A high-speed automatic chip mounter for avoiding chip placement deviation

Abstract

The present invention provides a high-speed automatic placement machine for avoiding patch deviation, belonging to the field of patch processing. The high-speed automatic placement machine for avoiding patch deviation comprises a placement machine body, a support mechanism and a cleaning mechanism, wherein the support mechanism comprises a first rotating plate, a second rotating plate, a first servo motor, two connecting columns, two second servo motors, a first support plate, a second support plate, two lead screws, and two movable plates, wherein the first servo motor is respectively connected to the first rotating plate and the second rotating plate by transmission, the second servo motor is connected to the lead screw by transmission, the lead screw is connected to the movable plate by transmission, the cleaning mechanism comprises two mechanical arms, two third servo motors and two suction nozzles, one side of the suction nozzle is fixedly connected to the output end of the third servo motor, and the present invention can prevent the PCB from shaking during the placement process, avoid unclear recognition of BOC marks, and thus avoid patch deviation.

Description

Technical Field

[0001] The present invention relates to the field of chip processing, and more particularly to a high-speed automatic chip mounter that avoids chip offset. Background Art

[0002] A high-speed automatic chip mounter is the core equipment in the chip mounting process of chip processing. Its function is to quickly and efficiently install surface-mounted components accurately onto the fixed positions of the PCB, greatly improving the efficiency of chip processing.

[0003] Currently, the existing high-speed automatic chip mounters run at a relatively high speed. During operation, the PCB substrate is transported under the mounting head in the mounter through a conveyor track. Generally, the bottom of the PCB substrate is in a suspended state. When the area of the PCB substrate is large, during the chip mounting operation, it will vibrate due to factors such as equipment operation or resonance, and the BOC marks on the PCB substrate are often soiled, resulting in inaccurate recognition by the optical components of the mounter and easily causing chip offset. Summary of the Invention

[0004] To make up for the above deficiencies, the present invention provides a high-speed automatic chip mounter that avoids chip offset, aiming to improve the problem that the existing high-speed automatic chip mounter is prone to chip offset due to the vibration of the PCB substrate and the difficulty in timely cleaning the soiled BOC marks.

[0005] The present invention is implemented as follows:

[0006] The present invention provides a high-speed automatic chip mounter that avoids chip offset, including a mounter body, a support mechanism, and a cleaning mechanism.

[0007] The support mechanism includes a first rotating plate, a second rotating plate, a first servo motor, two connecting columns, two second servo motors, a first support plate, a second support plate, two lead screws, and two movable plates. The first rotating plate and the second rotating plate are symmetrically and rotatably connected to the lower sides of both sides of the PCB conveying track of the mounter body. The first servo motor is fixedly connected to the lower side of one side of the PCB conveying track of the mounter body, and the first servo motor is respectively drivingly connected to the first rotating plate and the second rotating plate. The two connecting columns are respectively installed on the upper sides of the first rotating plate and the second rotating plate. The lead screws penetrate through the connecting columns. The two second servo motors are respectively fixedly connected to the upper sides of the first rotating plate and the second rotating plate. The second servo motor is arranged on the side of the connecting column close to the PCB conveying track of the mounter body. The second servo motor is drivingly connected to the lead screw. The two movable plates are arranged on both sides of the lead screw. The movable plate is arranged on the side of the connecting column away from the PCB conveying track of the mounter body. The lead screw is drivingly connected to the movable plate. The cleaning mechanism includes two robotic arms, two third servo motors, and two suction nozzles. The two robotic arms are respectively connected to the upper sides of both sides of the PCB conveying track of the mounter body. The two robotic arms are respectively arranged on both sides of the mounting head of the mounter body. The third servo motor is fixedly connected to the end of the robotic arm. One side of the suction nozzle is fixedly connected to the output end of the third servo motor.

[0008] In an embodiment of the present invention, a first gear is installed on one side of the first rotating plate, and a first sprocket is installed on one side of the second rotating plate.

