Microchannel heat sink device

Abstract

The present invention discloses a microchannel heat sink device, comprising a first side cover, a water return cover body, a guide cover body, a water inlet cover body and a second side cover, wherein the first side cover is provided with a water inlet hole; the water return cover body is provided with a water outlet channel; the guide cover body is arranged at a side of the water return cover body away from the first side cover, and the guide cover body is provided with a guide channel connected with the water outlet channel; the water inlet cover body is provided with a slow flow area, the slow flow area includes a water inlet channel, the water inlet hole is connected with the slow flow area through the water return cover body and the guide cover body, the water inlet channel is connected with the guide channel, and the side walls of the water inlet channel and the water outlet channel are both provided with convex ribs and grooves arranged at intervals; the guide cover body and the second side cover are respectively arranged on both sides of the water inlet cover body, and the second side cover is provided with a water outlet hole connected with the water outlet channel. According to the microchannel heat sink device of the present invention, the heat exchange efficiency can be improved, thereby greatly improving the overall heat dissipation capacity of the microchannel heat sink device, and at the same time it is beneficial to reduce the phenomenon of local temperature unevenness.

Description

Technical Field

[0001] The present invention relates to the technical field of heat sinks, and in particular to a microchannel heat sink device. Background Art

[0002] High-power semiconductor lasers have been widely used in various industries due to their advantages such as light weight, small size, and high electro-optical conversion rate. During the operation of semiconductor lasers, about 60% of the energy of the laser diode is effectively utilized, and the unused energy is converted into heat energy, which causes the temperature of the laser diode to rise sharply, resulting in an increase in the threshold current of the laser chip, affecting the stability of the operation of the semiconductor laser. The microchannel heat sink device is a key device for solving the high temperature rise of high-power semiconductor lasers due to its compact structure, small unit volume, and light weight. However, the microchannel heat sink device in the existing technology has uneven local temperature, low heat exchange efficiency, and poor overall heat dissipation capacity. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a microchannel heat sink device that can improve the heat exchange efficiency, thereby greatly improving the overall heat dissipation capacity of the microchannel heat sink device, and at the same time is conducive to reducing the phenomenon of local temperature unevenness.

[0004] An embodiment of the present invention provides a microchannel heat sink device, comprising a first side cover, a return water cover body, a guide cover body, a water inlet cover body and a second side cover, wherein the first side cover is provided with a water inlet hole, and one side of the first side cover is used to connect a semiconductor laser rake bar; the return water cover body is arranged on the other side of the first side cover, and the return water cover body is provided with a water outlet channel; the guide cover body is arranged on the side of the return water cover body away from the first side cover, and the guide cover body is provided with a guide channel connected with the water outlet channel; the water inlet cover body is provided with a slow flow area, and the slow flow area includes a water inlet channel, the water inlet hole is connected with the slow flow area through the return water cover body and the guide cover body, the water inlet channel is connected with the guide channel, and the side walls of the water inlet channel and the water outlet channel are both provided with convex ribs and grooves arranged at intervals; the guide cover body and the second side cover are respectively arranged on both sides of the water inlet cover body, and the second side cover is provided with a water outlet hole connected with the water outlet channel.

[0005] The microchannel heat sink device provided by the present invention has at least the following beneficial effects: the cooling medium enters the microchannel heat sink device from the water inlet hole arranged on the first side cover, the water inlet hole is connected to the return water cover body, the guide cover body and the water inlet cover body, and the cooling medium flows through the return water cover body and the guide cover body and then enters the slow flow area of ​​the water inlet cover body to slow down, which can effectively slow down the flow rate of the cooling medium, which is conducive to the full development of the cooling medium. After entering the water inlet channel, the cooling medium flows into the water outlet channel through the guide channel, that is, flows through the guide cover body and the return water cover body again, which can increase the path of the cooling medium flowing through the microchannel heat sink device, which is conducive to To achieve a better heat dissipation effect, the cooling medium then flows out from the water outlet channel, flows through the guide cover body and the water inlet cover body to the water outlet hole set on the second side cover, and finally flows out from the water outlet hole to achieve the effect of circulating refrigeration. Since the water inlet channel and the water outlet channel are the main fluid areas, by setting a combined microstructure of ribs and grooves, the cooling medium can produce strong fluid disturbance and internal vortex phenomena, and at the same time increase the heat dissipation area of ​​the water inlet channel and the water outlet channel, which can improve the heat exchange efficiency, thereby greatly improving the overall heat dissipation capacity of the microchannel heat sink device, and at the same time helping to reduce the phenomenon of local temperature unevenness.

