inductor component

Abstract

The present application relates to an inductor component, comprising: a substrate; a coil provided on the substrate and wound in a spiral shape along an axis; and a first external electrode and a second external electrode provided on the substrate and electrically connected to the coil, the substrate including a substrate having first and second main surfaces facing each other, and an insulating layer provided on the first main surface, the coil including: a first coil wiring provided on the first main surface and covered by the insulating layer; a second coil wiring provided on the second main surface; and a first through wiring and a second through wiring provided to pass through the substrate from the first main surface to the second main surface and arranged on opposite sides of the axis, the first coil wiring, the first through wiring, the second coil wiring, and the second through wiring being connected in this order to form at least a portion of the spiral shape, at least a portion of the first external electrode being provided above the first coil wiring and provided on the insulating layer in a manner separated from the first coil wiring.

Description

TECHNICAL FIELD

[0001] The present application relates to an inductor component. BACKGROUND

[0002] In the past, as an inductor component, there has been a technology described in Japanese Patent Application Publication No. 11-251146 (Patent Literature 1). The inductor component has a base body having a length, a width, and a height; a coil provided inside the base body and wound along an axial direction; and a first external electrode and a second external electrode provided to the base body and electrically connected to the coil. The base body has a first end surface and a second end surface located at both ends in the length direction, a first side surface and a second side surface located at both ends in the width direction, and a bottom surface and a top surface located at both ends in the height direction.

[0003] The first external electrode is provided to an entire surface of the first end surface and a part of each of the first side surface, the second side surface, the bottom surface, and the top surface. The second external electrode is provided to an entire surface of the second end surface and a part of each of the first side surface, the second side surface, the bottom surface, and the top surface.

[0004] Patent Literature 1: Japanese Patent Application Publication No. 11-251146

[0005] However, in the above-described conventional inductor component, the first external electrode and the second external electrode are so-called 5-face electrodes, and thus the first external electrode and the second external electrode become large, and the stray capacitance between the coil and the first external electrode and the second external electrode increases. SUMMARY

[0006] Therefore, an object of the present disclosure is to provide an inductor component capable of reducing the stray capacitance between a coil and an external electrode.

[0007] To solve the above problems, an inductor component according to one embodiment of the present disclosure includes a substrate having first and second main surfaces facing each other, an insulating layer provided on the first main surface, a coil including a first coil wire provided on the first main surface and covered by the insulating layer, a second coil wire provided on the second main surface, and first and second through wires provided to pass through the substrate from the first main surface to the second main surface and arranged on opposite sides with respect to the axis, the first coil wire, the first through wire, the second coil wire, and the second through wire being connected in this order to form at least a portion of the spiral shape, at least a portion of a first external electrode being provided above the first coil wire and provided on the insulating layer in a manner separated from the first coil wire, the first external electrode overlapping each of the first coil wire and the second coil wire as viewed in a direction orthogonal to the first main surface, and an area of an overlapping portion of the first external electrode and the first coil wire being smaller than an area of an overlapping portion of the first external electrode and the second coil wire.

[0008] According to the above-described embodiment, the first external electrode is closer to the first coil wire than to the second coil wire in the direction orthogonal to the first main surface. Also, the area of the overlapping portion of the first external electrode and the first coil wire is smaller than the area of the overlapping portion of the first external electrode and the second coil wire. Thus, the area of the overlapping portion of the first coil wire close to the first external electrode and the first external electrode can be relatively reduced, and thus the parasitic capacitance between the first external electrode and the first coil wire can be reduced, and the Q value can be improved.

[0009] In addition, the leakage current between the first external electrode and the first coil wire can be suppressed, and the reliability of the inductor component can be improved.

[0010] Preferably, in one embodiment of the inductor component, the substrate is made of glass.

[0011] According to the above-described embodiment, the substrate is made of glass, and the glass has high insulation, and thus the eddy current can be suppressed, and the Q value can be improved.

[0012] Preferably, in one embodiment of the inductor component, the substrate contains Si.

[0013] According to the above-described embodiment, the substrate contains Si, and thus the substrate has high thermal stability. Thus, the variation in the size of the substrate and the like caused by heat can be suppressed, and the electrical characteristic deviation can be reduced.

[0014] Preferably, in one embodiment of the inductor component, the first through-wiring and the second through-wiring extend in a direction orthogonal to the first main surface.

[0015] According to the above embodiment, the length of the first through-wiring and the second through-wiring can be shortened, and thus the DC resistance can be suppressed.

[0016] Preferably, in one embodiment of the inductor component, the thickness of the insulating layer is 1 / 3 or less of the thickness of the substrate, and the dielectric constant of the insulating layer is smaller than the dielectric constant of the substrate.

[0017] Here, the "thickness" refers to the maximum value of the size in the direction orthogonal to the first main surface.

[0018] According to the above embodiment, the thickness of the insulating layer is 1 / 3 or less of the thickness of the substrate, and thus the inductor component can be downsized. In addition, even if the thickness of the insulating layer is thinned, the distance between the external electrode and the first coil wiring is shortened, and thus the parasitic capacitance between the external electrode and the first coil wiring can be reduced due to the smaller dielectric constant of the insulating layer than the dielectric constant of the substrate, and the Q value can be improved.

[0019] Preferably, in one embodiment of the inductor component, the first coil wiring extends only in one direction.

[0020] According to the above embodiment, the first coil wiring extends only in one direction, and thus a fine first coil wiring can be formed by, for example, using deformation illumination in a photolithography process, and thus the inductor component can be downsized.

[0021] Preferably, in one embodiment of the inductor component, the second coil wiring extends only in one direction.

[0022] According to the above embodiment, the second coil wiring extends only in one direction, and thus a fine second coil wiring can be formed by, for example, using deformation illumination in a photolithography process, and thus the inductor component can be downsized.

[0023] Preferably, in one embodiment of the inductor component, the first end portion of the first coil wiring overlaps the first end portion of the second coil wiring, and the angle between the first coil wiring and the second coil wiring is an acute angle, as viewed in a direction orthogonal to the first main surface.

[0024] According to the above embodiment, the coil is tightly wound, and thus the inductance can be improved.

[0025] Preferably, in one embodiment of the inductor component, the angle is 5 degrees or more and 45 degrees or less.

[0026] According to the above-described embodiment, the coil is wound more tightly, and thus the inductance can be further increased.

[0027] Preferably, in one embodiment of the inductor component, a plurality of the first coil wires and a plurality of the second coil wires are provided, a first end portion of one of the first coil wires and a first end portion of one of the second coil wires overlap each other as viewed in a direction orthogonal to the first main surface, the one of the first coil wires and the one of the second coil wires constitute a group, and a plurality of the groups are provided, the angle formed by the first coil wire and the second coil wire of at least one of the groups is different from the angle formed by the first coil wire and the second coil wire of another group as viewed in the direction orthogonal to the first main surface.

[0028] According to the above-described embodiment, the angle formed by the first coil wire and the second coil wire of at least one of the groups is different from the angle formed by the first coil wire and the second coil wire of another group as viewed in the direction orthogonal to the first main surface. Thus, the length of the coil can be flexibly changed, and an inductor component having a desired inductance can be easily obtained.

[0029] Preferably, in one embodiment of the inductor component, a plurality of the first coil wires and a plurality of the second coil wires are provided, a first end portion of one of the first coil wires and a first end portion of one of the second coil wires overlap each other as viewed in a direction orthogonal to the first main surface, the one of the first coil wires and the one of the second coil wires constitute a group, and a plurality of the groups are provided, the angle formed by the first coil wire and the second coil wire of at least one of the groups is different from the angle formed by the first coil wire and the second coil wire of another group as viewed in the direction orthogonal to the first main surface.

[0030] According to the above-described embodiment, the angle formed by the first coil wire and the second coil wire of at least one of the groups is different from the angle formed by the first coil wire and the second coil wire of another group as viewed in the direction orthogonal to the first main surface. Thus, the length of the coil can be flexibly changed, and an inductor component having a desired inductance can be easily obtained.

