Electronic industry waste gas treatment device

Abstract

The present invention relates to an electronic industry waste gas treatment device. The electronic industry waste gas treatment device according to an embodiment of the present invention comprises: a reaction chamber formed with an inlet and an outlet, and formed with an internal space for purifying waste gas; a first partition plate extending from an inner wall of the reaction chamber opposite to the inlet toward the inlet direction, dividing the internal space into a pretreatment area for capturing dust in the waste gas and a remaining purification area; a second partition plate extending from a ceiling of the reaction chamber toward vertically downward, dividing the purification area into a pyrolysis area for heating the waste gas for pyrolysis and a post-treatment area; a heater provided at the ceiling of the reaction chamber to be located in the pyrolysis area, heating the waste gas flowing into the pyrolysis area to pyrolyze perfluorinated compounds; and a dry scrubber unit containing one or more catalysts to facilitate capturing at least one of dust, fluorinated compounds, nitrous oxide (N2O) in the waste gas flowing into the post-treatment area.

Description

TECHNICAL FIELD

[0001] The present invention relates to an electronic industry waste gas treatment device, and more particularly, to an electronic industry waste gas treatment device that purifies and discharges a pollutant contained in waste gas generated in an electronic industry field of manufacturing displays, semiconductors, etc. BACKGROUND

[0002] Generally, the electronic industry field of manufacturing LEDs, LCDs, etc. repeatedly performs various processes such as diffusion, etching, evaporation, etc. on a substrate, and such a process supplies a process gas to the inside of a mostly closed process chamber so as to react on a wafer, and various types of process gases are used according to different processes.

[0003] At this time, a process gas having strong characteristics such as toxicity, flammability, corrosiveness, etc. is mainly used, and only a part of the used process gas participates in the reaction, and the remaining process gas is discharged in an unreacted state.

[0004] The process gas discharged in the unreacted state, due to its characteristics, if not discharged into the air after a special purification process, not only causes damage to peripheral equipment and safety accidents of operators, but also causes serious environmental pollution, and thus various purification devices such as a pyrolysis reactor, a catalyst reactor, a scrubber, etc. are provided on a discharge line to purify and discharge the waste gas generated in the electronic industry.

[0005] Among the above-described purification devices, the scrubber can be classified into a dry type, a wet type, or a mixed type, and the wet type scrubber washes and cools the waste gas with water, has a relatively simple structure, is easy to manufacture, is easy to implement a large capacity, and is also advantageous in treating water-soluble perfluorocompounds, and thus is mainly used to purify the waste gas containing a large amount of perfluorocompounds generated in the electronic industry.

[0006] However, recently, the demand for a dry type waste gas treatment technology in the electronic industry such as semiconductors, etc. gradually increases due to problems in securing a sufficient amount of water for purification treatment, etc.

[0007] Also, when a POU (Point of Use) scrubber, etc. is provided on a production line (INSIDE OF FABRICATION LINE; FAB), the demand for a waste gas treatment device equipped with various treatment devices such as a pyrolysis reactor, a catalyst reactor, a scrubber, etc. in a single type gradually increases in order to miniaturize the waste gas treatment device while simultaneously treating various pollutants.

[0008] The contents described in the above background technology are only for further understanding the background of the present invention, and should not be considered as being equivalent to the conventional technology known to those skilled in the art.

[0009] PRIOR ART DOCUMENT

[0010] [Patent Document]

[0011] KR 10-1720086 B1 (2017.03.21.) SUMMARY

[0012] To solve the above-mentioned drawbacks, the present application provides an electronic industry waste gas treatment device which integrates a pyrolysis reactor, a catalyst reactor, a scrubber, etc. in one body to minimize the volume.

[0013] Also, the present application provides an electronic industry waste gas treatment device which can dry-clean pollutants in electronic industry waste gas and discharge them.

[0014] Also, the present application provides an electronic industry waste gas treatment device which can simultaneously treat perfluorinated compounds, dust, and nitrogen oxides (NO x ) in electronic industry waste gas.

[0015] The technical problem to be solved by the present application is not limited to the above-mentioned technical problem, and another technical problem not mentioned can be clearly understood by those skilled in the art from the description of the present application.

