A high voltage test and sorting conveyor line for semiconductor components

Abstract

The semiconductor component high-voltage test and sorting conveyor line of the present invention has a material receiving mechanism that receives a material tube loaded with a plurality of semiconductor components when in a horizontal position, and then is driven by a flipping drive mechanism to dock with an automatic blanking mechanism, so that a plurality of semiconductor components automatically slide along an inclined blanking channel into the component high-voltage test mechanism, thereby realizing high-voltage testing of a plurality of semiconductor components, and having high component testing efficiency. Moreover, after the component sorting mechanism completes sorting of semiconductor components of each group, it outputs the semiconductor components in a track conveying manner, thereby preferably avoiding positional displacement when the semiconductor components are output, and having a good use effect.

Description

Technical Field

[0001] The invention belongs to the technical field of high-voltage testing of semiconductor components, and in particular relates to a high-voltage testing and sorting conveying line for semiconductor components. Background Art

[0002] Existing electrical components, such as semiconductor components, have input and output pins on both sides. After manufacturing, the semiconductor components are generally subjected to high-voltage testing to detect whether the performance of the product is qualified. Existing high-voltage test and sorting equipment for testing semiconductor components generally uses a gripper vacuum suction cup assembly to perform loading testing and unloading sorting on the semiconductor components. However, the gripper vacuum suction cup assembly can only grab one semiconductor component at a time for testing, and the work efficiency is low. Moreover, when the semiconductor component is grabbed by the gripper vacuum suction cup assembly, after multiple re-grasping of the semiconductor component during the loading process, the release during the test process, and the unloading process, it is easy to cause a large cumulative position deviation between the gripper and the semiconductor component, causing the position of the gripper to output the semiconductor component to the production line The work station is offset, thereby affecting the production efficiency of the production line.

[0003] It can be seen that the existing technology still needs to be improved and enhanced. Summary of the invention

[0004] In view of the above-mentioned deficiencies of the prior art, the purpose of the present invention is to overcome the deficiencies of the prior art and provide a semiconductor component high-voltage test and sorting conveyor line that can perform high-voltage tests on multiple semiconductor components at the same time and prevent positional displacement during semiconductor component discharge and output.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A semiconductor component high-voltage test and sorting conveyor line, comprising a control module, a blanking conveying device, a component high-voltage test mechanism and a component sorting mechanism; the blanking conveying device comprises an automatic blanking mechanism, a receiving mechanism whose one end is rotatably connected to the upstream end of the automatic blanking mechanism, a flipping drive mechanism and a first blocking mechanism, the automatic blanking mechanism is provided with a blanking channel arranged downwardly inclined, the flipping drive mechanism is used to drive the driven receiving mechanism to switch between a horizontal position and an inclined position, the upstream end of the receiving mechanism is used to receive a material tube loaded with a plurality of semiconductor components in the material tube in a horizontal position and unload a group of semiconductor components in the material tube into the blanking channel in an inclined position, the first blocking mechanism is used to block and release the semiconductor components in the blanking channel to be transported downstream; the component high-voltage test mechanism is arranged at the downstream of the blanking conveying device, and comprises a test conveying track connected to the downstream end of the blanking channel, a power connection module located on both sides of the test conveying track, a test drive mechanism, a first power conveying mechanism and a second blocking mechanism, the test conveying track is provided with a test station, the first power conveying mechanism is used to drive the semiconductor components of the test conveying track to be transported downstream, and the second blocking mechanism The mechanism is used to limit the semiconductor components on the test conveying track at the test station or release the semiconductor components for conveyance in the downstream direction. The test driving mechanism is used to drive the two power connection modules to move or reset to one side of the semiconductor component respectively, so that the multiple power connection terminals on the power connection module are connected one by one with each semiconductor component pin respectively, so as to perform a high-voltage power-on test on the semiconductor component. The control module is used to identify the group of semiconductor components that fail the high-voltage power-on test and the group of all qualified semiconductor components respectively; the component sorting mechanism includes a translation driving mechanism, a sorting conveying track connected to the downstream end of the test conveying track, a component output mechanism, a component recovery mechanism, a third blocking mechanism and a second power conveying mechanism; the third blocking mechanism is used to limit the entering semiconductor components in the sorting conveying track, the translation driving mechanism is used to drive the sorting conveying track to connect with the component output mechanism or the component recovery mechanism respectively, so that the second power conveying mechanism respectively conveys the semiconductor components of the qualified mark group to the component output mechanism and separately conveys the semiconductor components of the unqualified mark group to the component output mechanism.

