A multi-station test device for integrated circuit manufacturing

Abstract

The present invention discloses a multi-station test device for integrated circuit manufacturing, including a connecting frame. A transmission groove is provided in the middle of the connecting frame. Both sides inside the transmission groove are rotatably connected with transmission central shafts. Both sides of the middle of the transmission central shafts are fixedly connected with hexagonal transmission wheels. A reinforcing inner rod is fixedly connected between the two hexagonal transmission wheels. For this multi-station test device for integrated circuit manufacturing, through the setting of the sliding rod and the flipping gear, when it is necessary to flip the flipping inner plate, when the transmission outer frame is driven by the hexagonal transmission wheel to move to a suitable position, the flipping gear is engaged with the transmission tooth groove. Subsequently, the sliding rod is pushed to move by the one-way hydraulic cylinder. Through the engagement of the flipping gear and the transmission tooth groove, the flipping gear rotates, thereby driving the flipping inner plate to rotate and flipping the integrated circuit board. Through the setting of the flipping gear, the flipping can be completed without using a motor for driving, which is not only convenient for production but also has a low cost.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuit testing, and specifically to a multi-station testing device for integrated circuit manufacturing. Background Art

[0002] An integrated circuit is a microelectronic device or component. Using a certain process, components such as transistors, resistors, capacitors, and inductors required in a circuit, as well as the wiring, are interconnected and fabricated on a small piece or a few small pieces of semiconductor wafers or dielectric substrates, and then encapsulated in a package to form a micro-structure with the required circuit functions; all components are integrated into a whole in terms of structure, which has taken a big step forward in the miniaturization, low power consumption, intelligence, and high reliability of electronic components. It is represented by the letter "IC" in a circuit. The inventors of integrated circuits are Jack Kilby (integrated circuit based on germanium (Ge)) and Robert Noyce (integrated circuit based on silicon (Si)). Most applications in the current semiconductor industry are silicon-based integrated circuits.

[0003] In the prior art, for example, a multi-station testing device for integrated circuit manufacturing in Chinese Patent Application CN114377995A includes a fixed seat, a first detection rack, and a second detection rack. A first conveyor belt is connected to the outer side of the left part of the fixed seat, and a placement assembly is arranged on the top of the first conveyor belt. The inner side of the placement assembly is connected to a rotating plate, and a clamping assembly is arranged inside the rotating plate. A micro air pump is arranged inside the rotating plate, and an air delivery pipe is connected to the outer side of the micro air pump. A transfer seat is arranged at the inner top of the fixed seat. The present invention integrates multiple detection stations on a first detection component, which can reduce the time waste and damage of integrated circuit boards caused by frequent movement during detection, and at the same time, the multi-station rotation and position adjustment detection, combined with the rotation of the rotating plate to drive the flipping of the integrated circuit board, can make the detection of the integrated circuit board more flexible to avoid dead angles in the detection of the integrated circuit board.

[0004] However, in the prior art, for the flipping of the circuit board during detection, it is directly flipped by the rotation of a motor. Since the circuit board itself has a small volume, the volume of the clamping frame of the circuit board is small. Therefore, the volume of the motor needs to be small to better drive the flipping of the clamping frame. When directly using the rotation of the motor, due to the inertia generated during the rotation of the motor, the flipping angle of the flipping frame will be relatively large, which is not conducive to subsequent testing. Moreover, the smaller the volume of the motor, the smaller the current that can pass through, resulting in a lower turning force and making it difficult to better drive the flipping of the clamping frame. If a larger clamping frame is selected and driven by a larger motor, it will increase the volume of the device, cause inconvenience in the installation of the circuit board, and result in a higher cost.

[0005] Therefore, we propose a multi-station testing equipment for integrated circuit manufacturing to solve the above-mentioned problems. Summary of the invention

[0006] The purpose of the present invention is to provide a multi-station testing equipment for integrated circuit manufacturing to solve the problem of flipping the circuit board during detection proposed in the above background technology, which is to directly flip it by rotating the motor. However, since the circuit board itself is small in size, the volume of the circuit board clamping frame is also small. Therefore, the volume of the motor needs to be small in order to better drive the flipping of the clamping frame. Directly using the rotation of the motor will generate a certain inertia when the motor rotates, which will cause the flipping angle of the flipping frame to be large, which is not conducive to subsequent testing. Moreover, the smaller the volume of the motor, the smaller the current that can pass through, resulting in lower rotation force and difficulty in better driving the flipping of the clamping frame. If a larger clamping frame is selected and driven by a larger motor, the volume of the equipment will increase, and it will cause the installation of the circuit board to be inconvenient and the cost to be high.

