Preparation process of high-orientation heat-conducting interface material and orientation mold used

Abstract

The application relates to a preparation process of a high-orientation heat-conducting interface material, which comprises the following steps: providing a mixed base material, pressing the mixed base material into an orientation mold, stacking heat-conducting glue layers layer by layer, and cutting and processing a heat-conducting blank. The orientation mold comprises multistage shunt channels and orientation discharge nozzles communicated with the shunt channels, a plurality of orientation grooves are arranged in the orientation discharge nozzles in a close arrangement, the mixed base material flows along the multistage shunt channels and is extruded to orient the carbon fibers, the mixed base material flows from the shunt channels into the orientation discharge nozzles, and is extruded from the plurality of orientation grooves to form the heat-conducting glue layers. By adopting the technical scheme, the mixed base material is formed into an integral heat-conducting glue layer in the orientation mold, the orientation mold is moved to make the heat-conducting glue layer form along the moving direction of the mold and be stacked. Compared with stacking heat-conducting glue strips, directly stacking the heat-conducting glue layers can control the gap width between the heat-conducting glue layers, so that the gap can be filled more easily, and the stacking efficiency can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat-conducting interface materials, in particular to a preparation process of a high-resilience oriented heat-conducting interface and an orientation mold used therein. BACKGROUND

[0002] With the development of semiconductor technology, the power of semiconductor chip devices is enhanced, and the heat dissipation performance of the heat-conducting material arranged on the semiconductor chip is also continuously improved. However, the heat-conducting performance of the existing heat-conducting material cannot meet the heat dissipation requirements of the chip.

[0003] The heat dissipation performance of the heat-conducting material is mainly provided by the heat-conducting fiber. The heat-conducting fiber usually only has good heat-conducting performance in a specific direction. Therefore, improving the orientation of the heat-conducting fiber in the specific direction can further improve the heat dissipation performance of the heat-conducting material.

[0004] In the prior art, the orientation of the heat-conducting fiber is mainly improved by reducing the inner diameter of the discharge nozzle of the orientation mold. By reducing the inner diameter of the discharge nozzle, the centripetal effect of the heat-conducting material in the flow is improved, and the orientation of the heat-conducting fiber is improved. However, reducing the inner diameter of the discharge nozzle also reduces the flow of the heat-conducting material extruded at a time. The orientation mold needs to be repeatedly moved multiple times to extrude and stack the heat-conducting material to form a three-dimensional heat-conducting body. Therefore, this method greatly reduces the production efficiency. Meanwhile, during the stacking of the heat-conducting material extruded at a time, the spacing distance between the heat-conducting adhesive strips formed each time fluctuates, resulting in gaps between the heat-conducting adhesive strips, and finally causing cavities in the heat-conducting material product, which seriously affects the heat-conducting performance. SUMMARY

[0005] Therefore, it is necessary to provide a preparation process of a heat-conducting interface material with high orientation to solve the problem that the existing preparation process of the heat-conducting interface material cannot simultaneously meet the requirements of high orientation of the heat-conducting fiber and high production efficiency of the heat-conducting product.

[0006] A preparation process of a heat-conducting interface material with high orientation, comprising:

[0007] providing a mixed base material, the mixed base material comprising carbon fibers, a plurality of fillers, and a bonding agent;

[0008] pressing the mixed base material into an orientation mold, the orientation mold comprising an orientation mold body and an orientation discharge nozzle, a plurality of stage flow channels are arranged in the orientation mold body, the plurality of stage flow channels are communicated with the orientation discharge nozzle, a plurality of orientation grooves are arranged in the orientation discharge nozzle in a close arrangement, the mixed base material flows along the plurality of stage flow channels and is extruded to orient the carbon fibers, the mixed base material flows from the stage flow channels into the orientation discharge nozzle, and is extruded from the plurality of orientation grooves to continuously guide out a heat-conducting adhesive layer in the form of a film;

[0009] based on the way of repeatedly moving the orientation mold in the X-axis direction in the XY area, the thermally conductive glue layer is stacked layer by layer in the Z-axis direction, and then heated and cured to form a thermally conductive blank;

[0010] the thermally conductive blank is cut in the YZ plane to form a thermally conductive product.

[0011] By adopting the above technical solution, the mixed base material can be dispersed from one inlet into multiple shunt channels, and then the mixed base material is formed into a whole thermally conductive glue layer through the orientation discharge nozzle. Since the inner diameter of the orientation groove in the orientation discharge nozzle is obviously smaller than the inner diameter of the inlet of the shunt channel, the mixed base material extruded from the orientation groove naturally forms a relatively thin thickness. At the same time, multiple orientation grooves are closely arranged, and the mixed base material is bonded with each other in the width direction, thereby forming a thermally conductive glue layer with a relatively long width. At this time, the orientation mold is moved, and the thermally conductive glue layer is formed and stacked along the moving direction.

[0012] Compared with the traditional process of directly extruding the mixed base material from the shunt channel to form a thermally conductive glue strip for stacking, the mixed base material is bonded into a thermally conductive glue layer in advance before stacking. Since the interval between the orientation grooves is a fixed value when the mold is opened, the inconsistent gap between any two adjacent thermally conductive glue strips in the stacking process can be avoided, and all gaps cannot be filled in the later stacking process, thereby reducing the air holes caused by the air wrapped in the gaps. At the same time, the inner diameter of the orientation groove is much smaller than the inner diameter of the traditional orientation discharge nozzle, so that the mixed base material extruded in the orientation groove has better fluid centripetal property, thereby improving the orientation of the thermally conductive fiber and improving the thermal conductivity coefficient of the finally formed thermally conductive product. Finally, compared with the traditional process of moving the extrusion mold back and forth to fully lay the first layer and then laying the second layer, the thermally conductive glue layer formed by the mold can form a thermally conductive glue layer by moving the orientation mold once, and a second thermally conductive glue layer by moving the orientation mold twice. Only a few times of moving the orientation mold can form a thermally conductive blank, and the production efficiency is also much higher than that of the traditional process.

[0013] In one embodiment, a flow regulating member is arranged on each shunt channel. In the step of pressing the mixed base material into the orientation mold, the flow of the mixed base material in the shunt channel is controlled based on the flow regulating member to keep the flow of the mixed base material in all shunt channels the same and to keep the extrusion forming of the thermally conductive glue layer.

[0014] By adopting the technical scheme, the thickness of the heat-conducting adhesive layer adhered in the orientation nozzle can be ensured to be uniform by adjusting the flow in the shunt passage. In the traditional process, since the mixed base material forms a single heat-conducting adhesive strip in the same mold, as long as the flow is kept constant, the size of the heat-conducting adhesive strip is always consistent. However, in the present application, since the multi-stage shunt passage is arranged to form the heat-conducting adhesive layer, the flow in each shunt passage may be different, which causes the flow of the mixed base material in different orientation grooves to be different, resulting in the thickness of the heat-conducting adhesive layer in some areas increasing, causing product cavities in the later stacking, and at the same time, extruding the surrounding position to damage the consistency of the carbon fibers, affecting the heat-conducting performance of the product. Therefore, the flow in the shunt passage needs to be controlled. Moreover, a large flow is required to directly form the heat-conducting adhesive layer, and when the flow is too large and the viscosity of the mixed base material is low, the forming speed of the heat-conducting adhesive layer needs to be controlled to match the moving speed of the orientation mold to avoid too much mixed base material being extruded and unable to form a single layer of heat-conducting adhesive layer.