[0007] Furthermore, the flip driving mechanism includes a bracket, a flip driving push rod and a driving arm, the driving arm is rotatably connected to the upstream end of the automatic blanking mechanism and the output end of the flip driving push rod respectively, the material receiving mechanism is arranged on the driving arm, the flip driving push rod is connected to the bracket, and the flip driving push rod drives the driving arm to make the material receiving mechanism horizontally placed on the bracket or obliquely docked with the automatic blanking mechanism; through such an arrangement, the setting method of the flip driving mechanism is simple, and the driving material receiving mechanism has a good relative flipping effect.

[0008] Furthermore, the bracket is horizontally arranged, and the bracket is provided with a buffer assembly, and the material receiving mechanism is placed on the bracket through the buffer assembly; through such an arrangement, the loss caused by hard collision between the material receiving mechanism and the bracket can be effectively avoided, and the product can be used reliably.

[0009] Furthermore, at least two component high-voltage testing mechanisms are continuously provided along the downstream direction of the blanking conveying device; by such an arrangement, the working efficiency of component high-voltage testing is effectively improved.

[0010] Furthermore, the test drive mechanism includes a test drive push rod and a slide rail assembly, the power connection module is arranged on the slide rail assembly, and the test drive push rod is transmission connected to the power connection module; through such an arrangement, the test drive mechanism has a simple structure, and the driving effect of moving the power connection module is stable and smooth.

[0011] Furthermore, the component high-voltage testing mechanism and the blanking channel are arranged obliquely in the same direction, the component high-voltage testing mechanism is set horizontally, and the sorting conveying track and the testing conveying track are transitionally connected by an arc guide track; through such an arrangement, it is convenient for semiconductor components to slide smoothly from the testing conveying track into the sorting conveying track.

[0012] Furthermore, the translation drive mechanism includes a mounting frame and a translation drive motor, a first pulley, a second pulley and a transmission belt arranged on the mounting frame, the transmission belt is respectively wound around the first pulley and the second pulley, the translation drive motor is connected to the first pulley in transmission, the sorting conveying track is arranged on the transmission belt, and the translation drive motor drives the sorting conveying track to dock with the component output mechanism or the component recovery mechanism in the translation direction; through such an arrangement, the translation drive mechanism has a simple structure and can drive the sorting conveying track to move quickly.

[0013] Furthermore, a test conveying channel is provided in the test conveying track, and the first power conveying mechanism includes a plurality of first conveying air paths arranged on the test conveying track and obliquely arranged along the downstream conveying direction and connected to the test conveying channel, and the plurality of first conveying air paths are respectively connected to the airflow generating device; when the translation driving mechanism drives the sorting conveying track to move relatively, the downstream end of the sorting conveying track is docked with the component output mechanism, or the upstream end of the sorting conveying track is docked with the component recovery mechanism; a sorting conveying channel is provided in the sorting conveying track, and the second power conveying mechanism includes a plurality of first conveying air paths arranged on the top of the sorting conveying track and obliquely arranged along the downstream conveying direction and connected to the sorting conveying channel A second conveying air path connected to the sorting conveying channel, a plurality of third conveying air paths arranged on the side of the sorting conveying track and obliquely arranged along the downstream conveying direction and connected to the sorting conveying channel, and a blowing device, the plurality of second conveying air paths and the third conveying air paths are respectively connected to the airflow generating device, the airflow generating device enters the airflow of the sorting conveying channel through the second conveying air path and the third conveying air path, so that the semiconductor components in the sorting conveying channel are moved to the component output mechanism, and the blowing device is used to generate an airflow that moves the semiconductor components in the sorting conveying channel to the component recovery mechanism; through such an arrangement, the power conveying mechanism is driven by airflow transmission, and the semiconductor component movement driving effect is good.

