Transfer head and manufacturing method thereof

Abstract

The present invention relates to a transfer head and a method for manufacturing the same. The first bottom surface of the transfer head is provided with a protrusion for picking up a chip to be transferred, and at least a portion of the protrusion is provided with a support member. The provision of the support member can enhance the supporting strength of the protrusion, so that when the chip passes through the transfer head to the display backplane, deformation and twisting of the protrusion due to heat and external pressure can be avoided as much as possible, thereby avoiding the situation where the light output effect is affected by poor consistency of the chip transferred to the display backplane.

Description

Technical Field

[0001] The present invention relates to the field of chip transfer, and in particular to a transfer head and a manufacturing method thereof. Background Art

[0002] Micro LED is sought after by various manufacturers due to its advantages such as high brightness, wide color gamut coverage and high contrast ratio. It is called the next-generation display device and its popularity has continued to rise in recent years; however, there are still many problems to overcome in the actual production process. For example, the Micro LED display panel includes several pixel areas. In some application scenarios, each pixel area includes a red LED chip, a blue LED chip, and a green LED chip. In the production process of the Micro LED display panel, a transfer head is required to transfer the red, green and blue LED chips from their respective growth substrates to the display backplane and electrically connect them to the corresponding pads on the display backplane through a bonding process. The currently used bonding process generally requires heating (mostly above 150°C) to achieve the connection between the LED chip and the display backplane through a simple metal solder.

[0003] Currently, transfer tips are typically made of polydimethylsiloxane (PDMS), a thermoplastic material that easily deforms under heat and external pressure. Consequently, the bumps on the PDMS transfer tip used to pick up LED chips can easily deform and twist during the process of picking up and transferring the picked-up LED chips to the display backplane for soldering. This can affect the consistency of the LED chip angle after soldering, ultimately impacting the display panel's lighting quality. Furthermore, the transfer tip's lifespan is shortened, leading to increased costs.

[0004] Therefore, how to prevent the protrusions on the transfer head from being easily deformed is an urgent problem to be solved. Summary of the Invention

[0005] In view of the above-mentioned deficiencies in the prior art, the purpose of this application is to provide a transfer head and a method for manufacturing the same, aiming to solve the problem in the related art that the protrusions on the transfer head are easily deformed.

[0006] A transfer head, comprising:

[0007] A carrier substrate having a first top surface and a first bottom surface opposite to each other;

[0008] at least one protrusion provided on the first bottom surface for picking up the chip to be transferred;

[0009] A support member is provided in at least one of the protrusions and is used to enhance the supporting strength of the protrusion.

[0010] In the above-mentioned transfer head, the first bottom surface of the transfer head is provided with a protrusion for picking up the chip to be transferred, and at least a part of the protrusion is provided with a support member. The setting of the support member can enhance the supporting strength of the protrusion, so that when the chip passes through the transfer head to the display backplane, the deformation and distortion of the protrusion caused by heat and external pressure can be avoided as much as possible, thereby avoiding the situation where the light output effect is affected by the poor consistency of the chip transferred to the display backplane, and the display effect can be improved.

[0011] Based on the same inventive concept, the present application also provides a method for manufacturing the above-mentioned transfer head, comprising:

[0012] forming a transfer head pattern on the third top surface of the template substrate, the transfer head pattern comprising at least one groove recessed from the third top surface toward the third bottom surface of the template substrate, the third top surface being opposite to the third bottom surface and close to the first bottom surface;

[0013] forming the protrusions in the grooves, forming the carrier substrate on the third top surface, and arranging the support member in at least one of the protrusions;

[0014] The template substrate is removed.

[0015] At least a portion of the protrusions of the transfer head manufactured by the above-mentioned transfer head manufacturing method is provided with a support member. The setting of the support member can enhance the supporting strength of the protrusions, so that when the chip is transferred from the transfer head to the display backplane, the deformation and twisting of the protrusions due to heat and external pressure can be avoided as much as possible, thereby improving the consistency of the chip transferred to the display backplane and improving the display effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1-1 A schematic diagram of a display backplane equipped with a light-emitting chip;

[0017] Figure 1-2 A top view of a growth substrate on which a light-emitting chip is grown;

[0018] Figure 1-3 A side view of a growth substrate on which a light-emitting chip is grown;

[0019] Figure 1-4 A side view of the growth substrate with the light-emitting chip grown thereon being bonded to the temporary substrate;

