Electronic components and electronic equipment

Abstract

The present invention provides an electronic component. The electronic component comprises: a body having a first end face and a second end face opposite to each other in the longitudinal direction, a first main face and a second main face opposite to each other in the height direction perpendicular to the longitudinal direction, and a first side face and a second side face opposite to each other in the width direction perpendicular to the longitudinal direction and the height direction; an internal conductor provided inside the body; and an external electrode provided on at least a portion of the first main face of the body, the external electrode comprising: a base electrode and a plated electrode covering the base electrode, the base electrode comprising: a first base electrode provided on a portion of the first main face of the body and directly connected to the internal conductor; a second base electrode (25b) located on a portion of the first main face of the body, separated from the first base electrode relative to the center side in the longitudinal direction and not directly connected to the internal conductor, the plated electrode comprising: a first plated electrode covering the first base electrode and a second plated electrode covering the second base electrode.

Description

Technical Field

[0001] The present invention relates to electronic components and electronic equipment. Background Art

[0002] As an electronic component, a laminated coil component having external electrodes is disclosed in Patent Document 1. In the laminated coil component described in Patent Document 1, a plating film is formed on a base electrode to form the external electrodes.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2019-186255.

[0004] When electronic components such as the laminated coil component described in Patent Document 1 are mounted on a substrate via solder, the thermal contraction of the solder may exert tensile stress on the external electrodes of the electronic component. Consequently, this tensile stress may cause the plating films (also called plated electrodes) that constitute the external electrodes to peel off, resulting in reduced reliability. Summary of the Invention

[0005] The present invention has been made to solve the above-mentioned problems, and its object is to provide an electronic component in which the plated electrodes of the external electrodes are not easily peeled off when mounted on a substrate via solder. Another object of the present invention is to provide an electronic device having the above-mentioned electronic component.

[0006] The electronic component of the present invention is characterized in that it comprises: a body having a first end face and a second end face opposite to each other in a longitudinal direction, a first main face and a second main face opposite to each other in a height direction perpendicular to the longitudinal direction, and a first side face and a second side face opposite to each other in a width direction perpendicular to the longitudinal direction and the height direction; an internal conductor arranged inside the above-mentioned body; and an external electrode arranged on at least a portion of the above-mentioned first main face of the above-mentioned body, the above-mentioned external electrode having a base electrode and a plated electrode covering the above-mentioned base electrode, the above-mentioned base electrode including: a first base electrode arranged on a portion of the above-mentioned first main face of the above-mentioned body and directly connected to the above-mentioned internal conductor; a second base electrode located on a portion of the above-mentioned first main face of the above-mentioned body, separated from the center side of the above-mentioned first base electrode in the above-mentioned longitudinal direction and not directly connected to the above-mentioned internal conductor, the above-mentioned plated electrode including a first plated electrode covering the above-mentioned first base electrode and a second plated electrode covering the above-mentioned second base electrode.

[0007] The electronic device of the present invention is characterized in that it comprises: the electronic component of the present invention; a substrate having a pad electrode on its surface; and solder that electrically connects the external electrode of the electronic component and the pad electrode of the substrate, wherein the solder continuously covers the first plated electrode and the second plated electrode.

[0008] According to the present invention, it is possible to provide an electronic component in which the plated electrodes of the external electrodes are not easily peeled off when mounted on a substrate via solder. In addition, according to the present invention, it is possible to provide an electronic device having the electronic component. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a schematic perspective view showing the electronic component according to the first embodiment of the present invention.

[0010] Figure 2 Is to express Figure 1 A schematic cross-sectional view of an example of a portion corresponding to line segment A1 - A2 .

[0011] Figure 3 Yes Figure 2 A three-dimensional schematic diagram of an example of an exploded state of the blank and the coil.

[0012] Figure 4 Yes Figure 2 A schematic plan view of an example of an exploded state of the blank and coil.

[0013] Figure 5 It is a schematic cross-sectional view showing an electronic device according to Embodiment 1 of the present invention.

[0014] Figure 6 It means magnification Figure 5 Schematic cross-sectional view of a first example of the state of region B in FIG.

[0015] Figure 7 It means magnification Figure 5 Schematic cross-sectional view of a second example of the state of region B in FIG.

[0016] Figure 8 It means magnification Figure 5 A schematic cross-sectional view of a third example of the state of region B in FIG.

[0017] Figure 9 It means magnification Figure 5 A schematic cross-sectional view of a fourth example of the state of region B in FIG.

[0018] Figure 10 This is a schematic cross-sectional view showing a first example of an enlarged state of a partial region of an electronic device according to a second embodiment of the present invention.

[0019] Figure 11 This is a schematic cross-sectional view showing a second example of an enlarged state of a partial region of the electronic device according to the second embodiment of the present invention.

[0020] Figure 12 This is a schematic cross-sectional view showing a third example of an enlarged state of a partial region of the electronic device according to the second embodiment of the present invention.

[0021] Figure 13 1 is a schematic cross-sectional view showing a model 1 of an electronic device.

[0022] Description of Reference Numerals

[0023] 1…coil component; 10…base body; 11a…first end surface; 11b…second end surface; 12a…first principal surface; 12b…second principal surface; 13a…first side surface; 13b…second side surface; 15, 15a, 15b, 15c, 15d, 15e…insulating layer; 21a, 21b, 121…first external electrode; 22a…second external electrode; 25a…first base electrode; 25b, 25b'…second base electrode; 25c…third base electrode; 26a…first plated electrode; 26b, 26b'…second plated electrode; 26c…third plated electrode; 30…coil; 31, 31a, 31b, 31c, 31d…coil conductor; 34 a, 34b, 34c, 34d, 34e…conducting hole conductor; 41…first connecting conductor; 42…second connecting conductor; 50…electronic device; 60…substrate; 61…first pad electrode; 62…second pad electrode; 71…first solder; 72…second solder; C…coil axis; L…length direction; P1…distance in the length direction between the first base electrode and the second base electrode; P2…distance in the height direction between the first base electrode and the third base electrode; Q1…distance in the length direction between the first plated electrode and the second plated electrode; Q2…distance in the height direction between the first plated electrode and the third plated electrode; T…height direction; W…width direction. DETAILED DESCRIPTION

[0024] Below, electronic component of the present invention and electronic equipment of the present invention are described. In addition, the present invention is not limited to the following structure, and can also be appropriately changed within the scope of not departing from the gist of the present invention. In addition, the structure that each preferred structure combination of the following records multiples forms also is the present invention.

[0025] The embodiments shown below are examples, and it is of course possible to replace or combine parts of the structures shown in different embodiments. After Embodiment 2, the description of matters that are the same as in Embodiment 1 is omitted, and the main points of difference are described. In particular, the same effects produced by the same structure are not mentioned in sequence for each embodiment. In the following description, when there is no special distinction between the various embodiments, they are simply referred to as "electronic components of the present invention" and "electronic equipment of the present invention."

[0026] [Implementation Method 1]

[0027] The electronic component of the present invention comprises: a body having a first end face and a second end face opposite to each other in the longitudinal direction, a first main face and a second main face opposite to each other in the height direction perpendicular to the longitudinal direction, and a first side face and a second side face opposite to each other in the width direction perpendicular to the longitudinal direction and the height direction; an internal conductor arranged inside the body; and an external electrode arranged on at least a portion of the first main face of the body.

[0028] In the electronic component of the present invention, the internal conductor may include a coil conductor. In this case, the electronic component of the present invention is equivalent to a coil component. In addition, in the electronic component of the present invention, the external electrode may include a first external electrode and a second external electrode. Below, as an electronic component of Embodiment 1 of the present invention, a coil component having a first external electrode and a second external electrode is shown.

[0029] Figure 1 It is a schematic perspective view showing the electronic component according to the first embodiment of the present invention.

[0030] like Figure 1 As shown, the coil component 1 includes a body 10, a first external electrode 21a, and a second external electrode 22a. Figure 1 Although not shown, the coil component 1 also has a coil conductor as an internal conductor provided inside the base body 10 as will be described later.

[0031] In this manual, if Figure 1 As shown in FIG. 1 , the longitudinal direction, the height direction, and the width direction are respectively defined by L, T, and W. Here, the longitudinal direction L, the height direction T, and the width direction W are orthogonal to each other.

[0032] The blank 10 has a first end face 11a and a second end face 11b opposite to each other in the length direction L, a first main face 12a and a second main face 12b opposite to each other in the height direction T, and a first side face 13a and a second side face 13b opposite to each other in the width direction W, and is, for example, a rectangular parallelepiped or a substantially rectangular parallelepiped.

