Wafer dicing and cutting method and device

Abstract

The present invention discloses a wafer dicing and cutting method and device, and relates to the field of semiconductor manufacturing technology, wherein the wafer dicing and cutting method comprises the following steps: recording the position information of each chip on a wafer on a stage, and cutting the wafer on the stage; transferring the same type of chips that need to be cut again to another stage for cutting according to the recorded position information to complete the secondary cutting step; repeating the secondary cutting step until all the chips on the wafer are cut. The present invention can achieve a convenient and fast cutting effect, reduce the use of manpower and other equipment, and improve production efficiency.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology, and in particular to a wafer dicing and cutting method and device. Background Art

[0002] With the development of data centers, silicon photonic integrated chips are becoming increasingly popular. However, due to the high cost of tape-out and the need to produce only a small number of chips to verify the design results, the silicon photonic wafer MPW (multi-project wafer) business has emerged. The dicing and slicing of MPW wafers after tape-out has become a more concerned issue.

[0003] MPW wafers are composed of multiple circulation units, and each circulation unit is composed of different chips. Because the chip sizes of different designs vary greatly, each cutting path cannot be spliced ​​into a straight line, so multiple dicing and dicing are required. This makes it difficult to cut the chips after splicing, and the process is cumbersome, and even requires multiple dicing, selection, and dicing processes. Summary of the invention

[0004] In view of the defects existing in the prior art, the first aspect of the present invention provides a wafer dicing and cutting method, which can achieve a convenient and fast cutting effect, reduce the use of manpower and other equipment, and improve production efficiency.

[0005] In order to achieve the above purpose, the technical solution adopted by the present invention is:

[0006] A wafer dicing and slicing method, the method comprising the following steps:

[0007] Recording the position information of each chip on the wafer on a stage, and cutting the wafer on the stage;

[0008] Transfer the same type of chips that need to be cut again to another stage for cutting according to the recorded position information to complete the secondary cutting step;

[0009] Repeat the secondary cutting step until all the chips on the wafer are cut.

[0010] In some embodiments, recording the position information of each chip on the wafer on a stage includes:

[0011] Mounting the wafer on a positioning assembly of a stage to form a wafer assembly, wherein the positioning assembly is provided with a plurality of identification units;

[0012] The wafer assembly is positioned by a positioning device on the stage, and a coordinate system is generated based on multiple identification units to record the coordinates of each chip on the wafer.

[0013] In some embodiments, the step of transferring the chips of the same type that need to be cut again to another stage for cutting according to the recorded position information includes:

[0014] The coordinate information of each chip on the wafer is transmitted to the stage for performing the secondary cutting step, wherein the positioning device of the stage for performing the secondary cutting step is provided with a positioning component;

[0015] Based on the coordinate information of the chip, the same type of chip that needs to be cut again is moved to the specified position on the corresponding stage;

[0016] All chips of the same type on the stage are cut along a straight line trajectory.

[0017] In some embodiments, a wafer assembly is formed by mounting a wafer on a UV film of a positioning assembly.

[0018] In some embodiments, before transferring the same type of chips that need to be cut again to another stage, a step of performing debonding using a UV lamp on the stage is also included.

[0019] A second aspect of the present invention provides a wafer scribing and cutting device, which can achieve a convenient and fast cutting effect, reduce the use of manpower and other equipment, and improve production efficiency.

[0020] In order to achieve the above purpose, the technical solution adopted by the present invention is:

[0021] A wafer dicing and cutting device comprises: a plurality of stages, a cutting mechanism, a chip picking mechanism and a control mechanism;

[0022] Each of the loading platforms is provided with a positioning device and a positioning component for mounting wafers that cooperates with the positioning device, and the positioning component is provided with a plurality of identification units;

[0023] The cutting mechanism comprises a cutting unit and a cutting image unit, wherein the cutting unit is used to perform cutting on the stage, and the cutting image unit generates and records the position information of each chip on the wafer on a stage based on the identification unit;

[0024] The control mechanism is used to send the position information to the remaining stages and chip picking mechanisms;

[0025] The chip pickup mechanism includes a chip pickup image unit and a chip pickup unit. The chip pickup image unit is used to correct the position information. The chip pickup unit transfers the cut chips on the wafer to another stage based on the corrected position information.

