An automatic film laminating machine control system

Abstract

The present invention discloses an automatic film laminating machine control system, including: a feeding system for controlling the film laminating machine to feed the chip carriers; a calibration system for calibrating the chip carriers in the film laminating machine; a film laminating system for controlling the film laminating machine to laminate the chip carriers; a baking system for controlling the film laminating machine to bake the chip carriers; and a discharging system for controlling the film laminating machine to discharge the chip carriers after film lamination. When laminating the chip carriers, the feeding system controls the film laminating machine to feed the chip carriers, the calibration system controls the film laminating machine to calibrate the chip carriers, the film laminating system laminates the film along with the chip carriers, the baking system controls the film laminating machine to bake the chip carriers, and finally the discharging system controls the film laminating machine to discharge the chips after film lamination. When the film laminating machine is in use, there may be situations where multiple chip carriers are stacked or the chip carriers are placed upside down, and the system can realize the judgment and processing of the stacked chip carriers.

Description

Technical Field

[0001] The present invention relates to the technical field of intelligent devices, and particularly to a control system for an automatic film pasting machine. Background Art

[0002] A film pasting machine is a machine specifically used for pasting protective films and anti-explosion films in industries such as electronics / communications / semiconductors, etc., which can ensure bubble-free and scratch-free film pasting. The chip film pasting machine realizes film pasting on the upper plane of the chip bracket, and the model selection is mainly based on efficiency, accuracy, and bubble requirements.

[0003] Chinese Patent Application No. 202111208702.5 discloses a chip bonding machine and a film pasting method for the chip bonding machine. The chip bonding machine includes a frame, at least one loading system, a first driving system, a second driving system, two vacuum hot pressing heads, a CCD alignment system, and a controller. The loading system includes two rotating loading platforms, both of which are rotatably installed on the frame and communicated with a vacuum pumping device. The first driving system is installed on the frame, the second driving system is installed on the first driving system, the second driving system is connected to the two vacuum hot pressing heads, the CCD alignment system is installed on the frame, and the controller is electrically connected to the two rotating loading platforms, the first driving system, the second driving system, the two vacuum hot pressing heads, and the CCD alignment system. The two vacuum hot pressing heads are aligned with the chips and nozzle plates on the corresponding rotating loading platforms through the CCD alignment system, thereby completing chip bonding. The technical solution of the present invention has the advantages of high bonding efficiency and accurate bonding.

[0004] However, when the film pasting machine is in use, there will be situations where multiple chip brackets are stacked and placed upside down, and the existing chip film pasting machines cannot realize the judgment and processing of chip bracket stacking. Summary of the Invention

[0005] In view of the above technical problems, the present invention provides a control system for an automatic film pasting machine, including:

[0006] A loading system for controlling the chip bracket loading of the film pasting machine.

[0007] An alignment system for aligning the chip brackets in the film pasting machine.

[0008] A film pasting system for controlling the film pasting of the chip brackets by the film pasting machine.

[0009] A baking system for controlling the baking of the chip brackets by the film pasting machine.

[0010] An unloading system for controlling the unloading of the chip brackets that have completed film pasting by the film pasting machine.

[0011] To achieve the above object, the present invention is realized through the following technical solutions: When applying a film to the chip bracket, the feeding system controls the film applicator to feed the chip bracket, the calibration system controls the film applicator to calibrate the chip bracket, removes the stacked chip brackets, the film application system applies a film along with the chip bracket, and the baking system controls the film applicator to bake the chip bracket to remove the bubbles in the film of the chip bracket. Finally, the discharging system controls the film applicator to discharge the chips with the film applied.

[0012] Compared with the prior art, the present invention has the following advantages: When the film applicator is in use, there may be situations where multiple chip brackets are stacked or the chip brackets are placed upside down, and it can realize the judgment and processing of the stacked chip brackets.

[0013] Further preferably, it further includes:

[0014] A management system, which is respectively connected to the feeding system, the calibration system, the film application system, the baking system, and the discharging system, and is used to coordinately manage the feeding system, the calibration system, the film application system, the baking system, and the discharging system.

