42 includes a base 50. The base 50 is, for example, planar. The base 50 extends relative to the stack 24, preferably relative to the entire stack 24. Element 42 also includes walls 48 and 52. Walls 48 and 52 are located between the base 50 and the stack 24. More specifically, the base 50 rests on walls 48 and 52. Thus, the base is supported by walls 48 and 52, and walls 48 and 52 rest on the stack 24.

[0043] Element 42 is made of a plastic material. For example, element 42 is made of a thermoplastic material, for example, doped with a non-conductive metallic inorganic compound. Element 42 is made of, for example, a rigid plastic based on epoxy resin. Element 42 includes a base 50 and walls 48 and 52, and is preferably formed as a single unit constituting a cover.

[0044] Component 42 defines an inner cavity 44. Once component 42 is attached to the stack, cavity 44 is a closed cavity, i.e., a cavity surrounded on all sides. Cavity 44 is preferably central. Cavity 44 preferably faces protective layer 40. Layer 40 is preferably located between chip 12 and cavity 44. Cavity 44 preferably faces layer 36.

[0045] Cavity 44 is defined by base 50 and stack 24 in a first direction (e.g., vertical) and by wall 48 in a plane orthogonal to a first dimension (e.g., horizontal). Base 50 forms the bottom of cavity. Wall 48 surrounds cavity 44.

[0046] exist Figure 1 In one embodiment, element 42 further defines a closed cavity 46. Cavity 46 preferably extends around cavity 44. Cavity 46 preferably forms a ring around cavity 44. Cavity 46 is separated from cavity 44 by wall 48.

[0047] Cavity 46 is defined by base 42 and stack 24 along a first direction (e.g., vertical), and by walls 48 and 52 in a plane orthogonal to a first dimension (e.g., horizontal plane). Wall 52 surrounds cavity 46. Base 50 forms the bottom of cavity. Cavity 46 surrounds wall 48. Wall 52 thus forms the outer wall of element 42. Wall 52 is preferably coplanar with the sidewalls of stack 24.

[0048] exist Figure 1 In the example, the base 50 has a substantially constant thickness. Therefore, according to Figure 1 In one embodiment, cavities 44 and 46 are substantially equal in height.

[0049] Component 42 is attached to stack 24. For example, component 42 is attached to stack 24 via an adhesive layer not shown.

[0050] In addition to layer 36, antenna 14 also includes a conductive layer or track (patch) 54 on a base 50 within cavity 44. Layer 54 is preferably made of metal. Layer 54 is located opposite a portion of layer 36, or more generally, the assembly of layers 36 forms the excitation portion of the antenna. Layer 54 allows the transmission of the antenna signal obtained through excitation by layer 36. Layer 54 is electrically isolated, particularly from layer 36. In other words, layer 54 does not contact any conductive elements and is particularly not electrically coupled to layer 36.

[0051] according to Figure 1In one embodiment, antenna 14 includes a secondary conductive layer or track 58 that participates in antenna excitation. The secondary portion 58 is preferably a metal layer, preferably the same metal as layer 36. The secondary portion 58 extends over element 42 into cavity 46. The secondary portion 58 forms a conductive ring around cavity 44. Therefore, the secondary portion 58 extends over the walls of cavity 46. The secondary portion 58 extends from stack 24 to the height of one of walls 48, 52, preferably the entire height of wall 52. The secondary portion 58 preferably extends over at least a portion of base 50 (i.e., the bottom of cavity 46, preferably in the plane of layer 54) into cavity 46. Therefore, the cross-sectional view of the secondary portion 58 is preferably L-shaped. Therefore, the secondary portion preferably includes legs pointing towards stack 24 and legs pointing towards layer 54, for example, coplanar with layer 54.

[0052] The secondary portion 58 is coupled to layer 36 via at least one conductive element 60 (e.g., at least one conductive via or conductive ring). The at least one conductive element 60 extends through one or more insulating layers of the stack 24 to reach layer 36. In other words, at least one conductive element 60 contacts layer 36 and extends to the upper surface of the stack 24. The secondary portion 58 is positioned to contact element 60, which is flush with the upper surface of the stack 24.

