A heat dissipation device and a circulating heat dissipation equipment

Abstract

The application discloses a heat dissipation device and a circulating heat dissipation equipment, which comprises a heat dissipation device, a second reflux device and a first reflux device. The second reflux device and the first reflux device can be replaced, the modular combination of the circulating heat dissipation equipment is realized, and the second reflux device and the first reflux device suitable for personal demands can be selected and installed.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat dissipation devices, in particular to a heat dissipation device and a circulating heat dissipation equipment. BACKGROUND

[0002] It is well known that high temperature is the enemy of equipment operation, high temperature not only causes the equipment operation to be unstable, the service life to be shortened, and even some components in the equipment can be burned. Especially, integrated circuit components in some electronic equipment generate high temperature during operation, and the purpose of the existing heat dissipation device is to absorb the heat generated by these heat generating components, and then dissipate the heat to the outside to ensure the temperature of the heat generating components to be normal.

[0003] However, these heat dissipation devices need to arrange a large number of connecting pipes inside and outside, and the installation and removal process is very cumbersome, and because of the existence of a large number of connecting pipes, the heat dissipation device structure is not compact, the integration is low, and the space occupation is large. SUMMARY

[0004] Therefore, in view of the above problems, the present application provides a heat dissipation device and a circulating heat dissipation equipment.

[0005] To achieve the above object, the technical scheme of the present application provides a heat dissipation device, which comprises a path plate for medium flow, a first sealing plate arranged on one end surface of the path plate, a second sealing plate arranged on the other end surface of the path plate, a first outflow groove arranged between the path plate and the first sealing plate and used for flowing out the medium after heat dissipation, an outflow pipe arranged on the path plate and in communication with one end of the first outflow groove and used for taking away the heat of the external heat source when the medium after heat dissipation passes through the external heat source, an inflow groove arranged between the path plate and the first sealing plate and in communication with the other end of the outflow pipe and used for flowing in the medium for taking away the heat of the external heat source, a first inflow hole arranged on the first sealing plate and in communication with one end of the inflow groove and the input end of an external first reflux device, a first outflow hole arranged on the first sealing plate and in communication with the output end of the external first reflux device, a confluence groove arranged between the path plate and the first sealing plate and in communication with the other end of the first outflow hole, a second inflow hole arranged on the first sealing plate and in communication with one end of the confluence groove and the input end of an external second reflux device, a second outflow hole arranged on the first sealing plate and in communication with the output end of the external second reflux device, a second outflow groove arranged between the path plate and the first sealing plate and in communication with the other end of the second outflow hole, a third outflow groove arranged between the second sealing plate and the path plate and in communication with the second outflow groove, a lane changing groove arranged between the second sealing plate and the path plate, and a reflux groove arranged between the second sealing plate and the path plate and in communication with the first outflow groove, at least one first heat dissipation pipe arranged on the second sealing plate and in communication with the third outflow groove and the lane changing groove and used for dissipating the heat of the medium to the outside during the passing of the medium for taking away the heat of the external heat source, and at least one second heat dissipation pipe arranged on the second sealing plate and in communication with the lane changing groove and the reflux groove and used for dissipating the heat of the medium to the outside again during the passing of the medium.

[0006] Further improvement is that at least one first heat dissipation fin is arranged between the at least one first heat dissipation pipe and used for accelerating the heat dissipation efficiency of the at least one first heat dissipation pipe, and / or at least one second heat dissipation fin is arranged between the at least one second heat dissipation pipe and used for accelerating the heat dissipation efficiency of the at least one second heat dissipation pipe.

[0007] Further improvement is that a heat dissipation device is arranged on the second sealing plate and outside the at least one first heat dissipation pipe and the at least one second heat dissipation pipe and used for simultaneously flowing air between the area where the at least one first heat dissipation pipe and the at least one second heat dissipation pipe are located and the external area.

[0008] Further improvement is that the heat dissipation device comprises a shell arranged on the second sealing plate and outside the at least one first heat dissipation pipe and the at least one second heat dissipation pipe, and air flow areas formed on at least two end surfaces of the shell.

[0009] Further improvement is that the air flow area includes a first opening area and a second opening area respectively arranged on the two end surfaces of the shell.

[0010] Further improvement is that a fan is arranged on the shell at the first opening area or the second opening area to accelerate the air flow between the area where the at least one first heat dissipation pipe and the at least one second heat dissipation pipe are located and the external area.