[0015] In one of the embodiments, the plurality of orientation grooves are in communication with each other, and in the step of pressing the mixed base material into the orientation mold, the mixed base material is adhered to each other in the orientation grooves to form the heat-conducting adhesive layer.

[0016] By adopting the technical scheme, the plurality of orientation grooves are in communication with each other, so that the mixed base material can be adhered to each other in the orientation grooves to form the heat-conducting adhesive layer, avoiding the mixed base material being adhered to each other after being extruded due to close arrangement, thereby causing breakage due to insufficient adhesion time. At the same time, the orientation grooves in communication mean that there is a communication part between the orientation grooves, which can reduce the gap height between adjacent orientation grooves, thereby reducing the cavities in the final product.

[0017] In one of the embodiments, in the step of stacking the heat-conducting adhesive layer layer by layer, the height of the orientation nozzle is adjusted synchronously based on the stacking height of the heat-conducting adhesive layer, so as to always keep the height of the orientation nozzle the same as the stacking height of the heat-conducting adhesive layer.

[0018] By adopting the technical scheme, since the heat-conducting adhesive layer is continuously stacked, the height position of the orientation nozzle also needs to be adjusted accordingly to avoid the extruded heat-conducting adhesive layer being extruded in the height direction during the stacking process, which affects the orientation of the carbon fibers.

[0019] In one of the embodiments, the upper and lower surfaces of the heat-conducting adhesive layer are each formed with a corresponding orientation notch defined by the orientation groove, the orientation notch is in the X-axis direction, and in the step of stacking the heat-conducting adhesive layer layer by layer, the position of the orientation nozzle is adjusted slightly along the Y-axis direction based on the horizontal position of the heat-conducting adhesive layer, so that the orientation notches between adjacent heat-conducting adhesive layers in the height direction are misaligned and stacked.

[0020] By adopting the technical scheme, the gap of the arc-shaped recess on the surface of the heat-conducting adhesive layer due to the cylindrical orientation groove is filled by the arc-shaped protrusion on the surface of the adjacent heat-conducting adhesive layer, so that the cavity in the finally formed heat-conducting product is further reduced, and the heat-conducting performance of the heat-conducting product is improved.

[0021] In one of the embodiments, in the step of stacking the heat-conducting adhesive layers layer by layer, the heat-conducting adhesive layers are arranged in a stacking mold, and the stacking mold comprises a plurality of stacking frames which are detachably connected along the height direction to form the side wall of the stacking mold.

[0022] By adopting the technical scheme, the traditional stacking mold is a whole mold, and when the solidified heat-conducting blank is detached, a scraper is needed to cut the connection between the heat-conducting blank and the inner wall of the stacking mold, and the heat-conducting blank is pried out from the stacking mold, which causes damage to the heat-conducting blank in the process of prying out the heat-conducting blank. The stacking frames arranged layer by layer along the height direction can be arranged in different numbers to limit the height of the heat-conducting blank according to the product requirement when the heat-conducting blank is formed. When the heat-conducting blank is detached, the stacking frames only need to be detached layer by layer, and the heat-conducting blank does not need to be pried out from the mold by using a scraper, so that damage to the heat-conducting blank in the process of detaching is avoided.

[0023] In one of the embodiments, before the step of stacking the heat-conducting adhesive layers layer by layer, a first separation film is laid on the bottom layer of the stacking mold; and after the step of stacking the heat-conducting adhesive layers layer by layer, a second separation film is laid on the top layer of the stacking mold.

[0024] By adopting the technical scheme, the separation films are arranged on the bottom layer and the top layer of the stacking mold, which can avoid the detachment problem caused by the adhesion of the heat-conducting blank to the top plate and the bottom plate of the stacking mold in the process of detaching the heat-conducting blank, so that the speed of detaching the heat-conducting blank is improved, and the production efficiency is improved.

[0025] An orientation mold comprises an orientation mold body and an orientation nozzle. The orientation mold body is internally provided with a plurality of multi-stage shunt channels. The orientation nozzle is connected to the orientation mold body, and the orientation nozzle is in communication with the plurality of shunt channels. The orientation nozzle is internally provided with a plurality of closely arranged orientation grooves. The mixed base material flows into the orientation nozzle along the plurality of shunt channels, and the orientation grooves extrude to directionally arrange the heat-conducting fibers in the mixed base material, so as to continuously discharge a film-shaped heat-conducting adhesive layer.

[0026] By adopting the technical scheme, the multiple orientation grooves closely arranged in the orientation nozzle can extrude the mixed base material to form the heat-conducting adhesive layer for direct stacking, so as to improve the stacking efficiency. Meanwhile, the concave-convex gap formed by the orientation grooves on the surface of the heat-conducting adhesive layer is small and has a fixed interval, so it is easier to fill in the later stacking process, so as to avoid the generation of cavities in the heat-conducting product.

[0027] A high-orientation heat-conducting interface material comprises 50-140 parts by weight of carbon fibers, 180-200 parts of a filler, 45-50 parts of a binder, 11-150 parts of a compound powder, 2-2.2 parts of a vulcanizing agent, 0.1 part of an inhibitor, 1.5 parts of a catalyst, and 0.5-2 parts of a filling aid, and the ratio of the carbon fibers to the total mass is not more than 27%.

[0028] By adopting the technical scheme, the traditional heat-conducting interface material has a lower proportion of carbon fibers in the total amount. Although more carbon fibers can significantly improve the heat-conducting coefficient of the product, too much carbon fiber filling can cause the mixed base material to dry and become loose, the extrusion resistance becomes large, the carbon fibers cannot be arranged in a direction, the orientation is poor, and the heat-conducting coefficient is reduced. The heat-conducting interface material formula of the process of the present application can use a relatively higher proportion of carbon fibers, which breaks through the maximum weight ratio of carbon fibers that can be used in the traditional process, can provide higher extrusion pressure through the smaller shunt channel to overcome the extrusion resistance, so that the material containing more carbon fibers has higher heat-conducting performance. At the same time, the total amount of extrusion is kept or improved by the multiple shunt channels, and the production efficiency is improved.

[0029] In summary, the high-orientation heat-conducting interface material of the present application has at least one of the following beneficial technical effects:

[0030] 1. The mixed base material is formed into a whole heat-conducting adhesive layer for stacking, which improves the production efficiency.

