A method for squaring silicon rods and a square silicon rod

Abstract

This invention discloses a method for squaring silicon rods and a square silicon rod, relating to the field of photovoltaic technology, to reduce the edge distance difference of the squared square silicon rod. The silicon rod squaring method includes: providing a cutting wire mesh; before cutting, under the condition that the cutting wire mesh and the end of the cylindrical silicon rod are mutually compressed, using the end of the cylindrical silicon rod to form a wire bow; using the cutting wire mesh forming the wire bow to cut the cylindrical silicon rod along its length. The silicon rod squaring method and square silicon rod provided by this invention are used to manufacture square silicon rods.

Description

Technical Field

[0001] This invention relates to the field of photovoltaic technology, and in particular to a method for squaring silicon rods and a square silicon rod. Background Technology

[0002] In the silicon rod squaring process, cylindrical silicon rods are typically cut with diamond wire to form square silicon rods. Both round and square silicon rods have their central axis running along their length. The head, middle, and tail of a square silicon rod are distributed along its length. Measurements have shown that the edge distance at the middle is often greater than the edge distance at the tail, and the edge distance at the tail is greater than the edge distance at the head. The edge distances at the head, middle, and tail of each square silicon rod are not the same. The greater the difference in edge distances at these three locations, the worse the uniformity of the square silicon rod, and the greater the dimensional variation of the silicon wafers after slicing. Square silicon rods with larger edge distance differences also require more polishing work. Summary of the Invention

[0003] The purpose of this invention is to provide a method for squaring silicon rods and a square silicon rod, so as to reduce the edge distance difference of the square silicon rod after squaring.

[0004] In a first aspect, the present invention provides a method for squaring silicon rods. The method for squaring silicon rods includes:

[0005] Provide cut wire mesh;

[0006] Before cutting, the cutting wire mesh and the end of the cylindrical silicon rod are pressed against each other, and the end of the cylindrical silicon rod is used to make the cutting wire mesh form a wire bow.

[0007] The cylindrical silicon rod is cut along its length using a cutting wire mesh that forms a wire bow.

[0008] When using the above technical solution, before squaring the cylindrical silicon rod, the cutting wire mesh is first pressed against the end of the cylindrical silicon rod, causing the cutting wire mesh to form a bow shape at the end of the cylindrical silicon rod. In this case, the cutting wire mesh has a bow shape from the initial cutting stage, rather than being straight. Compared to cutting the head of the cylindrical silicon rod with a straight cutting wire mesh, cutting the head of the cylindrical silicon rod with a cutting wire mesh forming a bow results in a larger head margin of the square silicon rod. The range of the margin is the difference between the maximum value (middle margin) and the minimum value (head margin). When the head margin increases, the range of the margin is smaller, and the margin uniformity of the square silicon rod is higher.

[0009] Compared to existing technologies that require a significant reduction in cutting speed to minimize edge distance differences, the squaring method of this invention does not require a substantial reduction in speed, thus ensuring squaring efficiency and increasing production capacity. Compared to existing technologies that increase the tension of the cutting wire mesh to reduce edge distance differences, the squaring method of this invention uses less cutting wire mesh tension, which can reduce the wire breakage rate and improve production efficiency and safety.

[0010] In addition, when the difference in edge distance is small, the uniformity of square silicon rods is better, which can reduce the grinding amount of square silicon rods, improve the utilization rate of cylindrical silicon rods, and reduce costs.

[0011] In some implementations, the aforementioned dicing mesh includes pre-diced and post-diced meshes. Before dicing, both pre-diced and post-diced meshes form wire bows. In this case, all dicing meshes for cutting cylindrical silicon rods form wire bows, which ensures that the difference between the two sets of edge distances of the square silicon rod is reduced, thereby ensuring the uniformity of the edge distances of the entire square silicon rod.

[0012] In some implementations, before cutting, the height of the bow formed by the pre-cut wire mesh is the same as the height of the bow formed by the post-cut wire mesh; the height direction of the bow is the same as the length direction of the cylindrical silicon rod. In this case, the tension force of the pre-cut and post-cut wire mesh and the force on the drive motor can be more balanced, thereby reducing the problems of wire breakage and edge distance fluctuation.

