A multi-point heat source modular heat dissipation device and method based on a loop heat pipe

Abstract

A multi-point heat source modular heat dissipation device based on a loop heat pipe, comprising a loop heat pipe, a heat collecting plate, and an evaporator saddle; the loop heat pipe includes an evaporator, a liquid reservoir, a condenser, and a pipeline; one side of the heat collecting plate is in contact with a multi-point heat source for heat exchange; the other side is connected to the evaporator saddle and then fixes the evaporator, and the surface of this side is provided with channels for laying the pipeline; the heat collecting plate is also used for temperature equalization; the evaporator saddle is closely attached to the surface of the evaporator, and the contact surface between the evaporator saddle and the evaporator is a cylindrical surface, and the contact surface between the evaporator saddle and the heat collecting plate is a tooth groove shape; the evaporator uses the absorbed heat to provide a starting heat source for the loop heat pipe, and the working fluid in the pipeline flows into the condenser after absorbing heat; after the condenser dissipates heat, the working fluid flows back to the liquid reservoir, ending a cycle, and starts a new cycle again under the promotion of the evaporator, finally realizing the collection and dissipation of the heat of the heat source.

Description

Technical Field

[0001] The invention relates to a multi-point heat source modular heat dissipation device and method based on a loop heat pipe, belonging to the technical field of temperature control. Background Art

[0002] In view of the need for high-power heat sources to maintain normal operating temperature through heat dissipation, and the need for large-area heat sources to maintain temperature consistency, traditional heat dissipation often uses slot heat pipes to transfer heat to the cold source for dissipation. The disadvantages are as follows: 1. The contact area with the heat source is small and the heat exchange efficiency is low; 2. High-power heat transfer requires large-sized slot heat pipes, which have high installation space requirements; 3. The heat transfer capacity is limited and cannot meet the needs of high-power and long-distance heat dissipation; 4. The thermal resistance along the way is large; 5. The rigid structure has many layout constraints; 6. The slot heat pipe is a rigid connection, which will transmit vibration and cause high structural stress, affecting the service life. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and solve the heat dissipation problem of large-power, large-size and multi-point heat sources.

[0004] The purpose of the present invention is achieved through the following technical solutions:

[0005] A multi-point heat source modular heat dissipation device based on a loop heat pipe, comprising a loop heat pipe, a heat collecting plate, and an evaporator saddle; the loop heat pipe comprises an evaporator, a liquid reservoir, a condenser, and a pipeline;

[0006] One side of the heat collecting plate contacts multiple heat sources for heat exchange; the other side is connected to the evaporator saddle to fix the evaporator, and the side surface is provided with a groove for laying pipelines;

[0007] The evaporator saddle is in close contact with the surface of the evaporator, and the contact surface between the evaporator saddle and the evaporator is a cylindrical surface, and the contact surface between the evaporator saddle and the heat collecting plate is a tooth groove shape;

[0008] The evaporator uses the absorbed heat to provide a starting heat source for the loop heat pipe. The working fluid in the pipe flows into the condenser after absorbing heat. After the condenser discharges heat, the working fluid flows back to the liquid reservoir, ending a cycle, and starts the cycle again under the promotion of the evaporator, finally realizing the collection and dissipation of heat from the heat source.

[0009] Preferably, the surface shape of the heat collecting plate matches the shape of the multi-point heat source, and the contact area is increased by designing bosses or grooves to improve the heat exchange efficiency.

[0010] Preferably, the grooves on the heat collecting plate are welded to the pipes to achieve heat collection and enhance heat exchange efficiency.

[0011] Preferably, the evaporator, the liquid reservoir, the pipeline, the heat collecting plate and the evaporator saddle are integrally integrated.

[0012] Preferably, the evaporator saddle is connected to the heat collecting plate by a screwing method to press the evaporator.

[0013] Preferably, the heat collecting plate is also used for temperature equalization.

[0014] Preferably, the pipeline is arranged in a flexible manner.

[0015] Preferably, the loop heat pipe adopts a high heat dissipation-driving ratio mode.

[0016] Preferably, the working process of the heat dissipation device is as follows:

[0017] When the heat source starts to work, heat is collected onto the heat collecting plate through the matching structure on the surface of the heat collecting plate. A part of the heat is transferred to the evaporator through the evaporator saddle as the starting heat source of the loop heat pipe, and the remaining heat is fully exchanged with the pipeline through the channels of the heat collecting plate. The working medium in the pipeline absorbs heat and vaporizes, then flows into the condenser under drive, condenses and dissipates heat, completing the dissipation of heat. Finally, it flows back to the liquid reservoir, ending one cycle, and starts a new cycle again under the push of the evaporator.

[0018] A multi-point heat source modular heat dissipation method based on a loop heat pipe, using the above multi-point heat source modular heat dissipation device, the heat dissipation method includes the following:

[0019] After the external heat source works, the heat collecting plate collects heat. A part of the heat is transferred to the evaporator through the evaporator saddle as the starting heat source of the loop heat pipe, and the remaining heat is fully exchanged with the pipeline through the channels of the heat collecting plate;

[0020] The working medium in the pipeline absorbs heat and vaporizes, then flows into the condenser under drive, condenses and dissipates heat, completing the dissipation of heat. Finally, it flows back to the liquid reservoir, ending one cycle, and starts a new cycle again under the push of the evaporator.