[0031] Preferably, in one embodiment of the inductor component, a plurality of the first coil wires and a plurality of the second coil wires are provided, a first end portion of one of the first coil wires and a first end portion of one of the second coil wires overlap each other as viewed in a direction orthogonal to the first main surface, the one of the first coil wires and the one of the second coil wires constitute a group, and a plurality of the groups are provided, the angle formed by the first coil wire and the second coil wire of at least one of the groups is different from the angle formed by the first coil wire and the second coil wire of another group as viewed in the direction orthogonal to the first main surface.

[0032] According to the above-described embodiment, compared with a case where the extension direction of the second coil wire is inclined with respect to the axial direction of the coil, the size in the axial direction of the coil can be reduced, and thus the inductor component can be downsized.

[0033] Preferably, in one embodiment of the inductor component, a shape of a cross section of at least one of the first through-hole wire and the second through-hole wire orthogonal to the extension direction is circular.

[0034] According to the above-described embodiment, the through-hole for the through-hole wire can be easily formed by laser. In addition, when the through-hole is filled with a plating layer, the plating layer can be isotropically filled, and thus a plating layer with few voids can be formed.

[0035] Preferably, in one embodiment of the inductor component, at least one of the first through-hole wire and the second through-hole wire is composed of a plurality of conductive layers, and at least one of the conductive layers has copper as a main component.

[0036] According to the above-described embodiment, at least one of the conductive layers of the through-hole wire has copper as a main component. Since copper has high conductivity, the DC resistance of the through-hole wire can be suppressed.

[0037] Preferably, in one embodiment of the inductor component, at least one of the first through-hole wire and the second through-hole wire is composed of a plurality of conductive layers, and at least one of the conductive layers is composed of a conductive resin.

[0038] According to the above-described embodiment, the through-hole can be easily filled with the conductive resin.

[0039] Preferably, in one embodiment of the inductor component, an upper surface of a portion of the first coil wire that overlaps with an end surface of the first coil wire on the side of the through-hole wire connected to the first coil wire has a recess when viewed from a direction orthogonal to the first main surface.

[0040] According to the above-described embodiment, the upper surface of the first coil wire has a recess, and thus the area of the upper surface of the first coil wire is increased, and the adhesion to the insulating layer can be improved.

[0041] Preferably, in one embodiment of the inductor component, the base body has a cuboid shape having a length, a width, and a height, and the volume of the inductor component is 0.08 mm 3 Hereinafter, the length of the long side of the inductor component is 0.65 mm or less.

[0042] Here, the "length of the long side" refers to the largest value among the length, the width, and the height of the inductor component.

[0043] According to the above embodiment, due to its small size and short long side, the weight of the component can be reduced. Therefore, even with a small external electrode, the required mounting strength can be obtained.

[0044] Preferably, in one embodiment of the inductor component, the first coil wiring, the second coil wiring, the first through wiring, and the second through wiring are primarily composed of copper.

[0045] According to the above embodiments, copper, which is inexpensive and highly conductive, is used as the material for coil wiring and through wiring, thereby improving the mass production of inductor components and increasing the Q value.

[0046] According to the inductor component as one aspect of this disclosure, stray capacitance between the coil and the external electrode can be reduced. Attached Figure Description

[0047] Figure 1 This is a schematic perspective view of the inductor component from the bottom side.

[0048] Figure 2 This is a schematic bottom view of the inductor component viewed from the bottom side.

[0049] Figure 3 yes Figure 2 AA sectional view.

[0050] Figure 4A This is a schematic cross-sectional view illustrating the manufacturing method of an inductor component.

[0051] Figure 4B This is a schematic cross-sectional view illustrating the manufacturing method of an inductor component.

[0052] Figure 4C This is a schematic cross-sectional view illustrating the manufacturing method of an inductor component.

[0053] Figure 4D This is a schematic cross-sectional view illustrating the manufacturing method of an inductor component.

[0054] Figure 4E This is a schematic cross-sectional view illustrating the manufacturing method of an inductor component.

[0055] Figure 4F This is a schematic cross-sectional view illustrating the manufacturing method of an inductor component.

[0056] Figure 4G This is a schematic cross-sectional view illustrating the manufacturing method of an inductor component.

[0057] Figure 4H This is a schematic cross-sectional view illustrating the manufacturing method of an inductor component.

[0058] Figure 5 is a schematic bottom view of a first modification example of the inductor component, viewed from the bottom surface side.

[0059] Figure 6 is a schematic bottom view of a second modification example of the inductor component, viewed from the bottom surface side.

[0060] Figure 7 is an XZ sectional view of a third modification example of the inductor component.

[0061] Figure 8 is an XZ sectional view of a fourth modification example of the inductor component.

[0062] Figure 9 is a schematic bottom view of a second embodiment of the inductor component, viewed from the bottom surface side.

[0063] Explanation of Reference Numerals

[0064] 1, 1A … inductor component; 10 … base; 11b … bottom surface wiring (first coil wiring); 11b1 … upper surface; 11t … top surface wiring (second coil wiring); 11t1 … upper surface; 13 … first through wiring; 13b, 13t … end surface; 14 … second through wiring; 21 … substrate; 21b … bottom surface (first main surface); 21t … top surface (second main surface); 22 … insulating layer; 100 … outer surface; 100b … bottom surface; 100t … top surface; 100s1 … first side surface; 100s2 … second side surface; 100e1 … first end surface; 100e2 … second end surface; 110 … coil; 121 … first external electrode; 121b … first bottom surface portion; 121e … first end surface portion; 121e1 … first portion; 121e2 … second portion; 121e3 … third portion; 122 … second external electrode; 122b … second bottom surface portion; 122e … second end surface portion; 122e1 … first portion; 122e2 … second portion; 122e3 … third portion; AX … axis; V … through hole; θ, θ1, θ2 … angle formed by the bottom surface wiring and the top surface wiring. DETAILED DESCRIPTION

[0065] Hereinafter, an inductor component according to an embodiment of the disclosure will be described in detail. Note that the drawings contain a part of the inductor component, and the actual size and ratio are not reflected.

[0066] <First Embodiment>

[0067] Hereinafter, an inductor component 1 according to the first embodiment will be described. Figure 1 is a schematic perspective view of the inductor component 1, viewed from the bottom surface side. Figure 2is a schematic bottom view of the inductor component 1 as viewed from the bottom surface side. Figure 3 is Figure 2 an A-A sectional view of the inductor component 1. In addition, in Figure 2 , for convenience, the insulating layer of the base is omitted and a portion (bottom surface portion) of the external electrode is depicted with a double-dot chain line.

[0068] 1. Outline structure

[0069] The outline structure of the inductor component 1 will be described. The inductor component 1 is, for example, a surface mount type inductor component used for a high frequency signal transmission circuit. As shown in Figure 1 , Figure 2 and Figure 3 , the inductor component 1 includes a base 10, a coil 110 provided to the base 10 and wound in a spiral shape along an axis AX, and a first external electrode 121 and a second external electrode 122 provided to the base 10 and electrically connected to the coil 110. The axis AX of the coil 110 is a straight line passing through the center of the inner diameter portion of the coil 110. The axis AX of the coil 110 does not have a dimension in a direction orthogonal to the axis AX.

[0070] The base 10 has a length, a width, and a height. The base 10 has a first end surface 100el and a second end surface 100e2 on both ends in the length direction, a first side surface 100sl and a second side surface 100s2 on both ends in the width direction, and a bottom surface 100b and a top surface 100t on both ends in the height direction. That is, the outer surface 100 of the base 10 includes the first end surface 100el and the second end surface 100e2, the first side surface 100sl and the second side surface 100s2, and the bottom surface 100b and the top surface 100t.

