Method for preparing copper-clad plate, copper-clad plate and LED lamp plate

Abstract

The application provides a preparation method of a copper-clad plate, the copper-clad plate and an LED lamp plate. The preparation method of the copper-clad plate comprises the following steps: mixing epoxy resin and titanium white powder to obtain a mixed glue solution; immersing a glass fiber cloth in the mixed glue solution, and then heating to form a semi-cured film; and pressing a copper foil layer and the semi-cured film to form the copper-clad plate. Since the titanium white powder is added to the epoxy resin, the titanium white powder is uniformly mixed with the epoxy resin as an inorganic filler in the mixed glue solution obtained by mixing the epoxy resin and the titanium white powder. When the mixed glue solution is solidified, the titanium white powder can fill the pores of the epoxy resin, thereby improving the hardness and stability of the epoxy resin. Meanwhile, the titanium white powder can make the semi-cured film form a white base film. The white base film has high stability and has a strong reflection effect on light, thereby avoiding yellowing of the copper-clad plate in a high-temperature or light environment.

Description

Technical Field

[0001] This application belongs to the field of circuit board technology, and more specifically, relates to a method for preparing copper-clad laminate, the copper-clad laminate, and an LED light board. Background Technology

[0002] With the continuous development of the electronics industry, optoelectronic semiconductor devices, represented by LEDs, are widely used in electronic devices such as LCD TVs, computer monitors, and smartphones. As LED power and brightness continue to increase, the substrates of printed circuit boards (PCBs) used for LED mounting are required to have good flatness and light resistance. Therefore, optimizing the performance of basic electronic materials such as laminates and copper-clad laminates is of great significance to the development of optoelectronic semiconductor devices.

[0003] In existing technologies, copper-clad laminates are typically made by hot-pressing copper foil onto FR-4 thermally conductive and insulating resin as the substrate. Due to the difference in thermal expansion coefficients between the FR-4 substrate and the copper foil, the copper-clad laminate is prone to warping after lamination, which affects the mounting of components. Moreover, when traditional copper-clad laminates are used as substrates for LED light boards, they are prone to yellowing under high temperature and humidity or long-term light exposure, which affects the light output performance of the LED light board. Summary of the Invention

[0004] This application provides a method for preparing copper-clad laminate, the copper-clad laminate, and an LED light board, which can solve the problems of warping and yellowing of existing copper-clad laminates under high temperature or light exposure.

[0005] This application provides a method for preparing a copper-clad laminate, including:

[0006] Epoxy resin and titanium dioxide are mixed to obtain a mixed adhesive solution;

[0007] Fiberglass cloth is impregnated with the mixed adhesive solution and then baked to form a semi-cured film;

[0008] The copper foil layer and the semi-cured film are pressed together to form a copper-clad laminate.

[0009] In some embodiments, the pressing of the copper foil layer and the semi-cured film to form a copper-clad laminate includes: pressing the first copper foil layer and the semi-cured film to form a single-sided copper-clad laminate.

[0010] In some embodiments, after pressing the first copper foil layer and the semi-cured film together to form a single-sided copper-clad laminate, the method further includes: attaching a release film, wherein the release film is located on the side of the semi-cured film opposite to the first copper foil layer.

[0011] In some embodiments, the pressing of the copper foil layer and the semi-cured film to form a copper-clad laminate includes: pressing a first copper foil layer, a semi-cured film and a second copper foil layer arranged in sequence to form a double-sided copper-clad laminate.

[0012] In some embodiments, the step of impregnating the fiberglass cloth with the mixed adhesive and then baking it to form a semi-cured film includes:

[0013] Pour the mixed adhesive solution into the adhesive tank;

[0014] Under the action of traction, the glass fiber cloth is immersed in the glue tank through the guide roller, then enters the heating channel after passing through the extrusion roller, and is molded by hot roller to form a semi-cured film.