[0031] 2. The structure of the multi-stage shunt channel cooperates with the orientation nozzle to improve the pipe pressure to overcome the extrusion resistance, so that a formula with a higher proportion of carbon fibers can be used to improve the heat-conducting performance of the product.

[0032] 3. The heat-conducting adhesive layer extruded in the closely arranged orientation grooves can reduce and fix the gap distance on the surface of the heat-conducting adhesive layer, so as to reduce the gap size between the heat-conducting adhesive layers in the stacking process, and also facilitate the filling of the gap size, so as to avoid the generation of cavities in the formed heat-conducting product to reduce the heat-conducting performance.

[0033] 4. Compared with the traditional integral stacking mold, the split stacking mold does not need to use tools to operate on the heat-conducting blank when disassembling the heat-conducting blank, only needs to disassemble the outer stacking mold, so as to avoid the damage to the heat-conducting blank and provide the quality of the heat-conducting product.

[0034] 5. It breaks through the formula of the maximum carbon fiber weight ratio that can be used in traditional processes. It provides higher extrusion pressure through smaller diameter distribution channels and orientation grooves to overcome extrusion resistance, so that materials containing more carbon fibers have higher thermal conductivity. Attached Figure Description

[0035] Figure 1 This is a process flow diagram of the preparation of a highly oriented thermally conductive interface material in one embodiment of this application;

[0036] Figure 2 This is a schematic diagram illustrating a scenario of the preparation process of a highly oriented thermally conductive interface material in one embodiment of this application.

[0037] Figure 3 This is a first-view structural schematic diagram of an orientation mold in one embodiment of this application;

[0038] Figure 4 This is a first-view exploded view of the structure of an orientation mold in one embodiment of this application;

[0039] Figure 5 This is a cross-sectional structural diagram of the orientation mold from a second perspective in one embodiment of this application;

[0040] Figure 6 for Figure 4 Enlarged structural diagram at point B;

[0041] Figure 7 for Figure 2 Enlarged structural diagram at point A;

[0042] Figure 8 for Figure 3 Enlarged structural diagram at point C;

[0043] Figure 9 This is a first-view structural schematic diagram of the orientation nozzle in one embodiment of this application;

[0044] Figure 10 This is a schematic diagram of a scene from a second perspective of stacked thermal conductive films in one embodiment of this application.

[0045] Explanation of reference numerals in the attached figures:

[0046] 1, orientation mold; 10A, orientation mold body; 10B, orientation mold cover plate; 10C, limiting hole; 11, shunt passage; 11A, first-stage shunt passage; 11B, second-stage shunt passage; 11C, third-stage shunt passage; 12, flow regulating member; 13, orientation discharge nozzle; 13A, first orientation discharge nozzle; 13B, second orientation discharge nozzle; 13C, orientation groove; 13D, buckle; 13E, clamping groove; 13F, transition surface; 14, adapter; 15, shunt dam; 3, stacking mold; 31, base; 32, stacking frame; 2, glue bucket; 11, heat-conducting embryo; 11, heat-conducting glue layer; 111, orientation protrusion; 112, orientation indentation. DETAILED DESCRIPTION

[0047] To make the above objectives, features and advantages of the present application more apparent, specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be practiced in a number of different ways beyond the specific embodiments described and it is therefore contemplated to cover all such modifications as fall within the scope of the application. It is to be understood that the following description is exemplary only and is intended to provide a descriptive copy of the preferred embodiments disclosed herein, and is not intended to limit the scope of the present application in any way.

[0048] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0049] In addition, the terms "first", "second", "third" and the like are used only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically limited.

[0050] In the present application, unless specifically defined otherwise, the terms "mount", "connected", "connecting", "fixed", and "fixedly" are used broadly and encompass direct and indirect connections, as well as fixed or detachable connections. Such terms are not limited to the mechanical connections between components, but can also include electrical connections, which are deemed equivalent by those skilled in the art. Unless specifically stated otherwise, the terms "on", "under", "over", and "beneath" as used herein refer to a relative position of one component with respect to another, and do not denote a positional relationship between the components.

[0051] In the present application, unless specifically defined otherwise, the terms "on", "under", "over", and "beneath" as used herein refer to a relative position of one component with respect to another, and do not denote a positional relationship between the components.

[0052] It should be noted that when an element is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element, or intervening elements can also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element, or intervening elements can also be present. The terms "vertical", "horizontal", "upper", "lower", "left", "right", and similar terms as used herein are for the purpose of illustration only and are not intended to be limiting.

[0053] First, since the present application relates to thermally conductive materials, it is necessary to introduce the background and related concepts.

[0054] Thermally conductive materials contain thermally conductive fibers, which contribute to the main thermal conductivity of the thermally conductive material. Thermally conductive fibers can be metal, ceramic or other composite materials. In order to achieve directional thermal conduction in composite materials, carbon fibers are usually used as the main thermally conductive fibers. Carbon fiber is a special fiber composed of carbon elements, with properties such as high temperature resistance, friction resistance, thermal conductivity and corrosion resistance. It has a fiber-like appearance, is soft and can be processed into various fabrics. Due to the graphite microcrystalline structure along the fiber axis, carbon fiber has high strength and modulus along the fiber axis. At the same time, the density of carbon fiber is small, so the specific strength and specific modulus are high.

[0055] The main use of carbon fiber is to be used as a reinforcing material to be combined with resin, metal, ceramic and carbon to make advanced composite materials. The carbon fiber reinforced epoxy resin composite material has the highest specific strength and specific modulus among existing engineering materials. In the current traditional heat-conducting soft gasket product, the thermal conductivity coefficient is at most 15 W / (m·K), which reaches the bottleneck. The heat-conducting soft gasket with a higher thermal conductivity coefficient needs to be realized by using special materials and anisotropy.

[0056] The existing heat-conducting carbon fiber orientation technology mainly includes two kinds. One is the centripetal and skin effect orientation by using the natural flow of fluid. The other is to place the carbon fiber in a strong magnetic field to realize orientation by using the anti-magnetic property of the carbon fiber.

[0057] At present, the conventional orientation method usually uses an extruder or the like to generate an extrusion thrust to extrude the material into a strip through a specific die, to stack in a subsequent station, to form an oriented three-dimensional body, and then to cut longitudinally to form a heat-conducting interface sheet. The stacking process in this production method is troublesome, and multiple stacking will also form a stacking gap in the middle. The gap is easy to cover air, which will bring a large number of cavities to the finished product production, affecting the heat-conducting effect of the product.

[0058] In the existing carbon fiber orientation operation process, an extruder is usually used for operation. The extruder is a relatively easy-to-obtain production equipment, which can effectively utilize the extrusion characteristics of the mixture to produce a strip with a certain orientation degree.

[0059] However, in order to cooperate with the extrusion production method of the extruder, the material needs to be prepared to be relatively dry to form a semi-solid screw shape to generate a forward thrust. Therefore, the initial premixed material that is too dry cannot realize a material with high resilience after solidification and molding, which leads to great limitation of the material in the application end. If a relatively wet material is used, the process of the material orientation operation process will inevitably change, and the relatively wet material will also face the problem of air covering during the subsequent stacking operation.