[0007] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a multi-station testing equipment for integrated circuit manufacturing, comprising a connecting frame, a transmission groove is provided in the middle of the connecting frame, both sides of the transmission groove are rotatably connected with a transmission central shaft, both sides of the middle of the transmission central shaft are fixedly connected with six-sided transmission wheels, a reinforcing inner rod is fixedly connected between the two six-sided transmission wheels, a transmission outer frame is provided on the outer side of the six-sided transmission wheel, both sides of the transmission outer frame are fixedly connected with rotation connection ears, two adjacent transmission outer frames are rotatably connected through the rotation connection ears, a plurality of the transmission outer frames are transmission-connected between the outer sides of the two six-sided transmission wheels, a rotation inner groove is provided in the middle of the opposite sides of the inner side of the transmission outer frame, a flip inner plate is provided inside the transmission outer frame, and both sides of the flip inner plate A rotating shaft is fixed on both sides, and the rotating shaft is rotatably connected with the rotating inner groove, one end of one of the rotating shafts is fixedly connected with a flip gear, and a rotating side groove is opened at the bottom of one of the rotating inner grooves, and the flip gear is located inside the rotating side groove, and an installation outer groove is opened at the upper and lower parts of the middle of one side on both sides of the connecting frame, and a one-way hydraulic cylinder is clamped inside the installation outer groove, and a sliding side groove is opened on one side of the installation outer groove, and a fixed connecting plate is fixedly connected to the outer side of the one-way hydraulic cylinder, and the fixed connecting plate is fixedly connected to the connecting frame, and a sliding rod is fixedly connected between the output ends of the two one-way hydraulic cylinders, and a transmission tooth groove is opened in the middle of the upper end of the sliding rod, and the transmission tooth groove is meshed with the flip gear, and both ends of the sliding rod are slidably clamped with the sliding side groove.

[0008] Preferably, support side rods are fixedly connected to the upper middle parts of both sides of the transmission groove, and the upper ends of the support side rods are fitted with the lower ends of the transmission outer frame.

[0009] Preferably, second side grooves are formed in the other two opposite sides inside the transmission outer frame, second magnets are fixedly connected inside the second side grooves, first side grooves are formed in the other two sides of the flipping inner plate, first magnets are fixedly connected inside the first side grooves, and the depth of the first side grooves is greater than the thickness of the first magnets.

[0010] Preferably, clamping bottom grooves are formed at the bottoms of the four inner ring surfaces of the flipping inner plate, a rotating limiting rod is fixedly connected to one side of each clamping bottom groove, an L-shaped limiting rod is clamped inside each clamping bottom groove, one end of the L-shaped limiting rod is rotatably clamped with the rotating limiting rod, a bottom through cavity is formed below the middle inside the flipping inner plate, a transfer inner cavity is formed at the bottom of the clamping bottom groove, the transfer inner cavity communicates with the bottom through cavity, an extrusion airbag is fixedly connected inside the transfer inner cavity, one end of the extrusion airbag is fixedly connected to the L-shaped limiting rod, and a second air pump is fixedly connected to one corner of the bottom of the flipping inner plate. The input end of the second air pump is fixedly communicated with the bottom through cavity through a connecting pipe.

[0011] Preferably, inner ventilation cavities are formed in the middle of the four inner ring surfaces of the flipping inner plate, the bottoms of the four inner ventilation cavities are communicated with each other, clamping expansion airbags are fixedly connected to one side of each of the four inner ventilation cavities, and a first air pump is fixedly connected to one corner of the upper end of the flipping inner plate. The output end of the first air pump is fixedly communicated with the inner ventilation cavities through a connecting pipe provided.

[0012] Preferably, a rubber support ball is rotatably clamped to the upper end of the L-shaped limiting rod.

[0013] Preferably, a limiting side groove is formed in one side of the flipping inner plate, a limiting clamping groove is formed in one side of the transmission groove, and a circuit board storage box is clamped between the limiting side groove and the limiting clamping groove.

[0014] Preferably, a extraction handle is fixedly connected to one side of the circuit board storage box, and a transparent observation window is fixedly connected to the middle of one side of the circuit board storage box. The transparent observation window is vertically arranged.

[0015] Preferably, a test support frame is fixedly connected to the upper end of the connecting frame, a unidirectional air cylinder is fixedly connected to the middle of the upper end of the test support frame, a connecting bottom plate is fixedly connected to the output end of the unidirectional air cylinder, a sliding inner cavity is formed in the connecting bottom plate, a buffer mounting plate is slidably clamped inside the sliding inner cavity, a buffer elastic sheet is fixedly connected between the upper end of the buffer mounting plate and the sliding inner cavity, and a test probe is fixedly connected to the lower end of the buffer mounting plate.