[0015] This application embodiment also provides a copper-clad laminate, the copper-clad laminate comprising:

[0016] A semi-cured film, the semi-cured film comprising a glass fiber cloth and a mixed adhesive layer coated on the surface of the glass fiber cloth, the mixed adhesive layer comprising epoxy resin and titanium dioxide;

[0017] A first copper foil layer is disposed on the semi-cured film;

[0018] In some embodiments, the copper-clad laminate also includes

[0019] Release film, the release film being disposed on the side of the semi-cured film opposite to the first copper foil layer.

[0020] In some embodiments, the copper-clad laminate further includes:

[0021] The second copper foil layer is disposed on the side of the semi-cured film opposite to the first copper foil layer.

[0022] In some embodiments, the surface reflectivity of the semi-cured film is greater than 85%.

[0023] In some embodiments, the glass transition temperature of the semi-cured film is greater than 170°C.

[0024] In some embodiments, the thickness of the semi-cured film ranges from 0.08 mm to 0.5 mm.

[0025] This application embodiment also provides an LED light board, the LED light board comprising:

[0026] LED beads;

[0027] A copper-clad laminate, wherein the LED beads are disposed on the copper-clad laminate, and the copper-clad laminate is any of the copper-clad laminates described above.

[0028] This application provides a method for preparing a copper-clad laminate (CCL), the CCL itself, and an LED light board. The method for preparing the CCL includes mixing epoxy resin and titanium dioxide to obtain a mixed adhesive; impregnating fiberglass cloth in the mixed adhesive and then baking it to form a semi-cured film; and pressing a copper foil layer and the semi-cured film together to form the CCL. Because titanium dioxide is added to the epoxy resin, it acts as an inorganic filler in the mixed adhesive, uniformly mixing with the epoxy resin. After the mixed adhesive cures, the titanium dioxide fills the pores of the epoxy resin, thereby improving its hardness and stability. Simultaneously, the titanium dioxide enables the semi-cured film to form a white base film, which has high stability and strong light reflection, thus preventing the CCL from yellowing under high temperature or light exposure. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0031] Figure 1 This is a schematic diagram of the process for preparing the copper-clad laminate provided in the embodiments of this application.

[0032] Figure 2 This is a schematic diagram illustrating the preparation process of the semi-cured film provided in the embodiments of this application.

[0033] Figure 3 This is a schematic diagram of the first structure of the copper-clad laminate provided in the embodiments of this application.

[0034] Figure 4 This is a schematic diagram of a second structure of the copper-clad laminate provided in an embodiment of this application. Detailed Implementation

[0035] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0036] This application provides a method for preparing a copper-clad laminate, the copper-clad laminate itself, and an LED light board, which can solve the problems of existing copper-clad laminates being prone to warping and yellowing under high temperature or light exposure. The following description is in conjunction with the accompanying drawings.

[0037] Please refer to Figure 1 , Figure 1 This is a schematic flowchart illustrating the preparation method of a copper-clad laminate provided in this application embodiment. This application embodiment provides a method for preparing a copper-clad laminate, including the following steps:

[0038] S110, epoxy resin and titanium dioxide are mixed to obtain a mixed adhesive solution.

[0039] Epoxy resin is a thermosetting resin. After curing, epoxy resin forms a network structure due to the cross-linking of molecules. Titanium dioxide is the main component of titanium dioxide. In the mixed adhesive obtained by mixing epoxy resin and titanium dioxide, titanium dioxide acts as an inorganic filler, uniformly mixed with the epoxy resin. After the mixed adhesive cures, the titanium dioxide fills the pores of the epoxy resin, thereby improving the hardness and stability of the epoxy resin.

[0040] Specifically, 10%–30% titanium dioxide, 5%–20% barium sulfate, 30%–50% alicyclic epoxy resin and heterocyclic epoxy resin, and 5%–25% acid anhydride epoxy curing agent by weight percentage are mixed to obtain a mixed adhesive. It should be noted that the mixed adhesive may also include other curing agents, flame retardants, catalysts, etc., which are not specifically limited in this application.

