Hot melt adhesive die cutting process

Abstract

The application discloses a hot melt adhesive die cutting process, which comprises first compounding, second compounding, single punching, third compounding and compound cutting. Compared with general processes, the new hot melt adhesive die cutting process performs hot pressing on each layer of hot melt adhesive according to the characteristics of the hot melt adhesive and finally performs die cutting. The first semi-finished product and the second semi-finished product are assembled and then hot pressed firmly by using full activation temperature, and the compounding of the first semi-finished product and the second semi-finished product by using semi-activation temperature does not affect the activity of the hot melt adhesive, so that the bonding strength is not affected when full activation hot pressing is performed. Then, the third semi-finished product and the hot pressed first semi-finished product and second semi-finished product are assembled together, and the third semi-finished product and the hot pressed first semi-finished product and second semi-finished product are hot pressed by using semi-activation temperature. The compounding by using the process can reduce the process failure rate, effectively reduce the loss, and improve the customer use effect while reducing the cost.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of die cutting process, in particular to a hot melt adhesive die cutting process. BACKGROUND

[0002] With the development of the intelligent terminal industry, the functions of intelligent terminal products are becoming more and more powerful, and the requirements for the performance of the equipment in all aspects are also becoming higher and higher. Hot melt adhesive is increasingly applied to the internal structure of the equipment due to its excellent performance, but the die cutting process of hot melt adhesive has not been greatly improved. At present, the process yield is low, the loss is large, and the customer use effect is not good. SUMMARY

[0003] According to one aspect of the present application, a hot melt adhesive die cutting process is provided, comprising the following steps,

[0004] First compounding, hot melt compounding the first film material and the first hot melt adhesive at a semi-activation temperature, and punching off the inner hole of the compounded first film material and first hot melt adhesive, and then compounding the screen onto the first hot melt adhesive at a semi-activation temperature to obtain a first semi-finished product;

[0005] Second compounding, hot melt compounding the second film material and the second hot melt adhesive at a semi-activation temperature to obtain a second semi-finished product, and punching off the inner hole of the second semi-finished product;

[0006] Single punching, punching the inner hole of the third hot melt adhesive to obtain a third semi-finished product;

[0007] Third compounding, assembling the first semi-finished product and the second semi-finished product, and then hot melt compounding at a full activation temperature;

[0008] Compound cutting, assembling the third semi-finished product with the compounded first semi-finished product and second semi-finished product, and then hot melt compounding at a semi-activation temperature; cutting the shape of the compounded first semi-finished product, second semi-finished product and third semi-finished product to obtain a finished product.

[0009] The application provides a novel hot melt adhesive die cutting process. Compared with a general process, the novel hot melt adhesive die cutting process respectively performs hot pressing on each layer of hot melt adhesive according to the characteristics of the hot melt adhesive and finally performs die cutting. The first hot melt adhesive needs to firmly bond the first hot melt adhesive and the screen, and the second hot melt adhesive needs to respectively firmly bond the screen and the second film material, so the three semi-finished products need to be die cut during die cutting. The first film material and the first hot melt adhesive are compounded by using a semi-activation temperature, the inner hole is punched, and then the screen is compounded to the first hot melt adhesive by using a semi-activation temperature to obtain a first semi-finished product. In the same way, the second film material and the second hot melt adhesive are compounded by using a semi-activation temperature, and then the inner hole is punched to obtain a second semi-finished product. Then, the third hot melt adhesive inner hole is punched alone to obtain a third semi-finished product. The first semi-finished product and the second semi-finished product are assembled, and then the two semi-finished products are firmly hot pressed by using a full-activation temperature. Because the first semi-finished product and the second semi-finished product are compounded by using a semi-activation temperature, the activity of the hot melt adhesive is not affected, so the bonding strength is not affected during full-activation hot pressing. Then, the third semi-finished product and the hot pressed first semi-finished product and second semi-finished product are assembled together, and then the third semi-finished product and the hot pressed first semi-finished product and second semi-finished product are hot pressed by using a semi-activation temperature. In this way, the third hot melt adhesive and the second film material have a certain bonding strength, and the performance of the third hot melt adhesive of the product is not lost when the product is used by a customer and is fully activated on a machine shell, so that the bonding strength of the product and the machine shell is guaranteed. If the third hot melt adhesive is directly hot pressed with the first semi-finished product and the second semi-finished product by using a full-activation temperature, the hot melt adhesive adhesion will be lost to a certain extent when the product is used by the customer, and the best effect cannot be achieved. The process is adopted for compounding, so that the process failure rate can be reduced, the loss can be effectively reduced, the cost can be reduced, and the use effect of the customer can be improved.