[0060] Please refer to Figure 1 and Figure 2 , Figure 1 shows a process flow diagram of the high-orientation heat-conducting interface material in an embodiment of the present application, Figure 2 is a scene diagram in the preparation process of the high-orientation heat-conducting interface material in an embodiment of the present application.

[0061] The preparation process of the high-orientation heat-conducting interface material provided in an embodiment of the present application comprises the following steps: S1, providing a mixed base material; S2, pressing the mixed base material into an orientation mold 1 to form a heat-conducting glue layer 110; S3, stacking the heat-conducting glue layers 110 layer by layer to form a heat-conducting blank 100; and S4, cutting and processing the heat-conducting blank 100 to form a heat-conducting product. Through the process method, the whole heat-conducting glue layer 110 can be directly formed in the orientation mold 1, and compared with stacking a plurality of independent heat-conducting glue strips, the heat-conducting glue layer 110 can reduce the gaps generated in the stacking process between the heat-conducting glue strips, thereby reducing the cavities existing in the formed heat-conducting product and improving the heat-conducting coefficient of the heat-conducting product.

[0062] The process parameters, formula proportions and related equipment involved will be introduced below according to the flow steps in the production process.

[0063] S1, providing a mixed base material. The mixed base material comprises carbon fibers, various fillers and adhesives, etc. Specifically, the carbon fibers are the main heat-conducting material in the formula. Due to the unique crystal structure of the carbon fibers, the crystals thereof have excellent heat-conducting performance in the axial direction. Further, by utilizing the heat-conducting performance of the carbon fibers in the axial direction, all the carbon fibers are arranged in the same direction, and the final heat-conducting product can have excellent heat-conducting performance in a specific direction.

[0064] Increasing the filling amount of the carbon fibers in the heat-conducting product to provide more heat-conducting channels can also improve the heat-conducting coefficient of the final heat-conducting product. However, in the traditional process, the greater the proportion of the carbon fibers in the mixed base material, the drier and looser the mixed base material, and the greater the resistance of the mixed base material to extrusion into a heat-conducting glue strip in the orientation mold 1. When the filling amount of the carbon fibers reaches a certain proportion, the orientation mold 1 cannot extrude the mixed base material into a heat-conducting glue strip, or the extruded heat-conducting glue strip is affected by excessive external force, which affects the orientation of the arrangement of the carbon fibers and reduces the heat-conducting coefficient of the heat-conducting product. At the same time, directly filling too much carbon fiber in the mixed base material can also reduce the mechanical properties of the final formed heat-conducting product.

[0065] In the embodiments of the present application, however, due to the use of a unique manufacturing process and mold (to be described later), the formula of the mixed base material can also be adjusted accordingly, thereby breaking through the problem of the decline of the heat-conducting coefficient and the mechanical properties of the product caused by too much addition of carbon fibers in the formula of the traditional process.

[0066] Specifically, in the embodiments of the present application, the formula of the mixed base material comprises carbon fibers, aluminum oxide, glue, compounded powder, vulcanizing agent, reaction inhibitor, curing catalyst and powder filler.

[0067] The carbon fiber is prepared by using pitch as a base, the length of the carbon fiber ranges from 11 to 250 um, the diameter of the carbon fiber is normally distributed, and the expected mean value is 5 um. The alumina is spherical alumina prepared by a gas phase method, the average particle size is 1 um, and is used for filling the product and assisting heat conduction. The compound powder is a metal powder material with different particle sizes, which is used for further filling the gap between the spherical alumina molecules and the long strip-shaped carbon fiber molecules, and mainly functions as filling the product and assisting heat conduction. The colloid is a vinyl silicone rubber with different viscosities, which is used for bonding the carbon fiber, alumina, compound powder and other materials to form a fluid with a certain viscosity. The remaining vulcanizing agent, reaction inhibitor, curing catalyst and powder filler are all commonly used formulas in the field of heat-conducting materials, and a person skilled in the art can select specific products and models according to the common knowledge in the art and the actual needs.

[0068] Based on the above introduction of each component in the formula of the high-orientation heat-conducting interface material, the present application provides a plurality of examples with different component ratios, as shown in Table 1 below:

[0069] Table 1: Formula components of examples and comparative examples

[0070] Example Colloidal Carbon fibres Alumina Compound powders Vulcanising agents Inhibitors Catalysts Fillers Example 1 50 50 200 150 2 0.1 1.5 0.5 Example 2 50 75 200 150 2 0.1 1.5 0.5 Example 3 50 11 200 150 2 0.1 1.5 0.5 Example 4 50 120 180 150 2 0.1 1.5 0.5 Comparative Example 1 50 50 200 150 2 0.1 1.5 0.5 Comparative Example 2 50 75 200 150 2 0.1 1.5 0.5 Comparative Example 3 50 11 200 150 2 0.1 1.5 0.5 Comparative Example 4 50 120 180 150 2 0.1 1.5 0.5

[0071] Among them, examples 1-4 are heat-conducting products prepared by using the process of the present application, and comparative examples 1-3 are heat-conducting products prepared by using a traditional process. The heat-conducting performance test results and the mechanical performance test results are shown in Tables 2 and 3, respectively:

[0072] Table 2: Heat-conducting performance test results of examples and comparative examples

[0073]

[0074] Table 3: Mechanical performance test results of examples and comparative examples

[0075]

[0076] From the above Table 2, from the mutual comparison of examples 1 to 4, as the proportion of carbon fiber increases, the thermal conductivity increases and the thermal resistance decreases, which proves that the filling amount of carbon fiber and the heat-conducting performance of the product are positively correlated within a certain range. From the above Table 3, as the proportion of carbon fiber increases, the rebound rate, elongation, hardness and density of the mechanical properties decrease, which conforms to the general physical law.

[0077] As can be seen from Table 2 and Table 3, compared with Comparative Examples 1 to 3 prepared by the traditional preparation process, the thermal conductivity and thermal resistance of the products prepared by the preparation process of the present application are better than those of the products prepared by the traditional preparation process, and the mechanical properties such as instantaneous compression stress, resilience, elongation and hardness of the products prepared by the preparation process of the present application are also better than those of the products prepared by the traditional preparation process. Therefore, it can be proved that, in addition to the influence of the formula, the preparation process of the present application can effectively improve the thermal conductivity and mechanical properties of the thermal conductivity products.

[0078] It should be noted that, in the comparison between Example 4 and Comparative Example 4, Example 4 with the same component formula can be formed and has better thermal conductivity and corresponding mechanical properties, while Comparative Example 4 prepared by the traditional process cannot be formed due to excessive filling of carbon fibers. Therefore, it can be proved that the process adopted in the present application can break through the upper limit of the filling rate of carbon fibers in the traditional process, so that the prepared product has higher thermal conductivity.