[0016] Preferably, a support foot is fixedly connected to the lower end of the connecting frame, a limiting bump is fixedly connected to the outer surface of the hexagonal transmission wheel, and limiting bottom grooves are formed on both sides of the lower end of the transmission outer frame, and the limiting bump is clamped with the limiting bottom groove.

[0017] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0018] 1. Through the arrangement of the sliding rod and the flipping gear, when it is necessary to flip the flipping inner plate, when the transmission outer frame is driven by the hexagonal transmission wheel to move to a suitable position, the flipping gear can be meshed with the transmission tooth groove. Subsequently, the sliding rod is pushed to move by the unidirectional hydraulic cylinder. Through the meshing of the flipping gear and the transmission tooth groove, the flipping gear rotates, thereby driving the flipping inner plate to rotate and flipping the integrated circuit board. Through the arrangement of the flipping gear, the flipping can be completed without using a motor for driving, which is not only convenient for production, but also has a low cost, is easy to use, and adopts a meshing transmission, making the flipping more stable. Only by controlling the extension or contraction distance of the unidirectional hydraulic cylinder can the problem of excessive transmission angle be avoided, and the occupied space area is small.

[0019] 2. Through the arrangement of the first magnet and the second magnet, after the flipping inner plate is rotated, the position of the flipped inner plate can be fixed by the magnetic adsorption between the first magnet and the second magnet, thereby preventing the flipping after the transmission outer frame rotates, which is not convenient for subsequent testing. Through the setting that the thickness of the first magnet is less than the depth of the first side groove, the first magnet can be prevented from contacting the second magnet, and the first magnet and the second magnet can be prevented from being worn due to friction.

[0020] 3. Through the arrangement of the extrusion airbag and the L-shaped limiting rod, when placing the integrated circuit board, the second air pump injects gas into the bottom cavity. Due to the increase in air pressure, the extrusion airbag expands and extends, thereby pushing the L-shaped limiting rod to unfold. Then, the integrated circuit board can be directly placed in. The end of the L-shaped limiting rod is used for support. And this design adopts a folding and extending design, which can greatly reduce the occupied area of the flipping inner plate, thereby reducing the hollow area inside the flipping inner plate and increasing the overall strength of the flipping inner plate.

[0021] 4. By setting the clamping expansion airbag, when the integrated circuit board is placed inside the flipping inner plate, gas can be injected through the first air pump, increasing the pressure inside the inner ventilation cavity. As a result, the integrated circuit board is squeezed and clamped by the clamping expansion airbag. Moreover, due to the characteristics of air pressure, the air pressure in each part of the inner ventilation cavity is equal, making the squeezing force of the clamping expansion airbag the same. This not only enables clamping but also squeezes and positions the integrated circuit board, ensuring that the integrated circuit board is located at the exact center inside the transmission outer frame, facilitating subsequent testing of the integrated circuit board. Additionally, the clamping by the airbag can provide buffer protection for the integrated circuit board when it expands under external force. Description of the Drawings

[0022] Figure 1 Schematic three-dimensional structure diagram of a multi-station test device for integrated circuit manufacturing according to the present invention;

[0023] Figure 2 Schematic three-dimensional structure diagram of the connecting frame in a multi-station test device for integrated circuit manufacturing according to the present invention;

[0024] Figure 3 Schematic connection structure diagram of the one-way hydraulic cylinder and the sliding rod in a multi-station test device for integrated circuit manufacturing according to the present invention;

[0025] Figure 4 Schematic connection and transmission structure diagram between the hexagonal transmission wheel and the transmission outer frame in a multi-station test device for integrated circuit manufacturing according to the present invention;

[0026] Figure 5 Schematic three-dimensional connection structure diagram of the flipping inner plate and the transmission outer frame in a multi-station test device for integrated circuit manufacturing according to the present invention;

[0027] Figure 6 Exploded schematic connection structure diagram of the flipping inner plate and the transmission outer frame in a multi-station test device for integrated circuit manufacturing according to the present invention;

[0028] Figure 7 Schematic internal structure diagram of the flipping inner plate in a multi-station test device for integrated circuit manufacturing according to the present invention;

[0029] Figure 8 A multi-station test device for integrated circuit manufacturing according to the present invention Figure 7 Enlarged schematic structure diagram of area A therein;

[0030] Figure 9 Schematic connection structure diagram of the test probe and the connection base plate in a multi-station test device for integrated circuit manufacturing according to the present invention.

