Electronic Package, Its Heat Dissipation Structure and Manufacturing Method

Abstract

An electronic package, its heat dissipation structure and manufacturing method, comprising a heat dissipation body and an adjustment channel. Among them, a bearing area and an acting area adjacent to the bearing area are defined on the surface of the heat dissipation body. A first heat dissipation material is arranged on the bearing area, and the adjustment channel is arranged on the acting area. One end of the adjustment channel is open and communicates with the outside of the heat dissipation structure, and the other end communicates with the bearing area. Therefore, when the heat dissipation body is combined with an electronic component through the first heat dissipation material, the adjustment channel can adjust the volume of the first heat dissipation material.

Description

Technical Field

[0001] The present invention relates to a packaging structure, and more particularly to an electronic package with a heat dissipation structure, its heat dissipation structure and manufacturing method. Background Art

[0002] As the demand for functions and processing speeds of electronic products increases, semiconductor chips, which are the core components of electronic products, need to have higher-density electronic components and electronic circuits. Therefore, a larger amount of heat will be generated when the semiconductor chips are operating. In addition, since the traditional encapsulation colloid covering the semiconductor chip is a poor heat-conducting material with a thermal conductivity of only 0.8 (unit: W.m -1 .k -1 ), that is, the heat dissipation efficiency is poor. Therefore, if the heat generated by the semiconductor chip cannot be effectively dissipated, it will cause damage to the semiconductor chip and product reliability problems.

[0003] Therefore, in order to quickly dissipate the heat energy to the outside, the industry usually configures a heat sink in the semiconductor package. The heat sink is usually combined with the back surface of the semiconductor chip through a heat-dissipating adhesive, such as a thermal interface material (TIM for short), so as to dissipate the heat generated by the semiconductor chip through the heat-dissipating adhesive and the heat sink. In addition, usually the top surface of the heat sink is exposed outside the encapsulation colloid or directly exposed to the atmosphere to obtain a better heat dissipation effect.

[0004] As Figure 1 shown, in the manufacturing method of the existing semiconductor package 1, a semiconductor chip 11 is first disposed on a packaging substrate 10 with its working surface 11a by means of flip-chip bonding (that is, through conductive bumps 110 and underfill 111), and then a heat sink 13 is bonded to the non-working surface 11b of the semiconductor chip 11 with its top sheet 130 through a TIM layer 12, and the support legs 131 of the heat sink 13 are mounted on the packaging substrate 10 through an adhesive layer 14.

[0005] During operation, the heat energy generated by the semiconductor chip 11 is conducted to the top sheet 130 of the heat sink 13 through the non-working surface 11b and the TIM layer 12 to dissipate heat to the outside of the semiconductor package 1.

[0006] In addition, in order to meet the development trends of electronic products towards multi-contact (I / O), large-size packaging specifications, large area and high heat dissipation, liquid metal is used to make the TIM layer 12 to replace the traditional hard TIM.

[0007] However, in the existing semiconductor package 1, since the TIM layer 12 is liquid metal, which is a fluid and expands at high temperatures, it cannot be stably laid on the non-functional surface 11b of the semiconductor chip 11, and may even overflow outside the semiconductor package 1, causing other components outside the semiconductor package 1 to be contaminated.

[0008] Therefore, how to overcome the various problems of the above-mentioned prior art has actually become a difficult problem that the industry urgently needs to overcome at present. Summary of the Invention

[0009] In view of the above-mentioned deficiencies of the prior art, the present invention provides an electronic package, its heat dissipation structure and manufacturing method, which can effectively prevent the first heat dissipation material from overflowing outside the electronic package and avoid the problem of other components outside the electronic package being contaminated.

[0010] The heat dissipation structure of the present invention includes: a heat dissipation body having opposite first and second sides, and a bearing area and an active area adjacent to the bearing area are defined on the surface of the first side. Among them, the first heat dissipation material is arranged on the bearing area; and an adjustment channel is arranged on the active area, and one end of the adjustment channel is open and communicates with the outside of the heat dissipation structure, and the other end communicates with the bearing area to adjust the volume of the first heat dissipation material.

[0011] In the above-mentioned heat dissipation structure, the adjustment channel has a fluid section and a gas section that are connected. The fluid section communicates with the bearing area to adjust the volume of the first heat dissipation material, and one end of the gas section opposite to the fluid section is open and communicates with the outside of the heat dissipation structure. For example, the cross-sectional area of the fluid section gradually decreases from the bearing area towards the gas section. Further, the fluid section gradually decreases based on an angle formed by its opposite sides, and the angle is at most 70 degrees.

[0012] Alternatively, the minimum width of the cross-sectional area of the fluid section is smaller than the height of the cross-sectional area of the gas section. Or, one open end of the gas section communicates with the fluid section, and the other open end of the gas section is away from the fluid section, so that the cross-sectional area of the gas section gradually decreases from the fluid section towards the other open end. Further, the gas section gradually decreases based on an angle formed by its opposite sides, and the angle is at most 70 degrees.

[0013] In addition, the adjustment channel has a plurality of the gas sections, and each of the gas sections communicates with the fluid section.

[0014] In the above-mentioned heat dissipation structure, the height of the cross-sectional area of the gas section is 10 micrometers to 1200 micrometers.

[0015] In the above-mentioned heat dissipation structure, the adjustment channel is formed by stacking a first heat dissipation member and a second heat dissipation member.

[0016] In the aforementioned heat dissipation structure, a space is defined on the bearing area. One of the opposite sides of the space is the surface of the first side, and the other is a horizontal plane spaced from the surface of the first side by a gap. The space is rectangular. The bearing area has a corner section extending from the center point towards the corner of the rectangle, and a line section extending from the center point towards the side line of the rectangle. The volume of the space corresponding to the corner section is smaller than the volume of the space corresponding to the line section.

[0017] The present invention further provides an electronic package, including: a bearing structure; electronic components disposed on the bearing structure; and an aforementioned heat dissipation structure, the heat dissipation body of which is bonded to the electronic components by the first heat dissipation material.

