A Rotary Potting Process for a Microcircuit Module

Abstract

The present invention discloses a rotary potting process for a microcircuit module. The rotary potting process includes the following steps: providing a PCB board, on which there are potting through holes; providing an aluminum alloy cover plate and a U-shaped shell surface, both of which are provided with potting holes, and there is no component layout at the PCB board at the potting holes; providing a rotary potting device, which includes a rotatable rotary loading table and a glue injection head, and there is a rotary loading tooling on the rotary loading table. After assembling the PCB board, the aluminum alloy cover plate and the U-shaped shell surface, place them in the rotary loading tooling; rotate the rotary loading table, and the glue injection head injects potting glue into the microcircuit module through the potting holes to complete the potting of the microcircuit module. Through process design and cooperation with a specific rotary potting device, the potting of the microcircuit module is realized, which has the advantages of good and reliable effect and flexible and controllable process operation.

Description

Technical Field

[0001] The present invention belongs to the technical field of PCBA, and particularly relates to a rotary potting process for a microcircuit module. Background Art

[0002] A microcircuit module is a typical PCBA. The microcircuit module is developing in the direction of high integration and high power density. Especially the application of ultra-large-scale integrated circuits and various power devices on the microcircuit module requires that the heat generated inside the microcircuit module during operation be quickly and well dissipated to the external environment. Otherwise, local high temperatures will be generated inside the microcircuit module, damaging the components inside the microcircuit module, thus affecting the service life and long-term reliability of the microcircuit module. Moreover, the microcircuit module requires an insulation performance of 3000 VAC and above, all of which need to be achieved through the potting process.

[0003] In order to meet the demanding heat dissipation and insulation requirements of the microcircuit module, the thermal conductivity and insulation index of the potting adhesive used during potting are also getting higher and higher. Currently, the thermal conductivity of the potting adhesive has reached 4.0 W / m·K and above, and the breakdown voltage has reached above 9000 V / mm. Therefore, the heat dissipation fillers and insulation media added to the potting adhesive have also increased significantly, which has led to an increasing viscosity of the potting adhesive, reaching 30000 mPa·s and above. At the same time, the interaction between the heat dissipation fillers and insulation media inside the potting adhesive increases the internal friction during the flow of the potting adhesive, making it increasingly difficult to achieve reliable potting.

[0004] In addition, the assembly structure of the PCB board and components inside the microcircuit module is becoming increasingly complex. Once the enclosed housing of the microcircuit module is bonded, potting can only be carried out through a very small potting hole, which poses challenges to the potting process.

[0005] Currently, the common potting methods mainly include: (1) Manual potting, that is, potting by relying on the gravitational force of the potting adhesive. However, this potting method is only suitable for products with a simple PCB board structure and non-enclosed housing bonding. It can no longer achieve effective dense potting for products with a complex internal structure of the microcircuit module, high-viscosity and high-thermal-conductivity potting adhesive, and enclosed housing bonding; (2) Vacuum immersion potting, but this potting method is not easy to pot completely, and the production time is long, the amount of wasted potting adhesive is extremely large, the production cost is extremely high, and the cleaning work after potting is very complicated; (3) Vibration potting, this potting method has certain damage to the PCB board and components inside the microcircuit module. At the same time, in the face of the increasingly complex assembly structure and high-viscosity potting adhesive inside the microcircuit module, it has also lost its advantages. Summary of the Invention

[0006] In view of this, it is necessary for the present invention to provide a rotary potting process for a microcircuit module. By designing the process such as the layout of the microcircuit module and the PCB, and combining with a specific rotary potting device, the high-cost potting problem and potting quality problem of existing high-viscosity potting adhesives are solved.