[0079] Further, in order to explore the upper limit of the carbon fiber filling rate of the thermal conductivity products that can be achieved by the process adopted in the present application, a series of examples are set to prove it, please refer to Table 4 and Table 5 below, Table 4 is used to show the formula components of the examples with different carbon fiber filling rates set by the present application, and Table 5 is used to show the test results of the examples with different carbon fiber filling rates set by the present application.

[0080] Table 4: Formula components of examples with different carbon fiber filling rates

[0081] Example Colloidal Carbon fibres Alumina Compound powders Vulcanising agents Inhibitors Catalysts Fillers Example 5 50 120 200 150 2 0.1 1.5 0.5 Example 6 50 140 200 150 2 0.1 1.5 0.5 Example 7 50 150 200 150 2 0.1 1.5 0.5

[0082] Table 5: Test results of examples with different carbon fiber filling rates

[0083]

[0084] As can be seen from Table 4 and Table 5, through the comparison between Example 5 and Example 6, when the mass fraction of carbon fibers reaches 120, the thermal conductivity is slightly reduced by further increasing the filling rate of carbon fibers, and the resilience, elongation, hardness and other coefficients are also correspondingly reduced. By calculating the filling mass ratio of carbon fibers in Example 5 and Example 6, it can be considered that when the mass filling rate of carbon fibers is between 23% and 26%, the preparation process of the present application has reached the optimal thermal conductivity performance supported by the process.

[0085] Continuing to compare Example 6 with Example 7, when the mass fraction of carbon fibers reaches 150, at which time the mass filling rate of carbon fibers is about 27%, the mixed base material prepared with the formula cannot be formed into a standard heat-conducting body 100, which proves that the mass filling rate of carbon fibers supported by the preparation process of the present application cannot exceed 27%. By comparing Comparative Example 4 with Example 7, the mass filling rate of carbon fibers in Comparative Example 4 is 24%, which proves that the preparation process of the present application can increase the mass filling rate of carbon fibers from 24% to 27% in the traditional process.

[0086] It should be noted that the formula obtained in the present application is based on the preparation process provided in the present application. The formula cannot be used to obtain the heat-conducting product with corresponding heat-conducting performance and mechanical performance parameters in the present application without the preparation process described in the present application.

[0087] It should also be noted that the comparative examples used in the present application are based on the preparation process of the traditional extruder, and other parameter conditions in the preparation process are the same as those used in the examples. The performance test results of the heat-conducting products obtained in the present application and the comparative examples cannot be reproduced without the parameter conditions of the preparation process in the present application.

[0088] The step S2 will be further described below.

[0089] Please refer to Figure 3 , Figure 3 is a structural schematic view of the first perspective of the orientation mold 1 in an embodiment of the present application.

[0090] S2, the mixed base material is pressed into the orientation mold 1 to form a heat-conducting glue layer 110. Specifically, the orientation mold 1 includes a multi-stage shunt channel 11 and an orientation discharge nozzle 13, which is connected to the tail end of the shunt channel 11. The multi-stage shunt channel 11 is used to simultaneously extrude the mixed base material into a plurality of directionally arranged heat-conducting glue strips, and the orientation discharge nozzle 13 is used to connect the mixed base material flowing out of the shunt channel 11 to form an integrated heat-conducting glue layer 110.

[0091] Please refer to Figure 4 , Figure 4It is an embodiment of the application for the first perspective of the orientation mold structure explosion diagram. In the embodiment, the orientation mold 1 includes the adapter 14, the orientation mold body 10A, the multi-stage shunt channel 11, the orientation mold cover plate 10B, and the orientation nozzle 13. The multi-stage shunt channel 11 is arranged in the orientation mold body 10A, and the adapter 14 is provided with a shunt groove (not marked in the figure), which is used to communicate the inside of the upstream glue barrel 2 with the multi-stage shunt channel 11, and to transmit the mixed base material flow to the multi-stage shunt channel 11. The orientation mold cover plate 10B is detachably arranged on the orientation mold body 10A to enclose and seal the multi-stage shunt channel 11, so that the orientation mold body 10A and the orientation mold cover plate 10B can be processed separately, and then assembled after processing, which reduces the processing cost of the orientation mold 1 and also facilitates the internal maintenance of the orientation mold body 10A in the later period.

[0092] Please refer to Figure 5 , Figure 5 It is a cross-sectional structure diagram of the second perspective of the orientation mold in an embodiment of the application. Specifically, the cross section of the multi-stage shunt channel 11 is designed to be gradually reduced, and the reduction coefficient is preferably designed to be gradually reduced by 10%-30% of the cross-sectional area. The gradually reduced shunt channel 11 can gradually increase the flow pressure and improve the flow speed when the mixed base material flows along the multi-stage shunt channel 11, thereby forming a continuous orientation effect on the carbon fibers in the mixed base material. In this embodiment, the multi-stage shunt channel 11 includes two one-stage shunt channels 11A, four two-stage shunt channels 11B, and eight three-stage shunt channels 11C with gradually decreasing pipe diameters, and the one-stage shunt channels 11A, the two-stage shunt channels 11B, and the three-stage shunt channels 11C are sequentially connected end to end.

[0093] In other embodiments, the shunt channel can be designed according to a symmetric structure, or an even symmetric design, or an odd symmetric design, which is not limited here.

[0094] In this embodiment, a shunt dam 15 is arranged between adjacent three-stage shunt channels 11C, and the shunt dam 15 is used to separate and distinguish adjacent three-stage shunt channels 11C.

[0095] It can be understood that a shunt dam 15 is also arranged between adjacent two-stage shunt channels 11B and adjacent one-stage shunt channels 11A, which has the same effect as the shunt dam 15 arranged between the three-stage shunt channels 11C.

[0096] The mixed base material enters the secondary flow distribution channel 11B from the primary flow distribution channel 11A, and then enters the tertiary flow distribution channel 11C from the secondary flow distribution channel 11B. Due to the gradual reduction of the pipe diameter, the mixed base material can continuously obtain the driving force to overcome the extrusion resistance of the inner wall of the pipeline under the action of gravity in the flow distribution channel 11.

[0097] At the same time, since the mixed base material in the flow distribution channel 11 always flows along the length direction of the pipeline, and the pipe diameter gradually decreases, the carbon fibers gradually arrange in the direction of the flow of the mixed base material in the posture of the smallest resistance under the characteristics of the natural flow of the fluid-like mixed base material, that is, even if the length direction of the carbon fibers is parallel to the flow direction, the orientation of the carbon fibers in the mixed base material is realized, the orientation degree of the carbon fibers is improved, and the final heat-conducting product has better heat-conducting performance.

[0098] Please refer to Figure 4 and Figure 5 , Figure 5 is a schematic diagram of the second perspective view of the orientation mold 1 in an embodiment of the present application. In some embodiments, the flow distribution channel 11 is also provided with a flow adjusting member 12 for adjusting the flow in the different flow distribution channels 11. In the present embodiment, the flow adjusting member 12 is a screw provided in the tertiary flow distribution channel 11C, and the flow in the tertiary flow distribution channel 11C is controlled by rotating the screw to adjust the insertion depth of the screw in the tertiary flow distribution channel 11C.

