Decoupling test method for thermal strain of test piece under ring temperature-radiation coupling test condition

Abstract

The application discloses a kind of ring temperature-radiation coupling test working condition under test piece thermal strain decoupling test method, comprising: respectively constructing ring temperature single test working condition, radiation single test working condition, the first expression and the second expression of test piece thermal strain test signal;According to target environment temperature, the first expression is solved, and first thermal strain test signal is obtained;According to target environment temperature, construct ring temperature transfer function, and according to target environment temperature and transfer function, obtain weakened environment temperature;According to weakened environment temperature and radiation intensity, the second expression is solved, and second thermal strain test signal is obtained;According to transfer function, first thermal strain test signal and second thermal strain test signal, obtain test piece thermal strain test signal under ring temperature-radiation coupling test working condition.The application can obtain test piece thermal strain test signal under ring temperature-radiation coupling test using test piece thermal strain test signal under ring temperature, radiation single environmental factor decoupling test.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of environmental simulation test experiment, and in particular relates to a decoupling test method for thermal strain of a test piece under a coupled test condition of ambient temperature and radiation, a decoupling test device for thermal strain of a test piece under a coupled test condition of ambient temperature and radiation, and an electronic device. BACKGROUND

[0002] Environmental simulation test experiment is an activity for maintaining the functional reliability of a test piece under all environments expected in use, transportation or storage. Specifically, it is an activity for detecting the tolerance parameters of a test piece under different environments by using artificial methods to simulate natural environments, including strong wind, high and low temperature, humidity, solar radiation, rainfall and snowfall, etc., to carry out single test experiments or coupled test experiments of various environmental factors on different test pieces, so as to provide theoretical support and practical guidance for various performance indicators of the test piece under real environments.

[0003] At present, the ambient temperature and radiation jointly act on the test piece under real conditions, have similar influences and have the most prominent effects. Therefore, it is necessary to carry out simulation tests in an environmental test cabin to seek the coupling mechanism of ambient temperature and radiation. However, the large environmental test cabin or the walk-in environmental test cabin in the related art is limited by the test environment and test cost, so that it is difficult to construct a coupled test environment of ambient temperature and radiation on a large scale. The environmental simulation device reduces the limit parameters of the single simulation condition of each environmental factor under the coupled test condition, so that there is a large difference between the direct test signal of the test piece under the coupled test condition of ambient temperature and radiation and the signal under the real condition. SUMMARY

[0004] The present application aims to at least solve one of the technical problems in the related art. To this end, a first object of the present application is to provide a decoupling test method for thermal strain of a test piece under a coupled test condition of ambient temperature and radiation, so as to obtain the test signal of the thermal strain of the test piece under the coupled test condition of ambient temperature and radiation by using the test signal of the thermal strain of the test piece under the decoupling test condition of ambient temperature and radiation.

[0005] A second object of the present application is to provide a decoupling test device for thermal strain of a test piece under a coupled test condition of ambient temperature and radiation.

[0006] A third object of the present application is to provide an electronic device.

[0007] To achieve the above object, the embodiment of the first aspect of the present application provides a decoupling test method for thermal strain of a test piece under a ring temperature-radiation coupling test condition, comprising the following steps: constructing expressions of test signals of thermal strain of the test piece under a ring temperature single test condition and a radiation single test condition respectively to obtain a first expression and a second expression; solving the first expression according to a target environment temperature to obtain a test signal of thermal strain of the test piece under the ring temperature single test condition, which is recorded as a first thermal strain test signal; constructing a ring temperature transfer function according to the target environment temperature and obtaining a weakened environment temperature according to the target environment temperature and the transfer function; solving the second expression according to the weakened environment temperature and a radiation intensity to obtain a test signal of thermal strain of the test piece under the radiation single test condition, which is recorded as a second thermal strain test signal; and obtaining a test signal of thermal strain of the test piece under the ring temperature-radiation coupling test condition according to the transfer function, the first thermal strain test signal and the second thermal strain test signal.