[0010] In some embodiments, the step of first compounding includes, in sequence, a first bonding device, a first hot pressing device, a first cutting device, a second bonding device, a second hot pressing device, and a third bonding device.

[0011] Therefore, in the step of first compounding, the above devices work jointly.

[0012] In some embodiments, the step of first compounding includes the following steps,

[0013] The first supporting film and the first film material are first input into the first bonding device for bonding, and the first hot melt adhesive and the first face paper are input into the first bonding device in sequence for bonding.

[0014] After compounding, the first supporting film, the first film material, the first hot melt adhesive, and the first face paper are input into the first hot pressing device for hot melt compounding.

[0015] And, the inner hole is punched by the first cutting device.

[0016] The second laminating device excludes the face paper and inputs the screen;

[0017] The first backing film, the first film material, the first hot melt adhesive and the screen are hot melt compounded by the second hot pressing device;

[0018] The compounded first backing film, the first film material, the first hot melt adhesive and the screen input the dustproof film in the third laminating device, so as to obtain the first semi-finished product with the first backing film and the dustproof film, and the first semi-finished product is discharged and wound for standby.

[0019] Thus, in the first compounding, the first semi-finished product is obtained through the above steps.

[0020] In some embodiments, the step of second compounding includes the fourth laminating device, the third hot pressing device, the second die cutting device and the fifth laminating device arranged in sequence.

[0021] Thus, in the second compounding, the above devices work jointly.

[0022] In some embodiments, the step of second compounding includes the following steps,

[0023] The second backing film and the second film material are first input into the second laminating device for lamination, and the second hot melt adhesive and the second face paper are input into the fourth laminating device for lamination;

[0024] The compounded second backing film, the second film material, the second hot melt adhesive and the second face paper are input into the third hot pressing device for hot melt compounding;

[0025] And, the inner hole is cut off by the second die cutting device,

[0026] The compounded second backing film, the second film material, the second hot melt adhesive and the second face paper output the second face paper in the fifth laminating device, so as to obtain the second semi-finished product with the second backing film, and the second semi-finished product is discharged and wound for standby.

[0027] Thus, in the second compounding, the second semi-finished product is obtained through the above steps.

[0028] In some embodiments, the step of single punching includes the sixth laminating device, the fourth hot pressing device, the third die cutting device and the seventh laminating device arranged in sequence.

[0029] Thus, in the single punching, the third semi-finished product is obtained through the above steps.

[0030] In some embodiments, the step of single punching includes the following steps,

[0031] The third backing film and the third hot melt adhesive are first input into the sixth laminating device for lamination, and the third face paper is also input into the sixth laminating device for lamination;

[0032] The third bottom film, the third hot melt adhesive and the third face paper after the lamination are input into a fourth hot pressing device for hot pressing;

[0033] The inner hole is punched off by the third set of cutting devices;

[0034] The third bottom film, the third hot melt adhesive and the third face paper after the lamination are output from the seventh laminating device, and the third face paper is output, that is, a third semi-finished product with the third bottom film is obtained, and the third semi-finished product is output and wound for standby.

[0035] Therefore, in the step of the single punching, the above-mentioned devices are jointly matched and worked.

