Signal transmission device and signal transmission circuit

Abstract

A signal transmission device has a signal-side electrode, a first signal line connected to one side of the signal-side electrode, a second signal line connected to the other side of the signal-side electrode, a power supply-side electrode connected to the signal-side electrode via an electronic component including at least an inductive component, and a capacitive coupling portion that capacitively couples the power supply-side electrode and a ground wiring or a power supply wiring, the first signal line, the signal-side electrode, and the second signal line forming a transmission path that transmits an electric signal, and the first signal line and the second signal line transmitting electric power via the signal-side electrode, the electronic component, and the power supply-side electrode.

Description

Technical Field

[0001] This invention relates to a signal transmission device and a signal transmission circuit. Background Technology

[0002] According to Patent Document 1, a coaxial cable is used to connect the monitoring circuit and the camera circuit, allowing the signal and power to overlap and be transmitted along the coaxial cable. A DC cutoff capacitor is placed near the transceiver IC along the signal line path. Furthermore, an active filter is inserted at the connection point with the signal line on the power line to separate the signal and power according to the filter's frequency range.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: U.S. Patent Application Publication No. 2013 / 0187445 Summary of the Invention

[0006] The problem the invention aims to solve

[0007] It is difficult to extend the filter frequency range to the high-frequency side.

[0008] Technical means to solve the problem

[0009] The signal transmission device of the first aspect of the present invention includes: a signal side electrode; a first signal line connected to one side of the signal side electrode; a second signal line connected to the other side of the signal side electrode; a power supply side electrode paired with the signal side electrode and connected to the signal side electrode via an electronic component containing at least an inductive component; and a capacitive coupling portion that capacitively couples the power supply side electrode to a ground wire or a power supply wire, wherein the first signal line, the signal side electrode, and the second signal line form a transmission path for transmitting an electrical signal, and the first signal line and the second signal line preferably transmit power via the signal side electrode, the electronic component, and the power supply side electrode.

[0010] The signal transmission device according to a second aspect of the present invention comprises: a first electrode; a first signal line connected to one side of the first electrode; a second signal line connected to the other side of the first electrode; a second electrode; a third signal line connected to one side of the second electrode; a fourth signal line connected to the other side of the second electrode; a third electrode and a fourth electrode, which are paired with the first electrode and the second electrode and connected to the first electrode and the second electrode via electronic components containing at least an inductive component; and a first capacitive coupling portion that connects the third electrode and a ground wire. Or power supply wiring capacitive coupling; and a second capacitive coupling section that capacitively couples the fourth electrode to the ground wiring or the power supply wiring, the first signal line and the second signal line forming a first differential wiring, the third signal line and the fourth signal line forming a second differential wiring, the first differential wiring and the first electrode, and the second differential wiring and the second electrode forming a transmission path for transmitting electrical signals, the first differential wiring and the second differential wiring preferably transmitting power from the third electrode and the fourth electrode via the first electrode and the second electrode.

[0011] The effects of the invention

[0012] According to the present invention, the range of filter frequencies can be extended to the high-frequency side.

[0013] Other than those described above, the subject matter, structure, and effects will be made clear by the following description of the manner in which the invention is carried out. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the signal transmission device in the comparative example.

[0015] Figure 2 (A) and (B) are diagrams showing the equivalent circuit and impedance distribution of the signal transmission device in the comparative example.

[0016] Figure 3 This is a diagram showing the configuration of the signal transmission device in the first embodiment.

[0017] Figure 4 (A) and (B) are cross-sectional views of a printed circuit board in which filter components are disposed on a substrate according to the first embodiment.

[0018] Figure 5 (A) and (B) are diagrams showing the equivalent circuit of the signal transmission device in the first embodiment and the distribution of the S-parameters of the signal transmission device.

[0019] Figure 6 (A) and (B) represent the signal transmission characteristics (S) in the first embodiment. 21 ), Filter characteristics (S) 31(The image is shown.)

[0020] Figure 7 This is a perspective view showing the signal transmission device in the first embodiment.

[0021] Figure 8 This is a diagram showing the configuration of the signal transmission device in the second embodiment.

[0022] Figure 9 (A), (B), and (C) are graphs showing the change in the electric field of the signal transmission device in the second embodiment, and represent the signal transmission characteristics (S). 21 ), Filter characteristics (S) 31 (The image is shown.)

[0023] Figure 10 This is a diagram showing the configuration of the signal transmission device in the third embodiment.

[0024] Figure 11 This is a diagram showing the configuration of the signal transmission device in the fourth embodiment.

[0025] Figure 12 This is a diagram showing the configuration of the signal transmission device in the fifth embodiment.

[0026] Figure 13 This is a diagram showing the configuration of the signal transmission device in the sixth embodiment.

[0027] Figure 14 This is a diagram showing the configuration of the signal transmission device in the seventh embodiment.

[0028] Figure 15 This is a diagram showing the configuration of the signal transmission device in the eighth embodiment.

[0029] Figure 16 This is a diagram showing the circuit configuration of the signal transmission circuit in the 9th embodiment.