[0016] The electronic industry waste gas treatment device according to an embodiment of the present application includes a reaction chamber which is formed with an inlet and a discharge port, and forms an internal space for cleaning waste gas; a first partition plate which extends from an inner wall of the reaction chamber opposite to the inlet toward the inlet direction, and divides the internal space into a pre-treatment area for capturing dust in waste gas and a remaining cleaning area; a second partition plate which extends from a ceiling of the reaction chamber toward the vertically lower side, and divides the cleaning area into a pyrolysis area for heating waste gas to perform pyrolysis and a post-treatment area; a heater which is provided at the ceiling of the reaction chamber to be located in the pyrolysis area, and heats waste gas flowing into the pyrolysis area to pyrolyze fluorinated compounds; and a dry scrubber unit which contains one or more catalysts to facilitate capturing at least one of dust, fluorinated compounds, and nitrous oxide (N2O) in waste gas flowing into the post-treatment area.

[0017] The first partition plate is inclined upward from the inner wall of the reaction chamber toward the inlet direction, and preferably, a plurality of first capturing protrusions are formed on the plane and the bottom surface in the longitudinal and transverse directions.

[0018] In the present application, the first partition plate can further include a dust discharge door adjacent to the reaction chamber, which discharges dust captured on the plane to the pre-treatment area.

[0019] More preferably, the electronic industrial waste gas treatment device of an embodiment of the present invention may further include: a third partition plate extending upward from the end of the first partition plate to prevent dust from flowing into the pyrolysis zone and from causing heat loss.

[0020] Preferably, in one embodiment of the present invention, the inlet is inclined downwards to facilitate the delivery of exhaust gas to the bottom of the internal space.

[0021] The reaction chamber may further include a plurality of second trapping protrusions spaced longitudinally and laterally, the second trapping protrusions being quadrangular pyramidal in shape, with their cross-sectional areas increasing from one side of the reaction chamber where the inlet is formed to the other side, in order to prevent backflow of dust accumulated at the bottom of the internal space.

[0022] The dry scrubbing tower unit may include: a first catalyst section, which adsorbs and treats fluorine compounds in the waste gas heated by the heater; and a heat exchange section, which is disposed at the rear end of the first catalyst section along the flow direction of the waste gas to recover the waste heat of the waste gas heated by the heater.

[0023] More preferably, the dry scrubbing tower unit may further include: a second catalyst section disposed between the first catalyst section and the heat exchange section, which directly decomposes and removes nitrous oxide (N2O) in the exhaust gas heated by the heater.

[0024] Furthermore, the dry scrubbing tower unit may also include a third catalyst section, which is located at the front end of the heat exchange section to adsorb and remove dust from the exhaust gas.

[0025] The embodiments of the present invention complete the functions of dust collection, pyrolysis, and scrubbing tower in a single reaction chamber to simultaneously treat multiple pollutants contained in electronic industrial waste gas, such as dust, perfluorinated compounds, and nitrous oxide, thereby minimizing its volume and reducing setup constraints.

[0026] Furthermore, dry purification of pollutants does not require additional engineering water, minimizing setup constraints and preventing the generation of secondary pollutants such as wastewater, thereby improving treatment efficiency and reducing treatment costs. Attached Figure Description

[0027] Figure 1 This is a side cross-sectional view of an electronic industrial waste gas treatment device according to an embodiment of the present invention.

[0028] Figure 2 This is a perspective view showing the shape and configuration of the capture protrusion according to an embodiment of the present invention.

[0029] Explanation of reference numerals in the attached figures

[0030] 100: Reaction chamber; 101: Inlet; 102: Outlet

[0031] 110: Internal space; 111: Pre-treatment area; 112: Cleanup area

[0032] 112a: Pyrolysis zone; 112b: Post-processing zone; 120: Second capture protrusion

[0033] 200: First partition plate; 210: First capture protrusion; 220: Dust removal door.