[0071] In addition, as shown in the drawings, hereinafter, for convenience of explanation, the length direction (longitudinal direction) of the base 10, that is, the direction from the first end surface 100el toward the second end surface 100e2 is set as the X direction. In addition, the width direction of the base 10, that is, the direction from the first side surface 100sl toward the second side surface 100s2 is set as the Y direction. In addition, the height direction of the base 10, that is, the direction from the bottom surface 100b toward the top surface 100t is set as the Z direction. The X direction, the Y direction, and the Z direction are directions orthogonal to each other, and when arranged in the order of X, Y, and Z, constitute a right-hand system.

[0072] In the present specification, the "outer surface 100 of the base" including the first end surface 100e1, the second end surface 100e2, the first side surface 100s1, the second side surface 100s2, the bottom surface 100b, and the top surface 100t of the base 10 does not mean only a surface facing the outer peripheral side of the base 10, but also a surface that becomes a boundary between the outer side and the inner side of the base 10. In addition, the "upper side of the outer surface 100 of the base 10" is not an absolute one direction like the vertical upper side defined by the direction of gravity, but means a direction toward the outer side among the outer side and the inner side that are boundaries of the outer surface 100. Therefore, the "upper side of the outer surface 100" means a relative direction determined by the orientation of the outer surface 100. In addition, the "upper side (above)" with respect to a certain element includes not only a position above the element, that is, a position on the upper side of the element through other objects, a position on the upper side with a clearance, but also a position on (on) the upper side in contact with the element.

[0073] The base 10 includes a substrate 21 and an insulating layer 22 provided on the substrate 21. The substrate 21 has a bottom surface 21b and a top surface 21t facing each other in the Z direction. The insulating layer 22 is provided on the bottom surface 21b of the substrate 21. The bottom surface 21b corresponds to one example of the "first main surface" recited in the technical solution, and the top surface 21t corresponds to one example of the "second main surface" recited in the technical solution.

[0074] The coil 110 includes a bottom surface wiring 11b provided on the bottom surface 21b and covered by the insulating layer 22, a top surface wiring 11t provided on the top surface 21t, and a first through wiring 13 and a second through wiring 14 provided to pass through the substrate 21 from the bottom surface 21b to the top surface 21t and arranged on opposite sides of each other with respect to the axis AX. The bottom surface wiring 11b corresponds to one example of the "first coil wiring" recited in the technical solution, and the top surface wiring 11t corresponds to one example of the "second coil wiring" recited in the technical solution. The bottom surface wiring 11b, the first through wiring 13, the top surface wiring 11t, and the second through wiring 14 are sequentially connected, thereby constituting at least a portion of a spiral shape.

[0075] At least a portion of the first external electrode 121 is provided above the bottom surface wiring 11b and provided to the insulating layer 22 in a manner separated from the bottom surface wiring 11b. As shown in FIG. 1, when viewed from a direction orthogonal to the bottom surface 21b, the first external electrode 121 overlaps each of the bottom surface wiring 11b and the top surface wiring 11t, and the area of the overlapping portion of the first external electrode 121 with the bottom surface wiring 11b is smaller than the area of the overlapping portion of the first external electrode 121 with the top surface wiring 11t. In Figure 2 Figure 2 ​In the diagram, the overlapping portion of the first external electrode 121 and the bottom wiring 11b is represented by a solid diagonal line, and the overlapping portion of the first external electrode 121 and the top wiring 11t is represented by a dashed diagonal line.

[0076] According to the above structure, in a direction orthogonal to the bottom surface 21b, the first external electrode 121 is closer to the bottom surface wiring 11b than the top surface wiring 11t. Furthermore, the area of ​​the overlap between the first external electrode 121 and the bottom surface wiring 11b is smaller than the area of ​​the overlap between the first external electrode 121 and the top surface wiring 11t. This relatively reduces the area of ​​the overlap between the bottom surface wiring 11b and the first external electrode 121, thereby reducing the parasitic capacitance between them and improving the Q value. Additionally, leakage current between the first external electrode 121 and the bottom surface wiring 11b can be suppressed, improving the reliability of the inductor component 1.

[0077] Furthermore, the second external electrode 122 has the same structure as the first external electrode 121 and has the same effect as the first external electrode 121.

[0078] That is, at least a portion of the second external electrode 122 is disposed above the bottom surface wiring 11b, and is disposed on the insulating layer 22 in a manner separate from the bottom surface wiring 11b. Viewed from a direction orthogonal to the bottom surface 21b, the second external electrode 122 overlaps with each of the bottom surface wiring 11b and the top surface wiring 11b, and the overlapping portion of the second external electrode 122 with the bottom surface wiring 11b ( Figure 2 The area of ​​the solid line (shown by the diagonal line) is greater than the area of ​​the overlap between the second external electrode 122 and the top surface wiring 11t (shown by the diagonal line). Figure 2 The area of ​​the inductor component 1 (shown by the diagonal line of the dashed line) is small. Therefore, the parasitic capacitance between the second external electrode 122 and the bottom surface wiring 11b can be reduced, thereby improving the Q value. In addition, leakage current between the second external electrode 122 and the bottom surface wiring 11b can be suppressed, thereby improving the reliability of the inductor component 1.

[0079] In addition, in at least the first external electrode 121 of the first external electrode 121 and the second external electrode 122, the overlap area with the bottom surface wiring 11b may be smaller than the overlap area with the top surface wiring 11t.

[0080] 2. Structure of each part

[0081] (Inductor component 1)

[0082] The volume of inductor component 1 is 0.08 mm. 3The length of the long side of the inductor component 1 is 0.65 mm or less. The length of the long side of the inductor component 1 refers to the largest value among the length, the width, and the height of the inductor component 1, and in the present embodiment, refers to the length in the X direction. According to the above structure, the volume of the inductor component 1 is small, and the length of the long side of the inductor component 1 is also short, so the weight of the inductor component 1 is light. Therefore, even if the external electrodes 121 and 122 are small, the required mounting strength can be obtained.

[0083] Specifically, the size (length (X direction) x width (Y direction) x height (Z direction)) of the inductor component 1 is 0.6 mm x 0.3 mm x 0.3 mm, 0.4 mm x 0.2 mm x 0.2 mm, 0.25 mm x 0.125 mm x 0.120 mm, or the like. In addition, the width and the height can also be different, and for example, can be 0.4 mm x 0.2 mm x 0.3 mm, or the like.

[0084] (Base 10)

[0085] The base 10 includes a substrate 21 having a bottom surface 21b and a top surface 21t on both end sides in the Z direction, and an insulating layer 22 covering each of the bottom surface 21b and the top surface 21t of the substrate 21. In addition, the insulating layer 22 can be provided only on the bottom surface 21b among the bottom surface 21b and the top surface 21t.

[0086] The material of the substrate 21 is preferably glass, whereby since the insulating property of glass is high, eddy current can be suppressed, and the Q value can be improved. It is preferable that the substrate 21 contain Si element, whereby the thermal stability of the substrate 21 is high, so that variation in the size of the base 10 or the like due to heat can be suppressed, and the electrical characteristic deviation can be reduced.

[0087] The substrate 21 is preferably a single-layer glass plate. Thereby, the strength of the base 10 can be ensured. In addition, in the case of a single-layer glass plate, the dielectric loss is small, so the Q value at high frequencies can be improved. In addition, since there is no sintering process like a sintered body, deformation of the base 10 at the time of sintering can be suppressed, so that the pattern deviation can be suppressed, and an inductor component with a small inductance tolerance can be provided.

[0088] As the material of the single-layer glass plate, from the viewpoint of the manufacturing method, a glass plate having photosensitivity typified by "Foturan II" (registered trademark of Schott AG) is preferable. In particular, the single-layer glass plate preferably contains cerium oxide (cerium dioxide: CeO2), and in this case, the cerium oxide becomes a sensitizer, and processing using photolithography becomes easier.

[0089] However, since a single-layer glass plate can be processed by mechanical processing such as drilling, sand blasting, dry / wet etching processing using a photoresist and a metal mask, laser processing, and the like, it can also be a glass plate that does not have photosensitivity. In addition, the single-layer glass plate can be a glass plate formed by sintering a glass paste or can be formed by a known method such as a float method.

