A circuit board solder mask coating device and its coating method

Abstract

The present invention discloses a solder mask coating device for a circuit board and a coating method thereof, which relates to the technical field of circuit board processing. The solder mask coating device for the circuit board includes an equipment bottom plate and a support shaft installed on the top surface of the equipment bottom plate. The top surface of the support shaft is installed with an equipment top plate. Two parallel lower moving tracks are installed on the top surface of the equipment bottom plate. Two parallel upper moving tracks are installed on the bottom surface of the equipment top plate. Driving mechanisms are installed inside the upper moving tracks and the lower moving tracks. A coating mechanism is installed on the outer surface of the driving mechanism. A feeding mechanism is installed on the outer surface of the coating mechanism. In the present invention, as the coating roller shaft continues to rotate, the flexible scraper contacts the outer surface of the circuit board to be processed, and the solder mask on the outer surface of the circuit board is evenly coated. By continuously rotating the coating roller shafts distributed in an upper and lower staggered manner, the two sides of the circuit board can be coated simultaneously, improving the processing efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board processing, and particularly to a solder mask coating device for a circuit board and a coating method thereof. Background Art

[0002] A circuit board can be called a printed wiring board or a printed circuit board, which is one of the important components of the electronics industry. Almost every electronic device, from small electronic watches and calculators to large computers, communication electronic devices, and military weapon systems, as long as there are electronic components such as integrated circuits, in order to achieve electrical interconnection between each component, a printed circuit board is used. The printed wiring board consists of an insulating base plate, connecting wires, and pads for assembling and soldering electronic components, and has the dual functions of a conductive circuit and an insulating base plate. It can replace complex wiring, realize the electrical connection between each component in the circuit, not only simplifies the assembly and soldering work of electronic products, reduces the wiring workload in the traditional way, and greatly reduces the labor intensity of workers; but also reduces the overall volume of the machine, reduces product costs, and improves the quality and reliability of electronic devices.

[0003] The solder mask is a protective layer coated on the circuits and substrates of the printed circuit board that do not need to be soldered, and the purpose is to protect the formed circuit pattern in the long term. The advantages of the solder resist are that it can avoid or reduce defects such as bridging, wicking, cold soldering, and continuous strips during dip soldering, make the solder joints plump, greatly reduce the rework amount of the board, improve the soldering quality, ensure the reliability of the product. At the same time, after using the solder resist, except for the pads, the rest of the lines are not tinned, which can save a large amount of solder. Currently, when applying the solder mask to the circuit board, a squeegee is generally used to squeeze the green oil onto the circuit board and then use the squeegee for coating, with low efficiency. And it adopts a single-sided coating method, which increases the workload and reduces the work efficiency. Summary of the Invention

[0004] Technical Problem to be Solved

[0005] In view of the deficiencies of the prior art, the present invention provides a solder mask coating device for a circuit board and a coating method thereof, which solve the problems that currently, when applying the solder mask to the circuit board, a squeegee is generally used to squeeze the green oil onto the circuit board and then use the squeegee for coating, with low efficiency, and it adopts a single-sided coating method, which increases the workload and reduces the work efficiency.

[0006] Technical Solution

[0007] To achieve the above object, the present invention is realized by the following technical solutions: A solder mask coating device for a circuit board, comprising a device bottom plate and a support shaft installed on the top surface of the device bottom plate. The top surface of the support shaft is installed with a device top plate. The top surface of the device bottom plate is installed with two parallel lower moving tracks. The bottom surface of the device top plate is installed with two parallel upper moving tracks. The inside of the upper moving track and the lower moving track are both installed with a driving mechanism. The outer surface of the driving mechanism is installed with a coating mechanism. By driving the driving mechanism to drive the coating mechanism to move, uniform coating of the circuit board is achieved. The outer surface of the coating mechanism is installed with a feeding mechanism for adding solder mask to the coating mechanism.

