Heat dissipation structure and electronic equipment

Abstract

The present invention provides a heat dissipation structure with excellent maintainability. The heat dissipation structure dissipates heat for a GPU in which a bare chip is arranged on the upper surface of a substrate and a capacitor is arranged around the bare chip. The heat dissipation structure comprises: a heat spreader thermally connected to the upper surface of the bare chip; a liquid metal arranged between the upper surface of the bare chip and the heat spreader; an insulating material covering the capacitor; an insulating sheet surrounding the bare chip; and an elastic wall arranged at the peripheral portion of the substrate and protruding upward. The insulating sheet comprises: a central portion covering the upper surface of the insulating material in a state not fixed relative to the insulating material; a peripheral portion fixed to the upper surface of the substrate in a freely loadable and detachable manner; and an intermediate portion forming a step difference between the central portion and the peripheral portion. The elastic wall is fixed to the upper surface of the peripheral portion.

Description

Technical Field

[0001] The present invention relates to a heat dissipation structure of a semiconductor chip in which a bare chip is arranged on the upper surface of a substrate and electrical components are arranged around the bare chip, and an electronic device. Background Art

[0002] Semiconductor chips such as GPUs are provided in electronic devices. The GPU is in the shape of a rectangular bare chip having a portion for mounting on a substrate, namely a base plate, and a top surface of the base plate. In addition, a plurality of small capacitors are sometimes arranged on the top surface of the base plate in a manner surrounding the bare chip.

[0003] Semiconductor chips such as GPUs are heat generating elements, and need to be cooled due to their power consumption. As a unit for cooling the GPU, a heat sink such as a heat spreader, a heat sink, or a heat sink is sometimes used, and such a heat sink is placed against the upper surface of the die to diffuse the heat. Between the die and the heat sink, a grease or liquid metal with high thermal conductivity is sometimes provided in order to efficiently transfer heat (for example, Japanese Patent Publication No. 2004-146819). Liquid metal has a higher thermal conductivity than grease and can effectively transfer heat from the die to the heat sink.

[0004] However, liquid metal is a liquid with high fluidity, so measures must be taken to prevent it from leaking from the upper surface of the die. In addition, even if the liquid metal flows out to the periphery of the die, it must not contact surrounding electrical components such as capacitors. This is because liquid metal is a conductor and may short-circuit the capacitor.

[0005] And, when professionals carry out the maintenance of electronic equipment, sometimes the radiator is removed from the semiconductor chip. At this time, liquid metal may also leak to the surrounding, but it is preferably a structure that can at least prevent outflow to the mounting substrate and can appropriately carry out post-processing. Summary of the invention

[0006] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a heat dissipation structure and an electronic device which can effectively dissipate heat from a semiconductor chip and have excellent maintainability.

[0007] In order to solve the above-mentioned problems and achieve the purpose, the first form of the present invention involves a heat dissipation structure, which is a heat dissipation structure of a semiconductor chip in which a bare chip is arranged on the upper surface of a substrate and electrical components are arranged around it, comprising: a heat sink thermally connected to the upper surface of the aforementioned bare chip; liquid metal arranged between the upper surface of the aforementioned bare chip and the aforementioned heat sink; insulating material covering the aforementioned electrical components; an insulating sheet surrounding the aforementioned bare chip; and an elastic wall arranged at the peripheral portion of the aforementioned substrate and protruding upward, the aforementioned insulating sheet comprising: a central portion covering the upper surface of the insulating material in a state of being not fixed relative to the aforementioned insulating material; a peripheral portion fixed to the upper surface of the aforementioned substrate in a freely loadable and detachable manner; and an intermediate portion forming a step difference between the aforementioned central portion and the aforementioned peripheral portion, and the aforementioned elastic wall fixed to the upper surface of the aforementioned peripheral portion.

[0008] An electronic device according to a second aspect of the present invention includes the above-mentioned heat dissipation structure and the above-mentioned semiconductor chip.

[0009] In the embodiment of the present invention, liquid metal is provided between the upper surface of the bare chip and the heat sink, so that the semiconductor chip can dissipate heat effectively. In addition, when the heat sink is removed, the electrical components are also protected by the insulating material and the insulating sheet, and even if the liquid metal leaks to the periphery, it flows from the central part of the insulating sheet through the step part to the peripheral part and accumulates between the elastic wall and the middle part. The peripheral part of the insulating sheet can be removed from the upper surface of the substrate, and the accumulated liquid metal can be handled together with the elastic wall, which is excellent in maintenance.