[0014] Furthermore, power connection avoidance ports are respectively provided on both sides of the test conveying track, and the pins on both sides of the semiconductor components in the test conveying track are connected to the outside through the corresponding power connection avoidance ports respectively; through such an arrangement, it is convenient for the power connection modules on both sides to perform high voltage testing through the power connection avoidance ports respectively.

[0015] Furthermore, the automatic blanking mechanism includes a blanking conveying track, the blanking channel is arranged in the blanking conveying track, the blanking conveying track is provided with a first avoidance hole corresponding to the first blocking mechanism, and the first blocking member of the first blocking mechanism can extend into the blanking channel through the first avoidance hole to achieve a blocking effect; the test conveying track is provided with a second avoidance hole corresponding to the second blocking mechanism, and the second blocking member of the second blocking mechanism can extend into the test conveying channel through the second avoidance hole to achieve a blocking effect; the sorting conveying track is provided with a third avoidance hole corresponding to the third blocking mechanism, and the third blocking member of the third blocking mechanism can extend into the sorting conveying channel through the third avoidance hole to achieve a blocking effect.

[0016] Beneficial effects: Compared with the prior art, the semiconductor component high-voltage test and sorting conveyor line of the present invention, after the material receiving mechanism receives the material tube loaded with a plurality of semiconductor components in the horizontal position, it is driven by the flipping drive mechanism to dock with the automatic blanking mechanism, so that the multiple semiconductor components automatically slide along the inclined blanking channel into the component high-voltage test mechanism, so that multiple semiconductor components can be subjected to high-voltage testing, and the component testing efficiency is high. Moreover, after the component sorting mechanism completes the sorting of each group of semiconductor components, the semiconductor components are output in a track conveying manner, which can better avoid the position displacement of the semiconductor components when they are output, and the use effect is good. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the high-voltage test and sorting conveyor line for semiconductor components.

[0018] Figure 2 It is a schematic diagram of the blanking conveying device.

[0019] Figure 3 It is a schematic diagram of the automatic blanking mechanism and the material receiving mechanism.

[0020] Figure 4 Schematic diagram of the high-voltage testing mechanism for components.

[0021] Figure 5 Schematic diagram of the test conveying track and the second blocking mechanism.

[0022] Figure 6 Schematic diagram of the component sorting mechanism.

[0023] Figure 7 This is a schematic diagram of the third conveying gas path being located on the sorting and conveying track.

[0024] Figure 8 This is a schematic diagram of a component recycling organization.

[0025] Fig. 9 It is a schematic diagram of a component recovery mechanism, a component output mechanism and a component sorting mechanism.

[0026] Fig.10 Schematic diagram of the high voltage test device.

[0027] Explanation of the main component symbols: 1-blanking conveying device, 2-component high-voltage testing mechanism, 13-material receiving mechanism, 3-component sorting mechanism, 4-flipping drive mechanism, 12-first blocking mechanism, 11-blanking conveying track, 111-blanking channel, 5-material tube, 51-semiconductor component, 21-test conveying track, 22-power module, 23-test drive mechanism, 24-second blocking mechanism, 25-test station, 20-base, 32-translation drive mechanism, 33-sorting conveying track, 34-component output mechanism, 35-component recovery mechanism, 36-third blocking mechanism, 41-bracket, 42-flipping drive push rod, 43-drive arm, 44-buffer assembly, 231-test drive push rod, 232-slide rail assembly, 26-arc guide rail , 321-mounting frame, 322-translational drive motor, 323-first pulley, 324-second pulley, 325-transmission belt, 61-first conveying air path, 611-first power conveying mechanism, 621-second power conveying mechanism, 62-second conveying air path, 63-third conveying air path, 27-power connection avoidance port, 121-first avoidance hole, 211-test conveying channel, 331-sorting conveying channel, 241-second avoidance hole, 361-third avoidance hole, 122-first driver, 123-first blocking member, 242-second driver, 243-second blocking member, 362-third driver, 363-third blocking member, 16-fourth blocking mechanism, 351-blowing device, 221-upper test piece, 222-lower test piece. DETAILED DESCRIPTION

[0028] The present invention provides a semiconductor component high voltage test sorting transmission line. In order to make the purpose, technical solution and effect of the present invention clearer and more specific, the present invention is further described in detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the scope of protection of the present invention.