[0011] Further improvement is that when the external heat source is a chip with a water cooling component, the outflow pipe includes a first outflow pipe with one end communicated with the first outflow groove and the other end communicated with the input end of the water cooling component of the heat source, and a second outflow pipe with one end communicated with the inflow groove and the other end communicated with the output end of the water cooling component of the heat source.

[0012] The application further provides a circulating heat dissipation device including the heat dissipation device, a second return device arranged on the first sealing plate and communicated with the second inflow hole and the second outflow hole, and / or a first return device arranged on the first sealing plate and communicated with the first inflow hole and the first outflow hole.

[0013] Further improvement is that the first return device is a first water pump or a first water tank which is detachably arranged on the first sealing plate.

[0014] Further improvement is that the second return device is a second water pump or a second water tank which is detachably arranged on the first sealing plate.

[0015] The application has the following beneficial effects:

[0016] 1. The heat dissipation device does not need to arrange a large number of connecting pipes inside and outside, so that the installation and disassembly process is convenient, the efficiency is improved, the heat dissipation device is compact in structure, high in integration, and small in space occupation.

[0017] 2. The second return device and the first return device can be replaced to realize modular combination of the circulating heat dissipation device, and the appropriate second return device and the first return device can be selected and installed according to individual needs.

[0018] 3. When the second return device is a second water pump, the shell of the second water pump is attached to the first sealing plate to form a seal, and the input end and the output end of the second water pump are respectively communicated with the second inflow hole and the second outflow hole when the seal is formed, so that the second water pump does not need to be connected with the second inflow hole and the second outflow hole through a pipeline, and the structure is more compact.

[0019] 4. When the first return device is the first water pump, when the first water pump is installed on the first sealing plate, the housing of the first water pump fits with the first sealing plate to form a seal. When the seal is formed, the input end and output end of the first water pump are connected to the first inlet hole and the first outlet hole respectively, so that the first water pump does not need to be connected to the first inlet hole and the first outlet hole through pipes, making the structure more compact. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the first structure of Embodiment 1 of the present invention;

[0021] Figure 2 This is a schematic diagram of the second structure of Embodiment 1 of the present invention;

[0022] Figure 3 This is a schematic diagram of the structure of Embodiment 2 of the present invention;

[0023] Figure 4 This is a schematic diagram of the structure of Embodiment 3 of the present invention;

[0024] Figure 5 This is a schematic diagram of the structure of Embodiment 4 of the present invention;

[0025] Figure 6 This is a schematic diagram of the structure of Embodiment 5 of the present invention;

[0026] Reference numerals: 1. Path plate; 2. First sealing plate; 3. Second sealing plate; 101. First outflow groove; 102. Inflow groove; 103. First inflow hole; 104. First outflow hole; 105. Convergence groove; 106. Second inflow hole; 107. Second outflow hole; 108. Second outflow groove; 109. Third outflow groove; 110. Changing channel groove; 111. Return groove; 41. First heat dissipation pipe; 42. Second heat dissipation pipe; 43. First heat dissipation fin; 44. Second heat dissipation fin; 11. First sealing groove; 12. First sealing ring; 3 1. Second sealing groove; 32. Third sealing groove; 33. Fourth sealing groove; 34. Second sealing ring; 35. Third sealing ring; 36. Fourth sealing ring; 51. Housing; 52. First opening area; 53. Second opening area; 61. First outflow pipe; 62. Second outflow pipe; 71. First water pump; 711. First slot; 712. First sealing strip; 713. First screw; 72. Second water pump; 721. Second slot; 722. Second sealing strip; 723. Second screw; 73. Second water tank; 74. First water tank. Detailed Implementation

[0027] The specific embodiments of the present invention will be further described below with reference to the accompanying drawings and examples. The following examples are only used to more clearly illustrate the technical solutions of the present invention and should not be construed as limiting the scope of protection of the present invention.