[0008] Preferably, the driving mechanism includes a moving component and a driving component. The moving component is installed inside the upper moving track and the lower moving track, and the driving component is installed on the outer surface of the moving component.

[0009] Preferably, the moving component includes a first electric push rod and a moving block. The outer surface of the moving block is respectively movably installed inside the upper moving track and the lower moving track. Four first electric push rods are respectively installed between the four moving blocks and the inner walls of the upper moving track and the lower moving track. The outer surface of the moving block is installed with a fixed seat. A rotating motor is installed on the outer surface of the fixed seat. A rotating shaft is installed on the outer surface of the output end of the rotating motor. The coating mechanism is installed on the end surface of the rotating shaft.

[0010] Preferably, the coating mechanism includes a coating roller shaft and a material guiding component. The coating roller shaft is installed on the end surface of the rotating shaft, and the material guiding component is installed inside the coating roller shaft.

[0011] Preferably, the material guiding component includes a material guiding channel and a discharging nozzle. A storage cavity is formed inside the coating roller shaft. The material guiding channels are distributed inside the coating roller shaft on the outer surface of the storage cavity. The end of the material guiding channel extends to the outer surface of the storage cavity. The discharging nozzle is installed on the end surface of the material guiding channel. The outer surface of the coating roller shaft is evenly distributed with movable long grooves. The inner wall of the movable long groove is movably installed with a flexible scraper. One end surface of the flexible scraper and the inner wall of the movable long groove are jointly installed with a compression spring. The other end of the flexible scraper is installed with a guiding shaft. A guiding cylinder body is installed on the outer surface of the rotating motor. The end of the guiding shaft is in movable contact with one end surface of the guiding cylinder body.

[0012] Preferably, the feeding mechanism includes a feeding component and a connecting component. The top surface of the fixed seat far from the rotating motor is installed with a second electric push rod. The feeding component is installed on the outer surface of the output end of the second electric push rod. The connecting component is installed inside the coating roller shaft.

[0013] Preferably, the feeding assembly includes a feeding tank and a pushing plate. The feeding tank is installed on the top surface of the fixed seat adjacent to the second electric push rod. The outer surface of the feeding tank is equipped with a feeding pipe, and the end surface of the feeding pipe is equipped with a sealing cover. The pushing plate is movably installed on the inner wall of the feeding tank. One side surface of the pushing plate is equipped with a movable support shaft. The outer surface of the feeding tank is provided with a movable groove, and the outer surface of the movable support shaft is movably installed on the inner wall of the movable groove. The end of the movable support shaft is connected to the outer surface of the output end of the second electric push rod.

[0014] Preferably, the connecting assembly includes a communicating pipe and a limiting collar. A through groove is provided on the end surface of the coating roller shaft far from the rotating shaft. One end surface of the communicating pipe is movably installed on the inner wall of the through groove. The limiting collar is installed at the connection of the through groove and the communicating pipe. The other end surface of the communicating pipe is connected to the inside of the feeding tank.

[0015] Preferably, the limiting mechanism includes a first electric telescopic rod and a second electric telescopic rod. The first electric telescopic rod is installed on the top surface of the equipment bottom plate. The top surface of the first electric telescopic rod is equipped with a bearing plate. The top surface of the bearing plate is equipped with a weighing sensor. Two vertical shafts are installed on the outer side surfaces of both sides of the equipment bottom plate. The second electric telescopic rod is installed on the top surface of the vertical shaft. The end surface of the second electric telescopic rod is equipped with a clamping plate.