[0018] In the aforementioned electronic package, the adjustment channel has a fluid section and a gas section communicating with each other. The fluid section communicates with the bearing area to adjust the volume of the first heat dissipation material, and the gas section is used to communicate with the outside of the heat dissipation structure to discharge gas.

[0019] In the aforementioned electronic package, the adjustment channel adjusts the volume of the first heat dissipation material in a direction away from the electronic components.

[0020] In the aforementioned electronic package, a ring body is formed in the acting area to surround the side surface of the electronic component, so that the adjustment channel is located between the ring body and the side surface of the electronic component, for the first heat dissipation material to adjust the volume of the first heat dissipation material along the side surface of the electronic component. For example, the adjustment channel is also located between the bottom side of the ring body and the bearing structure.

[0021] In the aforementioned electronic package, a ring body is formed in the acting area, which is disposed on the electronic component by the second heat dissipation material to laterally block the first heat dissipation material. For example, the ring body, the second heat dissipation material and the electronic component cooperate with each other to form a buffer channel, and one port of the buffer channel communicates with the adjustment channel, and the second heat dissipation material seals the other port of the buffer channel. Further, the port width of the buffer channel communicating with the adjustment channel is smaller than the port width of the adjustment channel communicating with the bearing area. Or, the width of the cross-sectional area of the buffer channel is 20 to 300 micrometers. Or, the cross-sectional area of the buffer channel tapers from the bearing area towards the direction of the second heat dissipation material.

[0022] In the foregoing electronic package, the heat dissipation structure further has a ring body surrounding the side surface of the electronic component and combined with the bearing structure by means of a second heat dissipation material, so that the ring body, the second heat dissipation material and the side surface of the electronic component cooperate with each other to form a buffer channel, and one port of the buffer channel communicates with the adjustment channel, and the second heat dissipation material seals the other port of the buffer channel. For example, the cross-sectional area of the buffer channel gradually decreases along the side surface of the electronic component towards the bearing structure. Further, the ring body is formed with a wedge block whose thickness gradually increases towards the bearing structure corresponding to the inner side surface of the electronic component.

[0023] In the foregoing electronic package, the first heat dissipation material contains metal.

[0024] The present invention also provides a manufacturing method of a heat dissipation structure, including: providing a first heat dissipation member and a second heat dissipation member; and stacking the first heat dissipation member and the second heat dissipation member to form the foregoing heat dissipation structure.

[0025] In the foregoing manufacturing method, the first heat dissipation member includes a ring body, and the second heat dissipation member includes the heat dissipation body. After stacking the first heat dissipation member and the second heat dissipation member, the ring body and the heat dissipation body cooperate with each other to form the adjustment channel disposed on the action area.

[0026] As can be seen from the above, in the electronic package, heat dissipation structure and manufacturing method of the present invention, mainly by means of the adjustment channel, a space for adjusting the thermal expansion of the first heat dissipation material is provided, so that at high temperatures, the first heat dissipation material can be stably laid on the electronic component. Therefore, compared with the prior art, the heat dissipation structure of the present invention can effectively prevent the first heat dissipation material from overflowing outside the electronic package, thereby avoiding the problem of contamination of other components outside the electronic package. Description of the Drawings

[0027] Figure 1 It is a cross-sectional schematic view of a conventional semiconductor package.

[0028] Figure 1A It is a cross-sectional schematic view of the first embodiment of the heat dissipation structure of the present invention for an electronic package.

[0029] Figure 2 It is a cross-sectional schematic view of the second embodiment of the heat dissipation structure of the present invention.

[0030] Figure 2A For Figure 2 A top view schematic view along the A0-A0 cross-section.

[0031] Figure 2B For Figure 2 The cross-sectional schematic view of the heat dissipation structure for an electronic package.

[0032] Figure 2C For Figure 2BPartial enlarged sectional view schematic diagram.

[0033] Figure 2D and Figure 2E is Figure 2B Partial three-dimensional schematic diagram.

[0034] Figure 2-1 is Figure 2 Sectional view schematic diagram of another embodiment.

[0035] Figure 2A-1 is Figure 2-1 Top view schematic diagram along the A1 - A1 cross-section.

[0036] Figure 2B-1 is Figure 2-1 Top view schematic diagram along the B1 - B1 cross-section.

[0037] Figure 2-2 is Figure 2-1 Sectional view schematic diagram of another embodiment.

[0038] Figure 2A-2 is Figure 2-2 Top view schematic diagram along the A2 - A2 cross-section.

[0039] Figure 2B-2 is Figure 2-2 Top view schematic diagram along the B2 - B2 cross-section.

[0040] Figure 3-1 , Figure 3-2 and Figure 3-3 is Figure 1A Partial sectional view schematic diagram of different embodiments.

[0041] Figure 3A is Figure 1A Top view schematic diagram along the A3 - A3 cross-section.

[0042] Figures 3A-1 to 3A-7 is Figure 3A Partial top view schematic diagram of different embodiments.

[0043] Figure 3B is Figure 1A Partial enlarged sectional view schematic diagram.

[0044] Figures 3B-1 to 3B-3 is Figure 3B Sectional view schematic diagram of different embodiments.

[0045] Figure 3C is Figure 3B Sectional view schematic diagram of another embodiment.

[0046] Figure 3D is Figure 3A Partial enlarged top view schematic diagram of another embodiment.

[0047] Figure 3D-1 is Figure 3D A partial cross-sectional schematic view of the first heat dissipation member is omitted.

[0048] Figures 4A to 4D is Figure 1A A cross-sectional schematic view of the manufacturing method of the heat dissipation structure of.

[0049] Figure 5A This is a partial cross-sectional schematic view of the third embodiment of the heat dissipation structure of the present invention for an electronic package.

[0050] Figure 5B is Figure 5A A cross-sectional schematic view of another embodiment of.

[0051] Figure 6A This is a cross-sectional schematic view of the fourth embodiment of the heat dissipation structure of the present invention for an electronic package.