[0030] Figure 17 (A) and (B) are cross-sectional views of the printed circuit board in which filter components are disposed on the substrate of the 10th embodiment. Detailed Implementation

[0031] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. The following description and drawings are examples for illustrating the present invention, and appropriate omissions and simplifications have been made for clarity of explanation. The present invention may also be implemented in various other ways. Unless otherwise specified, the constituent elements may be singular or plural.

[0032] To facilitate understanding of the present invention, the positions, sizes, shapes, and extents of the constituent elements shown in the accompanying drawings may not represent their actual positions, sizes, shapes, and extents. Therefore, the present invention is not limited to the positions, sizes, shapes, and extents disclosed in the accompanying drawings.

[0033] When multiple constituent elements have the same or identical functions, different subscripts are sometimes assigned to the same symbols for explanation. However, when it is not necessary to distinguish these multiple constituent elements, the subscripts are sometimes omitted for explanation.

[0034] [Comparative Example]

[0035] Before describing this embodiment, a comparative example will be described.

[0036] Figure 1 This is a schematic diagram of the signal transmission device in the comparative example. The signal transmission device connects the signal line 1-1 (left side) and signal line 1-2 (right side) via a signal / power separation filter composed of filter components 2-1 to 2-3 to the power supply wiring 5. Signal lines 1-1 and 1-2 form the transmission path for transmitting electrical signals and connect to equipment such as communication LSIs. Filter component 2-1 is constructed by placing a PoC filter component between the signal-side electrode 3 and the power-side electrode 4. PoC is an abbreviation for Powerover Coaxial Cable. A PoC filter component is an electronic component that contains at least an inductive component. Filter components 2-2 to 2-3 have the same configuration, but mostly use PoC filter components of different sizes and characteristics. The signal-side electrode 3 of filter component 2-1 is connected to signal lines 1-1 and 1-2. The power-side electrode 4 of filter component 2-1 is connected to the power supply wiring 5 via filter components 2-2 to 2-3.

[0037] Figure 2 (A) represents the equivalent circuit of the signal transmission device. Figure 2 (B) represents the impedance distribution of the signal transmission device. Figure 2 In (B), the horizontal axis represents frequency and the vertical axis represents impedance.

[0038] like Figure 2 As shown in (A), the filter components are not represented by a simple inductor, but rather by a circuit in which a resistive component connected in series with the inductor, and subsequently a parasitic capacitive component connected in parallel with the inductor, are connected. That is, filter components 2-1 to 2-3 are parallel LC circuits. Figure 2 As shown in (B), the impedance distribution has a mountain-shaped shape, where the impedance reaches its maximum value at the anti-resonant frequency determined by the inductance L and the capacitance C. The impedance distributions of filter components 2-1 to 2-3 are L1 to L3, respectively, and the combined impedance distribution of the signal and power separation filter is L.

[0039] The function of the signal-to-power separation filter is to prevent energy transfer to the power supply line 5 by inserting a component with a sufficiently high impedance relative to the signal line 1 at the connection point with the power supply line 5. As a function of the signal-to-power separation filter, the filter frequency range (signal transmission frequency range) where signal energy exists needs to be an impedance greater than or equal to the reference impedance Z0. On the other hand, since the impedance of a single filter component cannot cover a wide frequency range, the filter frequency range is extended by using multiple components with different anti-resonant frequencies. Figure 2 (B) represents an example of extending the filter frequency range by using three filter components 2-1 to 2-3. By placing the filter component 2-1, which has the highest anti-resonance frequency, at the connection point with signal lines 1-1 and 1-2, high-frequency energy leakage is prevented.

[0040] However, in this comparative example, if the filter frequency range is to be extended to the high-frequency side, it is necessary to make use of components with high anti-resonance frequencies. However, in the construction of filter components 2-1 to 2-3, there are limitations to increasing the anti-resonance frequency. For example, it is difficult to construct the filter to a filter frequency range of 10 GHz.

[0041] According to the embodiments described below, such a signal transmission device can, for example, provide a structure for forming a signal and power separation filter corresponding to a high-speed signal of more than 10Gbps on a printed wiring substrate at low cost.

[0042] [First Implementation]

[0043] Figure 3 This is a diagram showing the configuration of the signal transmission device 100 in the first embodiment.

[0044] like Figure 3 As shown, signal lines 1-1 and 1-2 are formed on substrate 11 by printed wiring. These signal lines 1-1 and 1-2 form the transmission path for transmitting electrical signals and are wirings that connect to devices such as communication LSIs. A filter component 2-1 constituting a signal-to-power separation filter is connected between signal lines 1-1 and 1-2, and further, the filter component 2-1 is connected to power wiring 5. Power wiring 5 is connected to a power IC (not shown). In addition, in this embodiment and subsequent embodiments, for the sake of simplicity, the signal-to-power separation filter may sometimes only show filter component 2-1, but as needed, it may also include filter components 2-2 to 2-3 as shown in the comparative example.