[0015] Adopting the above technical solutions, the management system coordinately manages the feeding system, the calibration system, the film application system, the baking system, and the discharging system so that each system works coordinately to improve efficiency.

[0016] Further preferably, it further includes:

[0017] A detection system, which is respectively connected to the feeding system, the calibration system, the film application system, the baking system, and the discharging system, and is used to detect the working states of the feeding system, the calibration system, the film application system, the baking system, and the discharging system.

[0018] Adopting the above technical solutions, the detection system detects the working states of the feeding system, the calibration system, the film application system, the baking system, and the discharging system, and when a fault occurs in the film applicator, it can be quickly repaired.

[0019] Further preferably, the detection system includes:

[0020] A log query system, which is used to detect the working states of the feeding system, the calibration system, the film application system, the baking system, and the discharging system in real time.

[0021] An alarm system, which is connected to the log query system, and is used to give an alarm when the log query system detects abnormalities in the feeding system, the calibration system, the film application system, the baking system, and the discharging system.

[0022] Adopting the above technical solutions, when the log query system detects a fault, the alarm system gives an alarm.

[0023] Further optimized, the calibration system includes:

[0024] Optical inspection system, used to detect whether the chip carriers are placed in the wrong direction or overlapped.

[0025] Barcode scanning system, used to scan the chip carriers to determine the batches of the chip carriers.

[0026] Adopting the above technical solution, the optical inspection system detects whether the chip carriers are placed in the wrong direction or overlapped, and the barcode scanning system detects whether the chip carriers are placed in the wrong direction or overlapped.

[0027] Further optimized to include:

[0028] Shooting system, used to collect images of the chip carriers.

[0029] Light source system, used to irradiate the chip carriers.

[0030] Analysis system, connected to the shooting system, used to analyze the images of the chip carriers.

[0031] Display system, connected to the shooting system, used to display the images of the chip carriers.

[0032] Adopting the above technical solution, the light source system irradiates the chip carriers, the shooting system collects images of the chip carriers, the analysis system analyzes the images of the chip carriers to determine whether the chip carriers are placed in the wrong direction or overlapped, and the display system can directly observe the images of the chip carriers.

[0033] Further optimized to include:

[0034] Light-emitting system, used to provide light source.

[0035] Adjustment system, used to adjust the brightness of the light-emitting system.

[0036] Adopting the above technical solution, the light-emitting system provides light source, and the adjustment system controls the brightness of the light-emitting system according to the ambient brightness.

[0037] Further optimized to include:

[0038] Adjustment system, used to adjust the images captured by the shooting system to obtain the optimal images.

[0039] Learning module, used to learn the images obtained according to the adjustment system to obtain the outlines of the chip carriers.

[0040] Adopting the above technical solution, the adjustment system adjusts the images captured by the shooting system to the clearest state, and the learning module learns the images.

[0041] Further optimized to include:

[0042] The positioning hole learning system is used to determine the front and back of the chip bracket according to the position of the positioning holes on the chip.

[0043] The contour learning system is used to determine the type of the chip bracket according to the contour of the chip.

[0044] The storage system is used to store data on the types of chip brackets.

[0045] Adopting the above technical solution, the positioning hole learning system determines the front and back of the chip bracket according to the position of the positioning holes on the chip.

[0046] The contour learning system determines the type of the chip bracket according to the contour of the chip.

[0047] The storage system stores data on the types of chip brackets.

[0048] Further optimized, the contour learning system includes.

[0049] The shape learning system is used to preliminarily determine the type of the chip bracket according to the shape of the chip bracket.

[0050] The size learning system is used to determine the type of the chip bracket according to the size of the chip bracket.

[0051] Adopting the above technical solution, the shape learning system preliminarily determines the type of the chip bracket according to the shape of the chip bracket. The size learning system determines the type of the chip bracket according to the size of the chip bracket, thus completing the classification of the chip brackets.