[0016] A coating method using the circuit board solder mask coating device includes the following operation methods:

[0017] S1: Before processing, open the sealing cover, add solder mask into the feeding tank through the feeding pipe, then close the sealing cover, place the circuit board to be processed between the upper and lower coating roller shafts. The bottom of the circuit board contacts the weighing sensor. The weight of the circuit board is detected by the weighing sensor, so as to calculate the size of the circuit board. Control the second electric telescopic rod to drive the clamping plate to approach the circuit board, so as to fix the circuit board, and the first electric telescopic rod shortens;

[0018] S2: Connect the first electric push rod to the circuit. The first electric push rod drives the moving blocks to move in the upper moving track and the lower moving track respectively. The two moving blocks move relative to each other, so as to drive the two coating roller shafts to move relative to each other;

[0019] S3: At the same time, connect the rotating motor to the circuit. The rotating motor drives the rotating shaft to rotate, so as to drive the coating roller shaft to rotate, so that the coating roller shaft continuously rolls over the outer surface of the circuit board to be processed. At the same time, drive its relative movement through the moving block, so that both ends of the circuit board to be processed are subjected to frictional forces in two opposite directions, so that the circuit board to be processed maintains dynamic balance;

[0020] S4: When the rotating motor rotates, it drives the discharge nozzle to rotate. According to the output power of the rotating motor, the control system controls the second electric push rod to be connected to the circuit at regular intervals. When the discharge nozzle rotates to contact the end face of the circuit board to be processed, the second electric push rod is connected to the circuit, causing the second electric push rod to drive the movable support shaft to move, thereby driving the push-pull plate to move, squeezing the solder mask inside the feeding tank into the storage cavity through the connecting pipe, and then overflowing from the discharge nozzle through the material guiding channel, so as to extrude it onto the outer surface of the circuit board to be processed;

[0021] S5: As the coating roller shaft continues to rotate, the flexible scraper contacts the outer surface of the circuit board to be processed, and spreads the solder mask on the outer surface of the circuit board to be processed evenly. By continuously rotating the coating roller shafts distributed in an upper and lower staggered manner, the two sides of the circuit board can be coated simultaneously, improving the processing efficiency. By contacting the waveform end face of the guide shaft and the guide cylinder body, the guide shaft drives the flexible scraper to reciprocate in the movable long groove, causing the flexible scraper to reciprocate on the surface of the circuit board, strengthening the coating effect.

[0022] Beneficial effects

[0023] The present invention has the following beneficial effects:

[0024] 1. For the solder mask coating device for circuit boards, by connecting the rotating motor to the circuit, the rotating motor drives the rotating shaft to rotate, thereby driving the coating roller shaft to rotate, causing the coating roller shaft to continuously roll over the outer surface of the circuit board to be processed. At the same time, through the relative movement driven by the moving block, both ends of the circuit board to be processed are subjected to frictional forces in two opposite directions, enabling the circuit board to be processed to maintain dynamic balance.

[0025] 2. For the solder mask coating device for circuit boards, when the rotating motor rotates, it drives the discharge nozzle to rotate. According to the output power of the rotating motor, the control system controls the second electric push rod to be connected to the circuit at regular intervals. When the discharge nozzle rotates to contact the end face of the circuit board to be processed, the second electric push rod is connected to the circuit, causing the second electric push rod to drive the movable support shaft to move, thereby driving the push-pull plate to move, squeezing the solder mask inside the feeding tank into the storage cavity through the connecting pipe, and then overflowing from the discharge nozzle through the material guiding channel, so as to extrude it onto the outer surface of the circuit board to be processed.

[0026] 3. For the solder mask coating device for circuit boards, as the coating roller shaft continues to rotate, the flexible scraper contacts the outer surface of the circuit board to be processed, and spreads the solder mask on the outer surface of the circuit board to be processed evenly. By continuously rotating the coating roller shafts distributed in an upper and lower staggered manner, the two sides of the circuit board can be coated simultaneously, improving the processing efficiency.