[0021] The present invention has the following beneficial effects compared with the prior art:

[0022] (1) The present invention is applicable to a modular heat dissipation device for high-power and large-size multi-point heat sources, can meet the collection and dissipation of high-power and large-area heat, and has both high-power heat dissipation and large-size temperature equalization functions;

[0023] (2) The lower surface of the heat collecting plate of the present invention is in direct contact with the heat source, with a small thermal conduction resistance and high heat transfer efficiency;

[0024] (3) The heat collecting plate of the present invention can be customized according to the heat source structure, increasing the contact area, reducing the thermal resistance, and realizing high-efficiency heat exchange of heat;

[0025] (4) The evaporator saddle of the present invention connects and couples heat transfer between the evaporator and the heat collecting plate. Heat conduction is enhanced by a cylindrical mating surface that is in full contact with the evaporator and a tooth-groove-shaped mating surface that mates with the heat collecting plate on both sides, and it is clamped by a screwing method to strengthen the heat transfer between the evaporator and the heat collecting plate.

[0026] (5) The evaporator and the heat collecting plate of the present invention are assembled through a contact saddle to couple heat transfer and directly use the heat source for the start-up of the loop heat pipe.

[0027] (6) The loop heat pipe of the present invention can achieve high-power and long-distance heat transfer. The pipeline is a flexible pipeline, with few constraints on the layout method, and it can be mechanically decoupled to reduce the influence of vibration.

[0028] (7) The loop heat pipe of the present invention can use a high heat dissipation ratio design to achieve low-power start-up and high-power heat transfer.

[0029] (8) The upper surface of the heat collecting plate of the present invention is a flat plate with grooves. The pipeline of the loop heat pipe can be welded to the grooves on the surface of the heat collecting plate to reduce the heat conduction resistance, improve the heat exchange efficiency of the heat collecting plate, and achieve uniform temperature within a large-size plane at the same time.

[0030] (9) The present invention adopts an integrated design, which is convenient for generalization and standardization, can unify the product installation interface, reduce the overall assembly difficulty, and compress the production cycle and cost. Brief Description of the Drawings

[0031] Figure 1 Schematic diagram of the working fluid flow of the heat dissipation device of the present invention;

[0032] Figure 2 Schematic diagram of the connection of the heat dissipation device of the present invention;

[0033] Figure 3 Schematic diagram of the partial connection of the heat dissipation device of the present invention. Detailed Embodiment

[0034] To make the objectives, technical solutions, and advantages of the present invention clearer, the following will further describe the embodiments of the present invention in detail with reference to the drawings.

[0035] A multi-point heat source modular heat dissipation device based on a loop heat pipe can meet the collection and dissipation of high-power and large-area heat, and has both high-power heat dissipation and large-size uniform temperature functions. It is in direct contact with the heat source, has a small heat conduction resistance, and a high heat transfer efficiency; it can make full use of the advantages of the loop heat pipe, such as strong heat transfer ability, long-distance heat transfer, flexible connection, and mechanical decoupling; it adopts an integrated design, which is convenient for generalization and standardization, can unify the product installation interface, reduce the overall assembly difficulty, and compress the production cycle and cost; the heat collecting plate can be customized according to the heat source structure to achieve high-efficiency heat exchange.

[0036] The heat dissipation device of the present invention includes a loop heat pipe, a heat collecting plate, and an evaporator saddle; among them, the loop heat pipe is used for heat transfer and includes an evaporator, a liquid reservoir, a condenser, a vaporization pipeline, and a condensation pipeline. The vaporization pipeline and the condensation pipeline together form a pipeline; as Figure 2 and 3 shown in the schematic diagram of the connection relationship of each component, the evaporator saddle connects and couples the heat transfer between the evaporator and the heat collecting plate. The heat conduction is enhanced by designing a cylindrical mating surface in full contact with the evaporator and a tooth groove-shaped contact surface mating with the heat collecting plate on both sides, and it is pressed tightly by a screwing method to strengthen the heat transfer between the evaporator and the heat collecting plate; the upper surface of the heat collecting plate is a flat plate with channels, which can be welded to the condensation pipe to enhance heat transfer; the lower surface of the heat collecting plate can be in full contact with the heat source through shape design, and its surface shape and size can be matched according to the special shape and size of the heat source. Protrusions or grooves are designed to increase the contact area and further enhance the contact heat exchange efficiency, which can meet the different heat dissipation requirements of different sizes, shapes, and occasions; part of the heat generated by the heat source can be directly used for the startup of the loop heat pipe, and the other part collects and equalizes the dispersed heat source through the heat collecting plate and discharges it through the loop heat pipe cycle. As Figure 1 shown in the system connection schematic diagram, connecting the heat dissipation device of the present invention with a condenser with channels to form a circulating system can realize the heat dissipation cycle and achieve high-power heat dissipation.