[0033] The first end face 11a and the second end face 11b of the blank 10 do not need to be strictly perpendicular to the longitudinal direction L. In addition, the first main face 12a and the second main face 12b of the blank 10 do not need to be strictly perpendicular to the height direction T. Furthermore, the first side face 13a and the second side face 13b of the blank 10 do not need to be strictly perpendicular to the width direction W.

[0034] When the coil component 1 is mounted on a substrate, the first principal surface 12 a of the base body 10 serves as a mounting surface.

[0035] The blank 10 preferably has a curvature at its corners and ridges. The corners of the blank 10 are where three surfaces of the blank 10 intersect. The ridges of the blank 10 are where two surfaces of the blank 10 intersect.

[0036] The first external electrode 21a is provided on at least a portion of the first main surface 12a of the body 10. Figure 1 In the example shown, the first external electrode 21a extends from a portion of the first main surface 12a of the base body 10 to a portion of each of the first end surface 11a, the first side surface 13a, and the second side surface 13b. The first external electrode 21a is provided on a portion of the first main surface 12a of the base body 10, which serves as the mounting surface, thereby improving the mountability of the coil component 1.

[0037] The second external electrode 22a is provided on at least a portion of the first main surface 12a of the body 10 and is provided at a position separated from the first external electrode 21a. Figure 1 In the example shown, the second external electrode 22a extends from a portion of the first main surface 12a of the base body 10 to a portion of each of the second end surface 11b, the first side surface 13a, and the second side surface 13b. The second external electrode 22a is provided on a portion of the first main surface 12a of the base body 10, which serves as the mounting surface, thereby improving the mountability of the coil component 1.

[0038] Figure 2 Is to express Figure 1 A schematic cross-sectional view of an example of a portion corresponding to line segment A1 - A2 .

[0039] like Figure 2 As shown, the base body 10 is formed by stacking a plurality of insulating layers 15 in a stacking direction, here, the longitudinal direction L. That is, the stacking direction of the insulating layers 15 is parallel to the longitudinal direction L and parallel to the first main surface 12a of the base body 10 as the mounting surface. Figure 2 In FIG. 1 , for convenience of explanation, the boundaries of these insulating layers 15 are shown, but in reality, the boundaries are not clearly shown.

[0040] A coil 30 is provided within the base body 10. The coil 30 is formed by electrically connecting a plurality of coil conductors 31 serving as internal conductors, and is, for example, in the shape of a solenoid. The coil conductors 31 are stacked together with the insulating layer 15 in the longitudinal direction L. Since the coil conductors 31 constituting the coil 30 are stacked together with the insulating layer 15, the coil component 1 is also referred to as a laminated coil component.

[0041] In addition, Figure 2 In FIG. 1 , the shape of the coil 30, the position of the coil conductor 31, the connection of the coil conductor 31, etc. are not strictly shown. For example, the coil conductors 31 adjacent to each other in the longitudinal direction L are connected via Figure 2 The via conductors not shown are electrically connected to each other.

[0042] The coil 30 has a coil axis C. The coil axis C of the coil 30 extends in the longitudinal direction L and passes between the first end face 11a and the second end face 11b of the blank 10. In other words, the direction of the coil axis C of the coil 30 is parallel to the first main surface 12a of the blank 10, which serves as the mounting surface. Furthermore, the coil axis C of the coil 30 passes through the center of the shape of the coil 30 when viewed in the longitudinal direction L.

[0043] As described above, the lamination direction of the insulating layer 15 and the direction of the coil axis C of the coil 30 are parallel to the first main surface 12 a of the base body 10 , which is the mounting surface.

[0044] The coil component 1 may further include a first coupling conductor 41 and a second coupling conductor 42 as internal conductors.

[0045] The first connecting conductor 41 is connected by Figure 2 A plurality of via-hole conductors (not shown) are electrically connected and stacked together with the insulating layer 15 in the longitudinal direction L. The first connecting conductor 41 is exposed at the first end surface 11 a of the base body 10 .

[0046] At least a portion of the first external electrode 21a is electrically connected to the coil 30 via the first connecting conductor 41. Here, among the plurality of coil conductors 31, the coil conductor 31a is provided at a position closest to the first end face 11a of the base body 10. In other words, at least a portion of the first external electrode 21a is electrically connected to the coil conductor 31a via the first connecting conductor 41.

[0047] The first connecting conductor 41 connects at least a portion of the first external electrode 21a to the coil 30. Preferably, the first connecting conductor 41 linearly connects the first external electrode 21a and the coil 30, in this case, the first external electrode 21a and the coil conductor 31a. Furthermore, preferably, when viewed in the longitudinal direction L, the first connecting conductor 41 overlaps with the coil conductor 31a and is located closer to the first principal surface 12a of the base body 10, which serves as the mounting surface, than the coil axis C. This facilitates electrical connection between the first external electrode 21a and the coil 30.

[0048] The first connecting conductor 41 linearly connects the first external electrode 21a and the coil 30, meaning that the via-hole conductors constituting the first connecting conductor 41 overlap when viewed in the longitudinal direction L. Therefore, the via-hole conductors constituting the first connecting conductor 41 do not need to be strictly arranged in a linear pattern.

[0049] The first connecting conductor 41 is preferably connected to the portion of the coil conductor 31a closest to the first main surface 12a of the base body 10. This reduces the area of the portion of the first external electrode 21a on the first end surface 11a of the base body 10. As a result, the stray capacitance between the first external electrode 21a and the coil 30 is reduced, thereby improving the high-frequency characteristics of the coil component 1.

[0050] Only one first coupling conductor 41 may be provided, or a plurality of first coupling conductors 41 may be provided.

[0051] The second connecting conductor 42 is connected by Figure 2 A plurality of via-hole conductors (not shown) are electrically connected and stacked together with the insulating layer 15 in the longitudinal direction L. The second connecting conductor 42 is exposed at the second end surface 11 b of the base body 10 .

[0052] At least a portion of the second external electrode 22a is electrically connected to the coil 30 via the second connecting conductor 42. Here, the coil conductor 31d is provided at the position closest to the second end face 11b of the base body 10 among the plurality of coil conductors 31. In other words, at least a portion of the second external electrode 22a is electrically connected to the coil conductor 31d via the second connecting conductor 42.

[0053] The second connecting conductor 42 connects at least a portion of the second external electrode 22a to the coil 30. The second connecting conductor 42 preferably linearly connects the second external electrode 22a and the coil 30, in this case, the second external electrode 22a and the coil conductor 31d. Furthermore, when viewed in the longitudinal direction L, the second connecting conductor 42 preferably overlaps with the coil conductor 31d and is located closer to the first principal surface 12a of the base body 10, which serves as the mounting surface, than the coil axis C. This facilitates electrical connection between the second external electrode 22a and the coil 30.

[0054] The second connecting conductor 42 linearly connects the second external electrode 22a and the coil 30, meaning that the via-hole conductors constituting the second connecting conductor 42 overlap when viewed in the longitudinal direction L. Therefore, the via-hole conductors constituting the second connecting conductor 42 do not need to be strictly arranged in a linear pattern.

[0055] The second connecting conductor 42 is preferably connected to the portion of the coil conductor 31d closest to the first principal surface 12a of the base body 10. This reduces the area of the portion of the second external electrode 22a on the second end surface 11b of the base body 10. As a result, the stray capacitance between the second external electrode 22a and the coil 30 is reduced, correspondingly improving the high-frequency characteristics of the coil component 1.

[0056] Only one second coupling conductor 42 may be provided, or a plurality of second coupling conductors 42 may be provided.

[0057] Figure 3Yes Figure 2 A three-dimensional schematic diagram of an example of an exploded state of the blank and the coil. Figure 4 Yes Figure 2 A schematic plan view of an example of an exploded state of the blank and coil.

[0058] exist Figure 3 as well as Figure 4 In the example shown, the base body 10 is formed by laminating insulating layers 15 a , 15 b , 15 c , 15 d , and 15 e as the insulating layers 15 in a lamination direction, in this case, the longitudinal direction L.

[0059] In this specification, the insulating layer 15 a , the insulating layer 15 b , the insulating layer 15 c , the insulating layer 15 d , and the insulating layer 15 e are referred to as the insulating layer 15 unless otherwise specified.

[0060] Coil conductors 31 (coil conductors 31a, 31b, 31c, and 31d) are provided on the main surfaces of insulating layers 15a, 15b, 15c, and 15d, respectively. Coil conductors 31a, 31b, 31c, and 31d are stacked together with insulating layers 15a, 15b, 15c, and 15d in the longitudinal direction L, and the coil conductors are electrically connected.

[0061] In this specification, the coil conductor 31 a , the coil conductor 31 b , the coil conductor 31 c , and the coil conductor 31 d are referred to as the coil conductor 31 unless otherwise specified.