[0041] S120, fiberglass cloth is impregnated in the mixed adhesive solution and then heated to form a semi-cured film.

[0042] In this mixture, fiberglass cloth serves as a carrier for the epoxy resin mixture, increasing its toughness and strength. Preferably, the strength of the fiberglass cloth is ≥3500MPa, and the fiberglass cloth type can be 1180, 1080, etc.

[0043] For example, please refer to Figure 2 , Figure 2 This is a schematic diagram illustrating the fabrication process of the semi-cured film provided in the embodiments of this application. The semi-cured film can be prepared by pultrusion molding, which is simple and easy to operate, and can improve material utilization and ensure stable product quality.

[0044] like Figure 2As shown, the pultrusion molding apparatus, from left to right, includes a guide roller 21, a glue tank 22, an extrusion roller 23, a heating channel 24, and a hot roller 25. For example, a mixture of epoxy resin and titanium dioxide is poured into the glue tank 22; fiberglass cloth, under traction, passes through the guide roller 21 and is immersed in the glue tank 22 to uniformly wet the fiberglass cloth with the mixed glue. Then, the fiberglass cloth wetted with the mixed glue passes through the extrusion roller 23 and enters the heating channel 24, where it is molded by the hot roller 25 to form a semi-cured film.

[0045] The content of the mixed adhesive solution impregnating the fiberglass cloth can be controlled by adjusting the gap of the extrusion roller 23, so that the mixed adhesive solution is evenly coated on the surface of the fiberglass cloth. Understandably, as the fiberglass cloth impregnated with the mixed adhesive solution passes through the extrusion roller 23, the extrusion roller 23 can scrape off and recycle excess resin from the surface of the fiberglass cloth, thereby improving the utilization rate of raw materials. At the same time, the extrusion roller 23 can also ensure the uniformity of the adhesive coating on the surface of the fiberglass cloth.

[0046] Under traction, the fiberglass cloth impregnated with the mixed adhesive passes through the extrusion roller 23 and enters the heating channel 24. For example, the heating channel 24 can be divided into three heating zones: heating zone 1, heating zone 2, and heating zone 3, with partitions installed between these zones. The temperatures of heating zones 1, 2, and 3 are different; for example, the temperature gradually increases from heating zone 1 to heating zone 3. It should be noted that the gelation time of the mixed adhesive can be controlled by adjusting the temperature, airflow, and traction speed of each heating zone in the heating channel 24. It should also be noted that during the passage of the fiberglass cloth impregnated with the mixed adhesive through the heating channel 24, volatile substances such as solvents in the mixed solution evaporate at high temperatures, thus forming a semi-cured film on the fiberglass cloth impregnated with the mixed adhesive.

[0047] Continue to refer to Figure 2 The semi-cured film is shaped by a hot roller 25 under traction and then wound up by a winding device 27 to obtain a roll of semi-cured film. It should be noted that in this embodiment, the semi-cured film is prepared by a stretch molding process, which is simple to operate, has high production efficiency, improves material utilization, and ensures stable product quality.

[0048] In this embodiment, the thickness of the prepreg film ranges from 0.08 mm to 0.5 mm. The thickness of the prepreg film is related to the thickness of the fiberglass cloth and the adhesive coating, and it also directly affects the thickness of the copper clad laminate. For example, the thickness of the prepreg film can be any one of 0.08 mm, 0.1 mm, 0.15 mm, 0.3 mm, or 0.5 mm. It should be noted that the specific thickness value of the prepreg film can be determined according to the actual situation, and this application does not impose a specific limitation.

