A method for thick film hybrid integrated circuit micro-assembly and production line

Abstract

The application discloses a thick film hybrid integrated circuit micro-assembly method and a production line, and the production line comprises a soldering sheet feeding device, a substrate entering a shell, a flux spraying device, a copper ring mounting device, a vacuum cavity welding device, a plasma cleaning device, an AOI detection device, an aluminum wire bonding device, a gold wire bonding device, a main conveying track system, a branch track system, a feeding and discharging system and the like. The thick film hybrid integrated circuit micro-assembly intelligent production line reduces labor intensity, realizes production capacity improvement, reduces manufacturing cost, replaces manual work, improves efficiency, realizes automatic production of hybrid integrated circuits such as power converters, power drive circuits and automobile electronics and the like.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of thick film hybrid integrated circuit, in particular to a thick film hybrid integrated circuit micro-assembly production line and a running method thereof. BACKGROUND

[0002] The thick film hybrid integrated circuit product has various types, and the manufacturing process is mainly in a manual mode due to the strict manufacturing process and the limitation of the technical level, so that the production efficiency is low, and the worker level is highly dependent, and the production demand of 'various types and small batches' needs to be solved through process optimization, technical upgrading and business process reform. SUMMARY

[0003] In order to solve the above problems, the purpose of the present application is to provide a thick film hybrid integrated circuit micro-assembly method and production line, which integrates the processes of bonding, welding and bonding process, saves the product production time, and greatly shortens the length of the automatic assembly line.

[0004] The technical scheme of the present application is as follows: a thick film hybrid integrated circuit micro-assembly method, the assembly method comprises:

[0005] The insulating glue and the solder paste are coated on the upper part of the substrate, and then the chip patching and the resistance-capacitance patching are sequentially performed;

[0006] The substrate is cooled, and then the end of the substrate vertical device is coated with tin paste;

[0007] In the upper soldering sheet station, the soldering sheet is automatically fed and the soldering sheet is sprayed with flux, and the processed soldering sheet is laid in the shell carrier;

[0008] The substrate is sent to the shell working station, the shell carrier is sent to the shell working station, the substrate is loaded into the shell carrier of the soldering sheet, and the substrate is controlled to the preset position;

[0009] The copper ring is assembled on the substrate, and the tin paste is coated again;

[0010] The substrate in the shell is sent to the soldering furnace for solidification, and finally cooled and discharged.

[0011] Further, after the resistance-capacitance patching process, an optical detector is used to detect the quality of the resistance-capacitance patching.

[0012] Further, after the resistance-capacitance patching process, the qualified substrate is transmitted to an epoxy curing furnace for heating for curing of the insulating glue and the conductive glue, and then cooled.

[0013] Further, in the shell working station, the substrate is placed in the set position in the shell carrier by a magnet device.

[0014] Further, each work station is connected to each other through a track, so that the substrate is circulated among the work stations, and each section of the track can independently adjust the running speed.

[0015] In order to realize the micro-assembly method, the application further provides a thick film hybrid integrated circuit micro-assembly production line, which comprises a plate feeding machine, a dispensing machine, a chip mounter, a resistor-capacitor mounter, an automatic optical detector, an epoxy curing furnace, a cooling line, a nitrogen storage cabinet, a solder paste machine, a soldering sheet feeding station, a substrate housing station, a copper ring mounting station, a vacuum reflow furnace, a cooling line, and a vapor phase cleaning machine.

[0016] The plate feeding machine is used for feeding the substrate carrier.

[0017] The dispensing machine is used for mounting devices on the substrate and for dispensing insulating glue and solder paste at the set position on the substrate.

[0018] The chip mounter is used for mounting resistor-capacitor devices on the substrate.

[0019] The resistor-capacitor mounter is used for detecting the mounting quality after resistor-capacitor mounting.

[0020] The automatic optical detector is used for detecting the mounting quality after resistor-capacitor mounting.

