Cooling device and heat sink assembly comprising the same

Abstract

This application relates to a cooling device and a radiator assembly including the cooling device. The cooling device is used to cool a radiator (24) having a plurality of cooling fins (26) disposed on a base (241). The cooling device includes a centrifugal fan (25) having a fan inlet (251) and a fan outlet (252), a support (21) for mounting the fan (25) above the radiator (24), and a baffle (29) positionable between the support (21) and the radiator base (241). The baffle (29) defines an inlet path for supplying air across the radiator base (241) between the cooling fins to the fan inlet (251) and an outlet path for discharging air from the fan outlet (252).

Description

Technical Field

[0001] This disclosure relates to a cooling device, and more particularly to a cooling device for cooling the housing of an electronic device. This disclosure particularly relates to a cooling device for an automotive electronic controller. This disclosure also relates to a radiator assembly incorporating such a cooling device. Background Technology

[0002] Electronic controllers are essential components in modern vehicles. Automotive controllers often contain densely packed electronic components, which are prone to generating significant heat during operation.

[0003] Within such an architecture, if electronic components are not adequately cooled, they may overheat, which could impair their operation and lead to premature degradation. Therefore, cooling systems are often a fundamental requirement for electronic architectures within vehicles.

[0004] In this regard, centrifugal fans are typically used for air cooling devices because of their ability to generate high-pressure flow, which allows air to be driven through complex airflow paths, resulting in high-pressure losses. Centrifugal fans can thus generate high flow rates on the surface of the housing to effectively remove heat from the electronic controller housed below. In such devices, the housing is provided with multiple cooling fins surrounding the fan to enhance heat exchange. Thus, the housing functions as a heat sink.

[0005] in this regard, Figure 1 An exploded view of a prior art cooling assembly 10 for an electronic controller is shown. The cooling assembly 10 includes an electronic controller housing 14, which is mounted on an automotive electronic controller and forms a radiator for its components. A plurality of cooling fins 16 are disposed above an upper cooling surface at the base of the housing 14 to improve heat transfer. A centrifugal fan 15 is fixed to the housing 14 at a central gap between the radially distributed cooling fins 16. A cover 11 is fixed to the cooling fins 16 to define a cooling housing and includes a central aperture located above the impeller of the fan 11 to define an inlet. The cover 11 is secured to the housing 14 by a plurality of fasteners 13 extending through spacers 12.

[0006] like Figure 2 As shown in the isometric schematic diagram, when the above-mentioned device is in use, air is drawn into the fan 15 through a hole provided in the cover 11 from a vertical direction 17 aligned with the rotation axis of the impeller. The fan then forces the air to exit perpendicular to the rotation axis of the impeller. In this way, the air is rapidly driven through the outlet path between the cooling fins, transferring heat away from the fin surface. However, this existing device has many problems.

[0007] First, the area used for heat exchange is limited by the space required to install the centrifugal fan 15. That is, the area directly below the centrifugal fan receives limited cooling because the incoming air is driven laterally away from the center. Furthermore, due to the use of a larger, more powerful fan to improve cooling, a larger area of ​​the casing is not effectively cooled because of the fan's presence.

[0008] Furthermore, the height of the controller housing 14, particularly the height of the cooling fins 16, is limited by the need for an air gap above the cover 11. This is necessary to allow air to be freely drawn from the surrounding environment into the centrifugal fan 15, and thus the height is limited when the component is intended for a compact mounting location, as is common in the automotive industry. Here, the necessary small cooling fins have a limiting effect on the overall cooling efficiency of the centrifugal fan.

[0009] Furthermore, undesirable heating of the controller housing can occur due to the contact and close proximity of the fan motor. The operation of the fan motor, especially at high speeds, can generate a significant amount of heat, which is conducted to the controller housing. This can cause a localized increase in temperature, partially offsetting the cooling effect of the generated airflow.

[0010] To address the aforementioned issues, a solution has been proposed that replace the axial fans mounted on the outer periphery of the housing with centrifugal fans. However, this solution introduces new drawbacks, as they cannot generate sufficient air pressure individually, thus requiring multiple fans and / or larger components. This leads to increased costs and necessitates significant redesign of existing systems.