[0009] In an embodiment of the present invention, a second gear and a second sprocket are installed at the output end of the first servo motor, and one side of the second gear is fixedly connected to one side of the second sprocket.

[0010] In an embodiment of the present invention, the first gear meshes with the second gear, and the first sprocket is drivingly connected to the second sprocket through a chain.

[0011] In an embodiment of the present invention, a third gear is installed at the output end of the second servo motor.

[0012] In an embodiment of the present invention, the lead screw includes a sleeve, a rod body, and a bushing. The rod body penetrates through the connecting column. One side of the outside of the sleeve is fixedly connected to the outside of the second servo motor. One end of the rod body slides through the sleeve. The bushing is rotatably connected to one end of the sleeve close to the connecting column. The rod body is threadedly penetrated through the bushing.

[0013] In an embodiment of the present invention, one side of the bushing away from the sleeve is rotatably connected to the connecting column. A gear ring is installed outside the bushing, and the gear ring meshes with the third gear.

[0014] In an embodiment of the present invention, a connecting rod is provided between the movable plate and the lever body. One end of the connecting rod is fixedly connected to the lower side of the movable plate, and the other end of the connecting rod is rotatably connected to the outer side of the end of the lever body away from the connecting column. Support columns are installed on the upper sides of the first rotating plate and the second rotating plate, and the upper ends of the support columns are rotatably connected to the connecting rod.

[0015] In an embodiment of the present invention, the robotic arm includes a first swing cylinder, a second swing cylinder, a first arm body, and a second arm body. The output end of the first swing cylinder is fixedly connected to the upper side of the PCB conveying track of the mounter body. One end of the first arm body is fixedly connected to one side of the first swing cylinder, and the other end of the first arm body is fixedly connected to one side of the second swing cylinder. One end of the second arm body is fixedly connected to the output end of the second swing cylinder, and the other end of the second arm body is fixedly connected to the third servo motor.

[0016] In an embodiment of the present invention, a brush is provided around the suction port of the suction nozzle.

[0017] The beneficial effects of the present invention are as follows:

[0018] 1. A high-speed automatic mounter for avoiding patch offset obtained by the above design of the present invention. During use, start the high-speed automatic mounter to start the patching operation. When the conveying track of the mounter conveys the PCB substrate under the patching head, start the first servo motor to drive the first rotating plate and the second rotating plate to close, so that the first support plate and the second support plate close and fit under the PCB substrate to provide support for the substrate. When the area of the PCB substrate is large, the second servo motor can be started to drive the lead screw according to actual needs to adjust the opening range of the movable plate to further provide more stable support for the PCB substrate. Then start the robotic arm to drive the suction nozzle to clean the BOC mark on the PCB, which can effectively prevent the PCB from shaking during the patching process, avoid the optical components of the mounter from misidentifying the BOC mark, and thus avoid patch offset.

[0019] 2. A first gear is installed on one side of the first rotating plate, a first sprocket is installed on one side of the second rotating plate, a second gear and a second sprocket are installed on the output end of the first servo motor, one side of the second gear is fixedly connected to one side of the second sprocket, the first gear and the second gear are meshed, the first sprocket is connected to the second sprocket through a chain transmission, the first servo motor can simultaneously rotate the first rotating plate and the second rotating plate to close them, and support the PCB by closing the first support plate and the second support plate. After the mounting is completed, the first rotating plate and the second rotating plate are synchronously flipped to separate the first support plate and the second support plate from the bottom side of the PCB without affecting the output of the PCB.

[0020] 3. A third gear is installed at the output end of the second servo motor, and the ring gear is meshed with the third gear. A connecting rod is arranged between the movable plate and the lever body, and one end of the connecting rod is fixedly connected to the lower side of the movable plate, and the other end of the connecting rod is rotatably connected to the outer side of one end of the lever body away from the connecting column. Support columns are installed on the upper sides of the first rotating plate and the second rotating plate, and the upper ends of the support columns are rotatably connected to the connecting rod. When the area of ​​the PCB is large, the second servo motor can be started to drive the lever body through the third gear and the ring gear to drive the connecting rod to adjust the opening range of the movable plate, thereby further providing support for the PCB substrate.