[0028] Embodiment one

[0029] Referring to Figures 1-2 As shown in the drawings, a heat dissipation device comprises a path plate 1 for medium flow, a first sealing plate 2 arranged on one end surface of the path plate 1, a second sealing plate 3 arranged on the other end surface of the path plate 1, a first outflow groove 101 arranged between the path plate 1 and the first sealing plate 2 for the outflow of medium after heat dissipation, an outflow pipe arranged on the path plate 1 and in communication with one end of the first outflow groove 101 for taking away the heat of an external heat source when the medium after heat dissipation passes through the external heat source, an inflow groove 102 arranged between the path plate 1 and the first sealing plate 2 for the inflow of medium for taking away the heat of the external heat source in communication with the other end of the outflow pipe, a first inflow hole 103 arranged on the first sealing plate 2 and in communication with one end of the inflow groove 102 and the input end of an external first reflux device, a first outflow hole 104 arranged on the first sealing plate 2 and in communication with the output end of the external first reflux device, a confluence groove 105 arranged between the path plate 1 and the first sealing plate 2 and in communication with the other end of the first outflow hole 104, a second inflow hole 106 arranged on the first sealing plate 2 and in communication with one end of the confluence groove 105 and the input end of an external second reflux device, a second outflow hole 107 arranged on the first sealing plate 2 and in communication with the output end of the external second reflux device, a second outflow groove 108 arranged between the path plate 1 and the first sealing plate 2 and in communication with the other end of the second outflow hole 107, a third outflow groove 109 arranged between the second sealing plate 3 and the path plate 1 and in communication with the second outflow groove 108, a lane-changing groove 110 arranged between the second sealing plate 3 and the path plate 1, and a reflux groove 111 arranged between the second sealing plate 3 and the path plate 1 and in communication with the first outflow groove 101, at least one first heat dissipation pipe 41 arranged on the second sealing plate 3 for communication between the third outflow groove 109 and the lane-changing groove 110 and for dissipating the heat of the medium to the outside during the passing of the medium for taking away the heat of the external heat source, and at least one second heat dissipation pipe 42 arranged on the second sealing plate 3 for communication between the lane-changing groove 110 and the reflux groove 111 and for dissipating the heat in the medium to the outside again during the passing of the medium.

[0030] A first sealing assembly is arranged between the first sealing plate 2 and the path plate 1 and outside the first outflow groove 101, the inflow groove 102, the confluence groove 105 and the second outflow groove 108, and the first sealing assembly comprises a first sealing groove 11 arranged on the path plate 1 and a first sealing ring (not shown in the drawings) arranged on the path plate and located in the first sealing groove 11.

[0031] The second sealing assembly between the second sealing plate 3 and the path plate 1 and outside the third outflow groove 109, the lane changing groove 110 and the backflow groove 111 comprises a second sealing groove 31, a third sealing groove 32 and a fourth sealing groove 33 respectively arranged on the second sealing plate 3 and corresponding to the positions of the third outflow groove 109, the lane changing groove 110 and the backflow groove 111; and the second sealing plate 3 is provided with a second sealing ring 34, a third sealing ring 35 and a fourth sealing ring 36 respectively arranged in the second sealing groove 31, the third sealing groove 32 and the fourth sealing groove 33.

[0032] The first sealing plate 2 and the second sealing plate 3 are detachably arranged on the path plate 1; and in the embodiment, the medium can be water or cooling liquid or gas.

[0033] At least one first heat dissipation fin 43 is arranged between the at least one first heat dissipation pipe 41 to accelerate the heat dissipation efficiency of the at least one first heat dissipation pipe 41; and at least one second heat dissipation fin 44 is arranged between the at least one second heat dissipation pipe 42 to accelerate the heat dissipation efficiency of the at least one second heat dissipation pipe 42. The first heat dissipation fin 43 and the second heat dissipation fin 44 are integrally formed.

[0034] A heat dissipation device is arranged outside the at least one first heat dissipation pipe 41 and the at least one second heat dissipation pipe 42 on the second sealing plate 3 to simultaneously provide air circulation between the areas where the at least one first heat dissipation pipe 41 and the at least one second heat dissipation pipe 42 are located and the external areas; the heat dissipation device comprises a housing 51 arranged on the second sealing plate 3 and outside the at least one first heat dissipation pipe 41 and the at least one second heat dissipation pipe 42, and air circulation zones formed on at least two end faces of the housing 51; the air circulation zones comprise a first opening zone 52 and a second opening zone 53 respectively arranged on the two end faces of the housing 51.