[0090] The single-layer glass plate is a single-layer plate-like member in which an internal conductor or the like is integrated inside the glass body without introducing a wiring (a part of the coil 110). In particular, the single-layer glass plate has an outer surface that is a boundary between the outside and the inside of the glass body. A through-hole V formed by the single-layer glass plate is also a boundary between the outside and the inside of the glass body and is therefore included in the outer surface 100 of the base 10.

[0091] The single-layer glass plate is basically in an amorphous state, but can also have a crystalline portion. For example, in the case of Foturan II described above, the dielectric constant of the glass in the amorphous state is 6.4, and in contrast, by crystallizing it, the dielectric constant can be reduced to 5.8. Thereby, the stray capacitance between the conductors (between the wirings) in the vicinity of the crystalline portion can be reduced.

[0092] The insulating layer 22 is a member that has an effect of protecting the wiring from external force by covering the wiring (the bottom surface wiring 11b, the top surface wiring 11t), an effect of preventing damage to the wiring, and an effect of improving the insulation of the wiring. The insulating layer 22 is, for example, preferably an inorganic film such as silicon, hafnium oxide, nitride, or oxynitride, which is excellent in insulating properties and thin film formation. However, the insulating layer 22 can also be a resin film such as epoxy or polyimide, which is easier to form. In particular, the insulating layer 22 is preferably composed of a material with a low dielectric constant, whereby in the case where the insulating layer 22 is present between the coil 110 and the external electrodes 121, 122, the stray capacitance formed between the coil 110 and the external electrodes 121, 122 can be reduced.

[0093] The insulating layer 22 can be formed, for example, by laminating a resin film such as ABF GX-92 (manufactured by Ajinomoto Fine-Techno Co., Inc.), or by applying a paste-like resin and performing heat curing or the like.

[0094] The thickness of the insulating layer 22 is preferably 1 / 3 or less of the thickness of the substrate 21, and the dielectric constant of the insulating layer 22 is smaller than the dielectric constant of the substrate 21. The thickness refers to the maximum value of the size in the direction orthogonal to the bottom surface 21b. Thereby, the thickness of the insulating layer 22 is made thin, and the inductor component 1 can be made small. In addition, even if the thickness of the insulating layer 22 is made thin and the distance between the first external electrode 121, the second external electrode 122, and the bottom surface wiring 11b is made short, since the dielectric constant of the insulating layer 22 is smaller than the dielectric constant of the substrate 21, the stray capacitance between the first external electrode 121, the second external electrode 122, and the bottom surface wiring 11b can be reduced, and the Q value can be improved.

[0095] Further, the base body 10 can also include a sintered body, that is, the substrate 21 can also be a sintered body, which can ensure the strength of the base body 10. In addition, by using ferrite or the like for the sintered body, the efficiency of obtaining the inductance can be improved.

[0096] The base body 10 can also further have an insulating film that covers a portion of the insulating layer 22 on the bottom surface 21b side. That is, the insulating film is at least located between the first external electrode 121 and the second external electrode 122 provided on the insulating layer 22, and can more reliably prevent short-circuiting of the first external electrode 121 and the second external electrode 122. The material of the insulating film is, for example, the same material as the insulating layer 22.

[0097] (Coils 110)

[0098] The coil 110 has a bottom surface wiring 11b disposed above the bottom surface 21b of the substrate 21 and covered by the insulating layer 22, a top surface wiring 11t disposed above the top surface 21t of the substrate 21 and covered by the insulating layer 22, and a pair of through wirings 13, 14 that penetrate the substrate 21 to the bottom surface 21b and the top surface 21t and are disposed on opposite sides of each other with respect to the axis AX. The bottom surface wiring 11b, the first through wiring 13, the top surface wiring 11t, and the second through wiring 14 are sequentially connected to constitute at least a portion of the coil 110 wound in the direction of the axis AX.

[0099] According to the above structure, the coil 110 is a so-called spiral-shaped coil 110, and thus in a cross section orthogonal to the axis AX, the area in which the bottom surface wiring 11b, the top surface wiring 11t, and the through wirings 13, 14 are parallel along the winding direction of the coil 110 can be reduced, and the stray capacitance in the coil 110 can be reduced.

[0100] Here, the spiral shape refers to a shape in which the number of turns of the entire coil is greater than one turn, and the number of turns of the coil in a cross section orthogonal to the axis is less than one turn. One turn or more refers to a state in which the wirings of the coil have a portion that is adjacent in the radial direction and parallel in the winding direction as viewed from the axis in a cross section orthogonal to the axis, and less than one turn refers to a state in which the wirings of the coil do not have a portion that is adjacent in the radial direction and parallel in the winding direction as viewed from the axis in a cross section orthogonal to the axis. In addition, the parallel portion of the wirings includes not only an extension portion extending in the winding direction of the wirings, but also a land portion connected to an end portion of the extension portion and having a width greater than that of the extension portion.

[0101] The bottom surface wiring 11b extends in only one direction. Specifically, the bottom surface wiring 11b is slightly inclined to the X direction and extends in the Y direction. A plurality of bottom surface wirings 11b are arranged in parallel along the X direction. Here, in the photolithography process, if a deformed illumination such as annular illumination, dipole illumination, or the like is used, the resolution of the pattern in a specific direction can be improved, and a finer pattern can be formed. According to the above structure, the bottom surface wiring 11b extends in only one direction, and thus by using, for example, deformed illumination in the photolithography process, a fine bottom surface wiring 11b can be formed, and the inductor component 1 can be miniaturized.

[0102] The top surface wiring 11t extends in only one direction. Specifically, the top surface wiring 11t is a shape extending in the Y direction. A plurality of top surface wirings 11t are arranged in parallel along the X direction. According to the above structure, the top surface wiring 11t extends in only one direction, and thus by using, for example, deformed illumination in the photolithography process, a fine top surface wiring 11t can be formed, and the inductor component 1 can be miniaturized.

[0103] The first through wiring 13 is arranged on the first side surface 100s1 side with respect to the axis AX inside the through hole V of the base 10, and the second through wiring 14 is arranged on the second side surface 100s2 side with respect to the axis AX inside the through hole V of the base 10. The first through wiring 13 and the second through wiring 14 respectively extend in a direction orthogonal to the bottom surface 21b and the top surface 21t (the bottom surface 100b and the top surface 100t). Thereby, the length of the first through wiring 13 and the second through wiring 14 can be shortened, and thus the direct current resistance (Rdc) can be suppressed. A plurality of first through wirings 13 and a plurality of second through wirings 14 are respectively arranged in parallel along the X direction.

[0104] The bottom surface wiring 11b and the top surface wiring 11t are made of a good conductor material such as copper, silver, gold, or an alloy thereof. The bottom surface wiring 11b and the top surface wiring 11t can be a metal film formed by plating, vapor deposition, sputtering, or the like, or can be a metal sintered body formed by applying a conductor paste and sintering. In addition, the bottom surface wiring 11b and the top surface wiring 11t can be a multilayer structure in which a plurality of metal layers are stacked. The thickness of the bottom surface wiring 11b and the top surface wiring 11t is preferably 5 μm or more and 50 μm or less.

[0105] Further, the bottom surface wiring 11b and the top surface wiring 11t are preferably formed by a semi-additive method, whereby the bottom surface wiring 11b and the top surface wiring 11t of low resistance, high precision, and high aspect ratio can be formed. For example, the bottom surface wiring 11b and the top surface wiring 11t can be formed as follows. First, a titanium layer and a copper layer are formed as seed layers in order by a sputtering method or a non-electrolytic plating on the entire outer surface 100 of the base 10 after dicing, and a patterned photoresist is formed on the seed layers. Next, a copper layer is formed on the seed layers in the opening portions of the photoresist by electroplating. Then, the photoresist and the seed layers are removed by wet etching or dry etching. Thereby, the bottom surface wiring 11b and the top surface wiring 11t patterned into an arbitrary shape can be formed on the outer surface 100 of the base 10.