[0021] 4. The robotic arm includes a first swing cylinder, a second swing cylinder, a first arm body and a second arm body. The output end of the first swing cylinder is fixedly connected to the upper side of the PCB conveying track of the placement machine body, one end of the first arm body is fixedly connected to one side of the first swing cylinder, the other end of the first arm body is fixedly connected to one side of the second swing cylinder, one end of the second arm body is fixedly connected to the output end of the second swing cylinder, and the other end of the second arm body is fixedly connected to the third servo motor. The first swing cylinder and the second swing cylinder can flexibly drive and adjust the angle, direction and length of the first arm body and the second arm body at multiple angles to drive the third servo motor to a suitable position.

[0022] 5. A brush is arranged on the periphery of the suction port of the suction nozzle. The angle of the suction nozzle can be flexibly adjusted by the third servo motor, and the BOC mark on the PCB substrate can be cleaned with the brush to avoid unclear recognition of the optical components of the placement machine, resulting in patch deviation. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 It is a schematic structural diagram of a high-speed automatic chip mounter for avoiding chip placement offset provided by an embodiment of the present invention;

[0025] Figure 2 It is a schematic structural diagram of a first servo motor and a first rotating plate provided by an embodiment of the present invention;

[0026] Figure 3 It is a schematic structural diagram of a support mechanism provided by an embodiment of the present invention;

[0027] Figure 4 It is a schematic structural diagram of a connecting column, a lead screw and a movable plate provided by an embodiment of the present invention;

[0028] Figure 5 It is a schematic structural diagram of a chain provided by an embodiment of the present invention;

[0029] Figure 6 It is a schematic structural diagram of a lead screw and a movable plate provided by an embodiment of the present invention;

[0030] Figure 7 It is a schematic structural diagram of a cleaning mechanism provided by an embodiment of the present invention;

[0031] Figure 8 It is a schematic structural diagram of a third servo motor and a nozzle provided by an embodiment of the present invention.

[0032] In the figure: 100-chip mounter body; 200-support mechanism; 210-first rotating plate; 211-first gear; 220-second rotating plate; 221-first sprocket; 230-first servo motor; 231-second gear; 232-second sprocket; 233-chain; 240-connecting column; 250-second servo motor; 251-third gear; 260-first support plate; 270-second support plate; 280-lead screw; 281-sleeve; 282-lead body; 283-bushing; 2831-toothed ring; 290-movable plate; 291-link; 292-support column; 300-cleaning mechanism; 310-robot arm; 311-first swing cylinder; 312-second swing cylinder; 313-first arm body; 314-second arm body; 320-third servo motor; 330-nozzle; 331-brush. Specific embodiments

[0033] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some but not all of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the scope of protection of the present invention.

[0034] Accordingly, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the scope of protection of the present invention.

[0035] It should be noted that like reference numerals and letters denote like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

[0036] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present invention.

[0037] In addition, the terms "first" and "second" are used only for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, "a plurality of" means two or more unless otherwise specifically defined.

[0038] In the present invention, unless otherwise clearly defined and limited, the terms "mounted", "connected", "coupled", "fixed", etc. shall be construed in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral body; it may be directly connected or indirectly connected through an intermediate medium, and may be the internal communication of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0039] In the present invention, unless otherwise clearly specified and defined, the first feature being "on" or "under" the second feature may include direct contact between the first and second features, or may include the first and second features not being in direct contact but in contact through additional features therebetween. Moreover, the first feature being "above", "over" and "on top of" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "beneath" and "underneath" the second feature includes the first feature being directly below and obliquely below the second feature, or merely indicating that the horizontal height of the first feature is less than that of the second feature.

[0040] Embodiment 1

[0041] Please refer to Figure 1 , the present invention provides a technical solution: a high-speed automatic chip mounter for avoiding chip placement deviation, comprising a chip mounter body 100, a support mechanism 200 and a cleaning mechanism 300. The support mechanism 200 is arranged below both sides of the PCB conveying track of the chip mounter body 100, and the cleaning mechanism 300 is arranged above both sides of the PCB conveying track of the chip mounter body 100, which can prevent the PCB from jittering and unclear BOC recognition during the chip placement process, thereby avoiding chip placement deviation.