[0035] A fan (not shown in the figure) is arranged on the housing 51 and located on the first opening zone 52 or the second opening zone 53 to simultaneously accelerate air circulation between the areas where the at least one first heat dissipation pipe 41 and the at least one second heat dissipation pipe 42 are located and the external areas;

[0036] When the external heat source is a heat source with a water cooling assembly, the heat source with the water cooling assembly is a chip with a water cooling assembly; and the outflow pipe comprises a first outflow pipe 61 having one end communicated with the first outflow groove 101 and the other end communicated with the input end of the water cooling assembly of the heat source, and a second outflow pipe 62 having one end communicated with the inflow groove and the other end communicated with the output end of the water cooling assembly of the heat source.

[0037] Embodiment two

[0038] As Figures 1-3As shown, a circulating heat dissipation device comprises a heat dissipation device, and the heat dissipation device is embodiment one,

[0039] The first sealing plate 2 is provided with a second backflow device, the input end of which is communicated with the second inflow hole 106, and the output end of which is communicated with the second outflow hole 107,

[0040] The first sealing plate 2 is provided with a first backflow device, the input end of which is communicated with the first inflow hole 103, and the output end of which is communicated with the first outflow hole 104.

[0041] The first backflow device is a first water pump 71 which is detachably arranged on the first sealing plate 2, when the first water pump 71 is arranged on the first sealing plate 2, the shell of the first water pump 71 is attached to the first sealing plate 2 to form a seal, and when the seal is formed, the input end and the output end of the first water pump 71 are respectively communicated with the first inflow hole 103 and the first outflow hole 104;

[0042] The first sealing member is arranged between the shell of the first water pump 71 and the first sealing plate 2, and the first sealing member comprises a first slot 711 arranged on the shell of the first water pump 71 and a first sealing strip 712 arranged on the shell of the first water pump 71 and located in the first slot 711.

[0043] A plurality of first screws 713 are arranged between the shell of the first water pump 71 and the path plate 1 to enhance the sealing performance when the shell of the first water pump 71 is attached to the first sealing plate 2, and the first screws 713 pass through or avoid the first sealing plate 2.

[0044] The second backflow device is a second water pump 72 which is detachably arranged on the first sealing plate 2, when the second water pump 72 is arranged on the first sealing plate 2, the shell of the second water pump 72 is attached to the first sealing plate 2 to form a seal, and when the seal is formed, the input end and the output end of the second water pump 72 are respectively communicated with the second inflow hole 106 and the second outflow hole 107;

[0045] The second sealing member is arranged between the shell of the second water pump 72 and the first sealing plate 2, and the second sealing member comprises a second slot 721 arranged on the shell of the second water pump 72 and a second sealing strip 722 arranged on the shell of the second water pump 72 and located in the second slot 721.

[0046] A plurality of second screws 723 are arranged between the shell of the second water pump 72 and the path plate 1 to enhance the sealing performance when the shell of the second water pump 72 is attached to the first sealing plate 2, and the second screws 723 pass through or avoid the first sealing plate 2.

[0047] When the device is running, the first water pump 71 and the second water pump 72 are powered on, the medium after heat dissipation enters the first outflow pipe 61 through the first outflow groove 101, then the medium after heat dissipation enters the water cooling assembly of the heat source from the input end and takes away the heat of the heat source when passing through the heat source, the medium taking away the heat of the heat source flows into the inflow groove 102 from the output end of the water cooling assembly of the heat source through the second outflow pipe 62, is sucked into the first water pump 71 through the first inflow hole 103 by the first water pump 71, and is discharged into the intersection groove 105 from the first outflow hole 104, the medium taking away the heat of the heat source is sucked into the second water pump 72 through the second inflow hole 106 in the intersection groove 105 by the second water pump 72, and is discharged into the second outflow groove 108 from the second outflow hole 107, the medium taking away the heat of the heat source in the second outflow groove 108 enters the first heat dissipation pipe 41 through the third outflow groove 109 to dissipate heat, the medium after heat dissipation flows into the lane change groove 110 and enters the second heat dissipation pipe 42 to dissipate heat again, and finally the medium after heat dissipation flows into the first outflow groove 101 through the backflow groove 111 to complete a cycle.

[0048] The first water pump 71 and the second water pump 72 are installed to enhance the efficiency of medium circulation in the device and further improve the heat dissipation effect.