[0034] 300: Second partition plate; 400: Heater; 500: Dry scrubbing tower unit

[0035] 510: First catalyst section; 520: Heat exchange section; 530: Second catalyst section

[0036] 540: Third catalyst section; 600: Third partition plate Detailed Implementation

[0037] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to or restricted by these embodiments. For reference only, the same reference numerals in this specification actually refer to the same elements. Under this rule, descriptions may be based on content shown in other drawings, and content that is obvious or repetitive to those skilled in the art may be omitted.

[0038] This invention relates to an electronic industry waste gas treatment device, which integrates a vacuum cleaner, a pyrolysis reactor, a catalyst reactor, and a scrubbing tower, simultaneously treating multiple harmful substances while minimizing its size.

[0039] Furthermore, dry removal of pollutants does not require additional engineering water, thus minimizing the generation of secondary pollutants such as wastewater.

[0040] Figure 1 This is a side cross-sectional view of an electronic industrial waste gas treatment device according to an embodiment of the present invention.

[0041] like Figure 1 As shown, an embodiment of the electronic industry waste gas treatment device of the present invention includes: a reaction chamber 100 having an internal space 110 for treating harmful substances contained in the waste gas; a first partition plate 200 dividing the internal space 110 into a pretreatment zone 111 and a purification zone 112; a second partition plate 300 dividing the purification zone 112 into a pyrolysis zone 112a and a post-treatment zone 112b; a heater 400 disposed in the pyrolysis zone 112a for purifying perfluorinated compounds; and a dry scrubbing tower unit 500 disposed in the post-treatment zone 112b for treating at least one of fluorinated compounds or nitrous oxide (N2O).

[0042] The reaction chamber 100 has an inlet 101 for the inflow of waste gas on one side and an outlet 102 for the discharge of treated waste gas on the upper part of the other side, forming a box-shaped structure with an internal space 110 for purifying pollutants in the waste gas flowing in through the inlet 101.

[0043] In this invention, the internal space 110 of the reaction chamber 100 is generally divided into a pretreatment area 111 and a purification area 112 according to the type of pollutants to be treated.

[0044] The pretreatment zone 111 removes dust from the exhaust gas flowing into the reaction chamber 100 through the inlet 101 for the first time. The purification zone 112 consists of a pyrolysis zone 112a and a post-treatment zone 112b. The pyrolysis zone 112a is used to heat and pyrolyze a large number of perfluorinated compounds generated in the electronics industry. The post-treatment zone 112b is used to treat dust, nitrous oxide, etc. generated during the pyrolysis process.

[0045] In one embodiment of the present invention, the reaction chamber 100 can be made of a variety of materials. However, since the temperatures of the pretreatment zone 111, the pyrolysis zone 112a and the posttreatment zone 112b are different, different materials can be used to make the chamber according to the process temperature of each zone.

[0046] For example, compared with the pretreatment zone 111 and the posttreatment zone 112b, the pyrolysis zone 112a needs to maintain a high temperature. Therefore, preferably, the inner wall of the reaction chamber 100 of the pyrolysis zone 112a, the first partition plate 200 and the second partition plate 300 are made of materials with excellent heat resistance. Depending on the operating temperature, ceramics or the like can be used to form a coating with excellent heat resistance before use.

[0047] This can prevent damage to the pretreatment zone 111 or the posttreatment zone 112b due to the high temperature of the pyrolysis zone 112a, and can also minimize heat loss, thereby saving waste gas treatment costs.

[0048] Preferably, the first partition plate 200 extends upward from the inner wall of the other side of the reaction chamber 100 toward the inlet 101, so as to divide the internal space 110 into a pretreatment area 111 for the first capture of dust in the exhaust gas and the remaining purification area 112.

[0049] Therefore, it can increase the contact opportunities and time of exhaust gas, improve dust capture efficiency, and guide the flow of exhaust gas to minimize pressure loss, making the flow smooth and improving treatment efficiency.

[0050] At this point, preferably, in one embodiment of the present invention, the inlet 101 is inclined and bent downward toward the inner wall of the other side of the reaction chamber 100.

[0051] The reason is that the flow of exhaust gas is guided so that the exhaust gas first contacts the bottom surface of the reaction chamber 100 and then is transported along the bottom surface of the first partition plate 200 to the purification area 112 located at the rear end. This makes the flow of exhaust gas smooth, increases the contact opportunities and time, and improves the treatment effect.