[0011] Given the above, there is still a need for a compact device that provides effective cooling for electronic controllers. Summary of the Invention

[0012] According to a first aspect, a cooling device is provided for cooling a radiator having a plurality of cooling fins disposed on a base, the cooling device comprising: a centrifugal fan having a fan inlet and a fan outlet; a support for mounting the fan above the radiator base; and a baffle capable of being located between the support and the radiator base to define an inlet path and an outlet path, the inlet path for supplying air across the radiator base between the cooling fins to the fan inlet, and the outlet path for discharging air from the fan outlet.

[0013] In this way, cooling airflow can be directed across the entire base of the radiator, including the area directly below the fan. Furthermore, since the fan is not directly mounted to the radiator, the heat dissipated by the fan motor is not directly transferred to the radiator, thus improving its overall cooling performance.

[0014] Furthermore, the proposed solution allows for greater installation flexibility in automotive applications. Specifically, since both the inlet and outlet air paths can flow perpendicular to the fan's rotation direction, no air gap is required above the support. This allows the component to be installed in a more compact location than could otherwise be.

[0015] In one embodiment, at least one of the support member and the baffle comprises metal and / or plastic. Metal can provide superior cooling performance due to its high thermal conductivity. Conversely, a plastic baffle can provide a lightweight and cost-effective construction. In one embodiment, the support member forms the top baffle. In another embodiment, the baffle is metal and the support member is plastic. In this case, the metal baffle enhances the cooling system performance, while the support baffle provides lightweight structural support and flow guidance.

[0016] In one embodiment, the heat sink forms a housing for the electronic controller.

[0017] In one embodiment, the baffle is a plate including a plurality of slits for receiving the cooling fins.

[0018] In one embodiment, the cutout is shaped for placement on a mounting structure disposed on the cooling fins to support the baffle.

[0019] In one embodiment, the cutout is shaped to form a press-fit interface against the cooling fins for securing the baffle to the cooling fins. This creates an airtight seal to prevent air from circulating between the inlet and outlet paths.

[0020] In one embodiment, the baffle further includes an airflow guide disposed at its lateral periphery and including an inclined surface for guiding air from the outlet path away from the inlet path. This minimizes the risk of heated air exiting the outlet path recirculating back through the inlet path.

[0021] In one embodiment, the baffle further includes an aperture into which the fan is received, such that the baffle is positioned between the fan inlet and the fan outlet. This allows the fan inlet and fan outlet to be separated by the baffle. The baffle aperture can form a seal around the fan.

[0022] In one embodiment, the support includes a flat mounting surface, and the fan is mounted to the flat mounting surface such that the fan inlet is positioned away from the support. This eliminates the need for an inlet hole in the support, thus utilizing the space above the support. Consequently, taller cooling fins can also be accommodated, thereby improving cooling performance.

[0023] In one embodiment, at least one of the inlet path and the outlet path includes multiple channels. These channels may be defined between multiple cooling fins.

[0024] According to a second aspect, a heat sink assembly for an electronic controller is provided, the heat sink assembly comprising: a heat sink base; a plurality of cooling fins disposed on the heat sink base; a support member; a centrifugal fan mounted to the support member and located above the heat sink base, the centrifugal fan having a fan inlet and a fan outlet; and a baffle located between the support member and the heat sink base, defining an inlet path for supplying air between the cooling fins above the heat sink base to the fan inlet and an outlet path for discharging air from the fan outlet.

[0025] In one embodiment, the cooling fins cover the entire surface of the radiator base. This allows cooling airflow to be provided to the area directly below the fan.

[0026] In one embodiment, the radiator base includes a cooling surface, wherein the cooling fins project perpendicularly to the cooling surface, and wherein the baffle and the support are located in a plane parallel to the cooling surface.

[0027] In one embodiment, the cooling fins include a height-reduced region in which the fan is received.

[0028] In this embodiment, the height of the cooling fins located at the radial ends of the radiator base is equal to the distance between the radiator base and the support member. In this way, the cooling fins utilize the entire available space to form a cooling channel.

[0029] In one embodiment, the support engages with the apex of one or more of the plurality of cooling fins.