[0052] In summary, the beneficial effects of the present invention are as follows: When laminating the chip bracket, the loading system controls the laminating machine to load the chip bracket, the calibration system controls the laminating machine to calibrate the chip bracket, removes the stacked chip brackets, the laminating system laminates along with the chip bracket, and the baking system controls the laminating machine to bake the chip bracket to remove the bubbles in the chip bracket laminate. Finally, the unloading system controls the laminating machine to unload the laminated chip. When the laminating machine is in use, there may be situations where multiple chip brackets are stacked or the chip bracket is placed backwards, and it can realize the judgment and processing of the stacked chip brackets. Description of the Drawings

[0053] Figure 1 It is a schematic structural diagram of this embodiment;

[0054] Figure 2 It is a structural view of the detection system of this embodiment;

[0055] Figure 3 It is a structural view of the calibration system of this embodiment;

[0056] Figure 4 It is a structural view of the analysis system of this embodiment;

[0057] Reference numerals: 1 - Loading system; 2 - Calibration system; 21 - Optical inspection system; 211 - Imaging system; 212 - Light source system; 2121 - Light-emitting system; 2122 - Adjustment system; 213 - Analysis system; 2131 - Adjustment system; 2132 - Learning module; 21321 - Locating hole learning system; 21322 - Contour learning system; 21323 - Storage system; 213221 - Shape learning system; 213222 - Dimension learning system; 214 - Display system; 22 - Scanning code system; 3 - Film pasting system; 4 - Baking system; 5 - Unloading system; 6 - Management system; 7 - Detection system; 71 - Log query system; 72 - Alarm system. Detailed implementation manners

[0058] The following further details the present invention in conjunction with the Figures 1-4 accompanying drawings.

[0059] A film pasting machine is a machine specifically used for pasting protective films and anti-explosion films in industries such as electronics / communication / semiconductor, etc., which can ensure bubble-free and scratch-free film pasting. The chip film pasting machine realizes film pasting on the upper plane of the chip carrier, and is mainly selected according to efficiency, accuracy, and bubble requirements.

[0060] Chinese Patent Application No. 202111208702.5 discloses a chip bonding machine and a film pasting method for the chip bonding machine. The chip bonding machine includes a frame, at least one loading system, a first driving system, a second driving system, two vacuum hot pressing heads, a CCD alignment system, and a controller. The loading system includes two rotating loading platforms, both of which are rotatably installed on the frame and communicated with a vacuum pumping device. The first driving system is installed on the frame, the second driving system is installed on the first driving system, the second driving system is connected to the two vacuum hot pressing heads, the CCD alignment system is installed on the frame, and the controller is electrically connected to the two rotating loading platforms, the first driving system, the second driving system, the two vacuum hot pressing heads, and the CCD alignment system. The two vacuum hot pressing heads are aligned with the chips and nozzle plates on the corresponding rotating loading platforms through the CCD alignment system, thereby completing chip bonding. The technical solution of the present invention has the advantages of high bonding efficiency and accurate bonding.

[0061] However, when the film pasting machine is in use, there will be situations where multiple chip carriers are stacked or the chip carriers are placed upside down. The existing chip film pasting machines cannot realize the judgment and processing of stacked chip carriers.

[0062] Based on the above technical problems, the applicant has the following technical solution conceptions:

[0063] When applying a film to the chip bracket, the feeding system 1 controls the film applicator to feed the chip bracket, the calibration system 2 controls the film applicator to calibrate the chip bracket, removes the stacked chip brackets, the film application system 3 applies a film along with the chip bracket, and the baking system 4 controls the film applicator to bake the chip bracket to remove the bubbles in the film of the chip bracket. Finally, the discharging system 5 controls the film applicator to discharge the chips with the film applied.

[0064] Based on the above concept, the applicant proposes the technical solution of this application as follows:

[0065] An automatic film applicator control system, as Figures 1-4 shown, includes: a feeding system 1 for controlling the film applicator to feed the chip bracket. A calibration system 2 for calibrating the chip bracket in the film applicator. A film application system 3 for controlling the film applicator to apply a film to the chip bracket. A baking system 4 for controlling the film applicator to bake the chip bracket. A discharging system 5 for controlling the film applicator to discharge the chip bracket with the film applied. When applying a film to the chip bracket, the feeding system 1 controls the film applicator to feed the chip bracket, the calibration system 2 controls the film applicator to calibrate the chip bracket, realizes the judgment and processing of the stacked chip brackets or the reversed chip brackets, the film application system 3 applies a film along with the chip bracket, the baking system 4 controls the film applicator to bake the chip bracket to remove the bubbles in the film of the chip bracket, and finally the discharging system 5 controls the film applicator to discharge the chips with the film applied. When the film applicator is in use, it can realize the judgment and processing of the stacked chip brackets or the reversed chip brackets.