[0006] According to some embodiments of the present invention, the cross-section of the convex rib is a right-angled trapezoid.

[0007] According to some embodiments of the present invention, the side walls on opposite sides of the water inlet channel are provided with the convex ribs, wherein the inclined surface of the convex ribs on the side wall on one side is parallel to the inclined surface of the convex ribs on the side wall on the other side.

[0008] According to some embodiments of the present invention, the side walls on opposite sides of the water outlet channel are provided with the convex ribs, wherein the inclined surface of the convex ribs on the side wall on one side is parallel to the inclined surface of the convex ribs on the side wall on the other side.

[0009] According to some embodiments of the present invention, the groove includes an arc structure and a slope structure connected to each other.

[0010] According to some embodiments of the present invention, the return water cover body is also provided with a first water inlet connection hole corresponding to the water inlet hole, the guide cover body is also provided with a second water inlet connection hole corresponding to the first water inlet connection hole, and the slow flow area also includes a slow flow groove corresponding to the second water inlet connection hole, and the slow flow groove respectively connects the second water inlet connection hole and the water inlet channel.

[0011] According to some embodiments of the present invention, the return water cover body is also provided with a first water outlet guide channel connected to the water outlet channel, the guide cover body is also provided with a second water outlet guide channel corresponding to the first water outlet guide channel, the water inlet cover body is also provided with a third water outlet guide channel corresponding to the second water outlet guide channel, and the water outlet hole connects the first water outlet guide channel, the second water outlet guide channel and the third water outlet guide channel.

[0012] According to some embodiments of the present invention, the guide cover body is also provided with a first water outlet intersection hole connected to the second water outlet guide channel, and the water inlet cover body is also provided with a second water outlet intersection hole connected to the third water outlet guide channel, and the water outlet holes connect the first water outlet intersection hole and the second water outlet intersection hole.

[0013] According to some embodiments of the present invention, the water inlet cover body is further provided with a plurality of first diversion ridges, and the water inlet channel is formed between two adjacent first diversion ridges; the water return cover body is further provided with a plurality of second diversion ridges, and the water outlet channel is formed between two adjacent second diversion ridges.

[0014] According to some embodiments of the present invention, the first side cover, the water return cover body, the guide cover body, the water inlet cover body and the second side cover are all 3D-printed copper-chromium-zirconium alloy parts.

[0015] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Additional aspects and advantages of the present invention will become apparent and readily understood from the following description of embodiments in conjunction with the accompanying drawings, in which:

[0017] Figure 1 It is an exploded schematic diagram of a microchannel heat sink device according to an embodiment of the present invention;

[0018] Figure 2 It is a schematic structural diagram of a water return cover body according to some embodiments of the present invention;

[0019] Figure 3 It is a schematic structural diagram of a guide cover body in some embodiments of the present invention;

[0020] Figure 4 It is a schematic structural diagram of a water inlet cover body according to some embodiments of the present invention;

[0021] Figure 5 for Figure 4 A magnified image of point A;

[0022] Figure 6 It is a schematic structural diagram of a first side cover in some embodiments of the present invention;

[0023] Figure 7 A top view of a water inlet cover body according to some embodiments of the present invention;

[0024] Figure 8 for Figure 7 Enlarged view of point B. DETAILED DESCRIPTION

[0025] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0026] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0027] In the description of the present invention, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood as not including the number itself, and "above", "below", "within" etc. are understood as including the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0028] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0029] like Figures 1 to 5As shown, the embodiment of the present invention provides a microchannel heat sink device 100, including a first side cover 200, a return water cover body 300, a guide cover body 400, a water inlet cover body 500 and a second side cover 600, wherein the first side cover 200 is provided with a water inlet hole 210, and one side of the first side cover 200 is used to connect the semiconductor laser rake bar 220; the return water cover body 300 is arranged on the other side of the first side cover 200, and the return water cover body 300 is provided with a water outlet channel 310; the guide cover body 400 is arranged on the side of the return water cover body 300 away from the first side cover 200, and the guide cover body 400 is provided with a water outlet channel 310; 0; the water inlet cover body 500 is provided with a slow flow area 510, the slow flow area 510 includes a water inlet channel 511, the water inlet hole 210 is connected to the slow flow area 510 through the return water cover body 300 and the guide cover body 400, the water inlet channel 511 is connected to the guide channel 410, and the side walls of the water inlet channel 511 and the water outlet channel 310 are provided with spaced ribs 700 and grooves 800; the guide cover body 400 and the second side cover 600 are respectively arranged on both sides of the water inlet cover body 500, and the second side cover 600 is provided with a water outlet hole 610 connected to the water outlet channel 310.