[0036] In some embodiments, in the step of the third lamination, the eighth laminating device, the fifth hot pressing device and the ninth laminating device are arranged in sequence; and the step further includes the following steps,

[0037] The first semi-finished product and the second semi-finished product are positioned and laminated by using a jig, and the laminated first semi-finished product and the laminated second semi-finished product are input into the eighth laminating device;

[0038] The laminated first semi-finished product and the laminated second semi-finished product are input into the fifth hot pressing device for hot melt lamination;

[0039] The laminated first semi-finished product and the laminated second semi-finished product are output from the ninth laminating device and wound for standby.

[0040] Therefore, in the step of the third lamination, the above-mentioned devices are jointly matched and worked.

[0041] In some embodiments, in the step of the lamination and cutting, the tenth laminating device, the sixth hot pressing device, the eleventh laminating device, the fourth set of cutting devices and the twelfth laminating device are arranged in sequence.

[0042] Therefore, in the step of the lamination and cutting, the above-mentioned devices are jointly matched and worked.

[0043] In some embodiments, in the step of the lamination and cutting, the step further includes the following steps,

[0044] The third semi-finished product is laminated with the laminated first semi-finished product and the laminated second semi-finished product;

[0045] The laminated first semi-finished product, the laminated second semi-finished product and the third semi-finished product are input into the sixth hot pressing device for hot melt lamination;

[0046] The laminated first semi-finished product, the laminated second semi-finished product and the third semi-finished product are input into the sixth hot pressing device for hot melt lamination, the waste bottom film is output from the eleventh laminating device, and the fourth face paper is input;

[0047] The laminated first semi-finished product, the laminated second semi-finished product, the third semi-finished product and the fourth face paper are input into the fourth set of cutting devices for cutting the shape to obtain a finished product;

[0048] The finished product is discharged and wound up at the twelfth laminating device.

[0049] Thus, in the composite cutting, the finished product is obtained through the above steps. BRIEF DESCRIPTION OF DRAWINGS

[0050] Figure 1 It is a schematic diagram of the first composite plane structure in the hot melt adhesive die-cutting process of an embodiment of the present application.

[0051] Figure 2 It is a schematic diagram of the second composite plane structure in the hot melt adhesive die-cutting process of an embodiment of the present application.

[0052] Figure 3 It is a schematic diagram of the single punching plane structure in the hot melt adhesive die-cutting process of an embodiment of the present application.

[0053] Figure 4 It is a schematic diagram of the third composite plane structure in the hot melt adhesive die-cutting process of an embodiment of the present application.

[0054] Figure 5 It is a schematic diagram of the composite cutting plane structure in the hot melt adhesive die-cutting process of an embodiment of the present application.

[0055] Figure 6 It is Figure 1 a schematic diagram of the first semi-finished product in the first composite step.

[0056] Figure 7 It is Figure 2 a schematic diagram of the second semi-finished product in the second composite step.

[0057] Figure 8 It is Figure 3 a schematic diagram of the third semi-finished product in the single punching step.

[0058] Figure 9 It is Figure 4 a schematic diagram of the first semi-finished product and the second semi-finished product in the third composite step.

[0059] Figure 10 It is Figure 5 a schematic diagram of the finished product in the composite cutting step.

[0060] The figure labels: 11, first laminating equipment; 12, first hot-pressing equipment; 13, first die-cutting equipment; 14, second laminating equipment; 15, second hot-pressing equipment; 16, third laminating equipment; 21, fourth laminating equipment; 22, third hot-pressing equipment; 23, second die-cutting equipment; 24, fifth laminating equipment; 31, sixth laminating equipment; 32, fourth hot-pressing equipment; 33, third die-cutting equipment; 34, seventh laminating; 41, eighth laminating equipment; 42, fifth hot-pressing equipment; 43, ninth laminating equipment; 51, tenth laminating equipment; 52, sixth hot-pressing equipment; 53, eleventh laminating equipment; 54, fourth die-cutting equipment; 55, twelfth laminating equipment; a, first backing film; b, first film material; c, first hot-melt adhesive; d, first face paper; e, silk screen; f, second backing film; g, second film material; h, second hot-melt adhesive; i, second face paper; j, third backing film; k, third hot-melt adhesive; l, third face paper; m, fourth face paper; n, dustproof film. DETAILED DESCRIPTION

[0061] The application will be further described in detail below with reference to the accompanying drawings.