[0027] Of course, it is not necessary for any product implementing the present invention to achieve all the above-mentioned advantages simultaneously. Description of the drawings

[0028] Figure 1 This is a schematic diagram of the overall front external structure of the present invention;

[0029] Figure 2 This is a schematic diagram of the overall side external structure of the present invention;

[0030] Figure 3 This is a schematic diagram of the overall bottom external structure of the present invention;

[0031] Figure 4 This is a schematic diagram of the overall external structure of another side of the present invention;

[0032] Figure 5 This is a schematic diagram of the external structure of the coating mechanism of the present invention;

[0033] Figure 6 This is a schematic diagram of the external structure of the coating mechanism from another angle of the present invention;

[0034] Figure 7 This is a schematic diagram of the internal structure of the coating mechanism of the present invention;

[0035] Figure 8 This is a schematic diagram of the internal structure of the coating mechanism from another angle of the present invention.

[0036] In the figure, 1, equipment bottom plate; 2, support shaft; 3, equipment top plate; 4, lower moving track; 5, upper moving track; 6, moving block; 7, first electric push rod; 8, fixed seat; 9, rotating motor; 10, rotating shaft; 11, coating roller shaft; 12, storage cavity; 13, material guiding channel; 14, discharge nozzle; 15, flexible scraper; 16, second electric push rod; 17, feeding tank; 18, feeding pipeline; 19, sealing cover; 20, pushing plate; 21, movable support shaft; 22, movable groove; 23, through groove; 24, connecting pipeline; 25, limiting collar; 26, movable long groove; 27, compression spring; 28, guiding shaft; 29, guiding cylinder; 30, first electric telescopic rod; 31, bearing plate; 32, weighing sensor; 33, vertical vertical shaft; 34, second electric telescopic rod; 35, clamping plate. Detailed implementation manners

[0037] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0038] In the description of the present invention, it should be understood that the terms "open hole", "upper", "lower", "thickness", "top", "middle", "length", "inner", "periphery", etc. indicating the orientation or position relationship are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the components or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present invention.

[0039] Please refer to Figures 1-8 , an embodiment of the present invention provides a technical solution: a solder mask coating device for a circuit board, including a device bottom plate 1 and a support shaft 2 installed on the top surface of the device bottom plate 1. The top surface of the support shaft 2 is installed with a device top plate 3. Two parallel lower moving tracks 4 are installed on the top surface of the device bottom plate 1. Two parallel upper moving tracks 5 are installed on the bottom surface of the device top plate 3. Driving mechanisms are installed inside the upper moving track 5 and the lower moving track 4. A coating mechanism is installed on the outer surface of the driving mechanism. The driving mechanism drives the coating mechanism to move to achieve uniform coating of the circuit board. A feeding mechanism is installed on the outer surface of the coating mechanism for adding solder mask to the coating mechanism.

[0040] Specifically, the driving mechanism includes a moving component and a driving component. The moving component is respectively installed inside the upper moving track 5 and the lower moving track 4. The driving component is installed on the outer surface of the moving component. The moving component includes a first electric push rod 7 and a moving block 6. The outer surface of the moving block 6 is respectively movably installed inside the upper moving track 5 and the lower moving track 4. Four first electric push rods 7 are respectively installed between the four moving blocks 6 and the inner walls of the upper moving track 5 and the lower moving track 4. A fixed seat 8 is installed on the outer surface of the moving block 6. The driving component is installed on the outer surface of the fixed seat 8. The first electric push rod 7 drives the moving block 6 to move respectively inside the upper moving track 5 and the lower moving track 4. The two moving blocks 6 move relatively, thereby driving the two coating mechanisms to move relatively.

[0041] Furthermore, the driving component includes a rotating motor 9 and a rotating shaft 10. The rotating motor 9 is installed on the outer surface of the fixed seat 8. The rotating shaft 10 is installed on the outer surface of the output end of the rotating motor 9. The coating mechanism is installed on the end surface of the rotating shaft 10. The rotating motor 9 is connected to the circuit, and the rotating motor 9 drives the rotating shaft 10 to rotate, thereby driving the coating mechanism to rotate.