[0010] The structure may be such that a partition wall is provided between the electric element covered by the insulating material and the bare chip, and the flow of the liquid metal can be partitioned by the partition wall.

[0011] The partition wall may be an elastic member and sandwiched between the substrate and the heat sink. The partition wall can be used to divide a first space in the center and a second space outside the partition wall, and the liquid metal can be contained in the first space.

[0012] The partition wall may also be a bent portion formed by bending the central side end of the insulating sheet downward, and the front end of the bent portion does not contact the substrate and the insulating material. Even if there is a slight dimensional error in such a bent portion, the central portion does not float relative to the upper surface of the insulating material but can be properly abutted, and the heat sink does not interfere with the central portion.

[0013] The interval between the bent portion and the bare chip may be set to a width that the liquid metal cannot enter. Liquid metal has poor wettability, so a certain interval prevents it from entering and prevents it from contacting the insulating material.

[0014] The peripheral portion may be configured to coincide with the outer periphery of the substrate, thereby facilitating positioning and fixing, and ensuring a moderately large area for accumulating liquid metal.

[0015] The insulating material may be a UV curable paint. Such a paint can easily form the insulating material.

[0016] The semiconductor chip may be a GPU mounted on a substrate, and the electrical element may be a capacitor.

[0017] According to the above aspect of the present invention, liquid metal is provided between the upper surface of the bare chip and the heat sink, so that the semiconductor chip can dissipate heat effectively. In addition, when the heat sink is removed, the electrical components are also protected by the insulating material and the insulating sheet, and even if the liquid metal leaks to the periphery, it flows from the central part of the insulating sheet through the step part to the peripheral part and accumulates between the elastic wall and the middle part. The peripheral part of the insulating sheet can be removed from the upper surface of the substrate, and the accumulated liquid metal can be handled together with the elastic wall, which is excellent in maintenance. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is an exploded perspective view showing a heat dissipation structure and a part of an electronic device according to an embodiment of the present invention.

[0019] Figure 2 It is a three-dimensional diagram of the GPU.

[0020] Figure 3 It is a schematic cross-sectional side view of the heat dissipation structure according to the first embodiment.

[0021] Figure 4 It is a perspective view showing a partition wall and its surrounding elements according to a modified example.

[0022] Figure 5 It is a schematic cross-sectional side view of a heat dissipation structure according to a second embodiment.

[0023] Figure 6 It is a schematic cross-sectional side view of a heat dissipation structure according to a third embodiment.

[0024] Description of Reference Numerals

[0025] 10, 10A, 10B, 10C…heat dissipation structure; 12…electronic device; 14…GPU (semiconductor chip); 16…heat spreader (heat sink); 22…substrate; 24…bare chip; 26…substrate; 28…capacitor (electrical element); 30…liquid metal; 32…insulating material; 34, 34B…insulating sheet; 34a…central portion; 34b…peripheral portion; 34ba…exposed flat portion; 34c…middle portion; 34Ba…bent portion; 36…elastic wall; 38, 38A…partition wall; 38Aa…groove; 42…elastic member; G…interval; S1…first space; S2…second space; S2a…liquid accumulation portion. DETAILED DESCRIPTION

[0026] Hereinafter, embodiments of the present invention will be described in detail based on the drawings. However, the present invention is not limited to the embodiments.

[0027] Figure 1 1 is an exploded perspective view showing a portion of a heat dissipation structure 10 and an electronic device 12 according to an embodiment of the present invention. As a specific example of the heat dissipation structure 10, a heat dissipation structure 10A according to the first embodiment (see Figure 3 ), the heat dissipation structure 10B according to the second embodiment (see Figure 5 ), and a heat dissipation structure 10C according to the third embodiment (see Figure 6 ). It is typically recorded as heat dissipation structure 10.

[0028] The electronic device 12 is, for example, a notebook PC, a desktop PC, a tablet terminal, or a smart phone, and is provided with a GPU (Graphics Processing Unit) 14. The GPU 14 is a semiconductor chip that can perform real-time image processing. The GPU 14 generates heat due to high-speed computing, and therefore needs to be cooled. In the electronic device 12, a heat spreader (heat sink) 16 is provided as a heat dissipation unit for the GPU 14.

[0029] The heat spreader 16 is a plate-shaped structure formed by joining the peripheral edges of two metal plates (e.g., copper plates) to form a closed space inside, and can efficiently diffuse heat through the phase change of the working fluid sealed in the closed space. A wick is arranged in the closed space of the heat spreader 16 to transport the condensed working fluid using capillary action.