[0031] In the figure: 1. Connecting frame; 2. Test support frame; 3. Unidirectional pneumatic cylinder; 4. Connecting bottom plate; 5. Test probe; 6. Unidirectional hydraulic cylinder; 7. Circuit board storage box; 8. Extraction handle; 9. Transparent observation window; 10. Support feet; 11. Flipping inner plate; 12. Transmission outer frame; 13. Transmission groove; 14. Support side rod; 15. Sliding side groove; 16. Installation outer groove; 17. Limit card slot; 18. Limit side groove; 19. Fixed connection plate; 20. Sliding rod; 21. Transmission tooth groove; 22. Hexagonal transmission wheel; 23. Transmission central axis; 24. Reinforcing inner rod; 25. Limit bump; 26. Limit bottom groove; 27. Rotating connection ear; 28. First air pump; 29. Clamping expansion airbag; 30. L-shaped limit rod; 31. Rotating side groove; 32. Flipping gear; 33. Rubber support ball; 34. Clamping bottom groove; 35. First side groove; 36. First magnet; 37. Second magnet; 38. Rotating inner groove; 39. Second side groove; 40. Second air pump; 41. Rotating limit rod; 42. Inner ventilation cavity; 43. Bottom through inner cavity; 44. Extrusion airbag; 45. Buffer mounting plate; 46. Buffer spring piece; 47. Sliding inner cavity; 48. Loading inner cavity. Detailed implementation manners

[0032] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0033] Please refer to Figure 1-9The present invention provides a technical solution: a multi-station testing device for integrated circuit manufacturing, comprising a connecting frame 1, a transmission slot 13 is provided in the middle of the connecting frame 1, both sides of the transmission slot 13 are rotatably connected with a transmission center shaft 23, and both sides of the middle of the transmission center shaft 23 are fixedly connected with a six-sided transmission wheel 22. This design makes it possible for no object to block the bottom of the flip inner plate 11, so as to ensure that sufficient space is provided when the flip inner plate 11 rotates, and this design can prevent the first air pump 28, the flip gear 32 and the second air pump 40 from being squeezed by the six-sided transmission wheel 22 when the six-sided transmission wheel 22 drives the flip inner plate 11 to move, so as to ensure the normal use of the transmission outer frame 12. A reinforcing inner rod 24 is fixedly connected between the two hexagonal transmission wheels 22. The reinforcing inner rod 24 is provided to support the two hexagonal transmission wheels 22 and increase the strength of the hexagonal transmission wheels 22. A transmission outer frame 12 is provided on the outside of the hexagonal transmission wheel 22. Rotating connecting ears 27 are fixedly connected on both sides of the transmission outer frame 12. Two adjacent transmission outer frames 12 are rotatably connected through the rotating connecting ears 27. Multiple transmission outer frames 12 are transmission-connected between the outsides of the two hexagonal transmission wheels 22. Through the cooperation of the transmission outer frame 12 and the hexagonal transmission wheel 22, a conveyor belt is used for transmission. The integrated circuit board is tested step by step, which can greatly increase the test efficiency. A rotating inner groove 38 is provided in the middle of the two opposite sides of the inner side of the moving outer frame 12, and the rotating inner groove 38 is located on the same two sides as the second magnet 37. A flip inner plate 11 is provided inside the transmission outer frame 12, and a rotating shaft is fixed on both sides of the flip inner plate 11, and the rotating shaft is rotatably connected with the rotating inner groove 38. One end of one of the rotating shafts is fixedly connected to a flip gear 32, and a rotating side groove 31 is provided at the bottom of one of the rotating inner grooves 38, and the flip gear 32 is located inside the rotating side groove 31. An installation outer groove 16 is provided at the upper and lower parts of one side of the middle of both sides of the connecting frame 1, and a one-way hydraulic cylinder 6 is provided inside the installation outer groove 16, and a sliding side groove 16 is provided on one side of the installation outer groove 16. Groove 15, a fixed connecting plate 19 is fixedly connected to the outer side of the one-way hydraulic cylinder 6, and the one-way hydraulic cylinder 6 is further installed with the connecting frame 1 through the fixed connecting plate 19, so as to increase the connection strength, so that the one-way hydraulic cylinder 6 has higher stability when in use, and the fixed connecting plate 19 is fixedly connected to the connecting frame 1, and a sliding rod 20 is fixedly connected between the output ends of the two one-way hydraulic cylinders 6, and a transmission tooth groove 21 is opened in the middle of the upper end of the sliding rod 20, and the transmission tooth groove 21 is meshed with the flip gear 32, and both ends of the sliding rod 20 are slidably engaged with the sliding side groove 15, and the transmission tooth groove 21 on the sliding rod 20 located below the middle of the transmission groove 13 is opened in the middle of the lower end of the sliding rod 20.