[0026] In some embodiments, the positioning assembly is a circular ring with a notch at one end, and the positioning device is a blocking piece that cooperates with the notch of the circular ring.

[0027] In some embodiments, the identification unit is a marking point set on the ring.

[0028] In some embodiments, a UV film for mounting is provided on the positioning component.

[0029] In some embodiments, the stage is further provided with a UV lamp for removing the stickiness of the UV film.

[0030] Compared with the prior art, the advantages of the present invention are:

[0031] The wafer dicing and slicing method of the present invention records the position information of each chip on a wafer on a stage, and cuts the wafer on the stage; transfers the same type of chips that need to be cut again to another stage for cutting according to the recorded position information to complete the secondary slicing step; repeats the secondary slicing step until all the chips on the wafer are cut. After adopting the slicing method of the present invention, it can achieve a convenient and fast cutting effect, reduce the use of manpower and other equipment, and improve production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 is a flow chart of a wafer dicing and slicing method according to an embodiment of the present invention;

[0033] Figure 2 is a schematic structural diagram of a wafer in an embodiment of the present invention;

[0034] Figure 3 is a schematic diagram of cutting of a wafer circulation unit in an embodiment of the present invention;

[0035] Figure 4 yes Figure 1 Flow chart of step S1 in FIG.

[0036] Figure 5 yes Figure 1 Flow chart of step S2;

[0037] Figure 6 is a schematic structural diagram of a wafer scribing and cutting device in an embodiment of the present invention;

[0038] Figure 7 is a schematic structural diagram of a wafer assembly in an embodiment of the present invention;

[0039] Figure 8 Schematic diagram of the structure of the stage in the embodiment of the present invention. DETAILED DESCRIPTION

[0040] The technical solution of the present invention (including the preferred technical solution) is further described in detail below by means of the accompanying drawings and by listing some optional embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] In the description of the present application, it should be noted that the terms "upper", "lower", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. Unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be a connection between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0042] Further, in this application, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0043] See also Figure 1 As shown, an embodiment of the present invention discloses a wafer dicing and cutting method, which includes the following steps:

[0044] S1. Record the position information of each chip on the wafer on a stage, and cut the wafer on the stage.

[0045] See also Figure 2As shown, a multi-project wafer (MPW) is a wafer that places multiple integrated circuit designs with the same process on the same wafer. After the wafer is taped out, dozens of chip samples can be obtained for each design variety. The embodiment of the present invention is called a cycle unit, that is, a wafer (MPW) is composed of multiple cycle units, see Figure 3 As shown, the circulation unit is composed of different chips; because the chips are of different sizes, each cutting path cannot be spliced ​​into a straight line, so multiple dicing is required.

[0046] In order to solve the above problems, the embodiment of the present invention firstly follows Figure 3 The first cutting is performed on the main cutting path in step S1, that is, the cutting step in step S1. Because the main cutting path is applicable to all circulation units, the cutting is relatively uniform.

[0047] After cutting along the main cutting path, Figure 3 It can be seen that the secondary cutting paths of the chips to be cut are irregular and cannot be simply cut uniformly along a straight line. Therefore, the concept of the present invention is to record the position information of each chip on a wafer on a stage, and then group the chips of the same type into a group for uniform cutting. The chips of the same type refer to chips that can be uniformly cut along the same primary cutting path and along a straight line. In this way, a convenient and fast cutting effect can be achieved, the use of manpower and other equipment can be reduced, and production efficiency can be improved.

[0048] See also Figure 4 As shown, regarding how to record the position information of each chip on a wafer on a stage, the method adopted by the embodiment of the present invention is:

[0049] S11. Mounting the wafer on a positioning assembly of a stage to form a wafer assembly, wherein the positioning assembly is provided with a plurality of identification units.