[0013] In some implementations, before cutting, the heights of both the bows formed by the first and second cut wire meshes are less than or equal to the distance between them. Because of the distance between the first and second cut wire meshes, when the bow height is less than or equal to this distance, it prevents the bows from cutting into each other, thus reducing the risk of wire breakage.

[0014] In some implementations, the height of the aforementioned wire bow is greater than 0 and less than or equal to 50 mm before cutting. Within this range, the height of the wire bow can be relatively large, which in turn can significantly increase the head margin of the square silicon rod and reduce the margin difference.

[0015] In some implementations, after providing the diced wire mesh, before the diced wire mesh forms a wire bow using the ends of the cylindrical silicon rod while the diced wire mesh and the ends of the cylindrical silicon rod are pressed together, the silicon rod squaring method further includes: driving at least one of the diced wire mesh and the cylindrical silicon rod to move along the length direction of the cylindrical silicon rod until the ends of the diced wire mesh and the cylindrical silicon rod are pressed together. At this time, regardless of whether the diced wire mesh moves towards the cylindrical silicon rod, or the cylindrical silicon rod moves towards the diced wire mesh, or both move towards each other, mutual pressing between the cylindrical silicon rod and the diced wire mesh can be achieved when they come into contact.

[0016] In some implementations, when one of the drive wire mesh and the cylindrical silicon rod moves along the length of the cylindrical silicon rod, the feed rate of the drive wire mesh or the cylindrical silicon rod along the length of the cylindrical silicon rod is greater than 0 and less than or equal to 2000 mm / min; when both the drive wire mesh and the cylindrical silicon rod move along the length of the cylindrical silicon rod, the feed rates of both the drive wire mesh and the cylindrical silicon rod along the length of the cylindrical silicon rod are greater than 0 and less than or equal to 1000 mm / min; and / or, when at least one of the drive wire mesh and the cylindrical silicon rod moves along the length of the cylindrical silicon rod, the linear velocity of the drive wire mesh is 0-40 m / s. At these feed rates and linear velocities, the problem of the drive wire mesh not forming a complete wire bow and directly cutting the cylindrical silicon rod due to excessive speed can be avoided, as can the problem of excessive wire bow height can also be avoided, thus ensuring that the expected wire bow is formed before cutting.

[0017] In some implementations, the cutting process parameters include: a cutting feed rate greater than 0 and less than or equal to 100 mm / min, and a cutting wire mesh linear speed of 0-40 m / s.

[0018] In some implementations, the second feed speed of the dicing wire mesh cutting the middle of the cylindrical silicon rod is lower than the first feed speed of the dicing wire mesh cutting the head of the cylindrical silicon rod; the first feed speed is greater than 0 and less than or equal to 100 mm / min. As the dicing wire mesh cuts the cylindrical silicon rod, the bow of the dicing wire gradually increases, leading to an increase in the edge distance and range of the square silicon rod in the middle. When the second feed speed for cutting the middle of the cylindrical silicon rod is relatively low, the bow of the dicing wire when it reaches the middle of the cylindrical silicon rod can be reduced, thereby reducing the edge distance of the square silicon rod in the middle and reducing the edge distance range.

[0019] In some implementations, after providing the dicing wire mesh, before the dicing wire mesh forms a wire bow using the end of the cylindrical silicon rod while the dicing wire mesh and the end of the cylindrical silicon rod are pressed together, the silicon rod squaring method further includes aligning the dicing wire mesh and the cylindrical silicon rod. At this time, the initial cutting positions of the dicing wire mesh and the cylindrical silicon rod can be aligned. When the dicing wire mesh and the end faces of the cylindrical silicon rod are pressed together to form a wire bow, the wire bow contacts the initial cutting position of the cylindrical silicon rod, thereby improving cutting efficiency and accuracy.

[0020] Secondly, the present invention provides a square silicon rod. This square silicon rod is obtained using the silicon rod squaring method described in the first aspect or any implementation thereof.