[0052] Figure 6B and 6C is Figure 6A A cross-sectional schematic view of other embodiments of.

[0053] Symbol description

[0054] 1: Semiconductor package

[0055] 10: Package substrate

[0056] 11: Semiconductor chip

[0057] 11a, 25a: Active surface

[0058] 11b, 25b: Non-active surface

[0059] 110: Conductive bump

[0060] 111, 250: Underfill

[0061] 12: TIM layer

[0062] 13: Heat dissipation member

[0063] 130: Top sheet

[0064] 131, 21: Support feet

[0065] 14: Adhesive layer

[0066] 2, 3, 5, 6: Heat dissipation structure

[0067] 2a: Heat source

[0068] 2b, 4, 5b, 6b: Electronic package

[0069] 20: Heat sink

[0070] 20a: First side

[0071] 20b: Second side

[0072] 200, 600: Adjustment channel

[0073] 201, 601: Fluid section

[0074] 202, 602: Gas section

[0075] 203, 503: Buffer channel

[0076] 204: Auxiliary channel

[0077] 210: Accommodation port

[0078] 22: Heat sink block

[0079] 22a: First heat dissipation material

[0080] 22b: Second heat dissipation material

[0081] 23, 53, 63: Ring body

[0082] 23a: Frame body

[0083] 24: Bearing structure

[0084] 25: Electronic component

[0085] 25c: Side surface

[0086] 26, 36: Bonding material

[0087] 3a: First heat dissipation component

[0088] 3b: Second heat dissipation component

[0089] 302: Protrusion

[0090] 530: Wedge block

[0091] A: Bearing area

[0092] A1: Corner section

[0093] A2: Line section

[0094] B: Action area

[0095] C: Peripheral area

[0096] D: Cross-sectional area

[0097] D1, D2, D3: Width

[0098] H: Height

[0099] h1, h2: Wave height

[0100] O: Center point

[0101] Q: Central region

[0102] S: Concave-convex surface

[0103] W: Spacing

[0104] Z: Air space

[0105] θ: Included angle. Specific implementation manner

[0106] The following uses specific embodiments to illustrate the implementation manner of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0107] It should be noted that the structures, proportions, sizes, etc. shown in the attached drawings of this specification are only used to cooperate with the content disclosed in the specification for those skilled in the art to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention. Therefore, they do not have technical substantial significance. Any modification of the structure, change of the proportional relationship, or adjustment of the size, without affecting the effects that the present invention can produce and the purposes that can be achieved, should still fall within the scope covered by the technical content disclosed in the present invention. At the same time, the terms such as "upper", "first", "second", and "one" cited in this specification are only for the convenience of clear narration and are not used to limit the scope for the implementation of the present invention. The change or adjustment of their relative relationships should also be regarded as the scope in which the present invention can be implemented without substantial change in the technical content.

[0108] Figure 1A It is a cross-sectional schematic diagram of the first embodiment of the heat dissipation structure 3 of the present invention, and Figure 2 It is a cross-sectional schematic diagram of the second embodiment of the heat dissipation structure 2 of the present invention. The difference between the first embodiment and the second embodiment lies in the manufacturing method. Among them, the heat dissipation structure 3 of the first embodiment is composed of multiple heat dissipation components (such as the first heat dissipation component 3a and the second heat dissipation component 3b), and the heat dissipation structure 2 of the second embodiment is a single plate integrally formed structure. Therefore, the structural features described below are common to the first and second embodiments, and this is hereby stated.

[0109] Such as Figure 1A And Figure 2As shown, the heat dissipation structure 2, 3 includes a sheet-shaped heat dissipation body 20 and at least one support leg 21 erected on the heat dissipation body 20. Among them, the heat dissipation body 20 has opposite first side 20a and second side 20b, and the surface of the first side 20a is sequentially defined with a bearing area A, an action area B adjacent to the bearing area A, and a peripheral area C adjacent to the action area B from the inside (center) to the outside, so that the support leg 21 is arranged in the peripheral area C of the first side 20a, as Figure 2A shown.

[0110] A heat dissipation block 22 protruding relative to the first side 20a is formed in the bearing area A, and the heat dissipation block 22 has an uneven surface S to carry a first heat dissipation material 22a as a thermal interface material (Thermal Interface Material, abbreviated as TIM), so as to be combined with a heat-generating object 2a (to form an electronic package 2b as Figure 2B shown).

[0111] In the first and second embodiments, the heat dissipation block 22 is conical or hill-shaped, and the first heat dissipation material 22a is filled into the concave portions of the uneven surface S of the heat dissipation block 22. For example, the uneven surface S is a plurality of wavy curved surfaces, as Figure 2D or Figure 2E shown, which is arranged in a surrounding manner along the central area Q of the heat dissipation block 22 (such as the circular contour as Figure 2D shown or the rectangular contour as Figure 2E shown) to form a lotus leaf hem shape.

[0112] In addition, the first heat dissipation material 22a has a high thermal conductivity, about 25-80 watts / (meter·Kelvin) (Wm -1 K -1 ). For example, the first heat dissipation material 22a is solid indium (In), liquid metal or any other metal-containing material that will be in a fluid state at normal / high temperature, so as to press the heat dissipation block 22 onto the heat-generating object 2a.

[0113] In addition, the heating element 2a is a packaging module, which includes a carrier structure 24 and electronic components 25 disposed on the carrier structure 24, and the first heat dissipation material 22a is bonded to the electronic components 25. For example, the carrier structure 24 is, for example, a packaging substrate having a core layer and a circuit structure, a packaging substrate in the form of a coreless circuit structure, a silicon interposer (TSI) with through-silicon vias (TSV), or other board types, which includes at least one insulating layer and at least one circuit layer bonded to the insulating layer, such as at least one fan-out type redistribution layer (RDL). It should be understood that the carrier structure 24 can also be other materials for carrying chips, such as a lead frame, a wafer, or other board bodies with metal routing, etc., and is not limited to the above.