[0062] exist Figure 3 as well as Figure 4 In the example shown, the lengths of coil conductor 31a, coil conductor 31b, coil conductor 31c, and coil conductor 31d are each ¾ of the length of a turn of coil 30. In other words, the number of layers of coil conductors forming three turns of coil 30 is four. In base body 10, coil conductor 31a, coil conductor 31b, coil conductor 31c, and coil conductor 31d are repeatedly layered as a unit (three turns).

[0063] Land portions may be provided at both ends of the coil conductor 31. More specifically, land portions may be provided at both ends of the coil conductor 31a, the coil conductor 31b, the coil conductor 31c, and the coil conductor 31d.

[0064] When viewed in the longitudinal direction L, the land portion of the coil conductor 31 may be circular or polygonal.

[0065] Via-hole conductors 34a, 34b, 34c, and 34d are provided so as to penetrate the insulating layers 15a, 15b, 15c, and 15d in the longitudinal direction L, respectively.

[0066] The via-hole conductors 34a, 34b, 34c, and 34d are connected to one end of the coil conductors 31a, 31b, 31c, and 31d, respectively. As described above, when pads are provided at each end of the coil conductors 31a, 31b, 31c, and 31d, the via-hole conductors 34a, 34b, 34c, and 34d are connected to the pads of the coil conductors 31a, 31b, 31c, and 31d, respectively.

[0067] The insulating layer 15a with the coil conductor 31a and the via-hole conductor 34a, the insulating layer 15b with the coil conductor 31b and the via-hole conductor 34b, the insulating layer 15c with the coil conductor 31c and the via-hole conductor 34c, and the insulating layer 15d with the coil conductor 31d and the via-hole conductor 34d are considered as a unit (by Figure 3 as well as Figure 4 The portions surrounded by the dotted lines in FIG. are repeatedly stacked. As a result, coil conductors 31a, 31b, 31c, and 31d are electrically connected via via-hole conductors 34a, 34b, 34c, and 34d. In other words, coil conductors adjacent in the longitudinal direction L are electrically connected to each other via the via-hole conductors.

[0068] Thus, the solenoid-shaped coil 30 provided inside the base body 10 is formed.

[0069] The coil 30 may be circular or polygonal when viewed from the longitudinal direction L. When the coil 30 includes a pad portion, for example, when pad portions are provided at both ends of the coil conductor 31 , the shape of the coil 30 refers to the shape excluding the pad portion.

[0070] A via-hole conductor 34e is provided so as to penetrate the insulating layer 15e in the longitudinal direction L.

[0071] A pad portion connected to the via-hole conductor 34 e may be provided on the main surface of the insulating layer 15 e .

[0072] Multiple insulating layers 15e with via-hole conductors 34e are stacked so as to overlap the insulating layer 15a with the coil conductor 31a and via-hole conductors 34a located on one end of the coil 30. As a result, the via-hole conductors 34e are electrically connected to each other to form a first connecting conductor 41, which is exposed at the first end surface 11a of the base body 10. As a result, at least a portion of the first external electrode 21a and the coil conductor 31a are electrically connected to each other via the first connecting conductor 41.

[0073] Multiple insulating layers 15e with via-hole conductors 34e are stacked so as to overlap the insulating layers 15d with the coil conductor 31d and the via-hole conductors 34d located on the other end side of the coil 30. As a result, the via-hole conductors 34e are electrically connected to each other to form a second connecting conductor 42, which is exposed at the second end surface 11b of the base body 10. As a result, at least a portion of the second external electrode 22a and the coil conductor 31d are electrically connected to each other via the second connecting conductor 42.

[0074] As the constituent materials of the coil conductor 31a, coil conductor 31b, coil conductor 31c, coil conductor 31d, via-hole conductor 34a, via-hole conductor 34b, via-hole conductor 34c, via-hole conductor 34d and via-hole conductor 34e, for example, Ag, Au, Cu, Pd, Ni, Al, alloys containing at least one of these metals, etc. are listed.

[0075] Hereinafter, an electronic device of the present invention in which the electronic component of the present invention is mounted on a substrate via solder will be shown, and the structure of the external electrodes of the electronic component of the present invention and its effects will be described.

[0076] The electronic device of the present invention comprises: the electronic component of the present invention; a substrate having a pad electrode on its surface; and solder electrically connecting the external electrode of the electronic component to the pad electrode of the substrate. Furthermore, in the electronic device of the present invention, the external electrode may include a first external electrode and a second external electrode, the pad electrode may include a first pad electrode and a second pad electrode, and the solder may include a first solder electrically connecting the first external electrode and the first pad electrode, and a second solder electrically connecting the second external electrode and the second pad electrode.

[0077] In the following, the electronic component of embodiment 1 of the present invention is set as a coil component having a first external electrode and a second external electrode as described above, and as an electronic device of embodiment 1 of the present invention, an electronic device is described in which the coil component as the electronic component of embodiment 1 of the present invention is mounted on the first pad electrode and the second pad electrode of the substrate via the first solder and the second solder.

[0078] Figure 5It is a schematic cross-sectional view showing an electronic device according to Embodiment 1 of the present invention.

[0079] like Figure 5 As shown, the electronic device 50 includes the coil component 1 , a substrate 60 , a first solder 71 , and a second solder 72 .

[0080] The substrate 60 has a first pad electrode 61 and a second pad electrode 62 on its surface. The first pad electrode 61 and the second pad electrode 62 are separated from each other.

[0081] The first solder 71 electrically connects the first external electrode 21 a of the coil component 1 and the first land electrode 61 of the substrate 60 .

[0082] The second solder 72 electrically connects the second external electrode 22 a of the coil component 1 and the second land electrode 62 of the substrate 60 .

[0083] In addition, Figure 5 , the structures of the first external electrode 21a and the second external electrode 22a are not strictly shown, and their detailed structures are described below.

[0084] In the electronic component of the present invention, the external electrode has a base electrode and a plated electrode covering the base electrode, the base electrode includes: a first base electrode arranged on a portion of the first main surface of the blank and directly connected to the internal conductor; a second base electrode located on a portion of the first main surface of the blank separated from the center side of the first base electrode in the longitudinal direction and not directly connected to the internal conductor, the plated electrode includes a first plated electrode covering the first base electrode and a second plated electrode covering the second base electrode.

[0085] Figure 6 It means magnification Figure 5 Schematic cross-sectional view of a first example of the state of region B in FIG.

[0086] exist Figure 6 In the illustrated example, the first external electrode 21 a includes a first base electrode 25 a , a second base electrode 25 b , a first plating electrode 26 a , and a second plating electrode 26 b .

[0087] The first base electrode 25a is provided on a portion of the first main surface 12a of the green body 10. The first base electrode 25a also extends from a portion of the first main surface 12a of the green body 10 to a portion of the first end surface 11a. Figure 6 Although not shown, the first base electrode 25 a also extends over a portion of each of the first side surface 13 a and the second side surface 13 b of the body 10 .

[0088] The first base electrode 25 a is directly connected to an internal conductor, in this case, the first connecting conductor 41 exposed on the first end face 11 a of the base body 10 .

[0089] In addition, with Figure 6 Different from the example shown, for example, when the first coupling conductor 41 is not present and the coil conductor 31 is exposed on the first end surface 11 a of the base body 10 , the first base electrode 25 a and the coil conductor 31 a are directly connected.

[0090] The second underlying electrode 25 b is located on a portion of the first principal surface 12 a of the green body 10, spaced apart from the center of the first underlying electrode 25 a in the longitudinal direction L. More specifically, the second underlying electrode 25 b is located on a portion of the first principal surface 12 a of the green body 10, spaced apart from the center of the first underlying electrode 25 a in the longitudinal direction L.

[0091] The second base electrode 25 b is not directly connected to the internal conductor, here, the coil conductor 31 , the first coupling conductor 41 , and the second coupling conductor 42 .

[0092] The distance P1 between the first foundation electrode 25 a and the second foundation electrode 25 b in the longitudinal direction L is preferably 6 μm or more and 66 μm or less, and more preferably 36 μm or more and 66 μm or less.

[0093] The distance between the first and second base electrodes in the longitudinal direction is determined to be the shortest in a cross section taken along the longitudinal and height directions at a substantially center portion in the width direction of the electronic component, here, the coil component.

[0094] Each of the first underlying electrode 25 a and the second underlying electrode 25 b preferably includes Ag or Cu, and more preferably includes Ag.

[0095] The first plating electrode 26a covers the first base electrode 25a. More specifically, in the cross section along the length direction L and the height direction T, the first plating electrode 26a is in contact with the first base electrode 25a and the first main surface 12a of the body 10. Figure 6 In the example shown, the first base electrode 25a is also provided on a portion of the first end surface 11a of the blank 10, so the first plating electrode 26a is also in contact with the first end surface 11a of the blank 10. Figure 6 Although not shown, the first base electrode 25a is also provided on a portion of each of the first side surface 13a and the second side surface 13b of the blank 10 , and therefore the first plating electrode 26a is also in contact with the first side surface 13a and the second side surface 13b of the blank 10 .