[0062] Figure 1 The hot-melt adhesive die-cutting process according to an embodiment of the application is schematically shown, comprising the following steps,

[0063] S1.1, first compounding, hot-melt compounding the first film material b and the first hot-melt adhesive c at a semi-activation temperature, punching the inner hole of the compounded first film material b and first hot-melt adhesive c, and then compounding the silk screen e to the first hot-melt adhesive c at a semi-activation temperature (100℃) to obtain a first semi-finished product;

[0064] S1.2, second compounding, hot-melt compounding the second film material g and the second hot-melt adhesive h at a semi-activation temperature to obtain a second semi-finished product, and punching the inner hole of the second semi-finished product;

[0065] S1.3, single punching, punching the inner hole of the third hot-melt adhesive k to obtain a third semi-finished product;

[0066] S2, third compounding, hot-melt compounding the first semi-finished product and the second semi-finished product at a full-activation temperature;

[0067] S3, compounding and cutting, assembling the third semi-finished product with the compounded first semi-finished product and second semi-finished product, and then hot-melt compounding at a semi-activation temperature; cutting the outer shape of the compounded first semi-finished product, second semi-finished product and third semi-finished product to obtain a finished product.

[0068] In this embodiment, the first film material b and the second film material g are both PI films.

[0069] In combination Figure 1, specifically, S1.1, the first composite, including the first laminating device 11, the first hot-pressing device 12, the first cutting device 13, the second laminating device 14, the second hot-pressing device 15, the third laminating device 16 arranged in sequence.

[0070] Further comprising the following steps,

[0071] S1.1.1, the first backing film a, the first film material b are first input into the first laminating device 11 for lamination, and the first hot melt adhesive c, the first face paper d are input into the first laminating device 11 in sequence for lamination;

[0072] S1.1.2, after compounding, the first backing film a, the first film material b, the first hot melt adhesive c, and the first face paper d are input into the first hot-pressing device 12 for hot melt compounding;

[0073] S1.1.3, the inner hole is cut off by the first cutting device 13; the positioning hole is cut and sleeved, the product inner hole is fully punched, and the waste is sucked and discharged;

[0074] S1.1.4, the second laminating device 14 is used to remove the face paper and input the silk screen e for lamination;

[0075] S1.1.5, the first backing film a, the first film material b, the first hot melt adhesive c, and the silk screen e are hot melt compounded at a semi-activation temperature by the second hot-pressing device 15;

[0076] S1.1.6, after compounding, the first backing film a, the first film material b, the first hot melt adhesive c, and the silk screen e are input into the third laminating device 16 for dustproof film n, that is, a first semi-finished product with the first backing film a and the dustproof film n is obtained, and the first semi-finished product is discharged and wound for standby use, such as Figure 6 .

[0077] Combined Figure 2 , specifically, S1.2, the second composite, including the fourth laminating device 21, the third hot-pressing device 22, the second cutting device 23, and the fifth laminating device 24 arranged in sequence.

[0078] Further comprising the following steps,

[0079] S1.2.1, the second backing film f, the second film material g are first input into the second laminating device 14 for lamination, and the second hot melt adhesive h, the second face paper i are input into the fourth laminating device 21 in sequence for lamination; the second backing film f, the second film material g, the second hot melt adhesive h, and the second face paper i are laminated in the middle

[0080] S1.2.2, after compounding, the second backing film f, the second film material g, the second hot melt adhesive h, and the second face paper i are input into the third hot-pressing device 22 for hot melt compounding, and semi-activation temperature hot melt compounding is adopted;

[0081] S1.2.3, punch out the inner hole through the second set of cutting equipment 23, cut and cover at the same time, the positioning hole is fully punched and the product is fully punched, and the waste is discharged by suction;

[0082] S1.2.4, the second bottom film f, the second film material g, the second hot melt glue h, and the second face paper i after compounding are discharged from the fifth laminating device 24 to discharge the second face paper i, that is, the second half product with the second bottom film f is obtained, and the second half product is discharged and rolled for standby use, such as Figure 7 .