[0114] In addition, the electronic components 25 are active components, passive components, chip modules, or a combination thereof. Among them, the active components are, for example, semiconductor chips, and the passive components are, for example, resistors, capacitors, and inductors. In the first and second embodiments, the electronic components 25 are semiconductor chips, which have opposite working surfaces 25a and non-working surfaces 25b, and the working surface 25a is disposed on the circuit layer of the carrier structure 24 and electrically connected to the circuit layer in a flip-chip manner by a plurality of conductive bumps such as solder materials, metal pillars, or others, and the electronic components 25 are encapsulated with underfill 250, and the first heat dissipation material 22a is bonded to the non-working surface 25b; alternatively, the electronic components 25 can be electrically connected to the circuit layer of the carrier structure 24 by a plurality of bonding wires (not shown in the figure) in a wire bonding manner; or, the electronic components 25 can be directly in contact with the circuit layer of the carrier structure 24. It should be understood that there are many ways for the electronic components 25 to be electrically connected to the carrier structure 24, and the required types and quantities of electronic components can be disposed on the carrier structure 24, and are not limited to the above.

[0115] An adjustment channel 200 communicating from the bearing area A to the peripheral area C is formed in the action area B to adjust the volume of the first heat dissipation material 22a. Among them, a ring body 23 (such as Figure 2C shown) that can be bonded to the heating element 2a (or the electronic components 25) by the second heat dissipation material 22b is formed in the action area B, so that the adjustment channel 200 defines a fluid section 201 formed by the ring body 23 and the heat dissipation block 22, and at least one gas section 202 formed by the ring body 23 and the heat dissipation body 20.

[0116] In the first and second embodiments, the fluid section 201 can accommodate the first heat dissipation material 22a to adjust the volume of the first heat dissipation material 22a, and one end of the gas section 202 communicates with the fluid section 201, while the other end is open and communicates with the outside of the heat dissipation structures 2 and 3 to maintain an air state to adjust the pressure of the internal gas. When the first heat dissipation material 22a expands due to heat, the excess gas in the electronic package 2b can be quickly discharged to a predetermined location. For example, one open end of the gas section 202 communicates with the fluid section 201, and the other open end of the gas section 202 is away from the fluid section 201, such as Figure 2B shown in communicating with the peripheral area C, or as Figure 2-1 and Figure 2-2 shown in communicating with the outside environment.

[0117] The fluid section 201 is arranged in a ring shape, such as Figure 2A , Figure 2B-1 and Figure 2B-2 shown, and its cross-sectional area D tapers in the direction of the gas section 202, as Figure 2 shown.

[0118] The gas section 202 is a channel, such as Figure 2A , Figure 2A-1 and Figure 2A-2 shown, and its cross-sectional area (such as the distance W between opposite sides) can be tapered as required (such as the upper surface of the ring body 23 shown in Figure 2A ) or made uniform (such as shown in Figure 2A-1 and Figure 2A-2 ), and if its cross-sectional area is tapered, the gas discharge velocity can gradually increase, which is conducive to the rapid dissipation of gas to the outside. For example, the channel path and shape of the gas section 202 can be designed as required, such as the tapered funnel shape shown in Figure 2A , the short straight strip shape shown in Figure 2A-1 , the long straight strip shape shown in Figure 2A-2 or other appropriate designs, without particular limitation. It should be understood that the adjustment channel 200 can have a plurality of such gas sections 202, such as Figure 2A-1 or Figure 2A-2 shown, and each gas section 202 communicates with the fluid section 201.

[0119] In addition, at least one buffer channel 203 communicating with the fluid section 201 can also be formed in the action area B, such as Figure 2 and Figure 2BAs shown, the buffer channel 203 and the gas section 202 are respectively disposed on opposite sides of the ring body 23, so that the first heat dissipation material 22a can be filled into the buffer channel 203 after being pressed, so as to disperse the pressing force received by the first heat dissipation material 22a during the process. For example, one port of the buffer channel 203 communicates with the fluid section 201, and the second heat dissipation material 22b seals the other port of the buffer channel 203 to prevent the first heat dissipation material 22a from diffusing and flowing out from the other port of the buffer channel 203. Therefore, the second heat dissipation material 22b can prevent the problem of the first heat dissipation material 22a leaking from the side (i.e., the direction of the side surface 25c of the electronic component 25).

[0120] Therefore, in the electronic package 2b, when the second heat dissipation material 22b closes the buffer channel 203, a high pressure will be formed in the buffer channel 203 (the high pressure formed when the gas is squeezed and cannot dissipate), causing the first heat dissipation material 22a to flow toward the fluid section 201.

[0121] In addition, the second heat dissipation material 22b has a low thermal conductivity, about 2-20 watts / (meter·Kelvin) (Wm -1 K -1 ), which can be a bonding film such as a silicone material or an ultraviolet (UV) glue such as an acrylic material, and it can also contain metal particles, graphite materials or other appropriate fillers. For example, the silicone material not only has high ductility, but also has a higher thermal conductivity than the UV glue. Therefore, compared with the UV glue, it is better to select the silicone material for the second heat dissipation material 22b.

[0122] The support feet 21 are disposed at the edge of the peripheral area C, so that the support feet 21 are far away from the action area B.

[0123] In the first and second embodiments, the peripheral area C can be formed with a frame body 23a corresponding to the ring body 23 as required, so that at least one auxiliary channel 204 extending from the gas section 202 is formed between the ring body 23 and the frame body 23a, as Figure 2 shown, so that the gas section 202 and the auxiliary channel 204 form a curved channel. For example, the support feet 21 can be adjacent to the frame body 23a to form a relatively regular-shaped air space Z in the peripheral area C, as Figure 2B shown.

[0124] The support feet 21 are erected on the carrier structure 24 by a bonding material 26 such as a glue material.

[0125] In the first and second embodiments, the support feet 21 can be formed with at least one accommodating port 210 that can be filled with a colloid (such as the bonding material 26) as required.