[0021] The epoxy curing furnace is used for curing the insulating glue and conductive glue.

[0022] The cooling line is used for cooling the substrate carrier after the furnace.

[0023] The nitrogen storage cabinet is used for online humidity control of the product and for preventing oxidation of the product.

[0024] The solder paste machine is used for oblique dispensing of solder paste on the end of the vertical device.

[0025] The soldering sheet feeding station is used for automatic feeding and spraying of the soldering sheet.

[0026] The substrate housing station is used for automatic and accurate housing of the substrate, and the copper ring automatic mounting station is used for tin paste dispensing function and copper ring automatic assembly.

[0027] The vacuum reflow furnace is used for fixing the substrate and the outer shell.

[0028] The vapor phase cleaning machine is used for cleaning the substrate after being assembled into the outer shell and reflow soldering, and no flux, tin beads, or excess impurities are left after cleaning.

[0029] Further, each work station is connected to each other through a track, so that the substrate is circulated among the work stations, and each section of the track can independently adjust the running speed.

[0030] Further, the production line further comprises a manual detection station, which is used for manually processing the unqualified mounting products.

[0031] Compared with the prior art, the significant advantages of the present application are: 1) the production line of the present application saves product production time by integrating the processes of bonding, welding and bonding process, greatly shortens the length of the automatic assembly line. By integrating and adjusting the bonding and welding process, the planning of the automatic assembly line reduces the number of operators, reduces the labor intensity, and reduces the number of personnel by more than 50%; improves the assembly production efficiency, shortens the production cycle by more than 50%, greatly improves the production capacity; 2) meets the needs of automatic production, has flexibility and scalability, and meets the promotion and construction of future new technology automation and informatization; 3) the whole line completes product processing through various equipment, and the consistency of the product produced by the traditional manual method is good. BRIEF DESCRIPTION OF DRAWINGS

[0032] The present application will be further described in detail below with reference to the accompanying drawings:

[0033] Figure 1 It is a structural schematic diagram of the thick film hybrid integrated circuit micro-assembly production line of the present application;

[0034] Figure 2 It is a partial structural schematic diagram of the upper solder sheet station;

[0035] Figure 3 It is a partial structural schematic diagram of the substrate into the shell station;

[0036] Figure 4 It is a partial structural schematic diagram of the copper ring mounting station;

[0037] In the figure, 1 is an upper plate machine, 2 is a first dispensing machine, 3 is a second dispensing machine, 4 is a first chip mounter, 5 is a first resistor-capacitor chip mounter, 6 is a first automatic optical detector, 7 is a first manual work station, 8 is an epoxy curing oven, 9 is a first cooling line body, 10 is a nitrogen storage cabinet, 11 is a first solder paste machine, 12 is a second solder paste machine, 13 is a second chip mounter, 14 is a second resistor-capacitor chip mounter, 15 is a second automatic optical detector, 16 is a first manual detection work station, 17 is an upper solder sheet station, 18 is a substrate into the shell station, 19 is a copper ring mounting station, 20 is a second manual detection work station, 21 is a third manual detection work station, 22 is a vacuum reflow oven, 23 is a second cooling line body, 24 is a third automatic optical detector, 25 is a second manual work station, and 26 is a vapor phase cleaning machine;

[0038] 27 is a first vision system, 28 is a high-precision four-axis robot, 29 is a shell carrier dividing disc position, 30 is a shell carrier flow line body, 31 is a blocking positioning position, 32 is a solder sheet carrier, 33 is a flux spraying system, and 34 is a roll material upper solder sheet mechanism;

[0039] 35 - second vision system, 36 - carrier plate mechanism, 37 - first robot, 38 - frame placement line, 39 - reflow line, 40 - blocking positioning position, 41 - magnet separation mechanism, 42 - flux spraying system;

[0040] 43 - frame, 44 - second robot, 45 - assembly position, 46 - copper ring placement area, 47 - lower camera position, 48 - frame taking position, 49 - upper line. DETAILED DESCRIPTION

[0041] The application will be further described below with reference to the drawings, which only describe typical examples of the application and should not be regarded as limiting the application.