[0050] In some embodiments, in order to protect the wafer, a UV film is also provided on the positioning assembly, and the wafer is mounted on the UV film of the positioning assembly to form a wafer assembly. The UV film plays a role in fixing the wafer to prevent the chip from moving and causing cutting losses.

[0051] S12. Position the wafer assembly through the positioning device on the stage, and generate a coordinate system based on multiple identification units to record the coordinates of each chip on the wafer.

[0052] As shown in the figure, the identification unit in the present invention refers to the marking points set on the positioning component. The marking points are set at intervals along the circumference of the positioning component. For example, four marking points are set as shown in the figure, which can play the role of identifying the orientation. After the wafer component is positioned, a coordinate system can be generated based on the four marking points, and then the coordinates of each chip on the wafer can be recorded.

[0053] S2. Transfer the same type of chips that need to be cut again to another stage for cutting according to the recorded position information to complete the secondary cutting step.

[0054] After step S1, the chips to be cut for the second time and the position information of each chip are obtained. Then, the chips are classified and the chips of the same type are transferred to another stage for cutting. It can be understood that the position information of the chip will be transferred from the previous stage to the stage for the second cutting.

[0055] It is worth noting that if the wafer is mounted on the UV film of the positioning component to form a wafer component, before the same type of chip that needs to be cut again is transferred to another stage, it also includes a step of debonding using the UV lamp on the stage.

[0056] Specifically, see Figure 5 As shown, step S2 includes:

[0057] S21. The coordinate information of each chip on the wafer is transmitted to the stage for performing the secondary cutting step, wherein the positioning device of the stage for performing the secondary cutting step is provided with a positioning component.

[0058] S22. Based on the coordinate information of the chip, the chip of the same type that needs to be cut again is moved to a designated position on the corresponding stage.

[0059] S23. Cut all similar chips on the stage along a straight line trajectory.

[0060] After the above steps, the one-time and two-time cutting steps are completed. Since the same type of chips are cut along a uniform straight line trajectory, a convenient and fast cutting effect can be achieved, thereby improving production efficiency.

[0061] S3. Repeat the secondary cutting step until all the chips on the wafer are cut.

[0062] It is understandable that after the wafer is cut, multiple types of similar chips can be obtained, and each type of similar chip can be subjected to the secondary cutting step according to the method in step S2. At the same time, for the chips that have been cut twice, it may be necessary to cut them again, and the method is the same, just follow step S2 until all the chips on the wafer are cut.

[0063] In summary, the wafer dicing and slicing method of the present invention records the position information of each chip on the wafer on a stage, and cuts the wafer on the stage; transfers the same type of chips that need to be cut again to another stage for cutting according to the recorded position information to complete the secondary slicing step; repeats the secondary slicing step until all the chips on the wafer are cut. After adopting the slicing method of the present invention, it can achieve a convenient and fast cutting effect, reduce the use of manpower and other equipment, and improve production efficiency.

[0064] In the meantime, see Figure 6 As shown, an embodiment of the present invention discloses a wafer scribing and cutting device, including: a platform 1, a plurality of loading tables 2, a cutting mechanism 3, a chip picking mechanism 4 and a control mechanism.

[0065] The platform 1 is used as a support, on which an area for accommodating the stage 2 is fixed, and a cutting mechanism 3 and a chip picking mechanism 4 are arranged on both sides of the platform 1. The control mechanism is connected with the stage 2, the cutting mechanism 3 and the chip picking mechanism 4 through signals.

[0066] Each stage 2 is provided with a positioning device 21 and a positioning component 22 for mounting wafers that cooperates with the positioning device 21 . The positioning component is provided with a plurality of identification units 23 .