[0008] The decoupling test method for thermal strain of a test piece under a ring temperature-radiation coupling test condition provided by the embodiment of the present application can obtain a test signal of thermal strain of the test piece under the ring temperature-radiation coupling test condition by using test signals of thermal strain of the test piece under ring temperature single test conditions and radiation single test conditions, and solves the problem that a large environmental test chamber or a walk-in environmental test chamber cannot carry out multi-environmental factor coupling test due to the limitation of test temperature and test cost.

[0009] In addition, the decoupling test method for thermal strain of a test piece under a ring temperature-radiation coupling test condition provided by the embodiment of the present application can have the following additional technical features:

[0010] According to an embodiment of the present application, obtaining a test signal of thermal strain of the test piece under the ring temperature-radiation coupling test condition according to the transfer function, the first thermal strain test signal and the second thermal strain test signal comprises: constructing an expression of a test signal of thermal strain of the test piece under the ring temperature-radiation coupling test condition to obtain a third expression; constructing a decoupling test expression according to the first expression, the second expression and the third expression; and obtaining a test signal of thermal strain of the test piece under the ring temperature-radiation coupling test condition according to the decoupling test expression, the transfer function, the first thermal strain test signal and the second thermal strain test signal.

[0011] According to an embodiment of the present application, the first expression is: The second expression is: The third expression is: wherein ρ is the density of the test piece, c is the specific heat capacity of the test piece, τ is a time interval, λ is the thermal conductivity of the test piece, h(x, y) is the convective heat transfer coefficient, δ is the thickness of the test piece, x is the length of the test piece, y is the width of the test piece, and α is the radiation absorption ratio.

[0012] According to one embodiment of the present application, the solving the first expression according to the target environment temperature comprises: performing S-domain transformation on the first expression to obtain a first function, and obtaining the first thermal strain test signal according to an S-domain function of the target environment temperature and the first function; and the solving the second expression according to the weakening environment temperature comprises: performing S-domain transformation on the second expression to obtain a second function, and obtaining the second thermal strain test signal according to an S-domain function of the weakening environment temperature and the second function.

[0013] According to one embodiment of the present application, the constructing the ring temperature transfer function according to the target environment temperature and obtaining the weakening environment temperature according to the target environment temperature and the transfer comprises: constructing the ring temperature transfer function wherein, is an S-domain function of the weakening environment temperature, T a (s) is an S-domain function of the target environment temperature; the S-domain function of the weakening environment temperature is obtained according to the S-domain function of the target environment temperature, the ring temperature transfer function and a temperature curve provided by the target environment test cabin.

[0014] According to one embodiment of the present application, the constructing the decoupling test expression according to the first expression, the second expression and the third expression comprises: performing S-domain transformation on the third expression to obtain a third function; and the decoupling test expression is obtained according to the first function, the second function and the third function wherein, T(s) is a thermal strain test signal of a test piece under the ring temperature-radiation coupling test condition, T1(s) and T2(s) are respectively the first thermal strain test signal and the second thermal strain test signal.

[0015] According to one embodiment of the present application, the method further comprises: constructing a two-dimensional thermal stress relationship of the test piece; and obtaining test piece principal stress and principal strain signals under a plane stress state according to the two-dimensional thermal stress relationship and the thermal strain test signal of the test piece under the ring temperature-radiation coupling test condition.

[0016] According to one embodiment of the present application, the two-dimensional thermal stress relationship is: wherein, is a deformation amount of the test piece along a length direction, is a deformation amount of the test piece along a width direction, and μ is a Poisson's ratio and β is a thermal expansion coefficient.

