Replaceable stacked beacon solid state power amplifier device

Abstract

The application provides a replaceable stacked beacon solid-state power amplifier device, which comprises a primary power module, a secondary power module and a microwave power amplifier module, the three modules are connected through an adapter socket and are stacked and assembled, the primary power module comprises an EMI filter circuit, a DC / DC conversion circuit and a relay control circuit, which are used for converting a bus voltage into gate and drain voltages required by a power amplifier tube, the secondary power module comprises a negative voltage protection circuit, a surge suppression circuit, a voltage distribution circuit, a telemetry acquisition circuit and an automatic gain control circuit, wherein the voltage converted by the primary power module is provided to each component in the microwave power amplifier module through the voltage distribution circuit, the device disclosed by the application divides the function of the beacon solid-state power amplifier into general independent modules, and has the characteristics of strong replaceability and strong universality.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of solid-state power amplifier, especially to the field of spaceborne beacon solid-state power amplifier. BACKGROUND

[0002] With the development of aviation, aerospace and navigation technology, the technology and batch production of beacon device also face higher and higher requirements. As an important part of the beacon link, the rapid development capability of the beacon solid-state power amplifier is crucial.

[0003] The current beacon solid-state power amplifier is often designed and researched following the technical indicators of beacon signal, and the repeated design and slow development progress restrict the rapid supply capability of the beacon device. From design to production delivery, a beacon solid-state power amplifier often takes one year or even longer to complete. Therefore, designing a general-purpose device that can meet the requirements of most beacon solid-state power amplifiers can greatly shorten the product development cycle and reduce production and operation costs. SUMMARY

[0004] In view of the defects in the prior art, the purpose of the present application is to provide a replaceable stacked beacon solid-state power amplifier device, which comprises a primary power module, a secondary power module and a microwave power amplifier module, the three modules are connected through an adapter socket and are stacked and assembled.

[0005] The primary power module comprises an EMI filter circuit, a DC / DC conversion circuit and a relay control circuit, which is used to convert the bus voltage into the gate and drain voltage required by the power amplifier tube.

[0006] The secondary power module comprises a negative voltage protection circuit, a surge suppression circuit, a voltage distribution circuit, a telemetry acquisition circuit and an automatic gain control circuit.

[0007] The secondary power module converts the voltage output by the primary power module through the voltage distribution circuit and provides it to each component in the microwave power amplifier module.

[0008] In one possible implementation, the microwave power amplifier module comprises a microwave power amplifier 1 and a microwave power amplifier 2, and the two components are functionally identical and backup each other, or functionally different and provide multiple channels.

[0009] In one possible implementation, the EMI filter circuit comprises a first EMI filter and a second EMI filter, which are independently used for two microwave power amplifier components.

[0010] In one possible implementation, the DC / DC circuit comprises a first to third DC / DC module, the first and second DC / DC modules are independently used for two microwave power amplifier components, and the third DC / DC module provides a common gate voltage.

[0011] In a possible implementation, the relay circuit comprises a first relay and a second relay, independently controlling the switches of the two microwave power amplifier assemblies.

[0012] In a possible implementation, the primary power amplifier module and the secondary power module meet the basic requirements of the beacon solid-state power amplifier.

[0013] In a possible implementation, the microwave power amplifier 1 and the microwave power amplifier 2 of the microwave power amplifier module are replaceable assemblies.

[0014] In a possible implementation, the device further comprises first and second fuses, respectively connected to the bus voltage and the EMI filter, for preventing excessive current when the circuit is short-circuited by breaking the fuses to protect the internal components.

[0015] In a possible implementation, the microwave power amplifier assembly further comprises first to third isolators, an ALC module, a microstrip coupler, and a detection circuit.

[0016] Compared with the prior art, the present application at least includes the following beneficial effects:

[0017] 1. The replaceable stacked beacon solid-state power amplifier device provided by the present application divides the functions of the beacon solid-state power amplifier into general independent modules, and is assembled by stacking three modules, having the characteristics of strong replaceability and strong universality.