[0083] In combination Figure 3 , specifically, S1.3, the steps are: single punching, including the sixth laminating device 31, the fourth hot pressing device 32, the third set of cutting devices 33, and the seventh laminating device 34 arranged in sequence.

[0084] Further comprising the following steps,

[0085] S1.3.1, the third bottom film j and the third hot melt glue k are first input into the sixth laminating device 31 for lamination, and the third face paper l is also input into the sixth laminating device 31 for lamination, and the third bottom film j, the third hot melt glue k, and the third face paper l are laminated in the middle;

[0086] S1.3.2, the third bottom film j, the third hot melt glue k, and the third face paper l after lamination are input into the fourth hot pressing device 32 for hot pressing, and semi-activated temperature hot melt compounding is adopted;

[0087] S1.3.3, punch out the inner hole through the third set of cutting devices 33, cut and cover at the same time, the positioning hole is fully punched and the product is fully punched, and the waste is discharged by suction;

[0088] S1.3.4, the third bottom film j, the third hot melt glue k, and the third face paper l after compounding are discharged from the seventh laminating device 34 to discharge the third face paper l, that is, the third half product with the third bottom film j is obtained, and the third half product is discharged and rolled for standby use, such as Figure 8 .

[0089] The first half product, the second half product, and the third half product are obtained through S1.1, S1.2, and S1.3, respectively.

[0090] In combination Figure 4 , specifically, S2, the steps are: third compounding, including the eighth laminating device 41, the fifth hot pressing device 42, and the ninth laminating device 43 arranged in sequence;

[0091] Further comprising the following steps,

[0092] S2.1, the first half product and the second half product are first positioned and assembled by a jig, and then input into the eighth laminating device 41, and the assembled first half product and the second half product are input into the eighth laminating device 41 and discharge the dustproof film n;

[0093] S2.2, the first half product, the second half product after group pasting is input into the fifth hot pressing equipment 42 for hot melt compounding;

[0094] S2.3, the first half product, the second half product after compounding are discharged from the ninth pasting equipment 43 and are wound for standby, like Figure 9 .

[0095] In combination Figure 5 , specifically, step S3, in the compounding and cutting, the tenth pasting equipment 51, the sixth hot pressing equipment 53, the eleventh pasting equipment 53, the fourth cutting equipment 54 and the twelfth pasting equipment 55 arranged in sequence are included.

[0096] Further comprising the following steps,

[0097] S3.1, the third half product is positioned and pasted with the first half product, the second half product after compounding by using a jig first, the first half product, the second half product, the third half product are input into the tenth pasting equipment 51 together, and the second bottom film f of the second half product is discharged;

[0098] S3.2, the first half product, the second half product after group pasting and the third half product are input into the sixth hot pressing equipment 52 for hot melt compounding;

[0099] S3.3, the first half product, the second half product, the third half product after compounding are input into the sixth hot pressing equipment 52 for hot melt compounding, the waste bottom film is discharged from the eleventh pasting equipment 53, and the fourth face paper m is input;

[0100] S3.4, the first half product, the second half product, the third half product, the fourth face paper m after compounding are input into the fourth cutting equipment 54 for cutting shape to obtain the finished product;

[0101] S3.5, the finished product is discharged from the twelfth pasting equipment 55 and is wound, like Figure 10 .