[0053] Cavity 44 is filled with material 56. This material has a dielectric constant of, for example, less than 20, preferably less than 10, more preferably less than 3, and for example, greater than 1. Material 56 is, for example, air.

[0054] Cavity 46 is filled with a second material 47, preferably different from the first material filling cavity 44. The dielectric constant of the second material is, for example, less than 20, preferably less than 10, more preferably less than 3, and for example greater than 1. Material 47 is, for example, air. Alternatively, material 47 may be the same material as material 56. Alternatively, material 47 may be a conductive material.

[0055] The substrate 50 preferably has a thickness of less than 100 μm, more preferably less than 50 μm. Preferably, the substrate 50 is as thin as possible while avoiding deformation of the element 42. The wall 48 extending from the substrate 50 to the stack 24 provides a stabilizer and ensures that the substrate 50 does not deform.

[0056] Layer 54 has a thickness, for example, between 5 μm and 30 μm. Layer 58 has, for example, the same thickness as layer 54. Layer 58 has a thickness, for example, between 20 μm and 50 μm.

[0057] Layers 36 and 40 are separated by a distance between 250 μm and 400 μm, for example, substantially equal to 350 μm. The distance between layer 54 and layer 36 depends, for example, on the wavelength range transmitted or received by antenna 14. For example, for a signal with a frequency substantially equal to 60 GHz, the distance between layer 54 and layer 36 is substantially equal to 400 μm. Preferably, the distance between layer 54 and layer 36 is greater than 150 μm, for example, greater than 200 μm.

[0058] The distance between layers 54 and 36 is a crucial characteristic of the antenna package. In practice, the distance between layers 54 and 36 must be sufficiently high to allow layer 54 to radiate transmitted signals. Layers 54 and 36 are further separated by a material with properties particularly important for dielectric constant, thereby allowing for an effective signal path.

[0059] A material layer can be selected to fill the cavity 44 on the stack and a layer 54 can be formed on the layer. However, it may not be possible to precisely select the thickness of the layer depending on the intended use.

[0060] Figure 2 This is a cross-sectional view of another embodiment of the electronic device 61.

[0061] Device 61 and Figure 1 The difference in device 10 is that the thickness of the base 50 facing cavity 46 is different from the thickness of the base 50 facing cavity 44, and preferably greater. In other words, the height of cavity 46 is less than the height of cavity 44. The upper surface of the base 50, that is, the surface farthest from cavities 44 and 46, is planar.

[0062] Layers 54 and 58 are located in their respective cavities, as if combined Figure 1 As described. Layer 58 includes legs extending above wall 52 and legs extending above base 50 and therefore not in the same plane as layer 54.

[0063] According to another embodiment, the legs of the layer 58 extending above the base 50 are coplanar with the layer 54, and the thickness of the base 50 facing the cavity 46 is different from the thickness of the base 50 facing the cavity 44, preferably greater than the thickness of the base 50 facing the cavity 44.

[0064] Figure 3 This is a cross-sectional view of another embodiment of the electronic device 70.

[0065] Equipment 70 and Figure 1 and Figure 2 The difference in this embodiment is that device 70 does not include cavity 46. Therefore, element 42 forms a single cavity 44. Cavity 44 includes layer 54 and material 56, as per [context missing]. Figure 1As described. The wall 48, which laterally surrounds the cavity 44, forms the sidewall of element 42, and thus forms part of the sidewall of the upper layer 18. Therefore, element 42 corresponds to a block comprising a single cavity corresponding to cavity 44. The wall 48 is therefore coplanar with the sidewalls of the stack 24.

[0066] Stack 24 preferably does not include conductive element 60. Antenna 14 does not include secondary portion 58.

[0067] Figure 4 This is a cross-sectional view of another embodiment of the electronic device 80.

[0068] Device 80 and Figure 1 The difference in this embodiment is that the secondary portion 58 is not present in the cavity 46. Therefore, the cavity 46 only includes material 47.

[0069] As in Figure 3 In this embodiment, there is no conductive element 60.

[0070] Figure 5 This is a cross-sectional view of another embodiment of the electronic device 90.