[0007] To achieve the above object, the present invention adopts the following technical solutions:

[0008] The present invention provides a rotary potting process for a microcircuit module, including the following steps:

[0009] Provide a PCB board, and the PCB board is provided with potting through holes;

[0010] Provide an aluminum alloy cover plate and a U-shaped shell surface. Both the aluminum alloy cover plate and the U-shaped shell surface are provided with potting holes, and there is no component layout at the PCB board at the potting holes;

[0011] Provide a rotary potting device, which includes a rotatable rotary carrier table and a glue injection head. A rotary carrier tooling is provided on the rotary carrier table, and the PCB board, the aluminum alloy cover plate and the U-shaped shell surface are assembled and placed in the rotary carrier tooling;

[0012] Rotate the rotary carrier table, and the glue injection head injects potting adhesive into the microcircuit module through the potting holes to complete the potting of the microcircuit module.

[0013] In a further aspect, the transverse cross-section of the potting through hole is rectangular.

[0014] In a further aspect, the potting through hole is provided in the middle of the PCB board.

[0015] In a further aspect, the aperture size of the potting hole is 3-5 mm.

[0016] In a further aspect, the potting hole is provided at the geometric center position of the aluminum alloy cover plate and / or the U-shaped shell surface.

[0017] In a further aspect, the rotary potting device includes a rotating mechanism, and the rotating mechanism is provided below the rotary carrier table for driving the rotary carrier table to rotate.

[0018] In a further aspect, the rotating mechanism includes a motor, a rotating shaft extends from the motor, a coupling is connected to the end of the rotating shaft away from the motor, and the coupling is connected to the rotary carrier table.

[0019] In a further aspect, a partition plate is provided below the rotary carrier table, and a potting adhesive collection channel is provided on the surface of the partition plate.

[0020] In a further embodiment, a drainage tube is connected to the glue outlet end of the glue injection head, and potting glue is injected into the potting hole through the drainage tube.

[0021] In a further embodiment, the drainage tube is a syringe, and the end of the syringe is located 1-3 mm away from the potting hole.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] In the rotary potting process of the present invention, a potting through-hole design is carried out on the PCB board, and accordingly, a matching design of the potting holes of the housing (aluminum alloy cover and / or U-shaped shell surface) is carried out. Combined with a specific rotary potting device, through the cooperation of process design and device, the rotary potting of the microcircuit module is realized.

[0024] In the rotary potting process of the present invention, based on the characteristics of the rotary potting process, once the potting glue injected into the microcircuit module touches the PCB board, it is quickly thrown by the centrifugal force generated by the rotation of the microcircuit module into the un-potted space corners. And the potting glue amount can be strictly controlled by observing the situation of the potting glue being flush with the potting hole and the method of weight verification, so that the potting glue amount of each microcircuit module is controllable. Therefore, the potting glue can be prepared according to the principle of "using as needed". Since the operable time of some potting glues is short, this is a challenge to the potting process. When the rotary potting process of the present invention is adopted, the potting glue perfusion amount of each microcircuit module and the time for each microcircuit module to complete the potting glue perfusion are both controllable. Combined with the specific operable time of the potting glue, appropriate cooperation can be carried out. When the potting glue becomes inoperable, the potting of all the prepared potting glue is completed, and then the next round of rotary potting is started, without being affected by the short operable time of the potting glue. Therefore, there is no limitation on the short operable time of the potting glue. And due to the characteristic of quantitative operation, this process will not waste expensive potting glue. In this rotary potting process, the centrifugal force generated when the microcircuit module rotates can be effectively adjusted according to the layout and size of different products. The potting glue can make use of the centrifugal force to densely fill all the potting spaces and corners inside the microcircuit module, ensuring good and reliable potting effect, flexible and controllable process operation, and being applicable to various types of tasks such as microcircuit module research and development and mass production.

[0025] The rotary potting process in the present invention is improved in terms of process design and device, so that the rotary potting process has the advantages of low cost, high reliability and simple operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic structural diagram of a PCB board 10 in a preferred embodiment of the present invention;

[0027] Figure 2 It is a schematic structural diagram of a rotary loading tooling 40 in a preferred embodiment of the present invention;

[0028] Figure 3 Schematic diagram of the combined structure of the microcircuit module and the rotary loading tooling 40 in a preferred embodiment of the present invention;

[0029] Figure 4 is Figure 3 exploded view of the combination of the microcircuit module and the rotary loading tooling 40;

[0030] Figure 5 Schematic diagram of the structure of the rotary potting device 50 in a preferred implementation of the present invention.