[0042] Please refer to Figures 2-6, the support mechanism 200 includes a first rotating plate 210, a second rotating plate 220, a first servo motor 230, two connecting columns 240, two second servo motors 250, a first support plate 260, a second support plate 270, two lead screws 280, and two movable plates 290. The first rotating plate 210 and the second rotating plate 220 are symmetrically and rotatably connected to the lower sides of both sides of the PCB conveying track of the mounter body 100. The first servo motor 230 is fixedly connected to the lower side of one side of the PCB conveying track of the mounter body 100. The first servo motor 230 is respectively drivingly connected to the first rotating plate 210 and the second rotating plate 220. The two connecting columns 240 are respectively installed on the upper sides of the first rotating plate 210 and the second rotating plate 220. The lead screw 280 penetrates through the connecting column 240. The two second servo motors 250 are respectively fixedly connected to the upper sides of the first rotating plate 210 and the second rotating plate 220. The second servo motor 250 is arranged on the side of the connecting column 240 close to the PCB conveying track of the mounter body 100. The second servo motor 250 is drivingly connected to the lead screw 280. The two movable plates 290 are arranged on both sides of the lead screw 280. The movable plate 290 is arranged on the side of the connecting column 240 far from the PCB conveying track of the mounter body 100. The lead screw 280 is drivingly connected to the movable plate 290. A first gear 211 is installed on one side of the first rotating plate 210. A first sprocket 221 is installed on one side of the second rotating plate 220. The output end of the first servo motor 230 is installed with a second gear 231 and a second sprocket 232. One side of the second gear 231 is fixedly connected to one side of the second sprocket 232. One side of the second gear 231 is fixedly connected to one side of the second sprocket 232 by welding. The first gear 211 and the second gear 231 are meshed. The first sprocket 221 is drivingly connected to the second sprocket 232 through a chain 233. Starting the first servo motor 230 can drive the first rotating plate 210 and the second rotating plate 220 at the same time, so that they close under the PCB substrate, drive the first support plate 260 and the second support plate 270 to close and fit on the lower side of the PCB, provide effective support for the PCB substrate, and prevent the PCB from shaking during the mounting process. The output end of the second servo motor 250 is installed with a third gear 251. The lead screw 280 includes a sleeve 281, a screw body 282, and a bushing 283. The screw body 282 penetrates through the connecting column 240. One side of the outside of the sleeve 281 is fixedly connected to the outside of the second servo motor 250. One end of the screw body 282 slidably penetrates through the sleeve 281. The bushing 283 is rotatably connected to one end of the sleeve 281 close to the connecting column 240. The screw body 282 is threadedly penetrated through the bushing 283. One side of the bushing 283 far from the sleeve 281 is rotatably connected to the connecting column 240. A gear ring 2831 is installed on the outside of the bushing 283. The gear ring 2831 and the third gear 251 are meshed. A connecting rod 291 is arranged between the movable plate 290 and the screw body 282. One end of the connecting rod 291 is fixedly connected to the lower side of the movable plate 290. One end of the connecting rod 291 is fixedly connected to the lower side of the movable plate 290 by welding.The other end of the connecting rod 291 is rotatably connected to the outer side of the end of the lever body 282 away from the connecting column 240. Support columns 292 are installed on the upper sides of the first rotating plate 210 and the second rotating plate 220. The upper ends of the support columns 292 are rotatably connected to the connecting rod 291. When the area of the PCB is relatively large, the second servo motor 250 can be started to drive the lever body 282 through the third gear 251 and the toothed ring 2831 to drive the connecting rod 291 to adjust the opening range of the movable plate 290, further providing support for the PCB substrate to prevent it from shaking during the mounting process.