[0020] Figure 1-5 Schematic diagram of peeling off the growth substrate;

[0021] Figure 1-6 This is a side view of the light-emitting chip after it is transferred to the temporary substrate;

[0022] Figure 1-7This is a top view of the light-emitting chip after it is transferred to the temporary substrate;

[0023] Figure 1-8 A side view of the transfer head and the light-emitting chip on the temporary substrate;

[0024] Figure 1-9 A side view of the light-emitting chip bonded to the display backplane;

[0025] Figure 2-1 A schematic structural diagram of a carrier substrate and a protrusion provided in an embodiment of the present application;

[0026] Figure 2-2 Schematic diagram 1 of an embodiment of the present application showing a support member disposed within a portion of a protrusion;

[0027] Figure 2-3 Schematic diagram 1 of providing support members in each protrusion according to an embodiment of the present application;

[0028] Figure 2-4 Schematic diagram 2 of providing support members in each protrusion according to an embodiment of the present application;

[0029] Figure 3-1 Schematic diagram 1 of a support substrate and a support member provided in an embodiment of the present application;

[0030] Figure 3-2 Schematic diagram 2 of the support substrate and support member provided in an embodiment of the present application;

[0031] Figure 4 Schematic diagram 3 of providing support members in each protrusion according to an embodiment of the present application;

[0032] Figure 5-1 Schematic diagram of providing support members in each protrusion provided in the embodiment of the present application Figure 4 ;

[0033] Figure 5-2 Schematic diagram 5 of providing support members in each protrusion according to an embodiment of the present application;

[0034] Figure 5-3 Schematic diagram 2 of an embodiment of the present application showing a support member disposed within a portion of a protrusion;

[0035] Figure 6 Schematic diagram 1 of a transfer head manufacturing method according to another embodiment of the present application;

[0036] Figure 7-1 Schematic diagram 2 of the process of manufacturing a transfer head according to another embodiment of the present application;

[0037] Figure 7-2 for Figure 7-1 Schematic diagram of the corresponding transfer head manufacturing process;

[0038] Figure 7-3 A schematic diagram of a release agent layer provided in another embodiment of the present application;

[0039] Figure 7-4 A schematic diagram of a support substrate provided in another embodiment of the present application;

[0040] Figure 7-5 A schematic diagram of forming a support member on a support substrate according to another embodiment of the present application;

[0041] Figure 8-1 Schematic diagram 3 of the process flow of the transfer head manufacturing method provided in another embodiment of the present application;

[0042] Figure 8-2 for Figure 8-1 Schematic diagram of the corresponding transfer head manufacturing process;

[0043] Figure 9-1 Schematic diagram of the transfer head manufacturing method provided in another embodiment of the present application Figure 4 ;

[0044] Figure 9-2 for Figure 9-1 Schematic diagram of the corresponding transfer head manufacturing process;

[0045] Description of reference numerals:

[0046] 01-red chip growth substrate, 02-blue chip growth substrate, 03-green chip growth substrate, 05-display backplane, 06-red Micro-LED chip, 07-temporary substrate, 08-transfer head, 11-carrying substrate, 110-carrying substrate layer, 12-bump, 120-bump layer, 21-support member, 22-support substrate, 31-template substrate, 32-groove, 4-release agent layer. DETAILED DESCRIPTION

[0047] To facilitate understanding of the present application, a more comprehensive description of the present application will be provided below with reference to the accompanying drawings. The accompanying drawings illustrate preferred embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the disclosure of the present application.

[0048] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0049] In the related art, when using Micro-LED chips to make display panels, see Figure 1-1 As shown, the red Micro-LED chip, blue Micro-LED chip and green Micro-LED chip need to be transferred from the red chip growth substrate 01, the blue chip growth substrate 02 and the green chip growth substrate 03 to the display backplane 05 respectively. The following is an example of the process of transferring one color of Micro-LED chip. Figure 1-2 and Figure 1-9 As shown, Figure 1-2 and Figure 1-3 The red chip growth substrate 01 with the red Micro-LED chip 06 is shown. Figure 1-4 and Figure 1-5 As shown, the red Micro-LED chip 06 is transferred from the growth substrate 01 to the temporary substrate 07 through the temporary substrate 07. The temporary substrate 07 after transfer is shown in FIG. Figure 1-6 and Figure 1-7 As shown, see Figure 1-8 and Figure 1-9 As shown, the red Micro-LED chip 06 is then transferred from the temporary substrate 07 to the display backplane 05 via a transfer head 08 for bonding. The transfer head 08 is generally made of PDMS. During this process, the protrusions on the transfer head 08 that adsorb the chip are easily deformed and distorted by heat and external pressure, thus affecting the consistency of the angle of the LED chip after welding. Figure 1-1 The chip indicated by the cross in the middle will eventually affect the luminous effect of the display panel and shorten the service life of the transfer head, resulting in increased costs.