[0042] Example 1

[0043] In combination Figure 1 The embodiment is a thick film hybrid integrated circuit micro-assembly production line, which includes a plate feeding machine, a dispensing machine, a chip mounter, a capacitor-resistor mounter, an automatic optical detector, an epoxy curing furnace, a cooling line, a nitrogen storage cabinet, a tin paste machine, a universal tin paste machine, a manual detection station, a soldering sheet station, a substrate into shell station, a copper ring mounting station, a vacuum reflow furnace, a cooling line, a vapor phase cleaning machine, etc.

[0044] The plate feeding machine part of the micro-assembly production line provided by the embodiment includes two dispensing machines, which are used for mounting devices on the substrate and for dispensing insulating glue, solder paste, etc. at partial positions on the substrate to dispense insulating glue, solder paste, etc. at both ends or different positions of the substrate. The plate feeding machine is used for feeding the substrate carrier. The dispensing machine is used for mounting devices on the substrate and for dispensing insulating glue, solder paste, etc. at partial positions on the substrate.

[0045] The production line includes two groups of chip mounters and capacitor-resistor mounters. There is a group of chip mounters and capacitor-resistor mounters behind the dispensing machine. The chip mounter is used for mounting capacitor-resistor devices on the substrate. The capacitor-resistor mounter is used for detecting the mounting quality after capacitor-resistor mounting. The chip mounter and the capacitor-resistor mounter are used in cooperation, and an automatic optical detector and a manual station are arranged behind the chip mounter and the capacitor-resistor mounter. The automatic optical detector is used for detecting the mounting quality after capacitor-resistor mounting. The manual detection station is used for manually processing unqualified mounting products.

[0046] The epoxy curing furnace is used for curing insulating glue, conductive glue, etc. The cooling line is used for cooling the substrate carrier after the furnace. The nitrogen storage cabinet is used for online humidity control of products and prevention of product oxidation. The production line includes two tin paste machines. The first tin paste machine is used for inclined dispensing of end tin paste of vertical mounting devices. The second tin paste machine is a universal tin paste machine, which is used for multi-angle dispensing of end tin paste of vertical mounting devices. A second group of chip mounters and capacitor-resistor mounters are arranged behind the universal tin paste machine.

[0047] The electrode loading station is used for automatic electrode feeding and flux spraying.

[0048] Among them, the equipment in the upper welding station section, such as Figure 2 As shown, the upper welding station 17 is used for automatic feeding of welding sheets and spraying of flux. It includes a first vision system 27, a high-precision four-axis robot 28, a housing carrier tray position 29, a housing carrier conveyor line 30, a blocking positioning position 31, a welding sheet carrier 32, a flux spraying system 33, and a coil welding sheet feeding mechanism 34. At the upper welding station, the conveyor line track has an adjustable running speed, and the track enables physical online connection between various devices, meeting the requirements for data communication. It can achieve time matching between the host computer and the slave computer, and can complete actions such as automatic blocking, lifting and positioning, and transportation of the carrier, conforming to SMEMA standards; under the control of the system control software, it can realize intelligent sorting production and intelligent logistics transportation; the tray-splitting mechanism automatically divides the carrier into trays, and after tray division, the individual welding carriers flow on the production line to complete the carrier assembly; the welding sheet loading bin automatically divides the trays in the material frame and transports them to the designated position. After the robot picks up the products, the tray is automatically put back into the material frame, and the whole process does not require manual intervention; the robot is used to spray flux and pick up welding sheets from the material tray and place them on the carrier to complete the welding sheet assembly; the welding sheet loading mechanism on the coil separates the welding sheets in the welding sheet coil so that the machine can pick up the welding sheets; it includes a vision system mainly used for positioning after the robot picks up the welding sheets, and is equipped with a computer control system to control the operating equipment.