[0031] In the figure: 10 - PCB board, 101 - potting through hole;

[0032] 20 - U-shaped shell surface, 201 - first potting hole;

[0033] 30 - aluminum alloy cover plate, 301 - second potting hole;

[0034] 40 - rotary loading tooling, 401 - screw hole, 402 - stop block, 403 - counterweight;

[0035] 50 - rotary potting device, 501 - housing, 502 - protective cover, 503 - potting window, 504 - locking column, 505 - partition plate, 506 - potting glue collection channel, 507 - motor, 508 - rotating shaft, 509 - coupling, 510 - rotary loading table, 511 - microcircuit module, 512 - glue injection head, 513 - syringe, 514 - hinge, 515 - control panel. Detailed implementation manners

[0036] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the drawings, in which the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions from beginning to end. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present invention and should not be construed as a limitation of the present invention.

[0037] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present invention belongs. The terms used in the description of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0038] A rotary potting process for a microcircuit module is provided in the embodiments of the present invention, which realizes dense and reliable potting of the microcircuit module, making the rotary potting process have the advantages of low cost, high reliability and simple operation. In this embodiment, specifically, the rotary potting process mainly includes the following steps:

[0039] Design of PCB layout and housing potting holes for microcircuit modules

[0040] The PCB board described in this article has the conventional definition and structure in the art. It is provided with relevant device layouts on the substrate as required, so it will not be specifically elaborated here. The PCB board described in this article is a PCB board on which components and leads have been assembled. On this PCB board, there are potting through-holes, and the potting through-holes are composed of PCB board layout pores, and the PCB board layout pores communicate with the upper and lower cavities of the microcircuit module after the housing is bonded respectively.

[0041] It can be understood that the potting through-holes described in this article are the pores of the potting channels on the PCB board. In some specific embodiments of the present invention, it is achieved by leaving a certain area empty on the PCB board. There are no special limitations on the size and position of the empty area, and it can be designed according to needs. According to the embodiments of the present invention, the cross-sectional area of the potting through-hole is preferably rectangular, with a size of 4 mm × 15 mm, and the position is preferably near the center of the PCB board. It should be noted that the potting through-hole can be designed at any position except the corner positions of the PCB board. More preferably, it is designed at the center position of the PCB board. This is because if the potting through-hole is designed at the corner position, it is not conducive to the smooth penetration of the potting glue in the upper and lower cavities of the microcircuit module, and it is easy to cause potting dead corners, resulting in the defect of incomplete potting.

[0042] The housing of the microcircuit module mainly includes an aluminum alloy cover plate and a U-shaped shell surface. Potting holes are respectively designed on the aluminum alloy cover plate and the U-shaped shell surface. The aperture size of the potting holes is selected according to design needs. In some specific embodiments of the present invention, the aperture size of the potting holes is 3 - 5 mm. It should be noted that there is no component layout at the position of the PCB board corresponding to the potting holes. The potting holes on the aluminum alloy cover plate or the U-shaped shell surface are the only channels for the potting glue to enter the interior of the microcircuit module from the outside. During the continuous rotation of the microcircuit module, the potting glue can be effectively thrown into the interior of the microcircuit module through the potting holes. If the potting holes are too small, the difficulty of injecting the potting glue will increase sharply during rotary potting; if the potting holes are too large, the potting glue will fly out from the potting holes during rotary potting, causing adverse effects. Therefore, preferably, the aperture size of the potting holes in the present invention is 3 - 5 mm.