[0050] Based on this, the present application hopes to provide a solution that can solve the above technical problems, the details of which will be explained in the subsequent embodiments.

[0051] This embodiment provides a transfer head, which includes:

[0052] The carrier substrate has a first top surface and a first bottom surface opposite to each other, for example, see Figure 2-1 The carrier substrate 11 shown has a first top surface T1 and a first bottom surface B1 that are opposite to each other;

[0053] At least one protrusion is provided on the first bottom surface of the carrier substrate, and is used to pick up the chip to be transferred. In this embodiment, the chip to be transferred may include, but is not limited to, an LED chip, and the LED chip may be, but is not limited to, a micro-light-emitting chip. The micro-light-emitting chip in this embodiment refers to a micron-level light-emitting chip, such as, but not limited to, at least one of a Mini LED chip and a Micro LED chip. Of course, the micro-light-emitting chip can be replaced with a chip of other sizes as needed, which will not be described here. The chip in this embodiment is not limited to a light-emitting chip and can be replaced with other equivalent chips as needed.

[0054] In this embodiment, the number of protrusions provided on the carrier substrate can be flexibly set, and can be set to one protrusion according to application requirements, or can be set to two or more protrusions according to requirements, for example, see Figure 2-1 As shown, a plurality of protrusions 12 are provided on the carrier substrate 11 (of course, only one protrusion 12 can be provided as required), and the spacing between each protrusion 12 can be flexibly set according to specific application requirements, for example, it can be set according to but not limited to the corresponding pad layout in the chip bonding area on the display backplane.

[0055] In this embodiment, the transfer head further includes a support member disposed in at least one protrusion for enhancing the support strength of the protrusion. Figure 2-2 As shown, in some examples of this embodiment, support members 21 for enhancing support strength may be provided within a portion of the protrusions 12 on the carrier substrate 11, while no support member may be provided within another portion of the protrusions 12. In still other examples, support members 21 may be provided within each protrusion 12 on the carrier substrate 11. It should be understood that the shape and size of the support members 21 in this embodiment match the shape and size of the corresponding protrusions 12, so that the support members 21 can be embedded within the protrusions 12 and that when the protrusions 12 pick up the chip to be transferred, the outer surface of the protrusions 12 directly contacts the chip to be picked up.

[0056] In one example of this embodiment, see Figure 2-2 to Figure 2-4 As shown, the transfer head may include a plurality of mutually separated and independent support members 21, each support member 21 being embedded in its corresponding protrusion 12. One end of the support member 21 close to the first top surface T1 of the carrier substrate 11 (i.e., the upper end of the support member 21) may be flush with the first bottom surface B1 of the carrier substrate 11 (e.g., see Figure 2-3 ), or may be located between the first bottom surface B1 and the first top surface T1 (see, for example Figure 2-2 ), or flush with the first top surface T1 (see Figure 2-4 shown).

[0057] In another example of this embodiment, in order to further improve the overall strength of the transfer head, the transfer head further includes a support substrate having a second top surface and a second bottom surface opposite to each other, the second bottom surface of the support substrate facing the first bottom surface of the carrier substrate, and a support member fixedly arranged on the second bottom surface, that is, an end of the support member close to the first top surface (that is, the upper end of the support member) is fixed to the second bottom surface of the support substrate. For example, see Figure 3-1 As shown, a plurality of support members 21 are arranged on a support substrate 22 , and the support substrate 22 has a second top surface T2 and a second bottom surface B2 opposite to each other. The upper ends of the plurality of support members 21 are fixed on the second bottom surface B2 of the support substrate 22 . Figure 3-1 In the embodiment, the plurality of support members 21 on the support substrate 22 correspond to the plurality of protrusions 12 on the carrier substrate 11. Of course, in some examples, the number of support members 21 on the support substrate 22 may be less than the number of protrusions 12 on the carrier substrate 11, see Figure 3-2 shown.