[0042] Furthermore, the coating mechanism includes a coating roller shaft 11 and a material guiding component. The coating roller shaft 11 is installed on the end surface of the rotating shaft 10, and the material guiding component is installed inside the coating roller shaft 11. The material guiding component includes a material guiding channel 13 and a discharge nozzle 14. A storage cavity 12 is formed inside the coating roller shaft 11. The material guiding channels 13 are distributed inside the coating roller shaft 11 on the outer surface of the storage cavity 12. The end of the material guiding channel 13 extends to the outer surface of the storage cavity 12. The discharge nozzle 14 is installed on the end surface of the material guiding channel 13. Activity long grooves 26 are evenly distributed on the outer surface of the coating roller shaft 11. A flexible scraper 15 is movably installed on the inner wall of the activity long groove 26. A compression spring 27 is jointly installed on one end surface of the flexible scraper 15 and the inner wall of the activity long groove 26. A guiding shaft 28 is installed at the other end of the flexible scraper 15. A guiding cylinder 29 is installed on the outer surface of the rotating motor 9. The end of the guiding shaft 28 is in movable contact with one end surface of the guiding cylinder 29. As the coating roller shaft 11 continues to rotate, the flexible scraper 15 contacts the outer surface of the circuit board to be processed, and evenly applies the solder resist on the outer surface of the circuit board to be processed. By continuously rotating the coating roller shafts 11 distributed in an up-and-down staggered manner, the two sides of the circuit board can be coated simultaneously. By the waveform end surface contact between the guiding shaft 28 and the guiding cylinder 29, the guiding shaft 28 drives the flexible scraper 15 to reciprocate in the activity long groove 26, so that the flexible scraper 15 reciprocates on the circuit board surface, strengthening the coating effect.

[0043] Furthermore, the feeding mechanism includes a feeding component and a connecting component. A second electric push rod 16 is installed on the top surface of the fixed seat 8 far away from the rotating motor 9. The feeding component is installed on the outer surface of the output end of the second electric push rod 16. The connecting component is installed inside the coating roller shaft 11. The feeding component includes a feeding tank 17 and a pushing plate 20. The feeding tank 17 is installed on the top surface of the fixed seat 8 adjacent to the second electric push rod 16. A feeding pipe 18 is installed on the outer surface of the feeding tank 17. A sealing cover 19 is installed on the end surface of the feeding pipe 18. Before processing, the sealing cover 19 is opened, and the solder resist is added into the feeding tank 17 through the feeding pipe 18, and then the sealing cover 19 is closed. The pushing plate 20 is movably installed on the inner wall of the feeding tank 17. A movable support shaft 21 is installed on one side surface of the pushing plate 20. An activity groove 22 is formed on the outer surface of the feeding tank 17. The outer surface of the movable support shaft 21 is movably installed on the inner wall of the activity groove 22. The end of the movable support shaft 21 is connected to the outer surface of the output end of the second electric push rod 16.

[0044] Further, the connecting component includes a communicating pipe 24 and a limiting collar 25. A through groove 23 is formed on the end surface of the coating roller shaft 11 away from the rotating shaft 10. One end surface of the communicating pipe 24 is movably installed on the inner wall of the through groove 23. The limiting collar 25 is installed at the connection between the through groove 23 and the communicating pipe 24. The other end surface of the communicating pipe 24 is connected to the inside of the feeding tank 17. When the discharging nozzle 14 rotates to contact the end face of the circuit board to be processed, the second electric push rod 16 is connected to the circuit, so that the second electric push rod 16 drives the movable support shaft 21 to move, thereby driving the push-pull plate to move, squeezing the solder resist in the feeding tank 17 into the storage cavity 12 through the communicating pipe 24, and then overflowing from the discharging nozzle 14 through the material guiding channel 13, so as to be extruded onto the outer surface of the circuit board to be processed;

[0045] Further, the limiting mechanism includes a first electric telescopic rod 30 and a second electric telescopic rod 34. The first electric telescopic rod 30 is installed on the top surface of the equipment base plate 1. A bearing plate 31 is installed on the top surface of the first electric telescopic rod 30. A weighing sensor 32 is installed on the top surface of the bearing plate 31. Two vertical shafts 33 are installed on the outer two side surfaces of the equipment base plate 1. The second electric telescopic rod 34 is installed on the top surface of the vertical shaft 33. A clamping plate 35 is installed on the end surface of the second electric telescopic rod 34. The weight of the circuit board is detected by the weighing sensor 32, so as to calculate the size of the circuit board, control the second electric telescopic rod 34 to drive the clamping plate 35 to approach the circuit board, so as to fix the circuit board, and the first electric telescopic rod 30 shortens.