[0030] Two substantially parallel heat pipes 18 are provided in the heat spreader 16, and the ends of the heat pipes 18 are connected to the fan 20. The heat pipes 18 are configured to seal a working fluid in a closed space formed in a thin and flat metal pipe, and are provided with a liquid wick similar to the heat spreader 16.

[0031] As a heat dissipation unit for heat generating bodies such as GPU 14, various heat sinks can be applied in addition to heat spreader 16. Examples of the heat sink include metal plates with high thermal conductivity such as copper and aluminum, graphite plates, heat channels, and heat sinks.

[0032] Figure 2 is a three-dimensional diagram of GPU 14. Figure 2 The structural elements of the heat dissipation structure 10 are omitted. In the following description of the heat dissipation structure 10 of the present application, the condition of maintaining the substrate 26 and the GPU 14 in the up and down directions is used as a reference. That is, when viewed from the substrate 26, the side on which the GPU 14 is installed is set as the top, and the opposite side is set as the bottom. The up and down directions are appropriately indicated by arrows in each figure. In addition, when the heat dissipation structure 10 is embedded in the electronic device 12 and used, there is no restriction in the up and down direction, for example, it can also be in an upside-down state.

[0033] The GPU 14 includes a substrate 22 and a die 24. The substrate 22 is a relatively thin plate-shaped portion mounted on a base plate 26 and is rectangular in a plan view. The die 24 is a portion including a computing circuit and is arranged to protrude slightly from the upper surface of the substrate 22. The die 24 is a rectangle smaller than the substrate 22 in a plan view and is arranged approximately in the center of the upper surface of the substrate 22. The GPU 14 is one of the components that generates the most heat in the electronic device 12, and the die 24 generates particularly much heat.

[0034] On the upper surface of the substrate 22, a plurality of small capacitors (electrical components) 28 are arranged in a manner surrounding the bare chip 24. Depending on the location, the capacitors 28 are arranged in one or two rows around the bare chip 24. The capacitors 28 are provided at a position relatively close to the bare chip 24. The height of the capacitors 28 is lower than that of the bare chip 24.

[0035] Figure 3 1 is a schematic cross-sectional side view of the heat dissipation structure 10A according to the first embodiment. The heat dissipation structure 10A includes: the above-mentioned heat spreader 16; the liquid metal 30 provided between the upper surface of the bare chip 24 and the heat spreader 16; the insulating material 32 covering the capacitor 28; the insulating sheet 34; the elastic wall 36; and the partition wall 38. The heat spreader 16 is thermally connected (thermally connected) to the upper surface of the die 24 via the liquid metal 30 and the metal foil 40 described later.

[0036] Liquid metal 30 is basically a metal that becomes liquid at room temperature, but it only needs to become liquid at least at a temperature in a normal use state when power is supplied to substrate 26 of electronic device 12 and GPU 14 is operated. Liquid metal 30 is a metal and therefore has excellent thermal and electrical conductivity.

[0037] The insulating material 32 is, for example, an ultraviolet curing type paint and is formed into a thin film. After the paint is applied to cover the capacitor 28, it is cured by irradiating ultraviolet rays to form the insulating material 32. The insulating material 32 is easily formed using ultraviolet curing type paint. The insulating material 32 is formed to surround the bare chip 24 with a predetermined width. The insulating material 32 insulates the first column and the second column of the capacitor 28 in the same manner. Figure 3 In FIG. 1 , capacitors 28 are shown in two columns.

[0038] The insulating sheet 34 is an insulating material such as resin, and is a three-dimensionally shaped body that is appropriately thin. The insulating sheet 34 is in a frame shape surrounding the bare chip 24 in a plan view (see FIG. Figure 1 The insulating sheet 34 includes a central portion 34a closer to the bare chip 24, an outer peripheral portion 34b, and a middle portion 34c between the central portion 34a and the peripheral portion 34b. The central portion 34a and the peripheral portion 34b are parallel to the upper surface of the substrate 22.

[0039] The central portion 34a is the inner portion of the frame of the insulating sheet 34 and covers the upper surface of the insulating material 32. In this embodiment, the central portion 34a of the insulating sheet 34 and the insulating material 32 are not fixed. The central portion 34a covers the entire upper surface of the insulating material 32, but it is sufficient to cover at least the upper portion of the capacitor 28.