[0058] See also Figure 4 In this example, Figure 3-1 The plurality of support members 21 on the support substrate 22 shown are embedded in the plurality of protrusions 12 on the carrier substrate 11. In one example of this embodiment, the support substrate 22 can be superimposed on the carrier substrate 11, and the second bottom surface B2 of the support substrate 22 contacts the first top surface T1 of the carrier substrate 11, for example, see Figure 5-1 shown.

[0059] In another example of this embodiment, at least a portion of the support substrate 22 may be embedded in the carrier substrate 11; for example, see Figure 5-2 As shown, the support substrate 22 is completely embedded in the carrier substrate 11 , and the second top surface T2 and the second bottom surface B2 of the support substrate 22 are located between the first top surface T1 and the first bottom surface B1 of the carrier substrate 11 .

[0060] Another application example of this embodiment is shown in Figure 4 As shown, a portion of the support substrate 22 is embedded in the carrier substrate 11 , and the second bottom surface B2 of the support substrate 22 is located between the first top surface T1 and the first bottom surface B1 of the carrier substrate 11 , and the second top surface T2 is located above the first top surface T1 of the carrier substrate 11 .

[0061] Another application example of this embodiment is shown in FIG. Figure 5-3 As shown, the supporting substrate 22 is embedded in the carrier substrate 11, the second bottom surface B2 of the supporting substrate 22 is flush with the first bottom surface B1 of the carrier substrate 11 (i.e., coplanar), and the second top surface T2 of the supporting substrate 22 is flush with the first top surface T1 of the carrier substrate 11 (i.e., coplanar).

[0062] It should be understood that the materials of the protrusion and the carrier substrate in this embodiment can be flexibly set, and the two can be the same or different. In some application examples, the protrusion and the carrier substrate are made of the same material and can be integrally formed, for example, see Figure 2-1 As shown. In this embodiment, the protrusion can form adhesion through but not limited to direct contact with the chip to be transferred, and the chip to be transferred is separated from the chip on the temporary substrate or growth substrate by the adhesion force, and transferred to the display backplane or other circuit board. At this time, the choice of the material of the protrusion can meet the adhesion between the protrusion and the chip to be transferred, which is greater than the bonding force between the chip to be transferred and the temporary substrate or growth substrate to achieve chip pickup, and is less than the bonding force between the chip to be transferred and the display backplane or other circuit board after the chip to be transferred is transferred to the display backplane or other circuit board and bonding is completed, so as to complete the release of the chip to be transferred. For example, in one example, the material of the protrusion can include but is not limited to PDMS, and the carrier substrate can also be used but is not limited to PDMS. Of course, it can also be replaced with other materials that meet the above conditions.

[0063] It should be understood that the material of the support member in this embodiment can also be flexibly set, as long as it can meet the support strength requirements of the lifting protrusion. For example, in some application examples, the material of the support member can include but is not limited to quartz, sapphire, glass, or metal. In addition, in this embodiment, when the transfer head includes a support substrate, the support substrate and the support member can be integrally formed. Of course, depending on the application requirements, it can also be set to non-integrated.

[0064] The transfer head provided in this embodiment is provided with a support member inside the protrusion for picking up the chip to be transferred, thereby enhancing the supporting strength of the protrusion, thereby preventing the protrusion from being deformed and twisted under heat and external pressure as much as possible, ensuring the consistency of the chip transferred by the transfer head and improving its display effect.

[0065] Another optional embodiment:

[0066] For ease of understanding, this embodiment provides a method for manufacturing the transfer head shown in the above embodiment. It should be understood that this manufacturing method is merely an example for ease of understanding, and the manufacturing of the transfer head is not limited to the manufacturing method shown in this embodiment.

[0067] The method for making the transfer head in this embodiment can be found in Figure 6 As shown, it includes but is not limited to:

[0068] S601: forming a transfer head pattern on the third top surface of the template substrate.

[0069] It should be understood that the material of the template substrate in this embodiment can be flexibly adopted, for example, it can be but not limited to a silicon substrate, a quartz substrate, a sapphire substrate, a glass substrate, a metal substrate, etc.

[0070] In this embodiment, the template substrate has a third top surface and a third bottom surface facing each other, with the third top surface being adjacent to the first bottom surface of the carrier substrate. The transfer head pattern formed on the template substrate includes at least one groove recessed from the third top surface toward the third bottom surface of the template substrate, the groove being used to form a protrusion of the transfer head.