[0049] It should be noted that, in this embodiment, the semi-cured film includes a glass fiber cloth and a mixed adhesive layer coated on the surface of the glass fiber cloth. The mixed adhesive layer includes epoxy resin and titanium dioxide. Epoxy resin is a thermosetting resin. After curing, epoxy resin can form a network structure due to the cross-linking between molecules. The main component of titanium dioxide is titanium dioxide. In the mixed adhesive obtained by mixing epoxy resin and titanium dioxide, titanium dioxide acts as an inorganic filler and is uniformly mixed with epoxy resin. When the mixed adhesive is cured, titanium dioxide can fill the pores of epoxy resin, thereby improving the hardness and stability of epoxy resin. At the same time, titanium dioxide can enable the semi-cured film to form a white base film. This white base film has high stability and strong light reflection, thereby preventing the copper-clad laminate from yellowing under high temperature or light exposure.

[0050] S130 is used to press the copper foil layer and the semi-cured film together to form a copper-clad laminate.

[0051] For example, the semi-cured film roll is cut to the required size by a cutting machine, and then the copper foil layer and the semi-cured film are stacked. Then, a steel plate is placed on the top and bottom of the stacked material and placed in a vacuum environment. The press presses the stacked material under a certain temperature and pressure environment to form a copper-clad laminate.

[0052] In this embodiment, the prepreg film is made of a material with a high glass transition temperature to improve the heat resistance of the copper-clad laminate, making it suitable for more electronic products and smart devices. Preferably, the glass transition temperature of the prepreg film is greater than 170°C.

[0053] It should be noted that in this embodiment, the copper foil layer is directly bonded to the copper foil layer by a semi-cured film. Therefore, it is not necessary to set a thermosetting adhesive film between the copper foil layer and the semi-cured film, thereby reducing the process of bonding the thermosetting adhesive film, which is conducive to improving the production efficiency of copper clad laminate and reducing the production cost of copper clad laminate.

[0054] Copper clad laminates (CCLs) include single-sided and double-sided CCLs. Single-sided CCLs have copper foil layers on only one side, while double-sided CCLs have copper foil layers on both sides. The difference in the manufacturing processes of single-sided and double-sided CCLs lies in the material lamination and bonding steps. For ease of explanation, copper foil layers are defined as the first copper foil layer and the second copper foil layer; "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implying the number of technical features indicated.

[0055] In some embodiments, the semi-cured film of the roll is cut to the required size by a cutting machine, and then the first copper foil layer and the semi-cured film are stacked. Then, a steel plate is placed on the top and bottom of the stacked material and placed in a vacuum environment. The press presses the stacked material under a certain temperature and pressure environment to form a single-sided copper-clad laminate.

[0056] The process includes, after laminating the first copper foil layer and the semi-cured film to form a single-sided copper-clad laminate, attaching a release film, wherein the release film is located on the side of the semi-cured film opposite to the first copper foil layer. It should be noted that the release film is attached to the surface of the semi-cured film, and the release film protects the semi-cured film from scratches or damage during subsequent production processes.

[0057] In some embodiments, the semi-cured film of the roll is cut to the required size by a cutting machine, and then the first copper foil layer, the semi-cured film and the second copper foil layer are stacked. Then, a steel plate is placed on the top and bottom of the stacked material and placed in a vacuum environment. The press presses the stacked material under a certain temperature and pressure environment to form a double-sided copper-clad laminate.

[0058] It should be noted that single-sided or double-sided copper-clad laminates can be processed into single-layer, double-layer, or multi-layer circuit boards using circuit board manufacturing processes. Components such as LED beads and chips can be mounted on these circuit boards, which are then installed in electronic devices. The circuit board manufacturing process is existing technology and will not be elaborated upon in this application.