[0021] The beneficial effects of the square silicon rod provided in the second aspect can be referred to the beneficial effects of the silicon rod squaring method described in the first aspect or any implementation thereof, and will not be repeated here. Attached Figure Description

[0022] The accompanying drawings, which are included to provide a further understanding of the invention and form part of this invention, illustrate exemplary embodiments of the invention and are used to explain the invention, but do not constitute an undue limitation of the invention. In the drawings:

[0023] Figure 1 This is a schematic diagram of the side distances of a square silicon rod in the prior art;

[0024] Figure 2 A schematic flowchart illustrating the method for squaring a silicon rod according to an embodiment of the present invention;

[0025] Figure 3 A schematic diagram showing the alignment of the dicing wire mesh and the cylindrical silicon rod according to an embodiment of the present invention;

[0026] Figure 4 This is a schematic diagram of forming a wire bow by cutting a wire mesh, provided in an embodiment of the present invention.

[0027] Figure 5 This is a schematic diagram illustrating the relationship between the dicing wire mesh used to form the bow and the cylindrical silicon rod, provided in an embodiment of the present invention.

[0028] Figure label:

[0029] Figures 1-5 In the middle, 10-square silicon rod, 20-cut wire mesh, 30-cylindrical silicon rod, 40-main roller. Detailed Implementation

[0030] To facilitate a clear description of the technical solutions of the embodiments of the present invention, the terms "first" and "second" are used in the embodiments of the present invention to distinguish identical or similar items with essentially the same function and effect. Those skilled in the art will understand that the terms "first" and "second" do not limit the quantity or execution order, and the terms "first" and "second" are not necessarily different.

[0031] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0032] It should be noted that in this invention, the terms "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in this invention should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of terms such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner.

[0033] In this invention, "at least one" refers to one or more, and "more than one" refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one of a, b, or c can represent: a, b, c, a combination of a and b, a combination of a and c, a combination of b and c, or a, b, and c, where a, b, and c can be single or multiple.

[0034] In the manufacturing process of silicon wafers for solar cells, the process of cutting cylindrical silicon rods into square silicon rods mainly utilizes diamond wire cutting. For example... Figure 1 As shown, the square silicon rod 10 has two end faces and four opposing sides. The vertical distance between two opposing sides is the edge distance of the square silicon rod 10. After squaring, the edge distances of the head A, middle B, and tail C of the square silicon rod 10 need to be measured to ensure the uniformity of the square silicon rod 10. Measurements revealed that the edge distance of the middle B of the square silicon rod 10 formed by diamond wire cutting is often greater than that of the tail C, and the edge distance of the tail C is greater than that of the head A. The edge distance range is the difference between the edge distance of the middle B and the edge distance of the head A.

[0035] In existing technologies, there are two ways to improve edge distance difference. One is to reduce the cutting speed, but this leads to reduced production capacity and fails to meet the goal of reducing production costs. The other is to increase the tension of the diamond wire, but this easily causes wire breakage.

[0036] To address the aforementioned technical problems, embodiments of the present invention provide a method for squaring silicon rods. For example... Figure 2 As shown, the silicon rod squaring method includes:

[0037] Step S100: Provide a dicing mesh. This dicing mesh includes a pre-diced mesh and a post-diced mesh. The pre-diced and post-diced meshes can be formed by winding a single dicing wire, creating a grid-like dicing mesh. Alternatively, they can be composed of multiple dicing wires. Specifically, the pre-diced mesh cuts a cylindrical silicon rod to form two opposite sides of a square silicon rod. The post-diced mesh cuts the cylindrical silicon rod to form two more opposite sides of the square silicon rod. The two dicing trajectories formed by the pre-diced mesh are parallel, and the two dicing trajectories formed by the post-diced mesh are also parallel. The included angle between the pre-diced and post-diced meshes is determined according to the dicing scheme design and can be 90° or other angles.

[0038] It should be understood that, simultaneously with, before, or after providing the cutting wire mesh, cylindrical silicon rods should also be provided, i.e., loading, by placing the cylindrical silicon rods to be cut onto the squaring machine. Here, a cylindrical silicon rod refers to a silicon rod with a circular cross-section, an approximately circular cross-section, or an elliptical cross-section. This process can be performed using a robotic arm, a conveyor belt, or a lifting platform, etc., to transport the cylindrical silicon rods. This embodiment of the invention does not specifically limit the loading method of the cylindrical silicon rods.