[0043] Please refer to Figure 1 and Figures 7-8 As shown in FIGS. and, the cleaning mechanism 300 includes two robotic arms 310, two third servo motors 320, and two suction nozzles 330. The two robotic arms 310 are respectively connected above both sides of the PCB conveying track of the mounter body 100. The two robotic arms 310 are respectively arranged on both sides of the mounting head of the mounter body 100. The third servo motor 320 is fixedly connected to the end of the robotic arm 310. The third servo motor 320 is fixedly connected to the end of the robotic arm 310 by fastening screws or riveting. One side of the suction nozzle 330 is fixedly connected to the output end of the third servo motor 320. One side of the suction nozzle 330 is fixedly connected to the output end of the third servo motor 320 by fastening screws or riveting. The robotic arm 310 includes a first swing cylinder 311, a second swing cylinder 312, a first arm body 313, and a second arm body 314. The output end of the first swing cylinder 311 is fixedly connected to the upper side of the PCB conveying track of the mounter body 100. The output end of the first swing cylinder 311 is fixedly connected to the upper side of the PCB conveying track of the mounter body 100 by riveting. One end of the first arm body 313 is fixedly connected to one side of the first swing cylinder 311. One end of the first arm body 313 is fixedly connected to one side of the first swing cylinder 311 by welding. The other end of the first arm body 313 is fixedly connected to one side of the second swing cylinder 312. The other end of the first arm body 313 is fixedly connected to one side of the second swing cylinder 312 by welding. One end of the second arm body 314 is fixedly connected to the output end of the second swing cylinder 312. One end of the second arm body 314 is fixedly connected to the output end of the second swing cylinder 312 by riveting. The other end of the second arm body 314 is fixedly connected to the third servo motor 320. The other end of the second arm body 314 is fixedly connected to the third servo motor 320 by welding, fastening screws or riveting. The first swing cylinder 311 and the second swing cylinder 312 can flexibly drive and adjust the angles, directions, and lengths of the first arm body 313 and the second arm body 314 at multiple angles, driving the third servo motor 320 to a suitable position. The third servo motor 320 can flexibly adjust the angle of the suction nozzle 330 to clean the BOC mark of the PCB substrate, avoiding unclear recognition by the optical components of the mounter and resulting in patch offset.

[0044] Embodiment 2

[0045] Please refer to Figure 1, the present invention provides a technical solution: a high-speed automatic pick-and-place machine for avoiding patch offset, including a pick-and-place machine body 100, a support mechanism 200, and a cleaning mechanism 300. The support mechanism 200 is arranged below both sides of the PCB conveying track of the pick-and-place machine body 100, and the cleaning mechanism 300 is arranged above both sides of the PCB conveying track of the pick-and-place machine body 100, which can prevent the PCB from shaking and unclear BOC recognition during the pick-and-place process, thereby avoiding patch offset.