[0030] like Figure 6 As shown, it should be noted that the microchannel heat sink device 100 of this embodiment can dissipate heat for the semiconductor laser rake bars 220 . When the semiconductor laser rake bars 220 are disposed on the outer side of the first side cover 200 , the water inlet holes 210 are arranged close to the semiconductor laser rake bars 220 .

[0031] According to the microchannel heat sink device 100 provided by the present invention, it includes a first side cover 200, a return water cover body 300, a guide cover body 400, a water inlet cover body 500 and a second side cover 600 which are arranged in sequence. The cooling medium enters the microchannel heat sink device 100 from the water inlet hole 210 arranged on the first side cover 200. The water inlet hole 210 connects the return water cover body 300, the guide cover body 400 and the water inlet cover body 500. After the cooling medium flows through the return water cover body 300 and the guide cover body 400, it enters the slow flow area 510 of the water inlet cover body 500 and slows down, which can effectively slow down the flow rate of the cooling medium and is conducive to the full development of the cooling medium. After the cooling medium enters the water inlet channel 511, it flows into the water outlet channel 310 through the guide channel 410, that is, it flows through the guide cover body 400 and the return water cover body 300 again, which can increase the cooling medium. The path through which the cooling medium flows in the microchannel heat sink device 100 is conducive to achieving a better heat dissipation effect. The cooling medium then flows out from the water outlet channel 310, passes through the guide cover body 400 and the water inlet cover body 500, and then flows to the water outlet hole 610 set on the second side cover 600, and finally flows out from the water outlet hole 610 to achieve the effect of circulating refrigeration. Since the water inlet channel 511 and the water outlet channel 310 are the main fluid areas, by setting the combined microstructure of the ribs 700 and the grooves 800, the cooling medium can produce strong fluid disturbances and internal vortex phenomena, and at the same time, the heat dissipation area of ​​the water inlet channel 511 and the water outlet channel 310 is increased, which can improve the heat exchange efficiency, thereby greatly improving the overall heat dissipation capacity of the microchannel heat sink device 100, and at the same time it is conducive to reducing the phenomenon of local temperature unevenness.

[0032] like Figure 1 and Figure 5 As shown, it should be noted that the convex rib 700 and the cavity structure cooperate with each other to mainly achieve the interruption and redevelopment of the velocity boundary layer and the thermal boundary layer. The convex rib 700 can change the flow direction of the mainstream, so that the cooling medium can flow through a longer path in the water inlet channel 511 and the water outlet channel 310, and at the same time impact the side wall of the microchannel heat sink device 100, so that the boundary layer becomes thinner, which can greatly reduce the thermal resistance caused by the boundary layer and enhance the heat transfer effect. The groove 800 of this embodiment can be understood as a cavity structure. The existence of the cavity structure increases the heat dissipation area inside the water inlet channel 511 and the water outlet channel 310, so that the overall heat dissipation effect is greatly enhanced. The injection and throttling effects caused by the periodic channel contraction and expansion cause the cooling medium to form a vortex at the groove 800, which enhances the convective heat exchange between the cooling media, so that the cooling media can be fully and evenly mixed, and the problem of local temperature unevenness can be solved. Therefore, the embodiment of the present invention is different from the microchannel heat sink device 100 using a straight channel structure in the prior art. Under the same heat flux density, it has the effects of lower temperature, smaller bottom temperature difference, etc., and the heat dissipation effect is more significant.

[0033] It can be understood that the combined microstructure of the ribs 700 and the cavity structure has a better heat dissipation effect than the single ribs 700 or cavity structure, and has better heat transfer performance.

[0034] like Figure 1 and Figure 4 As shown, in this embodiment, the slow flow area 510 is formed by combining the hollow areas on the water inlet cover body 500 and is an open space.

[0035] like Figure 4 , Figure 5 , Figure 7 and Figure 8 As shown, according to some embodiments of the present invention, the cross-section of the rib 700 is a right-angled trapezoid.