[0034] Working principle of this embodiment: Through the arrangement of the sliding rod 20 and the flipping gear 32, when it is necessary to flip the flipping inner plate 11, when the transmission outer frame 12 is driven by the hexagonal transmission wheel 22 to move to a suitable position, the flipping gear 32 is engaged with the transmission tooth groove 21. Subsequently, the sliding rod 20 is pushed to move by the one-way hydraulic cylinder 6. Through the engagement of the flipping gear 32 and the transmission tooth groove 21, the flipping gear 32 rotates, thereby driving the flipping inner plate 11 to rotate and flipping the integrated circuit board. Through the arrangement of the flipping gear 32, flipping can be completed without using a motor for driving, which is not only convenient for production, but also has a low cost, is easy to use, and adopts meshing transmission, making the flipping more stable. Only by controlling the extension or contraction distance of the one-way hydraulic cylinder 6, the problem of excessive transmission angle will not occur, and the occupied space area is small;

[0035] At the same time, according to Figure 1 - Figure 2 As shown, support side rods 14 are fixedly connected to the upper parts of the middle of both sides of the transmission groove 13. The upper ends of the support side rods 14 are in contact with the lower end of the transmission outer frame 12. The upper side of the upper end of the support side rod 14 is designed with a rounded corner, which can reduce the wear of the support side rod 14 on the transmission outer frame 12 when the transmission outer frame 12 moves. The support side rod 14 is used to support the lower end of the transmission outer frame 12 above the transmission groove 13, and is used to ensure the stability of the transmission outer frame 12 during detection and prevent the transmission outer frame 12 from shifting during detection.

[0036] At the same time, according to Figure 6 As shown, second side grooves 39 are opened on the other two opposite sides inside the transmission outer frame 12. Second magnets 37 are fixedly connected to the inside of the second side grooves 39. First side grooves 35 are opened on the other two sides of the flipping inner plate 11. First magnets 36 are fixedly connected to the inside of the first side grooves 35. The depth of the first side groove 35 is greater than the thickness of the first magnet 36. Through the arrangement of the first magnet 36 and the second magnet 37, after the flipping inner plate 11 is rotated, through the magnetic adsorption between the first magnet 36 and the second magnet 37, the position of the flipped inner plate 11 will be fixed by magnetic adsorption, thereby preventing the flipping inner plate 11 from flipping after the transmission outer frame 12 rotates, which is not convenient for subsequent testing. Through the setting that the thickness of the first magnet 36 is less than the depth of the first side groove 35, the first magnet 36 can be prevented from contacting the second magnet 37, and the first magnet 36 and the second magnet 37 can be prevented from being worn due to friction.

[0037] At the same time, according to Figure 5 - Figure 8As shown, clamping bottom grooves 34 are provided at the bottoms of the four inner ring surfaces of the flipping inner plate 11. A rotating limiting rod 41 is fixedly connected to one side of the clamping bottom groove 34. An L-shaped limiting rod 30 is clamped inside the clamping bottom groove 34. One end of the L-shaped limiting rod 30 is rotatably clamped with the rotating limiting rod 41. The rotating limiting rod 41 is used to limit one end of the L-shaped limiting rod 30 and ensure that the rotation center is restricted during the process of extending the L-shaped limiting rod 30. A bottom through cavity 43 is provided below the middle inside the flipping inner plate 11. A transfer inner cavity 48 is provided at the bottom of the clamping bottom groove 34. The transfer inner cavity 48 communicates with the bottom through cavity 43. An extrusion airbag 44 is fixedly connected inside the transfer inner cavity 48. One end of the extrusion airbag 44 is fixedly connected to the L-shaped limiting rod 30. A second air pump 40 is fixedly connected to a corner of the bottom of the flipping inner plate 11. The input end of the second air pump 40 is fixedly communicated with the bottom through cavity 43 through a connecting pipe. Through the arrangement of the extrusion airbag 44 and the L-shaped limiting rod 30, when placing the integrated circuit board, the second air pump 40 can inject gas into the bottom through cavity 43. With the increase of air pressure, the extrusion airbag 44 expands and extends, thereby pushing the L-shaped limiting rod 30 to unfold. Then, the integrated circuit board can be directly placed. The end of the L-shaped limiting rod 30 is used for support. And this design adopts a folding and extending design, which can greatly reduce the occupied area of the flipping inner plate 11, thereby reducing the hollow area inside the flipping inner plate 11 and increasing the overall strength of the flipping inner plate 11.