[0071] Device 90 and Figure 1 The difference in this embodiment is that layer 54 is located on the upper surface of base 50, i.e., on the upper surface of element 42. Layer 54 is located opposite cavity 44. Layer 54 has a dimension in a horizontal plane that is less than or equal to the size of cavity 44. Therefore, cavity 44 is filled only with material 56. Therefore, secondary portion 58 is located in a plane different from the plane including layer 54. In particular, the legs of secondary portion 58 resting on base 50 are not coplanar with layer 54.

[0072] Figure 6 It shows the manufacturing process. Figure 1 This is an example method as part of an embodiment. More specifically, Figure 6 Includes four cross-sectional views A, B, C, and D, each showing the process for manufacturing. Figure 1 The steps in the method are part of an embodiment. The steps shown in views A, B, C, and D are preferably sequential.

[0073] Figure 6 View A illustrates the steps of forming element 42 or the cap. Preferably, element 42 is formed by injecting the material constituting element 42 into a mold having the desired shape of element 42. The injection is performed, for example, by a syringe or by a suitable component, such as as part of a machine used to manufacture element 42. The material constituting element 42 is preferably in liquid form during injection. The material is then brought to a solid phase, for example, by heat treatment, i.e., by increasing its temperature. The mold is then removed.

[0074] The material of the constituent element 42 is plastic. Preferably, the material of the constituent element 42 is a material compatible with the laser direct forming (LDS) method; in other words, a thermoplastic material doped with non-conductive metallic inorganic compounds.

[0075] Figure 6 View B shows the laser activation at layer locations 54 and 58 to produce a substrate for metallization at these locations.

[0076] exist Figure 6 During the step shown in view C, element 42 is placed in the chemical plating bath composition. As a result, in Figure 6 Layers 54 and 58 are formed at the activated locations in step B of view.

[0077] alternative sites, in Figure 6 The active position in view B of the steps is greater than layers 54 and 58. Therefore, Figure 6 The step in view C allows the formation of metal layers with dimensions larger than those of layers 54 and 58. These layers are then etched to form layers 54 and 58.

[0078] exist Figure 6 In step D of the diagram, cavities 44 and 46 are filled with materials 56 and 47, respectively. For example, the materials are deposited in the cavities in liquid form and solidify, for example, through an annealing step.

[0079] In a subsequent step (not shown), element 42 is attached to stack 24.

[0080] Figure 6 It shows Figure 1 The manufacturing of the embodiment. However, by modification Figure 6 The shape of the mold shown in view A and by modifying Figure 6 The laser activation position in the steps of view B, the described method is applicable to the attached... Figures 2 to 5 Examples of implementations.

[0081] Corresponding to the direct laser structuring method Figure 6 Steps B and C can be replaced by other metal layer deposition steps, such as sputtering or spraying. Then, the material of element 42 can be different from the bonding material. Figure 6 The material discussed in view A. Then, element 42 can be made of any plastic material suitable for forming element 42 and for depositing the metal layer.

[0082] The advantage of the described embodiment is that the distance between the radiating conductive layer 54 (otherwise referred to as a "patch") and the excitation layer 36 can be better controlled. This distance can therefore be advantageously reduced to decrease the size of the package while maintaining sufficient distance for antenna operation.

[0083] Another advantage of the described embodiment is that it allows layers 54 and 36 to be separated by material 56 regardless of the type of structure. In practice, the structure is held in place by a plastic element or cap 42, and the strength of material 56 does not affect the strength of the package.

[0084] Another advantage of the described embodiment is that the materials 47 surrounding layer 58 and 56 surrounding layer 54 can be different from each other.

[0085] Various embodiments and variations have been described. Those skilled in the art will understand that certain features of these embodiments can be combined, and other variations will readily occur to them.

[0086] Finally, based on the functional descriptions provided above, the actual implementation of the embodiments and variations described herein is within the capabilities of those skilled in the art.

Claims

1. A package comprising: The upper layer includes: Stacked, including insulating layers and conductive components; A plastic element having a first side resting on the stack, a second side opposite the first side, and including a first cavity extending from the first side into the plastic element, the first cavity having a first height less than the thickness of the plastic element between the first side and the second side; and The antenna includes a first conductive track in the stack and a second conductive track on the wall of the plastic element.

2. The package of claim 1, wherein the first cavity has a side plastic surface and a bottom plastic surface, and the second conductive track is located on the bottom plastic surface of the first cavity.