[0102] Compared with the general process, the new hot melt die cutting process according to the characteristics of the hot melt adhesive respectively carries out hot pressing for each layer of hot melt adhesive according to the functional use, and finally carries out die cutting. The first hot melt adhesive c needs to firmly bond the first hot melt adhesive c and the screen e, and the second hot melt adhesive h needs to respectively bond the screen e and the second film material g, so that three semi-finished products need to be die cut during die cutting. The first film material b and the first hot melt adhesive c are first compounded by using a semi-activation temperature, the inner hole is punched out, and then the screen e is compounded to the first hot melt adhesive c by using a semi-activation temperature to obtain a first semi-finished product. In the same way, the second film material g and the second hot melt adhesive h are compounded by using a semi-activation temperature, and then the inner hole is punched out to obtain a second semi-finished product. Then the inner hole of the third hot melt adhesive k is punched out alone to obtain a third semi-finished product. The first semi-finished product and the second semi-finished product are assembled, and then the two semi-finished products are firmly hot pressed by using a full activation temperature. Because the first semi-finished product and the second semi-finished product are compounded by using a semi-activation temperature, the activity of the hot melt adhesive is not affected, so that the bonding strength is not affected during full activation hot pressing. Then the third semi-finished product and the hot pressed first semi-finished product and second semi-finished product are assembled together, and then the third semi-finished product and the hot pressed first semi-finished product and second semi-finished product are hot pressed by using a semi-activation temperature. In this way, it is ensured that the third hot melt adhesive k and the second film material g have a certain bonding force, and it is also ensured that the performance of the third hot melt adhesive k of the product is not lost when the product is used by a customer to be attached to a machine shell for full activation, so as to ensure the bonding force of the product and the machine shell. If the third hot melt adhesive k is directly hot pressed with the first semi-finished product and the second semi-finished product by using a full activation temperature, the adhesion of the hot melt adhesive will be lost to a certain extent when used by a customer, and the best effect cannot be achieved. By using the process for compounding, the process failure rate can be reduced, the loss can be effectively reduced, the cost can be reduced, and the use effect of a customer can be improved.

[0103] The above only describes some embodiments of the present application. Those skilled in the art can make several modifications and improvements without departing from the inventive concept, and these all belong to the protection scope of the present application.

Claims

1. A hot melt adhesive die-cutting process, characterized in that... Includes the following steps The first composite process involves hot-melting the first film material (b) and the first hot melt adhesive (c) at a semi-activated temperature, punching out the inner holes of the composite first film material (b) and the first hot melt adhesive (c), and then using a semi-activated temperature to composite the screen (e) onto the first hot melt adhesive (c) to obtain the first semi-finished product. The second composite process involves hot-melting the second film material (g) and the second hot melt adhesive (h) at a semi-activated temperature to form a second semi-finished product, and then punching out the inner hole of the second semi-finished product. Single punch, the third hot melt adhesive (k) punches the inner hole to obtain the third semi-finished product; The third process involves bonding the first and second semi-finished products together and then using a fully activated temperature hot melt bonding method. Composite cutting involves assembling the third semi-finished product with the composite first and second semi-finished products, followed by semi-activated temperature hot-melt bonding. The composite first, second, and third semi-finished products are then cut to obtain the finished product.

2. The hot melt adhesive die-cutting process according to claim 1, characterized in that... The steps are as follows: In the first composite process, there are a first bonding device (11), a first hot pressing device (12), a first cutting device (13), a second bonding device (14), a second hot pressing device (15), and a third bonding device (16) arranged in sequence.

3. The hot melt adhesive die-cutting process according to claim 2, characterized in that... The steps mentioned: In the first composite, Includes the following steps, The first backing film (a) and the first film material (b) are first fed into the first laminating equipment (11) for lamination, and the first hot melt adhesive (c) and the first face paper (d) are sequentially fed into the first laminating equipment (11) for lamination; After lamination, the first backing film (a), the first film material (b), the first hot melt adhesive (c), and the first face paper (d) are fed into the first hot pressing equipment (12) for hot melt lamination; And, the inner hole is punched off by the first set of cutting equipment (13); In the second laminating device (14), the face paper is removed and fed into the screen (e) for lamination; The first base film (a), the first film material (b), the first hot melt adhesive (c), and the wire mesh (e) are hot melt bonded together by the second hot pressing equipment (15); The first backing film (a), the first film material (b), the first hot melt adhesive (c), and the screen (e) are fed into the dustproof film (n) in the third laminating equipment (16) to obtain the first semi-finished product with the first backing film (a) and the dustproof film (n). The first semi-finished product is discharged and rolled up for later use.