[0029] See also Figures 1 to 8The semiconductor component high-voltage test and sorting conveyor line of the present invention comprises a rack (not shown) and a control module arranged on the rack, a blanking conveying device 1, a component high-voltage testing mechanism 2 and a component sorting mechanism 3; the blanking conveying device 1 comprises an automatic blanking mechanism, a receiving mechanism 13 whose one end is rotatably connected to the upstream end of the automatic blanking mechanism, a swing driving mechanism 4 and a first blocking mechanism 12, the automatic blanking mechanism is provided with a blanking channel 111 arranged downwardly inclined, the swing driving mechanism 4 is used to drive the receiving mechanism 13 to switch between a horizontal position and an inclined position, the upstream end of the receiving mechanism 13 is used to receive a material tube 5 loaded with a plurality of semiconductor components 51 in a horizontal position and unload a group of semiconductor components 51 in the material tube 5 into the blanking channel 111 in an inclined position, and the first blocking mechanism 12 is used to block and release the semiconductor components 51 in the blanking channel 111 to be transported downstream.

[0030] The component high-voltage test mechanism 2 is arranged at the downstream of the blanking conveying device 1, and includes a base frame 20 and a test conveying track 21 connected to the downstream end of the blanking channel 111 on the base frame 20, a power connection module 22 located on both sides of the test conveying track 21, a test drive mechanism 23, a first power conveying mechanism 611 and a second blocking mechanism 24. The test conveying track 21 is provided with a test station 25. The first power conveying mechanism 611 is used to drive the semiconductor component 51 of the test conveying track 21 to be conveyed downstream, and the second blocking mechanism 24 is used to transfer the test conveying track 21 to the downstream. The semiconductor component 51 of 21 is limited at the test station 25 or the semiconductor component 51 is released for transportation in the downstream direction. The test drive mechanism 23 is used to drive the two power connection modules 22 to move or reset to one side of the semiconductor component 51 respectively, so that the multiple power connection terminals on the power connection module 22 are respectively connected one by one with the pins of each semiconductor component 51, so as to perform a high-voltage power-on test on the semiconductor component 51. The control module is used to identify the group of semiconductor components 51 that fail the high-voltage power-on test and the group of all qualified semiconductor components 51.

[0031] The component sorting mechanism 3 includes a translation drive mechanism 32, a sorting conveying track 33 connected to the downstream end of the test conveying track 21, a component output mechanism 34, a component recovery mechanism 35, a third blocking mechanism 36 and a second power transmission mechanism 621; the third blocking mechanism 36 is used to limit the entering semiconductor component 51 in the sorting conveying track 33, and the translation drive mechanism 32 is used to drive the sorting conveying track 33 to dock with the component output mechanism 34 or the component recovery mechanism 35 respectively, so that the second power transmission mechanism 621 respectively transports the semiconductor components 51 of the qualified mark group to the component output mechanism 34 and transports the semiconductor components 51 of the unqualified mark group to the component recovery mechanism 35.

[0032] Compared with the prior art, in the semiconductor component high-voltage testing and sorting conveyor line of the present invention, after the receiving mechanism 13 receives the material tube 5 loaded with a plurality of semiconductor components 51 in the horizontal position, it is driven by the flipping drive mechanism 4 to dock with the automatic blanking mechanism, so that the plurality of semiconductor components 51 automatically slide along the inclined blanking channel 111 into the component high-voltage testing mechanism 2, so that the plurality of semiconductor components 51 can be subjected to high-voltage testing, and the component testing efficiency is high. Moreover, after the component sorting mechanism 3 completes the sorting of each group of semiconductor components 51, the semiconductor components 51 are output in a track conveying manner, which can better avoid the position displacement of the semiconductor components 51 when being output, and the use effect is good.

[0033] In one embodiment (not shown), the material receiving mechanism 13 may receive the material by providing a material receiving trough or a material clamping mechanism that is compatible with the material tube 5 .