[0126] Therefore, for the heat dissipation structures 2 and 3 of the present invention, by adopting a design with a gradually decreasing cross-sectional area D in the fluid section 201, the width D1 at the inlet side of the first heat dissipation material 22a is made larger (the pressure here is smaller), as Figure 2C shown. At the same time, since the width D3 of the cross-sectional area of the port of the buffer channel 203 (ranging from 20 to 300 micrometers, such as 50 micrometers at the inlet) is relatively smaller than the larger width D1 of the fluid section 201, when the first heat dissipation material 22a is under pressure, it will flow towards the fluid section 201 with a smaller pressure. Additionally, when the first heat dissipation material 22a flows under pressure, its lateral flow speed will be relatively fast. Therefore, the buffer channel 203 can provide a buffering mechanism for lateral flow, so that the impact force of the first heat dissipation material 22a flowing towards the fluid section 201 will not be too large and spill into the gas section 202.

[0127] Furthermore, the width D2 of the opening side where the fluid section 201 communicates with the gas section 202 is smaller, presenting a design with a gradually decreasing cross-sectional area, as Figure 2C shown. This can prevent the volume (or the amount of liquid metal) of the first heat dissipation material 22a initially filled in the fluid section 201 from being excessive. Therefore, most of the first heat dissipation material 22a will still be combined above the non-functional surface 25b of the electronic component 25, and the usage amount of the first heat dissipation material 22a (or liquid metal) is reduced to lower the material cost.

[0128] In addition, due to the size design of the gas section 202 being a microchannel (as Figure 2C shown, the height H of the cross-sectional area of the gas section 202 is from 10 to 1200 micrometers, preferably from 10 to 800 micrometers, such as 500 micrometers), the surface tension and cohesive force can be utilized to produce an effect of preventing the first heat dissipation material 22a from overflowing here.

[0129] Based on the manufacturing method, as Figure 1A shown, the heat dissipation structure 3 of the first embodiment divides Figure 2 the heat dissipation structure 2 of the second embodiment shown into two plates, and the two plates are respectively used as the first heat dissipation member 3a and the second heat dissipation member 3b. After the first heat dissipation member 3a is combined with the second heat dissipation member 3b by a bonding material 36 such as a glue material, the heat dissipation structure 3 forms the adjustment channel 200, the buffer channel 203, and the auxiliary channel 204.

[0130] In the first embodiment, the first heat dissipation member 3a includes the support feet 21, the ring body 23, and the frame body 23a, and the second heat dissipation member 3b includes the heat dissipation body 20 and the heat dissipation block 22. Among them, the bonding material 36 is formed between the heat dissipation body 20 and the support feet 21, such as Figure 3A the ring distribution shown.

[0131] In other embodiments, the configurations of the first heat sink 3a and the second heat sink 3b can be designed according to requirements. For example, in Figure 3-1 , the first heat sink 3a includes the ring body 23, and the second heat sink 3b includes the heat dissipation body 20, the support feet 21, and the heat dissipation block 22, and the configurations of the frame body 23a and the bonding material 36 are omitted. Or, in Figure 3-2 , the first heat sink 3a includes the heat dissipation block 22 and the ring body 23, and the second heat sink 3b includes the heat dissipation body 20 and the support feet 21, and the configurations of the frame body 23a and the bonding material 36 are omitted. Or, in Figure 3-3 , the first heat sink 3a includes the support feet 21, the heat dissipation block 22, the ring body 23, and the frame body 23a, and the second heat sink 3b includes the heat dissipation body 20. It should be understood that the plate shapes of the first heat sink 3a and the second heat sink 3b can be designed according to requirements and are not particularly limited.

[0132] In the first and second embodiments, the groove path and shape of the gas section 202 located above the ring body 23 can also be designed according to requirements, such as Figure 3A-1 the upper surface of the arc-shaped ring body 23 shown, Figure 3A-2 the upper surface of the tapered fin-shaped ring body 23 shown, such as Figure 3A-3 the upper surface of the multiple small tapered funnel-shaped ring bodies 23 shown, such as Figure 3A-4 the upper surface of the multiple staggered complementary trapezoidal ring bodies 23 shown. Even at least one bump 302 can be formed on the channel for a flow splitting design (as shown in Figure 3A-5 or Figure 3A-6 ). It should be understood that the groove path and shape of the gas section 202 are not limited to the tapered form and can also be straight, such as Figure 3A-7 the upper surface of the multiple rectangular ring bodies 23 shown.

[0133] In addition, the cross-sectional area D of the fluid section 201 can be changed according to the relative surfaces between the ring body 23 and the heat dissipation block 22, so that the cross-sectional area D of the fluid section 201 can be tapered based on an angle θ formed by its opposite sides, and the angle θ is at most 70 degrees (as shown in Figure 3B ). For example, the side surface of the ring body 23 is a vertical surface relative to the surface of the first side 20a of the heat dissipation body 20, and the side surface of the heat dissipation block 22 is an inclined surface relative to the surface of the first side 20a of the heat dissipation body 20 to form a tapered channel as shown in Figure 3B . Or, the side surface of the ring body 23 is an inclined surface relative to the surface of the first side 20a of the heat dissipation body 20, and the side surface of the heat dissipation block 22 is a vertical surface relative to the surface of the first side 20a of the heat dissipation body 20 to form a tapered channel as shown in Figure 3B-1The tapered channel shown. Alternatively, the side surfaces of the ring body 23 and the side surface of the heat sink 22 are both inclined planes with respect to the surface of the first side 20a of the heat dissipation body 20 (as Figure 3B-2 the tapered channel shown). It should be understood that the cross-sectional area D of the fluid section 201 can also be made uniform, such as when the side surfaces of the ring body 23 and the side surface of the heat sink 22 are both perpendicular planes with respect to the surface of the first side 20a of the heat dissipation body 20 (as Figure 3B-3 the flattened channel shown).