[0106] The first through wiring 13 and the second through wiring 14 can be formed in the through hole V formed in advance in the base 10 using the materials and the manufacturing method exemplified for the bottom surface wiring 11b and the top surface wiring 11t.

[0107] The bottom surface wiring 11b, the top surface wiring 11t, the first through wiring 13, and the second through wiring 14 are preferably mainly composed of copper. Thereby, as the material of the wiring, inexpensive and highly conductive copper is used, whereby the productivity of the inductor component 1 can be improved and the Q value can be improved.

[0108] The bottom surface wiring 11b and the top surface wiring 11t are preferably formed so that the first end portion of the bottom surface wiring 11b and the first end portion of the top surface wiring 11t overlap each other as viewed from a direction orthogonal to the bottom surface 21b, and the angle θ formed by the bottom surface wiring 11b and the top surface wiring 11t is an acute angle. Figure 2 The bottom surface wiring 11b and the top surface wiring 11t are preferably formed so that the first end portion of the bottom surface wiring 11b and the first end portion of the top surface wiring 11t overlap each other as viewed from a direction orthogonal to the bottom surface 21b, and the angle θ formed by the bottom surface wiring 11b and the top surface wiring 11t is an acute angle. Figure 2 The angle θ is an angle between the center line of the width of the bottom surface wiring 11b (dotted line in FIG. 10) and the center line of the width of the top surface wiring 11t (dotted line in FIG. 10) as viewed from a direction orthogonal to the bottom surface 21b. Figure 2

[0109] According to the above structure, the coil 110 is tightly wound, whereby the inductance can be improved. Further, the angle θ is only required to be an acute angle in at least one set of the bottom surface wiring 11b and the top surface wiring 11t among all the bottom surface wirings 11b and the top surface wirings 11t.

[0110] The angle θ is preferably 5 degrees or more and 45 degrees or less in at least one set of the bottom surface wiring 11b and the top surface wiring 11t. Thereby, the coil 110 is more tightly wound, whereby the inductance can be further improved.

[0111] The bottom surface wiring 11b and the top surface wiring 11t are preferably formed so that the first end portion of the bottom surface wiring 11b and the first end portion of the top surface wiring 11t overlap each other as viewed from a direction orthogonal to the bottom surface 21b, and the angle θ formed by the bottom surface wiring 11b and the top surface wiring 11t is an acute angle. Figure 2 ​As shown, a plurality of top surface wirings 11t are present, and a plurality of first through wirings 13 and a plurality of second through wirings 14 are present, respectively. One top surface wiring 11t and one first through wiring 13 and one second through wiring 14 connected to both end portions of one top surface wiring 11t, respectively, constitute one group, and a plurality of groups are present. When viewed from a direction orthogonal to the bottom surface 21b, the extending direction of the top surface wiring 11t connected to the first through wiring 13 and the second through wiring 14 of at least one group is orthogonal to the axis AX direction of the coil 110, and the first through wiring 13 and the second through wiring 14 of at least one group are arranged to be line-symmetric with respect to the axis AX of the coil 110.

[0112] According to the above structure, compared to a case where the extending direction of the top surface wiring 11t is inclined with respect to the axis AX direction of the coil 110, it is possible to reduce the size in the axis AX direction of the coil 110, and to downsize the inductor component 1. Further, it is preferable that the first through wiring 13 and the second through wiring 14 of more than half of the groups be arranged to be line-symmetric with respect to the axis AX of the coil 110, and it is more preferable that the first through wiring 13 and the second through wiring 14 of all the groups be arranged to be line-symmetric with respect to the axis AX of the coil 110, whereby it is possible to further reduce the size in the axis AX direction of the coil 110.

[0113] It is preferable that the shape of the cross section orthogonal to the extending direction of at least one of the first through wiring 13 and the second through wiring 14 be circular. According to the above structure, it is possible to easily form the through hole V for the through wiring using laser. In addition, when filling the through hole V with a plating layer, it is possible to isotropically fill the plating layer, and thus it is possible to form a plating layer with few voids. Further, if the shape of the cross section of all the first through wirings 13 and the second through wirings 14 is circular, it is possible to more easily form the through hole V.

[0114] It is preferable that the axis AX of the coil 110 be parallel to the bottom surface 100b of the base 10. Specifically, the axis AX is parallel to the X direction. Thereby, in a case where the bottom surface 100b of the base 10 is arranged to oppose the mounting substrate, it is possible to reduce the obstruction of the magnetic flux of the coil 110 by the mounting substrate, and to improve the efficiency of obtaining inductance.

[0115] (First external electrode 121 and second external electrode 122)

[0116] The first external electrode 121 is arranged on the first end surface 100el side with respect to the center of the X direction of the base 10 in a manner so as to protrude from the outer surface 100 of the base 10. The second external electrode 122 is arranged on the second end surface 100e2 side with respect to the center of the X direction of the base 10 in a manner so as to protrude from the outer surface 100 of the base 10.

[0117] The first external electrode 121 is connected to the first end of the coil 110, and the second external electrode 122 is connected to the second end of the coil 110. The first external electrode 121 and the second external electrode 122 can each be composed of a single layer of conductive material, or can be composed of multiple layers of conductive material. In the case of a single layer of conductive material, for example, the same material as the coil 110 is used, and in the case of multiple layers of conductive material, for example, a base layer of the same material as the coil 110 and a plating layer covering the base layer are used.

[0118] The first external electrode 121 is continuously provided with the first end surface 100el and the bottom surface 100b. According to the above-described structure, the first external electrode 121 is a so-called L-shaped electrode, and thus a solder tail can be formed in the first external electrode 121 when the inductor component 1 is mounted to a mounting substrate. Thus, the mounting strength of the inductor component 1 can be improved, and in addition, the mounting posture of the inductor component 1 can be further stabilized.

[0119] The first external electrode 121 has a first end surface portion 121e provided on the first end surface 100el and a first bottom surface portion 121b provided on the bottom surface 100b. The first end surface portion 121e is connected to the first bottom surface portion 121b. The first end surface portion 121e is embedded in the first end surface 100el in such a manner as to protrude from the first end surface 100el. The first bottom surface portion 121b is disposed on the bottom surface 100b in such a manner as to protrude from the bottom surface 100b. The first end surface portion 121e is connected to the second through-wiring 14 of the coil 110.

[0120] The first end surface portion 121e has a first portion 121el, a second portion 121e2, and a third portion 121e3 connected in this order in the Z direction. The first portion 121el is connected to the first bottom surface portion 121b on the bottom surface 100b. The second portion 121e2 is connected to the second through-wiring 14 within the base body 10. The first portion 121el, the second portion 121e2, and the third portion 121e3 are rectangular when viewed from the first end surface 100el in the X direction. The size of the Y direction of the first portion 121el, the size of the Y direction of the second portion 121e2, and the size of the Y direction of the third portion 121e3 are different from each other.

[0121] The second external electrode 122 is continuously provided with the second end surface 100e2 and the bottom surface 100b. According to the above-described structure, the second external electrode 122 is a so-called L-shaped electrode, and thus a solder tail can be formed in the second external electrode 122 when the inductor component 1 is mounted to a mounting substrate. Thus, the mounting strength of the inductor component 1 can be improved, and in addition, the mounting posture of the inductor component 1 can be further stabilized.

[0122] The second external electrode 122 has a second end face portion 122e disposed on the second end face 100e2 and a second bottom face portion 122b disposed on the bottom face 100b. The second end face portion 122e is connected to the second bottom face portion 122b. The second end face portion 122e is connected to the first through wiring 13 of the coil 110. The second end face portion 122e is embedded in the second end face 100e2 in a manner that exposes it. The second bottom face portion 122b is disposed on the bottom face 100b in a manner that protrudes from it.