[0045] The filter component 2-1 includes a signal-side electrode 3 and a power-side electrode 4, which is paired with the signal-side electrode 3 and connected to the signal-side electrode 3 via an electronic component 2 containing at least an inductive component. Signal line 1-1 is connected to one side of the signal-side electrode 3, and signal line 1-2 is connected to the other side of the signal-side electrode 3. On the power-side electrode 4, electrode patterns 6-1 and 6-2 are connected to both sides of the power-side electrode 4 via wiring patterns 7-1 and 7-2 that are finer than electrode patterns 6-1 and 6-2, respectively.

[0046] Signal lines 1-1 and 1-2 are connected to power wiring 5 via signal-side electrode 3, electronic component 2, and power-side electrode 4. Thus, power from the power supply IC is transmitted via power wiring 5, power-side electrode 4, signal-side electrode 3, and electronic component 2 to transmission signal lines 1-1 and 1-2, and then supplied to LSI or other devices that serve as their connection destinations via transmission signal lines 1-1 and 1-2. In other words, transmission signal lines 1-1 and 1-2 transmit power between the power supply IC and the connected device via signal-side electrode 3, electronic component 2, and power-side electrode 4.

[0047] A filter component 2-1, consisting of a signal-side electrode 3, an electronic component 2, and a power-side electrode 4, is disposed on the grounding wiring removal portion 9 of the substrate 11. On the other hand, electrode patterns 6-1 and 6-2 provided on both sides of the power-side electrode 4 and the grounding wiring 8-1 of the substrate 11 (see reference) Figure 4 The electrodes 6-1 and 6-2 are configured in a relative manner. Specifically, the electrode patterns 6-1 and 6-2 function as capacitor coupling portions 6 that capacitively couple the power supply electrode 4 and the ground wiring 8-1. In other words, the capacitor coupling portion 6 includes a first capacitor coupling portion (electrode pattern 6-1) and a second capacitor coupling portion (electrode pattern 6-2). Furthermore, the first capacitor coupling portion is located outside the connection point a between the signal side electrode 3 and the signal line 1-1, capacitively coupling the power supply electrode 4 and the ground wiring 8-1. The second capacitor coupling portion is located outside the connection point b between the signal side electrode 3 and the signal line 1-2, capacitively coupling the power supply electrode 4 and the ground wiring 8-1.

[0048] Figure 4 This is a cross-sectional view showing the state in which filter component 2-1 is disposed on substrate 11. Figure 4 (A) represents its side view. Figure 4 (B) indicates its rear view. Figure 4 (A) is Figure 3 Cross-sectional view of the XX line, Figure 4 (B) is Figure 3 A cross-sectional view of the YY line.

[0049] Substrate 11 is a multilayer wiring substrate. The surface of substrate 11 is the mounting surface for filter component 2-1, and a ground wiring layer 8-1 is located directly beneath it. Figure 4 Example (A) describes an example where a grounding cabling layer 8-2 is also provided below the grounding cabling layer 8-1, but this layer can also be a signal layer. For example... Figure 4 As shown in (A), a grounding wire removal part 9 is provided directly below the signal side electrode 3, electronic component 2, and power supply side electrode 4 to prevent the generation of unwanted parasitic capacitance.

[0050] On the other hand, such as Figure 4 As shown in (B), a grounding wiring layer 8-1 is located directly below the electrode patterns 6-1 and 6-2 on both sides of the power supply side electrode 4. That is, the electrode patterns 6-1 and 6-2 and the grounding wiring layer 8-1 form a parallel plate, which functions as a capacitive coupling part 6.

[0051] Figure 5 (A) represents the equivalent circuit of the signal transmission device 100. Figure 5 (B) represents the S-parameter distribution of the signal transmission device 100. Figure 5 In (B), the horizontal axis represents frequency, and the vertical axis represents S-parameters.

[0052] In this embodiment, such as Figure 5 As shown in (A), a capacitive coupling portion 6 is added to the power supply side electrode 4 of the primary filter component 2-1. This prevents the inflow of high-frequency current leaking to the power supply side via the parasitic capacitance of the filter component 2-1, thereby widening the filter performance.

[0053] According to this embodiment, such as Figure 5 As shown in (B), by adding the capacitive coupling part 6 to the power supply side electrode 4 of the primary filter part 2-1, even compared with the comparative example, the signal transmission characteristics (S) are improved. 21 It also has almost no effect. Furthermore, compared to the comparison example, the filter characteristics (S) are... 31 It can be extended to the high-frequency range of filters.

[0054] Figure 6 (A) represents the signal transmission characteristic (S) 21 (The image) Figure 6 (B) represents the filter characteristics (S) 31 (Image of a diagram.) Figure 6 As shown in (A), according to this embodiment, by adding the capacitive coupling portion 6 to the power supply side electrode 4 of the primary filter component 2-1, the signal passes through characteristic (S) 21 It has almost no impact. And, as... Figure 6 As shown in (B), the filter characteristics (S) can be confirmed. 31 There is a tendency for improvement.

[0055] Figure 7This is a perspective view showing the signal transmission device 100 in this embodiment.