[0071] S602: forming a protrusion in the groove, forming a carrier substrate on the third top surface, and disposing a support member in at least one protrusion.

[0072] In an example of this embodiment, forming a protrusion in the groove, forming a carrier substrate on the third top surface, and disposing a support member in at least one protrusion may include:

[0073] A raised layer is filled in the groove to form a raised portion, a support member is arranged in the raised layer, and then a carrier substrate layer is arranged on the third top surface to form a carrier substrate, and the raised layer and the carrier substrate layer are solidified; that is, in this example, the raised layer can be arranged first, and after the corresponding support member is arranged on the raised layer in the corresponding groove, the carrier substrate layer is arranged.

[0074] In another example of this embodiment, forming a protrusion in the groove, forming a carrier substrate on the third top surface, and disposing a support member in at least one protrusion may include:

[0075] A raised layer forming a raised portion is filled into the groove, and a carrier substrate layer forming a carrier substrate is disposed on the third top surface. The support member is then pressed through the carrier substrate layer into the corresponding raised portion, and the raised portion and the carrier substrate layer are cured. In other words, in this example, the raised portion and the carrier substrate layer are first disposed, and then the support member is pressed through the carrier substrate layer into the corresponding raised portion.

[0076] In one example of this embodiment, before setting a support member in at least one protrusion, a process of making the support member is also included. In some application scenarios, making the support member may include but is not limited to: making a support substrate that matches the carrier substrate, and forming a support member corresponding to and adapted to the protrusion on the second bottom surface of the support substrate.

[0077] The step of forming a support member corresponding to and matching the protrusion on the second bottom surface of the support substrate includes forming a support member corresponding to and matching the protrusion on the second bottom surface of the support substrate by, but not limited to, a reactive ion etching process.

[0078] S603: removing the template substrate to obtain a transfer head with stronger support strength.

[0079] In some examples of this embodiment, in order to improve the yield rate of the protrusions, before the protrusion layer is filled in the groove to form the protrusion, a release agent layer can be formed on at least one of the third top surface, the side wall of the groove, and the bottom of the groove, so as to facilitate the demolding process after the protrusion layer and the carrier substrate layer are cured, that is, to facilitate the separation of the template substrate, the protrusion and the carrier substrate.

[0080] To facilitate understanding, the following is an explanation using several examples of how to make transfer heads.

[0081] Production Example 1:

[0082] See also Figure 7-1 to Figure 7-5 As shown, the production of the transfer head includes but is not limited to:

[0083] S701: After cleaning the template substrate, a transfer head pattern is formed on the template substrate.

[0084] See for example Figure 7-2 As shown, the template substrate 31 is a silicon substrate having a third top surface T3 and a third bottom surface B3 arranged relatively to each other. The deep silicon etching template substrate 31 is prepared to present a specific pattern on the third top surface T3 of the template substrate 31. In this example, a groove 32 can be made on the template substrate 31 according to the size of the chip to be transferred.

[0085] S702: forming a protrusion layer and a carrier substrate layer on the template substrate.

[0086] See also Figure 7-2 As shown, the raised layer 120 and the carrier substrate layer 110 can be formed on the template substrate 31 by, but not limited to, molding, spraying, spin coating, etc. In this example, the raised layer 120 and the carrier substrate layer 110 are made of PDMS material, which can be used to bond the chip and has stronger adhesion than the bonding adhesive on the temporary substrate, but weaker than the welding force of the metal solder after welding. In addition, the PDMS material in this embodiment can be selected from UV-curable silicone material; UV-curable silicone material has a low thermal curing shrinkage rate, and the actual array structure after curing is best matched with the actual design, which can further improve the yield rate of the raised parts.

[0087] Optionally, in this embodiment, before filling the groove 32 with PDMS material, see Figure 7-3 As shown, a release agent layer 4 may be formed on the groove 32 and the third top surface first.

[0088] S703: Before the protrusion layer and the carrier substrate layer are solidified, a support member is pressed into the corresponding protrusion layer through the carrier substrate layer.

[0089] In one example of this embodiment, the prepared support member can be pressed onto the protrusion layer and the carrier substrate layer by, but not limited to, a bonding device having an alignment function, see Figure 7-2 As shown, the support member 21 is pressed into the corresponding raised layer. Figure 7-4 and Figure 7-5 As shown, the support member 21 can be fabricated on the substrate 22 by, but not limited to, various etching methods. For example, a carrier substrate (a quartz substrate is used in this example) can be coated with photoresist, and the areas to be etched are developed to reveal the quartz. Reactive ion etching is then performed, and the photoresist is finally washed away. The remaining areas are the raised areas corresponding to the above figure.