[0059] It should be noted that the circuit board manufacturing process requires an etching step, which involves etching away part of the copper foil on the surface of the copper-clad laminate to form metal circuits or pads. After the copper foil is etched away, a prepreg film is exposed. The prepreg film consists of fiberglass cloth and a mixed adhesive layer coated on the surface of the fiberglass cloth. The mixed adhesive layer includes epoxy resin and titanium dioxide. In the mixed adhesive obtained by mixing epoxy resin and titanium dioxide, titanium dioxide acts as an inorganic filler and is uniformly mixed with the epoxy resin. After the mixed adhesive cures, the titanium dioxide can fill the pores of the epoxy resin, thereby improving the hardness and stability of the epoxy resin. Simultaneously, the titanium dioxide allows the prepreg film to form a white base film. This white base film has high stability and strong light reflection, thus preventing the copper-clad laminate from yellowing under high temperature or light exposure.

[0060] For example, the copper-clad laminate in this embodiment of the application will not warp after the circuit board manufacturing process, and the finished circuit board can still maintain good flatness, without affecting the surface mounting of components on the circuit board. At the same time, since titanium dioxide is mixed into the epoxy resin to form a white semi-cured film, it can still maintain high whiteness after reflow soldering, avoiding the problem of yellowing; moreover, the white semi-cured film has a high reflectivity to light, especially for circuit boards with LED chips mounted, the light emitted by the LED chips can be reflected when it hits the white semi-cured film, which helps to improve the light output efficiency of the LED board.

[0061] In this embodiment, the white prepreg film of the copper-clad laminate has a reflectivity greater than 85%, especially for blue light with wavelengths between 425 nm and 450 nm, where the reflectivity can reach over 90%. As shown in Table 1, Table 1 presents the reflectivity test data of the copper-clad laminate after etching in this embodiment.

[0062] Table 1

[0063]

[0064] It should be noted that in the preparation method of the copper-clad laminate provided in this application embodiment, titanium dioxide is added to the epoxy resin. In the mixed adhesive obtained by mixing epoxy resin and titanium dioxide, titanium dioxide acts as an inorganic filler and is uniformly mixed with epoxy resin. After the mixed adhesive is cured, titanium dioxide can fill the pores of epoxy resin, thereby improving the hardness and stability of epoxy resin. At the same time, titanium dioxide can make the semi-cured film form a white base film. This white base film has high stability and strong light reflection, thereby preventing the copper-clad laminate from yellowing under high temperature or light exposure.

[0065] Please refer to Figure 3 , Figure 3 This is a schematic diagram of a first structure of a copper-clad laminate provided in an embodiment of this application. An embodiment of this application also provides a copper-clad laminate 100, which is a single-sided copper-clad laminate, such as... Figure 3 As shown, the copper-clad laminate 100 includes a prepreg film 10, a first copper foil layer 20, and a release film 30. The release film 30 is disposed on the side of the prepreg film 10 opposite to the first copper foil layer 20, which is equivalent to the prepreg film 10 being disposed between the first copper foil layer 20 and the release film 30. It should be noted that the release film 30 is attached to the surface of the prepreg film 10, and the release film 30 protects the prepreg film 10, preventing it from being scratched or damaged during subsequent production processes.

[0066] The prepreg 10 is made of a material with a high glass transition temperature to improve the heat resistance of the copper clad laminate 100, making it suitable for more electronic products and smart devices. Preferably, the glass transition temperature of the prepreg 10 is greater than 170°C.

[0067] The material of the first copper foil layer 20 can be electrolytic copper foil or rolled copper foil, and this application does not make specific limitations.

[0068] The semi-cured film 10 includes a glass fiber cloth and a mixed adhesive layer coated on the surface of the glass fiber cloth. The mixed adhesive layer includes epoxy resin and titanium dioxide. It should be noted that epoxy resin is a thermosetting resin. After curing, epoxy resin forms a network structure due to intermolecular cross-linking. The main component of titanium dioxide is titanium dioxide. In the mixed adhesive obtained by mixing epoxy resin and titanium dioxide, titanium dioxide acts as an inorganic filler and is uniformly mixed with the epoxy resin. After the mixed adhesive cures, titanium dioxide can fill the pores of the epoxy resin, thereby improving the hardness and stability of the epoxy resin. Simultaneously, titanium dioxide enables the semi-cured film to form a white base film. This white base film has high stability and strong light reflection, thus preventing the copper-clad laminate 100 from yellowing under high temperature or light exposure.