[0040] The peripheral portion 34b is detachably fixed to the peripheral upper surface of the substrate 22 by adhesive tape or the like. The peripheral portion 34b is configured to have an outer periphery that matches the size and shape of the substrate 22, making it easy to position and fix, and to ensure a moderately large area.

[0041] The middle portion 34c is a portion between the central portion 34a covering the upper surface of the insulating material 32 and the peripheral portion 34b fixed to the upper surface of the substrate 22, and has a step difference based on the height difference between the two. The middle portion 34c is inclined over a suitable width and is easy to mold.

[0042] The elastic wall 36 is provided at the peripheral portion of the substrate 22 and protrudes upward. In the present embodiment, the elastic wall 36 is fixed to the upper surface of the peripheral portion 34b in the insulating sheet 34 by means of an adhesive tape or the like. The elastic wall 36 is a frame, and the outer peripheral edge is consistent with the substrate 22 and the peripheral portion 34b. The inner peripheral edge of the elastic wall 36 is closer to the outside than the inner peripheral edge of the peripheral portion 34b. The peripheral portion 34b is ensured to have some exposed flat portions 34ba that are not covered by the elastic wall 36 in the inner position. The elastic wall 36 is slightly higher than the bare chip 24 in a natural state without external force, and is appropriately compressed by the heat spreader 16 in the assembled state of the heat dissipation structure 10A. The elastic wall 36 is, for example, a sponge material.

[0043] The partition wall 38 is disposed between the capacitor 28 covered by the insulating material 32 and the bare chip 24 and protrudes upward. The partition wall 38 is a frame, and its inner periphery is close to or in contact with the outer periphery of the bare chip 24. The partition wall 38 is an elastic member such as a sponge material and is sandwiched between the substrate 22 and the heat spreader 16. The partition wall 38 is fixed to the upper surface of the substrate 22 by an adhesive tape or the like. In addition, the insulating material 32 is not actually Figure 3 The exact rectangular cross-section shown may be slightly extended in the lateral direction. The lower surface of the partition wall 38 may also be fixed to the upper surface of the extended insulating material 32. The partition wall 38 is slightly higher than the die 24 in the natural state without external force, and is appropriately compressed by the heat spreader 16 in the assembled state of the heat dissipation structure 10A.

[0044] The heat spreader 16 is fixed to the substrate 26 or the housing of the electronic device 12 by a predetermined fixing means such as screws (see Figure 1 ). By assembling the heat spreader 16, the elastic wall 36 and the partition wall 38 are appropriately compressed. The heat spreader 16 can be configured so that part of the heat pipe 18 abuts against the bare chip 24. A metal foil 40 is provided on the lower surface of the heat spreader 16 and at the position abutting against the bare chip 24. Depending on the design conditions, the metal foil 40 can also be omitted. In the heat dissipation structure 10A, a first space S1 surrounded by the partition wall 38 and a second space S2 surrounded by the partition wall 38 and the elastic wall 36 are formed on all sides. The first space S1 and the second space S2 are basically closed spaces. The inner periphery of the partition wall 38 is close to the outer periphery of the bare chip 24, so the first space S1 is a sufficiently narrow space.

[0045] The liquid metal 30 is appropriately coated on the upper surface of the die 24 during the assembly stage of the heat dissipation structure 10A, and then the vapor chamber 16 is placed thereon, thereby being pressed by the lower surface of the vapor chamber 16 and extending to the upper surface of the die 24 without omission, filling the gap between the die 24 and the vapor chamber 16. The liquid metal 30 is a liquid and therefore has fluidity, and is fully extended by the pressing of the vapor chamber 16. Therefore, at the microscopic level, there is a part where the vapor chamber 16 and the die 24 are in direct contact, and the liquid metal 30 is filled in the tiny gaps other than that. This enables efficient heat conduction between the die 24 and the vapor chamber 16, thereby improving the heat dissipation of the GPU 14.

[0046] In the heat dissipation structure 10A thus constructed, the liquid metal 30 is pressed and expanded by the heat spreader 16, and thus the excess amount is squeezed out around the bare chip 24, but the first space S1 is partitioned by the partition wall 38, so it does not leak into the second space S2. In addition, the first space S1 is a sufficiently narrow space, which is substantially filled with the liquid metal 30 and almost no air. Therefore, the liquid metal 30 does not flow inadvertently inside the first space S1.