[0052] More preferably, the first partition plate 200 of an embodiment of the present invention further includes a dust discharge door 220, which is adjacent to the inner wall of the other side of the reaction chamber 100, so as to discharge the dust and foreign matter accumulated in the upper part downward.

[0053] Therefore, the dust accumulated on the plane of the first partition plate 200 moves along the inclination of the first partition plate 200 toward the dust discharge door 220, and the dust discharge door 220 is opened and closed according to the preset time or the amount of dust accumulated, so that the dust accumulated on the upper part of the first partition plate 200 is discharged toward the pretreatment area 111 below, thereby ensuring convenient maintenance, extending the maintenance cycle, and improving work efficiency.

[0054] Furthermore, preferably, in one embodiment of the present invention, the plane and bottom surface of the first partition plate 200 are separated by longitudinal and transverse directions to form a plurality of first capture protrusions 210. Preferably, the bottom surface of the reaction chamber 100 is also formed with a plurality of second capture protrusions 120 in the same shape and arrangement as the first capture protrusions 210.

[0055] Figure 2 These are perspective views of the shape and configuration of the first and second capturing protrusions according to an embodiment of the present invention.

[0056] like Figure 2 As shown, preferably, in one embodiment of the present invention, the first capturing protrusion 210 and the second capturing protrusion 120 are in the shape of a quadrangular pyramid, and the cross-sectional area increases towards the rear along the flow direction of the exhaust gas.

[0057] Therefore, the first capturing protrusion 210 and the second capturing protrusion 120 increase the contact area with the exhaust gas, thereby improving the capturing efficiency. They can also prevent the captured dust from being blocked by the back of the first capturing protrusion 210 and the second capturing protrusion 120, which would cause the exhaust gas to flow in reverse.

[0058] Furthermore, in this invention, preferably, the first capturing protrusion 210 and the second capturing protrusion 120 are alternately formed along the direction of exhaust gas flow, i.e., in a chessboard pattern, in the front and rear rows.

[0059] Therefore, even if dust flows back between the first capture protrusion 210 and the second capture protrusion 120 in column n+1, it can be prevented from being blocked by the back side of the first capture protrusion 210 and the second capture protrusion 120 in column n and flowing back.

[0060] Furthermore, as the dust moves along the direction of the exhaust flow, it can naturally move backward along the sides or at an angle of the first capture protrusion 210 and the second capture protrusion 120.

[0061] According to the present invention, the first capturing protrusion 210 and the second capturing protrusion 120 are in the shape of a quadrangular pyramid, or they can be arranged in the direction of the exhaust gas flow, smoothly moving the dust in the forward direction while preventing reverse backflow. It has various forms, including morphology.

[0062] Furthermore, the electronic industrial waste gas treatment device of one embodiment of the present invention may also include a dust conveying means 130, such as a vibrator, which is disposed on the outer wall of the reaction chamber 100 to facilitate the movement of dust accumulated on the plane of the first partition plate 200 along the direction of the dust discharge door 220.

[0063] Therefore, by using the dust conveying means 130, the dust accumulated on the plane of the first partition plate 200 is conveyed along the direction of the dust discharge door 220, thereby making dust discharge smoother and maintenance more convenient.

[0064] More preferably, an electronic industrial waste gas treatment device according to an embodiment of the present invention further includes a third partition plate 600 extending upward from the end of the first partition plate 200.

[0065] Therefore, the third partition plate 600 prevents heat from the pyrolysis zone 112a from being transferred to the pretreatment zone 111, thereby improving thermal efficiency, preventing the pretreatment zone 111 from being damaged by high temperature, and further preventing dust from the pretreatment zone 111 from flowing into the pyrolysis zone 112a.

[0066] The second partition plate 300 extends vertically downward from the top of the reaction chamber 100 adjacent to the discharge port 102, so as to divide the purification area 112 into a pyrolysis area 112a for pyrolysis treatment of perfluorinated compounds and the remaining post-treatment area 112b.