[0049] Implementation three

[0050] Based on the above embodiment two, as shown in Figure 1 , 2 , 4, the second backflow device can also be a second water tank 73 detachably arranged on the first sealing plate 2;

[0051] When the device is running, the first water pump 71 is powered on, the medium after heat dissipation enters the first outflow pipe 61 through the first outflow groove 101, then the medium after heat dissipation enters the water cooling assembly of the heat source from the input end and takes away the heat of the heat source when passing through the heat source, the medium taking away the heat of the heat source flows into the inflow groove 102 from the output end of the water cooling assembly of the heat source through the second outflow pipe 62, is sucked into the first water pump 71 through the first inflow hole 103 by the first water pump 71, and is discharged into the intersection groove 105 from the first outflow hole 104, the medium taking away the heat of the heat source is sucked into the second water pump 72 through the second inflow hole 106 in the intersection groove 105 because of the power of the first water pump 71, the medium mixed with the medium taking away the heat of the heat source in the second water tank 73 is sucked out and discharged into the second outflow groove 108 from the second outflow hole 107, then enters the first heat dissipation pipe 41 through the third outflow groove 109 to dissipate heat, the medium after heat dissipation flows into the lane change groove 110 and enters the second heat dissipation pipe 42 to dissipate heat again, and finally the medium after heat dissipation flows into the first outflow groove 101 through the backflow groove 111 to complete a cycle.

[0052] The second water tank 73 increases the storage amount of the medium in the device to ensure the heat dissipation effect of the device.

[0053] Embodiment Four

[0054] Based on the above embodiment two, as shown in Figure 1 , 2 , 5, the first backflow device can also be a first water tank 74 detachably arranged on the first cover plate 2;

[0055] When the device is running, the second water pump 72 is powered on to provide power. The medium after heat dissipation enters the first outflow pipe 61 through the first outflow groove 101, and then the medium after heat dissipation enters the water cooling assembly of the heat source from the input end and takes away the heat of the heat source when passing through the heat source. The medium taking away the heat of the heat source flows into the inflow groove 102 from the output end of the water cooling assembly of the heat source through the second outflow pipe 62. Under the power of the second water pump 72, the medium taking away the heat of the heat source enters the first water tank 74 through the first inflow hole 103. The medium mixed with the medium taking away the heat of the heat source in the first water tank 74 is extracted and discharged into the junction groove 105 from the first outflow hole 104. The medium is extracted into the second water pump 72 through the second inflow hole 106 by the second water pump 72 in the junction groove 105, and is discharged into the second outflow groove 108 from the second outflow hole 107. Then, the medium is discharged into the first heat dissipation pipe 41 through the third outflow groove 109 to dissipate heat. The medium after heat dissipation flows into the lane change groove 110 and enters the second heat dissipation pipe 42 to dissipate heat again. Finally, the medium after heat dissipation flows into the first outflow groove 101 through the backflow groove 111 to complete a cycle.

[0056] The first water tank 74 increases the storage amount of the medium in the device, thereby ensuring the heat dissipation effect of the device.

[0057] Embodiment Five

[0058] Based on the above embodiment two, as shown in Figure 1 , 2 , 6, the first backflow device can also be a first water tank 74 detachably arranged on the first cover plate 2, and the second backflow device can also be a second water tank 73 detachably arranged on the first cover plate 2;

[0059] When the device is running, the medium after heat dissipation enters the first outflow groove 101 through the first outflow slot 101 by the power of the external water pump, and then the medium after heat dissipation enters the water cooling assembly of the heat source from the input end and takes away the heat of the heat source when passing through the heat source. The medium taking away the heat of the heat source flows into the inflow groove 102 from the output end of the water cooling assembly of the heat source through the second outflow pipe 62. By the power of the external water pump, the medium taking away the heat of the heat source enters the first water tank 74 through the first inflow hole 103. The medium mixed with the medium taking away the heat of the heat source in the first water tank 74 is pumped out and discharged into the junction groove 105 from the first outflow hole 104. The medium is pumped into the second water tank 73 through the second inflow hole 106 by the external water pump in the junction groove 105, and is discharged into the second outflow groove 108 from the second outflow hole 107. Then the medium enters the first heat dissipation pipe 41 through the third outflow groove 109 to dissipate heat. The medium after heat dissipation flows into the lane change groove 110 and enters the second heat dissipation pipe 42 to dissipate heat again. Finally, the medium after heat dissipation flows into the first outflow groove 101 through the backflow groove 111, completing a cycle.