[0037] The working process (i.e., heat dissipation method) of the present invention is as follows:

[0038] When the heat source starts to work, the heat is collected to the heat collecting plate through the matching structure on the lower surface of the heat collecting plate. Part of the heat is transmitted to the evaporator through the evaporator saddle as the startup heat source of the loop heat pipe, and the remaining heat is fully exchanged with the loop heat pipe through the grooves of the heat collecting plate. The working fluid in the pipeline absorbs heat and vaporizes, then flows into the condenser under drive, condenses and dissipates heat, completes the heat dissipation, and finally flows back to the liquid reservoir to end a cycle, and starts a new cycle under the promotion of the evaporator. While the heat collecting plate realizes large-area heat collection, it can also achieve temperature equalization, conduct the heat at local positions to low-temperature areas, and realize temperature equalization within a large-size heat source surface. The entire device realizes integrated heat dissipation based on the loop heat pipe applicable to high-power and large-size heat sources.

[0039] The matching structure design of the lower surface of the heat collecting plate and the heat source strengthens the heat exchange and can improve the heat transfer efficiency; the upper surface is designed with channels to be coupled with the loop heat pipe pipeline, strengthening the coupling between the heat source and the loop heat pipe, and further improving the heat exchange efficiency; the evaporator saddle connects and couples the heat transfer between the evaporator and the heat collecting plate. The heat conduction is enhanced by designing a cylindrical mating surface in full contact with the evaporator and a tooth groove-shaped contact surface mating with the heat collecting plate on both sides, and it is pressed tightly by a screwing method to strengthen the heat transfer between the evaporator and the heat collecting plate, increasing the heat utilization efficiency.

[0040] Applying a loop heat pipe to the heat dissipation of high-power heat sources, the advantages of the loop heat pipe are obvious. The loop heat pipe has a large heat dissipation capacity and can meet the high-power heat dissipation requirements; the pipes of the loop heat pipe can be flexibly arranged, with fewer constraints on the arrangement method and can reduce the impact of vibration; the loop heat pipe has a long length and can achieve long-distance heat transfer; the high heat dissipation-driving ratio design of the loop heat pipe can achieve high-power heat transfer with low-power driving.

[0041] The four components of the evaporator, liquid reservoir, heat collecting plate and evaporator saddle of this device are integrated into one design, which is convenient for generalization and standardization, can unify the product installation interface, reduce the overall assembly difficulty, and compress the production cycle and cost.

[0042] The content not described in detail in the specification of this invention belongs to the well-known technology of those skilled in the art.

[0043] Although this invention has been disclosed above with preferred embodiments, it is not used to limit this invention. Any person skilled in the art can make possible changes and modifications to the technical solution of this invention by using the methods and technical contents disclosed above without departing from the spirit and scope of this invention. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of this invention without departing from the technical solution of this invention all belong to the protection scope of the technical solution of this invention.

Claims

1. A multi-point heat source modular heat dissipation device based on a loop heat pipe, characterized in that, It includes a loop heat pipe, a heat collecting plate, and an evaporator saddle; the loop heat pipe includes an evaporator, a liquid reservoir, a condenser, and a pipeline; One side of the heat collecting plate is in contact with multiple heat sources for heat exchange; the other side is connected to the evaporator saddle and then fixes the evaporator, and the surface of this side is provided with channels for laying pipelines; The evaporator saddle is closely attached to the surface of the evaporator, and the contact surface between the evaporator saddle and the evaporator is a cylindrical surface, and the contact surface between the evaporator saddle and the heat collecting plate is a tooth groove shape; The evaporator uses the absorbed heat to provide a starting heat source for the loop heat pipe, and the working fluid in the pipeline flows into the condenser after absorbing heat; after the condenser dissipates heat, the working fluid flows back to the liquid reservoir, ending a cycle, and starts a new cycle under the drive of the evaporator, finally realizing the collection and dissipation of the heat of the heat source; The surface shape of the heat collecting plate matches the shape of the multiple heat sources. By designing bosses or grooves, the contact area is increased to improve the heat exchange efficiency; The channels on the heat collecting plate are welded to the pipeline to realize heat collection and enhance the heat exchange efficiency; The evaporator, the liquid reservoir, the pipeline, the heat collecting plate, and the evaporator saddle are integrally integrated; The evaporator saddle is connected to the heat collecting plate by a screwing method to press the evaporator; The heat collecting plate is also used for temperature equalization; The loop heat pipe adopts a high heat dissipation drive ratio mode; The working process of the heat dissipation device is as follows: When the heat source starts to work, the heat is collected to the heat collecting plate through the matching structure on the surface of the heat collecting plate. Part of the heat is transmitted to the evaporator through the evaporator saddle as the starting heat source of the loop heat pipe, and the remaining heat is fully exchanged with the pipeline through the channels on the heat collecting plate. The working fluid in the pipeline absorbs heat and vaporizes, and then flows into the condenser under the drive, condenses and dissipates heat, completes the dissipation of the heat, and finally flows back to the liquid reservoir, ending a cycle, and starts a new cycle under the drive of the evaporator.

2. The multi-point heat source modular heat dissipation device according to claim 1, characterized in that The pipeline is arranged in a flexible manner.

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