Substrate heating device and semiconductor machine

Abstract

This invention provides a substrate heating device and a semiconductor machine, including a heating plate, a base, and a fixing unit. The fixing unit is disposed on the base and located at the edge of the heating plate. The fixing unit is used to fix the heating plate. The heating plate includes a fixing unit contact area and a non-fixing unit contact area. The area where the fixing unit contacts the heating plate is located within the fixing unit contact area. The fixing unit contact area and the non-fixing unit contact area achieve zoned heating. A gap exists between the lower surface of the heating plate and the upper surface of the base. By fixing the heating plate from the edge of the heating plate using the fixing unit, the heating plate can be fixed more evenly in a smaller space, making the movement of the heating plate easier. Furthermore, the zoned heating of the heating plate and the heating by the fixing unit result in better heating temperature uniformity.

Description

Technical Field

[0001] This invention relates to the field of semiconductors, and in particular to a substrate heating device and a semiconductor machine. Background Technology

[0002] With the continuous development of integrated circuit technology, the manufacturing process of integrated circuits is also constantly evolving, and the requirements for related processes are becoming increasingly stringent. Among them, some processes (such as laser annealing and bonding processes) require the substrate to be preheated to a certain temperature (e.g., 300℃~500℃) before execution, and there are high requirements for the uniformity of the heating temperature (e.g., within ±2.5℃ of the set temperature). This places higher demands on the design of the substrate heating device.

[0003] Currently, heating plates in preheating substrate heating devices are typically supported and fixed using a shaft or bracket located in the middle of the heating plate. However, using a shaft or bracket fixed in the middle takes up a lot of space, makes it inconvenient for the movement of the heating plate, is not conducive to improving the movement speed of the heating plate, and will also affect the accuracy of the heating plate during the movement process.

[0004] On the other hand, existing substrate heating devices are not ideal in terms of heating temperature uniformity, with large temperature differences in different areas of the heating plate, making it difficult to meet higher process requirements. Summary of the Invention

[0005] The purpose of this invention is to provide a substrate heating device and a semiconductor machine to solve the problem of poor motion performance of existing heating plates.

[0006] Another objective of this invention is to improve the temperature uniformity of the heating plate.

[0007] To solve the above-mentioned technical problems, the present invention provides a substrate heating device, including a heating plate, a base, and a fixing unit. The fixing unit is disposed on the base and located at the edge of the heating plate. The fixing unit is used to fix the heating plate. The heating plate includes a fixing unit contact area and a non-fixing unit contact area. The area where the fixing unit contacts the heating plate is located within the fixing unit contact area. The fixing unit contact area and the non-fixing unit contact area achieve zoned heating. There is a gap between the lower surface of the heating plate and the upper surface of the base.

[0008] Optionally, the number of fixing units is at least three, and the at least three fixing units are evenly distributed on the edge of the heating plate.

[0009] Optionally, the fixing unit includes a supporting component, an elastic component, and a heat insulation component. The lower surface of the heating plate is disposed on the supporting component, the elastic component is disposed on the supporting component and contacts the upper surface of the heating plate to fix the heating plate, and the heat insulation component is disposed between the supporting component and the base.

[0010] Optionally, the supporting component is a supporting column, and the supporting component is made of rigid heat-insulating material; further, the supporting component is made of ceramic.

[0011] Optionally, the elastic component is an elastic pressure plate, and the material of the elastic component is spring steel.

[0012] Optionally, the fixing unit further includes a fixing unit heater, which is disposed inside the support member or outside the support member.

[0013] Optionally, the heat insulation component is made of an elastic heat insulation material; further, the heat insulation component is made of aerogel.

[0014] Optionally, the contact between the supporting component and the elastic component is a point contact, and the contact between the supporting component and the heat insulation component is a point contact.

[0015] Optionally, when implementing zoned heating, the set temperature of the contact area of ​​the fixed unit is higher than the set temperature of the contact area of ​​the non-fixed unit.

[0016] Furthermore, the heating plate includes a central area and an outer area surrounding the central area, and the central area and the outer area are heated in separate zones. The central area includes a first central area and a second central area surrounding the first central area, and the outer area includes a first outer area and a second outer area surrounding the first outer area. The contact area of ​​the fixing unit is located in the first outer area and the second outer area, and the set temperatures of the first central area, the second central area, the first outer area and the second outer area increase sequentially.

