Resin film, multilayer body, transparent conductive film, and method for producing resin film

Abstract

The present invention provides a resin film having sliding properties and being transparent, as well as a multilayer body, a transparent conductive film, and a method for manufacturing a resin film. A resin film having at least one surface satisfying the following formula (1). Formula (1) 1.00≤S10z*log(Spd)≤10.00 (In formula (1), S10z represents the sum of S5p and S5v, S5p represents the average value (in μm) of the local heights from the highest mountain top to the fifth highest mountain top, S5v represents the average value (in μm) of the local depths from the deepest valley bottom to the fifth deepest valley bottom, and Spd ... 2 The number of convex parts (unit: piece), S5p, S5v and Spd are the values ​​specified in ISO25718-2:2012).

Description

Technical Field

[0001] The present invention relates to a resin film, a multilayer body, a transparent conductive film, and a method for producing the resin film. Background Art

[0002] Transparent conductive films are used in film sensors of touch panels, electronic paper, dye-sensitized solar cells, touch sensors, etc. The transparent conductive film 10 is, for example, Figure 1 As shown, it is known that it includes an electrode layer (transparent conductive film) 11, a substrate 12, an adhesive layer 13 and a protective film 14.

[0003] Specifically, Patent Document 1 discloses a transparent conductive film laminate comprising an adhesive layer, a film substrate, and a transparent conductive film in this order on a protective film. In this embodiment, at least one of the film substrate and the protective film has a concave-convex portion on its surface on the adhesive layer side in each end region extending from one extreme end in the width direction to 100 mm inward of each end region in the width direction, and the effective roughness R1 of the surface of the concave-convex portion in each end region is 0.1 to 20 μm. The adhesive layer is provided in the width direction between the concave-convex portion of one end region and the concave-convex portion of the other end region, from a position separated by 0 to 10 mm from the concave-convex portion of the first end region to a position separated by 0 to 10 mm from the concave-convex portion of the other end region. Furthermore, the protective film is described as using a polycarbonate resin.

[0004] Prior art documents

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Laid-Open No. 2018-152187 Summary of the Invention

[0007] Problems to be solved by the invention

[0008] As mentioned above, a protective film is generally used for transparent conductive films. Such a protective film is used to protect the substrate when transporting a laminate having an electrode layer and a substrate. More specifically, transparent conductive films are mostly manufactured by roll-to-roll in industry, and in this case, it is required to improve the transportability and anti-wrinkle of the film. Poor film transport and wrinkling can be reduced by suppressing the adhesion (sticking) of the films to each other. Therefore, in order to prevent the adhesion of the opposite side of the electrode layer of the transparent conductive film, the protective film of the transparent conductive film is required to have a sliding property to the extent that the films do not stick to each other. In addition, the transparent conductive film is usually inspected for damage online in a state where the protective film is attached, and therefore a transparent film is required.

[0009] In order to solve such problems, an object of the present invention is to provide a transparent resin film having sliding properties, a multilayer body, a transparent conductive film, and a method for producing the resin film.

[0010] Methods for solving problems

[0011] Based on the above problems, the inventors of the present invention conducted intensive research and found that the above problems can be solved by forming the concavo-convex shape of the surface of the resin film into a predetermined shape. Specifically, the above problems are solved by the following method.

[0012] <1> A resin film having at least one surface satisfying the following formula (1).

[0013] Formula (1)

[0014] 1.00≤S10z*log(Spd)≤10.00

[0015] (In formula (1), S10z represents the sum of S5p and S5v,

[0016] S5p represents the average value of the local height from the highest peak to the fifth highest peak (unit: μm), S5v represents the average value of the local depth from the deepest valley to the fifth deepest valley bottom (unit: μm), and Spd represents the average value of the local depth of the resin film per 1 mm. 2 The number of convex parts (unit: piece), S5p, S5v and Spd are the values ​​specified in ISO25718-2:2012.

[0017] <2> The resin film according to <1>, wherein an area ratio of the convex portions having a height of 0.04 μm or greater among the convex portions is 0.2% to 8%.