[0036] It should be noted that the cross-section of the convex rib 700 is a right-angled trapezoid, which is different from the structure of a rectangular parallelepiped or a cube. The convex rib 700 of this embodiment is structurally offset. When the cooling medium flows through the convex rib 700, it can change the flow direction and directly impact the contraction area of ​​the grooves 800 arranged at intervals, so that the boundary layer of the grooves 800 becomes thinner, achieving a better fluid mixing effect, making the local temperature of the microchannel heat sink device 100 more uniform, which is beneficial to improving the heat dissipation performance.

[0037] like Figure 5 and Figure 8 As shown, according to some embodiments of the present invention, the side walls on opposite sides of the water inlet channel 511 are provided with ribs 700, wherein the inclined surface of the ribs 700 on one side of the side wall is parallel to the inclined surface of the ribs 700 on the other side of the side wall.

[0038] By making the inclined surfaces of the ribs 700 distributed on the side walls on opposite sides of the water inlet channel 511 parallel, the flow direction of the cooling medium can be guided so that the flow direction of the cooling medium in the water inlet channel 511 remains consistent, which is beneficial to improving the cooling efficiency of the microchannel heat sink device 100.

[0039] like Figure 5 As shown, specifically, in this embodiment, the side walls on opposite sides of the water inlet channel 511 include a first side wall 541 and a second side wall 542, and the cross-section of the rib 700 on the first side wall 541 gradually decreases from the direction of entering the water inlet channel 511 to the edge of the water inlet cover body 500, while the cross-section of the rib 700 on the second side wall 542 gradually increases from the direction of entering the water inlet channel 511 to the edge of the water inlet cover body 500.

[0040] It can be understood that the side walls on the opposite sides of the water inlet channel 511 are provided with grooves 800. By setting the combined microstructure of the ribs 700 and the grooves 800, the cooling medium can be fully mixed. In addition, the combined microstructure of the side walls on the opposite sides of the water inlet channel 511 adopts an asymmetrical arrangement, which can better improve the heat exchange efficiency.

[0041] According to some embodiments of the present invention, ribs 700 are disposed on the side walls on opposite sides of the water outlet channel 310 , wherein the inclined surface of the ribs 700 on one side wall is parallel to the inclined surface of the ribs 700 on the other side wall.

[0042] It should be noted that by making the inclined surfaces of the ribs 700 distributed on the side walls on opposite sides of the water outlet channel 310 parallel, the flow direction of the cooling medium can be guided so that the flow direction of the cooling medium in the water outlet channel 310 remains consistent, which is beneficial to improving the cooling efficiency of the microchannel heat sink device 100.

[0043] It is understandable that the specific arrangement direction of the ribs 700 in this embodiment can refer to Figure 5 Setup directions shown.

[0044] In one embodiment, grooves 800 are provided on the side walls on opposite sides of the water outlet channel 310. By setting a combined microstructure of the ribs 700 and the grooves 800, the cooling medium can be fully mixed. In addition, the combined microstructure of the side walls on opposite sides of the water outlet channel 310 adopts an asymmetrical arrangement, which can better improve the heat exchange efficiency.

[0045] like Figure 5 As shown, according to some embodiments of the present invention, the groove 800 includes an arc structure 810 and a slope structure 820 connected to each other.

[0046] It should be noted that the groove 800 includes an arc structure 810 and a slope structure 820 , which can enable the cooling medium to form a vortex at the groove 800 , which is beneficial to increasing the convection heat exchange area of ​​the fluid in the water inlet channel 511 and the water outlet channel 310 .

[0047] like Figure 8 As shown, it can be understood that the cross-section of the convex rib 700 is fan-shaped.

[0048] like Figures 1 to 4 As shown, according to some embodiments of the present invention, the return water cover body 300 is also provided with a first water inlet intersection hole 320 corresponding to the water inlet hole 210, the guide cover body 400 is also provided with a second water inlet intersection hole 420 corresponding to the first water inlet intersection hole 320, and the slow flow area 510 also includes a slow flow groove 512 corresponding to the second water inlet intersection hole 420, and the slow flow groove 512 respectively connects the second water inlet intersection hole 420 and the water inlet channel 511.

[0049] In this embodiment, the cooling medium enters the microchannel heat sink device 100 from the water inlet hole 210, and then passes through the first water inlet intersection hole 320 and the second water inlet intersection hole 420 in sequence to enter the slow flow groove 512 in the slow flow area 510. By slowing down in the slow flow area 510, flowing from the slow flow groove 512 to the water inlet channel 511, and reaching the full development stage in the water inlet channel 511, and then flowing into the guide channel 410, the path of the cooling medium flowing through the microchannel heat sink device 100 can be increased, which is beneficial to improving the heat dissipation effect of the microchannel heat sink device 100.