[0099] When the mixed base material passes through the flow distribution channel 11, due to the too small flow, too large viscosity of the mixed base material, or other mechanical reasons, the flow distribution of the mixed base material in each flow distribution channel 11 is uneven, which causes the flow to each position of the final flow orientation nozzle 13 to be different. Among them, the position with larger flow will inevitably spread to the surrounding and extrude the mixed base material at the surrounding position. The arrangement of the internal carbon fibers of the mixed base material subjected to unilateral extrusion will be disturbed, which affects the orientation degree of the final heat-conducting product. At the same time, the uneven flow distribution will also cause the thickness of the formed heat-conducting adhesive layer 110 to be inconsistent, which further amplifies the thickness unevenness of the heat-conducting adhesive layer 110 in the stacking process, resulting in a large number of cavities in the finally formed heat-conducting product, which affects the product quality.

[0100] Please refer to Figure 4 In the present embodiment, the orientation mold 13 is formed by assembling the first orientation mold 13A and the second orientation mold 13B, and the first orientation mold 13A and the second orientation mold 13B are mirror-symmetrical structures and are formed by using the same mold to reduce the processing cost. At the same time, the assembled forming structure has lower processing difficulty and higher processing precision than the integral forming structure.

[0101] It should be noted that in other embodiments, the orientation mold 13 is integrally formed.

[0102] Please refer to Figure 6 and Figure 7 , Figure 6 for Figure 4 the structure of the orientation slot 13C, Figure 7 for Figure 2 the structure of the heat-conducting adhesive layer 110. The second orientation mold 13B is provided with a plurality of orientation slots 13C arranged closely along the width direction of the orientation mold 13B. In the present embodiment, the inner diameter of each orientation slot 13C is 0.9 mm, so that the flow width of the carbon fibers in the mixed base material in the orientation slot 13C is smaller, and only the carbon fibers with the orientation consistent with the flow direction will not collide with the inner wall of the orientation slot 13C, while the carbon fibers with other orientations will continuously collide with the inner wall of the orientation slot 13C until the orientation of the carbon fibers is corrected to be consistent with the flow direction, thereby improving the orientation of the carbon fibers and improving the heat-conducting performance of the product. At the same time, the heat-conducting adhesive layer 110 extruded from the orientation slot 13C with a smaller inner diameter has smaller undulations in thickness, and the gap caused by the undulations on the surface of the heat-conducting adhesive layer 110 is smaller during the stacking of different heat-conducting adhesive layers 110, thereby reducing the voids in the heat-conducting product during later molding.

[0103] When the mixed base material flows from the three-stage flow channel 11C into the orientation slot 13C, the mixed base material is divided from 8 flow paths to 120 flow paths, so that the width of the mixed base material flowing in each individual flow path is reduced to improve the orientation of the carbon fiber arrangement while maintaining the overall width of the extruded mixed base material unchanged, forming the heat-conducting adhesive layer for laying and stacking, and improving the stacking efficiency. Thus, the technical contradiction that the smaller the pipe diameter of the extruded mixed base material, the higher the orientation of the carbon fibers, but the lower the stacking efficiency, is overcome.

[0104] Further, the plurality of orientation grooves 13C are in communication with each other, so that the mixed base material in the orientation grooves 13C adhere to each other to form a whole heat-conductive adhesive layer 110. In this way, the heat-conductive adhesive layer 110 can form a whole, thereby avoiding the breakage between the heat-conductive adhesive layers 110 due to the different flow speeds of the mixed base material in different orientation grooves 13C during the stacking process, affecting the product quality. Only when the heat-conductive adhesive layer 110 forms a whole, the stacking can be directly performed in the whole layer, thereby improving the stacking efficiency with high quality. When the heat-conductive adhesive layer 110 is directly stacked, the process is simpler compared to the traditional process of extruding the heat-conductive adhesive strip from one end of the substrate to the other end, then adjusting the orientation mold to the opposite direction and then translating a small distance until the heat-conductive adhesive strip is fully laid on a layer. The heat-conductive adhesive layer 110 is directly stacked, and the distance between the heat-conductive adhesive layers is fixed, so that the error caused by the translation of the orientation mold can be avoided, and the gap can be filled more easily.

[0105] It should be noted that the outlet position of the orientation groove 13C can be a flat rectangular outlet, or an outlet with an arc-shaped groove, which can be changed according to the extrusion orientation characteristics requirements. Preferably, the outlet is arc-shaped, so that the mixed base material is extruded in a cylindrical structure, thereby improving the centripetal action of the carbon fibers in the mixed base material and improving the orientation.

[0106] In this way, the heat-conductive adhesive layer 110 formed by the orientation mold 1 of the present application not only has the advantages of the slender heat-conductive adhesive strip with good orientation, but also overcomes the low production efficiency of the slender heat-conductive adhesive strip, and can also reduce the problem of product hollow caused by the gap generated during the stacking of the heat-conductive adhesive strip.

[0107] Please refer to Figure 8 , Figure 8 for Figure 3 the enlarged structural schematic view of the structure at C, which is used to show the structure of the buckle 13D and the card slot 13F. The orientation mold body 10A and the orientation mold cover plate 10B form a mounting groove with a concave-convex structure (not labeled in the figure), and the first orientation nozzle 13A and the second orientation nozzle 13B are provided with buckles 13D and card slots 13F matched with the concave-convex structure, so that the orientation nozzle 13 is fixedly connected in the mounting groove, and the third shunt channel 11C in the orientation mold 1 is in communication with the orientation groove 13C in the orientation nozzle 13, so as to ensure the flow of the mixed base material. In some embodiments, the mounting groove is further provided with a limiting hole 10C on the upper side, which is used to limit the movement of the orientation nozzle 13 in the mounting groove.

[0108] Please refer to Figure 5 and Figure 9 , Figure 9Figure 1 is a schematic view of a first perspective of the orientation nozzle 1 according to an embodiment of the present application. The bottom end of the orientation nozzle 13 is provided with an orientation groove 13C. The orientation groove 13C is provided with a transition surface 13F having an inclination angle at one end close to the third flow distribution channel 11C. The first orientation nozzle 10A and the second orientation nozzle 10B are both provided with the transition surface 13F. The two transition surfaces 13F together form a funnel structure. The wider side of the funnel structure is adapted to the inner diameter of the third flow distribution channel 11C and is in communication with the third flow distribution channel 11C to receive the mixed base material flowing from the third flow distribution channel 11C. The narrower side of the funnel structure is adapted to the inner diameter of the orientation groove 13C and is in communication with the orientation groove 13C to extrude the mixed base material into the orientation groove 13C. The funnel structure formed by the transition surface 13F having an inclination angle can level the flow velocity difference of the mixed base material flowing from the third flow distribution channel 11C, so that the mixed base material can flow uniformly into each orientation groove 13C.