[0018] <3> The resin film according to <1> or <2>, wherein the thickness is 20 to 300 μm.

[0019] <4> The resin film according to any one of <1> to <3>, wherein the amount of inorganic particles contained in the resin film is less than 0.01% by mass.

[0020] <5> The resin film according to any one of <1> to <4>, wherein the resin film comprises an amorphous resin.

[0021] <6> The resin film according to any one of <1> to <4>, wherein the resin film comprises a polycarbonate resin.

[0022] <7> The resin film according to any one of <1> to <6>, which is a single-layer film.

[0023] <8> The resin film according to any one of <1> to <7>, wherein the haze is 10% or less.

[0024] <9> A multilayer body comprising the resin film according to any one of <1> to <8> and at least one other layer.

[0025] <10> The multilayer body according to <9>, wherein the other layer includes an adhesive layer.

[0026] <11> A transparent conductive film comprising a protective layer, an adhesive layer, a substrate, and an electrode layer in this order, wherein at least one of the substrate and the protective layer is the resin film according to any one of <1> to <8>.

[0027] <12> The method for producing a resin film according to any one of <1> to <8>, comprising the step of applying a melt-extruded thermoplastic resin to a sandblasted roller to form projections on a film surface.

[0028] Effects of the Invention

[0029] According to the present invention, a transparent resin film having slidability, a multilayer body, a transparent conductive film, and a method for producing the resin film can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 This is an example of a schematic cross-sectional view showing the layer structure of a transparent conductive film.

[0031] Figure 2 (a) is a schematic diagram showing a state in which a smooth polycarbonate resin film is slid on a smooth polycarbonate resin film. Figure 2 (b) is a schematic diagram showing a state in which a polycarbonate resin film having fine irregularities on its surface is slid on a polycarbonate resin film having fine irregularities on its surface. DETAILED DESCRIPTION

[0032] Hereinafter, a mode for carrying out the present invention (hereinafter referred to as "this embodiment") will be described in detail. Note that the following this embodiment is an example for explaining the present invention, and the present invention is not limited to this embodiment.

[0033] In addition, in this specification, "to" is used to mean that the numerical values ​​described before and after it are included as the lower limit and the upper limit.

[0034] In this specification, various physical property values ​​and characteristic values ​​refer to values ​​at 23°C unless otherwise specified.

[0035] The term "multilayer body" as used herein includes a film or sheet, preferably a film or sheet. "Film" refers to a thin, generally flat, shaped body relative to both length and width. Unless otherwise specified, "film" as used herein may be either a single layer or a multilayer.

[0036] In addition, in this specification, "mass parts" represents the relative amount of a component, and "mass %" represents the absolute amount of a component.

[0037] The resin film of the present embodiment is characterized in that at least one surface satisfies the following formula (1).

[0038] Formula (1)

[0039] 1.00≤S10z*log(Spd)≤10.00

[0040] (In formula (1), S10z represents the sum of S5p and S5v,

[0041] S5p represents the average value of the local height from the highest peak to the fifth highest peak (unit: μm), S5v represents the average value of the local depth from the deepest valley to the fifth deepest valley bottom (unit: μm), and Spd represents the average value of the local depth of the resin film per 1 mm. 2 The number of convex parts (unit: piece), S5p, S5v and Spd are the values ​​specified in ISO25718-2:2012.

[0042] By adopting such a configuration, a resin film having excellent slip properties and transparency can be obtained.

[0043] In addition, “*” in S10z*log(Spd) means “×” (product).

[0044] That is, for resin film, from the viewpoint of improving the transportability of film, anti-wrinkle, sometimes require the slipperiness of the degree of non-sticking and the tight adhesion (anti-blocking) of suppressing film. Here, anti-blocking means that film can be easily peeled off even if it is close to each other. Figure 2 (a) is a schematic diagram showing a state where a smooth resin film is slid on a smooth resin film. As described above, when a smooth resin film is carried on a smooth resin film, there is no sliding property. In order to impart sliding property to the smooth resin film, it is possible to consider the following method: Figure 2 As shown in the schematic diagram of (b), fine concavo-convex is provided on the surface of the resin film. When fine concavo-convex is provided on the surface of the resin film, the contact area between the resin films is reduced, and high sliding property is achieved. Figure 2 In the figure, 21 represents a resin film having a smooth surface, and 22 represents a resin film having fine concavoconvexities on the surface. Figure 2In the embodiment, fine concavo-convex is provided on both sides of the two resin films. However, as shown in the examples described later, fine concavo-convex is provided on at least one resin film to achieve the generally desired sliding property.