[0018] 2. The replaceable stacked beacon solid-state power amplifier device provided by the present application can realize the general application of satellite-borne S / C / X / Ku band beacon solid-state power amplifiers, and is suitable for the fields of aviation, aerospace, and navigation. BRIEF DESCRIPTION OF DRAWINGS

[0019] Other features, objects, and advantages of the present application will become more apparent from the following detailed description of non-limiting embodiments, made with reference to the following drawings:

[0020] Figure 1 The composition diagram of the replaceable stacked beacon solid-state power amplifier device of the present application;

[0021] Figure 2 The schematic diagram of an example of the replaceable stacked beacon solid-state power amplifier device of the present application;

[0022] Figure 3 The three-dimensional model diagram of an example of the replaceable stacked beacon solid-state power amplifier device of the present application. DETAILED DESCRIPTION

[0023] The application will be described in detail below with specific examples. The following examples will help those skilled in the art to further understand the application, but do not limit the application in any form. It should be noted that those skilled in the art can make several changes and improvements without departing from the concept of the application. These are within the scope of the application.

[0024] The application provides a replaceable stacked beacon solid-state power amplifier device, comprising a primary power module, a secondary power module and a microwave power amplifier module, the three modules are connected through an adapter socket and stacked. The primary power module comprises an EMI filter circuit, a DC / DC conversion circuit and a relay control circuit, which is used to convert the bus voltage into the gate and drain voltage required by the power amplifier tube.

[0025] In one example embodiment, as shown in Figure 1 The application provides a replaceable stacked beacon solid-state power amplifier device, comprising a primary power module, a secondary power module and a microwave power amplifier module.

[0026] The beacon solid-state power amplifier provided in the embodiment is a solid-state power amplifier device composed of three functional modules. The primary power module comprises an EMI filter circuit, a DC / DC conversion circuit and a relay control circuit. The function of this module is to convert the bus voltage into the gate and drain voltage required by the power amplifier tube, while having remote control, anti-electromagnetic interference and other functions. The secondary power module comprises a negative voltage protection circuit, a surge suppression circuit, a voltage distribution circuit, a telemetry acquisition circuit and an automatic gain control circuit. The function of this module is to convert the voltage output by the primary power module through the voltage distribution circuit and provide it to each chip in the microwave power amplifier assembly. At the same time, the secondary power module also has a negative voltage protection current, which makes the gate voltage loaded on the chip prior to the drain voltage, protecting the chip from being burned out; a surge suppression current, preventing excessive current during startup from causing the whole device to start up and be protected; a telemetry acquisition circuit, providing the solid-state power amplifier with a power telemetry voltage; and an automatic gain control current, providing the solid-state power amplifier with real-time dynamic closed loop to ensure the relative stability of the output power. The microwave power amplifier module comprises microwave power amplifier 1 and microwave power amplifier 2, the two components can be functionally the same and back up each other, or can be functionally different to provide multiple channels. The microwave power amplifier assembly is composed of multiple amplification chips, and the function is to amplify and output the microwave power.

[0027] Further, as shown in Figure 2 the replaceable stacked beacon solid-state power amplifier device provided by the present application, the EMI filter circuit includes a first EMI filter and a second EMI filter, and works independently for the two microwave power amplifier components. The DC / DC circuit includes a first to third DC / DC module, the first and second DC / DC modules work independently for the two microwave power amplifier components, and the third DC / DC module provides a common gate voltage. The relay circuit includes a first relay and a second relay, and independently controls the switches of the two microwave power amplifier components.

[0028] Further, as shown in Figure 2 the replaceable stacked beacon solid-state power amplifier device provided by the present application, the replaceable stacked beacon solid-state power amplifier device further includes: a first and a second fuse, connected to the bus voltage and the EMI filter, which functions to prevent short circuit of the circuit, and to protect the internal devices by breaking the fuses when the current is too large.