[0096] The second plating electrode 26b covers the second base electrode 25b. More specifically, in a cross section along the longitudinal direction L and the height direction T, the second plating electrode 26b is in contact with the second base electrode 25b and the first main surface 12a of the body 10.

[0097] It is preferable that each of the first plating electrode 26 a and the second plating electrode 26 b contains at least one of Ni and Sn.

[0098] The first plating electrode 26a and the second plating electrode 26b may each have a single-layer structure or a multi-layer structure, but preferably a multi-layer structure. If the first plating electrode 26a has a multi-layer structure, the first plating electrode 26a preferably includes a Ni-plated electrode and a Sn-plated electrode in that order from the first base electrode 25a side. If the second plating electrode 26b has a multi-layer structure, the second plating electrode 26b preferably includes a Ni-plated electrode and a Sn-plated electrode in that order from the second base electrode 25b side.

[0099] In addition to elemental analysis in energy dispersive X-ray analysis (EDX), plated electrodes such as the first plated electrode 26a and the second plated electrode 26b are distinguished from base electrodes such as the first base electrode 25a and the second base electrode 25b formed by methods other than plating by information such as density in cross-sections along the length and height directions.

[0100] In the electronic device of the present invention, the solder continuously covers the first plated electrode and the second plated electrode.

[0101] exist Figure 6 In the example shown, the first solder 71 continuously covers the first plated electrode 26a and the second plated electrode 26b. More specifically, in a cross section along the longitudinal direction L and the height direction T, the first solder 71 contacts the first plated electrode 26a and the second plated electrode 26b.

[0102] like Figure 5 and Figure 6 As shown, when the coil component 1 is mounted on the first land electrode 61 of the substrate 60 via the first solder 71, if the first external electrode 21a of the coil component 1 includes a second base electrode 25b in addition to the first base electrode 25a, the tensile stress caused by the thermal contraction of the first solder 71 is applied to the second base electrode 25b located near the end of the first solder 71 in the first external electrode 21a on the first principal surface 12a of the base body 10, but is less likely to be applied to the first base electrode 25a. Therefore, even if the second plated electrode 26b is susceptible to delamination due to the tensile stress, the first plated electrode 26a is less susceptible to delamination. As described above, the first plated electrode 26a is directly connected to the internal conductor, in this case, the first connecting conductor 41. Therefore, the first plated electrode 26a is less susceptible to delamination, thereby suppressing a reduction in the reliability of the coil component 1. On the other hand, the second plated electrode 26b is not directly connected to the internal conductor, in this case, the coil conductor 31, the first connecting conductor 41, and the second connecting conductor 42. Therefore, even if the second plated electrode 26b is susceptible to delamination, the reliability of the coil component 1 is less likely to be reduced.

[0103] In the electronic component of the present invention, the first plated electrode and the second plated electrode may be in contact with each other.

[0104] exist Figure 6 In the example shown, the first plating electrode 26a and the second plating electrode 26b are in contact. More specifically, in a cross-section along the length direction L and the height direction T, the first plating electrode 26a and the second plating electrode 26b are continuous. In other words, in a cross-section along the length direction L and the height direction T, the thickness of the plating electrode is not zero in the region between the first base electrode 25a and the second base electrode 25b. This makes the first plating electrode 26a and the second plating electrode 26b continuous, allowing the first solder 71 to easily infiltrate and diffuse along the first plating electrode 26a and the second plating electrode 26b, thereby easily covering the first plating electrode 26a and the second plating electrode 26b.

[0105] exist Figure 6 In the example shown, when the height position in the height direction T is defined with the first principal surface 12a of the base body 10 as the reference position, the height position of the surface of the plating electrode in the region overlapping with the first base electrode 25a in the height direction T is higher than the region between the first base electrode 25a and the second base electrode 25b. Furthermore, the height position of the surface of the plating electrode in the region overlapping with the second base electrode 25b in the height direction T is higher than the region between the first base electrode 25a and the second base electrode 25b. In other words, the height position of the surface of the plating electrode in the region overlapping with the first base electrode 25a and the region overlapping with the second base electrode 25b in the height direction T is higher than the region between the first base electrode 25a and the second base electrode 25b.

[0106] As a method of contact between the first plated electrode 26a and the second plated electrode 26b, in addition to Figure 6 In addition to the examples shown, the following examples are also listed.

[0107] Figure 7 It means magnification Figure 5 Schematic cross-sectional view of a second example of the state of region B in FIG.

[0108] exist Figure 7 In the example shown, the first plating electrode 26a and the second plating electrode 26b are in point contact in a cross section along the length direction L and the height direction T. In other words, in a cross section along the length direction L and the height direction T, there is only one point where the thickness of the plating electrode is zero in the region between the first base electrode 25a and the second base electrode 25b.

[0109] In the electronic component of the present invention, the first plated electrode and the second plated electrode may be separated from each other.

[0110] Figure 8 It means magnification Figure 5 A schematic cross-sectional view of a third example of the state of region B in FIG.

[0111] exist Figure 8 In the example shown, the first plating electrode 26a is separated from the second plating electrode 26b. More specifically, in a cross section along the longitudinal direction L and the height direction T, a region where the thickness of the plating electrode is zero exists between the first base electrode 25a and the second base electrode 25b.

[0112] The distance Q1 between the first plating electrode 26 a and the second plating electrode 26 b in the longitudinal direction L is preferably 3 μm or more and 20 μm or less, and more preferably 5 μm or more and 15 μm or less.

[0113] The distance between the first and second plating electrodes in the longitudinal direction is determined to be the shortest distance in a cross section along the longitudinal and height directions at a substantially center portion in the width direction of the electronic component, here, the coil component.

[0114] In the above, the configuration of the first plating electrode 26a and the second plating electrode 26b is shown. Figure 6 、 Figure 7 as well as Figure 8 The examples shown, among which, are preferably Figure 6 or Figure 8 The examples shown are particularly preferred Figure 6 Example shown.

[0115] exist Figure 6 、 Figure 7 as well as Figure 8 In the example shown, the second foundation electrode 25b is located on a portion of the first main surface 12a of the green body 10, but the second foundation electrode may be provided as follows.

[0116] Figure 9 It means magnification Figure 5 A schematic cross-sectional view of a fourth example of the state of region B in FIG.

[0117] exist Figure 9 In the example shown, the second base electrode 25 b ′ is not provided on a portion of the first main surface 12 a of the body 10 , but is provided between adjacent insulating layers 15 in the stacking direction, here, the longitudinal direction L, and is exposed on a portion of the first main surface 12 a of the body 10 .

[0118] From Figure 9 In the cross section along the length direction and the height direction as shown, the second base electrode passes through the center and is perpendicular to the stacking direction of the insulating layer. Figure 9 The line extending in the height direction passes through the inner conductor and Figure 9 The coil conductor in the middle indicates that the second base electrode is provided between the insulating layers adjacent to each other in the stacking direction.

[0119] The first plating electrode 26a is separated from the second plating electrode 26b' covering the second base electrode 25b'.

[0120] Figure 9 The example shown is similar to Figure 8 The examples shown are the same.

[0121] exist Figure 9 In the example shown, the first plating electrode 26a and the second plating electrode 26b' are separated, but the first plating electrode 26a and the second plating electrode 26b' may also be in contact. When the first plating electrode 26a and the second plating electrode 26b' are in contact, the first plating electrode 26a and the second plating electrode 26b' may be continuous or in point contact in a cross section along the length direction L and the height direction T.

[0122] The second external electrode 22a preferably has the same structure as the first external electrode 21a. That is, the second external electrode 22a preferably includes a first base electrode, a second base electrode, a first plated electrode, and a second plated electrode. In this case, the first base electrode is provided on a portion of the first main surface 12a of the base body 10 and is directly connected to the internal conductor, in this case, the second connecting conductor 42. Furthermore, the second base electrode is located on a portion of the first main surface 12a of the base body 10, separated from the center side of the first base electrode in the longitudinal direction L, and is not directly connected to the internal conductor, in this case, the coil conductor 31, the first connecting conductor 41, and the second connecting conductor 42. Furthermore, the first plated electrode covers the first base electrode. Furthermore, the second plated electrode covers the second base electrode.

[0123] In the second external electrode 22a, the first plated electrode and the second plated electrode may be in contact or separated. In the second external electrode 22a, when the first plated electrode and the second plated electrode are in contact, in a cross section along the length direction L and the height direction T, the first plated electrode and the second plated electrode may be continuous or in point contact.