[0090] S704: After curing the protrusion layer and the carrier substrate layer to form the protrusions and the carrier substrate, the template substrate is removed.

[0091] See also Figure 7-2 As shown, after the template substrate 31 is removed, a transfer head provided with a support member 21 is obtained.

[0092] Production Example 2:

[0093] See also Figure 8-1 to Figure 8-2 As shown, the production of the transfer head includes but is not limited to:

[0094] S801: After cleaning the template substrate, a transfer head pattern is formed on the template substrate.

[0095] See for example Figure 8-2 As shown, the template substrate 31 is a silicon substrate, and a specific pattern is presented on the third top surface T3 of the template substrate 31. In this example, grooves 32 can be made on the template substrate 31 according to the size of the chip to be transferred.

[0096] S802: forming a raised layer on the template substrate.

[0097] See also Figure 8-2 As shown, the raised layer 120 can be formed on the template substrate 31 by, but not limited to, molding, spraying, or spin coating. In this example, the raised layer 120 is made of PDMS, which can be used to bond the chip and has stronger adhesion than the bonding adhesive on the temporary substrate, but weaker than the welding force of metal solder after welding. In this embodiment, the PDMS material can be selected from UV-curable silicone material; UV-curable silicone material has a low thermal curing shrinkage rate, and the actual array structure after curing is best matched with the actual design, which can further improve the yield rate of the raised layers.

[0098] Optionally, in this embodiment, before the groove 32 is filled with the PDMS material, a release agent layer 4 may be formed on the groove 32 and the third top surface.

[0099] S803: Before the raised layer is solidified, press the support member into the corresponding raised layer.

[0100] In one example of this embodiment, the prepared support member can be pressed into the raised layer by, but not limited to, a bonding device having an alignment function, see Figure 8-2 As shown, the support member 21 is pressed into the corresponding raised layer.

[0101] S804: forming a carrier substrate layer on the template substrate.

[0102] See also Figure 8-2 As shown, a carrier substrate layer 21 covering the support member 21 is formed on the template substrate 31 .

[0103] S805: After curing the protrusion layer and the carrier substrate layer to form protrusions and the carrier substrate, the template substrate is removed.

[0104] See also Figure 8-2 As shown, after the template substrate 31 is removed, a transfer head provided with a support member 21 is obtained.

[0105] Production Example 3:

[0106] See also Figure 9-1 to Figure 9-2 As shown, the production of the transfer head includes but is not limited to:

[0107] S901: After cleaning the template substrate, a transfer head pattern is formed on the template substrate.

[0108] See for example Figure 9-2 As shown, the template substrate 31 is a silicon substrate, and a specific pattern is presented on the third top surface T3 of the template substrate 31. In this example, grooves 32 can be made on the template substrate 31 according to the size of the chip to be transferred.

[0109] S902: forming a raised layer on the template substrate.

[0110] See also Figure 9-2 As shown, the raised layer 120 can be formed on the template substrate 31 by, but not limited to, molding, spraying, or spin coating. In this example, the raised layer 120 is made of PDMS, which can be used to bond the chip and has stronger adhesion than the bonding adhesive on the temporary substrate, but weaker than the welding force of metal solder after welding. In this embodiment, the PDMS material can be selected from UV-curable silicone material; UV-curable silicone material has a low thermal curing shrinkage rate, and the actual array structure after curing is best matched with the actual design, which can further improve the yield rate of the raised layers.

[0111] Optionally, in this embodiment, before the groove 32 is filled with the PDMS material, a release agent layer 4 may be formed on the groove 32 and the third top surface.

[0112] S903: Before the raised layer is solidified, press the support member into the corresponding raised layer.

[0113] In one example of this embodiment, the prepared support member can be pressed into the raised layer by, but not limited to, a bonding device having an alignment function, see Figure 9-2 As shown, the support member 21 fixed on the support substrate 22 is pressed into the corresponding raised layer.

[0114] S904: forming a carrier substrate layer on the template substrate.

[0115] See also Figure 9-2 As shown, a carrier substrate layer 21 covering the support member 21 is formed on the template substrate 31 .

[0116] S905: After curing the protrusion layer and the carrier substrate layer to form protrusions and the carrier substrate, the template substrate 31 is removed.