[0066] Specifically, it further includes: a management system 6 respectively connected to the feeding system 1, the calibration system 2, the film application system 3, the baking system 4, and the discharging system 5 for coordinately managing the feeding system 1, the calibration system 2, the film application system 3, the baking system 4, and the discharging system 5. The management system 6 coordinately manages the feeding system 1, the calibration system 2, the film application system 3, the baking system 4, and the discharging system 5 so that each system works coordinately to improve efficiency.

[0067] Specifically, it further includes: a detection system 7 respectively connected to the feeding system 1, the calibration system 2, the film application system 3, the baking system 4, and the discharging system 5 for detecting the working states of the feeding system 1, the calibration system 2, the film application system 3, the baking system 4, and the discharging system 5. The detection system 7 detects the working states of the feeding system 1, the calibration system 2, the film application system 3, the baking system 4, and the discharging system 5, and when a fault occurs in the film applicator, it can be quickly repaired.

[0068] Specifically, the detection system 7 includes: a log query system 71 for detecting the working status of the loading system 1, the calibration system 2, the film pasting system 3, the baking system 4, and the unloading system 5 in real time. An alarm system 72 is connected to the log query system 71 and is used to issue an alarm when the log query system 71 detects abnormalities in the loading system 1, the calibration system 2, the film pasting system 3, the baking system 4, and the unloading system 5. When the log query system 71 detects a fault, the alarm system 72 issues an alarm.

[0069] Specifically, the calibration system 2 includes: an optical inspection system 21 for detecting whether the chip carriers are placed in the wrong direction or overlapped. A barcode scanning system 22 for scanning the chip carriers to determine the batches of the chip carriers. The optical inspection system 21 detects whether the chip carriers are placed in the wrong direction or overlapped, and the barcode scanning system 22 also detects whether the chip carriers are placed in the wrong direction or overlapped.

[0070] Specifically, the optical inspection system 21 includes: a photographing system 211 for collecting images of the chip carriers. A light source system 212 for irradiating the chip carriers. An analysis system 213 is connected to the photographing system 211 and is used to analyze the images of the chip carriers. A display system 214 is connected to the photographing system 211 and is used to display the images of the chip carriers. The light source system 212 irradiates the chip carriers, the photographing system 211 collects images of the chip carriers, the analysis system 213 analyzes the images of the chip carriers to determine whether the chip carriers are placed in the wrong direction or overlapped, and the display system 214 can directly observe the images of the chip carriers.

[0071] Specifically, the light source system 212 includes: a light emitting system 2121 for providing light sources. An adjustment system 2122 for adjusting the brightness of the light emitting system 2121. The light emitting system 2121 provides light sources, and the adjustment system 2122 controls the brightness of the light emitting system 2121 according to the ambient brightness.

[0072] Specifically, the analysis system 213 includes: an adjustment system 2131 for adjusting the images captured by the photographing system 211 to obtain optimal images. A learning module 2132 for learning the images obtained according to the adjustment system 2131 to acquire the contours of the chip carriers. The adjustment system 2131 adjusts the images captured by the photographing system 211 to the clearest state, and the learning module 2132 learns the images.

[0073] Specifically, the learning module 2132 includes: a positioning hole learning module 21321 for determining the front and back of the chip holder according to the position of the chip positioning hole; a contour learning module 21322 for determining the type of the chip holder according to the contour of the chip; and a learning module 21323 for storing data on the types of chip holders. The positioning hole learning module 21321 determines the front and back of the chip holder according to the position of the chip positioning hole. The contour learning module 21322 determines the type of the chip holder according to the contour of the chip. The learning module 21323 stores data on the types of chip holders.