3. The package according to claim 2, wherein the first cavity is filled with a first material having a dielectric constant of less than 20.

4. The package of claim 1, wherein the second conductive track is above the first cavity and located on the second side of the plastic element.

5. The package of claim 1, wherein the plastic element further comprises a second cavity extending from the first side into the plastic element, the second cavity having a second height less than the thickness of the plastic element between the first side and the second side, the second cavity surrounding the first cavity.

6. The package of claim 5, wherein the second cavity is separated from the first cavity by a first wall that extends the first height of the first cavity and rests on the stack.

7. The package of claim 5, wherein the antenna further comprises a third conductive track located within the second cavity.

8. The package of claim 7, wherein the third conductive track includes a first portion extending on the sidewall of the second cavity and a second portion extending on the bottom of the second cavity.

9. The package of claim 8, wherein the second conductive track is located at the bottom of the first cavity, and wherein the second portion of the third conductive track is coplanar with the second conductive track.

10. The package of claim 8, wherein the second conductive track is located at the bottom of the first cavity, and wherein the second portion of the third conductive track extends in a plane different from the plane of the second conductive track.

11. The package of claim 7, wherein the third conductive track is electrically coupled to the first conductive track.

12. The package of claim 5, wherein the first cavity is filled with a first dielectric material, and wherein the second cavity is filled with a second dielectric material different from the first dielectric material.

13. The package according to claim 1, further comprising: Lower layer; The upper layer is attached to the lower layer via an electrical connection element; The third cavity is defined between the upper and lower layers and is surrounded by the electrical connection element; and An integrated circuit chip is located within the third cavity and is electrically connected to the antenna.

14. The package of claim 13, further comprising a fourth conductive track extending into the stack between the first conductive track and the third cavity.

15. The package of claim 1, wherein the plastic element is made of a thermoplastic material doped with a non-conductive inorganic metal compound.

16. A method for manufacturing a package, comprising: The upper layer is formed through the following operations; A stack is formed, the stack including an insulating layer and conductive elements and including a first conductive track forming part of an antenna; Forming a plastic element having a first side and a second side opposite to the first side, wherein forming the plastic element includes forming a first cavity extending from the first side into the plastic element, the first cavity having a first height less than the thickness of the plastic element between the first side and the second side; The plastic element is mounted onto the stack, wherein the first side rests on the stack and the first cavity is closed by the stack; as well as A second conductive track is formed on the wall of the plastic element.

17. The method of claim 16, further comprising filling the first cavity with a first material having a dielectric constant of less than 20.

18. The method of claim 16, wherein forming the plastic element further comprises forming a second cavity extending from the first side into the plastic element, the second cavity having a second height less than the thickness of the plastic element between the first side and the second side, the second cavity surrounding the first cavity.

19. The method of claim 18, further comprising forming a third conductive track extending along at least one wall of the second cavity.

20. The method of claim 19, wherein the third conductive track comprises a first portion extending on the sidewall of the second cavity and a second portion extending on the bottom of the second cavity.

21. The method of claim 20, wherein the second conductive track extends on the bottom of the first cavity, and the second portion of the third conductive track is coplanar with the second conductive track.

22. The method of claim 20, wherein the second conductive track extends over the bottom of the first cavity, and the second portion of the third conductive track extends in a plane different from the plane of the second conductive track.

23. The method of claim 19, further comprising electrically coupling the third conductive track to the first conductive track.

24. The method of claim 18, further comprising filling the first cavity with a first dielectric material and filling the second cavity with a second dielectric material different from the first dielectric material.

25. The method of claim 24, wherein forming the plastic element includes molding, and wherein filling the first cavity and the second cavity with the first dielectric material and the second dielectric material, respectively, occurs after molding.

26. The method of claim 16, further comprising: Forming the lower layer; as well as The upper layer is attached to the lower layer, and the attachment defines a third cavity between the upper and lower layers.

27. The method of claim 26, further comprising forming a fourth conductive track extending into the stack between the first conductive track and the third cavity.

28. The method of claim 16, wherein the plastic element is made of a thermoplastic material doped with a non-conductive inorganic metal compound.

29. The method of claim 28, wherein forming the plastic element comprises performing a laser direct forming operation.

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