[0056] like Figure 7 As shown, a parallel plate-type capacitor is formed by aligning electrode patterns 6-1 and 6-2 with the ground wiring 8, thus realizing the capacitive coupling section 6. Although electrode pattern 6-1 is omitted from the illustration, electrode patterns 6-1 and 6-2 are connected to both sides of the power supply side electrode 4 via wiring patterns 7-1 and 7-2 that are thinner than electrode patterns 6-1 and 6-2. The capacitance added by providing the capacitive coupling section 6 is approximately 0.1 pF to several pF, which helps improve the filter performance in the 10 GHz band. In addition, it is preferable that the positions of electrode patterns 6-1 and 6-2 are close to the signal lines 1-1 and 1-2, respectively. Furthermore, it is preferable that the electrode patterns 6-1 and 6-2 provided on both sides of the power supply side electrode 4 are symmetrical. The reasons for these configurations will be explained in the second embodiment with the results of electromagnetic field analysis.

[0057] According to this embodiment, the range of filter frequency can be extended to the high-frequency side, and the capacitive coupling part 6 can be formed only by the pattern wiring of the substrate 11. In addition, since the pattern wiring is very small, it has almost no impact on the area of ​​the substrate 11 and does not increase the additional cost.

[0058] [Second Implementation]

[0059] Reference Figure 8 , Figure 9 The second embodiment will be described below. The same symbols are used to mark the same parts as in the first embodiment, and their descriptions are omitted. In the first embodiment, electrode patterns 6-1 and 6-2 are provided on both sides of the power supply side electrode 4, but in the second embodiment, electrode patterns 6-1, 6-2, 6-3, and 6-4 are provided on both sides of the power supply side electrode 4. This further improves the filter performance.

[0060] If the size of the electrode pattern in the capacitive coupling section 6 is increased to improve the characteristics in the high-frequency region, resonance corresponding to the size of the electrode pattern will occur. Therefore, it is preferable to provide multiple small electrode patterns. Thus, in the second embodiment, as... Figure 8 As shown, two electrode patterns 6-1, 6-2, 6-3, and 6-4 are arranged on each side of the power supply electrode 4, for a total of four. Furthermore, by connecting electrode patterns 6-1, 6-2, 6-3, and 6-4 to the grounding wiring 8-1 (see reference...) Figure 4 In contrast, a parallel plate-type capacitor is formed to realize the capacitive coupling part 6. In addition, the electrode pattern is not limited to 4, and more electrode patterns can be provided.

[0061] Figure 9(A) is a graph showing the change in the electric field when a high-frequency current flows through signal lines 1-1 and 1-2 in this embodiment. The change in the electric field E, obtained analytically from the electromagnetic field, is represented by a dashed line.

[0062] When the current flowing through signal lines 1-1 and 1-2 reaches the signal-side electrode 3, a disturbance in the electric field E is generated. This is because the presence of the signal-side electrode 3 causes a significant change in the wiring width. Furthermore, a grounding wire removal section 9 is provided directly below the signal-side electrode 3 for impedance matching, thus the return current becomes discontinuous. This disturbance in the electric field E couples with the nearest power-side electrode 4, causing leakage of high-frequency current. To allow this leakage current to immediately flow into the grounding wire, capacitive coupling sections 6 at both ends are effective. Since the high-frequency current on signal lines 1-1 and 1-2 flows bidirectionally and couples on both sides of the power-side electrode 4, the capacitive coupling sections 6 need to be symmetrically arranged on both sides of the power-side electrode 4. Additionally, due to the coupling from the signal-side electrode 3, it is preferable that the capacitive coupling sections 6 of the power-side electrode 4 are located on the signal lines 1-1 and 1-2. For example, as shown in the first embodiment, when there are two electrode patterns 6-1 and 6-2, such as... Figure 3 As shown, electrode patterns 6-1 and 6-2 are positioned on the signal lines 1-1 and 1-2. When there are multiple electrode patterns, they should also be positioned on the signal lines 1-1 and 1-2 as much as possible.

[0063] Figure 9 (B) represents the signal transmission characteristic (S) 21 (The image) Figure 9 (C) represents the filter characteristics (S) 31 (The image is shown.)

[0064] like Figure 9 As shown in (B), according to this embodiment, by forming a capacitive coupling section 6 from multiple electrode patterns, the signal transmission characteristic (S) 21 It has almost no impact. And, as... Figure 9 As shown in (C), the filter characteristics (S) can be confirmed. 31 There is a tendency for improvement.

[0065] [Third Implementation]

[0066] Reference Figure 10 The third embodiment will be described. The same symbols will be used to mark the same parts as in the first embodiment, and their descriptions will be omitted.

[0067] In this embodiment, the capacitive coupling portion 6 is formed by expanding the width W of the power supply side electrode 4. The width W of the power supply side electrode 4 is larger than the width of the grounding wiring removal portion 9. As a result, the two ends of the power supply side electrode 4 that overlap with the grounding wiring are opposite to the grounding wiring, thus forming a parallel plate type capacitor and forming the capacitive coupling portion 6 (6-5, 6-6).

[0068] By expanding its width W only by about 10% compared to the size of the power supply electrode 4, a capacitance of about 0.1 to 0.3 pF can be formed, thus achieving a significant effect with a simple configuration. The signal side electrode 3 is designed to be housed within the width of the grounding wiring removal portion 9. In other words, the width W of the power supply electrode 4 is made larger than the width of the signal side electrode 3. Furthermore, the length of the filter component 2-1 in the longitudinal direction is the same as in the first embodiment.