[0017] Furthermore, the peripheral area includes a direct contact area, an indirect contact area, and a non-contact area distributed circumferentially thereon. The area in which each fixed unit contacts the heating plate constitutes a direct contact area. The indirect contact areas are distributed on both sides of each direct contact area. The contact area of ​​the fixed unit includes a direct contact area and an indirect contact area. The direct contact area, the indirect contact area, and the non-contact area achieve zoned heating, and the set temperature of the indirect contact area is greater than the set temperature of the direct contact area.

[0018] Optionally, the heating plate includes a heating plate housing and a heating plate heater. The first central area, the second central area, the first peripheral area, and the second peripheral area are each provided with the heating plate heater. The heating plate heater is disposed inside the heating plate housing or on the lower surface of the heating plate housing. Further, the heating plate heater is a resistance heater.

[0019] Based on another aspect of the present invention, the present invention also provides a semiconductor machine tool, including the substrate heating device as described above.

[0020] Optionally, the semiconductor equipment is a laser annealing device or a bonding device.

[0021] In summary, the substrate heating device and semiconductor machine provided by the present invention have the following beneficial effects:

[0022] 1) The fixing unit is located at the edge of the heating plate. By fixing the heating plate from the edge of the heating plate using the fixing unit, the heating plate can be fixed more evenly in a small space, which makes it easier for the heating plate to move and helps to improve the movement speed and accuracy of the heating plate during the movement.

[0023] 2) The heating plate achieves zoned heating between the central and outer areas, so that the set temperature of the outer area is higher than that of the central area, thereby reducing the temperature difference between the central and outer areas;

[0024] 3) The outer area of ​​the heating plate includes a direct contact area, an indirect contact area, and a non-contact area distributed along its circumference. The direct contact area, indirect contact area, and non-contact area achieve zoned heating, so that the set temperature of the indirect contact area is higher than the set temperature of the direct contact area, resulting in better heating temperature uniformity. Attached Figure Description

[0025] Those skilled in the art will understand that the accompanying drawings are provided to better understand the invention and do not constitute any limitation thereof. Wherein:

[0026] Figure 1 This is a cross-sectional schematic diagram of a substrate heating device provided in an embodiment of this application;

[0027] Figure 2 This is a top view schematic diagram of a substrate heating device provided in an embodiment of this application;

[0028] Figure 3 This is a cross-sectional schematic diagram of another substrate heating device provided in an embodiment of this application;

[0029] Figure 4 This is a schematic diagram of a heating plate with zoned heating provided in an embodiment of this application.

[0030] Figure 5This is a schematic diagram of another substrate heating device provided in the embodiments of this application.

[0031] In the attached image:

[0032] 100 - Substrate; 10 - Heating plate;

[0033] 20 - Fixed unit; 21 - Elastic component; 22 - Support component; 22a - First support component; 22b - Second support component;

[0034] 23-Insulation component; 23a-First insulation component; 23b-Second insulation component;

[0035] 24 - Protrusion; 25 - Fixed unit heater;

[0036] 30 - Cooling tray (base). Detailed Implementation

[0037] To make the objectives, advantages, and features of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that the drawings are all in a very simplified form and are not drawn to scale, and are only used to facilitate and clarify the explanation of the embodiments of this invention. Furthermore, the structures shown in the drawings are often part of the actual structures. In particular, different figures may emphasize different aspects and may sometimes use different scales.

[0038] It should be understood that when an element or layer is referred to as "on" or "connected to" other elements or layers, it may be directly on or connected to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on" or "directly connected to" other elements or layers, there are no intervening elements or layers. Although the terms first, second, third, etc., may be used to describe various elements, components, areas, layers, and / or portions, these elements, components, areas, layers, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, area, layer, or portion from another element, component, area, layer, or portion. Therefore, without departing from the teachings of this invention, the first element, component, area, layer, or portion discussed below may be referred to as a second element, component, area, layer, or portion. Spatial relation terms such as "below," "under," "below," "above," "on top," "above," etc., may be used herein for convenience of description to describe the relationship between one element or feature shown in the figures and other elements or features. It should be understood that, in addition to the orientations shown in the figures, spatial relational terms are intended to also include different orientations of the devices in use and operation. For example, if the devices in the figures are flipped, then elements or features described as “below,” “under,” or “below” will be oriented “on” other elements or features. Devices may be oriented additionally (rotated 90 degrees or otherwise) and the spatial descriptive terms used herein will be interpreted accordingly. The terminology used herein is intended only to describe particular embodiments and is not intended to limit the invention. When used herein, the singular forms “a,” “an,” and “the” are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “comprising” is used to identify the presence of features, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, steps, operations, elements, components, and / or groups. When used herein, the terms “and / or” include any and all combinations of the associated listed items.