[0045] One method for creating fine irregularities on the surface of a smooth resin film is to add fine particles to the film and use the particles to create the fine irregularities on the film surface. However, this method of adding fine particles can sometimes impair transparency due to the difference in refractive index between the particles and the resin.

[0046] In contrast, in the present embodiment, by providing the concavo-convex that satisfies the prescribed formula on the surface of the resin film, transparency can be maintained and desired slippage can be achieved. This inference mechanism can be considered as described below. That is, it is inferred that in order to give equal consideration to transparency and slippage, the number of convex portions on the surface of the resin film and the influence of the height of the convex portions are affected. It can be believed that when the number of convex portions is small and the height is small, the contact area between the films increases and the slippage decreases. On the other hand, when the number of convex portions is large and the height is large, the transparency is poor. It is particularly inferred that the influence of the height of the convex portions is large for transparency. In the present embodiment, it is inferred that by adjusting S10z, which is an index representing the height of the convex portions, and Spd, which is an index representing the number of convex portions per unit area of ​​the resin film, to a prescribed range, a resin film with excellent slippage and transparency can be obtained.

[0047] Hereinafter, the physical properties of the resin film of this embodiment will be described in detail.

[0048] The resin film of this embodiment satisfies the following formula (1).

[0049] Formula (1)

[0050] 1.00≤S10z*log(Spd)≤10.00

[0051] (In formula (1), S10z represents the sum of S5p and S5v,

[0052] S5p represents the average value of the local height from the highest peak to the fifth highest peak (unit: μm), S5v represents the average value of the local depth from the deepest valley to the fifth deepest valley bottom (unit: μm), and Spd represents the average value of the local depth of the resin film per 1 mm. 2 The number of convex parts (unit: piece), S5p, S5v and Spd are the values ​​specified in ISO25718-2:2012.

[0053] In the resin film of this embodiment, the lower limit of formula (1) is 1.00 or greater. By setting it to 1.00 or greater, the slip properties of the resin film are improved. The lower limit of formula (1) is preferably 1.20 or greater, more preferably 1.30 or greater, further preferably 1.40 or greater, even more preferably 1.50 or greater, and even more preferably 1.60 or greater.

[0054] In the resin film of this embodiment, the upper limit of formula (1) is 10.00 or less. By setting it to 10.00 or less, transparency can be improved. The upper limit of formula (1) is preferably 8.00 or less, more preferably 6.00 or less, further preferably 4.00 or less, even more preferably 3.00 or less, further preferably 2.50 or less, and further preferably 2.40 or less.

[0055] In the resin film of this embodiment, S10z represents the sum of the average local height (S5p, unit: μm) of the fifth highest peak, ranked from the highest peak, and the average local depth (S5v, unit: μm) of the fifth deepest valley, ranked from the deepest valley. Here, height refers to the convex portion perpendicular to the film surface of the resin film, and depth refers to the concave portion perpendicular to the film surface. It is speculated that the presence of concave and convex portions in the resin film reduces the contact area between the resin film and other films, thereby improving sliding properties.

[0056] The lower limit of S10z is preferably 0.10 μm or more, more preferably 0.20 μm or more, even more preferably 0.45 μm or more, even more preferably 0.50 μm or more, and even more preferably 0.55 μm or more. Furthermore, the upper limit of S10z is preferably 8.00 μm or less, more preferably 5.00 μm or less, even more preferably 2.00 μm or less, even more preferably 1.50 μm or less, even more preferably 1.20 μm or less, even more preferably 1.10 μm or less, and particularly preferably 1.00 μm or less. By setting the upper limit below the upper limit, a resin film with even better transparency can be obtained.