[0017] To achieve the above object, the second aspect embodiment of the present application proposes a decoupling test device for thermal strain of a test piece under a ring temperature-radiation coupled test condition, comprising: a construction module configured to construct expressions of test signals of thermal strain of the test piece under a ring temperature single test condition and a radiation single test condition respectively, to obtain a first expression and a second expression; an acquisition module configured to acquire a target environment temperature; a first calculation module configured to solve the first expression according to the target environment temperature, to obtain a test signal of thermal strain of the test piece under the ring temperature single test condition, denoted as a first thermal strain test signal; a second calculation module configured to construct a ring temperature transfer function according to the target environment temperature, and to obtain a weakened environment temperature according to the target environment temperature and the transfer function; a third calculation module configured to solve the second expression according to the weakened environment temperature and a radiation intensity, to obtain a test signal of thermal strain of the test piece under the radiation single test condition, denoted as a second thermal strain test signal; and a fourth calculation module configured to obtain a test signal of thermal strain of the test piece under the ring temperature-radiation coupled test condition according to the transfer function, the first thermal strain test signal and the second thermal strain test signal.

[0018] To achieve the above object, the third aspect embodiment of the present application proposes an electronic device, comprising a memory and a processor, wherein the memory stores a computer program, and the computer program is executed by the processor to implement the decoupling test method for thermal strain of a test piece under a ring temperature-radiation coupled test condition.

[0019] Additional aspects and advantages of the present application will be made apparent from the following description. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 is a temperature change graph of the present embodiment acting on the insulation board;

[0021] Figure 2 is a radiation change graph of the present embodiment acting on the insulation board;

[0022] Figure 3 is a node division selection and radiation range diagram of the present embodiment of the insulation board;

[0023] Figure 4 is a flowchart of the decoupling test method for thermal strain of a test piece under a ring temperature-radiation coupled test condition of the present embodiment;

[0024] Figure 5 is a weakened temperature change graph of the present embodiment acting on the insulation board;

[0025] Figure 6is a flow chart of a decoupling test method for thermal strain of a test piece in a ring temperature-radiation coupling test condition according to another embodiment of the present application;

[0026] Figure 7 (a) is a T-t graph of the present application acting on point A (40, 20) of the insulation board;

[0027] Figure 7 (b) is a T-t graph of the present application acting on point B (40, 40) of the insulation board;

[0028] Figure 7 (c) is a T-t graph of the present application acting on point C (80, 20) of the insulation board;

[0029] Figure 7 (d) is a T-t graph of the present application acting on point D (80, 40) of the insulation board;

[0030] Figure 8 is a flow chart of a decoupling test method for thermal strain of a test piece in a ring temperature-radiation coupling test condition according to another embodiment of the present application;

[0031] Figure 9 (a) is a ε-t graph of the present application acting on point A (40, 20) of the insulation board;

[0032] Figure 9 (b) is a ε-t graph of the present application acting on point B (40, 40) of the insulation board;

[0033] Figure 9 (c) is a ε-t graph of the present application acting on point C (80, 20) of the insulation board;

[0034] Figure 9 (d) is a ε-t graph of the present application acting on point D (80, 40) of the insulation board;

[0035] Figure 10 is a block schematic diagram of a decoupling test device for thermal strain of a test piece in a ring temperature-radiation coupling test condition according to an embodiment of the present application;

[0036] Figure 11 is a structural schematic diagram of an electronic device according to an embodiment of the present application. DETAILED DESCRIPTION

[0037] Embodiments of the present application are described in detail below with reference to the attached drawings, which show by way of example, embodiments in which like numerals indicate like elements or elements having the same or similar function. The embodiments described below are examples intended to explain the present application, and are not to be understood as limiting the present application.

[0038] The following description is made with reference to the accompanying drawings, which show by way of exampleFigure 1 -Appendix Figure 11 The application discloses a decoupling test method, device and electronic equipment for thermal strain of a test piece in a ring temperature-radiation coupling test mode.

[0039] The application discloses a decoupling test method, device and electronic equipment for thermal strain of a test piece in a ring temperature-radiation coupling test mode. Figure 1 Figure 2 The application discloses a decoupling test method, device and electronic equipment for thermal strain of a test piece in a ring temperature-radiation coupling test mode. Figure 3

[0040] Figure 4 The application discloses a decoupling test method, device and electronic equipment for thermal strain of a test piece in a ring temperature-radiation coupling test mode. Figure 4 The decoupling test method for thermal strain of the test piece in the ring temperature-radiation coupling test mode comprises the following steps:

[0041] S1, expressions of thermal strain test signals of the test piece in a ring temperature single test mode and a radiation single test mode are respectively constructed, to obtain a first expression and a second expression.