[0039] Figure 1 This is a cross-sectional schematic diagram of a substrate heating device provided in an embodiment of this application. Figure 2 This is a top view schematic diagram of a substrate heating device provided in an embodiment of this application.

[0040] like Figure 1 and Figure 2As shown in the embodiment of this application, a substrate heating device includes a heating plate 10, a base 30, and a fixing unit 20. The fixing unit 20 is disposed on the base 30 and located at the edge of the heating plate 10. The fixing unit 20 is used to fix the heating plate 10. The heating plate 10 includes a fixing unit contact area and a non-fixed unit contact area. The area where the fixing unit 20 contacts the heating plate 10 is located within the fixing unit contact area. The fixing unit contact area and the non-fixed unit contact area achieve zoned heating. There is a gap between the lower surface of the heating plate 10 and the upper surface of the base 30.

[0041] The fixing unit 20 includes an elastic member 21, a supporting member 22, and a heat insulation member 23. The supporting member 22 is disposed on the base 30 and has a supporting surface. The lower surface of the heating plate 10 is disposed on the supporting surface of the supporting member 22. The elastic member 21 is disposed on the supporting surface of the supporting member 22 and contacts the upper surface of the heating plate 10 to fix the heating plate 10. The heat insulation member 23 is disposed between the supporting member 22 and the base 30.

[0042] The substrate heating device in this embodiment is used, for example, to heat a silicon wafer, and the heating plate 10 is preferably a disc structure. The base 30 can be a cooling plate, i.e., the cooling plate 30 is disposed below the heating plate 10 and connected to the heating plate 10 by a fixing unit 20, and there is a gap between the upper surface of the cooling plate 30 and the lower surface of the heating plate 10 to reduce the downward conduction or radiation of heat from the heating plate and prevent damage to other structures or devices below the substrate heating device. In practice, the cooling fluid flowing in the cooling plate 30 can be a coolant or a cooling gas.

[0043] Please refer to Figure 2 The number of fixing units 20 is three, and they are evenly distributed along the edge of the heating plate 10 to better support and fix the heating plate 10. Of course, in specific implementations, the number and shape of the fixing units 20 can be adjusted accordingly, for example, to one, two, or more than three, as long as the purpose of supporting and fixing the heating plate 10 can be achieved. Furthermore, in order to better fix the heating plate, when there is only one fixing unit 20, the fixing unit 20 can be arranged in a ring around the edge of the heating plate 10, or when there are only two fixing units 20, the fixing units 20 can be arranged in an arc shape, and the two fixing units 20 are arranged opposite each other along the edge of the heating plate 10.

[0044] like Figure 1 As shown, the support member 22 of the fixing unit 20 is a support column, such as a square column. The support member 22 is made of a rigid heat-insulating material, such as ceramic, which helps to reduce heat loss when the support member 22 comes into contact with the heating plate 10 and to ensure the support member 22's support and fixing effect on the heating plate 10.

[0045] Continue to refer to Figure 1 The elastic component 21 is an elastic pressure plate, which is, for example, an L-shaped sheet structure, such as... Figure 1 As shown, the L-shaped sheet structure includes a vertical portion and a horizontal portion fixedly connected to the vertical portion. The vertical portion is fixedly connected to the surface of the support member 22 exposed outside the heating plate 10, and the horizontal portion extends to contact the edge of the upper surface of the heating plate 10 to fix the heating plate 10. The elastic member 21 is preferably made of an elastic and high-temperature resistant material. Of course, the high-temperature resistance here refers to the maximum preset heating temperature of the heating plate 10, for example, greater than 600°C. Preferably, the elastic member 21 is made of spring steel.

[0046] A heat insulation component 23 is disposed between the support component 22 and the cooling plate 30 to prevent heat exchange between them, thus preventing heat from the heating plate 10 from being conducted from the support component 22 to the cooling plate 30, which would result in heat loss from the heating plate 10. It also prevents damage to the cooling plate 30 from heat conducted by the support component 22. Specifically, the heat insulation component 23 is disposed between the lower surface of the support component 22 and the upper surface of the cooling plate 30, and is, for example, a heat insulation pad. The heat insulation component 23 is preferably made of an elastic heat-insulating material, which helps improve the stability of the connection between the support component 22 and the cooling plate 30 at high temperatures and buffers the impact of thermal expansion of the support component 22 on the connection. In this embodiment, the heat insulation component 23 is made of aerogel with a thermal conductivity of, for example, 0.023 W / mK and a thickness of, for example, 0.5 mm to 2 mm. Experiments have shown that this configuration results in better performance of the heat insulation component 23.