[0057] S10z is a value specified in ISO 25718-2:2012 and is measured according to the description in the Examples described below.

[0058] In the resin film of this embodiment, Spd represents the thickness of the resin film per 1 mm. 2 By setting the number of convex portions within a predetermined range, the contact area between the resin film and other films can be reduced, thereby improving the sliding property.

[0059] The lower limit of Spd is preferably 150 pieces / mm 2 More than 200 pieces / mm 2More than 250 pieces / mm 2 More than 300 pieces / mm 2 More than 320 pieces / mm 2 In addition, the upper limit of the above Spd is preferably 3000 pieces / mm 2 Below, more preferably 2000 pieces / mm 2 Below, more preferably 1000 pieces / mm 2 Below, more preferably 800 pieces / mm 2 Below, more preferably 600 pieces / mm 2 Below, more preferably 580 / mm 2 Below, particularly preferably 550 pieces / mm 2 By setting it below the said upper limit, the resin film which is more excellent in transparency can be obtained.

[0060] Spd is a value specified in ISO 25718-2:2012 and is measured according to the description in the Examples described below.

[0061] In the resin film of this embodiment, the area ratio of the protrusions with a height of 0.04 μm or greater among the protrusions is preferably 0.2% or greater, more preferably 0.4% or greater, even more preferably 0.6% or greater, even more preferably 0.8% or greater, and even more preferably 0.9% or greater. By setting the area ratio above the lower limit, the resin film can be given even better lubricity. Furthermore, the upper limit of the area ratio is preferably 8% or less, more preferably 7% or less, even more preferably 6% or less, even more preferably 5.5% or less, and can also be 4.5% or less, 3.0% or less, 2.0% or less, or 1.5% or less. By setting the area ratio below the upper limit, a resin film with even better transparency can be obtained.

[0062] The resin film of this embodiment preferably has a thickness of 20 μm or greater, more preferably 22 μm or greater, even more preferably 24 μm or greater, even more preferably 26 μm or greater, and even more preferably 28 μm or greater. By setting the thickness above the lower limit, a resin film having better handleability and durability suitable for a protective film can be obtained. Furthermore, the thickness of the resin film is preferably 300 μm or less, more preferably 200 μm or less, even more preferably 175 μm or less, even more preferably 150 μm or less, even more preferably 120 μm or less, and even more preferably 105 μm or less. By setting the thickness below the upper limit, the bending resistance of the resin film can be further improved.

[0063] The thickness of the resin film was measured according to the description in the Examples described later.

[0064] In the resin film of this embodiment, the thickness of the thickest portion (for example, the highest convex portion) is preferably not more than +10% of the average thickness of the resin film, and more preferably not more than +5%.

[0065] The resin film of this embodiment preferably has a low haze. Specifically, the haze of the resin film of this embodiment is preferably 10% or less, more preferably 7% or less, even more preferably 5% or less, even more preferably 3% or less, and even more preferably 1% or less. By keeping the haze below the upper limit, defects can be inspected online while the resin film is attached as a protective film. The lower limit of the haze of the resin film of this embodiment is ideally 0%, but is practically 0.01% or greater.

[0066] It is particularly preferred that the resin film has a thickness of 20 to 300 μm and satisfies the above-mentioned haze.

[0067] The haze of the resin film was measured according to the description in the Examples described below.

[0068] The resin film of this embodiment preferably has a low coefficient of kinetic friction. Specifically, the root mean square roughness of the resin film of this embodiment can be measured as the coefficient of kinetic friction between the film and a film having a thickness of 0.093 μm. The coefficient of kinetic friction is preferably 3.0 or less, more preferably 1.8 or less, and even more preferably 1.5 or less. The lower limit is, for example, 0.1 or greater.

[0069] The above-mentioned coefficient of dynamic friction is a value measured under the conditions of a thread speed of 100 mm / min and a pressure sensor of 10 N. Specifically, it is measured by the method described in the Examples below.