[0043] It is understandable that, generally speaking, the potting holes should be designed at the geometric center of the aluminum alloy cover plate or the U-shaped shell surface. If the components in the PCB layout are exactly below the potting holes and cannot be avoided in the PCB layout design, the potting holes can be designed at the middle position of the aluminum alloy cover plate or the U-shaped shell surface. If the potting holes deviate from the geometric center of the aluminum alloy cover plate or the U-shaped shell surface, the eccentricity can be corrected by rotating the loading tooling, but the potting holes are not allowed to be designed at the corner positions of the aluminum alloy cover plate or the U-shaped shell surface. This is because when the potting holes are designed at the corner positions of the aluminum alloy cover plate or the U-shaped shell surface, it will cause over-eccentricity defects. At this time, the rotating loading tooling cannot achieve effective eccentricity correction and normal rotating potting cannot be realized.

[0044] Through the design of the through holes for PCB potting, it mainly plays the role of connecting the upper and lower cavities inside the microcircuit module. When the potting glue is continuously and rotationally injected from the potting holes on the outer shell of the microcircuit module onto the PCB, the potting glue in the PCB cavity can enter the cavity on the other side of the PCB through the through holes for potting, so that the potting glue in the upper and lower cavities inside the microcircuit module can be integrated into a whole, thus realizing dense potting.

[0045] Provide a rotary potting device

[0046] The rotary potting device can provide the power for the rotary potting of microcircuit modules, thus realizing rotary potting. The rotary potting device includes a rotary carrier table, and the rotary carrier table realizes rotation by means of the power provided by the rotation of the motor. In some specific embodiments of the present invention, the motor is fixed at the bottom of the housing of the rotary potting device, and the rotating shaft of the motor vertically extends from the upper surface of the motor. The rotation speed and direction of the rotating shaft can be set as required. Through a coupling, it is connected to the horizontally arranged rotary carrier table, and the control panel is arranged on the outside of the housing of the rotary potting device. A partition plate is designed inside the housing, and the partition plate divides the inner part of the housing of the rotary potting device into upper and lower space parts. Among them, the rotary carrier table is designed in the upper space part of the partition plate, and the motor for driving the rotation of the rotary carrier table and the like are designed in the lower space part of the partition plate. The rotary carrier table is collinear with the rotating shaft of the rotary potting device, and the rotation speed and direction of the rotating shaft are the rotation speed and direction of the rotary carrier table. Since the microcircuit module is placed in the tooling of the rotary carrier table, and the tooling of the rotary carrier table is fixed on the rotary carrier table, the rotation speed and direction of the microcircuit module around the potting hole are also consistent with this. In addition, a potting glue collecting channel is provided on the surface of the partition plate, and the potting glue collecting channel helps to collect the excess potting glue splashed out during the rotary potting process, realizing a good potting glue collecting effect. A protective cover is provided at the upper end of the housing of the rotary potting device, and the protective cover can effectively protect the safety of the rotary potting operator and realize safe operation. In addition, a rotary potting window, a hinge and a locking column are designed on the protective cover. The rotary potting window is circular and is located at the central position of the protective cover. The potting glue is potted into the microcircuit module through the rotary potting window. Further, the hinge is used to connect the protective cover and the housing of the rotary potting device, so that the protective cover can be completely opened or cover the upper end of the housing. When performing rotary potting, the protective cover can be firmly fixed in the locking hole at the upper end of the rotary potting cylindrical groove through the locking column to close the protective cover. When the rotary potting stops and the microcircuit module is taken and placed, the protective cover can be opened for convenient operation.

[0047] After the rotating shaft of the rotary potting device starts to rotate, the microcircuit module located in the rotary carrier table rotates at a constant speed around the potting hole. At this time, the potting glue flows out from the drainage pipe and is injected into the microcircuit module through the potting hole. Under the action of the centrifugal force of the rotation of the microcircuit module, the potting glue is continuously thrown into the space inside the microcircuit module to complete the dense and reliable potting of the microcircuit module.