[0038] At the same time, according to Figure 5 - Figure 7 As shown, inner ventilation cavities 42 are provided in the middle of the four inner ring surfaces of the flipping inner plate 11. The bottoms of the four inner ventilation cavities 42 are communicated with each other. A clamping expansion airbag 29 is fixedly connected to one side of each of the four inner ventilation cavities 42. A first air pump 28 is fixedly connected to a corner of the upper end of the flipping inner plate 11. The output end of the first air pump 28 is fixedly communicated with the inner ventilation cavity 42 through a set connecting pipe. Through the arrangement of the clamping expansion airbag 29, when placing the integrated circuit board inside the flipping inner plate 11, the first air pump 28 can inject gas, so that the pressure inside the inner ventilation cavity 42 increases, thereby squeezing and clamping the integrated circuit board through the clamping expansion airbag 29. And due to the characteristics of air pressure, the air pressure at each part of the inner ventilation cavity 42 is equal, so that the squeezing force of the clamping expansion airbag 29 is the same. Thus, it can not only play a clamping role, but also squeeze and position the integrated circuit board, making the integrated circuit board located at the exact center inside the transmission outer frame 12, which is convenient for subsequent testing of the integrated circuit board. And through the clamping of the airbag, when it expands under external force, it can buffer and protect the integrated circuit board.

[0039] At the same time, according to Figure 6As shown, a rubber support ball 33 is rotatably clamped to the upper end of the L-shaped limit rod 30. Through the arrangement of the rubber support ball 33, after the integrated circuit board is clamped and the L-shaped limit rod 30 is retracted, the rotation of the rubber support ball 33 can reduce the friction between the L-shaped limit rod 30 and the circuit board, thereby reducing the wear of the integrated circuit board and increasing the qualified rate of integrated circuit board production.

[0040] At the same time, according to Figure 1 - Figure 2 As shown, a limit side groove 18 is opened on one side of the flip inner plate 11, and a limit card slot 17 is opened on one side of the transmission groove 13. A circuit board storage box 7 is clamped between the limit side groove 18 and the limit card slot 17. The number of circuit board storage boxes 7 arranged on the connecting frame 1 is two, and the two circuit board storage boxes 7 are respectively used for storing qualified and unqualified integrated circuit boards.

[0041] At the same time, according to Figure 1 As shown, a extraction handle 8 is fixedly connected to one side of the circuit board storage box 7, and a transparent observation window 9 is fixedly connected to the middle of one side of the circuit board storage box 7. The transparent observation window 9 is vertically arranged. The extraction handle 8 is used to pull the circuit board storage box 7 to take out the circuit board storage box 7, and the transparent observation window 9 is used to observe the quantity of integrated circuit boards in the circuit board storage box 7, which is convenient for timely collecting the tested circuit boards.

[0042] At the same time, according to Figure 1 、 Figure 4 And Figure 9As shown in the figure, the upper end of the connecting frame 1 is fixedly connected with a test support frame 2. The middle part of the upper end of the test support frame 2 is fixedly connected with a unidirectional air cylinder 3. The output end of the unidirectional air cylinder 3 is fixedly connected with a connecting bottom plate 4. A sliding inner cavity 47 is opened inside the connecting bottom plate 4. A buffer mounting plate 45 is slidably clamped inside the sliding inner cavity 47. A buffer elastic piece 46 is fixedly connected between the upper end of the buffer mounting plate 45 and the sliding inner cavity 47. The lower end of the buffer mounting plate 45 is fixedly connected with a test probe 5. The lower end of the connecting frame 1 is fixedly connected with a support foot 10. The outer surface of the hexagonal transmission wheel 22 is fixedly connected with a limiting convex point 25. Limiting bottom grooves 26 are opened on both sides of the lower end of the transmission outer frame 12. The limiting convex point 25 is clamped with the limiting bottom groove 26. Through the setting of the test probe 5, it is used to test the integrated circuit board. Through the setting of the sliding inner cavity 47 and the buffer elastic piece 46, when the unidirectional air cylinder 3 controls the test probe 5 to conduct a test, the test probe 5 can be buffered by the buffer elastic piece 46. When the test probe 5 contacts the test point of the integrated circuit board for testing, the force applied by the unidirectional air cylinder 3 can be buffered, preventing the test probe 5 from poking and damaging the contact point. Through the setting of the limiting convex point 25 and the limiting bottom groove 26, when the transmission outer frame 12 moves, the flipping inner plate 11 is further clamped and limited, making the transmission more stable and increasing the moving accuracy of the circuit board during testing.