[0042] Specifically, the first expression can be as follows:

[0043]

[0044] The second expression is as follows:

[0045]

[0046] Wherein, ρ is the density of the test piece, c is the specific heat capacity of the test piece, τ is a time interval, λ is the thermal conductivity of the test piece, h(x, y) is the convective heat transfer coefficient, δ is the thickness of the test piece, x is the length of the test piece, y is the width of the test piece, and α is the radiation absorption ratio.

[0047] S2, the first expression is solved according to the environmental temperature, to obtain the thermal strain test signal of the test piece in the ring temperature single test mode, which is recorded as a first thermal strain test signal. ​​

[0048] Specifically, the S-domain transformation is performed on the first expression to obtain a first function, and the first thermal strain test signal (i.e., a first temperature signal) is obtained according to the S-domain function of the ambient temperature and the first function.

[0049] S3, constructing a ring temperature transfer function according to the ambient temperature, and obtaining a weakened ambient temperature according to the ambient temperature and the transfer function.

[0050] Specifically, the ring temperature transfer function is constructed as wherein, is the S-domain function of the weakened ambient temperature, T a (s) is the S-domain function of the target ambient temperature; the S-domain function of the weakened ambient temperature is obtained according to the S-domain function of the ambient temperature, the ring temperature transfer function, and the temperature curve provided by the target ambient test chamber. As an example, the target ambient temperature curve and the weakened ambient temperature curve can be seen from Figure 5 .

[0051] S4, solving the second expression according to the weakened ambient temperature and the radiation intensity to obtain the thermal strain test signal of the test piece under the radiation single test condition, denoted as a second thermal strain test signal.

[0052] Specifically, the S-domain transformation is performed on the second expression to obtain a second function, and the second thermal strain test signal (i.e., a second temperature signal) is obtained according to the S-domain function of the weakened ambient temperature and the second function.

[0053] S5, obtaining the thermal strain test signal of the test piece under the ring temperature-radiation coupling test condition according to the transfer function, the first thermal strain test signal, and the second thermal strain test signal.

[0054] In an embodiment of the present application, the thermal strain test signal of the test piece under the ring temperature-radiation coupling test condition is obtained according to the transfer function, the first thermal strain test signal, and the second thermal strain test signal, as shown in Figure 6 , including the following steps:

[0055] S51, constructing an expression of the thermal strain test signal of the test piece under the ring temperature-radiation coupling test condition to obtain a third expression.

[0056] Specifically, the third expression is:

[0057]

[0058] S52, constructing a decoupling test expression according to the first expression, the second expression, and the third expression.

[0059] In one embodiment of the present application, the decoupling test expression is constructed according to the first expression, the second expression and the third expression, comprising: performing S-domain transformation on the third expression to obtain a third function; and obtaining the decoupling test expression according to the first function, the second function and the third function Wherein, T(s) is the test piece thermal strain test signal under the ring temperature-radiation coupling test condition, T1(s) and T2(s) are respectively the first thermal strain test signal and the second thermal strain test signal.

[0060] Specifically, the test piece thermal strain test signal T(s) under the ring temperature-radiation coupling test condition is judged, if T(s) meets the accuracy requirement, T(s) is output; if it does not meet the accuracy requirement, it returns to step S2.

[0061] S53, obtaining the test piece thermal strain test signal under the ring temperature-radiation coupling test condition according to the decoupling test expression, the transfer function, the first thermal strain test signal and the second thermal strain test signal.

[0062] As shown in Figure 7 (a)-(d), the temperature of the insulation board can reach 17℃ under the weather, and the temperature difference between the radiation area and the non-radiation area is 2℃. Among the four points, the A point in the radiation area has good coupling and decoupling experimental data coincidence, in the non-radiation area, the B point close to the radiation area also has good coincidence degree, the C and D points far away from the radiation area have slight decoupling and coupling deviation, the trend of the coupling and decoupling images is basically consistent, which verifies the accuracy of the decoupling test method of the present application.