[0030] In one embodiment, the cooling fins include a mounting structure for supporting the baffle. Thus, the baffle can be positioned at the midpoint of the cooling fins, and the channel dimensions can vary depending on the location of the mounting structure.

[0031] In one embodiment, the baffle is fixed to the cooling fins by at least one of thermally conductive adhesive or by press-fitting. Attached Figure Description

[0032] Illustrative embodiments will now be described with reference to the accompanying drawings, in which:

[0033] Figure 1 This is an exploded view of existing cooling equipment;

[0034] Figure 2 yes Figure 1 An isometric view of the equipment, showing the airflow at the inlet and outlet;

[0035] Figure 3A This is an isometric view of a heat sink assembly according to an illustrative embodiment;

[0036] Figure 3B yes Figure 3A Isometric view of a heat sink assembly without supports;

[0037] Figure 4A yes Figure 3A Exploded view of the heat sink assembly;

[0038] Figure 4B It shows Figure 3A Exploded view of the lower side of the heat sink assembly;

[0039] Figure 5 This is a top view of the baffle used in the illustrative embodiment;

[0040] Figure 6 This is an isometric view of the cooling fins and center gap in the illustrative embodiment;

[0041] Figure 7A It is a cross-sectional view of the arrangement of baffles and cooling fins according to the illustrative embodiment;

[0042] Figure 7B This is a cross-sectional view of the baffle and cooling fins according to another embodiment;

[0043] Figure 7C This is a cross-sectional view of the baffle and cooling fins according to yet another embodiment;

[0044] Figure 8A This is an isometric view showing the side of the heat sink assembly 20 according to an illustrative embodiment; and

[0045] Figure 8B It shows Figure 8A A cross-sectional view of the airflow channels within the heat sink assembly shown. Detailed Implementation

[0046] Figure 3A An isometric view of an automotive radiator assembly 20 according to an illustrative embodiment is shown. The radiator assembly 20 forms an electronic controller housing for enclosing and cooling an electronic controller.

[0047] Figure 3B It shows Figure 3A The isometric view of the radiator assembly 20 shown shows the cover 21 removed to expose the components of the cooling device. Figure 4A and Figure 4B An exploded view of the components is shown. As shown, the heat sink assembly 20 includes a heat sink 24 that forms the main body of the controller housing. Figure 4A As most clearly shown, a plurality of cooling fins 26 are disposed on the upper surface of the radiator base 241, and this forms the main cooling surface of the radiator. The cooling fins 26 extend vertically upward from the plane of the radiator base 241 and form a radial pattern on the surface of the base 241, extending from the central gap 242.

[0048] Centrifugal fan 25 is configured to have an inlet 251 and an outlet 252. Fan 25 is mounted to the underside of cover 21 using fasteners 211. Cover 21 is configured as a continuous plate located at the top apex of cooling fins 26. Cover 21 thus forms a top plate on the heat sink 24, as... Figure 3A As shown, this provides a top baffle on the cooling fins 26. The cover 21 also forms a support for mounting a fan above the base of the radiator 24, with the fan inlet opposite the radiator base 241. The cover 21 is secured using a plurality of fasteners 23, which are received in mounting members disposed on the radiator 24. A plurality of spacers 22 are assembled around the fastener at the periphery of the assembly and serve to support the cover 21, which aligns with (or corresponds to) the top of the cooling fins 26.

[0049] The baffle 29 is disposed between the radiator base 241 and the cover 21. Figure 5 A top view of baffle 29 is shown. Baffle 29 is configured as a plate-like body including a plurality of cutouts 30 corresponding to cooling fins 26 disposed on radiator 24. The cooling fins 26 are sized to partially receive the fins, allowing baffle 29 to be located in a plane between radiator base 241 and cover 21 below the apex of the fins, wherein the cutouts 30 seal around the cooling fins 26. Mounting holes 301 are similarly provided in the cutouts 30 for mounting on a cover mount disposed on radiator base 241.

[0050] A central fan port 31 is provided in the baffle 29 to receive a centrifugal fan 25. Thus, the fan 25 extends downward from its mounting position on the cover 21, partially extending through the fan port 31. The fan port 31 is sized to seal around the outer periphery of the fan body to separate the fan inlet 251 from the fan outlet 252. The baffle 29 also includes airflow guides 32 provided on three exposed sides of the assembly, with the fourth side including a recess for mounting around a cable termination channel. The airflow guides 32 include an upwardly inclined surface at the lateral end of the baffle 29 and are thereby configured to guide air flowing over the upper surface of the baffle away from the radiator 24.