[0067] In this invention, as described above, the first to third partition plates 200, 300, and 600 are configured to be disposed in the pyrolysis zone. Preferably, they are made of a material with excellent heat resistance, and, as needed, a heat-resistant coating can be applied to the surface facing the pyrolysis zone 112a.

[0068] As described above, the first to third partition plates 200, 300, and 600 divide the internal space into: a pretreatment zone 111, which first captures dust in the exhaust gas; a pyrolysis zone 112a, which heats the perfluorinated compounds in the exhaust gas for pyrolysis and captures the dust generated during the pyrolysis process for the second time; and a posttreatment zone 112b, which removes at least one of the fluorinated compounds or nitrous oxide from the exhaust gas containing the treated perfluorinated compounds, so as to integrate them into a single unit and simultaneously treat multiple pollutants such as dust, perfluorinated compounds, and nitrous oxide in a single reaction chamber 100, thereby minimizing the volume and improving the treatment efficiency.

[0069] The heater 400 is installed on the roof of the reaction chamber 100 so that it is located in the pyrolysis zone 112a and heats the waste gas flowing into the pyrolysis zone 112a at high temperature, thereby treating the perfluorinated compounds in the waste gas through thermal reaction.

[0070] In this invention, the heater 400 can be selectively applied to a variety of heaters that can heat exhaust gas and pyrolyze perfluorinated compounds, such as electric heaters, plasma heaters, etc. More preferably, an electric heater is used because the electric heater has a lower processing temperature, which can prevent damage to catalysts and other components in the downstream dry scrubbing tower unit.

[0071] At this time, the electronic industrial waste gas treatment device of one embodiment of the present invention may further include one or more temperature sensors, which are disposed in the pyrolysis zone 112a to detect the temperature of the pyrolysis zone 112a.

[0072] Therefore, the operation of heater 400 is controlled based on the temperature of pyrolysis zone 112a detected in real time by temperature sensor, thereby improving pyrolysis efficiency and preventing increased processing costs and damage caused by overheating.

[0073] In one embodiment of the present invention, a dry scrubbing tower unit 500 has one or more catalysts sequentially arranged in the waste gas flow path formed between the second partition plate 300 and the inner wall of the other side of the reaction chamber 100, so as to capture at least one of fluorine compounds and nitrous oxide in the pyrolysis-treated waste gas.

[0074] More specifically, the catalyst that can be used in the dry scrubbing tower unit 500 of an embodiment of the present invention can be an adsorption catalyst that adsorbs and removes fluorine compounds generated by the decomposition of perfluorinated compounds, a nitrous oxide decomposition catalyst that directly decomposes nitrous oxide, etc. Preferably, a catalyst with excellent corrosion resistance to fluorine is used.

[0075] Another dry scrubbing tower unit 500 according to an embodiment of the present invention can be configured with the above-mentioned catalyst in sequence, thereby maximizing the removal efficiency of pollutants and reducing the temperature of the exhaust gas.

[0076] More specifically, a dry scrubbing tower unit 500 according to an embodiment of the present invention comprises, along the direction of waste gas flow: a first catalyst section 510 containing a fluorine compound adsorption catalyst to perform secondary biological treatment of fluorine compounds by thermally decomposing perfluorinated compounds in a heater 400; a second catalyst section 530 containing a nitrous oxide decomposition catalyst disposed at the rear end of the first catalyst section 510 to directly decompose and remove nitrous oxide in the waste gas; and a heat exchange section 540 disposed at the rear end of the second catalyst section 530.

[0077] In this invention, the reason for first configuring the first catalyst section 510 is to adsorb and remove highly corrosive fluorine compounds, thereby minimizing damage to the second catalyst section 530 and the heat exchange section 520 configured thereafter.

[0078] Furthermore, preferably, the third catalyst section 540 for removing dust is disposed at the front end of the heat exchange section 540, because it prevents dust from sticking to the surface of the heat exchange section 540 and reducing the heat exchange efficiency, thereby suppressing the rise in exhaust gas temperature and improving thermal efficiency.

[0079] The present invention allows the waste heat recovered through the heat exchange section 520 to flow into the internal space 110 through the inlet 101 to preheat the waste gas.