[0109] The step S3 will be further described below.

[0110] Please refer to Figure 2 S3, the thermally conductive glue layers 110 are stacked layer by layer to form a cured thermally conductive body 100. Specifically, a stacking mold 3 is provided, which is provided with an inner cavity for stacking the thermally conductive glue layers 110 to form the thermally conductive body 100. The inner cavity limits the forming size and shape of the thermally conductive body 100. The thermally conductive glue layers 110 are stacked layer by layer upwards from the base 31 of the stacking mold 3 along the height direction to form the thermally conductive body 100 until the top cover (not shown in the figure) is sealed. Finally, the stacking mold 3 is heated to cure the thermally conductive body 100 in the stacking mold 3, and the formed thermally conductive body 100 is taken out.

[0111] Specifically, in the present embodiment, the stacking mold 3 includes the base 31, the top cover, and a plurality of stacking frames 32 which are detachably connected along the height direction to form the side wall of the stacking mold 3. When the thermally conductive glue layers 110 are stacked, the number of the stacking frames 32 is adjusted according to the specification size of the final thermally conductive product to be formed to control the height of the inner cavity and thus the height size of the thermally conductive body 100. When the thermally conductive glue layers 110 are completely stacked in the stacking mold 3, the top cover is sealed to prevent the subsequent heating and curing of the thermally conductive body 100. The volume expansion of the thermally conductive body 100 causes the deformation of the stacking mold 3.

[0112] After the heat-conducting embryo 100 is cured and formed, when the heat-conducting embryo 100 is disassembled from the stacked mold 3, the top cover is first removed, and then the stacked frames 32 are removed layer by layer from the top layer to the bottom layer until the entire stacked mold 3 can be disassembled. The cured heat-conducting embryo 100 can be naturally moved for the next process. In the traditional process, the heat-conducting embryo 100 is disassembled from the stacked mold 3, which is specifically manifested by cutting the connection between the heat-conducting embryo 100 and the stacked mold 3 by a tool, and then the heat-conducting embryo 100 is fished out of the stacked mold 3. Compared with the disassembly of the heat-conducting embryo 100 from the stacked mold 3 in the traditional process, the idea adopted by the present application is to directly disassemble the stacked mold 3 on the outside, which can avoid damage to the heat-conducting embryo 100 by using a tool, thereby improving the quality of the finally formed heat-conducting product.

[0113] Specifically in the present embodiment, the stacked frames 32 are provided with buckle structures (not shown in the figure) to be connected by mutual buckling. The thickness of the stacked frames 32 of the bottom layer and the top layer is equal to the thickness of the stacked frames 32 in the middle. Preferably, the thickness of the stacked frames 32 of the bottom layer and the top layer can be set to 5 times the thickness of the stacked frames 32 in the middle, so as to enhance the fixing effect and the wear resistance.

[0114] In other embodiments, before the heat-conducting glue layer 110 is stacked, a separation film is arranged on the bottom wall of the stacked mold 3, and before the top cover is finally sealed, the same separation film is arranged on the top cover of the stacked mold 3. The separation film is made of PET material to avoid the adhesion of the heat-conducting embryo 100 to the stacked mold 3, which may cause damage to the heat-conducting embryo 100 when it is finally disassembled from the stacked mold 3.

[0115] In the step of stacking the heat-conducting glue layer 110 layer by layer, the orientation discharge nozzle 13 of the orientation mold 1 is arranged on the upper side of the stacked mold 3, the heat-conducting glue layer 110 formed in the orientation discharge nozzle 13 is extruded on the bottom wall of the stacked mold 3, and at the same time, the orientation discharge nozzle 13 is uniformly moved in a certain direction, so that the heat-conducting glue layer 110 gradually spreads on the bottom wall of the stacked mold 3 during the extrusion process.

[0116] When the bottom wall of the stacked mold 3 has been completely spread, the height of the orientation discharge nozzle 13 is raised, and the raised height is the same as the thickness of the heat-conducting glue layer 110, so as to always keep the height of the orientation discharge nozzle 13 the same as the height of the heat-conducting embryo 100 which has been stacked and formed, thereby avoiding the mutual extrusion of the second layer of the heat-conducting glue layer 110 and the first layer of the heat-conducting glue layer 110, which may cause deformation and affect the orientation of the carbon fibers in the heat-conducting glue layer 110.

[0117] Please refer to Figure 1 , Figure 1Fig. 2 is a schematic view of a second perspective view of the stacked heat-conducting glue sheet in an embodiment of the present application. After lifting the orientation nozzle 13, the orientation mold 1 also needs to be horizontally moved to offset a certain distance, so that the adjacent heat-conducting glue layers 110 are offset in the height direction. The width of the offset is preferably half the width of the heat-conducting glue protrusion. Since the heat-conducting glue layer 110 is extruded from the mixed base material in the cylindrical orientation groove 13C, the surface of the heat-conducting glue layer 110 has continuous alternating arc-shaped orientation indentations 112 and orientation protrusions 111. By offsetting the adjacent heat-conducting glue layers 110, the orientation indentations 112 on the first heat-conducting glue layer 110 can be bonded to the orientation protrusions 111 on the second heat-conducting glue layer 110. At the same time, since the structure of each heat-conducting glue layer 110 is the same, all the orientation indentations 112 on the heat-conducting glue layer 110 can be filled by the orientation protrusions 111 on the adjacent heat-conducting glue layer 110, thereby greatly reducing the void problem of the heat-conducting body 100 caused by the orientation indentations 112 and the orientation protrusions 111 of the heat-conducting glue strip during the stacking process.

[0118] It can be understood that the subsequent orientation mold 1 moves and extrudes the heat-conducting glue layer 110 in the forward and reverse directions, so that the extruded heat-conducting glue layer 110 is stacked on the previously laid heat-conducting glue layer 110 in turn, and finally forms the heat-conducting body 100.

[0119] The step S4 will be further described below.

[0120] S4, cutting the heat-conducting body 100 to form a heat-conducting product. After curing, the heat-conducting body 100 is disassembled, and the heat-conducting body 100 is cut into a cutting processing heat-conducting body 100 that meets the product design requirements by ultrasonic cutting or other methods to form a high-orientation heat-conducting interface material.

[0121] The preparation process of the high-orientation heat-conducting interface material adopted in the present application has the following implementation principle: the orientation mold 1 is used instead of the traditional extruder, so that the mixed base material can be extruded to form thinner heat-conducting glue strips to improve the orientation of carbon fibers and reduce product voids, and a plurality of heat-conducting glue strips are bonded to form a heat-conducting glue layer 110 to overcome the production efficiency problem. And through this process, since the multi-stage shunt channel 11 of the orientation mold 1 has a smaller pipe cross-sectional area, and is supplemented by flow regulation, it can overcome greater resistance during the extrusion of the mixed base material to form heat-conducting glue strips, thereby breaking through the technical problem of the upper limit of the carbon fiber filling rate in the traditional process, so that the finally formed heat-conducting product has a higher thermal conductivity. In the stacking process, the stacking mold 3 composed of the detachable stacking frame 32 improves the efficiency of disassembling the heat-conducting body 100, reduces the damage to the heat-conducting body 100 during disassembly, and also improves the quality of the finally formed heat-conducting product.