[0063] In one embodiment of the present application, as shown in Figure 8 the decoupling test method of the test piece thermal strain under the ring temperature-radiation coupling test condition can further comprise:

[0064] S601, constructing a two-dimensional thermal stress relationship of the test piece.

[0065] Specifically, the two-dimensional thermal stress relationship is:

[0066]

[0067] Wherein, is the deformation amount of the test piece along the length direction, is the deformation amount of the test piece along the width direction, and μ is the Poisson's ratio and β is the thermal expansion coefficient.

[0068] S602, obtaining the principal stress and the principal strain signal of the test piece under the plane stress state according to the two-dimensional thermal stress relationship and the test piece thermal strain test signal under the ring temperature-radiation coupling test condition.

[0069] Specifically, the main strain signal ε is judged, if ε reaches the accuracy requirement, ε is output; if the accuracy requirement is not reached, step S602 is returned.

[0070] Specifically, it is judged whether the end time is reached, if the end time is reached, the thermal strain test signal T(s) and the main strain signal ε of the test piece under the ring temperature-radiation coupling test condition are output; if the end time is not reached, step S2 is returned.

[0071] The processing signal obtained by the maximum elongation line strain coupling processing is a four-point strain change curve over time, as shown in Figure 9 (a)-(d). As shown in Figure 9 Under this environmental parameter, the elongation line main strain ε of the insulation board can reach 2.4*10-5m, and since the insulation board is a plane heat conductor, the strain change in the non-radiation area is delayed by about 10h compared with the radiation area. The strain coupling and decoupling signal trends are generally consistent, for A point in the radiation area and B point close to the radiation area, the influence of radiation is large, and the obtained strain coupling and decoupling signal deviation is large, and the strain coupling and decoupling signal deviation of C, D which are relatively far from the radiation area is small.

[0072] In summary, the decoupling test method for the thermal strain of the test piece under the ring temperature-radiation coupling test condition of the embodiment of the application can solve the problem that the large environmental test chamber or the walk-in environmental test chamber cannot carry out the multi-environmental factor coupling test of the test piece due to the test temperature and test cost limitations; the thermal strain test signal of the test piece under the ring temperature-radiation coupling test condition can be obtained by using the thermal strain test signal of the test piece under the ring temperature-radiation single environmental factor decoupling test condition.

[0073] Corresponding to the above-mentioned embodiment, the application further provides a decoupling test device for thermal strain of a test piece under a ring temperature-radiation coupling test condition.

[0074] As shown in Figure 10 The decoupling test device for thermal strain of a test piece under a ring temperature-radiation coupling test condition of the embodiment of the application comprises a construction module 10, a first acquisition module 20, a second acquisition module 30, a first calculation module 40, a second calculation module 50, a third calculation module 60 and a fourth calculation module 70.

[0075] The expression of the thermal strain test signal of the test piece under the single test condition of the ambient temperature and the single test condition of the radiation is constructed by the construction module 10, and first and second expressions are obtained; the first acquisition module 20 is used for acquiring the target environment temperature; the second acquisition module 30 is used for acquiring the radiation intensity; the first calculation module 40 is used for solving the first expression according to the target environment temperature, and the thermal strain test signal of the test piece under the single test condition of the ambient temperature is obtained, which is recorded as the first thermal strain test signal; the second calculation module 50 is used for constructing the ambient temperature transfer function according to the target environment temperature, and the weakening environment temperature is obtained according to the target environment temperature and the transfer function; the third calculation module 60 is used for solving the second expression according to the weakening environment temperature and the radiation intensity, and the thermal strain test signal of the test piece under the single test condition of the radiation is obtained, which is recorded as the second thermal strain test signal; and the fourth calculation module 70 is used for obtaining the thermal strain test signal of the test piece under the coupling test condition of the ambient temperature and the radiation according to the transfer function, the first thermal strain test signal and the second thermal strain test signal.