[0047] In a preferred embodiment, the contact between the elastic member 21 and the heating plate 10 is a point contact. For example, the lower surface of the horizontal portion of the elastic member 21 has several protrusions 24, so that the elastic member 21 and the heating plate 10 form a point contact, which helps to reduce the heat conduction between the heating plate 10 and the fixing unit 20, and reduce the temperature difference between the contact area between the heating plate 10 and the fixing unit 20 and other areas of the heating plate.

[0048] Furthermore, the contact between the support member 22 and the heating plate 10 is preferably a point contact to reduce heat loss between the heating plate 10 and the fixing unit 20. Specifically, the upper surface of the support member 22 has a plurality of protrusions 24 for forming point contact between the support member 22 and the heating plate 10.

[0049] This embodiment also provides another substrate heating device, such as... Figure 3As shown, in other substrate heating devices of this embodiment, the support member 22 includes a first support member 22a and a second support member 22b, which are spaced apart. Two heat-insulating members 23 (first heat-insulating member 23a and second heat-insulating member 23a) and an elastic member 21 are also included. The first support member 22a is located below the lower surface of the heating plate 10 and is used to support the heating plate 10. The horizontal portion of the elastic member 21 is located above the upper surface of the heating plate 10, and the vertical portion of the elastic member 21 is connected to the upper surface of the second support member 22b and is used to support and fix the elastic member 21. By configuring the support member as two spaced-apart parts (first support member 22a and second support member 22b), under the condition that the contact area between the fixing unit 20 and the heating plate 10 and other factors remain unchanged, the contact area between the fixing unit 20 and the cooling plate 30 can be reduced to reduce heat loss between the fixing unit 20 and the cooling plate 30, thereby improving the temperature uniformity of the heating plate 10. Furthermore, the heat insulation component 23 includes a first heat insulation component 23a and a second heat insulation component 23b. The first heat insulation component 23a is disposed between the first support component 22a and the cooling plate 30, and the second heat insulation component 23b is disposed between the second support component 22b and the cooling plate 30, so as to further reduce the heat exchange between the support component and the cooling plate 30.

[0050] Please refer to Figure 4 In this embodiment, when implementing zoned heating, the set temperature of the contact area of ​​the fixed unit is higher than the set temperature of the contact area of ​​the non-fixed unit, so as to improve the uniformity of the heating temperature.

[0051] Specifically, the heating plate 10 includes a central area and an outer area surrounding the central area. The central area and the outer area achieve zoned heating. The central area includes a first central area R1 and a second central area R2 surrounding the first central area R1. The outer area includes a first outer area and a second outer area surrounding the first outer area. The fixed unit contact area is located in the first outer area and the second outer area. The heating area on the heating plate other than the fixed unit contact area is the non-fixed unit contact area. The set temperatures of the first central area R1, the second central area R2, the first outer area, and the second outer area increase sequentially. It should be understood that the closer to the outer edge of the heating plate 10, the easier it is for heat to be lost from the edge and surface of the heating plate 10 due to conduction. In order to make the heating temperature uniform, the set heating temperature of the area where heat is easily lost is increased accordingly. In this embodiment, in order to achieve a heating temperature difference of the heating plate 10 within ±2.5℃, the center area is divided into two areas (first center area R1 and second center area R2) to achieve zoned heating. If the heating temperature difference of the heating plate 10 is further reduced and the uniformity of the heating temperature is improved, it can be further divided into more and more suitable areas for zoned heating.

[0052] Furthermore, each peripheral zone includes a direct contact zone, an indirect contact zone, and a non-contact zone distributed circumferentially. The area where each fixed unit 20 contacts the heating plate 10 constitutes a direct contact zone. Indirect contact zones are distributed on both sides of each direct contact zone. The contact zone of the fixed unit includes both direct and indirect contact zones. The direct, indirect, and non-contact zones achieve zoned heating, and the set temperature of the indirect contact zone is higher than that of the direct contact zone, and the set temperature of the direct contact zone is higher than that of the non-contact zone. Specifically, the direct, indirect, and non-contact zones in the first peripheral zone are R6, R5, and R3, respectively, and the direct, indirect, and non-contact zones in the second peripheral zone are R8, R7, and R4, respectively. For example, using each zone to represent the corresponding set temperature, the set temperature of each zone of the heating plate 10 can be expressed as: R7 > R8 > R4, R5 > R6 > R3, R4 > R3 > R2 > R1. In particular, both computer simulations and actual experiments have verified that when the set temperature of the indirect contact area is greater than that of the direct contact area, the heating temperature difference of the corresponding area is smaller.