[0039] like Figure 3 As shown, after providing the cutting wire mesh 20 and the cylindrical silicon rod 30, before step S200, the silicon rod squaring method further includes aligning the cutting wire mesh 20 and the cylindrical silicon rod 30. Aligning the cutting wire mesh 20 and the cylindrical silicon rod 30 includes aligning the cylindrical silicon rod 30 and aligning the cutting wire mesh 20. Aligning the cylindrical silicon rod 30 means detecting the edge position of the cylindrical silicon rod 30 on the cutting table using an infrared or sensing device, and adjusting the position of the cylindrical silicon rod 30 so that its edge is located in a preset area, ensuring that the cutting start position of the cylindrical silicon rod 30 is the same as the preset position. Aligning the cutting wire mesh means moving the cutting wire mesh 20 to the blade setting position. In practical applications, different squaring machines have different blade setting positions. Specifically, as shown... Figure 3 As shown, the tool setting position OO′ can be at a certain distance from the cylindrical silicon rod 30.

[0040] Aligning the cutting wire mesh 20 with the cylindrical silicon rod 30 allows the initial cutting positions of the cutting wire mesh 20 and the cylindrical silicon rod 30 to be aligned. When the end faces of the cutting wire mesh 20 and the cylindrical silicon rod 30 are pressed together to form a wire bow, the wire bow comes into contact with the initial cutting position of the cylindrical silicon rod 30, thereby improving cutting efficiency and accuracy.

[0041] Step S200: As Figure 4 and Figure 5 As shown, before cutting, when the cutting wire mesh 20 and the end of the cylindrical silicon rod 30 are pressed against each other, the end of the cylindrical silicon rod 30 is used to make the cutting wire mesh 20 form a wire bow.

[0042] The method to cause the dicing wire mesh 20 and the end of the cylindrical silicon rod 30 to press against each other can be as follows: drive at least one of the dicing wire mesh 20 and the cylindrical silicon rod 30 to move along the length direction of the cylindrical silicon rod 30 until the ends of the dicing wire mesh 20 and the cylindrical silicon rod 30 press against each other. In practical applications, the cylindrical silicon rod 30 can be fixed in position, and the dicing wire mesh 20 can be driven to move toward the cylindrical silicon rod 30; the dicing wire mesh 20 can be fixed in position, and the cylindrical silicon rod 30 can be driven to move toward the dicing wire mesh 20; or the dicing wire mesh 20 and the cylindrical silicon rod 30 can be driven to move toward each other. In this case, regardless of the movement method used, when the two come into contact, the cylindrical silicon rod 30 and the dicing wire mesh 20 can be pressed against each other. The relative movement distance between the dicing wire mesh 20 and the cylindrical silicon rod 30 is greater than or equal to the height of the formed wire bow. For example, when the height of the wire bow is 25 mm, the relative movement distance between the dicing wire mesh 20 and the cylindrical silicon rod 30 can be 29 mm.

[0043] When one of the drive wire mesh 20 and the cylindrical silicon rod 30 moves along the length direction of the cylindrical silicon rod 30, the feed speed of the wire mesh or the cylindrical silicon rod along the length direction of the cylindrical silicon rod 30 is greater than 0 and less than or equal to 2000 mm / min. This feed speed is the feed speed of the moving wire mesh 20 or the cylindrical silicon rod 30. For example, the feed speed along the length direction of the cylindrical silicon rod 30 can be 2000 mm / min, 1500 mm / min, 1300 mm / min, 1000 mm / min, 800 mm / min, 600 mm / min, 500 mm / min, etc.

[0044] When both the wire mesh 20 and the cylindrical silicon rod 30 move along the length of the cylindrical silicon rod 30, the feed speed of both the wire mesh and the cylindrical silicon rod along the length of the cylindrical silicon rod 30 is greater than 0 and less than or equal to 1000 mm / min. This feed speed is either the feed speed of the wire mesh 20 or the feed speed of the cylindrical silicon rod 30. At this time, the sum of the two feed speeds is less than or equal to 2000 mm / min. For example, the feed speed of the wire mesh 20 or the cylindrical silicon rod 30 can be 1000 mm / min, 900 mm / min, 800 mm / min, 700 mm / min, 600 mm / min, 500 mm / min, 400 mm / min, etc.