[0067] See also Figure 7 In this embodiment, the positioning assembly 22 is a circular ring with a notch at one end, and the positioning device 21 is a baffle that matches the notch of the circular ring. When the two are in use, the notch of the circular ring is aligned with the baffle to complete the positioning. The identification unit 23 is a marking point set on the circular ring. As shown in the figure, there are 4 marking points set at intervals in the circumferential direction of the circular ring, and these 4 marking points can be used for auxiliary positioning when in use.

[0068] In order to protect the wafer, a UV film 24 is also provided on the positioning component 22, and the wafer is mounted on the UV film of the positioning component 22 to form a wafer assembly. Figure 8 As shown, correspondingly, a UV lamp 25 for removing the stickiness of the UV film is also provided on the stage 2. If the wafer is mounted on the UV film 24 of the positioning component 22 to form a wafer assembly, the UV lamp 25 on the stage 2 is used to debond the same chip that needs to be cut again before transferring it to another stage.

[0069] The cutting mechanism 3 includes a cutting unit 31 and a cutting image unit 32 . The cutting unit 31 is used for cutting on a stage. The cutting image unit 32 generates and records the position information of each chip on the wafer on a stage based on the identification unit 23 .

[0070] The control mechanism is used to send the position information to the rest of the loading platforms and the chip picking mechanism. In this embodiment, the control mechanism mainly issues instructions to control information transmission and control the actions of the cutting mechanism 3 and the chip picking mechanism 4.

[0071] The chip pickup mechanism 4 includes a chip pickup image unit 41 and a chip pickup unit 42 . The chip pickup image unit 42 is used to correct the position information. The chip pickup unit 41 transfers the cut chips on the wafer to another stage 2 based on the corrected position information.

[0072] That is to say, the chip picking unit 41 will transfer the same type of chip to another stage 2 according to the original position information, so that the chip can be cut along a straight line on the other stage 2, thereby improving the cutting efficiency.

[0073] The following is a further introduction to the use principle of the wafer dicing and cutting device in the embodiment of the present invention:

[0074] First, the wafer 5 is mounted on the positioning component 22 to form a wafer assembly. The positioning component 22 is a UV film 24 with a circular ring.

[0075] Place the wafer assembly on stage 1 (see Figure 6 , from left to right are No. 1, No. 2 and No. 3 loading platforms), and the positioning component 22 is also placed on No. 2 loading platform and No. 3 loading platform; the position is calibrated by the positioning device 21; the three loading platforms can be rotated at any angle.

[0076] After the components on the stage are placed, the cutting image unit 32 performs image processing on the wafer 5 on the wafer assembly, and then rotates the wafer to a horizontal and vertical state of the main cutting path through stage No. 1, so as to facilitate cutting by the cutting unit 31; the cutting image unit 32 processes the identification units 23 on the ring at this time, uses the four identification units 23 to produce a coordinate system, and then records the coordinates of each chip on the wafer 5; then, this coordinate information is transmitted to stage No. 2 and stage No. 3; at this time, the state of the positioning components 22 on stage No. 2 and stage No. 3 will be rotated to the same state as the components on stage No. 1;

[0077] Start cutting the main cutting path on the wafer. At this time, the secondary cutting path cannot be cut, otherwise the chip will be cut and further cutting is required. After the wafer 5 on stage No. 1 is cut, the UV lamp 25 on the stage is used for debonding (the UV lamp will only be turned on when debonding is required) to facilitate chip picking by the chip picking unit 41; the chip picking image unit 42 performs image processing on the cut wafer, and compares and corrects the chip coordinates generated by the cutting primitive unit 32 before cutting, and places the same type of chips that need to be cut twice on the positioning component 22 of stage No. 2. The chip coordinates correspond to stage No. 1. At this time, the secondary cutting path of each chip to be cut twice is in the same straight line state. The same type of chips to be cut twice in each circulation area are placed on the positioning component 22 of the same stage, and the chip cutting work begins;

[0078] In the same way, another chip of the same type to be cut for the second time is placed on stage No. 3. After the cutting on stage No. 2 is completed, the cutting unit 31 cuts the chip on stage No. 3; the positioning component 22 that has been cut on stage No. 2 is taken out, and a new positioning component 22 is placed, and then the chip picking unit 41 places a new chip to be cut for the second time; this cycle is repeated until all the chips are cut.