[0046] Please refer to Figures 2-6, the support mechanism 200 includes a first rotating plate 210, a second rotating plate 220, a first servo motor 230, two connecting columns 240, two second servo motors 250, a first support plate 260, a second support plate 270, two lead screws 280, and two movable plates 290. The first rotating plate 210 and the second rotating plate 220 are symmetrically and rotatably connected to the lower sides of both sides of the PCB conveying track of the mounter body 100. The first servo motor 230 is fixedly connected to the lower side of one side of the PCB conveying track of the mounter body 100. The first servo motor 230 is respectively drivingly connected to the first rotating plate 210 and the second rotating plate 220. The two connecting columns 240 are respectively installed on the upper sides of the first rotating plate 210 and the second rotating plate 220. The lead screw 280 penetrates through the connecting column 240. The two second servo motors 250 are respectively fixedly connected to the upper sides of the first rotating plate 210 and the second rotating plate 220. The second servo motor 250 is arranged on the side of the connecting column 240 close to the PCB conveying track of the mounter body 100. The second servo motor 250 is drivingly connected to the lead screw 280. The two movable plates 290 are arranged on both sides of the lead screw 280. The movable plate 290 is arranged on the side of the connecting column 240 away from the PCB conveying track of the mounter body 100. The lead screw 280 is drivingly connected to the movable plate 290. A first gear 211 is installed on one side of the first rotating plate 210. A first sprocket 221 is installed on one side of the second rotating plate 220. The output end of the first servo motor 230 is installed with a second gear 231 and a second sprocket 232. One side of the second gear 231 is fixedly connected to one side of the second sprocket 232. One side of the second gear 231 is fixedly connected to one side of the second sprocket 232 by welding. The first gear 211 and the second gear 231 are meshed. The first sprocket 221 is drivingly connected to the second sprocket 232 through a chain 233. Starting the first servo motor 230 can simultaneously drive the first rotating plate 210 and the second rotating plate 220 to close under the PCB substrate, drive the first support plate 260 and the second support plate 270 to close and fit against the lower side of the PCB, provide effective support for the PCB substrate, and prevent the PCB from shaking during the mounting process. The output end of the second servo motor 250 is installed with a third gear 251. The lead screw 280 includes a sleeve 281, a screw body 282, and a bushing 283. The screw body 282 penetrates through the connecting column 240. One side of the outside of the sleeve 281 is fixedly connected to the outside of the second servo motor 250. One end of the screw body 282 slidably penetrates through the sleeve 281. The bushing 283 is rotatably connected to one end of the sleeve 281 close to the connecting column 240. The screw body 282 is threadedly penetrated through the bushing 283. One side of the bushing 283 away from the sleeve 281 is rotatably connected to the connecting column 240. A gear ring 2831 is installed on the outside of the bushing 283. The gear ring 2831 and the third gear 251 are meshed. A connecting rod 291 is arranged between the movable plate 290 and the screw body 282. One end of the connecting rod 291 is fixedly connected to the lower side of the movable plate 290. One end of the connecting rod 291 is fixedly connected to the lower side of the movable plate 290 by welding.The other end of the connecting rod 291 is rotatably connected to the outer side of the end of the lever body 282 away from the connecting column 240. A support column 292 is installed on the upper sides of the first rotating plate 210 and the second rotating plate 220. The upper end of the support column 292 is rotatably connected to the connecting rod 291. When the area of the PCB is large, the second servo motor 250 can be started to drive the lever body 282 through the third gear 251 and the toothed ring 2831 to drive the connecting rod 291 to adjust the opening range of the movable plate 290, further providing support for the PCB substrate and preventing it from shaking during the mounting process.

[0047] Please refer to Figure 1 and Figures 7-8 As shown in FIGS. and, the cleaning mechanism 300 includes two robotic arms 310, two third servo motors 320, and two suction nozzles 330. The two robotic arms 310 are respectively connected above both sides of the PCB conveying track of the mounter body 100. The two robotic arms 310 are respectively arranged on both sides of the mounting head of the mounter body 100. The third servo motor 320 is fixedly connected to the end of the robotic arm 310. The third servo motor 320 is fixedly connected to the end of the robotic arm 310 by fastening screws or riveting. One side of the suction nozzle 330 is fixedly connected to the output end of the third servo motor 320. One side of the suction nozzle 330 is fixedly connected to the output end of the third servo motor 320 by fastening screws or riveting. The robotic arm 310 includes a first swing cylinder 311, a second swing cylinder 312, a first arm body 313, and a second arm body 314. The output end of the first swing cylinder 311 is fixedly connected to the upper side of the PCB conveying track of the mounter body 100. The output end of the first swing cylinder 311 is fixedly connected to the upper side of the PCB conveying track of the mounter body 100 by riveting. One end of the first arm body 313 is fixedly connected to one side of the first swing cylinder 311. One end of the first arm body 313 is fixedly connected to one side of the first swing cylinder 311 by welding. The other end of the first arm body 313 is fixedly connected to one side of the second swing cylinder 312. The other end of the first arm body 313 is fixedly connected to one side of the second swing cylinder 312 by welding. One end of the second arm body 314 is fixedly connected to the output end of the second swing cylinder 312. One end of the second arm body 314 is fixedly connected to the output end of the second swing cylinder 312 by riveting. The other end of the second arm body 314 is fixedly connected to the third servo motor 320. The other end of the second arm body 314 is fixedly connected to the third servo motor 320 by welding, fastening screws or riveting. The first swing cylinder 311 and the second swing cylinder 312 can flexibly drive and adjust the angles, directions, and lengths of the first arm body 313 and the second arm body 314 at multiple angles, driving the third servo motor 320 to a suitable position. A brush 331 is arranged around the suction port of the suction nozzle 330. The angle of the suction nozzle 330 can be flexibly adjusted through the third servo motor 320, and the BOC mark of the PCB substrate is cleaned in cooperation with the brush 331, avoiding unclear recognition by the optical components of the mounter and resulting in patch offset.