[0029] Further, the microwave power amplifier component further includes a first to third isolator, an ALC module, a microstrip coupler and a detection circuit.

[0030] As understood by those skilled in the art, the first to third isolators are connected to the front stage, middle stage and end stage of the microwave link, for improving microwave matching, preventing reflection power from causing link mismatch and self-excitation. The ALC module is used for automatic gain control, and dynamically adjusts the attenuation value according to the detection voltage, so as to stabilize the output power. The microstrip coupler is used for coupling the microwave power on the link to the detection circuit. The detection circuit is connected to the microstrip coupler, and is used for converting the coupled-out microwave signal into a direct current voltage.

[0031] Further, the primary power amplifier module and the secondary power module can meet the basic requirements of the beacon solid-state power amplifier.

[0032] Further, the microwave power amplifier 1 and the microwave power amplifier 2 of the microwave power amplifier module are replaceable components, and can be plugged and replaced according to other requirements, so as to meet different functions. In the embodiment, the microwave power amplifier 1 and the microwave power amplifier 2 are the same components, and are backup for each other.

[0033] Further, the bus voltage is +30V.

[0034] Further, the replaceable stacked beacon solid-state power amplifier device can be widely used in beacon solid-state power amplifiers of S / C / X / Ku and other frequency bands. In the embodiment, the replaceable stacked beacon solid-state power amplifier device is applied to Ku frequency band.

[0035] The specific embodiments of the present application are described above. It needs to be understood that the present application is not limited to the specific embodiments described above, and various changes or modifications can be made by those skilled in the art within the scope of the claims, which does not affect the essential content of the present application. The embodiments of the present application and the features in the embodiments can be combined with each other at will without conflict.

Claims

1. A replaceable stacked beacon solid state power amplifier device, characterized by, It comprises: A primary power module, a secondary power module and a microwave power amplifier module, the three modules are connected through an adapter socket and stacked together; The primary power module comprises an EMI filter circuit, a DC / DC conversion circuit and a relay control circuit, which is used to convert the bus voltage into the gate and drain voltage required by the power amplifier tube; The secondary power module comprises a negative voltage protection circuit, a surge suppression circuit, a voltage distribution circuit, a telemetry acquisition circuit and an automatic gain control circuit; The secondary power module converts the voltage output by the primary power module through the voltage distribution circuit and provides it to each component in the microwave power amplifier module respectively; The microwave power amplifier module comprises microwave power amplifier 1 and microwave power amplifier 2, the two components are functionally the same and backup each other, or functionally different to provide multiple channels; The EMI filter circuit comprises a first EMI filter and a second EMI filter, which works independently for two microwave power amplifier components; The DC / DC circuit comprises first to third DC / DC modules, the first and second DC / DC modules work independently for two microwave power amplifier components, and the third DC / DC module provides a common gate voltage; The microwave power amplifier component further comprises first to third isolators, an ALC module, a microstrip coupler and a detection circuit.

2. The replaceable stacked beacon solid state power amplifier device of claim 1, wherein, The relay circuit comprises a first relay and a second relay, which independently controls the switch of two microwave power amplifier components.

3. The replaceable stacked beacon solid state power amplifier device of claim 1, wherein, The functions of the primary power amplifier module and the secondary power module meet the basic requirements of the beacon solid-state power amplifier.

4. The replaceable stacked beacon solid state power amplifier device of claim 1, wherein, The microwave power amplifier 1 and the microwave power amplifier 2 of the microwave power amplifier module are replaceable components.

5. The replaceable stacked beacon solid state power amplifier device of claim 1, wherein, The device further comprises first and second fuses, which are respectively connected to the bus voltage and the EMI filter, used to prevent the circuit from being short-circuited and to protect the internal devices by breaking the fuses when the current is too large.

Images