[0049] The substrate loading station is used for automatic and precise substrate loading and automatic magnet installation. The copper ring loading station is used for solder paste application and automatic copper ring assembly.

[0050] Equipment for the substrate mounting station section, such as Figure 3As shown, the substrate entry station 18 is used for automatic and accurate entry of the substrate into the shell and automatic installation of the magnet, and includes a second vision system 35, a carrier plate receiving mechanism 36, a robot 37, a material frame placement line body 38, a reflow line body 39, a blocking positioning position 40, a magnet separating mechanism 41, a flux spraying system 42. In the substrate entry station, the track running speed is adjustable, the line body track realizes physical online connection between devices, meets the data communication requirements of the connection, completes time matching between the upper computer and the lower computer, completes automatic blocking, jacking positioning, transportation and other actions after the carrier scans the code, meets the SMEMA standard, and realizes intelligent sorting production and intelligent logistics transportation under the control of the system control software; the substrate carrier plate receiving mechanism receives the substrate carrier into the material frame, the empty material frame is placed from the lower line body, and after the material frame is full, it is sent to the material frame taking position by the upper line body to facilitate the taking out of the material frame to realize the recovery of the carrier; the robot is used to spray flux, take out the substrate from the substrate carrier, and place it into the welding carrier shell to complete the substrate entry assembly; the magnet separating mechanism separates the connected magnets at the end, and moves the single magnet to the magnet taking position for the robot to suck the magnet; the vision system is mainly used for positioning after the robot sucks the soldering sheet; and a computer control system is provided to control the operation equipment.

[0051] The equipment of the copper ring installation station is as shown in Figure 4 As shown, the copper ring installation station 19 is used for spot solder paste function and automatic assembly of the copper ring, and includes a material frame 43, a robot 44, an assembly position 45, a copper ring placement area 46, a lower camera position 47, a material frame taking position 48, and an upper line body 49. The transmission line body track of the copper ring installation station has adjustable running speed, realizes physical online connection between devices, meets the data communication requirements of the connection, completes time matching between the upper computer and the lower computer, completes automatic blocking, jacking positioning, transportation and other actions after the carrier scans the code, meets the SMEMA standard, and realizes intelligent sorting production and intelligent logistics transportation under the control of the system control software; the substrate carrier plate receiving mechanism receives the substrate carrier into the material frame, the empty material frame is placed from the lower line body, and after the material frame is full, it is sent to the material frame taking position by the upper line body to facilitate the taking out of the material frame to realize the recovery of the carrier; the robot is used to spray flux and assemble the copper ring to the product; the vision system is mainly used for positioning after the robot sucks the copper ring; and the copper ring placement position is a flexible vibrating disc for bulk copper rings.

[0052] The vacuum reflow furnace is used for solid connection of the substrate and the outer shell; and the vapor phase cleaning machine is used for cleaning after the substrate is reflow soldered into the outer shell, and no flux, tin beads or excess materials are left after cleaning.

[0053] Embodiment 2

[0054] Based on the above production line, a thick film hybrid integrated circuit micro-assembly method is provided, which includes the following steps:

[0055] Step 1, a stack of substrate carriers is loaded into a substrate carrier magazine to a panel loader, each substrate carrier has several substrates, the panel loader feeding area can store several magazines at the same time, each magazine contains several carriers according to the customization requirements, the panel loader will adjust the line conveying speed before delivery according to the beat requirements, and the carriers are sequentially sorted out from the magazine and transferred to the dispensing machine work station.

[0056] Step 2, the panel loader transmits the substrate carrier to the dispensing machine work station through the line, the dispensing machine dispenses insulation glue and solder paste on part of the substrate for subsequent work station device mounting, etc., the number of dispensing machines can be configured according to the amount of glue needed to be dispensed on the substrate and the dispensing speed of the dispensing machine.