[0048] Specifically, the working principle of a high-speed automatic chip mounter for avoiding chip placement offset: During use, start the high-speed automatic chip mounter to start the chip placement operation. Starting the first servo motor 230 can drive the first rotating plate 210 and the second rotating plate 220 simultaneously, causing them to close below the PCB substrate, driving the first support plate 260 and the second support plate 270 to close and fit against the lower side of the PCB, providing effective support for the PCB substrate. When the area of the PCB substrate is large, according to actual needs, start the second servo motor 250 to drive the lever body 282 through the third gear 251 and the gear ring 2831 to drive the connecting rod 291 to adjust the opening range of the movable plate 290, further providing more stable support for the PCB substrate, preventing the PCB from shaking during the chip placement process. The first swing cylinder 311 and the second swing cylinder 312 flexibly drive and adjust the angles, directions, and lengths of the first arm body 313 and the second arm body 314 at multiple angles, driving the third servo motor 320 to a suitable position. Through the third servo motor 320, the angle of the suction nozzle 330 can be flexibly adjusted, and the BOC mark on the PCB substrate is cleaned in cooperation with the brush 331. This can effectively prevent the PCB from shaking during the chip placement process, avoid the optical components of the chip mounter from misidentifying the BOC mark, and thus avoid chip placement offset.

[0049] It should be noted that the specific model specifications of the first servo motor 230, the second servo motor 250, the first swing cylinder 311, the second swing cylinder 312, and the third servo motor 320 need to be selected and determined according to the actual specifications of the device, etc. The specific selection calculation method adopts the existing technology in this field, so it will not be elaborated in detail.

[0050] The power supply and its principle of the first servo motor 230, the second servo motor 250, and the third servo motor 320 are clear to those skilled in the art and will not be elaborated in detail here.