[0076] The decoupling test device for the thermal strain of the test piece under the coupling test condition of the ambient temperature and the radiation according to the embodiment of the application realizes the thermal strain test signal of the test piece under the single environmental factor decoupling test condition of the ambient temperature and the radiation, and obtains the thermal strain test signal of the test piece under the coupling test condition of the ambient temperature and the radiation.

[0077] Based on the decoupling test method for the thermal strain of the test piece under the coupling test condition of the ambient temperature and the radiation, the application further provides an electronic device.

[0078] In this embodiment, as shown in Figure 11 The electronic device of the embodiment of the application can realize the thermal strain test signal of the test piece under the single environmental factor decoupling test condition of the ambient temperature and the radiation, and obtain the thermal strain test signal of the test piece under the coupling test condition of the ambient temperature and the radiation when the computer program corresponding to the decoupling test method for the thermal strain of the test piece under the coupling test condition of the ambient temperature and the radiation stored on the memory of the electronic device is executed by the processor.

[0079] The electronic device of the embodiment of the application can realize the thermal strain test signal of the test piece under the single environmental factor decoupling test condition of the ambient temperature and the radiation, and obtain the thermal strain test signal of the test piece under the coupling test condition of the ambient temperature and the radiation when the computer program corresponding to the decoupling test method for the thermal strain of the test piece under the coupling test condition of the ambient temperature and the radiation stored on the memory of the electronic device is executed by the processor.

[0080] It is to be appreciated that the above description and the examples that follow are intended to be illustrative only and that changes can be made to the description and examples without departing from the scope of the application. Note also that the use of particular brand names in the description is solely for illustration and should not be construed as an endorsement of such brands.

[0081] It should be understood that aspects of the application can be implemented in hardware, software, firmware or a combination thereof. In the above embodiments, various steps or methods can be implemented in software or firmware that is stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, any of the following technologies, known in the art, can be used: a hybrid of the technologies mentioned above, discrete logic circuitry having logic gates for implementing logic functions upon data signals, application specific integrated circuits having appropriate combinational logic gates, programmable gate arrays (PGA), field programmable gate arrays (FPGA), and so forth.

[0082] In the description of the present application, reference has been made to the use of terms such as "one embodiment", "some embodiments", "an example", "a specific example" or "some examples" means that a particular feature, structure, material or characteristic is included in at least one embodiment or example of the present application. The illustrative examples given are not necessarily to be construed as preferred or advantageous or with the exclusion of other equally valid examples that can be particularly adapted to a given application. Moreover, such illustrative examples are not necessarily mutually exclusive as the various aspects of the application can be combined in any suitable manner.

[0083] In the description of the application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the application.

[0084] In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features. In the description of the application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise explicitly specified and limited.

[0085] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0086] In the present application, unless otherwise explicitly specified and limited, the first feature "on" or "under" the second feature can be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature "above", "above" and "above" the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0087] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as a limitation on the present application, and those skilled in the art can make changes, modifications, replacements and variations to the above embodiments within the scope of the present application.