[0057] Step 3, after the substrate dispensing is completed, the substrate carrier is transmitted to the chip mounter for chip mounting, and then the substrate carrier is transmitted to the resistor-capacitor mounter work station through the line.

[0058] Step 4, the resistor-capacitor mounter work station is used to mount resistor-capacitor devices on the substrate, and then the substrate carrier is transmitted to the automatic optical detector work station through the line.

[0059] Step 5, the automatic optical detector work station is used to detect the quality of the mounted chip after the resistor-capacitor mounting, and if there is a quality problem, the automatic optical detector automatically prompts the quality problem point and transmits the substrate carrier to the manual work station.

[0060] Step 6, the operator processes the problem at the manual work station, and transmits the qualified substrate to the epoxy curing oven for heating for insulation glue and conductive glue curing through the substrate carrier.

[0061] Step 7, the cured substrate is transmitted to the cooling line 9 for cooling, and then the cooled substrate is transmitted to the nitrogen storage cabinet.

[0062] Step 8, the cured substrate needs to be placed in an oxygen-free environment for several hours to stabilize the chemical properties of the cured glue, the nitrogen storage cabinet is used for online humidity control of the product and prevents the product from being oxidized, and when the substrate is placed for a stable time, the substrate carrier is transmitted to the solder paste machine.

[0063] Step 9, the solder paste machine is used for inclined dispensing of solder paste on the end of the substrate vertical device.

[0064] Step 10, the universal angle solder paste machine is used for multi-angle dispensing of solder paste on the solder paste that cannot be dispensed by the substrate solder paste machine.

[0065] Step 11, the chip mounter is used to mount devices on the substrate after dispensing the solder paste.

[0066] Step 12, the resistor-capacitor mounter is used to mount resistor-capacitor devices on the substrate after dispensing the solder paste.

[0067] Step 13, the step is used for the automatic optical inspection instrument station to detect the quality of the patch after detecting the tin paste of the point coating, and the automatic optical inspection instrument automatically prompts the quality problem point and transmits the substrate carrier to the manual station.

[0068] Step 14, the operator processes the problem at the manual station, and the qualified substrate is transmitted to the substrate housing station by the substrate carrier.

[0069] Step 15, before the substrate enters the shell, it is necessary to lay the soldering sheet in the shell for protecting the substrate, so the soldering sheet feeding station is arranged before the substrate housing station for automatic feeding and spraying of the soldering sheet, the soldering sheet carrier is placed in the soldering sheet carrier or the soldering sheet roll of the soldering sheet feeding device, the soldering sheet in the soldering sheet roll is separated by the soldering sheet feeding mechanism to the feeding position, the shell carrier is separated from the shell carrier flow line body at the shell carrier separation position, and the shell carrier flows to the blocking positioning position, and then the upper computer of the soldering sheet feeding station calls the corresponding assembly process according to the product type, the soldering sheet feeding device completes the soldering sheet calling and combination according to the program and the vision system, the shell carrier sprays the soldering sheet with the soldering flux spraying system after the assembly is completed, and then flows into the substrate housing station through the carrier flow line body.

[0070] Step 16, the substrate housing station is used for automatic and accurate housing of the substrate and automatic installation of the magnet, the magnet is connected in a strip shape at the head and tail and is placed in the magnet separation mechanism, the magnet separation mechanism separates the magnet so as to be sucked by the robot, the empty material frame is placed on the lower substrate carrier material frame placing line body, the empty material frame runs along the line body into the substrate carrier collecting mechanism so as to be collected by the substrate carrier, after the above preparation work is completed, the equipment is started, the soldering sheet carrier and the substrate carrier enter the substrate housing station through the respective reflow line body and stop and position at the respective blocking positioning positions, the substrate housing station calls the program after identifying the product model, the equipment combines the vision system 35 according to the program instruction to assemble the substrate into the shell carrier, and the magnet is placed in the magnet separation mechanism by the robot, the magnet is placed at the corresponding position of the substrate to fix the position of the substrate and prevent the coordinate deviation of the substrate in the shell, and the soldering sheet carrier is assembled after the assembly is completed, the shell carrier sprays the soldering sheet with the soldering flux spraying system, and then enters the copper ring assembling station through the soldering carrier flow line body.