[0124] It is preferable that the second solder 72 also continuously covers the first plated electrode and the second plated electrode of the second external electrode 22 a similarly to the first solder 71 .

[0125] The coil component as the electronic component according to the first embodiment of the present invention is manufactured by, for example, the following method.

[0126] Magnetic Material Manufacturing Process

[0127] First, Fe 2 O 3 , NiO, ZnO, and CuO are weighed so as to have a predetermined ratio.

[0128] Next, these weighed materials are wet-mixed and then pulverized to prepare a slurry. The mixing time of the weighed materials is, for example, 4 hours to 8 hours.

[0129] The obtained slurry is then dried and then calcined. The calcination temperature is, for example, 700° C. to 800° C. The calcination time is, for example, 2 hours to 5 hours.

[0130] In this way, a powdery magnetic material, more specifically, a powdery ferrite material is produced.

[0131] The ferrite material is preferably a Ni—Cu—Zn ferrite material.

[0132] The preferred Ni-Cu-Zn ferrite material includes: when the total amount is set to 100 mol%, Fe converted into Fe2O3 is greater than 40 mol% and less than 49.5 mol%, Ni converted into NiO is greater than 10 mol% and less than 45 mol%, Zn converted into ZnO is greater than 2 mol% and less than 35 mol%, and Cu converted into CuO is greater than 6 mol% and less than 13 mol%.

[0133] The Ni—Cu—Zn-based ferrite material may further contain additives such as Co, Bi, Sn, and Mn, and unavoidable impurities.

[0134] Green Sheet Production Process

[0135] First, a magnetic material, an organic binder such as a polyvinyl butyral resin, an organic solvent such as ethanol or toluene, and a plasticizer are mixed and pulverized to produce a slurry. The resulting slurry is then formed into a sheet of a specified thickness using a doctor blade method, and then punched into a specified shape to produce a green sheet.

[0136] As the material of the green sheet, a non-magnetic material such as a borosilicate glass material may be used instead of a magnetic material, or a mixed material of a magnetic material and a non-magnetic material may be used.

[0137] <Conductor Pattern Formation Process>

[0138] First, predetermined locations on a green sheet are irradiated with laser light to form via holes.

[0139] Next, a conductive paste such as Ag paste is filled into the via holes by screen printing or the like and applied to the surface of the raw sheet. Thus, for the raw sheet, a conductor pattern for a via hole conductor is formed in the via hole, and a conductor pattern for a coil conductor connected to the conductor pattern for the via hole conductor is formed on the surface. In this way, a coil sheet having a conductor pattern for a coil conductor and a conductor pattern for a via hole conductor formed on the raw sheet is produced. A plurality of coil sheets are produced, and for each coil sheet, a coil sheet equivalent to Figure 3 and Figure 4 The coil conductor pattern of the coil conductor shown in FIG. Figure 3 and Figure 4 The via-hole conductor shown is a conductor pattern for the via-hole conductor.

[0140] In addition, a conductive paste such as Ag paste is filled into the via hole by screen printing, thereby forming a conductive sheet with a conductive pattern for the via hole conductor on the green sheet separately from the coil sheet. A plurality of conductive sheets are also produced, and for each conductive sheet, a conductive pattern equivalent to Figure 3 and Figure 4 The via-hole conductor shown is a conductor pattern for the via-hole conductor.

[0141] <Laminated Block Production Process>

[0142] The coil piece and the conductive piece are equivalent to Figure 3 as well as Figure 4 The laminated body block is produced by stacking in the stacking direction and then thermally pressing.

[0143] <Body and Coil Manufacturing Process>

[0144] First, the laminated body block is cut into predetermined sizes using a dicing machine or the like, thereby producing individual chips.

[0145] Next, the individual chips are fired. The firing temperature is set to, for example, 900° C. or higher and 920° C. or lower. The firing time is set to, for example, 2 hours or higher and 4 hours or lower.

[0146] By firing the individual chips, the coil sheets and the conductive sheet green sheets become insulating layers, resulting in a green body in which a plurality of insulating layers are stacked in the stacking direction, in this case, the longitudinal direction.

[0147] By firing the singulated chips, the coil conductor pattern and the via conductor pattern of the coil sheet become coil conductors and via conductors, respectively. As a result, a coil is produced in which a plurality of coil conductors are stacked in the longitudinal direction and electrically connected via the via conductors.

[0148] Thus, a green body and a coil provided inside the green body are produced. The lamination direction of the insulating layers and the direction of the coil axis of the coil are parallel to the first main surface of the green body as the mounting surface, in this case, parallel to the longitudinal direction.

[0149] By firing the singulated chips, the conductive pattern for the via conductors of the conductive sheet becomes a via conductor. This results in a first connecting conductor and a second connecting conductor, each of which is formed by stacking and electrically connecting multiple via conductors in the longitudinal direction. The first connecting conductor is exposed at the first end surface of the green body. The second connecting conductor is exposed at the second end surface of the green body.

[0150] The green body may be subjected to barrel grinding, for example, so that the corners and ridges are curved.

[0151] External electrode formation process

[0152] First, the blank is dipped obliquely in a layer of a conductive paste containing Ag and glass material stretched to a predetermined thickness, thereby forming a first coating film that extends from a portion of the first main surface of the blank over a portion of each of the first end surface, the first side surface, and the second side surface and is directly connected to the first connecting conductor exposed on the first end surface of the blank.

[0153] In addition, a conductive paste containing Ag and glass frit is applied to a portion of the first main surface of the blank, thereby forming a second coating film that is separated from the first coating film and arranged on a portion of the first main surface of the blank on the center side in the longitudinal direction and is not directly connected to the coil conductor, the first connecting conductor, and the second connecting conductor.

[0154] When forming the first coating film and the second coating film, the first coating film and the second coating film may be formed at different times or may be formed at the same time.

[0155] When the first coating film and the second coating film are formed at different times, they may be formed in the order of the first coating film and the second coating film, or they may be formed in the order of the second coating film and the first coating film.

[0156] Next, the first coating film is fired to form a first base electrode extending from a portion of the first principal surface of the green body over a portion of each of the first end surface, the first side surface, and the second side surface and directly connected to the first connecting conductor.

[0157] Furthermore, by firing the second coating film, a second base electrode is formed which is provided on a portion of the first principal surface of the green body, spaced apart from the center of the first base electrode in the longitudinal direction, and is not directly connected to the coil conductor, the first connecting conductor, and the second connecting conductor.

[0158] The sintering temperature of the first coating film and the second coating film is set to, for example, 800° C. or higher and 820° C. or lower.

[0159] Then, a Ni-plated electrode and a Sn-plated electrode are sequentially formed on the first base electrode by electroplating or the like, thereby forming a first plated electrode having the Ni-plated electrode and the Sn-plated electrode and covering the first base electrode.

[0160] Furthermore, a Ni-plated electrode and a Sn-plated electrode are sequentially formed on the second base electrode by electroplating or the like, thereby forming a second plated electrode having the Ni-plated electrode and the Sn-plated electrode and covering the second base electrode.

[0161] When forming the first plated electrode and the second plated electrode, by adjusting the plating growth size, the Figure 6 or Figure 7 The first plated electrode and the second plated electrode are formed in a manner of contacting each other as shown, or as shown in FIG. Figure 8 As shown, the first plating electrode and the second plating electrode are formed separately from each other.

[0162] In the above, an example in which the second foundation electrode is formed on a portion of the first principal surface of the green body has been described. However, as described below, the second foundation electrode may be formed so as to be exposed on a portion of the first principal surface of the green body.

[0163] First, in the above-mentioned conductive pattern forming step, a conductive paste containing Ag and glass frit is applied to the surface of the green sheet so as to reach the outer edge thereof, thereby forming a second base electrode conductive pattern.

[0164] When forming the second base electrode conductor pattern, the second base electrode conductor pattern may be formed on the coil sheet, on the conductive sheet, or on both the coil sheet and the conductive sheet.

[0165] After the laminate block manufacturing step, the individual chips are fired in the green body and coil manufacturing step, whereby the second base electrode conductor pattern becomes a second base electrode. The second base electrode thus formed is exposed on a portion of the first main surface of the green body.

[0166] In the subsequent steps, after forming the first base electrode as described above, the first plating electrode covering the first base electrode and the second plating electrode covering the second base electrode are formed on the blank body on which the second base electrode is preformed. At this time, by adjusting the plating growth size, the first plating electrode and the second plating electrode can be formed in a mutually contacting manner, or as described above. Figure 9 As shown, the first plating electrode and the second plating electrode are formed separately from each other.

[0167] In this way, a first external electrode is formed, at least a portion of which is electrically connected to the coil via the first connecting conductor.