[0051] The above is only the preferred embodiment of the present invention and is not used to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A high-speed automatic chip mounter for avoiding chip placement offset, characterized in that, including a mounter body (100); a support mechanism (200), the support mechanism (200) includes a first rotating plate (210), a second rotating plate (220), a first servo motor (230), two connecting columns (240), two second servo motors (250), a first support plate (260), a second support plate (270), two lead screws (280), and two movable plates (290). The first rotating plate (210) and the second rotating plate (220) are symmetrically and rotatably connected to the lower sides of both sides of the PCB conveying track of the mounter body (100). The first servo motor (230) is fixedly connected to the lower side of one side of the PCB conveying track of the mounter body (100). The first servo motor (230) is respectively drivingly connected to the first rotating plate (210) and the second rotating plate (220). The two connecting columns (240) are respectively installed on the upper sides of the first rotating plate (210) and the second rotating plate (220). The lead screw (280) penetrates through the connecting column (240). The two second servo motors (250) are respectively fixedly connected to the upper sides of the first rotating plate (210) and the second rotating plate (220). The second servo motor (250) is arranged on the side of the connecting column (240) close to the PCB conveying track of the mounter body (100). The second servo motor (250) is drivingly connected to the lead screw (280). The two movable plates (290) are arranged on both sides of the lead screw (280). The movable plate (290) is arranged on the side of the connecting column (240) away from the PCB conveying track of the mounter body (100). The lead screw (280) is drivingly connected to the movable plate (290); a cleaning mechanism (300), the cleaning mechanism (300) includes two robotic arms (310), two third servo motors (320), and two suction nozzles (330). The two robotic arms (310) are respectively connected to the upper sides of both sides of the PCB conveying track of the mounter body (100). The two robotic arms (310) are respectively arranged on both sides of the placement head of the mounter body (100). The third servo motor (320) is fixedly connected to the end of the robotic arm (310). One side of the suction nozzle (330) is fixedly connected to the output end of the third servo motor (320); the lead screw (280) includes a sleeve (281), a screw body (282), and a bushing (283). The screw body (282) penetrates through the connecting column (240). One side of the outside of the sleeve (281) is fixedly connected to the outside of the second servo motor (250). One end of the screw body (282) slidably penetrates through the sleeve (281). The bushing (283) is rotatably connected to one end of the sleeve (281) close to the connecting column (240). The screw body (282) is threadedly penetrated through the bushing (283); The sleeve (283) is rotatably connected to the connecting column (240) on the side away from the sleeve (281). A gear ring (2831) is installed outside the sleeve (283), and the gear ring (2831) meshes with the third gear (251). A connecting rod (291) is provided between the movable plate (290) and the lever body (282). One end of the connecting rod (291) is fixedly connected to the lower side of the movable plate (290), and the other end of the connecting rod (291) is rotatably connected to the outer side of the end of the lever body (282) away from the connecting column (240). A support column (292) is installed on the upper sides of the first rotating plate (210) and the second rotating plate (220), and the upper end of the support column (292) is rotatably connected to the connecting rod (291). The robotic arm (310) includes a first swing cylinder (311), a second swing cylinder (312), a first arm body (313), and a second arm body (314). The output end of the first swing cylinder (311) is fixedly connected to the upper side of the PCB conveying track of the mounter body (100). One end of the first arm body (313) is fixedly connected to one side of the first swing cylinder (311), and the other end of the first arm body (313) is fixedly connected to one side of the second swing cylinder (312). One end of the second arm body (314) is fixedly connected to the output end of the second swing cylinder (312), and the other end of the second arm body (314) is fixedly connected to the third servo motor (320). A brush (331) is provided around the suction port of the suction nozzle (330). Start the high-speed automatic mounter to start the mounting operation. Starting the first servo motor (230) can drive the first rotating plate (210) and the second rotating plate (220) simultaneously, causing them to close below the PCB substrate, driving the first support plate (260) and the second support plate (270) to close and fit against the lower side of the PCB, providing effective support for the PCB substrate. Starting the second servo motor (250) drives the lever body (282) through the third gear (251) and the gear ring (2831) to drive the connecting rod (291) to adjust the opening range of the movable plate (290), further providing more stable support for the PCB substrate and preventing the PCB from shaking during the mounting process. The first swing cylinder (311) and the second swing cylinder (312) flexibly drive and adjust the angles, directions, and lengths of the first arm body (313) and the second arm body (314) at multiple angles, driving the third servo motor (320) to a suitable position. The third servo motor (320) can flexibly adjust the angle of the suction nozzle (330), and cooperate with the brush (331) to clean the BOC mark on the PCB substrate.

2. The high-speed automatic chip mounter for avoiding chip placement offset according to claim 1, wherein, A first gear (211) is installed on one side of the first rotating plate (210), and a first sprocket (221) is installed on one side of the second rotating plate (220).

3. The high-speed automatic chip mounter for avoiding chip placement offset according to claim 2, wherein The output end of the first servo motor (230) is installed with a second gear (231) and a second sprocket (232), and one side of the second gear (231) is fixedly connected to one side of the second sprocket (232).

4. A high-speed automatic chip mounter for avoiding chip placement offset according to claim 3, characterized in that, The first gear (211) meshes with the second gear (231), and the first sprocket (221) is drivingly connected to the second sprocket (232) through a chain (233).

5. A high-speed automatic chip mounter for avoiding chip placement deviation according to claim 1, characterized in that, A third gear (251) is mounted on the output end of the second servo motor (250).

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