[0069] [Fourth Implementation]

[0070] Reference Figure 11 The fourth embodiment will be described. The same symbols will be used to mark the same parts as in the first embodiment, and their descriptions will be omitted.

[0071] In this embodiment, such as Figure 11 As shown, the widths of the power supply side electrode and the signal side electrode 3 are the same as in the first embodiment, but the width of the grounding wire removal portion 9 directly below the power supply side electrode 4 is narrower than that of the grounding wire removal portion 9 directly below the signal side electrode 3. Therefore, the two ends 6-5 and 6-6 of the power supply side electrode 4, which overlap with the grounding wire, face the grounding wire, thus forming a parallel plate-type capacitor and a capacitive coupling portion 6. The signal side electrode 3 is set to be sized to fit within the width of the grounding wire removal portion 9. Furthermore, the length of the filter component 2-1 in the longitudinal direction is the same as in the first embodiment.

[0072] According to this embodiment, significant results can be achieved simply by focusing on the grounding wiring.

[0073] [Fifth Implementation]

[0074] Reference Figure 12 The fifth embodiment will be described. The same symbols will be used to mark the same parts as in the first embodiment, and their descriptions will be omitted.

[0075] In this embodiment, similar to the third embodiment, the capacitive coupling portion 6 is formed by increasing the size of the power supply side electrode 4. In this case, the power supply side electrode 4 is made into a trapezoidal shape by widening the area of ​​the side of the power supply side electrode 4 closest to the signal lines 1-1 and 1-2. The wide portions 6-5 and 6-6 of the trapezoid of the power supply side electrode 4 are larger than the width of the removed portion 9 of the ground wiring. As a result, the wide portions 6-5 and 6-6 of the power supply side electrode 4 that overlap with the ground wiring are opposite to the ground wiring, thus forming a parallel plate type capacitor, thereby forming the capacitive coupling portion 6.

[0076] According to this embodiment, significant effects can be achieved by simply configuring the power supply side electrode 4 into a trapezoidal shape.

[0077] [Sixth Implementation]

[0078] Reference Figure 13 The sixth embodiment will be described. The same symbols will be used to mark the same parts as in the first embodiment, and their descriptions will be omitted.

[0079] In this embodiment, similar to the third embodiment, the capacitive coupling portion 6 is formed by increasing the size of the power supply side electrode 4. In this case, protrusions 6-5 and 6-6 are formed on the power supply side electrode 4 such that the area of ​​the power supply side electrode 4 near the signal lines 1-1 and 1-2 is widened. The protrusions 6-5 and 6-6 of the power supply side electrode 4 are larger than the width of the grounding wire removal portion 9. As a result, the protrusions 6-5 and 6-6 of the power supply side electrode 4, which overlap with the grounding wire, are opposite to the grounding wire, thus forming a parallel plate-type capacitor and creating the capacitive coupling portion 6.

[0080] According to this embodiment, significant effects can be achieved by simply configuring the power supply side electrode 4 as protrusions 6-5 and 6-6.

[0081] [Seventh Implementation]

[0082] Reference Figure 14 The seventh embodiment will be described. The same symbols will be used to mark the same parts as in the first embodiment, and their descriptions will be omitted.

[0083] In this embodiment, the signal transmission device 100 is utilized in the power overlay of the differential signal line. For example, PoDL (Power over Data Line) is used in this way.

[0084] A filter component 21, consisting of a signal-side electrode 3-1, an electronic component 2-1, and a power-side electrode 4-1, is disposed on the grounding wiring removal portion 9-1 of the substrate 11. Furthermore, the signal-side electrode 3-1 is connected to the P-side wirings 1-1 and 1-2. Electrode patterns 6-1 and 6-2 provided on both sides of the power-side electrode 4-1 are connected to the grounding wiring 8-1 of the substrate 11 (see reference). Figure 4 The electrodes 6-1 and 6-2 are configured in a relative manner. That is, the electrode patterns 6-1 and 6-2 function as capacitor coupling parts 6 that capacitively couple the power supply side electrode 4-1 and the ground wiring 8-1.

[0085] A filter component 22, consisting of a signal-side electrode 3-2, an electronic component 2-2, and a power-side electrode 4-2, is disposed on the ground wiring removal portion 9-2 of the substrate 11. Furthermore, the signal-side electrode 3-2 is connected to the N-side wirings 1-3 and 1-4. Electrode patterns 6-3 and 6-4 provided on both sides of the power-side electrode 4-2 are connected to the ground wiring 8-1 of the substrate 11 (see reference). Figure 4 The electrodes 6-3 and 6-4 are configured in a relative manner. That is, the electrode patterns 6-3 and 6-4 function as capacitive coupling parts 6 that couple the power supply side electrode 4-2 and the ground wiring capacitor.

[0086] According to this embodiment, the signal transmission device 100 can be used for power supply overlap of differential signal lines.

[0087] [Eighth Implementation]

[0088] Reference Figure 15 The eighth embodiment will be described. The same symbols will be used to mark the same parts as in the first embodiment, and their descriptions will be omitted.