[0123] The second end face portion 122e has a first portion 122e1, a second portion 122e2, and a third portion 122e3 connected sequentially along the Z direction. The first portion 122e1 is connected to the second bottom surface portion 122b at the bottom surface 100b. The second portion 122e2 is connected to the first through wiring 13 within the substrate 10. When viewed from the second end face 100e2 side in the X direction, the first portion 122e1, the second portion 122e2, and the third portion 122e3 are rectangular. The Y-direction dimensions of the first portion 122e1, the second portion 122e2, and the third portion 122e3 are different from each other.

[0124] (The overlapping area of ​​the first external electrode 121 and the overlapping area of ​​the second external electrode 122)

[0125] like Figure 2 As shown, when viewed from a direction orthogonal to the bottom surface 21b, the overlapping portion of the first external electrode 121 and the bottom surface wiring 11b ( Figure 2 The area of ​​the solid line (shown by the diagonal line) is greater than the area of ​​the overlapping portion of the first external electrode 121 and the top surface wiring 11t (shown by the diagonal line). Figure 2 The area of ​​the overlapping portion (shown by the diagonal line of the dashed line) is smaller. Specifically, the area of ​​the overlapping portion of the first bottom portion 121b and the bottom wiring 11b is smaller than the area of ​​the overlapping portion of the first bottom portion 121b and the top wiring 11t. As a result, the parasitic capacitance between the first bottom portion 121b and the bottom wiring 11b can be reduced.

[0126] The overlapping portion of the first external electrode 121 with the bottom surface wiring 11b and the top surface wiring 11t does not include the portion of the first external electrode 121 directly connected to the coil 110 (second through wiring 14) (the second portion 121e2) overlapping with the bottom surface wiring 11b and the top surface wiring 11t. This is because even if the second portion 121e2 overlaps with the bottom surface wiring 11b, the second portion 121e2 becomes at approximately the same potential as the bottom surface wiring 11b, thus the parasitic capacitance between the second portion 121e2 and the bottom surface wiring 11b is inherently smaller.

[0127] Furthermore, the second external electrode 122 has the same structure as the first external electrode 121. When viewed from a direction orthogonal to the bottom surface 21b, the overlap between the second external electrode 122 and the bottom surface wiring 11b is ( Figure 4A to Figure 4H The area of ​​the solid line (shown by the diagonal line) is greater than the area of ​​the overlap between the second external electrode 122 and the top surface wiring 11t (shown by the diagonal line). Figure 4A to Figure 4H The area of ​​the overlapping portion of the second bottom portion 122b and the bottom wiring 11b is smaller than that of the overlapping portion of the second bottom portion 122b and the top wiring 11t. This reduces the parasitic capacitance between the second bottom portion 122b and the bottom wiring 11b.

[0128] The overlapping portion of the second external electrode 122 with the bottom surface wiring 11b and the top surface wiring 11t does not include the portion of the second external electrode 122 that is directly connected to the coil 110 (first through wiring 13) (the second part 122e2) overlapping with the bottom surface wiring 11b and the top surface wiring 11t. This is because even if the second part 122e2 overlaps with the bottom surface wiring 11b, the second part 122e2 becomes to approximately the same potential as the bottom surface wiring 11b, and therefore the parasitic capacitance between the second part 122e2 and the bottom surface wiring 11b is inherently smaller.

[0129] (Manufacturing method of inductor component 1)

[0130] Next, use Figure 2 The manufacturing method of inductor component 1 will be described. Figure 4A Is with Figure 4B The diagram corresponding to the BB section.

[0131] like Figure 4C As shown, a glass substrate 1021 is prepared to become substrate 21. The glass substrate 1021 is a single-layer glass plate. Multiple through holes V are provided at predetermined positions on the glass substrate 1021. At this time, the glass substrate 1021 is opened by laser processing, or it can be opened by dry or wet etching, or by mechanical processing such as drilling.

[0132] like Figure 4DAs shown, a seed layer (not shown) is formed on the entire surface of the glass substrate 1021. A copper layer is formed on the seed layer by electroplating. The seed layer and the copper layer on the top and bottom surfaces of the glass substrate 1021 are removed by wet etching or dry etching. As a result, a through conductor layer 1014, which becomes the second through wiring 14, is formed in the through hole V of the glass substrate 1021. In addition, a third base layer 1121e3 is formed as the base of the third portion 121e3 of the first end face portion 121e. At this time, although not shown, a through conductor layer, which becomes the first through wiring 13, is similarly formed in the through hole V, and a third base layer is formed as the base of the third portion 122e3 of the second end face portion 122e.

[0133] In addition, CMP processing and machining can be used to remove the copper layer. Furthermore, conductive resin can be filled into the voids within the through-hole V after partial plating.

[0134] like Figure 4E As shown, a seed layer (not shown) is formed on the entire surface of the glass substrate 1021, and a patterned photoresist is formed on the seed layer. Next, a copper layer is formed on the seed layer at the opening of the photoresist by electroplating. Then, the photoresist and the seed layer are removed by wet etching or dry etching. As a result, a bottom conductor layer 1011b, patterned into an arbitrary shape, which becomes the bottom surface wiring 11b, and a top conductor layer 1011t, which becomes the top surface wiring 11t, are formed. In addition, a second base layer 1121e2 is formed as the base of the second portion 121e2 of the first end face portion 121e. At this time, although not shown, a second base layer is similarly formed as the base of the second portion 122e2 of the second end face portion 122e.

[0135] like Figure 4F As shown, an insulating resin layer 1022, forming an insulating layer 22, is applied to the top and bottom surfaces of the glass substrate 1021 and then cured to cover the conductor layer. Figure 4G As shown, a hole 1022a is formed on the second base layer 1121e2 of the insulating resin layer 1022 on the bottom side using laser processing.

[0136] like Figure 4HAs shown, a seed layer not shown is provided on the insulating resin layer 1022 on the bottom surface side, and a patterned photoresist is formed on the seed layer. Next, a copper layer is formed on the seed layer in the opening portion of the photoresist by electroplating. Then, the photoresist and the seed layer are removed by wet etching or dry etching. Thus, the first bottom surface base layer 1121b, which is a base of the first bottom surface portion 121b, and the second bottom surface base layer 1122b, which is a base of the second bottom surface portion 122b, are formed in a patterned arbitrary shape. In addition, the first base layer 1121e1, which is a base of the first portion 121e1 of the first end surface portion 121e, is formed in the hole 1022a. At this time, although not shown, similarly, the first base layer, which is a base of the first portion 122e1 of the second end surface portion 122e, is formed in the hole of the insulating resin layer 1022 on the bottom surface side.

[0137] As shown, the dicing is performed along the dicing line C, and as shown, the plating layer 1121, 1122 is formed by barrel plating so as to cover each base layer. That is, the first bottom surface base layer 1121b, the first base layer 1121e1, the second base layer 1121e2, and the third base layer 1121e3 are covered by the plating layer 1121, and the first external electrode 121 is formed. In addition, the second bottom surface base layer 1122b and the first base layer, the second base layer, and the third base layer connected to the second bottom surface base layer 1122b are covered by the plating layer 1122, and the second external electrode 122 is formed. Thus, the inductor component 1 is manufactured. Figure 5 Figure 5 The plating layer 1121, 1122 is composed of, for example, two layers of Ni / Sn. In addition, the plating layer 1121, 1122 can also be composed of, for example, a plurality of layers of Cu / Ni / Au, Cu / Ni / Pd / Au, or the like. In addition, as the external electrode, the plating layer can not be provided and only the base layer can be provided, as long as a suitable optimum material is selected from the viewpoint of rust prevention or solder wettability, electromigration resistance, or the like.

[0138] In addition, in the above manufacturing method, a glass substrate is used as the base, but a sintered material can also be used as the base. In this case, the inductor wiring of one turn or less is formed by printing using a conductive paste. Here, as the conductive paste, a material having a good conductivity such as Ag, Cu, or the like is selected.

[0139] Next, an insulating paste such as glass, ferrite, or the like is printed, and this operation is repeated. By forming an opening portion in which a connection portion to the inductor wiring is opened in the above insulating paste, and filling the conductive paste in the opening portion, the connection portion of the inductor wiring between the layers can be electrically connected.