[0168] On the other hand, in addition to forming a first base electrode that extends from a portion of the first main surface of the blank to cover the second end surface, the first side surface, and a portion of each surface of the second side surface and is directly connected to the second connecting conductor, and forming a second base electrode that is separated from the center side of the first base electrode in the longitudinal direction and is arranged on a portion of the first main surface of the blank and is not directly connected to the coil conductor, the first connecting conductor, and the second connecting conductor, a second external electrode at least a portion of which is electrically connected to the coil via the second connecting conductor is formed in the same manner as the above method.

[0169] In this manner, the coil component as the electronic component according to the first embodiment of the present invention is manufactured.

[0170] Furthermore, the coil component as the electronic component according to the first embodiment of the present invention is mounted on the first pad electrode and the second pad electrode of the substrate via the first solder and the second solder, thereby manufacturing the electronic device according to the first embodiment of the present invention.

[0171] In the coil component of the electronic component as the first embodiment of the present invention, an example is shown in which the first external electrode extends from a portion of the first main surface of the blank to a portion of each of the first end surface, the first side surface, and the second side surface, but the first external electrode may also extend from the first end surface of the blank to a portion of each of the first main surface, the second main surface, the first side surface, and the second side surface.

[0172] In the coil component of the electronic component as the first embodiment of the present invention, an example is shown in which the second external electrode extends from a portion of the first main surface of the blank to a portion of the second end surface, the first side surface, and each of the second side surfaces, but the second external electrode may also extend from the second end surface of the blank to a portion of the first main surface, the second main surface, the first side surface, and each of the second side surfaces.

[0173] In the coil component of the electronic component according to the first embodiment of the present invention, an example is shown in which the stacking direction of the insulating layer and the direction of the coil axis of the coil are parallel to the first main surface of the base body as the mounting surface, but the stacking direction of the insulating layer and the direction of the coil axis of the coil may also be orthogonal to the first main surface of the base body as the mounting surface. In this case, it is preferred that the first external electrode extends from the first end surface of the base body to a portion of each of the first main surface, the second main surface, the first side surface, and the second side surface. In addition, it is preferred that the second external electrode extends from the second end surface of the base body to a portion of each of the first main surface, the second main surface, the first side surface, and the second side surface.

[0174] [Implementation Method 2]

[0175] In the electronic component according to the second embodiment of the present invention, the first base electrode further extends from a portion of the first principal surface of the base body to a portion of the first end surface, the base electrode further includes a third base electrode located on a portion of the first end surface of the base body, spaced apart from the first base electrode in the height direction on the second principal surface side of the base body, and not directly connected to the internal conductor, and the plated electrode further includes a third plated electrode covering the third base electrode. Except for this point, the electronic component according to the second embodiment of the present invention is the same as the electronic component according to the first embodiment of the present invention.

[0176] In the electronic device according to the second embodiment of the present invention, the first base electrode further extends from a portion of the first principal surface of the base body to a portion of the first end surface. The base electrode further includes a third base electrode located on a portion of the first end surface of the base body, spaced apart from the first base electrode in the height direction on the second principal surface side of the base body, and not directly connected to the internal conductor. The plated electrode further includes a third plated electrode covering the third base electrode. The solder further continuously covers the first plated electrode and the third plated electrode. Except for this point, the electronic device according to the second embodiment of the present invention is the same as the electronic device according to the first embodiment of the present invention.

[0177] In the following, the electronic component of embodiment 2 of the present invention is set as a coil component in the same way as the electronic component of embodiment 1 of the present invention, and as an electronic device of embodiment 2 of the present invention, an electronic device is described in which the coil component as the electronic component of embodiment 2 of the present invention is mounted on the first pad electrode and the second pad electrode of the substrate via the first solder and the second solder.

[0178] Figure 10 1 is a cross-sectional view showing a first example of a state in which a part of an area of an electronic device according to a second embodiment of the present invention is enlarged. Figure 5 Basically the same.

[0179] exist Figure 10 In the illustrated example, the first external electrode 21 b includes a first base electrode 25 a , a second base electrode 25 b , a first plating electrode 26 a , and a second plating electrode 26 b , and further includes a third base electrode 25 c and a third plating electrode 26 c .

[0180] exist Figure 10 In the example shown, the arrangement of the first plating electrode 26a and the second plating electrode 26b on the first main surface 12a of the base body 10 is similar to that of Figure 6 The example shown is the same as Figure 7 、 Figure 8 or Figure 9 The examples shown are the same.

[0181] The third base electrode 25 c is located on a portion of the first end surface 11 a of the green body 10, separated from the first base electrode 25 a, on the second principal surface 12 b side of the green body 10 in the height direction T. More specifically, the third base electrode 25 c is located on a portion of the first end surface 11 a of the green body 10, separated from the first base electrode 25 a, on the second principal surface 12 b side of the green body 10 in the height direction T.

[0182] The third base electrode 25 c is not directly connected to the internal conductors, in this case, the coil conductor 31 , the first coupling conductor 41 , and the second coupling conductor 42 .

[0183] The distance P2 between the first foundation electrode 25 a and the third foundation electrode 25 c in the height direction T is preferably 6 μm or more and 66 μm or less, and more preferably 36 μm or more and 66 μm or less.

[0184] The height distance between the first base electrode and the third base electrode is determined to be the shortest distance in a cross section taken along the longitudinal direction and the height direction at a substantially center portion in the width direction of the electronic component, here, the coil component.

[0185] It is preferable that the third foundation electrode 25 c contain Ag similarly to the first foundation electrode 25 a and the second foundation electrode 25 b .

[0186] The third plating electrode 26c covers the third base electrode 25c. More specifically, in a cross section along the longitudinal direction L and the height direction T, the third plating electrode 26c is in contact with the third base electrode 25c and the first end surface 11a of the body 10.

[0187] It is preferable that the third plating electrode 26 c contain at least one of Ni and Sn, similarly to the first plating electrode 26 a and the second plating electrode 26 b .

[0188] The third plated electrode 26c, like the first plated electrode 26a and the second plated electrode 26b, may have a single-layer structure or a multi-layer structure, but is preferably a multi-layer structure. When the third plated electrode 26c has a multi-layer structure, it is preferred that the third plated electrode 26c include a Ni-plated electrode and a Sn-plated electrode in that order from the third base electrode 25c side.

[0189] The first solder 71 continuously covers the first and second plated electrodes 26a, 26b, and further continuously covers the first and third plated electrodes 26a, 26c. More specifically, in a cross-section along the length direction L and the height direction T, the first solder 71 contacts the first and second plated electrodes 26a, 26b, and also contacts the third plated electrode 26c.

[0190] like Figure 10As shown, if the first solder 71 is provided on the first main surface 12a and the first end surface 11a of the blank 10, the tensile stress caused by the thermal contraction of the first solder 71 is easily applied to the side of the first end surface 11a of the blank 10 in the longitudinal direction L (at the end of the first end surface 11a). Figure 10 In the direction of the left side), sometimes also applied to the first main surface 12a side of the blank 10 in the height direction T (in Figure 10 in the middle, lower side) direction.

[0191] In this case, for the tensile stress applied in the direction toward the first end face 11a side of the blank 10 in the longitudinal direction L, the first external electrode 21b has a second base electrode 25b in addition to the first base electrode 25a, so that as described above, even if the second plated electrode 26b is easily peeled off due to the tensile stress, the first plated electrode 26a is not easily peeled off.

[0192] On the other hand, with respect to tensile stress applied in the direction toward the first principal surface 12a of the base body 10 in the height direction T, the first external electrode 21b includes the third base electrode 25c. Thus, the tensile stress is applied to the third base electrode 25c located near the end of the first solder 71 in the first external electrode 21b on the first end surface 11a of the base body 10, but is less likely to be applied to the first base electrode 25a. Therefore, even if the third plated electrode 26c is likely to peel due to the tensile stress, the first plated electrode 26a is less likely to peel.

[0193] Therefore, in having Figure 10 In the coil component of the structure shown in FIG. 1 , when mounted on the substrate via the first solder 71, the first plated electrode 26a is not easily peeled off, thereby suppressing the reduction in reliability of the coil component. Figure 10 In the coil component of the structure shown, the second plated electrode 26b and the third plated electrode 26c are not directly connected to the internal conductor, here the coil conductor 31, the first connecting conductor 41 and the second connecting conductor 42. Therefore, even if the second plated electrode 26b and the third plated electrode 26c are easily peeled off, the reliability of the coil component is not easily reduced.

[0194] In the electronic component of the present invention, the first plated electrode and the third plated electrode may be in contact with each other.