[0070] Materials

[0071] Next, the materials constituting the resin film will be described.

[0072] The resin film of this embodiment includes a thermoplastic resin. The type of the thermoplastic resin is not particularly limited, and it may be an amorphous resin or a crystalline resin. However, from the viewpoint of transparency, an amorphous resin is preferred.

[0073] Examples of the thermoplastic resin include polycarbonate resins, polyester resins, polyamide resins, polyacetal resins, cycloolefin resins, polyacrylate resins, acrylic resins, and polystyrene resins, and polycarbonate resins are preferred.

[0074] The polycarbonate resin is preferably a bisphenol A polycarbonate resin. By using a bisphenol A resin, a resin film exhibiting improved durability and heat resistance, as well as improved transferability, can be obtained. A bisphenol A polycarbonate resin is a resin having carbonate structural units derived from bisphenol A and its derivatives, preferably having a structural unit represented by the following formula (A-1). The * in the formula indicates the bonding position with other structural units and terminal groups.

[0075]

[0076] In formula (A-1), X 1 The following structure is shown.

[0077]

[0078] R 5 and R 6 is an alkyl group or a hydrogen atom, preferably at least one is a methyl group, and more preferably neither is a methyl group.

[0079] Formula (A-1) is preferably represented by the following formula (A-2).

[0080]

[0081] The content of the structural unit represented by formula (A-1) in the bisphenol A polycarbonate resin is preferably 70 mol% or more, more preferably 80 mol% or more, and further preferably 90 mol% or more in all the structural units excluding the two terminals. The upper limit is not particularly limited, and 100 mol% can be the structural unit represented by formula (A-1). As a bisphenol A polycarbonate resin, a resin in which substantially all the structural units excluding the two terminals are composed of structural units of formula (A-1) is particularly preferred. Specifically, substantially all the structural units excluding the two terminals here refer to 99.0 mol% or more, preferably 99.5 mol% or more, and more preferably 99.9 mol% or more of all the structural units excluding the two terminals.

[0082] The bisphenol A polycarbonate resin may have other structural units other than the carbonate structural units derived from bisphenol A and its derivatives. As dihydroxy compounds constituting such other structural units, for example, aromatic dihydroxy compounds described in paragraph 0014 of JP-A-2018-154819 can be cited, and these contents are cited in this specification.

[0083] The proportion of the thermoplastic resin (preferably an amorphous resin, more preferably a polycarbonate resin) in the resin film of this embodiment is preferably 90% by mass or more, more preferably 95% by mass or more, and even more preferably 97% by mass or more. By setting it to above the above lower limit, a resin film with even better transparency is obtained. The upper limit of the proportion of the thermoplastic resin in the resin film of the above embodiment can be 100% by mass.

[0084] The resin film of this embodiment may contain only one type of thermoplastic resin or may contain two or more types. When containing two or more types, the total amount is preferably within the above range.

[0085] <Other ingredients>

[0086] The resin film of the present embodiment may contain other ingredients in addition to the thermoplastic resin, within the scope of the present invention. Specifically, it may contain antioxidants, transesterification inhibitors, release agents, heat stabilizers, flame retardants, flame retardant additives, ultraviolet absorbers, colorants, antistatic agents, fluorescent whitening agents, antifogging agents, flow improvers, plasticizers, dispersants, antibacterial agents, antiblocking agents, impact modifiers, slip improvers, hue improvers, oxygen scavengers, etc. These ingredients can be used alone or in combination.

[0087] For details of the antioxidant, reference can be made to paragraphs 0057 to 0061 of JP-A-2017-031313, the contents of which are incorporated herein by reference.

[0088] For details of the transesterification inhibitor, reference can be made to paragraphs 0035 to 0039 of International Publication No. 2015 / 190162, paragraph 0037 of Japanese Patent Application Laid-Open No. 2019-002023, and paragraph 0041 of Japanese Patent Application Laid-Open No. 2018-199745, the contents of which are incorporated herein by reference.