4. The hot melt adhesive die-cutting process according to claim 1, characterized in that... The steps described include: the second composite process, which includes a fourth bonding device (21), a third hot pressing device (22), a second cutting device (23), and a fifth bonding device (24) arranged in sequence.

5. The hot melt adhesive die-cutting process according to claim 4, characterized in that... The step described is: in the second composite, Includes the following steps, The second backing film (f) and the second film material (g) are first fed into the second laminating equipment (14) for lamination, and the second hot melt adhesive (h) and the second face paper (i) are sequentially fed into the fourth laminating equipment (21) for lamination; After lamination, the second backing film (f), the second film material (g), the second hot melt adhesive (h), and the second face paper (i) are fed into the third hot pressing equipment (22) for hot melt lamination; And, the inner hole is punched off by the second set of cutting equipment (23). The composite second backing film (f), second film material (g), second hot melt adhesive (h), and second face paper (i) are discharged from the fifth laminating device (24) to obtain the second semi-finished product with the second backing film (f). The second semi-finished product is discharged and wound up for later use.

6. The hot melt adhesive die-cutting process according to claim 1, characterized in that... The steps described are as follows: In the single punch, there are a sixth bonding device (31), a fourth hot pressing device (32), a third cutting device (33), and a seventh bonding device (34) arranged in sequence.

7. The hot melt adhesive die-cutting process according to claim 6, characterized in that... The steps mentioned above, in a single stroke, include the following steps: The third backing film (j) and the third hot melt adhesive (k) are first fed into the sixth laminating device (31) for lamination, and the third face paper (l) is also fed into the sixth laminating device (31) for lamination; The bonded third backing film (j), third hot melt adhesive (k), and third face paper (l) are fed into the fourth hot pressing device (32) for hot pressing; And, the inner hole is punched off by the third set of cutting equipment (33); The third backing film (j), the third hot melt adhesive (k), and the third face paper (l) after lamination are discharged from the seventh lamination (34) equipment, and the third face paper (l) is obtained, thus obtaining the third semi-finished product with the third backing film (j). The third semi-finished product is discharged and rolled up for later use.

8. The hot melt adhesive die-cutting process according to any one of claims 1-7, characterized in that... The third lamination process includes an eighth bonding device (41), a fifth hot pressing device (42), and a ninth bonding device (43) arranged sequentially; it also includes the following steps: The first semi-finished product and the second semi-finished product are first positioned and assembled using a fixture, and the assembled first semi-finished product and the second semi-finished product are input into the eighth bonding equipment (41); The first and second semi-finished products of the assembly are fed into the fifth hot press equipment (42) for hot melt bonding; The first and second semi-finished products after lamination are discharged and wound up in the ninth lamination equipment (43) for later use.

9. The hot melt adhesive die-cutting process according to claim 8, characterized in that... The steps described include the following: In the composite cutting process, there are a tenth bonding device (51), a sixth hot pressing device (52), an eleventh bonding device (53), a fourth set of cutting devices (54), and a twelfth bonding device (55) arranged in sequence.

10. The hot melt adhesive die-cutting process according to claim 9, characterized in that... The steps mentioned above, including composite cutting, are as follows: The third semi-finished product is assembled with the first and second semi-finished products after being combined. The first, second, and third semi-finished products of the assembly are fed into the sixth hot-pressing equipment (52) for hot-melt bonding. The first, second, and third semi-finished products after lamination are fed into the sixth hot pressing equipment (52) and the eleventh laminating equipment (53) for hot melt lamination. The waste material of the bottom film is discharged and fed into the fourth face paper (m). The first semi-finished product, the second semi-finished product, the third semi-finished product, and the fourth face paper (m) after lamination are fed into the fourth set of cutting equipment (54) to cut the shape and obtain the finished product; The finished product is discharged and wound up in the twelfth lamination equipment (55).

Images