[0045] When at least one of the drive wire mesh 20 and the cylindrical silicon rod 30 moves along the length direction of the cylindrical silicon rod 30, the linear velocity of the drive wire mesh 20 is 0-40 m / s. For example, the linear velocity of the drive wire mesh 20 can be 0 m / s, 2 m / s, 5 m / s, 10 m / s, 15 m / s, 20 m / s, 24 m / s, 30 m / s, 35 m / s, 40 m / s, etc. At the above feed speed and linear velocity, the problem of the drive wire mesh 20 not forming a complete wire bow and directly cutting the cylindrical silicon rod 30 due to excessive speed can be avoided, as can the problem of excessive wire bow height can also be avoided, thereby ensuring that the expected wire bow is formed before cutting.

[0046] Taking the movement of the wire mesh 20 towards the cylindrical silicon rod 30 as an example, given the distance between the pre-cut and post-cut wire meshes, before cutting, both the pre-cut and post-cut wire meshes can move towards the cylindrical silicon rod 30 at a linear velocity of 0 and a feed rate of less than 2000 mm / min. Subsequently, the wire mesh 20 continues to move along the length of the cylindrical silicon rod 30. When the post-cut wire mesh is about to contact the end of the cylindrical silicon rod 30, the pre-cut wire mesh is in the cutting state of the cylindrical silicon rod 30, and both the pre-cut and post-cut wire meshes have relatively high feed and linear velocities. When the post-cut wire mesh reaches the tool setting position, the linear velocity and feed rate of the wire mesh 20 can be reduced to 0, allowing the post-cut wire mesh to contact the cylindrical silicon rod 30 at a lower feed rate and press against each other, ensuring that the post-cut wire mesh forms a wire bow. After the post-cut wire mesh forms a wire bow, the wire mesh 20 resumes normal cutting parameters. The aforementioned deceleration process takes less than 5 seconds, which is extremely short and will not adversely affect the cutting process.

[0047] Before cutting, both the pre-cut and post-cut wire meshes form wire bows. At this time, all the cutting wire meshes 20 of the cylindrical silicon rod 30 form wire bows, which can ensure that the difference between the two sets of edge distances of the square silicon rod is reduced, thereby ensuring the uniformity of the edge distance of the entire square silicon rod.

[0048] like Figure 4 and Figure 5 As shown, before cutting, the height H of the wire bow formed by the first-cut wire mesh and the height H of the wire bow formed by the second-cut wire mesh are the same; the height direction of the wire bow is the same as the length direction of the cylindrical silicon rod 30. At this time, the tension force of the first-cut and second-cut wire mesh and the force on the drive motor can be more balanced, thereby reducing the problems of wire breakage and edge distance fluctuation.

[0049] Before cutting, the height H of the bow formed by the first cut wire mesh and the height H of the bow formed by the second cut wire mesh are both less than or equal to the distance between the first and second cut wire meshes. For example, when the distance between the first and second cut wire meshes is 25mm, the height H of the bows of both the first and second cut wire meshes is less than or equal to 25mm. Because there is a distance between the first and second cut wire meshes, when the height H of the bow is less than or equal to this distance, it is possible to avoid the bows of the first and second cut wire meshes cutting each other, thereby reducing the problem of wire breakage.

[0050] Specifically, such as Figure 4 and Figure 5 As shown, before cutting, the height H of the wire bow can be greater than 0 and less than or equal to 50 mm. For example, the height H of the wire bow can be 50 mm, 45 mm, 40 mm, 35 mm, 30 mm, 28 mm, 20 mm, 10 mm, etc. Within this range, the height of the wire bow can be relatively large, which can significantly increase the head edge distance of the square silicon rod and reduce the edge distance range.

[0051] Step S300: The cylindrical silicon rod 30 is cut along its length using the cutting wire mesh 20 that forms the bow.