[0089] This embodiment is an example corresponding to PoDL for differential wiring at higher frequencies. At higher frequencies, if separate filter components are used in the P-side wiring 1-1, 1-2 and the N-side wiring 1-3, 1-4, common-mode components may be generated due to the poor inter-component characteristics caused by the deviation of the filter components. Therefore, a single filter component 10 with 4 terminals is utilized.

[0090] like Figure 15 As shown, the device includes a first signal line 1-1 connected to one side of the first electrode 3-1 and a second signal line 1-2 connected to the other side of the first electrode 3-1. Furthermore, it includes a third signal line 1-3 connected to one side of the second electrode 3-2 and a fourth signal line 1-4 connected to the other side of the second electrode 3-2. The first signal line 1-1 and the second signal line 1-2 are P-side wirings. The third signal line 1-3 and the fourth signal line 1-4 are N-side wirings.

[0091] The single filter component 10 has a third electrode 4-1 and a fourth electrode 4-2, which are paired with the first electrode 3-1 and the second electrode 3-2 and connected to the first electrode 3-1 and the second electrode 3-2 via electronic components that include at least an inductive component.

[0092] A single filter component 10 is disposed on the grounding wiring removal section 9. Furthermore, it includes first capacitor coupling sections 6-1 and 6-2 that capacitively couple the third electrode 4-1 to the grounding wiring, and second capacitor coupling sections 6-3 and 6-4 that capacitively couple the fourth electrode 4-2 to the grounding wiring. The first capacitor coupling sections 6-1 and 6-2, located on both sides of the third electrode 4-1, are connected to the grounding wiring 8-1 of the substrate 11 (see reference). Figure 4 The third electrode 4-1 and the ground wiring capacitor are coupled relative to each other. The second capacitor coupling parts 6-3 and 6-4, which are provided on both sides of the fourth electrode 4-2, are coupled to the ground wiring 8-1 of the substrate 11 (see reference). Figure 4 In a relative configuration, the fourth electrode 4-2 is coupled to the ground wiring capacitor.

[0093] Signal line 1-1 and signal line 1-2 constitute the first differential wiring, and signal line 1-3 and signal line 1-4 constitute the second differential wiring. Furthermore, the first differential wiring and electrode 3-1, and the second differential wiring and electrode 3-2 form a transmission path for transmitting electrical signals, and the first and second differential wiring transmit power from electrode 4-1 and electrode 4-2 via electrode 3-1 and electrode 3-2.

[0094] In this embodiment, a single filter element 10 is used as an example for explanation, but multiple single filter elements 10 can also be connected in series and connected to power supply wirings 5-1 and 5-2. In this case, the primary single filter element 10 connected to the first differential wiring and the second differential wiring has first capacitive coupling portions 6-1 and 6-2 and second capacitive coupling portions 6-3 and 6-4, but the subsequent single filter elements 10 do not have capacitive coupling portions.

[0095] According to this embodiment, since a single filter component 10 is used, the common-mode component caused by the difference in characteristics between components due to the deviation of the components can be suppressed compared with the use of multiple filter components 10.

[0096] [Ninth Implementation]

[0097] Figure 16 This is a diagram showing the circuit configuration of the signal transmission circuit 1000. The signal transmission circuit 1000 in this embodiment uses the signal transmission device 100 described in embodiments 1 to 8.

[0098] like Figure 16As shown, the signal transmission circuit 1000 is configured to connect the camera unit 19 and the ECU module 20 via a coaxial cable 18. Power is supplied from the ECU module 20 to the camera unit 19 via the coaxial cable 18, and signals are transmitted at high speed mainly from the camera unit 19 to the ECU module 20 via the coaxial cable 18.

[0099] The camera unit 19 includes a camera 16, an image IC 13-1, a serializer 14, and a capacitor 12-1. Image data captured by the camera 16 is processed by the image IC 13-1, converted into serial data by the serializer 14, and transmitted to the coaxial cable 18 via the DC-DC cutoff capacitor 12-1. Meanwhile, power supplied via the coaxial cable 18 is supplied to the DC-DC converter 17-1 via the signal transmission device 100. The DC-DC converter 17-1 supplies power to the camera 16, the image IC 13-1, and the serializer 14. The signal transmission device 100 includes the capacitive coupling unit 6 shown in the above embodiments.

[0100] The ECU module 20 includes a capacitor 12-2, a serial-to-parallel converter 15, and a control IC 13-2. Signals transmitted to the ECU module 20 are transmitted to the serial-to-parallel converter 15 via the DC-DC cutoff capacitor 12-2, converted into parallel data by the serial-to-parallel converter 15, and input to the control IC 13-2. On the other hand, the DC-DC converter 17-2 receives power from a battery or the like and supplies a specified power supply to the coaxial cable 18 via the signal transmission device 100. The signal transmission device 100 includes the capacitive coupling section 6 shown in the above embodiments.

[0101] According to this embodiment, since a signal transmission device 100 with a capacitive coupling unit 6 is used in both the camera unit 19 and the ECU module 20, high-speed communication corresponding to a PoC of 10Gbps can be achieved, for example.