[0048] It is well-known to those skilled in the art that potting bubble defects and potting pore defects are difficult problems in the potting process, and these problems can be solved by the rotary potting process in the present invention. During rotary potting, the colloid is thrown to every corner inside the module by the centrifugal force generated during rotation. The bubbles in the colloid are cracked and released. As the colloid is continuously injected and rotated, the internal space of the module is finally densely filled with potting glue, and the bubbles generated inside the colloid are extruded from the inside of the module by centrifugal force and discharged into the atmosphere through the potting holes. When rotary potting, the rotation speed should not be too fast. If the rotation speed is too fast, the potting glue will fill the inside of the microcircuit module at a high speed, making it impossible to discharge the bubbles at the bottom of some parts of the module. If the rotation speed is too slow, the speed at which the potting glue is injected into the microcircuit module is too slow, and a large amount of air will enter the potting cavity accordingly, forming bubble defects. Therefore, the rotation speed parameter of rotary potting is very important. Generally, the rotation speed is set at 500 - 800 r / min.

[0049] In this rotary potting device, the rotary loading tooling is an important tooling design in the present invention. If the rotary loading tooling is lost during the installation of the microcircuit module, the microcircuit module can only be directly fixed on the rotary loading table, which will greatly reduce the production efficiency: mechanical fixation of the microcircuit module is required before rotary potting, and the microcircuit module needs to be disassembled after rotary potting is completed. Repeated fixation and disassembly of the microcircuit module directly on the rotary loading table result in a waste of a large amount of formal production time, and the production efficiency will inevitably be extremely low. The rotary loading tooling completely solves the above problems: for the rotary loading tooling corresponding to different microcircuit modules, it only needs to be fixed on the rotary loading table once, and the microcircuit module can be directly placed and taken out in the fixed rotary loading tooling. The original 4 minutes of fixation and disassembly time required for each microcircuit module is shortened to within 3 seconds, which greatly improves the production efficiency.

[0050] Furthermore, for the rotary loading tooling, a number of screw holes are designed at its bottom for fixing on the rotary loading table. According to the layout of the microcircuit modules with different sizes and their potting holes, corresponding stoppers and counterweights are designed to achieve the correct placement of the microcircuit modules and complete non-eccentric rotary potting and eccentric rotary potting. Eccentricity refers to the phenomenon that the potting hole is not at the geometric center of the microcircuit module, that is, the potting hole deviates from the geometric center of the microcircuit module. When the potting hole of the microcircuit module is located at the geometric center of the microcircuit module, the potting hole coincides with the geometric center of the rotary loading table tooling. The rotary loading table tooling only needs to design corresponding stoppers and does not need to design counterweights to achieve normal non-eccentric rotary potting. When the potting hole deviates from the geometric center of the microcircuit module, in order to keep the potting hole coinciding with the geometric center of the rotary loading table tooling, corresponding stoppers and counterweights must be designed simultaneously to achieve eccentric rotary potting.

[0051] The present invention will be described below through specific embodiments. It should be noted that the following specific embodiments are only for illustrative purposes and do not limit the scope of the present invention in any way. In addition, unless otherwise specified, the methods without specific conditions or steps recorded are conventional methods.

[0052] Embodiment

[0053] The structure of the PCB board 10 in this embodiment is as Figure 1 shown in, and the assembly of components and leads has been completed. The specific layout and the like will not be elaborated here and can be adjusted according to actual design needs. As Figure 1 shown in, a potting through-hole 101 is provided in the middle of the PCB board 10. The cross-section of the potting through-hole 101 is designed to be rectangular. In this embodiment, the size of the potting through-hole 101 is 4 mm × 15 mm, and its position is close to the center of the PCB board 10. The upper and lower cavities of the PCB board 10 are connected through the potting through-hole 101.