[0053] Specifically, the heating plate 10 includes a heating shell and heating plate 10 heaters. Each of the first central region, second central region, first peripheral region, and second peripheral region is provided with a corresponding heating plate heater. The heating plate heaters can be located inside the heating plate shell or on the lower surface of the heating plate shell. Each heating zone, including zones R1 to R8, has a heating plate heater with a heating surface matching the shape of each heating zone. The heating plate shell can be made of a rigid, high-temperature resistant material. To facilitate the uniformity of heat conduction through the heating plate 10 shell to its surface, the material of the heating plate shell is preferably a material with a low thermal conductivity, such as ceramic. The heating plate heater can be a resistance heater, such as a heating element or resistance wire located on the lower surface of the heating plate shell, or a resistance wire embedded in the heating plate 10 shell and arranged with corresponding wiring patterns. It should be understood that although the overall heat utilization rate of the heating plate heater externally located on the lower surface of the heating plate shell is lower than that of the heating plate heater built into the heating plate shell, the configuration and replacement of the heating plate heater are more flexible. Therefore, the specific choice of heating plate heater can be considered in conjunction with the specific actual situation, and the embodiments of this application are not limited thereto.

[0054] Furthermore, embodiments of this application provide yet another substrate heating device, such as... Figure 5 As shown, the overall structure of the substrate heating device is similar to... Figure 1 and Figure 3The provided substrate heating device is similar, except that a fixing unit heater 25 is also provided on the support member 22 of the fixing unit 20 to increase the temperature of the support member 22 of the fixing unit 20, thereby reducing the temperature difference between the support member 22 and the heating plate 10, and thus reducing or preventing the heat of the heating plate 10 from being lost through conduction from the fixing unit 20. Therefore, the contact between the support member 22 and the elastic member 21 and the heating plate 10 can be surface contact for ease of installation.

[0055] Specifically, the fixed unit heater 25 can be a heating wire, disposed in the support member 22 or surrounding the outer surface of the support member 22, for providing heat to the support member 22. In this embodiment, since the support member 22 and the cooling plate 30 are relatively close, separated only by a thin heat insulation member 23, preferably, the set temperature of the fixed unit heater 25 should not be too high, for example, lower than the minimum set temperature of each zone in the heating plate 10, so as not to damage the cooling plate 30. Furthermore, the fixed unit heater 25 can also be disposed on the side of the support member 22 closer to the heating plate 10, so as to be as far away from the cooling plate 30 as possible.

[0056] It is understandable that, in practical implementation, the difference in set temperature between the direct contact area and the indirect contact area of ​​the heating plate 20 can be reduced. Under suitable conditions, the set temperature of the entire peripheral area (including the first peripheral area and the second peripheral area) can even be consistent, thereby simplifying the heating zone setting of the heating plate 10. Of course, if the requirement for temperature uniformity is relatively low (e.g., ±10℃), the heating plate 10 can be subjected to more streamlined zone heating, such as two-zone heating, or even whole-area heating without zone heating, which is not limited here.

[0057] This embodiment also provides a semiconductor device, including the substrate heating device described above, for heating a substrate in the semiconductor device. In some specific embodiments, the aforementioned semiconductor device is a laser annealing device, used for preheating the substrate before laser annealing, for example, preheating it to 400°C to 600°C. In other specific embodiments, the aforementioned semiconductor device is a bonding device, used for heating the substrate before bonding.

[0058] In summary, the substrate heating device and semiconductor machine provided by the present invention have the following beneficial effects:

[0059] 1) The fixing unit is located at the edge of the heating plate. By fixing the heating plate from the edge of the heating plate using the fixing unit, the heating plate can be fixed more evenly in a small space, which makes it easier for the heating plate to move and helps to improve the movement speed and accuracy of the heating plate during the movement.