[0060] The first water tank 74 and the second water tank 73 increase the storage capacity of the medium in the device, ensuring the heat dissipation effect of the device.

[0061] The above shows and describes the basic principles and main features of the present application and its advantages. Those skilled in the art should understand that the present application is not limited to the above examples. The above examples and descriptions are only to illustrate the principles of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application. These changes and improvements fall within the scope of the present application. The scope of protection of the present application is defined by the appended claims and their equivalents.

Claims

1. A heat dissipating device characterized by: The application relates to a heat dissipation device, which comprises a path plate for medium flow, a first sealing plate arranged on one end surface of the path plate, a second sealing plate arranged on the other end surface of the path plate, a first outflow groove arranged between the path plate and the first sealing plate and used for flowing out of medium after heat dissipation, an outflow pipe arranged on the path plate and in communication with one end of the first outflow groove and used for taking away heat of an external heat source when the medium after heat dissipation passes through the external heat source, an inflow groove arranged between the path plate and the first sealing plate and used for flowing in of medium for taking away heat of the external heat source, a first inflow hole arranged on the first sealing plate and in communication with one end of the inflow groove and the input end of an external first reflux device, a first outflow hole arranged on the first sealing plate and in communication with the output end of the external first reflux device, a confluence groove arranged between the path plate and the first sealing plate and in communication with the other end of the first outflow hole, a second inflow hole arranged on the first sealing plate and in communication with one end of the confluence groove and the input end of an external second reflux device, a second outflow hole arranged on the first sealing plate and in communication with the output end of the external second reflux device, a second outflow groove arranged between the path plate and the first sealing plate and in communication with the other end of the second outflow hole, a third outflow groove arranged between the second sealing plate and the path plate and in communication with the second outflow groove, a lane-changing groove arranged between the second sealing plate and the path plate, and a reflux groove arranged between the second sealing plate and the path plate and in communication with the first outflow groove. At least one first heat dissipation fin is arranged between the at least one first heat dissipation pipe and used for accelerating the heat dissipation efficiency of the at least one first heat dissipation pipe, and / or at least one second heat dissipation fin is arranged between the at least one second heat dissipation pipe and used for accelerating the heat dissipation efficiency of the at least one second heat dissipation pipe. A heat dissipation device is arranged on the second sealing plate and outside the at least one first heat dissipation pipe and the at least one second heat dissipation pipe and used for simultaneously flowing air between the area where the at least one first heat dissipation pipe and the at least one second heat dissipation pipe are located and the external area. The heat dissipation device comprises a shell arranged on the second sealing plate and outside the at least one first heat dissipation pipe and the at least one second heat dissipation pipe, and air flow areas formed on at least two end surfaces of the shell.

2. A heat dissipating device according to claim 1, wherein: The air flow areas comprise two first opening areas and second opening areas respectively arranged on the two end surfaces of the shell.

3. A heat dissipating device according to claim 2, wherein: A fan is arranged on the shell and located on the first opening area or the second opening area and used for simultaneously accelerating air flow between the area where the at least one first heat dissipation pipe and the at least one second heat dissipation pipe are located and the external area.

4. The heat dissipating device of claim 1, wherein: When the external heat source is a heat source with a water cooling component, the outflow pipe comprises a first outflow pipe with one end in communication with the first inflow groove and the other end in communication with the input end of the water cooling component of the heat source, and a second outflow pipe with one end in communication with the inflow groove and the other end in communication with the output end of the water cooling component of the heat source.

5. A circulating heat dissipation apparatus characterized by comprising: The heat dissipation device comprises the heat dissipation device according to any one of claims 1-4, wherein the first sealing plate is provided with a second backflow device with an input end in communication with the second inflow hole and an output end in communication with the second outflow hole, and / or the first sealing plate is provided with a first backflow device with an input end in communication with the first inflow hole and an output end in communication with the first outflow hole.

6. A recirculating heat dissipation apparatus as claimed in claim 5, wherein: The first backflow device is a first water pump or a first water tank which is detachably arranged on the first sealing plate.

7. A recirculating heat dissipation apparatus as claimed in claim 5, wherein: The second backflow device is a second water pump or a second water tank which is detachably arranged on the first sealing plate.

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