[0051] Figure 6This is an isometric view of the central region of the heat sink 24, showing the configuration of the cooling fins 26 surrounding the central gap 242. As shown, the height of the cooling fins 26 in the central gap 242 is reduced to create space for receiving the fan 25. Specifically, the cooling fins 26 have a shortened section 261 in the region of the heat sink base 241, located directly below where the centrifugal fan 25 is mounted to the cover 21. The shortened section 261 transitions to the normal height of the fins 26 as the fins extend radially outward. A short protrusion 262 is provided at the center of the central gap 242 below the fan rotor to maximize the surface area available for heat transfer in this region of the heat sink 24.

[0052] As described above, the baffle 29 is configured to receive the cooling fins 26 through its cutout 30, such that the baffle 29 is located at an intermediate height between the radiator base 241 and the cover 21, below the apex of the cooling fins 26. This arrangement allows for... Figure 7A As can be seen more clearly in the figure, the cooling fins 26 are provided with shoulders 41, which form a seat for supporting the bottom surface of the baffle 29 between the radiator base 241 and the cover 21. In this embodiment, the baffle 29 is held in place by the clamping action of the spacer 22 and fasteners 23 against the radiator 24 during installation. Once in place, the baffle 29 engages with the cooling fins 26 to form separate lower inlet channels 27 and upper outlet channels 28. That is, an inlet channel 27 is defined between the radiator base 241 and the bottom surface of the baffle 29 between each fin 26, and an outlet channel 28 is defined between the top surface of the baffle 29 and the bottom surface of the cover 21. The engagement between the baffle 29 and the fins 26 restricts the mixing of airflow between the inlet channels 27 and the outlet channels 28.

[0053] On this point, Figure 7B and Figure 7C An alternative embodiment is shown in which the fit between the baffle 29 and the fin 26 is enhanced. Figure 7B One embodiment is shown in which thermally conductive adhesive 42 is applied at the interface between the collar and the baffle 29 to improve the integrity of the hermetic seal between the inlet channel 27 and the outlet channel 28. Figure 7C One embodiment is shown in which the edge of the cutout 30 is provided with a flange 43 for forming a press-fit engagement with the opposing surface of the fin 26. Once engaged, an interference fit is formed between the fin 26 and the baffle 29, which serves to hold the baffle in place by friction and helps maintain an airtight seal between the inlet channel 27 and the outlet channel 28. With this configuration, the fin does not require a shoulder structure for engagement with the baffle 29.

[0054] Figure 8AAn isometric view of the side of the radiator assembly 20 assembled according to an illustrative embodiment is shown. As shown, the radiator 24, baffle 29, and cover 21 form a layered assembly with an inlet channel 27 and an outlet channel 28 inserted therein. Thus, the fan 25 draws in an inlet airflow 271 through the inlet channel 27. Simultaneously, the fan 25 drives an outlet airflow 281 out of the outlet channel 28. An airflow guide 32 is used to deflect the discharged outlet airflow 281 away from the radiator assembly 20.

[0055] Figure 8B A cross-sectional view through a portion of the heat sink assembly 20 is shown. As shown, a baffle 29 extends from the periphery of the assembly to a fan hole 31, from which the baffle abuts against the outer body of the fan 25, located between a fan inlet 251 at the bottom of the fan and a fan outlet 252 on one side of the fan. The fan inlet 251 is thus in fluid communication with an inlet channel 27, and the fan outlet 252 is in fluid communication with an outlet channel 28.

[0056] When activated, fan 25 drives air through an airflow path defined by inlet channel 27 and outlet channel 28, thereby drawing air from the surrounding environment of radiator assembly 20 onto the cooling surface of the radiator. Thus, as the intake air passes between the fins 26 and over the radiator base 241, it is heated, thereby cooling the radiator 24. The hot air enters centrifugal fan 25 and is expelled through outlet channel 28, further cooling the cooling fins 26 before being exhausted.