[0195] exist Figure 10In the example shown, the first plating electrode 26a and the third plating electrode 26c are in contact. More specifically, in a cross-section along the length direction L and the height direction T, the first plating electrode 26a and the third plating electrode 26c are continuous. In other words, in a cross-section along the length direction L and the height direction T, the thickness of the plating electrode is not zero in the region between the first base electrode 25a and the third base electrode 25c. This makes the first plating electrode 26a and the third plating electrode 26c continuous, allowing the first solder 71 to easily infiltrate and diffuse along the first plating electrode 26a and the third plating electrode 26c, thereby easily covering the first plating electrode 26a and the third plating electrode 26c.

[0196] exist Figure 10 In the example shown, when the height position in the longitudinal direction L is defined with the first end face 11a of the base body 10 as the reference position, the height position of the surface of the plating electrode is higher in the region overlapping with the first base electrode 25a in the longitudinal direction L than in the region between the first base electrode 25a and the third base electrode 25c. Furthermore, the height position of the surface of the plating electrode is higher in the region overlapping with the third base electrode 25c in the longitudinal direction L than in the region between the first and third base electrodes 25a, 25c. In other words, the height position of the surface of the plating electrode is higher in the region overlapping with the first and third base electrodes 25a and 25c in the longitudinal direction L than in the region between the first and third base electrodes 25a, 25c.

[0197] As a contact method between the first plating electrode 26a and the third plating electrode 26c, in addition to Figure 10 In addition to the examples shown, the following examples are also listed.

[0198] Figure 11 This is a schematic cross-sectional view showing a second example of an enlarged state of a partial region of the electronic device according to the second embodiment of the present invention.

[0199] exist Figure 11 In the example shown, the first plating electrode 26a and the third plating electrode 26c are in point contact in a cross section along the length direction L and the height direction T. In other words, in a cross section along the length direction L and the height direction T, there is only one point where the thickness of the plating electrode is zero in the region between the first base electrode 25a and the third base electrode 25c.

[0200] exist Figure 11 In the example shown, the arrangement of the first plating electrode 26a and the second plating electrode 26b on the first main surface 12a of the base body 10 is similar to that of Figure 7 The example shown is the same as Figure 6 、 Figure 8 or Figure 9 The examples shown are the same.

[0201] In the electronic component of the present invention, the first plated electrode and the third plated electrode may be separated from each other.

[0202] Figure 12 This is a schematic cross-sectional view showing a third example of an enlarged state of a partial region of the electronic device according to the second embodiment of the present invention.

[0203] exist Figure 12 In the example shown, the first plating electrode 26a is separated from the third plating electrode 26c. More specifically, in a cross section along the longitudinal direction L and the height direction T, a region where the thickness of the plating electrode is zero exists between the first base electrode 25a and the third base electrode 25c.

[0204] The distance Q2 between the first plating electrode 26 a and the third plating electrode 26 c in the height direction T is preferably 3 μm or more and 20 μm or less, and more preferably 5 μm or more and 15 μm or less.

[0205] The height distance between the first and third plating electrodes is determined to be the shortest distance in a cross section along the longitudinal and height directions at a substantially center portion in the width direction of the electronic component, here, the coil component.

[0206] exist Figure 12 In the example shown, the arrangement of the first plating electrode 26a and the second plating electrode 26b on the first main surface 12a of the base body 10 is similar to that of Figure 8 The example shown is the same as Figure 6 、 Figure 7 or Figure 9 The examples shown are the same.

[0207] In the above, the configuration of the first plating electrode 26a and the third plating electrode 26c is shown. Figure 10 、 Figure 11 as well as Figure 12 The examples shown, among which, are preferably Figure 10 or Figure 12 The examples shown are particularly preferred Figure 10 Example shown.

[0208] exist Figure 10 、 Figure 11 as well as Figure 12In the illustrated example, the third base electrode 25c is provided on a portion of the first end face 11a of the base body 10 as a method of positioning the third base electrode 25c on a portion of the first end face 11a of the base body 10. However, the third base electrode may also be provided so as to be exposed on a portion of the first end face of the base body. Even in this case, the first plating electrode and the third plating electrode may be in contact with or separated from each other.

[0209] The second external electrode preferably has the same structure as the first external electrode 21b. That is, the second external electrode preferably includes a first base electrode, a second base electrode, a first plated electrode, and a second plated electrode, and further includes a third base electrode and a third plated electrode. In this case, the first base electrode extends from a portion of the first principal surface 12a of the base body 10 to a portion of the second end surface 11b. Furthermore, the third base electrode is located on a portion of the second end surface 11b of the base body 10, separated from the first base electrode on the side of the second principal surface 12b of the base body 10 in the height direction T, and is not directly connected to the internal conductor, specifically the coil conductor 31, the first connecting conductor 41, and the second connecting conductor 42. Furthermore, the third plated electrode covers the third base electrode.

[0210] In the second external electrode, the first plated electrode and the third plated electrode may be in contact or separated. In the second external electrode, when the first plated electrode and the third plated electrode are in contact, in a cross section along the length direction L and the height direction T, the first plated electrode and the third plated electrode may be continuous or in point contact.

[0211] It is preferable that the second solder also continuously covers the first plated electrode and the third plated electrode of the second external electrode, similarly to the first solder 71 .

[0212] The coil component of the electronic component according to the second embodiment of the present invention is manufactured in the same manner as the coil component of the electronic component according to the first embodiment of the present invention, except that the third base electrode is formed by the same method as the second base electrode, and the third plated electrode is further formed by the same method as the second plated electrode.

[0213] Furthermore, the coil component as the electronic component according to the second embodiment of the present invention is mounted on the first pad electrode and the second pad electrode of the substrate via the first solder and the second solder, thereby manufacturing the electronic device according to the second embodiment of the present invention.

[0214] In the electronic component of the first embodiment of the present invention and the electronic component of the second embodiment of the present invention, a first base electrode is also provided on a portion of each of the first and second side surfaces of the body. In the electronic component of the present invention, the first base electrode further extends from a portion of the first principal surface of the body to a portion of at least one of the first and second side surfaces. The base electrode may further include a fourth base electrode located separately from the first base electrode and not directly connected to the internal conductor, and the plating electrode may further include a fourth plating electrode covering the fourth base electrode. In this manner, even if tensile stress caused by thermal contraction of the solder is applied to the external electrode on at least one of the first and second side surfaces of the body, the tensile stress is applied to the fourth base electrode in the external electrode on at least one of the first and second side surfaces of the body, but is less likely to be applied to the first base electrode. Therefore, even if the fourth plating electrode is easily peeled due to the tensile stress, the first plating electrode is less likely to peel.

[0215] In the above embodiments, coil components are shown as electronic components of the present invention, but the electronic components of the present invention are not limited to coil components. They can also be other stacked ceramic electronic components such as stacked ceramic capacitors, stacked thermistors, stacked varistors, stacked LC filters, stacked piezoelectric filters, etc., and can also be electronic components other than stacked ceramic electronic components.

[0216] [Example]

[0217] Hereinafter, examples of the electronic component and the electronic device of the present invention will be described in more detail using a simulation model. However, the present invention is not limited to these examples.

[0218] [Model 1]

[0219] Figure 13 1 is a schematic cross-sectional view showing a model 1 of an electronic device.

[0220] exist Figure 13 In the illustrated model 1 of the electronic device, the first external electrode 121 includes a first base electrode 125 a and a first plating electrode 126 a .

[0221] The first base electrode 125a is provided on a portion of the first major surface 12a of the green body 10. The first base electrode 125a also extends from a portion of the first major surface 12a of the green body 10 over a portion of the first end surface 11a.

[0222] The first base electrode 125 a is directly connected to an internal conductor, in this case, the first connecting conductor 41 exposed at the first end surface 11 a of the base body 10 .

[0223] The electronic device model 1 has the same structure as the electronic device except that the first external electrode 121 does not have the second base electrode and the second plating electrode. Figure 6 、 Figure 7 as well as Figure 8 The same structure as the example shown.

[0224] In the electronic device model 1 , the distance in the longitudinal direction L between the front end of the first base electrode 125 a and the front end of the first plating electrode 126 a on the first main surface 12 a of the body 10 was set to 30 μm.

[0225] [Model 2]

[0226] As a model 2 of electronic equipment, it adopts Figure 8 The same structure as the example shown.

[0227] In the electronic device model 2, various distances are set as follows.

[0228] · Distance between the first and second substrate electrodes in the longitudinal direction: 42 μm

[0229] · Distance between the first plating electrode and the second plating electrode in the longitudinal direction: 10 μm

[0230] · Distance in the longitudinal direction between the front end of the first base electrode and the front end of the first plating electrode: 30 μm

[0231] [Model 3]

[0232] As an electronic device model 3, adopts Figure 7 The same structure as the example shown.