[0089] For details of the release agent, reference can be made to paragraph 0032 of JP-A-2017-226848 and paragraph 0056 of JP-A-2018-199745, the contents of which are incorporated herein by reference.

[0090] <Method for producing resin film>

[0091] The method for producing the resin film of this embodiment can employ any known method as long as the desired concavo-convex shape can be formed. For example, the method for producing the resin film of this embodiment includes applying a melt-extruded thermoplastic resin to a sandblasted roller to form convex portions on the film surface. Alternatively, the method for producing the resin film of this embodiment can be produced by hot pressing using a sandblasted press plate.

[0092] The resin film of this embodiment can be manufactured by forming unevenness on the surface of the resin film. Therefore, it is also possible to manufacture the resin film without adding microparticles to the film and using the microparticles to form fine unevenness on the surface of the film. Therefore, in the resin film of this embodiment, the amount of inorganic particles contained in the resin film can be less than 0.01% by mass, can be less than 0.001% by mass, or can be substantially 0% by mass. Substantially 0% by mass means that the resin film contains no intentionally added inorganic particles, including impurities.

[0093] The resin film of this embodiment may be a single-layer film or a multilayer film composed of multiple thermoplastic resin layers. The multilayer film can be produced by a known method. For example, when using T-die melt extrusion, the multilayer film can be formed by laminating multiple thermoplastic resins inside the die to form a film, or by laminating multiple thermoplastic resins after separately forming them into films.

[0094] <Application>

[0095] The resin film of the present embodiment can be used as a monolayer film. In addition, the resin film of the present embodiment can also be used as a multilayer having the above-mentioned resin film and at least one other layer. As the above-mentioned other layer, a known layer can be adopted, and an adhesive layer can be exemplified.

[0096] The resin film of this embodiment is preferably used as a masking film. It is more preferably used as an anti-blocking film. Furthermore, it is also preferably used as a protective film constituting a transparent conductive film. In particular, a transparent conductive film comprising a protective layer, an adhesive layer, a substrate, and an electrode layer in this order is preferably a transparent conductive film in which at least one of the substrate and the protective layer (preferably at least the protective layer) is used.

[0097] Furthermore, the transparent conductive film is preferably used as a transparent conductive film used in film sensors for touch panels, electronic paper, dye-sensitized solar cells, touch sensors, and the like.

[0098] Furthermore, the resin film of the present embodiment is preferably used as a film for applications requiring slipperiness and transparency in addition to the above-mentioned properties.

[0099] Example

[0100] Below, enumerate embodiment, more specifically the present invention is described. Materials, usage, ratio, processing content, processing steps etc. shown in the following embodiment can be appropriately changed as long as they do not exceed the gist of the present invention. Therefore, the scope of the present invention is not limited by the specific example shown below.

[0101] If the measuring instruments used in the examples are difficult to obtain due to discontinuation of production, other instruments with equivalent performance may be used for measurement.

[0102] Example 1, Example 2, Comparative Example 1

[0103] A bisphenol A polycarbonate resin film (manufactured by Mitsubishi Gas Chemical Co., Ltd., FE-2000, 100 μm thick, free of inorganic particles) having a masking film on one surface is hot-pressed at 180°C, 0.6 MPa, and a pressurizing time of 10 minutes using a sandblasted stainless steel plate so that the masking film has the desired concave portions on the surface, and the desired concave-convex shape shown in Table 1 is applied, and the film is cooled and solidified to obtain the resin film of this embodiment.

[0104] The following measurements were performed on the obtained resin film.

[0105] <Measurement of S5p, S5v, Spd, and Area Ratio of Convex Portions [%]>

[0106] For the surface of the obtained resin film with a concave-convex shape, the S5p, S5v and Spd specified in ISO25718-2:2012 were measured using a scanning white interference microscope VS1550 manufactured by Hitachi High-Technologies Corporation. The value of S10z was calculated by adding the measured values ​​of S5p and S5v. In addition, the value of formula (1) (S10z*log(Spd)) was calculated based on the values ​​of Spd and S10z. Measurements were performed and analyzed at any three locations, and the average value was used. The unit of S5p is μm, the unit of S5v is μm, and the unit of Spd is per 1 mm 2 Number of pieces (unit: pieces / mm 2 ).