[0071] Step 17, copper ring loading station is used for tin paste dispensing function and copper ring automatic assembly. The copper ring loading station places the copper ring into the copper ring placement area. The placement area is provided with a flexible vibration disc for separating the copper ring. After the product is clamped by the cylinder, the robot dispenses tin paste on the product. After the tin paste dispensing is completed, the robot moves to the copper ring placement position under the guidance of the vision system to pick up the copper ring. After picking up, the robot moves to the next camera position to correct the position. After correction, the copper ring is assembled to the product under the guidance of the vision system. Then the robot performs secondary tin paste dispensing on the upper surface of the copper ring to complete the copper ring assembly. The empty substrate carrier is returned to the material frame. When the material frame is full, it is transported to the material frame taking position 48 by the upper line to realize the recovery of the substrate carrier.

[0072] Step 18, the substrate after being loaded into the shell enters the manual station. The operator processes problems at the manual station and transfers the qualified substrate to the vacuum reflow soldering furnace through the substrate carrier.

[0073] Step 19, the substrate carrier is transported to the vacuum reflow soldering furnace for substrate and shell body fixation. After the shell and substrate are fixed, the substrate carrier is transported from the vacuum reflow soldering furnace to the cooling line.

[0074] Step 21, the shell with fixed substrate and shell body is transported to the cooling line for cooling. The cooled shell is transported to the manual station for inspection and problem processing.

[0075] Step 22, after entering the manual station, the operator processes problems at the manual station.

[0076] Step 23, after the operator processes problems at the manual station, the shell is placed on the safety slide and buffered in the discharge and receiving area.

[0077] Step 24, after the shell is buffered to a certain number, the operator transports it to the weather washing machine to clean the substrate, flux, tin beads and excess materials. The substrate is assembled in the shell.

[0078] The technical research has the innovation of improving the process flow of adhesive welding. By integrating the processes of bonding, welding and bonding, the product production time is saved, and the length of the automatic assembly line is greatly shortened. By integrating and adjusting the bonding and welding process flow, the automatic assembly line is planned.

[0079] The application discloses a thick film hybrid integrated circuit micro-assembly production line and a running method thereof. The production line comprises a soldering piece loading device, a substrate loading device, a flux spraying device, a copper ring loading device, a vacuum cavity welding device, a plasma cleaning device, an AOI detection device, an aluminum wire bonding device, a gold wire bonding device, a main conveying track system, a branch track system, a loading and unloading system and the like. The thick film hybrid integrated circuit micro-assembly intelligent production line reduces labor intensity, realizes production capacity improvement, reduces manufacturing cost, replaces manual work, improves efficiency, realizes automatic production of hybrid integrated circuits such as power converters, power drive circuits and automobile electronics. The production process of the product mainly comprises welding, bonding and substrate assembly and the like. The built digital micro-assembly system has the characteristics of production lean, equipment automation and management informatization, and the number and distribution mode of the processing equipment can be set according to the production rhythm and the size of the site, so that balanced production is realized.

[0080] Although the present application has been disclosed with reference to the preferred embodiments, it is not intended to limit the present application. Those skilled in the art can make various modifications and improvements without departing from the spirit and scope of the present application. Therefore, the scope of the present application is defined by the appended claims.