[0080] The foregoing description has illustrated the present invention with reference to preferred embodiments. However, it should be understood that those skilled in the art can make various modifications and alterations to the present invention without departing from the spirit and scope of the invention as set forth in the appended claims.

Claims

1. An electronic industry waste gas treatment device, as a dry treatment device for electronic industry waste gas, comprising: The reaction chamber has an inlet and an outlet, forming an internal space for purifying waste gas; A first partition plate extends upwardly at an angle from the inner wall of the reaction chamber opposite the inlet toward the inlet, dividing the interior space into a pretreatment area for capturing dust in the exhaust gas and the remaining purification area. The second partition plate extends vertically downward from the ceiling of the reaction chamber adjacent to the discharge port, dividing the purification area into a pyrolysis area for heating the exhaust gas for pyrolysis and a post-treatment area. A third partition plate extends upward from the end of the first partition plate to prevent dust from flowing into the pyrolysis zone and from causing heat loss. A heater, which is disposed on the roof of the reaction chamber and located in the pyrolysis zone, heats the exhaust gas flowing into the pyrolysis zone to pyrolyze perfluorinated compounds; as well as A dry scrubbing tower unit comprising one or more catalysts to capture at least one of dust, fluorine compounds, and nitrous oxide in the exhaust gas flowing into the post-treatment zone. The second partition plate is arranged between the heater and the dry scrubbing tower unit, and its lower end extends longer than the lower ends of the heater and the dry scrubbing tower unit to prevent heat from the heater from being directly transferred to the dry scrubbing tower unit. The inlet is formed by a downwardly curved inclination towards the inner wall of the reaction chamber to facilitate the flow of exhaust gas. The exhaust gas first contacts the bottom surface of the reaction chamber and then is transported along the bottom surface of the first partition plate to the purification area. In this configuration, a plurality of first capture protrusions are formed along the longitudinal and transverse directions on the plane and bottom surface of the first partition plate, and a plurality of second capture protrusions are formed along the longitudinal and transverse directions on the bottom surface of the reaction chamber. The plurality of first capturing protrusions and the plurality of second capturing protrusions respectively form a chessboard pattern, with the plurality of first capturing protrusions in adjacent columns alternating with each other, and the plurality of second capturing protrusions in adjacent columns alternating with each other. The cross-sectional area of ​​each of the plurality of first capturing protrusions formed on the plane of the first partition plate is larger in a direction parallel to the plane of the first partition plate as it approaches the inner wall of the reaction chamber, and the cross-sectional area of ​​each of the plurality of first capturing protrusions formed on the bottom surface of the first partition plate is larger in a direction parallel to the bottom surface of the first partition plate as it moves away from the inner wall of the reaction chamber, so that the captured dust is blocked by the back side of the first capturing protrusion, preventing the reverse flow of exhaust gas. The cross-sectional area of ​​the plurality of second capturing protrusions is larger the closer they are to the inner wall of the reaction chamber, in order to prevent the backflow of dust that has accumulated at the bottom of the internal space.

2. The electronic industry waste gas treatment device according to claim 1, characterized in that, The first partition plate further includes a dust removal door, which is adjacent to the reaction chamber, and discharges the dust captured on its plane into the pretreatment area.

3. The electronic industry waste gas treatment device according to claim 1, characterized in that, The dry scrubbing tower unit includes: a first catalyst section, which adsorbs and treats fluorine compounds in the waste gas heated by the heater; and a heat exchange section, which is disposed at the rear end of the first catalyst section along the flow direction of the waste gas to recover the waste heat of the waste gas heated by the heater.

4. The electronic industry waste gas treatment device according to claim 3, characterized in that, The dry scrubbing tower unit further includes a second catalyst section, which is disposed between the first catalyst section and the heat exchange section, to directly decompose and remove nitrous oxide in the exhaust gas heated by the heater.

5. The electronic industry waste gas treatment device according to claim 3, characterized in that, The dry scrubbing tower unit also includes a third catalyst section, which is located at the front end of the heat exchange section to adsorb and remove dust from the exhaust gas.

Images