[0107] The measurement conditions are as follows.

[0108] Measurement conditions

[0109] Field of view: multiple fields of view

[0110] Aperture of the CCD camera used for measurement: 1 / 3 inch

[0111] Objective lens magnification: ×10

[0112] Observation area: 947.311×865.380μm 2 、

[0113] Field of view: 439×480 pixels

[0114] Measurement mode: wave mode

[0115] Wavelength filter: 530nm White

[0116] Scanning range: ±5μm

[0117] Observation conditions

[0118] Interpolation conditions: Complete interpolation

[0119] Surface correction condition: 4th-order polynomial approximation

[0120] In addition, the area ratio of the convex portions (the area ratio occupied by convex portions having a height of 0.04 μm or more) was measured as follows.

[0121] The surface profile of the resin film obtained by hot pressing, which had an uneven surface, was measured and analyzed using the following measurement equipment and conditions. Binary analysis was performed using a height threshold of 0.040 μm. The total area of ​​convexities greater than 0.040 μm was divided by the observed area to calculate the convex area ratio. Measurements and analysis were performed at three random locations, and the average value was used.

[0122] For the measurement, a scanning white interference microscope VS1550 (manufactured by Hitachi High-Technologies Corporation) was used.

[0123] The measurement conditions are as follows.

[0124] Measurement conditions

[0125] Field of view: Single field of view

[0126] Aperture of the CCD camera used for measurement: 1 / 3 inch

[0127] Objective lens magnification: ×5

[0128] Observation area: 701.52×935.267(μm 2 )

[0129] Field of view: 640×480 pixels

[0130] Measurement mode: wave mode

[0131] Wavelength filter: 530nmWhite

[0132] Scanning range: ±5μm

[0133] Observation conditions

[0134] Interpolation conditions: Complete interpolation

[0135] Surface correction condition: 4th-order polynomial approximation

[0136] Particle analysis

[0137] Analysis: Protrusion analysis

[0138] Threshold: 0.040 μm

[0139] Reference plane: zero plane

[0140] <Resin film thickness>

[0141] The thickness was measured at five points in the film width direction, and the average value was adopted.

[0142] For the measurement, a micrometer (MDC-25PX) manufactured by MITUTOYO Co., Ltd. was used.

[0143] Furthermore, the thickness of the thickest portion of the resin film is within 5% of the average thickness of the resin film.

[0144] <Measurement of dynamic friction coefficient>

[0145] The dynamic friction coefficient of the resulting resin film was measured using a friction coefficient measuring machine. Specifically, a film having a surface root mean square roughness of 0.093 μm and the resin film obtained above were placed in an overlapping manner. The resin film was slid against the film having a surface root mean square roughness of 0.093 μm at a thread speed of 100 mm / min and a pressure sensor of 10 N to measure the dynamic friction coefficient.

[0146] A friction coefficient measuring machine manufactured by Toyo Seiki Co., Ltd. ("friction coefficient measuring machine") was used.

[0147] A film having a root mean square roughness of 0.093 μm was used, which was a bisphenol A polycarbonate resin film (manufactured by Mitsubishi Gas Chemical Co., Ltd., FE-2000, 100 μm thick) with a masking film applied to one surface. In this example, the masked surface of the bisphenol A polycarbonate resin film, from which the masking film was peeled off, was placed on the right end of the test bench with its long axis aligned with the long axis. The resulting film was then attached to the underside of a 63 mm x 63 mm, 200 g thread, with the polycarbonate resin film and the resulting resin film overlapping. The resulting resin film was then slid over the film as described above to measure the coefficient of dynamic friction.

[0148] When it cannot be measured, it is recorded as unmeasurable.

[0149] <Haze Measurement>

[0150] The haze (%) of the obtained resin film was measured using a haze meter under the conditions of a D65 light source and a 10° field of view.

[0151] The haze meter used was "HM-150" manufactured by Murakami Color Research Laboratory Co., Ltd.