[0043] Working principle: When in use, when the integrated circuit board is placed into the transmission outer frame 12, the second air pump 40 is turned on to inject gas into the bottom through cavity 43, so that the air pressure in the bottom through cavity 43 increases, causing the extrusion airbag 44 to extend and pushing the L-shaped limit rod 30 to extend. Then, the integrated circuit board is directly placed into the inside of the flipping inner plate 11, and the lower end of the integrated circuit board is supported by the rubber support balls 33. Subsequently, the first air pump 28 is turned on to inject air pressure into the inner air passage cavity 42, and the air pressure increases, causing the clamping expansion airbag 29 to expand and squeezing and limiting the side of the integrated circuit board. Then, the hexagonal transmission wheel 22 rotates to drive the transmission outer frame 12 to move. During this period, the limit convex points 25 on the hexagonal transmission wheel 22 are engaged with the limit bottom grooves 26 to drive the transmission outer frame 12 to move. Subsequently, the integrated circuit board is driven to move by the transmission outer frame 12, so that the integrated circuit board moves to the lower part of the test probe 5. Then, the one-way air cylinder 3 extends, causing the test probe 5 to contact the test point on the integrated circuit board for testing. At the same time, through the buffer elastic piece 46, when the one-way air cylinder 3 extends too much, the buffer mounting plate 45 can slide into the sliding inner cavity 47, and the buffer elastic piece 46 provides buffering, so that the test probe 5 contacts the test point on the integrated circuit board for contact testing. Then, the transmission outer frame 12 continues to drive the integrated circuit board to move, and the subsequent test probes 5 test the integrated circuit board. When it is necessary to test the back of the integrated circuit board, the transmission outer frame 12 moves to a position close to the sliding rod 20, causing the flipping gear 32 to engage with the transmission tooth groove 21. Then, the one-way hydraulic cylinder 6 drives the sliding rod 20 to move, causing the transmission tooth groove 21 to drive the flipping gear 32 to rotate and flip the flipping inner plate 11. After the flipping inner plate 11 is flipped, the first magnets 36 on both sides of the flipping inner plate 11 are flipped and re-adsorbed with the second magnets 37 on both sides inside the transmission outer frame 12 to re-limit both sides of the flipping inner plate 11. At the same time, the second air pump 40 pumps out the gas in the bottom through cavity 43, causing the extrusion airbag 44 to pull the L-shaped limit rod 30 to retract. Then, it continues to move, and the subsequent test probes 5 test the back side of the integrated circuit board. After the test, the qualified and unqualified integrated circuit boards are respectively put into the two circuit board storage boxes 7. When putting them in, the first air pump 28 pumps out the gas in the inner air passage cavity 42, causing the clamping expansion airbag 29 to contract and releasing the clamping of the integrated circuit board, so that the integrated circuit board falls into the circuit board storage box 7.

[0044] In this technical solution, the one-way hydraulic cylinder 6, the first air pump 28 and the second air pump 40 are all prior arts and will not be elaborated here.

[0045] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A multi-station test device for integrated circuit manufacturing, including a connecting frame (1), characterized in that: A transmission groove (13) is formed in the middle of the connecting frame (1). Both sides inside the transmission groove (13) are rotatably connected with transmission central shafts (23). Both sides in the middle of the transmission central shafts (23) are fixedly connected with hexagonal transmission wheels (22). A reinforcing inner rod (24) is fixedly connected between the two hexagonal transmission wheels (22). A transmission outer frame (12) is arranged on the outer side of the hexagonal transmission wheel (22). Rotating connection ears (27) are fixedly connected to both sides of the transmission outer frame (12). Adjacent two transmission outer frames (12) are rotatably connected through the rotating connection ears (27). A plurality of the transmission outer frames (12) are transmission-connected between the outer sides of the two hexagonal transmission wheels (22). Rotating inner grooves (38) are formed in the middle of the opposite sides inside the transmission outer frame (12). A flipping inner plate (11) is arranged inside the transmission outer frame (12). Rotating shafts are fixedly connected to both sides of the flipping inner plate (11). The rotating shafts are rotatably connected with the rotating inner grooves (38). One end of one of the rotating shafts is fixedly connected with a flipping gear (32). A rotating side groove (31) is formed at the bottom of one of the rotating inner grooves (38). The flipping gear (32) is located inside the rotating side groove (31). Installation outer grooves (16) are formed above and below the middle of one side of both sides of the connecting frame (1). A unidirectional hydraulic cylinder (6) is clamped and arranged inside the installation outer groove (16). A sliding side groove (15) is formed on one side of the installation outer groove (16). A fixed connecting plate (19) is fixedly connected to the outer side of the unidirectional hydraulic cylinder (6). The fixed connecting plate (19) is fixedly connected with the connecting frame (1). A sliding rod (20) is fixedly connected between the output ends of the two unidirectional hydraulic cylinders (6). A transmission tooth groove (21) is formed in the middle of the upper end of the sliding rod (20). The transmission tooth groove (21) is meshed with the flipping gear (32). Both ends of the sliding rod (20) are slidably clamped with the sliding side groove (15); A test support frame (2) is fixedly connected to the upper end of the connecting frame (1). A unidirectional air cylinder (3) is fixedly connected to the middle of the upper end of the test support frame (2). A connecting bottom plate (4) is fixedly connected to the output end of the unidirectional air cylinder (3). A sliding inner cavity (47) is formed inside the connecting bottom plate (4). A buffer installation plate (45) is slidably clamped inside the sliding inner cavity (47). A buffer elastic sheet (46) is fixedly connected between the upper end of the buffer installation plate (45) and the sliding inner cavity (47). A test probe (5) is fixedly connected to the lower end of the buffer installation plate (45).