[0140]

[0141] ​​Then, after heat treatment at a high temperature to sinter the insulating paste, the insulating paste is divided, external terminals are formed, and an inductor component is manufactured. If the insulating paste is made of a material such as glass that has high insulation, an inductor component with a high Q can be obtained even at a high frequency. If the insulating paste is made of ferrite, an inductor component with a high inductance can be obtained.

[0142] 3. Modification

[0143] (First Modification)

[0144] Figure 6 is a schematic bottom view of the inductor component of the first modification as viewed from the bottom surface 100b (bottom surface 21b) side.

[0145] As shown in Figure 6 , in the inductor component of the first modification, a plurality of bottom surface wires 11b and a plurality of top surface wires 11t are present. As viewed from a direction orthogonal to the bottom surface 21b, the first end portion of one bottom surface wire 11b overlaps the first end portion of one top surface wire 11t, one bottom surface wire 11b and one top surface wire 11t constitute a group, and a plurality of groups are present. As viewed from a direction orthogonal to the bottom surface 21b, the angle formed by the bottom surface wire 11b and the top surface wire 11t of at least one group is different from the angle formed by the bottom surface wire 11b and the top surface wire 11t of the other groups. Specifically, the first angle θ1 formed by the bottom surface wire 11b and the top surface wire 11t of the first group is different from the second angle θ2 formed by the bottom surface wire 11b and the top surface wire 11t of the second group. Here, if the above angles are changed, the length of the coil 110 changes, and the inductance changes.

[0146] According to the above structure, the first angle θ1 and the second angle θ2 are different, so the length of the coil 110 can be changed flexibly, and an inductor component with a desired inductance can be easily obtained. Furthermore, the angles formed by the bottom surface wire 11b and the top surface wire 11t of all groups can also be different from each other.

[0147] (Second Modification)

[0148] Figure 2 is a schematic bottom view of the inductor component of the second modification as viewed from the bottom surface 100b (bottom surface 21b) side.

[0149] As shown in Figure 2As shown, in the inductor component of the second modified example, there are multiple bottom surface wirings 11b, and multiple first through wirings 13 and multiple second through wirings 14. A bottom surface wiring 11b and a first through wiring 13 and a second through wiring 14 connected to both ends of a bottom surface wiring 11b respectively constitute a group, and multiple groups exist. Viewed from a direction orthogonal to the bottom surface 21b, the extension direction of the bottom surface wiring 11b connected to at least one group of first through wirings 13 and second through wirings 14 is orthogonal to the AX axis of the coil 110, and at least one group of first through wirings 13 and second through wirings 14 is configured to be linearly symmetrical with respect to the AX axis of the coil 110. Specifically, the bottom surface wiring 11b and... Figure 7 The difference lies in the shape, which extends along the Y direction, and the top surface wiring 11t. Figure 7 Unlike others, it is slightly tilted in the X direction and extends along the Y direction.

[0150] According to the above structure, compared with the case where the extension direction of the bottom wiring 11b is inclined relative to the axial direction of the coil 110, the size of the axial direction of the coil 110 can be reduced, thereby enabling the inductor component to be miniaturized.

[0151] Furthermore, it is preferable that more than half of the first through wiring 13 and second through wiring 14 are configured to be linearly symmetrical with respect to the axis AX of the coil 110, and more preferably that all the first through wiring 13 and second through wiring 14 are configured to be linearly symmetrical with respect to the axis AX of the coil 110, thereby further reducing the size of the coil 110 in the axis AX direction.

[0152] (Third variation)

[0153] Figure 8 This is an XZ sectional view showing a third modified example of an inductor component.

[0154] like Figure 8 As shown, in the inductor component of the third variation, the first through wiring 13 is composed of multiple conductive layers 131 to 134, and at least one conductive layer is mainly composed of copper.

[0155] Specifically, the first through wiring 13 is composed of four conductive layers 131 to 134. The first conductive layer 131, the second conductive layer 132, the third conductive layer 133, and the fourth conductive layer 134 are arranged in this order from the radially outer side toward the inner side. The first conductive layer 131, the second conductive layer 132, and the third conductive layer 133 are each formed in a circular ring shape, and the fourth conductive layer 134 is formed in a circular column shape. The first conductive layer 131 has titanium as a main component, the second conductive layer 132 and the third conductive layer 133 have copper as a main component, and the fourth conductive layer 134 contains silver and copper. The first conductive layer 131, the second conductive layer 132, the third conductive layer 133, and the fourth conductive layer 134 are formed in this order in the through-hole V by plating or the like.

[0156] According to the above structure, at least one of the conductive layers has copper as a main component, and thus the conductivity of copper is high, and the direct current resistance of the first through wiring 13 can be suppressed. Further, at least one of the first through wiring 13 and the second through wiring 14 is composed of a plurality of conductive layers, and at least one of the conductive layers has copper as a main component.

[0157] As another modification example, at least one of the conductive layers can also be composed of a conductive resin. Specifically, the fourth conductive layer 134 can also be composed of a conductive resin. The fourth conductive layer 134 is formed in the through-hole V by applying a conductor paste or the like. Thus, the through-hole V can be easily filled with the conductive resin.

[0158] Further, at least one of the conductive layers can also have a void S. It is preferable that the conductive layer located at the radially innermost side has the void S. Specifically, the fourth conductive layer 134 has the void S. Thus, stress can be alleviated by the void S.

[0159] (Fourth Modification Example)

[0160] Figure 4B is an XZ sectional view showing a fourth modification example of the inductor component.

[0161] As shown in Figure 4C , in the inductor component of the fourth modification example, as viewed from a direction orthogonal to the bottom surface 21b, the upper surface 11b1 of the portion of the bottom surface wiring 11b that overlaps with the end surface 13b of the first through wiring 13 on the bottom surface wiring 11b side connected to the first through wiring 13 has a recess. Thus, the upper surface 11b1 of the bottom surface wiring 11b has a recess, and thus the area of the upper surface 11b1 of the bottom surface wiring 11b is increased, and the adhesion to the insulating layer 22 can be improved. Further, the upper surface of the portion of the bottom surface wiring 11b that overlaps with the end surface of the second through wiring 14 can also have a recess.

[0162] Similarly, the upper surface 11t1 of the portion of the top surface wiring 11t that overlaps with the end surface 13t of the first through wiring 13 on the top surface wiring 11t side connected to the top surface wiring 11t has a recess when viewed in a direction orthogonal to the top surface 21t. Thus, the upper surface 11t1 of the top surface wiring 11t has a recess, and the area of the upper surface 11t1 of the top surface wiring 11t is increased, and the adhesion to the insulating layer 22 can be improved. Also, the upper surface of the portion of the top surface wiring 11t that overlaps with the end surface of the second through wiring 14 can also have a recess.

[0163] As a method of forming a recess in the upper surface 11b1 of the bottom surface wiring 11b and the upper surface 11t1 of the top surface wiring 11t, for example, in the case where the copper layer is not removed, as shown in FIG. 10B, the bottom surface conductor layer 1011b and the top surface conductor layer 1011t are formed, and thus the shape of the upper surfaces of the bottom surface conductor layer 1011b and the top surface conductor layer 1011t corresponding to the through hole V can be made into a recessed shape. Figure 9 Figure 9 As a method of forming a recess in the upper surface 11b1 of the bottom surface wiring 11b and the upper surface 11t1 of the top surface wiring 11t, for example, in the case where the copper layer is not removed, as shown in FIG. 10B, the bottom surface conductor layer 1011b and the top surface conductor layer 1011t are formed, and thus the shape of the upper surfaces of the bottom surface conductor layer 1011b and the top surface conductor layer 1011t corresponding to the through hole V can be made into a recessed shape.

[0164] <Second Embodiment>

[0165] Figure 9 is a schematic bottom view of the second embodiment of the inductor component viewed from the bottom surface side. In Figure 9 , for convenience, the insulating layer of the base body is omitted and depicted, and a portion (a bottom surface portion) of the external electrode is depicted with a two-dot chain line. The second embodiment differs from the first embodiment in the position of the axis of the coil. The different structure will be described below. The other structures are the same as those of the first embodiment, and the same reference numerals are assigned and the description thereof is omitted.