Claims

1. A decoupled testing method for thermal strain of a specimen under ambient temperature-radiation coupling testing conditions, characterized in that, The method includes: Expressions for the thermal strain test signals of the specimen under single ambient temperature test conditions and single radiation test conditions are constructed respectively, resulting in the first expression and the second expression; Solving the first expression based on the target ambient temperature yields the specimen thermal strain test signal under a single ambient temperature test condition, which is denoted as the first thermal strain test signal. An ambient temperature transfer function is constructed based on the target ambient temperature, and a weakened ambient temperature is obtained based on the target ambient temperature and the ambient temperature transfer function. Solving the second expression based on the weakened ambient temperature and radiation intensity yields the specimen thermal strain test signal under a single radiation test condition, which is denoted as the second thermal strain test signal. Based on the ambient temperature transfer function, the first thermal strain test signal, and the second thermal strain test signal, the thermal strain test signal of the specimen under the ambient temperature-radiation coupling test condition is obtained, including: An expression for the thermal strain test signal of the specimen under the ambient temperature-radiation coupling test condition is constructed, resulting in the third expression; Construct a decoupling test expression based on the first expression, the second expression, and the third expression; Based on the decoupling test expression, the ambient temperature transfer function, the first thermal strain test signal and the second thermal strain test signal, the thermal strain test signal of the specimen under the ambient temperature-radiation coupling test condition is obtained. The first expression is: The second expression is: The third expression is: in, The density of the specimen, The specific heat capacity of the specimen. For time intervals, The thermal conductivity of the specimen. The convective heat transfer coefficient is... For the thickness of the specimen, The length of the specimen. The width of the specimen. It is the radiation absorptivity; Solving the first expression based on the target ambient temperature includes: The first expression is transformed in the S-domain to obtain the first function, and the first thermal strain test signal is obtained based on the S-domain function of the target ambient temperature and the first function. Solving the second expression based on the weakened ambient temperature includes: The second expression is transformed in the S-domain to obtain the second function, and the second thermal strain test signal is obtained based on the S-domain function of the weakened ambient temperature and the second function. The ambient temperature transfer function is constructed based on the target ambient temperature, and based on the target ambient temperature... The ambient temperature transfer function is used to obtain a weakened ambient temperature, including: Construct the ambient temperature transfer function ,in, For the weakened ambient temperature, (This is an S-domain function) The S-domain function of the target ambient temperature; The S-domain function of the weakened ambient temperature is obtained based on the S-domain function of the target ambient temperature, the ambient temperature transfer function, and the temperature curve provided by the target environment test chamber. The step of constructing a decoupling test expression based on the first expression, the second expression, and the third expression includes: Perform an S-domain transformation on the third expression to obtain the third function; Based on the first function, the second function, and the third function, the decoupling test expression is obtained. ,in, This refers to the thermal strain test signal of the specimen under the ambient temperature-radiation coupling test condition. , These are the first thermal strain test signal and the second thermal strain test signal, respectively.

2. The method according to any one of claims 1, characterized in that, The method further includes: Construct the two-dimensional thermal stress relationship of the specimen; Based on the two-dimensional thermal stress relationship and the thermal strain test signal of the specimen under the ambient temperature-radiation coupling test condition, the principal stress and principal strain signals of the specimen under plane stress state are obtained.

3. The method according to claim 2, characterized in that, The two-dimensional thermal stress relationship is as follows: in, This represents the deformation of the specimen along its length. denoted as σ, where σ is the deformation of the specimen along its width, σ is Poisson's ratio, and σ is the coefficient of thermal expansion.

4. A decoupling test device for thermal strain of a specimen under ambient temperature-radiation coupling test conditions, characterized in that, The device includes: The construction module is used to construct the expressions for the thermal strain test signals of the specimen under single ambient temperature test conditions and single radiation test conditions, respectively, to obtain the first expression and the second expression; The first acquisition module is used to acquire the target ambient temperature; The second acquisition module is used to acquire radiation intensity; The first calculation module is used to solve the first expression based on the target ambient temperature to obtain the specimen thermal strain test signal under a single ambient temperature test condition, which is denoted as the first thermal strain test signal. The second calculation module is used to construct an ambient temperature transfer function based on the target ambient temperature, and to obtain a weakened ambient temperature based on the target ambient temperature and the transfer function. The third calculation module is used to solve the second expression based on the weakened ambient temperature and the radiation intensity to obtain the specimen thermal strain test signal under the single radiation test condition, which is denoted as the second thermal strain test signal. The fourth calculation module is used to obtain the thermal strain test signal of the specimen under the ambient temperature-radiation coupling test condition based on the transfer function, the first thermal strain test signal and the second thermal strain test signal.

5. An electronic device comprising a memory, a processor, and a computer program stored in the memory, characterized in that, When the computer program is executed by the processor, it implements the method according to any one of claims 1-3.

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