[0054] Please continue to refer to Figure 2 , Figure 2 which shows a rotating loading tooling 40 for setting the PCB board 10 in the rotating potting process. A number of screw holes 401 are provided on the bottom plate of the rotating loading tooling 40 for fixing the rotating loading tooling 40 in a rotating potting device 50 later. Further, please continue to refer to Figure 2 , on opposite sides of the bottom plate of the rotating loading tooling 40, there are stoppers 402 for limiting the PCB board 10 and the like placed on the rotating loading tooling 40 to ensure the smooth progress of the rotating potting of the PCB board 10. At the same time, a counterweight 403 is provided on the side of the bottom plate of the rotating loading tooling 40, and the counterweight 403 can be adjusted as needed to correct the center of the potting.

[0055] Further, please combine Figure 2 and Figure 3 . By sequentially assembling the aluminum alloy cover plate 30, the PCB board 10, and the U-shaped shell surface 20 and placing them in the rotating loading tooling 40, further combining Figure 4 , it can be seen that a first potting hole 201 is provided on the U-shaped shell surface 20, and a second potting hole 301 is provided on the aluminum alloy cover plate 30. Potting is achieved through the first potting hole 201, the second potting hole 301, and the potting through-hole 101.

[0056] Further, please refer to Figure 5, which shows a schematic structural diagram of the rotary potting device 50 in this embodiment. It includes a housing 501. At the upper end of the housing 501, a protective cover 502 is provided through a hinge 514. The protective cover 502 can be opened or closed along the hinge 514, and a locking column 504 is provided on the side opposite to the hinge 514. Through the cooperation of the locking column 504 with a locking hole (not shown in the figure) on the housing 501, the locking of the protective cover 502 is achieved; further, a potting window 503 is provided in the middle of the protective cover 502, and rotary potting is performed through this potting window 503. Further, a partition plate 505 is provided inside the housing 501. The partition plate 505 divides the interior of the housing 501 into upper and lower spaces. Among them, a rotating mechanism is provided in the lower space. Specifically, a motor 507 is provided at the bottom of the housing 501, a rotating shaft 508 is provided at the upper end of the motor 507, and a coupling 509 is provided at the end of the rotating shaft 508. Further, a rotary carrier 510 is provided in the upper space. The rotary carrier 510 is connected to the coupling 509. Through the drive of the motor 507, the rotary carrier 510 rotates. A glue injection head 512 is provided at the upper end of the rotary carrier 510. A syringe 513 is connected to the glue outlet end of the glue injection head 512. Glue injection and rotary potting are performed on the microcircuit module 511 on the rotary carrier 510 through the glue injection head 512 and the syringe 513. In addition, a potting glue collection channel 506 is provided on the upper surface of the partition plate 505. Excess potting glue splashed during the rotary potting process is collected through this potting glue collection channel 506. On the one hand, the collection of potting glue is realized, and on the other hand, the interior of the housing 501 is prevented from being polluted by the potting glue splashed during the rotary potting process. Further, it can be understood that the control of the motor 507 is performed through a control panel 515. Specifically, the rotation speed and direction of rotation can be controlled, etc. The arrangement position of the control panel 515 is not particularly limited. Preferably, in this embodiment, the control panel 515 is arranged outside the housing 501 for convenient operation.

[0057] The following combines Figure 5 the rotary potting device 50 in

[0058] to specifically describe the rotary potting process in this embodiment: Figure 3 and Figure 4The schematic diagram in it is glued into the shell to assemble and form the microcircuit module 511, which is placed in the rotary loading tooling 40. The rotary loading tooling 40 is fixed at the central position of the rotary loading table 510 through the corresponding screw holes 401. Among them, a first potting hole 201 is designed at the U-shaped shell surface 20. Confirm that the first potting hole 201 faces upward. At this time, the microcircuit module 511 is constrained inside the stopper 402 of the rotary loading tooling 40. Among them, the first potting hole 201 deviates from the geometric center of the microcircuit module 511, but the counterweight 403 of the rotary loading tooling 40 corrects it, so that the first potting hole 201 is located at the central position of the rotary loading table 510. Then, through the hinge 514 and the locking column 504, the protective cover 502 of the rotary potting device 50 is locked.