[0134] In addition, the height H of the cross-sectional area of the gas section 202 can also be tapered based on an angle formed by its opposite sides, and the angle is at most 70 degrees, and is not limited to Figure 3B the equal-width state shown. For example, in order to prevent the first heat dissipation material 22a from overflowing into the gas section 202, the height H of the gas section 202 is 10 to 1200 micrometers, preferably 10 to 800 micrometers, and the minimum width D2 of the fluid section 201 (i.e., where the fluid section 201 is at the open end connecting to the gas section 202) needs to be less than the minimum height H of the gas section 202.

[0135] It should be understood that the width D3 of the buffer channel 203 (as Figure 3B the flattened channel shown or as Figure 3C the tapered channel shown) or the width of the auxiliary channel 204 ( Figure 3B the uniform form shown) can also be changed as needed. Preferably, the inlet width D3 of the buffer channel 203 is 20 to 300 micrometers.

[0136] In addition, a space is defined on the bearing area A. One of the opposite sides of the space is the surface of the first side 20a, and the other is a horizontal plane spaced from the surface of the first side 20a by a gap, and the space is generally rectangular. In this embodiment, the horizontal plane is the upper surface of the electronic component, as Figure 3D the bearing area A shown, and its center point O extends towards the rectangular corner to form a narrow and long (as Figure 3D the sword-shaped) corner section A1, and extends from the center point O towards the rectangular side to form an expanding (as Figure 3D the triangular) line section A2, and the heights of the wavy surfaces of the concave-convex surface of the heat sink 22 are inconsistent, that is, the wavy heights of the adjacent corner section A1 and line section A2 of the space are different. For example, the wavy height h1 of the corner section A1 is higher (as Figure 3D-1 shown, and it is closer to the electronic component 25), and the wavy height h2 of the line section A2 is lower (as Figure 3D-1 shown, and it is farther from the electronic component 25).

[0137] Therefore, in the heat dissipation structure 2, 3 of the present invention, the wave height h1 of the corner section A1 is higher than the wave height h2 of the line section A2, and the volume of the space corresponding to the corner section A1 is smaller than the volume of the space corresponding to the line section A2, so as to distribute the flow velocity of the first heat dissipation material 22a, that is, the flow velocity of the first heat dissipation material 22a in the corner section A1 is faster than the flow velocity of the first heat dissipation material 22a in the line section A2, making the time for the first heat dissipation material 22a to reach the side edge and the corner of the bearing area A (or the heat dissipation block 22) similar. Therefore, the heat dissipation block 22 can evenly distribute the first heat dissipation material 22a, improving the heat dissipation uniformity and avoiding the problem of thermal stress concentration of the electronic component 25.

[0138] In addition, in the heat dissipation structure 2, 3 of the present invention, the distance W and / or height H on the relative two sides of the gas section 202 are designed to be tapered (i.e., the cross-sectional area of the gas section 202 tapers in the direction away from the electronic component 25), so as to further prevent the first heat dissipation material 22a from spilling. For example, usually, through the design of the height H of the gas section 202, the surface tension and cohesive force are utilized to prevent the first heat dissipation material 22a from flowing into the gas section 202. However, in case of an accident, when the first heat dissipation material 22a is squeezed and flows into the gas section 202, the tapered design of the cross-sectional area of the gas section 202 can prevent the first heat dissipation material 22a from overflowing outside the gas section 202, thus avoiding the problem of spillage pollution.

[0139] In addition, if the buffer channel 203 (as Figure 3C shown) is a tapered channel, its effect of buffering the lateral flow pressure of the first heat dissipation material 22a is better.

[0140] Figures 4A to 4D FIG. is a schematic cross-sectional view of a method for manufacturing an electronic package 4 using the heat dissipation structure 3 of the first embodiment. In this embodiment, the heat dissipation structure plate including the first heat dissipation member 3a and the second heat dissipation member 3b in FIG. 3 is used for illustration.

[0141] As Figure 4A shown, first, the heat-generating object 2a and the first heat dissipation member 3a are provided, and the second heat dissipation material 22b is arranged on the ring body 23 of the first heat dissipation member 3a, and a bonding material 26 is formed on the bearing structure 24 of the heat-generating object 2a.

[0142] As Figure 4B shown, then, the heat-generating object 2a and the first heat dissipation member 3a are combined, so that the ring body 23 of the first heat dissipation member 3a is combined to the electronic component 25 of the heat-generating object 2a through the second heat dissipation material 22b, and the support feet 21 of the first heat dissipation member 3a are combined to the bonding material 26 on the bearing structure 24 of the heat-generating object 2a, making the non-functional surface 25b of the electronic component 25 exposed outside the ring opening of the ring body 23.

[0143] As Figure 4C shown, thereafter, the second heat sink 3b is provided, on the concave-convex surface S of the heat sink block 22 of which the first heat dissipation material 22a is disposed, and another bonding material 36 is formed on the support leg 21 of the first heat sink 3a. Wherein, the first heat dissipation material 22a may also be disposed on the non-functional surface 25b of the electronic component 25 according to requirements.

[0144] As Figure 4D shown, the second heat sink 3b is combined to the heat-generating object 2a and the first heat sink 3a, so that the heat sink block 22 of the second heat sink 3b is pressed against the non-functional surface 25b of the electronic component 25 through the first heat dissipation material 22a, and the heat sink body 20 of the second heat sink 3b is combined with the bonding material 36 on the support leg 21.

[0145] Therefore, in the foregoing manufacturing method, the second heat sink 3b abuts against the upper surface of the first heat sink 3a to maintain the central height of the heat sink body 20 of the second heat sink 3b, preventing the central portion of the second heat sink 3b from directly contacting the non-functional surface 25b of the electronic component 25 and damaging the electronic component 25.

[0146] Figure 5A It is a schematic cross-sectional view of the third embodiment of the heat dissipation structure 5 of the present invention. The difference between this embodiment and the first embodiment lies in the configuration of the ring body 53, so the same parts will not be described in detail hereinafter.

[0147] As Figure 5A shown, the ring body 53 is combined to the bearing structure 24 of the heat-generating object 2a through the second heat dissipation material 22b and is not disposed on the non-functional surface 25b of the electronic component 25, so that the buffer channel 503 and the fluid section 201 are channels extending in the same direction (such as from the surface of the bearing structure 24 to the first side 20a of the heat sink body 20).