[0047] In addition, even when the liquid metal 30 passes over the partition wall 38 and penetrates into the second space S2, the capacitor 28 is doubly insulated by the insulating material 32 and the insulating sheet 34 and does not contact the liquid metal 30. The capacitor 28 can obtain considerable insulation only by the insulating material 32, but even when pinholes or cracks are generated in the insulating material 32 due to unexpected excessive impact, vibration, etc., the insulation is ensured by the insulating sheet 34. In addition, the second space S2 is closed by the elastic wall 36, so the liquid metal 30 does not leak to the substrate 26.

[0048] When a professional performs maintenance on the electronic device 12, the heat dissipation structure 10A is placed in an orientation in which the substrate 26 is on the lower side and the GPU 14 is on the upper side. During maintenance, the heat spreader 16 is sometimes removed from the GPU 14 and the substrate 26. At this time, the liquid metal 30 may also leak out to the surrounding area to the area of ​​the second space S2, but as described above, the capacitor 28 is protected by the insulating material 32 and the insulating sheet 34 and does not contact the liquid metal 30. In addition, the liquid metal 30 leaking into the second space S2 flows on the upper surface of the central portion 34a of the insulating sheet 34 and accumulates in the liquid accumulation portion S2a formed between the middle portion 34c forming the step difference and the inner peripheral wall of the elastic wall 36, and at least does not flow out to the substrate 26. In the liquid accumulation portion S2a, it is ensured that the flat portion 34ba is exposed and has a certain degree of space capacity so that the liquid metal 30 does not overflow, and it becomes easy to accumulate the liquid metal 30.

[0049] As described above, the lower surface of the peripheral portion 34b of the insulating sheet 34 is detachably fixed to the substrate 22. Therefore, the liquid metal 30 that has flowed into the liquid accumulation portion S2a can be removed together with the insulating sheet 34 and the elastic wall 36 by removing the insulating sheet 34 from the substrate 22, and can be appropriately and easily post-processed. The insulating sheet 34 is not fixed to the insulating material 32, and the insulating material 32 will not peel off even if the insulating sheet 34 is removed. In reassembling the heat dissipation structure 10A, a new insulating sheet 34 and elastic wall 36 can be used.

[0050] During maintenance, workers may touch GPU 14 with their fingers or tools, but capacitor 28 is protected by insulating material 32 and insulating sheet 34, so even if they touch insulating sheet 34, they will not directly touch insulating material 32, and will not damage insulating material 32 and reduce insulation. In this way, heat dissipation structure 10A and electronic device 12 according to the present embodiment can effectively dissipate heat from GPU 14 and have excellent maintainability.

[0051] In addition, the liquid metal 30 is basically sealed in the first space S1, but a small amount of it can be allowed to flow out to the second space S2 during the assembly stage depending on the amount of coating on the upper surface of the bare chip 24. This is because the capacitor 28 is insulated by the insulating material 32 and the insulating sheet 34, and the elastic wall 36 prevents leakage to the outside.

[0052] Figure 4 38A and its surrounding elements involved in the modification. The partition wall 38A is a modification of the partition wall 38 described above, and a shallow groove 38Aa is formed in the center of each upper surface of the four sides to connect the first space S1 and the second space S2. If such a partition wall 38A is used, when the heat spreader 16 is installed during the assembly of the heat dissipation structure 10A, the excess amount of liquid metal 30 applied to the upper surface of the bare chip 24 is squeezed out to the surroundings, but even if it cannot be completely accommodated in the first space S1, a small amount of excess is discharged to the second space S2, and the first space S1 is filled with an appropriate amount of liquid metal 30. As a result, the liquid metal 30 is allowed to be slightly more applied to the upper surface of the bare chip 24 during assembly, and the assembly performance is improved. In addition, the first space S1 is filled with an appropriate amount of liquid metal 30, and more reliable heat transfer is performed between the heat spreader 16 and the bare chip 24. The partition wall 38A is compressed by the heat spreader 16 , so that the groove 38Aa can be formed shallowly to a degree that the groove 38Aa is substantially closed.

[0053] Figure 5 1 is a schematic cross-sectional side view of a heat dissipation structure 10B according to the second embodiment. In the heat dissipation structure 10B and the heat dissipation structure 10C described later, the same components as those of the heat dissipation structure 10A are denoted by the same reference numerals and their detailed descriptions are omitted. In the heat dissipation structure 10B, an insulating sheet 34B is provided instead of the insulating sheet 34 in the heat dissipation structure 10A. In the heat dissipation structure 10B, the partition wall 38 in the heat dissipation structure 10A is omitted.