[0166] As shown in Figure 9 , in the inductor component 1A of the second embodiment, the axis AX of the coil 110 is perpendicular to the X direction. Specifically, the axis AX is parallel to the Y direction. Thus, the interference of the first external electrode 121 and the second external electrode 122 with the magnetic flux of the coil 110 can be reduced, and the efficiency of obtaining inductance can be improved.

[0167] In the inductor component 1A of the second embodiment, as with the first embodiment, the area of the overlapping portion of the first external electrode 121 and the bottom surface wiring 11b (indicated by the oblique line of the solid line of Figure 9 ) is smaller than the area of the overlapping portion of the first external electrode 121 and the top surface wiring 11t (indicated by the oblique line of the broken line of Figure 9 ). Thus, the parasitic capacitance between the first external electrode 121 (the first bottom surface portion 121b) and the bottom surface wiring 11b can be reduced.

[0168] ​In addition, the area ratio of the overlapping portion of the second external electrode 122 and the bottom surface wiring 11b (indicated by the solid diagonal line of the second external electrode 122) is smaller than the area ratio of the overlapping portion of the second external electrode 122 and the top surface wiring 11t (indicated by the broken diagonal line of the second external electrode 122) as viewed in the direction orthogonal to the bottom surface 21b. Thus, the parasitic capacitance between the second external electrode 122 (the second bottom surface portion 122b) and the bottom surface wiring 11b can be reduced. ​ ​

[0169] Further, although not illustrated, the axis AX of the coil 110 can also be perpendicular with respect to the bottom surface 100b of the base 10, whereby the obstruction of the magnetic flux of the coil 110 by the first external electrode 121 and the second external electrode 122 can be reduced, and the efficiency of obtaining the inductance can be improved.

[0170] Further, the present disclosure is not limited to the above-described embodiments, and design changes can be made within the scope of the gist of the present disclosure. For example, the characteristic points of the first embodiment and the second embodiment can each be variously combined.​​

Claims

1. An inductor component, wherein, Possessing: a base body; a coil provided to the base body and wound in a spiral shape along an axis; and a first external electrode and a second external electrode provided to the base body and electrically connected to the coil, the base body includes a substrate having a first main surface and a second main surface facing each other, and an insulating layer provided on the first main surface, the coil includes: a first coil wiring provided on the first main surface and covered by the insulating layer; a second coil wiring provided on the second main surface; and a first through wiring and a second through wiring provided to pass through the substrate from the first main surface to the second main surface and arranged on opposite sides with respect to the axis, the first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are sequentially connected, thereby constituting at least a part of the spiral shape, at least a part of the first external electrode is provided above the first coil wiring and provided to the insulating layer in a manner separated from the first coil wiring, when viewed from a direction orthogonal to the first main surface, the first external electrode overlaps each of the first coil wiring and the second coil wiring, and an area of an overlapping portion of the first external electrode and the first coil wiring is smaller than an area of an overlapping portion of the first external electrode and the second coil wiring, a plurality of the first coil wiring and the second coil wiring exist respectively, when viewed from a direction orthogonal to the first main surface, a first end portion of one first coil wiring overlaps a first end portion of one second coil wiring, the one first coil wiring and the one second coil wiring constitute a group, and a plurality of the group exist, when viewed from a direction orthogonal to the first main surface, an angle formed by the first coil wiring and the second coil wiring of at least one group is different from an angle formed by the first coil wiring and the second coil wiring of another group, at least one of the first through wiring and the second through wiring is constituted by three or more conductive layers.

2. An inductor component, wherein, Possessing: a base body; a coil provided to the base body and wound in a spiral shape along an axis; and a first external electrode and a second external electrode provided to the base body and electrically connected to the coil, the base body includes a substrate having a first main surface and a second main surface facing each other, and an insulating layer provided on the first main surface, the coil includes: a first coil wiring provided on the first main surface and covered by the insulating layer; a second coil wiring provided on the second main surface; and a first through wiring and a second through wiring provided to pass through the substrate from the first main surface to the second main surface and arranged on opposite sides with respect to the axis, the first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are sequentially connected, thereby constituting at least a part of the spiral shape, at least a part of the first external electrode is provided above the first coil wiring and provided to the insulating layer in a manner separated from the first coil wiring, the first external electrode overlaps each of the first coil wiring and the second coil wiring, and an area of an overlapping portion of the first external electrode and the first coil wiring is smaller than an area of an overlapping portion of the first external electrode and the second coil wiring, as viewed in a direction orthogonal to the first main surface, at least one of the first through wiring and the second through wiring is composed of a plurality of conductive layers, at least one of the conductive layers is composed of a conductive resin.

3. The inductor component according to claim 1 or 2, wherein a material of the substrate is glass.

4. The inductor component according to claim 3, wherein the substrate contains an Si element.

5. The inductor component according to claim 1 or 2, wherein the first through wiring and the second through wiring extend in a direction orthogonal to the first main surface.

6. The inductor component according to claim 1 or 2, wherein a thickness of the insulating layer is 1 / 3 or less of a thickness of the substrate, a dielectric constant of the insulating layer is smaller than a dielectric constant of the substrate.

7. The inductor component according to claim 1 or 2, wherein the first coil wiring extends in only one direction.

8. The inductor component according to claim 1 or 2, wherein the second coil wiring extends in only one direction.

9. The inductor component according to claim 1 or 2, wherein a first end portion of the first coil wiring overlaps a first end portion of the second coil wiring, as viewed in a direction orthogonal to the first main surface, an angle formed by the first coil wiring and the second coil wiring is an acute angle.

10. The inductor component according to claim 9, wherein the angle is 5 degrees or more and 45 degrees or less.

11. The inductor component according to claim 1 or 2, wherein a plurality of the first coil wirings exist, a plurality of the first through wirings and the second through wirings exist, respectively, one first coil wiring and one first through wiring and one second through wiring connected to both end portions of the one first coil wiring, respectively, constitute one group, and a plurality of the groups exist, an extension direction of the first coil wiring connected to the first through wiring and the second through wiring of at least one group is orthogonal to an axial direction of the coil, as viewed in a direction orthogonal to the first main surface, and the first through wiring and the second through wiring of the at least one group are arranged to be line-symmetric with respect to the axial direction of the coil.

12. The inductor component according to claim 1 or 2, wherein a plurality of the second coil wirings exist, a plurality of the first through wirings and the second through wirings exist, respectively, one second coil wiring and one first through wiring and one second through wiring connected to both end portions of the one second coil wiring, respectively, constitute one group, and a plurality of the groups exist, The extension direction of the second coil wire connected to the first through-wiring and the second through-wiring of at least one group is orthogonal to the axial direction of the coil when viewed from a direction orthogonal to the first main surface, and the first through-wiring and the second through-wiring of the at least one group are arranged to be line-symmetric with respect to the axis of the coil.

13. The inductor component according to claim 1 or 2, wherein The shape of a cross section of at least one of the first through-wiring and the second through-wiring orthogonal to the extension direction is circular.

14. The inductor component according to claim 1 or 2, wherein At least one of the first through-wiring and the second through-wiring is composed of a plurality of conductive body layers, At least one of the conductive body layers has copper as a main component.

15. The inductor component according to claim 1 or 2, wherein An upper surface of a portion of the first coil wire that overlaps with an end surface on the first coil wire side of a through-wiring connected to the first coil wire has a recess when viewed from a direction orthogonal to the first main surface.

16. The inductor component according to claim 1 or 2, wherein The base body is a cuboid shape having a length, a width, and a height, The inductor component has a volume of 0.08mm 3 In the following, The length of the long side of the inductor component is 0.65 mm or less.

17. The inductor component according to claim 1 or 2, wherein The first coil wire, the second coil wire, the first through-wiring, and the second through-wiring have copper as a main component.

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