[0117] See also Figure 9-2 As shown, after the template substrate 31 is removed, a transfer head provided with a support member 21 is obtained.

[0118] The protrusions 12 of the transfer head manufactured by the methods shown in the above examples have stronger supporting strength, which prevents the protrusions 12 from being deformed and twisted due to heat and pressure during use, thereby ensuring the consistency of chips transferred using the transfer head.

[0119] Yet another optional embodiment:

[0120] This embodiment also provides a display screen comprising a frame and a display panel; the display panel is fixed to the frame; the display panel comprises a display backplane and a plurality of micro-light-emitting chips disposed on the display backplane. The micro-light-emitting chips are transferred to the display backplane using the transfer head described in each of the above embodiments, thereby achieving better consistency after bonding of the micro-light-emitting chips on the display backplane, thereby improving the display quality of the display screen. This display screen can be applied to, but is not limited to, various smart mobile terminals, vehicle-mounted terminals, PCs, monitors, electronic billboards, and the like.

[0121] This embodiment also provides a spliced display screen, including a spliced display screen that can be spliced together by at least two display screens as shown above. Since the micro-light-emitting chips of the display screens have better consistency after bonding, the consistency of the micro-light-emitting chips between the spliced display screens after bonding can be further ensured, thereby improving the visual effect.

[0122] It should be understood that the application of the present invention is not limited to the above examples. For those skilled in the art, improvements or changes can be made based on the above description. All these improvements and changes should fall within the scope of protection of the claims attached to the present invention.

Claims

1. A transfer head, characterized in that: include: A carrier substrate having a first top surface and a first bottom surface opposite to each other; at least one protrusion provided on the first bottom surface for adhering the chip to be transferred, wherein the material of the protrusion includes polydimethylsiloxane; A support member is provided in at least one of the protrusions and is used to enhance the supporting strength of the protrusion.

2. The transfer head according to claim 1, wherein: The transfer head includes at least two protrusions and the support member disposed in each protrusion.

3. The transfer head according to claim 1, wherein: The support member is made of quartz, sapphire, glass or metal.

4. The transfer head according to any one of claims 1 to 3, wherein: The transfer head further includes a supporting substrate having a second top surface and a second bottom surface opposite to each other. The second bottom surface faces toward the first bottom surface, and the supporting member is fixed on the second bottom surface.

5. The transfer head according to claim 4, wherein: The protrusion is integrally formed with the carrier substrate, and / or the support substrate is integrally formed with the support member.

6. A method for manufacturing a transfer head according to any one of claims 1 to 5, characterized in that: include: forming a transfer head pattern on the third top surface of the template substrate, the transfer head pattern comprising at least one groove recessed from the third top surface toward the third bottom surface of the template substrate, the third top surface being opposite to the third bottom surface; forming the protrusions in the grooves, forming the carrier substrate on the third top surface, and arranging the support member in at least one of the protrusions; The template substrate is removed.

7. The method for manufacturing a transfer head according to claim 6, wherein: The forming of the protrusion in the groove, the forming of the carrier substrate on the third top surface, and the disposing of the support member in at least one of the protrusions comprises: Filling the groove with a convex layer to form the convexity; Disposing the support member in the raised layer; A carrier substrate layer forming the carrier substrate is provided on the third top surface; curing the protrusion layer and the carrier substrate layer; or, Filling the groove with a convex layer to form the convexity, and arranging a carrier substrate layer to form the carrier substrate on the third top surface; Pressing the support member through the carrier substrate layer into the corresponding raised layer; The protrusion layer and the carrier substrate layer are cured.

8. The method for manufacturing a transfer head according to claim 7, wherein: Before filling the groove with the convex layer to form the convex portion, the method further comprises: A release agent layer is formed on at least one of the third top surface, the sidewall of the groove, and the bottom of the groove.

9. The method for manufacturing a transfer head according to any one of claims 6 to 8, wherein: Before arranging the support member in at least one of the protrusions, the method further includes manufacturing the support member; The manufacturing of the support member comprises: A supporting substrate matching the carrier substrate is manufactured, and a supporting member corresponding to and matching the protrusion is formed on the supporting substrate.

10. The method for manufacturing a transfer head according to claim 9, wherein: The supporting member formed on the supporting substrate and corresponding to and adapted to the protrusion comprises: A support member corresponding to and adapted to the protrusion is formed on the support substrate through a reactive ion etching process.

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