Claims

1. A method for micro-assembly of thick-film hybrid integrated circuits, characterized in that, The assembly method includes: Insulating adhesive and solder paste are applied to the upper part of the substrate, and then chip mounting and resistor-capacitor mounting are performed in sequence. After cooling the substrate, first use a solder paste machine to apply solder paste to the ends of the vertically mounted components on the substrate at an angle, and then use a universal angle solder paste machine to apply solder paste from multiple angles to the solder paste that the solder paste machine cannot reach. At the upper welding station, welding sheets are automatically fed and flux is sprayed onto the welding sheets, and the processed welding sheets are laid inside the housing carrier; The substrate is sent to the shell processing station, the shell carrier is sent to the shell processing station, the substrate is loaded into the shell carrier of the solder pad, and the substrate is controlled to a preset position; The starting equipment welding carrier blocks and lifts the product at the assembly position. After the cylinder clamps the product, the robot applies solder paste to the product. After the solder paste is applied, the robot moves down to the copper ring placement position under visual guidance to pick up the copper ring. After picking it up, it moves to the lower camera position for position correction. After correction, the copper ring is assembled onto the product under the guidance of the upper vision. Then the robot applies solder paste to the upper surface of the copper ring a second time to complete one copper ring assembly. The substrate is sent to a soldering furnace for bonding and finally cooled and discharged.

2. The thick-film hybrid integrated circuit micro-assembly method according to claim 1, characterized in that, After the resistive and capacitive chip mounting process, an optical inspection instrument is used to inspect the quality of the resistive and capacitive chips.

3. The thick-film hybrid integrated circuit micro-assembly method according to claim 1, characterized in that, After the resistive and capacitive bonding process, the qualified substrate is transferred to an epoxy curing oven for heating to cure the insulating and conductive adhesives, and then cooled.

4. The thick-film hybrid integrated circuit micro-assembly method according to claim 1, characterized in that, At the shell work station, the substrate is placed in a predetermined position within the shell carrier using a magnet device.

5. A method for micro-assembly of thick-film hybrid integrated circuits according to any one of claims 1 to 4, characterized in that, Each workstation is interconnected by a track, allowing the substrate to circulate between the workstations. The running speed of each section of the track can be adjusted independently.

6. A thick-film hybrid integrated circuit micro-assembly production line, characterized in that, The production line includes a board loading machine, a dispensing machine, a chip mounter, a resistor and capacitor chip mounter, an automatic optical inspection instrument, an epoxy curing oven, a cooling line, a nitrogen storage cabinet, a solder paste machine, a soldering station, a substrate loading station, a copper ring mounting station, a vacuum reflow oven, a cooling line, and a vapor phase cleaning machine. The board loading machine is used for loading substrate carriers; Dispensing machines are used to apply insulating adhesive and solder paste to designated locations on a substrate for mounting components. Pick and place machines are used to mount resistive capacitor components onto substrates; A resistive-capacitive chip mounter is used to inspect the quality of resistive-capacitive chip mounting after the chip is mounted. An automated optical inspection instrument is used to inspect the quality of resistors and capacitors after they have been mounted. Epoxy curing ovens are used for curing insulating and conductive adhesives; The cooling line is used to cool the substrate carrier after it exits the furnace; Nitrogen storage cabinets are used for online humidity control and to prevent product oxidation. The first solder paste machine is used for tilting and dotting solder paste on the ends of vertically mounted components. The second solder paste machine is a universal solder paste machine, which is used for multi-angle dotting of solder paste on the ends of vertically mounted components. The electrode loading station is used for automatic electrode feeding and flux spraying; The substrate loading station is used for automatic and precise substrate loading and automatic magnet installation. The copper ring station is used for solder paste application and automatic copper ring assembly. Vacuum reflow ovens are used to fix the substrate to the outer casing; Vapor phase cleaning machines are used to clean substrates after they have been installed in the housing and reflow soldering. After cleaning, no flux, solder balls, or excess debris remain.

7. A thick-film hybrid integrated circuit micro-assembly production line according to claim 6, characterized in that, Each workstation is interconnected by a track, allowing the substrate to circulate between the workstations. The running speed of each section of the track can be adjusted independently.

8. A thick-film hybrid integrated circuit micro-assembly production line according to claim 6, characterized in that, The production line is also equipped with a manual inspection station, which is used to manually handle defective products.

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