[0079] In summary, the wafer dicing and cutting device in the present invention includes multiple stages, a cutting mechanism, a chip picking mechanism and a control mechanism. The cutting mechanism records the position information of each chip on the wafer on a stage and cuts the wafer on the stage; the chip picking mechanism transfers the same type of chips that need to be cut again to another stage for cutting according to the recorded position information to complete the secondary cutting step; the cutting mechanism and the chip picking mechanism repeat the secondary cutting step until all the chips on the wafer are cut. The wafer dicing and cutting device in the present invention can achieve a convenient and fast cutting effect, reduce the use of manpower and other equipment, and improve production efficiency.

[0080] The above description is only a specific implementation of the present application, so that those skilled in the art can understand or implement the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest range consistent with the principles and novel features applied for herein.

Claims

1. A wafer dicing and cutting method, characterized in that: The method comprises the following steps: Recording the position information of each chip on the wafer on a stage, and cutting the wafer on the stage; Transferring the same type of chips that need to be cut again to another stage for cutting according to the recorded position information to complete the secondary cutting step, wherein the same type of chips are chips that can be cut uniformly along the same cutting path and along a straight line; Repeat the secondary cutting step until all the chips on the wafer are cut; The recording of the position information of each chip on the wafer on a stage includes: Mounting the wafer on a positioning assembly of a stage to form a wafer assembly, wherein the positioning assembly is provided with a plurality of identification units; The wafer assembly is positioned by a positioning device on the stage, and a coordinate system is generated based on multiple identification units to record the coordinates of each chip on the wafer; The method of transferring the same type of chips that need to be cut again to another stage for cutting according to the recorded position information includes: The coordinate information of each chip on the wafer is transmitted to the stage for performing the secondary cutting step, wherein the positioning device of the stage for performing the secondary cutting step is provided with a positioning component; Based on the coordinate information of the chip, the same type of chip that needs to be cut again is moved to the specified position on the corresponding stage; All chips of the same type on the stage are cut along a straight line trajectory.

2. A wafer dicing and slicing method according to claim 1, characterized in that: The wafer is mounted on the UV film of the positioning component to form a wafer component.

3. A wafer dicing and slicing method according to claim 2, characterized in that: Before transferring the same type of chip that needs to be cut again to another stage, the process also includes a step of debonding using a UV lamp on the stage.

4. A wafer dicing and slicing device for implementing the wafer dicing and slicing method as claimed in claim 1, characterized in that: include: Multiple stages, cutting mechanisms, chip picking mechanisms, and control mechanisms; Each of the loading platforms is provided with a positioning device and a positioning component for mounting wafers that cooperates with the positioning device, and the positioning component is provided with a plurality of identification units; The cutting mechanism comprises a cutting unit and a cutting image unit, wherein the cutting unit is used to perform cutting on the stage, and the cutting image unit generates and records the position information of each chip on the wafer on a stage based on the identification unit; The control mechanism is used to send the position information to the remaining stages and chip picking mechanisms; The chip pickup mechanism includes a chip pickup image unit and a chip pickup unit. The chip pickup image unit is used to correct the position information. The chip pickup unit transfers the cut chips on the wafer to another stage based on the corrected position information.

5. The wafer dicing and cutting device according to claim 4, characterized in that: The positioning assembly is a circular ring with a notch at one end, and the positioning device is a blocking piece matched with the notch of the circular ring.

6. The wafer dicing and cutting device according to claim 5, characterized in that: The identification unit is a marking point arranged on the ring.

7. The wafer dicing and cutting device according to claim 5, characterized in that: The positioning component is provided with a UV film for mounting.

8. The wafer dicing and cutting device according to claim 7, characterized in that: The loading platform is also provided with a UV lamp for removing the stickiness of the UV film.

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