[0148] In this embodiment, the buffer channel 503 is located between the ring body 53 and the side surface 25c of the electronic component 25, and the first heat dissipation material 22a will be pressured to flow to the side surface 25c or the bottom glue 250 of the electronic component 25, but the buffer channel 503 is sealed by the second heat dissipation material 22b to stop the first heat dissipation material 22a from flowing out of the ring body 53 from the buffer channel 503.

[0149] In addition, the width D3 of the buffer channel 503 can be changed according to requirements. For example, by the bottom glue 250 surrounding the side surface 25c of the electronic component 25 in a wedge shape, the width D3 of the buffer channel 503 is tapered, as Figure 5A shown, tapered from top to bottom. Or, as Figure 5BAs shown, a wedge 530 is formed on the end side of the ring body 53 that is combined with the second heat dissipation material 22b and faces the side surface 25c of the electronic component 25, in the shape of a slope, so as to reduce the width D3 of the buffer channel 503.

[0150] Therefore, the heat dissipation structure 5 of the present invention can form an up-and-down bidirectional adjustable fluid channel with the fluid section 201 through the buffer channel 503, so as to provide volume adjustment for the up-and-down thermal expansion of the first heat dissipation material 22a and achieve the purpose of three-dimensional heat dissipation.

[0151] In addition, since the first heat dissipation material 22a of this embodiment contacts the side surface 25c of the electronic component 25 to assist in heat dissipation, the three-dimensional heat dissipation effect of this embodiment is better than that of the first and second embodiments.

[0152] Figure 6A It is a schematic cross-sectional view of the fourth embodiment of the heat dissipation structure 6 of the present invention. The difference between this embodiment and the above embodiments lies in the design of the bearing area A and the acting area B, so the same parts will not be described in detail below.

[0153] As Figure 6A shown in the electronic package 6b, the ring body 63 serves as an inner lead, and it is arranged in the same direction as the support lead 21. Therefore, no gas section is formed between the ring body 63 and the heat dissipation body 20.

[0154] In this embodiment, the fluid section 601 of the adjustment channel 600 is located between the ring body 63 and the side surface 25c of the electronic component 25, for the first heat dissipation material 22a to be arranged along the side surface 25c of the electronic component 25, and the gas section 602 is located between the bottom side of the ring body 63 and the bearing structure 24.

[0155] In addition, the cross-sectional area of the fluid section 601 of the adjustment channel 600 can be changed as needed, such as Figure 6A the consistent pattern shown or as Figure 6B the tapered pattern shown. For example, if the fluid section 601 is in a tapered pattern, the gas section 602 can be extended to between the ring body 63 and the side surface 25c of the electronic component 25 as needed, as Figure 6C shown.

[0156] In addition, the length of the fluid section 601 of the adjustment channel 600 can also be changed as needed, such as Figure 6A and Figure 6B the long channel shown or as Figure 6C the short channel shown.

[0157] In addition, since there is no need to design a buffer channel, the second heat dissipation material 22b is not required.

[0158] It should be noted that the fluid section 601 of the adjustment channel 600 extends from the heat sink 20 towards the bearing structure 24, such that the thermal expansion adjustment direction of the first heat dissipation material 22a is along the side surface 25c of the electronic component 25. Therefore, compared with the thermal expansion adjustment direction of the first heat dissipation material 22a described in the first embodiment, which is along the direction away from the electronic component 25, in this embodiment, due to the influence of the gravity factor (its expansion direction is the direction of gravity, and its retraction direction is the anti-gravity direction), the first heat dissipation material 22a in the first embodiment has the advantages of slower expansion (its expansion direction is the anti-gravity direction) and faster retraction (its retraction direction is the direction of gravity). Therefore, for the effect of preventing overflow of the heat dissipation material, the adjustment channel design of the first embodiment is superior to that of this embodiment.

[0159] In summary, for the electronic packages 2b, 4, 5b, 6b and their heat dissipation structures 2, 3, 5, 6 and manufacturing methods of the present invention, mainly the fluid sections 201, 601 in the adjustment channels 200, 600 provide space for adjusting the thermal expansion of the first heat dissipation material 22a, and then the gas sections 202, 602 provide adjustment of the air volume, enabling the air to dissipate and discharge outward without being squeezed. Therefore, compared with the prior art, the fluid sections 201, 601 of the present invention can provide space for adjusting the thermal expansion of the first heat dissipation material 22a, so that at high temperatures, the first heat dissipation material 22a can be stably laid on the non-functional surface 25b of the electronic component 25. This can not only effectively prevent the first heat dissipation material 22a from overflowing outside the electronic packages 2b, 4, 5b, 6b, thus avoiding the problem of other components outside the electronic packages 2b, 4, 5b, 6b being contaminated, but also avoid the problem of popcorn holes by means of the gas sections 202, 602.

[0160] In addition, the adjustment channels 200, 600 are arranged around the bearing area A, enabling the bearing area A to be combined with the heat-generating object 2a (the non-functional surface 25b of the electronic component 25) with a larger area (such as a complete heat dissipation block 22), which is thus beneficial for heat dissipation.

[0161] Furthermore, due to the design that the cross-sectional area D of the fluid sections 201, 601 tapers towards the gas sections 202, 602, the first heat dissipation material 22a can be filled into the fluid sections 201, 601. Therefore, compared with the design of the two-dimensional (such as the plane formed by length and width) distribution area of the existing heat dissipation material, the heat dissipation structures 2, 3, 5, 6 of the present invention can generate a three-dimensional distribution area (such as the space formed by length, width and height), making the heat dissipation effect of the heat dissipation structures 2, 3, 5, 6 of the present invention better.

[0162] The above embodiments are only used to illustrate the principles and effects of the present invention by way of example, rather than to limit the present invention. Any person skilled in the art can modify the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of the protection of the rights of the present invention shall be as set forth in the claims.