[0057] With the above arrangement, the orientation of the centrifugal fan 25 is reversed compared to that used in conventional arrangements. Thus, the fan 25 is supported above the radiator base 241 by the cover 21, allowing the inlet airflow 271 to extend over the entire cooling surface. That is, the central region of the radiator 24 does not lose the space required to install the fan 25, and the airflow is driven to the central gap 242 below the fan by the negative pressure generated by the fan impeller. The short protrusion 262 also helps to maximize the surface area available for heat transfer in this region. Therefore, this arrangement provides a larger cooling surface area compared to conventional arrangements.

[0058] Another advantage of the above arrangement is that, since the fan is mounted to cover 21, the heat dissipated by its motor during operation is not directly transferred to the electronic component housing. This separation provides an overall improvement in cooling system performance. Simultaneously, because fan 25 draws air in from the side, cover 21 does not require an inlet port, whereas conventional arrangements do. This avoids the traditional requirement of creating an air gap above cover 21 when assembling components. In terms of the location where the controller can be installed, this provides greater flexibility and allows for the use of cooling components with taller cooling fins than other possibilities.

[0059] Therefore, an improved cooling device can be provided that allows for greater cooling efficiency and installation flexibility. Thus, an improved cooling device for automotive controllers can be provided to maintain the operating temperature of sensitive electronic components.

[0060] It should be understood that the above embodiments are illustrative only. In reality, the embodiments can be applied to many different configurations, and detailed embodiments are readily implemented by those skilled in the art.

Claims

1. A cooling arrangement for cooling a heat sink having a plurality of cooling fins disposed on a base, the cooling arrangement comprising: a centrifugal fan having a fan inlet and a fan outlet; a support for mounting the fan above the heat sink base; and a baffle comprising: an aperture into which the fan is received such that the baffle is located between the fan inlet and the fan outlet, and a plate having a plurality of cut-outs for receiving the cooling fins such that the baffle can be positioned between the support and the heat sink base to define an inlet path for feeding air between the cooling fins over the heat sink base to the fan inlet and an outlet path for exhausting air from the fan outlet, wherein the plurality of cooling fins extend radially outwardly thereby defining, between each fin and between the heat sink base and the baffle, an inlet channel extending radially to the fan inlet, and between each fin and between the baffle and the support, an outlet channel extending radially from the fan outlet. The heat sink forms a housing for an electronic controller.

2. Cooling device according to claim 1, wherein The cut-outs are shaped for seating onto a seating structure disposed on the cooling fins for supporting the baffle.

3. Cooling device according to claim 1 or 2, wherein The cut-outs are shaped for forming a press-fit interface against the cooling fins for securing the baffle to the cooling fins.

4. Cooling device according to claim 1 or 2, wherein The baffle further comprises an airflow guide disposed at a transverse periphery and comprising an angled face for directing air from the outlet path away from the inlet path.

5. Cooling device according to claim 1 or 2, wherein The support comprises a flat mounting surface, and wherein the fan is mounted to the flat mounting surface such that the fan inlet is positioned away from the support.

6. The cooling device according to claim 1 or 2, wherein At least one of the inlet path and the outlet path comprises a plurality of channels.

7. The cooling device according to claim 1 or 2, wherein 8. The cooling arrangement of claim 1 or 2, further comprising: a heat sink having a heat sink base and a plurality of cooling fins disposed on the heat sink base, and wherein the cooling fins are received in the plurality of cut-outs such that the baffle is located between the support and the heat sink base to define the inlet path and the outlet path. The heat sink base comprises a cooling surface, and wherein the cooling fins project perpendicular to the cooling surface, and wherein the baffle and the support are located in a plane parallel to the cooling surface.

9. Cooling device according to claim 8, wherein The cooling fins comprise a reduced height region into which the fan is received.

10. The cooling device of claim 8, wherein, The support engages with an apex of one or more of the plurality of cooling fins.

11. The cooling device of claim 8, wherein, The cooling fins comprise a seating structure for supporting the baffle.

12. The cooling device of claim 8, wherein, The baffle is secured to the cooling fins by at least one of a thermally conductive adhesive or by a press-fit engagement.

13. The cooling device of claim 8, wherein, ​

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