[0152] Example 3, Comparative Example 2

[0153] Polycarbonate resin pellets (Iupilon E-2000, manufactured by Mitsubishi Engineering-Plastics Corporation) were extruded into a molten state using a T-die melt extruder with a vented twin-screw extruder (TEX30α, manufactured by The Japan Steel Works, Ltd.) with a barrel diameter of 32 mm and a screw L / D ratio of 31.5. The extruder was operated at a rate of 10 kg / h and a screw speed of 150 rpm. The extruder was then pressed between first and second rolls and cooled to solidify, forming a film. The film thickness was adjusted to 50 μm by varying the roll speeds of the first and second rolls. The barrel and die temperatures were maintained at 300°C.

[0154] The details of the first roll and the second roll used are as follows.

[0155] First roller: Silicone rubber roller (IT68S-MCG) manufactured by Mochida Shoko Co., Ltd.

[0156] Size: outer diameter 260mm × width 600mm

[0157] Roller temperature: 50°C

[0158] Second roller: A metal rigid roller with the desired concave surface after sandblasting

[0159] Core diameter: outer diameter 250mm × width 600mm

[0160] Roller temperature: 140°C

[0161] In the same manner as in Example 1, S5p, S5v, Spd, the area ratio [%] of the convex portions, the thickness of the resin film, the dynamic friction coefficient, and the haze were measured.

[0162] Comparative Example 3

[0163] In Example 3, the same procedure was carried out except that the following roller was used as the second roller.

[0164] Second roller: hard chrome treated mirror metal rigid roller

[0165] Core diameter: outer diameter 250mm × width 600mm

[0166] Roller temperature: 140°C

[0167] [Table 1]

[0168]

[0169] Explanation of symbols

[0170] 10 Transparent conductive film

[0171] 11. Electrode layer (transparent conductive film)

[0172] 12 Base material

[0173] 13 Adhesive layer

[0174] 14 Protective film

[0175] 21 Polycarbonate resin film with smooth surface

[0176] 22 Polycarbonate resin film with fine concavo-convex patterns on the surface

Claims

1. A resin film, characterized in that: At least one surface satisfies the following formula (1), and the amount of inorganic particles contained in the resin film is less than 0.01% by mass. Formula (1) 1.00≤S10z*log(Spd)≤10.00 In formula (1), S10z represents the sum of S5p and S5v, S5p represents the average value of the local height from the highest peak to the fifth highest peak, in μm, S5v represents the average value of the local depth from the deepest valley to the fifth deepest valley, in μm, Spd represents the average value of the local depth per 1 mm of the resin film 2 The number of convex parts is in pieces. S5p, S5v and Spd are the values ​​specified in ISO25718-2:2012.

2. The resin film according to claim 1, wherein: In the resin film, an area ratio of convex portions having a height of 0.04 μm or greater among the convex portions is 0.2% to 8%.

3. The resin film according to claim 1 or 2, wherein: Its thickness is 20 to 300 μm.

4. The resin film according to claim 1 or 2, wherein: The amount of the inorganic particles contained in the resin film is substantially 0% by mass.

5. The resin film according to claim 1 or 2, wherein: The resin film includes an amorphous resin.

6. The resin film according to claim 1 or 2, wherein: The resin film includes a polycarbonate resin.

7. The resin film according to claim 1 or 2, wherein: It is a single-layer film.

8. The resin film according to claim 1 or 2, wherein: The haze is 10% or less.

9. A multilayer body, characterized in that: The invention comprises the resin film according to any one of claims 1 to 8 and at least one other layer.

10. The multilayer body according to claim 9, wherein: The other layers include an adhesive layer.

11. A transparent conductive film, characterized in that: In order: protective layer, Adhesive layer, substrate, and electrode layer, At least one of the substrate and the protective layer is the resin film according to any one of claims 1 to 8.

12. A method for producing a resin film, for producing the resin film according to any one of claims 1 to 8, wherein: The method includes applying a melt-extruded thermoplastic resin to a sandblasted roller to form projections on the film surface.

Images