Claims

1. A heat dissipation structure, characterized in that, comprising: a heat dissipation body having opposite first and second sides, and a bearing area and an acting area adjacent to the bearing area are defined on the surface of the first side, wherein, a first heat dissipation material is arranged on the bearing area; an adjustment channel arranged on the acting area, one end of the adjustment channel is open and communicates with the outside of the heat dissipation structure, and the other end of the adjustment channel communicates with the bearing area to adjust the volume of the first heat dissipation material; and a buffer channel formed on the acting area to communicate with the adjustment channel, and the first heat dissipation material fills into the buffer channel after being pressed.

2. The heat dissipation structure according to claim 1, characterized in that, the adjustment channel has a fluid section and a gas section communicating with each other, the fluid section communicates with the bearing area to adjust the volume of the first heat dissipation material, and one end of the gas section opposite to the fluid section is open and communicates with the outside of the heat dissipation structure.

3. The heat dissipation structure according to claim 2, characterized in that, the cross-sectional area of the fluid section gradually decreases from the bearing area towards the gas section.

4. The heat dissipation structure according to claim 3, characterized in that, the fluid section gradually decreases based on an angle formed by its opposite sides, and the angle is at most 70 degrees.

5. The heat dissipation structure according to claim 3, characterized in that, the minimum width of the cross-sectional area of the fluid section is smaller than the height of the cross-sectional area of the gas section.

6. The heat dissipation structure according to claim 2, characterized in that, one open end of the gas section communicates with the fluid section, and the other open end of the gas section is far from the fluid section, so that the cross-sectional area of the gas section gradually decreases from the fluid section towards the other open end.

7. The heat dissipation structure according to claim 6, characterized in that, the gas section gradually decreases based on an angle formed by its opposite sides, and the angle is at most 70 degrees.

8. The heat dissipation structure according to claim 2, characterized in that, the adjustment channel has a plurality of the gas sections, and each of the gas sections communicates with the fluid section.

9. The heat dissipation structure according to claim 2, characterized in that, the height of the cross-sectional area of the gas section is 10 micrometers to 1200 micrometers.

10. The heat dissipation structure according to claim 1, characterized in that, the adjustment channel is formed by stacking a first heat dissipation member and a second heat dissipation member.

11. The heat dissipation structure according to claim 1, characterized in that, a space is defined on the bearing area, one of the opposite sides of the space is the surface of the first side, and the other is a horizontal plane spaced from the surface of the first side by a gap, and the space is rectangular, the bearing area has a corner section extending from the center point towards the corner of the rectangle, and a line section extending from the center point towards the side line of the rectangle, the volume of the space corresponding to the corner section is smaller than the volume of the space corresponding to the line section.

12. An electronic package, characterized in that, comprising: a bearing structure; electronic components arranged on the bearing structure; and a heat dissipation structure according to claim 1, wherein the heat dissipation body is combined with the electronic components through the first heat dissipation material.

13. The electronic package according to claim 12, wherein, the adjustment channel has a fluid section and a gas section that are connected and communicate with each other. The fluid section communicates with the bearing area to adjust the volume of the first heat dissipation material, and the gas section is used to communicate with the outside of the heat dissipation structure to discharge gas.

14. The electronic package according to claim 12, wherein, the adjustment channel adjusts the volume of the first heat dissipation material in a direction away from the electronic component.

15. The electronic package according to claim 12, wherein, a ring body is formed in the acting area so that the ring body surrounds the side surface of the electronic component, and the adjustment channel is located between the ring body and the side surface of the electronic component, for the first heat dissipation material to adjust the volume of the first heat dissipation material along the side surface of the electronic component.

16. The electronic package according to claim 15, wherein, the adjustment channel is also located between the bottom side of the ring body and the bearing structure.

17. The electronic package according to claim 12, wherein, a ring body is formed in the acting area, and it is provided on the electronic component through the second heat dissipation material, so that the second heat dissipation material laterally blocks the first heat dissipation material.

18. The electronic package according to claim 17, wherein, the ring body, the second heat dissipation material and the electronic component cooperate with each other to form the buffer channel, and one port of the buffer channel communicates with the adjustment channel, and the second heat dissipation material seals the other port of the buffer channel.

19. The electronic package according to claim 18, wherein, the port width of the buffer channel communicating with the adjustment channel is smaller than the port width of the adjustment channel communicating with the bearing area.

20. The electronic package according to claim 18, wherein, the width of the cross-sectional area of the buffer channel is 20 to 300 micrometers.

21. The electronic package according to claim 18, wherein, the cross-sectional area of the buffer channel gradually shrinks from the bearing area towards the direction of the second heat dissipation material.

22. The electronic package according to claim 12, wherein, the heat dissipation structure further has a ring body that surrounds the side surface of the electronic component and is combined with the bearing structure through the second heat dissipation material, so that the ring body, the second heat dissipation material and the side surface of the electronic component cooperate with each other to form the buffer channel, and one port of the buffer channel communicates with the adjustment channel, and the second heat dissipation material seals the other port of the buffer channel.

23. The electronic package according to claim 22, wherein, the cross-sectional area of the buffer channel gradually shrinks along the side surface of the electronic component towards the direction of the bearing structure.

24. The electronic package according to claim 23, wherein, the ring body is formed with a wedge block with a gradually increasing thickness in the direction towards the bearing structure corresponding to the inner side surface of the electronic component.

25. The electronic package according to claim 12, wherein, the first heat dissipation material contains metal.

26. A manufacturing method of a heat dissipation structure, wherein, it includes: providing a first heat dissipation member and a second heat dissipation member; and stacking the first heat dissipation member and the second heat dissipation member to form a heat dissipation structure as described in claim 1.

27. The manufacturing method of the heat dissipation structure according to claim 26, characterized in that, the first heat dissipation member includes an annular body, and the second heat dissipation member includes the heat dissipation body. After stacking the first heat dissipation member and the second heat dissipation member, the annular body and the heat dissipation body cooperate to form the adjustment channel disposed on the action area.

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