[0122] Any combination of the technical features in the above-described embodiments can be made. For the sake of brevity, the foregoing description is not intended to be exhaustive or to limit the scope of the application to the precise form disclosed. Modifications and alterations can occur to others upon reading the description. It is intended that the scope of the application be measured by the breadth of the appended claims rather than the particulars of the foregoing description.

[0123] The above-described embodiments are merely illustrative of several embodiments of the present application, and the description is relatively specific and detailed, but should not be construed as limiting the scope of the patent application. It should be noted that for those skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are all within the scope of the present application. Therefore, the scope of the patent of the present application should be subject to the appended claims.

Claims

1. A process for preparing a highly oriented thermally conductive interface material, characterized by, The application relates to a method for manufacturing a heat-conducting product. The method comprises the following steps: a mixed base material is provided, which comprises heat-conducting fibers, fillers and a binder; the mixed base material is pressed into an orientation mold (1), which comprises an orientation mold body (10A) and an orientation discharge nozzle (13), a plurality of multistage shunt channels (11) are arranged in the orientation mold body (10A), the multistage shunt channels (11) are communicated with the orientation discharge nozzle (13), a plurality of closely arranged orientation grooves (13C) are arranged in the orientation discharge nozzle (13), the inner diameter of the orientation grooves (13C) in the orientation discharge nozzle (13) is smaller than the inner diameter of the inlet of the shunt channels (11), the mixed base material flows along the multistage shunt channels (11) to the orientation discharge nozzle (13), and is extruded from the plurality of orientation grooves (13C) to arrange the heat-conducting fibers in a directional arrangement, so that a heat-conducting adhesive layer (110) in the form of a film is continuously discharged; the heat-conducting adhesive layer (110) is stacked layer by layer along the Z-axis based on the repeated movement of the orientation mold (1) along the X-axis in the XY area, and is post-heated and solidified to form a heat-conducting blank (10); the upper and lower surfaces of the heat-conducting adhesive layer (110) are each formed with corresponding orientation indentations (112) which are defined by the orientation grooves (13C); the orientation indentations (112) are along the X-axis, and in the step of stacking the heat-conducting adhesive layer (110) layer by layer, the position of the orientation discharge nozzle (13) is slightly adjusted along the Y-axis direction based on the horizontal position of the heat-conducting adhesive layer (110), so that the orientation indentations (112) between the adjacent heat-conducting adhesive layers (110) in the height direction are misaligned and stacked; 2. The process for preparing a high orientation thermally conductive interface material of claim 1, wherein, the heat-conducting blank (10) is cut and processed in the YZ plane to form a heat-conducting product in the form of a film.

3. The process for preparing a high orientation thermally conductive interface material of claim 2, wherein, A flow adjusting member (12) is arranged on each shunt channel (11), and in the step of pressing the mixed base material into the orientation mold (1), the flow in the shunt channel (11) is controlled based on the flow adjusting member (12) to keep the flow of the mixed base material in all the shunt channels (11) the same and keep the extrusion molding of the heat-conducting adhesive layer (110).

4. The process for preparing a high orientation thermally conductive interface material of claim 1, wherein, The plurality of orientation grooves (13C) are communicated with each other, and in the step of pressing the mixed base material into the orientation mold (1), the mixed base material is adhered to each other in the orientation grooves (13C) to form the heat-conducting adhesive layer (110).

5. The process for preparing a high orientation thermally conductive interface material according to any one of claims 1 to 4, wherein In the step of stacking the heat-conducting adhesive layer (110) layer by layer, the height of the orientation discharge nozzle (13) is synchronously adjusted based on the stacking height of the heat-conducting adhesive layer (110) to keep the height of the orientation discharge nozzle (13) the same as the stacking height of the heat-conducting adhesive layer (110) at all times.

6. The process for preparing a high orientation thermally conductive interface material of claim 5, wherein, In the step of stacking the heat-conducting adhesive layer (110) layer by layer, the heat-conducting adhesive layer (110) is arranged in a stacking mold (20), and the stacking mold (20) comprises a plurality of stacking frames (32) which are detachably connected along the height direction to form the side wall of the stacking mold (20). Before the step of stacking the heat-conducting adhesive layer (110) layer by layer, a first separation film is laid on the bottom layer of the stacking mold (20); and After the step of layer-by-layer stacking the thermally conductive adhesive layers (110), a second separation film is laid on the top layer of the stacking mold (20).

7. The process of claim 1, wherein the high orientation thermally conductive interface material is prepared by the steps of: The mixed base material comprises 50-140 parts by weight of carbon fibers, 180-200 parts of fillers, 45-50 parts of adhesives, 11-150 parts of compound powders, 2-2.2 parts of vulcanizing agents, 0.1 parts of inhibitors, 1.5 parts of catalysts, and 0.5-2 parts of filling aids, wherein the carbon fibers account for more than 25% of the upper limit of the total mass ratio.

8. An orientation mold characterized by, The orientation mold for preparing the high-orientation thermally conductive interface material comprises: An orientation mold body (10A) internally provided with multi-stage shunt channels (11); An orientation discharge nozzle (13) is clamped to the orientation mold body (10A) and is connected to the tail end of the shunt channels (11); the orientation discharge nozzle (13) is connected to the multi-stage shunt channels (11), and the orientation discharge nozzle (13) is internally provided with multiple closely arranged orientation grooves (13C); the inner diameter of the orientation grooves (13C) in the orientation discharge nozzle (13) is smaller than the inner diameter of the entrances of the shunt channels (11); the mixed base material flows along the multi-stage shunt channels (11) to the orientation discharge nozzle (13), and the orientation grooves (13C) extrude to directionally arrange the thermally conductive fibers in the mixed base material to continuously discharge the film-shaped thermally conductive adhesive layers (110); the orientation discharge nozzle (13) can be slightly adjusted in the Y-axis direction to misalign the orientation indentations (112) between the adjacent thermally conductive adhesive layers (110) in the height direction.

9. The orientation mold of claim 8, wherein, The upper surface and the lower surface of the orientation grooves (13C) are both provided with symmetrical arc-shaped structures, so that the surface of the thermally conductive adhesive layers (110) extruded from the orientation grooves (13C) forms orientation protrusions (111) and orientation indentations (112); the thermally conductive adhesive layers (110) have a minimum value of thickness at the orientation indentations (112), and a maximum value of thickness at the orientation protrusions (111); the ratio of the minimum value of thickness to the maximum value of thickness of the thermally conductive adhesive layers ranges from 0 to 0.7.

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