[0034] See also Figures 1 to 3 In one embodiment, the flip drive mechanism 4 includes a bracket 41, a flip drive push rod 42 and a drive arm 43. The flip drive push rod 42 is preferably a pneumatic push rod or an electric push rod. The drive arm 43 is rotatably connected to the upstream end of the automatic blanking mechanism and the output end of the flip drive push rod 42 respectively. The material receiving mechanism 13 is arranged on the drive arm 43. The flip drive push rod 42 is connected to the bracket 41. The flip drive push rod 42 drives the drive arm 43 to make the material receiving mechanism 13 horizontally placed on the bracket 41 or obliquely docked with the automatic blanking mechanism. Through such a setting, the setting method of the flip drive mechanism 4 is simple, and the driving material receiving mechanism 13 has a good relative flipping effect.

[0035] See also Figures 1 to 3 In one embodiment, the bracket 41 is horizontally arranged, and the bracket 41 is provided with a buffer component 44, such as a nitrogen buffer rod, and the material receiving mechanism 13 is placed on the bracket 41 through the buffer component 44; through such an arrangement, the hard collision between the material receiving mechanism 13 and the bracket 41 can be effectively avoided to cause loss, and the product can be used reliably.

[0036] See also Figure 1 , Figure 4 and Figure 5In one embodiment, the test drive mechanism 23 is provided with one corresponding to each side of the power connection module 22, and the test drive mechanism 23 includes a test drive push rod 231 and a slide rail assembly 232. The test drive push rod 231 is preferably an electric push rod or a pneumatic push rod, etc. The power connection module 22 can be slidably arranged on the base frame 20 through the slide rail assembly 232. The test drive push rod 231 is transmission-connected with the power connection module 22, and the power connection module 22 is driven by the test drive push rod 231 to approach one side of the test conveying track 21 and perform high-voltage testing or relative reset; through such a setting, the test drive mechanism 23 has a simple structure, and the power connection module 22 is driven to move stably and smoothly.

[0037] The material tube 5 can load multiple semiconductor components 51 at one time, and all the power-connecting modules are connected to a high-voltage tester. In this embodiment, two pins are provided on each side of the semiconductor component 51, and a total of four pins are provided. Each test station can test 10 semiconductor components at a time, and the number of power-connecting modules of the high-voltage test device 22 is set to ten groups; each group of power-connecting modules of the high-voltage test device 22 corresponds to two pins on each side of the semiconductor component 51, including two upper test pieces 221 and two lower test pieces 222, and the two upper test pieces 221 of the same group are connected and the two lower test pieces 222 of the same group are also connected. A pair of upper test pieces 221 and lower test pieces 222 are used to perform a high voltage test on a pin of the semiconductor element 51, and the upper test pieces 221 and lower test pieces 222 located in the same vertical direction are staggered. When the pair of upper test pieces 221 and lower test pieces 222 in the same vertical direction contact the same pin of the semiconductor element 51, the pin is used as an intermediary for the upper test piece 221 and the lower test piece 222 to communicate, and the power connection module of the high voltage test device 22 will perform a power-on test. When the upper test piece 221 can successfully energize the lower test piece 222 through the pin, the semiconductor element 51 is a qualified product, otherwise, the semiconductor element 51 is a failed product. The two upper test pieces 221 and lower test pieces 222 located in the same vertical direction are staggered. The advantage of such a staggered arrangement is that it can detect whether the upper test piece 221 and the lower test piece 222 are in good contact with the semiconductor pin. During the test, 10 semiconductor components are tested at high voltage simultaneously, which greatly improves the test effect and test stability compared with the existing technology.

[0038] See also Figure 1 , Figure 4 and Figure 5In one embodiment, at least two of the component high voltage test mechanisms 2 are continuously arranged along the downstream direction of the blanking conveying device 1. In this embodiment, two component high voltage test mechanisms 2 are arranged; through such arrangement, the two component high voltage test mechanisms 2 test semiconductor components at the same time, effectively improving the efficiency of component high voltage testing. Moreover, the two component high voltage test mechanisms 2 share one high voltage tester, reducing the equipment manufacturing cost.

[0039] See also Figure 1 , Figure 4 and Figure 5 In one embodiment, the component high-voltage testing mechanism 2 and the blanking channel 111 are arranged obliquely in the same direction, the component sorting mechanism 3 is arranged horizontally, and the sorting conveying track 33 and the test conveying track 21 are transitionally connected by an arc guide track 26; through such an arrangement, it is convenient for the semiconductor component 51 to slide smoothly from the test conveying track 21 into the sorting conveying track 33.