2. The multi-station test equipment for integrated circuit manufacturing according to claim 1, wherein: Support side rods (14) are fixedly connected to the middle of the upper parts of both sides of the transmission groove (13). The upper ends of the support side rods (14) are in contact with the lower ends of the transmission outer frames (12).

3. The multi-station test equipment for integrated circuit manufacturing according to claim 1, characterized in that: On both opposite sides inside the transmission outer frame (12), second side grooves (39) are provided. Inside the second side grooves (39), second magnets (37) are fixedly connected. On the other two sides of the flipping inner plate (11), first side grooves (35) are provided. Inside the first side grooves (35), first magnets (36) are fixedly connected. The depth of the first side grooves (35) is greater than the thickness of the first magnets (36).

4. The multi-station test equipment for integrated circuit manufacturing according to claim 2, wherein: At the bottom of the four inner ring surfaces of the flipping inner plate (11), clamping bottom grooves (34) are provided. On one side of the clamping bottom grooves (34), rotation limiting rods (41) are fixedly connected. Inside the clamping bottom grooves (34), L-shaped limiting rods (30) are clamped. One end of the L-shaped limiting rods (30) is rotationally clamped with the rotation limiting rods (41). Below the middle inside the flipping inner plate (11), a bottom through cavity (43) is provided. At the bottom of the clamping bottom grooves (34), transfer inner cavities (48) are provided. The transfer inner cavities (48) communicate with the bottom through cavity (43). Inside the transfer inner cavities (48), extrusion air bags (44) are fixedly connected. One end of the extrusion air bags (44) is fixedly connected with the L-shaped limiting rods (30). At a corner of the bottom of the flipping inner plate (11), a second air pump (40) is fixedly connected. The input end of the second air pump (40) is fixedly communicated with the bottom through cavity (43) through a connecting pipe.

5. The multi-station test equipment for integrated circuit manufacturing according to claim 1, wherein: In the middle of the four inner ring surfaces of the flipping inner plate (11), inner ventilation cavities (42) are provided. The bottoms of the four inner ventilation cavities (42) are communicated with each other. On one side of each of the four inner ventilation cavities (42), clamping expansion air bags (29) are fixedly connected. At a corner of the upper end of the flipping inner plate (11), a first air pump (28) is fixedly connected. The output end of the first air pump (28) is fixedly communicated with the inner ventilation cavities (42) through a provided connecting pipe.

6. The multi-station test equipment for integrated circuit manufacturing according to claim 4, characterized in that: At the upper end of the L-shaped limiting rods (30), rubber support balls (33) are rotationally clamped.

7. The multi-station test equipment for integrated circuit manufacturing according to claim 1, characterized in that: On one side of the flipping inner plate (11), a limiting side groove (18) is provided. On one side of the transmission groove (13), a limiting clamping groove (17) is provided. Between the limiting side groove (18) and the limiting clamping groove (17), a circuit board storage box (7) is clamped.

8. The multi-station test equipment for integrated circuit manufacturing according to claim 7, wherein: On one side of the circuit board storage box (7), a extraction handle (8) is fixedly connected. In the middle of one side of the circuit board storage box (7), a transparent observation window (9) is fixedly connected. The transparent observation window (9) is vertically arranged.

9. A multi-station test device for integrated circuit manufacturing according to claim 1, characterized in that: At the lower end of the connecting frame (1), support feet (10) are fixedly connected. On the outer surface of the hexagonal transmission wheel (22), limiting convex points (25) are fixedly connected. On both sides at the lower end of the transmission outer frame (12), limiting bottom grooves (26) are provided. The limiting convex points (25) are clamped with the limiting bottom grooves (26).

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