[0060] 2) The heating plate achieves zoned heating between the central and outer areas, so that the set temperature of the outer area is higher than that of the central area, thereby reducing the temperature difference between the central and outer areas;

[0061] 3) The outer area of ​​the heating plate includes a direct contact area, an indirect contact area, and a non-contact area distributed along its circumference. The direct contact area, indirect contact area, and non-contact area achieve zoned heating, so that the set temperature of the indirect contact area is higher than the set temperature of the direct contact area, resulting in better heating temperature uniformity.

[0062] The above description is merely a description of preferred embodiments of the present invention and is not intended to limit the scope of the present invention in any way. Any changes or modifications made by those skilled in the art based on the above disclosure shall fall within the protection scope of the claims.

Claims

1. A substrate heating device, characterized in that, The device includes a heating plate, a base, and a fixing unit. The fixing unit is disposed on the base and located at the edge of the heating plate. The fixing unit is used to fix the heating plate. The heating plate includes a fixing unit contact area and a non-fixing unit contact area. The area where the fixing unit contacts the heating plate is located within the fixing unit contact area. The fixing unit contact area and the non-fixing unit contact area achieve zoned heating. There is a gap between the lower surface of the heating plate and the upper surface of the base. The heating plate includes a central area and an outer area surrounding the central area. The outer area includes a direct contact area, an indirect contact area, and a non-contact area distributed circumferentially therearound. The area in contact between each fixed unit and the heating plate constitutes a direct contact area. The indirect contact areas are distributed on both sides of each direct contact area. The contact area of ​​the fixed unit includes a direct contact area and an indirect contact area. The direct contact area, indirect contact area, and non-contact area achieve zoned heating, and the set temperature of the indirect contact area is higher than the set temperature of the direct contact area.

2. The substrate heating device according to claim 1, characterized in that, The number of fixing units is at least three, and the at least three fixing units are evenly distributed on the edge of the heating plate.

3. The substrate heating device according to claim 1 or 2, characterized in that, The fixing unit includes a support component, an elastic component, and a heat insulation component. The lower surface of the heating plate is disposed on the support component. The elastic component is disposed on the support component and contacts the upper surface of the heating plate to fix the heating plate. The heat insulation component is disposed between the support component and the base.

4. The substrate heating device according to claim 3, characterized in that, The support component includes one support column or two support columns spaced apart.

5. The substrate heating device according to claim 3, characterized in that, The supporting component is made of rigid heat-insulating material.

6. The substrate heating device according to claim 5, characterized in that, The supporting component is made of ceramic.

7. The substrate heating device according to claim 3, characterized in that, The elastic component is an elastic pressure plate.

8. The substrate heating device according to claim 7, characterized in that, The elastic component is made of spring steel.

9. The substrate heating device according to claim 3, characterized in that, The fixing unit further includes a fixing unit heater, which is disposed inside the support member or outside the support member.

10. The substrate heating device according to claim 3, characterized in that, The heat insulation component is made of elastic heat insulation material.

11. The substrate heating apparatus according to claim 10, characterized in that, The heat insulation component is made of aerogel.

12. The substrate heating device according to claim 3, characterized in that, The contact between the supporting component and the elastic component is a point contact.

13. The substrate heating device according to claim 3, characterized in that, The contact between the supporting component and the heat insulation component is a point contact.

14. The substrate heating device according to claim 1, characterized in that, When implementing zoned heating, the set temperature of the contact area of ​​the fixed unit is higher than the set temperature of the contact area of ​​the non-fixed unit.

15. The substrate heating device according to claim 14, characterized in that, The central area and the peripheral area are heated in separate zones. The central area includes a first central area and a second central area surrounding the first central area. The peripheral area includes a first peripheral area and a second peripheral area surrounding the first peripheral area. The contact area of ​​the fixed unit is located in the first peripheral area and the second peripheral area. The set temperatures of the first central area, the second central area, the first peripheral area and the second peripheral area increase sequentially.

16. The substrate heating apparatus according to claim 15, characterized in that, The heating plate includes a heating plate housing and a heating plate heater. The heating plate heater is provided in the first central area, the second central area, the first peripheral area and the second peripheral area respectively. The heating plate heater is located inside the heating plate housing or on the lower surface of the heating plate housing.

17. The substrate heating apparatus according to claim 16, characterized in that, The heating plate heater is a resistance heater.

18. A semiconductor machine, characterized in that, Includes the substrate heating device as described in any one of claims 1 to 17.

19. The semiconductor machine according to claim 18, characterized in that, The semiconductor equipment is a laser annealing device or a bonding device.

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