[0069] It should be noted that the single-sided copper-clad laminate provided in this application embodiment can be processed into a single-layer circuit board using circuit board manufacturing processes. This circuit board can maintain good flatness to facilitate component mounting. Furthermore, after the etching process of the circuit board, some of the copper foil on the surface of the single-sided copper-clad laminate is etched away, exposing a white semi-cured film. This semi-cured film has a strong light-reflecting effect, preventing the copper-clad laminate from yellowing under high temperature or light exposure.

[0070] For example, after the copper foil of the copper-clad laminate 100 is etched, the exposed white prepreg film has a reflectivity greater than 85%, especially for blue light with wavelengths in the range of 425 nm to 450 nm, where the reflectivity can reach more than 90%, and the thickness of the prepreg film ranges from 0.08 mm to 0.5 mm.

[0071] Please refer to Figure 4 , Figure 4This is a schematic diagram of a second structure of the copper-clad laminate provided in this application embodiment. This application embodiment also provides another copper-clad laminate 100, which is a double-sided copper-clad laminate with copper foil layers on both sides. The copper-clad laminate 100 includes a first copper foil layer 20, a prepreg film 10, and a second copper foil layer 40 stacked sequentially. The prepreg film 10 is made of a material with a high glass transition temperature to improve the heat resistance of the copper-clad laminate 100. The glass transition temperature of the prepreg film 10 is greater than 170°C, the surface reflectivity of the prepreg film is greater than 85%, and the thickness of the prepreg film ranges from 0.08 mm to 0.5 mm.

[0072] The materials of the first copper foil layer 20 and the second copper foil layer 40 can be the same or different. For example, the first copper foil layer 20 is electrolytic copper foil, and the second copper foil layer 40 is rolled copper foil, or both the first copper foil layer 20 and the second copper foil layer 40 are rolled copper foil. This application does not make specific limitations in this regard.

[0073] The first copper foil layer 20 and the second copper foil layer 40 are located on both sides of the semi-cured film 10, respectively. Therefore, it is not necessary to set a thermosetting adhesive film between the first copper foil layer 20 and the semi-cured film 10, or between the second copper foil layer 40 and the semi-cured film 10, thereby reducing the process of bonding the thermosetting adhesive film, which helps to improve the production efficiency of the copper clad laminate 100 and reduce the production cost of the copper clad laminate 100.

[0074] This application embodiment also provides an LED light board, which includes LED beads and a copper-clad laminate, with an array of LED beads disposed on the copper-clad laminate. The copper-clad laminate can be understood as a circuit board manufactured using circuit board production processes. Metal lines or pads are formed on the copper-clad laminate, and the LED beads are soldered onto the pads. The copper-clad laminate serves to support, fix, and electrically connect the LED beads.

[0075] LED light panels, as light source components, can provide backlighting for electronic devices, which can be: LCD panels, electronic paper, mobile phones, tablets, televisions, monitors, laptops, digital photo frames, navigators, and any other products or components with display functions. Since the LED light panel of this application adopts all the technical solutions of the above embodiments, it possesses at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated further here.

[0076] This application provides a method for preparing a copper-clad laminate (CCL), the CCL itself, and an LED light board. The method for preparing the CCL includes mixing epoxy resin and titanium dioxide to obtain a mixed adhesive; impregnating fiberglass cloth in the mixed adhesive and then heating it to form a semi-cured film; and pressing a copper foil layer and the semi-cured film together to form the CCL. Because titanium dioxide is added to the epoxy resin, it acts as an inorganic filler in the mixed adhesive, uniformly mixing with the epoxy resin. After the mixed adhesive cures, the titanium dioxide fills the pores of the epoxy resin, thereby improving its hardness and stability. Simultaneously, the titanium dioxide enables the semi-cured film to form a white base film, which has high stability and strong light reflection, thus preventing the CCL from yellowing under high temperature or light exposure.