[0059] Further, turn on the switch of the rotary potting device 50 to connect the power supply. Set the rotation speed at 600 r / min on the control panel 515 of the rotary potting device 50, and then press the OK key to confirm. Through the potting window 503, insert the syringe 513 connected to the glue injection head 512 filled with potting glue into the microcircuit module 511 to a position about 1 mm - 3 mm away from the surface of the first potting hole 201. The motor 507 is installed inside the housing 501 of the rotary potting device 50. The coupling 509 connects the rotating shaft 508 of the motor 507 to the rotary loading table 510, and start rotary potting. When the potting glue is flush with the first potting hole 201, the glue injection head 512 stops injecting glue. Observe the first potting hole 201 of the microcircuit module 511. When voids appear in the first potting hole 201, continue to inject glue until no more voids appear in the first potting hole 201 and then stop potting. After potting is completed, the potting quality can be monitored by weight measurement in the process and then the subsequent baking and curing of the potting glue can be carried out. The potting glue collection channel 506 can collect the excess potting glue splashed during rotary potting and is also convenient for cleaning the potting glue after rotary potting.

[0060] Facing the challenge of the increasingly complex assembly structure of the PCB board and components inside the microcircuit module, the rotary potting process system in the present invention completely solves the potting problem of high thermal conductivity, high insulation, and high viscosity potting glue, can achieve batch production, has excellent potting quality, ensures the potting effect of the microcircuit module, and eliminates inferior products; The microcircuit module products potted using this rotary potting process system have been widely applied in large quantities in high-tech fields such as aerospace, with stable and reliable quality, and can be extended to other fields.

[0061] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0062] The above-described embodiments merely represent several implementation manners of the present invention. The description thereof is relatively specific and detailed, but it should not be construed as a limitation on the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can still be made, and these all fall within the protection scope of the present invention. Therefore, the protection scope of the present invention patent shall be subject to the appended claims.

Claims

1. A rotary potting process for a microcircuit module, characterized in that, The steps include: Provide a PCB board, on which there are potting through-holes, and the transverse cross-section of the potting through-holes is rectangular; Provide an aluminum alloy cover plate and a U-shaped shell surface, and there are potting holes on both the aluminum alloy cover plate and the U-shaped shell surface, and there is no component layout at the position of the PCB board where the potting holes are located; Provide a rotary potting device, which includes a rotatable rotary carrier table and a glue injection head. There is a rotary carrier tooling containing a stop block and a counterweight block on the rotary carrier table, and after assembling the PCB board, the aluminum alloy cover plate and the U-shaped shell surface, place them in the rotary carrier tooling; Rotate the rotary carrier table, and the glue injection head injects potting glue into the microcircuit module through the potting holes to complete the potting of the microcircuit module.

2. The rotary potting process according to claim 1, wherein The potting through-holes are arranged in the middle of the PCB board.

3. The rotary potting process according to claim 1, wherein, The aperture size of the potting holes is 3-5 mm.

4. The rotary potting process according to claim 1, characterized in that, The potting holes are arranged at the geometric center positions of the aluminum alloy cover plate and / or the U-shaped shell surface.

5. The rotary potting process according to claim 1, wherein The rotary potting device includes a rotating mechanism, and the rotating mechanism is arranged below the rotary carrier table and is used to drive the rotary carrier table to rotate.

6. The rotary potting process according to claim 5, wherein, The rotating mechanism includes a motor, a rotating shaft extends from the motor, and a coupling is connected to the end of the rotating shaft away from the motor, and the coupling is connected to the rotary carrier table.

7. The rotary potting process according to claim 5, wherein, There is a partition plate below the rotary carrier table, and a potting glue collecting channel is arranged on the surface of the partition plate.

8. The rotary potting process according to claim 1, wherein, The glue outlet end of the glue injection head is connected with a drainage pipe, and the potting glue is injected into the potting holes through the drainage pipe.

9. The rotary potting process according to claim 8, characterized in that, The drainage pipe is a syringe needle, and the end of the syringe needle is located 1-3 mm away from the potting holes.

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