[0046] During use and operation, before processing, the sealing cover 19 is opened, the solder resist is added into the feeding tank 17 through the feeding pipe 18, and then the sealing cover 19 is closed. The circuit board to be processed is placed between the upper and lower coating roller shafts 11. The bottom of the circuit board contacts the weighing sensor 32. The weight of the circuit board is detected by the weighing sensor 32, so as to calculate the size of the circuit board, control the second electric telescopic rod 34 to drive the clamping plate 35 to approach the circuit board, so as to fix the circuit board, and the first electric telescopic rod 30 shortens;

[0047] It works based on the proportional relationship between the oscillation frequency of the capacitor oscillation circuit and the plate spacing. There are two plates, one is fixed and the other is movable. When the measured object is loaded on the weighing platform, the leaf spring deflects, the distance between the two plates changes, and the oscillation frequency of the circuit also changes accordingly. By measuring the change in frequency, the mass of the measured object on the weighing platform can be obtained;

[0048] Connect the first electric push rod 7 to the circuit. The first electric push rod 7 drives the moving blocks 6 to move in the upper moving track 5 and the lower moving track 4 respectively. The two moving blocks 6 move relative to each other, thereby driving the two coating roller shafts 11 to move relative to each other;

[0049] Meanwhile, the rotating motor 9 is connected to the circuit. The rotating motor 9 drives the rotating shaft 10 to rotate, thereby driving the coating roller shaft 11 to rotate, so that the coating roller shaft 11 continuously rolls over the outer surface of the circuit board to be processed. At the same time, the moving block 6 drives its relative movement, so that both ends of the circuit board to be processed are subjected to frictional forces in two opposite directions, keeping the circuit board to be processed in dynamic balance;

[0050] When the rotating motor 9 rotates, it drives the discharge nozzle 14 to rotate. According to the output power of the rotating motor 9, the control system controls the second electric push rod 16 to be connected to the circuit at regular intervals. When the discharge nozzle 14 rotates to contact the end face of the circuit board to be processed, the second electric push rod 16 is connected to the circuit, so that the second electric push rod 16 drives the movable support shaft 21 to move, thereby driving the push-pull plate to move, and squeezing the solder resist in the feeding tank 17 into the storage cavity 12 through the communication pipe 24, and then overflowing from the discharge nozzle 14 through the material guiding channel 13, so as to be extruded onto the outer surface of the circuit board to be processed;

[0051] As the coating roller shaft 11 continues to rotate, the flexible squeegee 15 contacts the outer surface of the circuit board to be processed, and smears the solder resist on the outer surface of the circuit board to be processed evenly. By continuously rotating the coating roller shafts 11 distributed in an upper and lower staggered manner, the two sides of the circuit board can be smeared simultaneously, improving the processing efficiency. By contacting the waveform end face of the guide shaft 28 with the guide cylinder 29, the guide shaft 28 drives the flexible squeegee 15 to reciprocate in the movable long groove 26, so that the flexible squeegee 15 reciprocates on the circuit board surface, strengthening the smearing effect.

[0052] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprising", "including" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device.

[0053] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor limit the invention to the specific embodiments described. Obviously, according to the content of this specification, many modifications and changes can be made. This specification selects and specifically describes these embodiments to better explain the principle and practical application of the present invention, so that those skilled in the art can well understand and utilize the present invention. The present invention is only limited by the claims and their full scope and equivalents.