[0052] The cutting process parameters include: a cutting feed rate greater than 0 and less than or equal to 100 mm / min, and a cutting wire mesh 20 linear velocity of 0-40 m / s. For example, the cutting feed rate can be 100 mm / min, 90 mm / min, 80 mm / min, 70 mm / min, 60 mm / min, 50 mm / min, 40 mm / min, 30 mm / min, etc. The cutting wire mesh 20 linear velocity can be 40 m / s, 35 m / s, 33 m / s, 30 m / s, 28 m / s, 25 m / s, 22 m / s, 20 m / s, 10 m / s, etc.

[0053] In practical applications, the second feed speed of the dicing wire mesh 20 when cutting the middle of the cylindrical silicon rod 30 is less than the first feed speed of the dicing wire mesh 20 when cutting the head of the cylindrical silicon rod 30; the first feed speed is greater than 0 and less than or equal to 100 mm / min. As the dicing wire mesh 20 cuts the cylindrical silicon rod 30, the bow of the dicing wire gradually increases, resulting in an increase in the edge distance and range of the square silicon rod in the middle. When the second feed speed when cutting the middle of the cylindrical silicon rod 30 is relatively low, the bow of the dicing wire when it reaches the middle of the cylindrical silicon rod 30 can be reduced, thereby reducing the edge distance of the square silicon rod in the middle and reducing the edge distance range.

[0054] After the cylindrical silicon rod 30 is cut to obtain a square silicon rod, it can be transported to the polishing process using a transport vehicle or automated conveyor belt.

[0055] Based on the aforementioned method for squaring silicon rods, it can be seen that before squaring the cylindrical silicon rod 30, the cutting wire mesh 20 and the ends of the cylindrical silicon rod 30 are pressed together, causing the cutting wire mesh 20 to form a wire bow at the ends of the cylindrical silicon rod 30. In this case, the cutting wire mesh 20 has a wire bow at the initial cutting stage before cutting, rather than being in a straight state. Compared to cutting the head of the cylindrical silicon rod 30 with a straight cutting wire mesh 20, cutting the head of the cylindrical silicon rod 30 with a cutting wire mesh 20 forming a wire bow results in a larger head margin of the square silicon rod. The range of the margin is the difference between the maximum value (middle margin) and the minimum value (head margin). When the head margin increases, the range of the margin is smaller, and the margin uniformity of the square silicon rod is higher.

[0056] Compared to existing technologies that require a significant reduction in cutting speed to minimize edge distance differences, the squaring method of this invention does not require a substantial speed reduction, thus ensuring squaring efficiency and increasing production capacity. Compared to existing technologies that increase the tension of the cutting wire mesh 20 to reduce edge distance differences, the squaring method of this invention uses lower tension for the cutting wire mesh 20, which reduces the breakage rate and improves production efficiency and safety. Furthermore, when the edge distance difference is small, the uniformity of the square silicon rod is better, reducing the amount of grinding required for the square silicon rod, increasing the utilization rate of the cylindrical silicon rod 30, and lowering costs.

[0057] The silicon rod squaring method of this invention significantly reduces the edge distance difference of the resulting square silicon rods. For example, for an M2 silicon wafer, the standard edge distance of the square silicon rod is 156.85 mm, the corresponding center-to-center distance of the cutting main rollers 40 is 158.2 mm, and the diamond wire diameter is 0.35 mm. The square silicon rod processed using existing squaring processes has an edge distance of 157.7 mm and an edge distance difference of 0.4 mm, requiring 0.85 mm of grinding and polishing. Using the silicon rod squaring method provided in this invention, the edge distance difference is reduced from 0.4 mm to 0.2 mm, and the spacing of the main rollers 40 can be reduced to 158 mm, thereby reducing the amount of polishing work.

[0058] This invention also provides a square silicon rod. The square silicon rod is obtained using the silicon rod squaring method described above. The beneficial effects of this square silicon rod can be found by referring to the beneficial effects of the silicon rod squaring method described above, and will not be repeated here.