[0077] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more features.

[0078] The preparation method of the copper-clad laminate, the copper-clad laminate, and the LED light board provided in the embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A method for producing a copper clad plate, characterized by, The application relates to a copper-clad plate and an LED lamp plate. The epoxy resin and titanium white powder are mixed to obtain a mixed glue solution, wherein the mixed glue solution comprises, by weight percentage, 10-30% of titanium white powder, 5-20% of barium sulfate, 30-50% of alicyclic epoxy resin and heterocyclic epoxy resin, and 5-25% of anhydride epoxy curing agent; The glass fiber cloth is immersed in the mixed glue solution, and then a semi-cured film sheet is formed through baking, wherein the baking adopts a pultrusion process, the mixed glue solution is poured into a glue tank, the glass fiber cloth is immersed in the glue tank under the action of traction, then passes through an extrusion roller and enters a heating channel, and the semi-cured film sheet is formed through hot roller molding, the heating channel comprises multiple heating zones, and the temperature gradually increases from the first heating zone to the third heating zone to control the gel time of the mixed glue solution; The copper foil layer and the semi-cured film sheet are pressed to form the copper-clad plate.

2. The method for producing a copper-clad plate according to claim 1, wherein The copper foil layer and the semi-cured film sheet are pressed to form the copper-clad plate, which comprises pressing the first copper foil layer and the semi-cured film sheet to form a single-sided copper-clad plate.

3. The method of producing a copper-clad plate according to claim 2, wherein After the first copper foil layer and the semi-cured film sheet are pressed to form the single-sided copper-clad plate, a release film is attached to the side of the semi-cured film sheet away from the first copper foil layer.

4. The method of producing a copper-clad plate according to claim 1, wherein The copper foil layer and the semi-cured film sheet are pressed to form the copper-clad plate, which comprises pressing the first copper foil layer, the semi-cured film sheet and the second copper foil layer arranged in sequence to form a double-sided copper-clad plate.

5. A copper clad plate characterized by, The application relates to a copper-clad plate and an LED lamp plate. The semi-cured film sheet comprises a glass fiber cloth and a mixed glue solution layer coated on the surface of the glass fiber cloth, wherein the mixed glue solution layer comprises, by weight percentage, 10-30% of titanium white powder, 5-20% of barium sulfate, 30-50% of alicyclic epoxy resin and heterocyclic epoxy resin, and 5-25% of anhydride epoxy curing agent; The first copper foil layer is arranged on the semi-cured film sheet. The release film is arranged on the side of the semi-cured film sheet away from the first copper foil layer.

6. The copper-clad board according to claim 5, wherein The copper-clad plate further comprises The release film is arranged on the side of the semi-cured film sheet away from the first copper foil layer.

7. The copper-clad board according to claim 5, wherein The copper-clad plate further comprises The second copper foil layer is arranged on the side of the semi-cured film sheet away from the first copper foil layer.

8. The copper-clad board according to any one of claims 5 to 7, characterized by, The surface reflectivity of the semi-cured film sheet is greater than 85%.

9. The copper-clad board according to any one of claims 5 to 7, wherein The glass transition temperature of the semi-cured film sheet is greater than 170 DEG C.

10. The copper-clad board according to any one of claims 5 to 7, wherein The thickness of the semi-cured film sheet ranges from 0.08 mm to 0.5 mm.

11. An LED light panel, characterized by The LED lamp plate comprises: An LED lamp bead; A copper-clad plate, wherein the LED lamp bead is arranged on the copper-clad plate, and the copper-clad plate is the copper-clad plate according to any one of claims 5-10.

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