Claims

1. A solder mask coating device for a circuit board, comprising a device base plate (1) and a support shaft (2) installed on the top surface of the device base plate (1), characterized in that: The top surface of the support shaft (2) is equipped with an equipment top plate (3). The top surface of the equipment bottom plate (1) is equipped with two parallel lower moving tracks (4). The bottom surface of the equipment top plate (3) is equipped with two parallel upper moving tracks (5). A driving mechanism is installed inside both the upper moving track (5) and the lower moving track (4). The outer surface of the driving mechanism is equipped with a coating mechanism. By driving the coating mechanism to move, uniform coating of the circuit board is achieved. The outer surface of the coating mechanism is equipped with a feeding mechanism for adding solder resist to the coating mechanism. The outer two side surfaces of the equipment bottom plate (1) are equipped with a limiting mechanism for fixing the circuit board; The driving mechanism includes a moving component and a driving component. The moving component is respectively installed inside the upper moving track (5) and the lower moving track (4), and the driving component is installed on the outer surface of the moving component; The moving component includes a first electric push rod (7) and a moving block (6). The outer surface of the moving block (6) is respectively movably installed inside the upper moving track (5) and the lower moving track (4). Four first electric push rods (7) are respectively installed between the four moving blocks (6) and the inner walls of the upper moving track (5) and the lower moving track (4). A fixed seat (8) is installed on the outer surface of the moving block (6). A rotating motor (9) is installed on the outer surface of the fixed seat (8). A rotating shaft (10) is installed on the outer surface of the output end of the rotating motor (9). The coating mechanism is installed on the end surface of the rotating shaft (10).

2. The solder mask coating device for a circuit board according to claim 1, characterized in that: The coating mechanism includes a coating roller shaft (11) and a material guiding component. The coating roller shaft (11) is installed on the end surface of the rotating shaft (10), and the material guiding component is installed inside the coating roller shaft (11).

3. The solder mask coating device for a circuit board according to claim 2, characterized in that: The material guiding component includes a material guiding channel (13) and a discharging nozzle (14). A storage cavity (12) is formed inside the coating roller shaft (11). The material guiding channels (13) are distributed inside the coating roller shaft (11) on the outer surface of the storage cavity (12). The end of the material guiding channel (13) extends to the outer surface of the storage cavity (12). The discharging nozzle (14) is installed on the end surface of the material guiding channel (13). Movable long grooves (26) are evenly distributed on the outer surface of the coating roller shaft (11). A flexible scraping plate (15) is movably installed on the inner wall of the movable long groove (26). A compression spring (27) is jointly installed on one end surface of the flexible scraping plate (15) and the inner wall of the movable long groove (26). A guiding shaft (28) is installed at the other end of the flexible scraping plate (15). A guiding cylinder body (29) is installed on the outer surface of the rotating motor (9). The end of the guiding shaft (28) is in movable contact with one end surface of the guiding cylinder body (29).

4. The solder mask coating device for a circuit board according to claim 1, characterized in that: The feeding mechanism includes a feeding component and a connecting component. A second electric push rod (16) is installed on the top surface of the fixed seat (8) away from the rotating motor (9). The feeding component is installed on the outer surface of the output end of the second electric push rod (16), and the connecting component is installed inside the coating roller shaft (11).

5. The solder mask coating device for a circuit board according to claim 4, characterized in that: The feeding assembly includes a feeding tank (17) and a pushing plate (20). The feeding tank (17) is installed on the top surface of the fixed seat (8) adjacent to the second electric push rod (16). The outer surface of the feeding tank (17) is equipped with a feeding pipe (18), and the end surface of the feeding pipe (18) is equipped with a sealing cover (19). The pushing plate (20) is movably installed on the inner wall of the feeding tank (17). One side surface of the pushing plate (20) is equipped with a movable support shaft (21). The outer surface of the feeding tank (17) is provided with a movable groove (22). The outer surface of the movable support shaft (21) is movably installed on the inner wall of the movable groove (22). The end of the movable support shaft (21) is connected to the outer surface of the output end of the second electric push rod (16).