[0050] like Figures 1 to 4 As shown, according to some embodiments of the present invention, the return water cover body 300 is also provided with a first water outlet guide channel 330 connected to the water outlet channel 310, the guide cover body 400 is also provided with a second water outlet guide channel 430 corresponding to the first water outlet guide channel 330, the water inlet cover body 500 is also provided with a third water outlet guide channel 520 corresponding to the second water outlet guide channel 430, and the water outlet hole 610 connects the first water outlet guide channel 330, the second water outlet guide channel 430 and the third water outlet guide channel 520.

[0051] In this embodiment, when the cooling medium flows from the guide channel 410 into the water outlet channel 310 and reaches the fully developed stage in the water outlet channel 310, it then flows to the first water outlet guide channel 330, and sequentially flows through the second water outlet guide channel 430 and the third water outlet guide channel 520, that is, flows through the guide cover body 400 and the water inlet cover body 500, and then flows to the water outlet hole 610 of the second side cover 600, and finally flows out from the water outlet hole 610, thereby realizing the uniform circulation flow of the cooling medium in the microchannel heat sink device 100, which is beneficial to improving the heat dissipation effect of the microchannel heat sink device 100.

[0052] like Figures 1 to 4 As shown, according to some embodiments of the present invention, the guide cover body 400 is also provided with a first water outlet intersection hole 440 connected to the second water outlet guide channel 430, the water inlet cover body 500 is also provided with a second water outlet intersection hole 530 connected to the third water outlet guide channel 520, and the water outlet hole 610 connects the first water outlet intersection hole 440 and the second water outlet intersection hole 530.

[0053] In this embodiment, when the cooling medium flows from the guide channel 410 into the water outlet channel 310 and then flows to the first water outlet guide channel 330 and the second water outlet guide channel 430, the cooling medium can also enter the first water outlet intersection hole 440 and the second water outlet intersection hole 530 in sequence. By setting the first water outlet intersection hole 440 and the second water outlet intersection hole 530, the pressure of the second water outlet guide channel 430 and the third water outlet guide channel 520 can be reduced, and the water outlet area can be increased.

[0054] like Figure 2 and Figure 4As shown, according to some embodiments of the present invention, the water inlet cover body 500 is further provided with a plurality of first diversion ridges 540 , and a water inlet channel 511 is formed between two adjacent first diversion ridges 540 ; the water return cover body 300 is further provided with a plurality of second diversion ridges 340 , and a water outlet channel 310 is formed between two adjacent second diversion ridges 340 .

[0055] It should be noted that by setting a first diverter ridge 540 on the water inlet cover body 500, the water inlet channel 511 can be separated by the first diverter ridge 540. It can be understood that the water inlet cover body 500 is provided with multiple water inlet channels 511, and by setting a second diverter ridge 340 on the water outlet cover body, the water outlet channel 310 can be separated by the second diverter ridge 340. The return water cover body 300 is provided with multiple water outlet channels 310, wherein the convex ribs 700 and the grooves 800 are provided on the side walls of the first diverter ridge 540 and the second diverter ridge 340.

[0056] like Figure 2 As shown, in one embodiment, the second diverter ridge 340 is bent at a preset angle, and the second diverter ridge 340 is bent toward the side wall of the return water cover body 300, which is beneficial to the return of the cooling medium.

[0057] like Figures 1 to 4 As shown, specifically, the water inlet cover 500 is provided with ten water inlet channels 511, the water return cover 300 is provided with ten water outlet channels 310, the guide channel 410 includes ten guide holes 411, and each guide hole 411 is respectively connected to the corresponding water inlet channel 511 and the water outlet channel 310, which is conducive to achieving the effect of uniform heat dissipation.

[0058] According to some embodiments of the present invention, the first side cover 200, the water return cover body 300, the guide cover body 400, the water inlet cover body 500 and the second side cover 600 are all 3D-printed copper-chromium-zirconium alloy parts.

[0059] The first side cover 200, the return water cover body 300, the guide cover body 400, the water inlet cover body 500 and the second side cover 600 are manufactured by 3D printing, which can avoid the introduction of additional thermal stress and contact thermal resistance between the layers of the cover bodies due to welding. Since the copper-chromium-zirconium alloy has good thermal conductivity, by using the copper-chromium-zirconium alloy material for 3D printing, the inner wall of the microchannel heat sink device 100 does not need to be gold-plated, which avoids the problem of heat sink blockage caused by the shedding of the gold-plated material, which is beneficial to improving the heat exchange efficiency.