[0102] [10th Implementation]

[0103] Figure 17 This is a cross-sectional view showing the state in which filter component 2-1 is disposed on substrate 11. Figure 17 (A) represents its side view. Figure 17 (B) indicates its rear view. Regarding... Figure 4 The same parts shown in the first embodiment are marked with the same symbols, and their descriptions are omitted. The structure of the substrate 11 with the multilayer wiring structure is different from that in the first embodiment.

[0104] like Figure 17As shown in (A), the surface of the substrate 11 is the mounting surface of the filter component 2-1, and a power wiring layer 23 is provided directly below it. Furthermore, a ground wiring layer 8 is provided below the power wiring layer 23. In the case of this multi-layer wiring structure of the substrate 11, since the power wiring layer 23 and the ground wiring layer 8 are very large parallel plates with capacitance, it is equivalent to a low-impedance connection at high frequencies. In this type of substrate 11, even if a power wiring removal portion 9 is provided directly below the filter component 2-1, the same effect as described in the first embodiment can be obtained.

[0105] like Figure 17 As shown in (B), a power wiring layer 23 is located directly below the electrode patterns 6-1 and 6-2 provided on both sides of the power supply side electrode 4. That is, the electrode patterns 6-1 and 6-2 and the power wiring layer 23 form a parallel plate, which functions as a capacitive coupling part 6.

[0106] This embodiment can be applied not only to the first embodiment, but also to the second to ninth embodiments.

[0107] According to this embodiment, a signal transmission device 100 covering a frequency range exceeding 10 GHz, which is difficult to achieve using only a combination of filter components, can be realized. Furthermore, since it can be constructed using only patterned wiring on a printed wiring board, high performance can be achieved at low cost and high density. Such a signal transmission device 100 can be applied to various product fields, such as communication between cameras and control units in vehicle-mounted equipment, and other information devices and infrastructure control devices that transmit power over overlapping on signal lines.

[0108] The following effects can be obtained by implementing the methods described above.

[0109] (1) The signal transmission device 100 includes: a signal-side electrode 3; a first signal line 1-1 connected to one side of the signal-side electrode 3; a second signal line 1-2 connected to the other side of the signal-side electrode 3; a power-side electrode 4 paired with the signal-side electrode 3 and connected to the signal-side electrode 3 via an electronic component 2 containing at least an inductive component; and a capacitive coupling section 6 that capacitively couples the power-side electrode 4 to ground wiring 8-1, 8-2 or power wiring 23. The first signal line 1-1, the signal-side electrode 3, and the second signal line 1-2 form a transmission path for transmitting electrical signals, and the first signal line 1-1 and the second signal line 1-2 transmit power via the signal-side electrode 3, the electronic component 2, and the power-side electrode 4. This allows the range of filter frequencies to be extended to the high-frequency side.

[0110] (2) The signal transmission device 100 includes a first electrode 3-1; a first signal line 1-1 connected to one side of the first electrode 3-1; a second signal line 1-2 connected to the other side of the first electrode 3-1; a third signal line 1-3 connected to one side of the second electrode 3-2; a fourth signal line 1-4 connected to the other side of the second electrode 3-2; a third electrode 4-1 and a fourth electrode 4-2, which are paired with the first electrode 3-1 and the second electrode 3-2 and connected to the first electrode 3-1 and the second electrode 3-2 via electronic components containing at least an inductive component; and first capacitive coupling portions 6-1 and 6-2, which... The third electrode 4-1 is capacitively coupled to the ground or power supply wiring; and the second capacitive coupling parts 6-3 and 6-4 capacitively couple the fourth electrode 4-2 to the ground or power supply wiring. The first signal line 1-1 and the second signal line 1-2 form a first differential wiring, and the third signal line 1-3 and the fourth signal line 1-4 form a second differential wiring. The first differential wiring and the first electrode 3-1, and the second differential wiring and the second electrode 3-2 form a transmission path for transmitting electrical signals. The first differential wiring and the second differential wiring transmit power from the third electrode 4-1 and the fourth electrode 4-2 via the first electrode 3-1 and the second electrode 3-2. Therefore, the filter frequency range can be extended to the high-frequency side.

[0111] This invention is not limited to the embodiments described above. Other embodiments that can be considered within the scope of the technical concept of this invention, as long as they do not impair the characteristics of this invention, are also included within the scope of this invention. Additionally, it may be a combination of the embodiments described above.

[0112] Symbol Explanation

[0113] 1-1, 1-2… Signal lines, 2, 2-1, 2-2, 2-3… Filter components (electronic components), 3, 3-1, 3-2… Signal side electrodes, 4, 4-1, 4-2… Power side electrodes, 5… Power wiring, 6-1, 6-2, 6-3, 6-4… Electrode patterns, 6, 6-5, 6-6… Capacitor coupling parts, 7-1, 7-2… Wiring patterns, 8-1, 8-2… Ground wiring, 9… Removal part of ground wiring or power wiring, 11… Substrate, 12-1, 12-2… Capacitors, 13-1… Image IC, 13-2… Control IC, 14… Serializer, 15… Serial-to-parallel converter, 16… Camera, 18… Coaxial cable, 19… Camera unit, 20… ECU module, 22… Filter components, 23… Power wiring, 100… Signal transmission device, 1000… Signal transmission circuit.