[0233] In the electronic device model 3, various distances are set as follows.

[0234] · Distance between the first and second substrate electrodes in the longitudinal direction: 42 μm

[0235] · Distance in the longitudinal direction between the front end of the first base electrode and the front end of the first plating electrode: 40 μm

[0236] [Model 4]

[0237] As a model of electronic equipment 4, adopts Figure 6 The same structure as the example shown.

[0238] In the electronic device model 4, various distances are set as follows.

[0239] · Distance between the first and second substrate electrodes in the longitudinal direction: 42 μm

[0240] [Model 5]

[0241] As a model of electronic equipment 5, adopting Figure 9 The same structure as the example shown.

[0242] In the electronic device model 5, various distances are set as follows.

[0243] · Distance between the first and second substrate electrodes in the longitudinal direction: 42 μm

[0244] · Distance between the first plating electrode and the second plating electrode in the longitudinal direction: 10 μm

[0245] · Distance in the longitudinal direction between the front end of the first base electrode and the front end of the first plating electrode: 30 μm

[0246] [Model 6]

[0247] As a model 6 of the electronic device, except that the first plated electrode and the second plated electrode are in point contact, Figure 9 The same structure as the example shown.

[0248] In the electronic device model 6, various distances are set as follows.

[0249] · Distance between the first and second substrate electrodes in the longitudinal direction: 42 μm

[0250] · Distance in the longitudinal direction between the front end of the first base electrode and the front end of the first plating electrode: 40 μm

[0251] [Model 7]

[0252] As a model 7 of the electronic device, the same as that of the first plated electrode and the second plated electrode is adopted except that the first plated electrode and the second plated electrode are continuous. Figure 9 The same structure as the example shown.

[0253] In the electronic device model 7, various distances are set as follows.

[0254] · Distance between the first and second substrate electrodes in the longitudinal direction: 42 μm

[0255] [Evaluation 1]

[0256] For electronic device models 1 to 7, the software "Femtet (registered trademark)" manufactured by Murata Software was used to calculate the degree of stress applied to the tip of the first base electrode provided on the first main surface of the base body due to tensile stress caused by thermal contraction of the solder. Table 1 shows the calculation results.

[0257] The "stress" listed in Table 1 is the stress applied to the tip of the first base electrode, and is expressed as a relative value when the value in electronic device model 1 is set to 100. Furthermore, the "stress reduction rate" listed in Table 1 indicates the extent to which the stress applied to the tip of the first base electrode has been reduced relative to that in electronic device model 1.

[0258]

Table 1

[0259] stress Stress reduction rate (%) Model 1 100 － Model 2 3 97 Model 3 13 87 Model 4 2 98 Model 5 2 98 Model 6 10 90 Model 7 2 98

[0260] The electronic device model 1 is a comparative example outside the scope of the present invention, while the electronic device models 2 to 7 are examples within the scope of the present invention.

[0261] As shown in Table 1, in models 2 to 7 of the electronic device, the stress applied to the front end of the first base electrode is reduced compared to model 1 of the electronic device, so it can be considered that the first plated electrode is not easy to peel off, resulting in the reduction of the reliability of the electronic component, here the coil component.

[0262] [Models 8-13]

[0263] Electronic device models 8 to 13 had the same structure as electronic device model 4 except that the distance between the first foundation electrode and the second foundation electrode in the longitudinal direction was changed as shown in Table 2.

[0264] [Evaluation 2]

[0265] For electronic device models 8 to 13, the same method as in [Evaluation 1] was used to calculate the degree of stress applied to the tip of the first foundation electrode provided on the first main surface of the body. Table 2 shows the calculation results. Table 2 also shows the calculation results for electronic device model 4, which is also shown in Table 1.

[0266] The “stress” and “stress reduction rate” described in Table 2 have the same meanings as those in Table 1. The “distance between foundation electrodes” described in Table 2 indicates the distance between the first foundation electrode and the second foundation electrode in the longitudinal direction.

[0267]

Table 2

[0268] Distance between substrate electrodes (μm) stress Stress reduction rate (%) Model 8 6 46 54 Model 9 18 42 58 Model 10 30 45 55 Model 11 36 4 96 Model 4 42 2 98 Model 12 54 9 91 Model 13 66 7 93

[0269] Furthermore, electronic device models 8 to 13 are examples within the scope of the present invention, similar to electronic device model 4 .

[0270] As shown in Table 2, in electronic device models 8 to 13, as in electronic device model 4, and compared to electronic device model 1, the stress applied to the tip of the first base electrode is reduced. Therefore, it is believed that the first plated electrode is less likely to peel off, thereby suppressing a decrease in the reliability of the electronic component, in this case, the coil component. In particular, in electronic device models 4 and 11 to 13, where the lengthwise distance between the first and second base electrodes is 36 μm or greater and 66 μm or less, the stress applied to the tip of the first base electrode is significantly reduced compared to electronic device models 8 to 10. Therefore, it is believed that the first plated electrode is significantly less likely to peel off, thereby significantly suppressing a decrease in the reliability of the electronic component, in this case, the coil component.

Claims

1. An electronic component, characterized in that have: The blank has a first end face and a second end face opposite to each other in the longitudinal direction, a first main face and a second main face opposite to each other in the height direction perpendicular to the longitudinal direction, and a first side face and a second side face opposite to each other in the width direction perpendicular to the longitudinal direction and the height direction; an internal conductor, disposed inside the blank; as well as an external electrode provided on at least a portion of the first main surface of the body, The external electrode includes a base electrode and a plated electrode covering the base electrode. The base electrode includes: a first base electrode provided on a portion of the first main surface of the green body and directly connected to the internal conductor; and a second base electrode located on a portion of the first main surface of the green body, spaced apart from the center of the first base electrode in the longitudinal direction and not directly connected to the internal conductor. The plating electrode includes: a first plating electrode covering the first base electrode and a second plating electrode covering the second base electrode. The first plating electrode is in contact with the second plating electrode.

2. An electronic component, characterized in that have: The blank has a first end face and a second end face opposite to each other in the longitudinal direction, a first main face and a second main face opposite to each other in the height direction perpendicular to the longitudinal direction, and a first side face and a second side face opposite to each other in the width direction perpendicular to the longitudinal direction and the height direction; an internal conductor, disposed inside the blank; as well as an external electrode provided on at least a portion of the first main surface of the body, The external electrode includes a base electrode and a plated electrode covering the base electrode. The base electrode includes: a first base electrode provided on a portion of the first main surface of the green body and directly connected to the internal conductor; and a second base electrode located on a portion of the first main surface of the green body, spaced apart from the center of the first base electrode in the longitudinal direction and not directly connected to the internal conductor. The plating electrode includes: a first plating electrode covering the first base electrode and a second plating electrode covering the second base electrode. The first plating electrode is separated from the second plating electrode.

3. The electronic component according to claim 1 or 2, wherein The second base electrode is provided on a portion of the first main surface of the body, spaced apart from the first base electrode on the center side in the longitudinal direction.

4. The electronic component according to claim 2, wherein A distance between the first plating electrode and the second plating electrode in the longitudinal direction is 3 μm or more and 20 μm or less.

5. The electronic component according to claim 1 or 2, wherein The first base electrode further extends from a portion of the first main surface of the green body to a portion of the first end surface. The base electrode further includes a third base electrode, the third base electrode being located at a portion of the first end surface of the green body on the second main surface side of the green body in the height direction, separated from the first base electrode and not directly connected to the internal conductor. The plating electrode further includes a third plating electrode covering the third base electrode. The electronic component according to claim 5 , wherein The first plating electrode is in contact with the third plating electrode.

7. The electronic component according to claim 5, wherein The first plating electrode is separated from the third plating electrode.

8. The electronic component according to claim 7, wherein A distance between the first plating electrode and the third plating electrode in the height direction is greater than or equal to 3 μm and less than or equal to 20 μm.

9. The electronic component according to claim 1 or 2, wherein The inner conductor includes a coil conductor.

10. An electronic device, characterized in that: have: The electronic component according to any one of claims 1 to 9; a substrate having pad electrodes on a surface thereof; and Soldering electrically connects the external electrodes of the electronic component and the pad electrodes of the substrate, The solder continuously covers the first plated electrode and the second plated electrode.

11. The electronic device according to claim 10, wherein: The first base electrode further extends from a portion of the first main surface of the green body to a portion of the first end surface. The base electrode further includes a third base electrode, the third base electrode being located at a portion of the first end surface of the base body on the second main surface side of the base body in the height direction and being separated from the first base electrode and not directly connected to the internal conductor. The plating electrode further includes a third plating electrode covering the third base electrode, The solder also continuously covers the first plated electrode and the third plated electrode.

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