[0059] Although the invention has been described herein in conjunction with various embodiments, those skilled in the art will understand and implement other variations of the disclosed embodiments by reviewing the accompanying drawings, the disclosure, and the appended claims in carrying out the claimed invention. In the claims, the word "comprising" does not exclude other components or steps, and "a" or "an" does not exclude a plurality. While different dependent claims may recite certain measures, this does not mean that these measures cannot be combined to produce good results.

[0060] Although the invention has been described in conjunction with specific features and embodiments, it is obvious that various modifications and combinations can be made therein without departing from the spirit and scope of the invention. Accordingly, this specification and drawings are merely exemplary descriptions of the invention as defined by the appended claims, and are considered to cover any and all modifications, variations, combinations, or equivalents within the scope of the invention. Clearly, those skilled in the art can make various alterations and modifications to the invention without departing from its spirit and scope. Thus, if such modifications and modifications of the invention fall within the scope of the claims and their equivalents, the invention is also intended to include such modifications and modifications.

Claims

1. A method for squaring silicon rods, characterized in that, include: Provide cut wire mesh; Before cutting, at least one of the cutting wire mesh and the cylindrical silicon rod is driven to move along the length direction of the cylindrical silicon rod until the cutting wire mesh and the end of the cylindrical silicon rod are pressed against each other. When the cutting wire mesh and the end of the cylindrical silicon rod are pressed against each other, the end of the cylindrical silicon rod is used to make the cutting wire mesh form a wire bow. The cylindrical silicon rod is cut along its length using the cutting wire mesh that forms the bow. The second feed speed of the cutting wire mesh when cutting the middle part of the cylindrical silicon rod is less than the first feed speed of the cutting wire mesh when cutting the head of the cylindrical silicon rod.

2. The method for squaring silicon rods according to claim 1, characterized in that, The cutting wire mesh includes a pre-cut wire mesh and a post-cut wire mesh. Before cutting, both the pre-cut wire mesh and the post-cut wire mesh are formed with wire bows.

3. The method for squaring silicon rods according to claim 2, characterized in that, Before cutting, the height of the wire bow formed by the first cutting of the wire mesh is the same as the height of the wire bow formed by the second cutting of the wire mesh; the height direction of the wire bow is the same as the length direction of the cylindrical silicon rod.

4. The method for squaring silicon rods according to claim 2, characterized in that, Before cutting, the height of the bow formed by the first cut wire mesh and the height of the bow formed by the second cut wire mesh are both less than or equal to the distance between the first cut wire mesh and the second cut wire mesh.

5. The method for squaring silicon rods according to claim 1, characterized in that, Before cutting, the height of the bow is greater than 0 and less than or equal to 50 mm.

6. The method for squaring silicon rods according to claim 1, characterized in that, When one of the drive wire mesh and the cylindrical silicon rod moves along the length direction of the cylindrical silicon rod, the feed speed of the drive wire mesh or the cylindrical silicon rod along the length direction of the cylindrical silicon rod is greater than 0 and less than or equal to 2000 mm / min. When both the drive wire mesh and the cylindrical silicon rod move along the length direction of the cylindrical silicon rod, the feed speed of both the wire mesh and the cylindrical silicon rod is greater than 0 and less than or equal to 1000 mm / min along the length direction of the cylindrical silicon rod. And / or, When at least one of the drive wire mesh and the cylindrical silicon rod moves along the length of the cylindrical silicon rod, the linear velocity of the drive wire mesh is 0-40 m / s.

7. The method for squaring silicon rods according to any one of claims 1 to 5, characterized in that, The cutting process parameters include: a cutting feed speed greater than 0 and less than or equal to 100 mm / min, and a cutting wire mesh linear speed of 0-40 m / s.

8. The method for squaring silicon rods according to any one of claims 1 to 5, characterized in that, The first feed rate is greater than 0 and less than or equal to 100 mm / min.

9. The method for squaring silicon rods according to any one of claims 1 to 5, characterized in that, After providing the wire mesh, and before the wire mesh forms a wire bow using the end of the cylindrical silicon rod while being pressed against each other, the silicon rod squaring method further includes: Align the dicing wire mesh with the cylindrical silicon rod.

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