Claims

1. A signal transmission device, characterized in that, have: One or more filter components are disposed on a substrate and each has a signal-side electrode, an electronic component that includes at least an inductive component, and a power-side electrode connected to the signal-side electrode via the electronic component. The first signal line is connected to one side of the signal-side electrode of the filter component; The second signal line is connected to the other side of the signal-side electrode of the filter component; the electrode pattern is connected to the power-side electrode of the filter component, and the electrode pattern is disposed on the substrate at a position opposite to the ground wiring or power wiring disposed in the substrate. The electrode pattern couples the power supply side electrode to the ground wiring or the power supply wiring capacitor. The first signal line, the signal-side electrode of the filter component, and the second signal line form a transmission path for transmitting electrical signals. The first signal line or the second signal line transmits power via the respective signal-side electrodes of the filter component, the electronic component, and the power-side electrodes.

2. The signal transmission device according to claim 1, characterized in that, The electrode pattern has the following characteristics: A first capacitive coupling portion is disposed outside the connection point between the signal-side electrode and the first signal line of the filter component; and The second capacitive coupling portion is disposed outside the connection point between the signal-side electrode and the second signal line of the filter component.

3. The signal transmission device according to claim 1, characterized in that, The electrode pattern is connected to the power-side electrode via a wiring pattern that is thinner than the electrode pattern itself.

4. The signal transmission device according to any one of claims 1 to 3, characterized in that, The first signal line and the second signal line form a differential wiring.

5. A signal transmission device, comprising: One or more filter components are disposed on a substrate and each has a signal-side electrode, an electronic component that includes at least an inductive component, and a power-side electrode connected to the signal-side electrode via the electronic component. The first signal line is connected to one side of the signal-side electrode of the filter component; The second signal line is connected to the other side of the signal-side electrode of the filter component; as well as A capacitive coupling portion is disposed in the power supply side electrode of the filter component and is the portion opposite to the ground wiring or power supply wiring in the substrate; The capacitive coupling section couples the power supply side electrode to the ground wiring or the power supply wiring capacitor. The first signal line, the signal-side electrode of the filter component, and the second signal line form a transmission path for transmitting electrical signals. The first signal line or the second signal line transmits power via the respective signal-side electrodes of the filter component, the electronic component, and the power-side electrodes.

6. The signal transmission device according to claim 5, characterized in that, The capacitive coupling portion is formed by making the width of the power supply side electrode of the filter component larger than the width of the signal side electrode.

7. The signal transmission device according to claim 5, characterized in that, The capacitive coupling section is formed by shaping the power supply side electrode of the filter component into a trapezoid with a widened wiring side for the first signal line and the second signal line.

8. The signal transmission device according to claim 5, characterized in that, The capacitive coupling portion is formed by protrusions that widen on both sides of the power supply side electrode of the filter component and on the wiring side of the first signal line and the second signal line.

9. The signal transmission device according to any one of claims 5 to 8, characterized in that, The first signal line and the second signal line form a differential wiring.

10. A signal transmission device, characterized in that, have: Electrode 1; The first signal line is connected to one side of the first electrode; The second signal line is connected to the other side of the first electrode; the second electrode; The third signal line is connected to one side of the second electrode; The fourth signal line is connected to the other side of the second electrode; the third and fourth electrodes are paired with the first and second electrodes respectively and are connected to the first and second electrodes respectively via electronic components containing at least an inductive component; The first electrode pattern connected to the third electrode is capacitively coupled to a grounding wire or power supply wire disposed within the substrate. The first electrode pattern is disposed on the substrate at a position opposite to the grounding wire or power supply wire disposed within the substrate. Alternatively, it can be a first capacitive coupling portion of the third electrode, the portion opposite to the grounding wire or power supply wire, capacitively coupled to the grounding wire or power supply wire. The second electrode pattern connected to the fourth electrode is capacitively coupled to the ground wiring or the power wiring. The second electrode pattern is disposed on the substrate at a position opposite to the ground wiring or the power wiring disposed within the substrate. Alternatively, it can be a second capacitive coupling portion of the fourth electrode that is opposite to the ground wiring or the power wiring, and is capacitively coupled to the ground wiring or the power wiring. The first signal line and the second signal line constitute the first differential wiring. The third signal line and the fourth signal line constitute the second differential wiring. The first differential wiring and the first electrode, and the second differential wiring and the second electrode form a transmission path for transmitting electrical signals, wherein the first differential wiring or the second differential wiring transmits power from the third electrode and the fourth electrode via the first electrode and the second electrode.

11. A signal transmission circuit that connects a camera and an ECU module via a coaxial cable. The signal transmission circuit is characterized in that... Power is supplied to the camera from the ECU module via the coaxial cable. Signal communication is conducted between the camera and the ECU module via the coaxial cable. The signal transmission circuit is mounted on the substrate of at least one of the camera and the ECU module, and includes a signal transmission device according to any one of claims 1 to 9 for performing the signal communication and the power supply.

Images