[0060] like Figure 1 As shown, in one embodiment, corresponding positioning holes 910 and screw holes 920 are provided in the first side cover 200, the return water cover body 300, the guide cover body 400, the water inlet cover body 500 and the second side cover 600, and the positioning holes 910 and the screw holes 920 are used to fix the entire microchannel heat sink device 100.

[0061] The microchannel heat sink device 100 of the embodiment of the present invention is provided with a combined microstructure of ribs 700 and grooves 800 in the water inlet channel 511 and the water outlet channel 310. The boundary layer is periodically destroyed by the ribs 700 and the grooves 800, so that the velocity boundary layer and the thermal boundary layer are interrupted and redeveloped, thereby making the temperature distribution in the water inlet channel 511 and the water outlet channel 310 more uniform. That is, the presence of the ribs 700 and the grooves 800 can play a significant role in enhancing heat transfer in the microchannel, thereby ensuring good heat dissipation performance of the microchannel heat sink device 100.

[0062] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A microchannel heat sink device, characterized in that: include: A first side cover, wherein the first side cover is provided with a water inlet hole, and one side of the first side cover is used for connecting a semiconductor laser rake bar; A water return cover body, the water return cover body is arranged on the other side of the first side cover, and the water return cover body is provided with a water outlet channel; A guide cover body, the guide cover body is arranged on a side of the water return cover body away from the first side cover, and the guide cover body is provided with a guide channel communicating with the water outlet channel; A water inlet cover body, wherein the water inlet cover body is provided with a slow flow area, the slow flow area includes a water inlet channel, the water inlet hole is connected to the slow flow area through the water return cover body and the guide cover body, the water inlet channel is connected to the guide channel, and the side walls of the water inlet channel and the water outlet channel are both provided with ribs and grooves arranged at intervals, the cross section of the ribs is a right-angled trapezoid, wherein in the water inlet channel, the inclined surface of the ribs on the side wall of one of the two opposite sides is parallel to the inclined surface of the ribs on the side wall of the other side; The second side cover, the guide cover body and the second side cover are respectively arranged on both sides of the water inlet cover body, and the second side cover is provided with a water outlet hole connected with the water outlet channel.

2. The microchannel heat sink device according to claim 1, characterized in that: The side walls on the opposite sides of the water outlet channel are both provided with the convex ribs, wherein the inclined surface of the convex rib on the side wall on one side is parallel to the inclined surface of the convex rib on the side wall on the other side.

3. The microchannel heat sink device according to claim 1, characterized in that: The groove includes an arc structure and a slope structure connected to each other.

4. The microchannel heat sink device according to claim 1, characterized in that: The return water cover body is also provided with a first water inlet intersection hole corresponding to the water inlet hole, and the guide cover body is also provided with a second water inlet intersection hole corresponding to the first water inlet intersection hole, and the slow flow area also includes a slow flow groove corresponding to the second water inlet intersection hole, and the slow flow groove respectively connects the second water inlet intersection hole and the water inlet channel.

5. The microchannel heat sink device according to claim 1, characterized in that: The return water cover body is also provided with a first water outlet guide channel connected to the water outlet channel, the guide cover body is also provided with a second water outlet guide channel corresponding to the first water outlet guide channel, the water inlet cover body is also provided with a third water outlet guide channel corresponding to the second water outlet guide channel, and the water outlet hole connects the first water outlet guide channel, the second water outlet guide channel and the third water outlet guide channel.

6. The microchannel heat sink device according to claim 5, characterized in that: The guide cover body is also provided with a first water outlet intersection hole connected to the second water outlet guide channel, and the water inlet cover body is also provided with a second water outlet intersection hole connected to the third water outlet guide channel, and the water outlet holes connect the first water outlet intersection hole and the second water outlet intersection hole.

7. The microchannel heat sink device according to claim 1, characterized in that: The water inlet cover body is also provided with a plurality of first diversion ridges, and the water inlet channel is formed between two adjacent first diversion ridges. The water return cover body is also provided with a plurality of second diversion ridges, and the water outlet channel is formed between two adjacent second diversion ridges.

8. The microchannel heat sink device according to claim 1, characterized in that: The first side cover, the water return cover body, the guide cover body, the water inlet cover body and the second side cover are all 3D-printed copper-chromium-zirconium alloy parts.

Images