[0074] Specifically, the contour learning module 2132 includes: a shape learning module 213221 for preliminarily determining the type of the chip holder according to the shape of the chip holder; and a size learning module 213222 for determining the type of the chip holder according to the size of the chip holder. The shape learning module 213221 preliminarily determines the type of the chip holder according to the shape of the chip holder. The size learning module 213222 determines the type of the chip holder according to the size of the chip holder, thereby completing the classification of the chip holders.

[0075] In summary, when applying a film to the chip holder, the loading system 1 controls the film applicator to load the chip holder, the calibration system 2 controls the film applicator to calibrate the chip holder, removes the stacked chip holders, the film application system 3 applies a film along with the chip holder, and the baking system 4 controls the film applicator to bake the chip holder to remove the bubbles in the film applied to the chip holder. Finally, the unloading system 5 controls the film applicator to unload the chip with the film applied. When the film applicator is in use, there may be situations where multiple chip holders are stacked or the chip holder is placed upside down, and it can realize the judgment and processing of the stacked chip holders.

[0076] This specific embodiment is only an interpretation of the invention and is not a limitation of the invention. After reading this specification, those skilled in the art can make modifications to this embodiment without creative contributions as needed, but as long as they are within the protection scope of the invention, they are protected by the patent law.

Claims

1. An automatic film laminating machine control system, characterized in that, Including: A loading system (1) for controlling the chip carrier loading of the laminating machine; A calibration system (2) for calibrating the chip carrier in the laminating machine; The calibration system (2) includes: An optical inspection system (21) for detecting whether the chip carrier is placed in the wrong direction or overlapped; A barcode scanning system (22) for scanning the chip carrier to determine the batch of the chip carrier; The optical inspection system (21) includes: A shooting system (211) for collecting images of the chip carrier; A light source system (212) for irradiating the chip carrier; An analysis system (213), connected to the shooting system (211), for analyzing the images of the chip carrier; The analysis system (213) includes: An adjustment system (2131) for adjusting the images captured by the shooting system (211) to obtain the optimal images; A learning module (2132) for learning based on the images obtained by the adjustment system (2131) to obtain the contour of the chip carrier; A display system (214), connected to the shooting system (211), for displaying the images of the chip carrier; A laminating system (3) for controlling the laminating of the chip carrier by the laminating machine; A baking system (4) for controlling the baking of the chip carrier by the laminating machine; A discharging system (5) for controlling the discharging of the chip carrier after laminating by the laminating machine; A detection system (7), respectively connected to the loading system (1), the calibration system (2), the laminating system (3), the baking system (4) and the discharging system (5), for detecting the working states of the loading system (1), the calibration system (2), the laminating system (3), the baking system (4) and the discharging system (5); The detection system (7) includes: A log query system (71) for detecting the working states of the loading system (1), the calibration system (2), the laminating system (3), the baking system (4) and the discharging system (5) in real time; An alarm system (72), connected to the log query system (71), for sending an alarm when the log query system (71) detects abnormalities in the loading system (1), the calibration system (2), the laminating system (3), the baking system (4) and the discharging system (5).

2. The automatic film laminating machine control system according to claim 1, characterized in that, It also includes: A management system (6), respectively connected to the loading system (1), the calibration system (2), the laminating system (3), the baking system (4) and the discharging system (5), for coordinating and managing the loading system (1), the calibration system (2), the laminating system (3), the baking system (4) and the discharging system (5).

3. The automatic film laminating machine control system according to claim 1, wherein, The light source system (212) includes: A light emitting system (2121) for providing light sources; An adjustment system (2122) for adjusting the brightness of the light emitting system (2121).

4. The automatic film laminating machine control system according to claim 1, characterized in that, The learning module (2132) includes: A positioning hole learning system (21321) for determining the front and back of the chip carrier according to the positions of the chip positioning holes; Profile learning system (21322), used to determine the type of chip carrier according to the profile of the chip; Storage system (21323), used to store data on the types of chip carriers.

5. The automatic film laminating machine control system according to claim 4, characterized in that, The profile learning system (21322) includes; Shape learning system (213221), used to preliminarily determine the type of chip carrier according to the shape of the chip carrier; Size learning system (213222), used to determine the type of chip carrier according to the size of the chip carrier.

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