6. The solder mask coating device for a circuit board according to claim 4, characterized in that: The connecting assembly includes a communicating pipe (24) and a limiting collar (25). A through groove (23) is provided on the end surface of the coating roller shaft (11) far from the rotating shaft (10). One end surface of the communicating pipe (24) is movably installed on the inner wall of the through groove (23). The limiting collar (25) is installed at the connection between the through groove (23) and the communicating pipe (24). The other end surface of the communicating pipe (24) is connected to the inside of the feeding tank (17).

7. The solder mask coating device for a circuit board according to claim 1, characterized in that: The limiting mechanism includes a first electric telescopic rod (30) and a second electric telescopic rod (34). The first electric telescopic rod (30) is installed on the top surface of the equipment base plate (1). The top surface of the first electric telescopic rod (30) is equipped with a bearing plate (31). The top surface of the bearing plate (31) is equipped with a weighing sensor (32). Two vertical shafts (33) are installed on the outer two side surfaces of the equipment base plate (1). The second electric telescopic rod (34) is installed on the top surface of the vertical shaft (33). The end surface of the second electric telescopic rod (34) is equipped with a clamping plate (35).

8. A method for coating a solder mask on a circuit board using the solder mask coating device according to claim 7, characterized in that: It includes the following operation methods: S1: Before processing, open the sealing cover (19), add anti-welding paint into the feeding tank (17) through the feeding pipe (18), then close the sealing cover (19), place the circuit board to be processed between the upper and lower coating roller shafts (11). The bottom of the circuit board contacts the weighing sensor (32). Detect the weight of the circuit board through the weighing sensor (32), thereby calculating the size of the circuit board, control the second electric telescopic rod (34) to drive the clamping plate (35) to approach the circuit board, thereby fixing the circuit board, and the first electric telescopic rod (30) shortens; S2: Connect the first electric push rod (7) to the circuit. The first electric push rod (7) drives the moving block (6) to move in the upper moving track (5) and the lower moving track (4) respectively. The two moving blocks (6) move relatively, thereby driving the two coating roller shafts (11) to move relatively; S3: At the same time, connect the rotating motor (9) to the circuit. The rotating motor (9) drives the rotating shaft (10) to rotate, thereby driving the coating roller shaft (11) to rotate, so that the coating roller shaft (11) continuously rolls over the outer surface of the circuit board to be processed. At the same time, drive its relative movement through the moving block (6), so that both ends of the circuit board to be processed are subjected to frictional forces in two opposite directions, so that the circuit board to be processed maintains dynamic balance; S4: When the rotating motor (9) rotates, it drives the discharge nozzle (14) to rotate. According to the output power of the rotating motor (9), control the second electric push rod (16) to be connected to the circuit regularly through the control system. When the discharge nozzle (14) rotates to contact the end face of the circuit board to be processed, the second electric push rod (16) is connected to the circuit, so that the second electric push rod (16) drives the movable support shaft (21) to move, thereby driving the push-pull plate to move, and squeezing the solder mask in the feeding tank (17) into the storage cavity (12) through the connecting pipe (24), and then overflowing from the discharge nozzle (14) through the material guiding channel (13), so as to be extruded onto the outer surface of the circuit board to be processed; S5: As the coating roller shaft (11) continues to rotate, the flexible scraper (15) contacts the outer surface of the circuit board to be processed, and smears the solder mask on the outer surface of the circuit board to be processed evenly. Through the continuous rotation of the coating roller shafts (11) distributed in an up-and-down staggered manner, the two sides of the circuit board are smeared at the same time, improving the processing efficiency. By contacting the waveform end face of the guide shaft (28) with the guide cylinder (29), the guide shaft (28) drives the flexible scraper (15) to reciprocate in the movable long groove (26), so that the flexible scraper (15) reciprocates on the circuit board surface, strengthening the smearing effect.

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