[0040] See also Figure 1 , Figures 6 to 8 In one embodiment, the translation drive mechanism 32 includes a mounting frame 321 and a translation drive motor 322, a first pulley 323, a second pulley 324 and a transmission belt 325 arranged on the mounting frame 321, the transmission belt 325 is respectively wound around the first pulley 323 and the second pulley 324, the translation drive motor 322 is connected to the first pulley 323 by transmission, the sorting conveying track 33 is arranged on the transmission belt 325 and is arranged on the mounting frame 321 through a guide device, and is driven by the translation drive motor 322 to realize that the sorting conveying track 33 is respectively docked with the component output mechanism 34 or the component recovery mechanism 35 in the translation direction; through such an arrangement, the translation drive mechanism 32 has a simple structure and can drive the sorting conveying track 33 to move quickly.

[0041] See also Figure 1 , Figures 6 to 8 In one embodiment, a test conveying channel 211 is provided in the test conveying track 21, and the first power conveying mechanism 611 includes a plurality of first conveying gas paths 61 which are arranged obliquely along the downstream conveying direction of the test conveying track 21 and connected to the test conveying channel 211. The plurality of first conveying gas paths 61 are respectively connected to the airflow generating device, and the airflow generating device generates an airflow entering the test conveying channel 211 through the first conveying gas path 61, so as to realize the conveying of the semiconductor element 51 in the downstream direction. Through such an arrangement, the power conveying mechanism is driven by pneumatic transmission, and the driving effect of moving the semiconductor element 51 is good.

[0042] See also Figure 1 , Figures 6 to 8In one embodiment, when the translation drive mechanism 32 drives the sorting and conveying track 33 to move relatively, the downstream end of the sorting and conveying track 33 is connected to the component output mechanism 34, or the upstream end of the sorting and conveying track 33 is connected to the component recovery mechanism 35; a sorting and conveying channel 331 is provided in the sorting and conveying track 33, and the second power conveying mechanism 621 includes a plurality of second conveying air paths 62 arranged obliquely along the downstream conveying direction of the sorting and conveying track 33 and connected to the sorting and conveying channel 331, a plurality of third conveying air paths 63 arranged obliquely along the downstream conveying direction of the sorting and conveying track 33 and connected to the sorting and conveying channel 331, and a blowing device 351, and the plurality of second conveying air paths 62 and the plurality of third conveying air paths 63 are respectively connected to the air flow generation device 351. The air blowing device 351 is used to generate an airflow that moves the semiconductor component 51 in the sorting and conveying channel 331 to the component recovery mechanism 35; through such an arrangement, the component output mechanism 34 and the component recovery mechanism 35 are respectively arranged in opposite directions on both sides of the translation drive mechanism 32, so that the sorting and conveying track 33 can transport the semiconductor component 51 to the component output mechanism 34 and the component recovery mechanism 35 respectively, and the power conveying mechanism is driven by pneumatic transmission, so that the semiconductor component 51 can be driven effectively.

[0043] See also Figure 4 and Figure 5 In one embodiment, power connection avoidance ports 27 are respectively provided on both sides of the test conveying track 21, and the pins on both sides of the semiconductor component 51 in the test conveying track 21 are connected to the outside through the corresponding power connection avoidance ports 27; through such a setting, it is convenient for the power connection modules 22 on both sides to perform high voltage testing through the power connection avoidance ports 27 respectively.

[0044] See also Figure 3 In one embodiment, a first blocking mechanism 12 is disposed between a blanking conveying track 11 and a test conveying track 21, the first blocking mechanism 12 includes a first driver 122 and a first blocking member 123, the automatic blanking mechanism includes a blanking conveying track 11, the blanking channel 111 is disposed in the blanking conveying track 11, the blanking conveying track 11 is provided with a first avoidance hole 121 corresponding to the first blocking mechanism 12, and the first blocking member 123 of the first blocking mechanism 12 can extend into the blanking channel 111 through the first avoidance hole 121 to achieve a blocking effect.