[0054] The insulating sheet 34B has a central portion 34a, a peripheral portion 34b, and an intermediate portion 34c in the same manner as the above-mentioned insulating sheet 34. The insulating sheet 34B also has a bent portion (partition wall) 34Ba protruding downward from the inner peripheral edge of the central portion 34a. The bent portion 34Ba is a part of the insulating sheet 34 and is integrally formed with the central portion 34a, the peripheral portion 34b, and the intermediate portion 34c, so that the number of components does not increase.

[0055] The bent portion 34Ba is small, and its lower end does not contact the upper surface of the substrate 22 and the insulating material 32. Therefore, even if there is a slight dimensional error, the central portion 34a can properly abut against the upper surface of the insulating material 32 without floating, and the heat spreader 16 can properly press the expanded liquid metal 30 without interfering with the central portion 34a.

[0056] The gap G between the bent portion 34Ba and the bare die 24 is sufficiently small and is set to a width that the liquid metal 30 cannot enter. The liquid metal 30 lacks wettability, so by setting a certain degree of gap G (for example, about 0.5 mm), it cannot enter and is prevented from contacting the insulating material 32 located inside the insulating sheet 34. Therefore, even if pinholes or cracks are generated in the insulating material 32, the capacitor 28 is protected from the liquid metal 30. In addition, since the gap G is ensured, even if there is a slight dimensional error, it does not abut against the side surface of the bare die 24, and stress is not applied to the insulating sheet 34, or the central portion 34a is not floated.

[0057] Figure 6 1 is a schematic cross-sectional side view of a heat dissipation structure 10C according to the third embodiment. In the heat dissipation structure 10C, a thin elastic member 42 is provided between the central portion 34a of the insulating sheet 34 in the heat dissipation structure 10B and the heat spreader 16. The elastic member 42 is a frame, for example, formed of a sponge. The elastic member 42 is sufficiently soft and does not become an obstacle when the heat spreader 16 is installed. In addition, a strong compressive force does not act on the elastic member 42, so an excessively large compressive force does not act on the central portion 34a, the insulating material 32, and the capacitor 28.

[0058] Such an elastic member 42 clearly divides the first space S1 and the second space S2, and can prevent the liquid metal 30 from entering the second space S2. In addition, if the elastic member 42 is removed during maintenance, the leaked liquid metal 30 can flow into the liquid storage portion S2a.

[0059] The present invention is not limited to the above-described embodiments, and can be freely modified within a scope not departing from the gist of the present invention.

Claims

1. A heat dissipation structure is a heat dissipation structure of a semiconductor chip in which a bare chip is arranged on the upper surface of a substrate and electrical components are arranged around the bare chip, characterized in that: have: a heat sink thermally connected relative to the upper surface of the die; Liquid metal is disposed between the upper surface of the die and the heat sink; an insulating material covering the electrical component; An insulating sheet surrounding the bare die; as well as an elastic wall, which is arranged at the peripheral portion of the substrate and protrudes upward, The insulating sheet comprises: a central portion covering an upper surface of the insulating material in a non-fixed state relative to the insulating material; A peripheral portion detachably fixed to the upper surface of the substrate; and an intermediate portion, forming a step difference between the central portion and the peripheral portion, The elastic wall is fixed to the upper surface of the peripheral portion.

2. The heat dissipation structure according to claim 1, characterized in that: There is a partition wall between the electrical element covered by the insulating material and the die.

3. The heat dissipation structure according to claim 2, characterized in that: The partition wall is an elastic member and is sandwiched by the substrate and the heat sink.

4. The heat dissipation structure according to claim 2, characterized in that: The partition wall is a bent portion formed by bending the central end of the insulating sheet downward. The front end of the bent portion does not contact the substrate and the insulating material.

5. The heat dissipation structure according to claim 4, characterized in that: The interval between the bent portion and the die is set to a width that prevents the liquid metal from entering.

6. The heat dissipation structure according to any one of claims 1 to 5, characterized in that: The peripheral portion is consistent with the outer periphery of the substrate.

7. The heat dissipation structure according to any one of claims 1 to 5, characterized in that: The semiconductor chip is a GPU mounted on a substrate, and the electrical element is a capacitor.

8. The heat dissipation structure according to any one of claims 1 to 5, characterized in that: The insulating material is an ultraviolet curing paint.

9. An electronic device, characterized in that: A heat dissipation structure according to any one of claims 1 to 5 and the semiconductor chip are provided.

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