[0045] See also Figure 5In one embodiment, the second blocking mechanism 24 includes a second driver 242 and a second blocking member 243. The test conveying track 21 is provided with a second avoidance hole 241 corresponding to the second blocking mechanism 24. The second blocking member 243 of the second blocking mechanism 24 can extend into the test conveying channel 211 through the second avoidance hole 241 to achieve a blocking effect.

[0046] See also Figure 1 and Figure 6 In one embodiment, the third blocking mechanism 36 includes a third driver 362 and a third blocking member 363. The sorting and conveying track 33 is provided with a third avoidance hole 361 corresponding to the third blocking mechanism 36. The third blocking member 363 of the third blocking mechanism 36 can extend into the sorting and conveying channel 331 through the third avoidance hole 361 to achieve a blocking effect or relatively accommodate the semiconductor components 51 in the sorting and conveying channel 331 to facilitate entering the component output mechanism 34.

[0047] See also Figure 2 In one embodiment, the fourth blocking mechanism 16 is further included between the blanking conveying track 11 and the receiving mechanism 13, and the fourth blocking mechanism 16 is used to block and release the semiconductor components 51 in the material tube 5 from being conveyed to the blanking conveying track 11. The fourth blocking mechanism 16 is similar in structure to the first blocking mechanism 12.

[0048] See also Figure 3 In one embodiment, in order to speed up the conveying speed of the semiconductor component 51 in the blanking conveying track 11 , the semiconductor component 51 may also be configured with the first power conveying mechanism 611 .

[0049] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0050] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0051] It is understandable that those skilled in the art can make equivalent substitutions or changes based on the technical solution and inventive concept of the present invention, and all these changes or substitutions should fall within the protection scope of the present invention.

Claims

1. A semiconductor component high voltage test sorting conveyor line, characterized in that: include: Control module; The blanking conveying device comprises an automatic blanking mechanism, a receiving mechanism whose one end is rotatably connected to the upstream end of the automatic blanking mechanism, a swinging driving mechanism and a first blocking mechanism, wherein the automatic blanking mechanism is provided with a blanking channel arranged to be tilted downward, the swinging driving mechanism is used to drive the receiving mechanism to switch between a horizontal position and an inclined position, the upstream end of the receiving mechanism is used to receive a material tube loaded with a plurality of semiconductor components in the horizontal position and unload a group of semiconductor components in the material tube into the blanking channel in the inclined position, and the first blocking mechanism is used to block and release the semiconductor components in the blanking channel to be transported downstream; A component high-voltage testing mechanism is provided downstream of the blanking conveying device, and includes a test conveying track connected to the downstream end of the blanking channel, power connection modules located on both sides of the test conveying track, a test driving mechanism, a first power transmission mechanism, and a second blocking mechanism. The test conveying track is provided with a test station. The first power transmission mechanism is used to drive the semiconductor components of the test conveying track to be transported downstream. The second blocking mechanism is used to limit the semiconductor components of the test conveying track at the test station or release the semiconductor components to be transported in the downstream direction. The test driving mechanism is used to drive the two power connection modules to move or reset to one side of the semiconductor component respectively, so that the multiple power connection terminals on the power connection modules are connected to each semiconductor component pin one by one, so as to perform a high-voltage power-on test on the semiconductor components. The control module is used to identify the group of semiconductor components that fail the high-voltage power-on test and the group of all qualified semiconductor components respectively. The component sorting mechanism includes a translation drive mechanism, a sorting conveying track connected to the downstream end of the test conveying track, a component output mechanism, a component recovery mechanism, a third blocking mechanism and a second power transmission mechanism; the third blocking mechanism is used to limit the entering semiconductor components within the sorting conveying track, the translation drive mechanism is used to drive the sorting conveying track to connect with the component output mechanism or the component recovery mechanism respectively, so that the second power transmission mechanism respectively transports the semiconductor components of the qualified mark group to the component output mechanism and transports the semiconductor components of the unqualified mark group to the component output mechanism.

2. The semiconductor component high voltage test sorting conveyor line according to claim 1, characterized in that: The flip driving mechanism includes a bracket, a flip driving push rod and a driving arm, and the driving arm is rotatably connected to the upstream end of the automatic blanking mechanism and the output end of the flip driving push rod respectively. The material receiving mechanism is arranged on the driving arm, and the flip driving push rod is connected to the bracket. The flip driving push rod drives the driving arm to make the material receiving mechanism horizontally placed on the bracket or obliquely docked with the automatic blanking mechanism.

3. The semiconductor component high voltage test sorting conveyor line according to claim 2, characterized in that: The support is arranged horizontally, and a buffer component is arranged on the support. The material receiving mechanism is placed on the support through the buffer component.

4. The semiconductor component high voltage test sorting conveyor line according to claim 1, characterized in that: At least two of the component high-voltage testing mechanisms are continuously arranged along the downstream direction of the blanking conveying device.

5. The semiconductor component high voltage test sorting conveyor line according to claim 1, characterized in that: The test drive mechanism comprises a test drive push rod and a slide rail assembly, the power connection module is arranged on the slide rail assembly, and the test drive push rod is transmission-connected with the power connection module.

6. The semiconductor component high voltage test sorting conveyor line according to claim 1 or 4, characterized in that: The component high-voltage testing mechanism and the blanking channel are arranged obliquely in the same direction, the component high-voltage testing mechanism is set horizontally, and the sorting conveying track and the testing conveying track are transitionally connected by an arc guide track.

7. The semiconductor component high voltage test sorting conveyor line according to claim 1, characterized in that: The translation drive mechanism includes a mounting frame and a translation drive motor, a first pulley, a second pulley and a transmission belt arranged on the mounting frame, the transmission belt is respectively wound around the first pulley and the second pulley, the translation drive motor is connected to the first pulley in transmission, the sorting conveying track is arranged on the transmission belt, and the translation drive motor drives the sorting conveying track to dock with the component output mechanism or the component recovery mechanism in the translation direction.

8. The semiconductor component high voltage test sorting conveyor line according to claim 1, characterized in that: The test conveying track is provided with a test conveying channel, the first power conveying mechanism comprises a plurality of first conveying gas paths which are arranged obliquely along the downstream conveying direction of the test conveying track and are connected to the test conveying channel, and the plurality of first conveying gas paths are respectively connected to the airflow generating device; When the translation drive mechanism drives the sorting and conveying track to move relatively, the downstream end of the sorting and conveying track is docked with the component output mechanism, or the upstream end of the sorting and conveying track is docked with the component recovery mechanism; A sorting conveying channel is provided in the sorting conveying track, and the second power conveying mechanism includes a plurality of second conveying air paths which are arranged at the top of the sorting conveying track and obliquely along the downstream conveying direction and are connected to the sorting conveying channel, a plurality of third conveying air paths which are arranged at the side of the sorting conveying track and obliquely along the downstream conveying direction and are connected to the sorting conveying channel, and an air blowing device. The plurality of second conveying air paths and the third conveying air paths are respectively connected to the airflow generating device, and the airflow generating device enters the airflow of the sorting conveying channel through the second conveying air path and the third conveying air path, so that the semiconductor components in the sorting conveying channel are moved to the component output mechanism, and the air blowing device is used to generate an airflow to move the semiconductor components in the sorting conveying channel to the component recovery mechanism.

9. The semiconductor component high voltage test sorting conveyor line according to claim 8, characterized in that: The two sides of the test conveying track are respectively provided with power connection avoidance ports, and the pins on both sides of the semiconductor components in the test conveying track are respectively connected with the outside through the corresponding power connection avoidance ports.

10. The semiconductor component high voltage test sorting conveyor line according to claim 8, characterized in that: The automatic blanking mechanism comprises a blanking conveying track, the blanking channel is arranged in the blanking conveying track, the blanking conveying track is provided with a first avoidance hole corresponding to the first blocking mechanism, and the first blocking member of the first blocking mechanism can extend into the blanking channel through the first avoidance hole to achieve a blocking effect; The test conveying track is provided with a second avoidance hole corresponding to the second blocking mechanism, and the second blocking member of the second blocking mechanism can extend into the test conveying channel through the second avoidance hole to achieve a blocking effect; The sorting and conveying track is provided with a third avoidance hole corresponding to the third blocking mechanism, and the third blocking member of the third blocking mechanism can extend into the sorting and conveying channel through the third avoidance hole to achieve a blocking effect.

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