Light emitting device

Abstract

A light emitting device with higher reliability is provided. A light emitting device (100) has a light emitting element (1), a first substrate (10) having an element placement region (13) on which the light emitting element (1) is placed, a sheet-shaped light-transmissive member (5) covering the light emitting element (1) and having an outer edge of a lower surface in contact with an upper surface of an outer side of the element placement region (13) of the first substrate (10), and a first protrusion (41) extending across the upper surface of the first substrate (10) and the upper surface of the light-transmissive member (5) and having a top portion higher than the upper surface of the light emitting element.

Description

Technical Field

[0001] This disclosure relates to light-emitting devices. Background Technology

[0002] In the past, light-emitting devices utilizing multiple light-emitting elements have been used as light sources for vehicle-mounted applications and projectors. When using a light-emitting device as a light source, a structure is employed, for example, to irradiate light from the light source to the outside via a lens. As such a light-emitting device, a structure is known in which multiple light-emitting elements are arranged on a base, and the base is mounted on a wiring board, with the base and wiring board connected by leads (e.g., Patent Documents 1 and 2).

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2021-009898

[0006] Patent Document 2: Japanese Patent Application Publication No. 2017-212301 Summary of the Invention

[0007] The technical problem that the invention aims to solve

[0008] The purpose of this disclosure is to provide a light-emitting device with higher reliability.

[0009] Technical solutions for solving technical problems

[0010] The light-emitting device according to embodiments of this disclosure includes: a light-emitting element; a first substrate having an element mounting area on an upper surface on which the light-emitting element is mounted; a light-transmitting member being a sheet covering the light-emitting element, the outer edge of the lower surface of which is in contact with the upper surface of the first substrate outside the element mounting area; and a first protrusion extending across the upper surface of the first substrate and the upper surface of the light-transmitting member, disposed along the outer edge of the upper surface of the light-transmitting member, and having a top that is higher than the upper surface of the light-emitting element.

[0011] The effects of the invention

[0012] According to embodiments of this disclosure, a light-emitting device with higher reliability can be provided. Attached Figure Description

[0013] Figure 1 This is a perspective view schematically representing the light-emitting device of the first embodiment.

[0014] Figure 2 This is a schematic top view of the light-emitting device according to the first embodiment.

[0015] Figure 3 yes Figure 2 A cross-sectional view along line III-III.

[0016] Figure 4 yes Figure 2 A sectional view of the portion along line IV-IV.

[0017] Figure 5 yes Figure 2 A cross-sectional view of the VV line.

[0018] Figure 6 yes Figure 2 A sectional view along line VI-VI.

[0019] Figure 7 This is a top view schematically showing the first protrusion and the second protrusion, the light-transmitting component, and the lead wire in the light-emitting device of the first embodiment.

[0020] Figure 8 This is a flowchart illustrating the manufacturing method of the light-emitting device according to the first embodiment.

[0021] Figure 9A This is a top view schematically illustrating the manufacturing method of the light-emitting device according to the first embodiment.

[0022] Figure 9B This is a top view schematically illustrating the manufacturing method of the light-emitting device according to the first embodiment.

[0023] Figure 9C This is a top enlarged view schematically illustrating the manufacturing method of the light-emitting device according to the first embodiment.

[0024] Figure 9D This is a top view schematically illustrating the manufacturing method of the light-emitting device according to the first embodiment.

[0025] Figure 9E This is a top view schematically illustrating the manufacturing method of the light-emitting device according to the first embodiment.

[0026] Figure 9F This is a top view schematically illustrating the manufacturing method of the light-emitting device according to the first embodiment.

[0027] Figure 9G This is a top view schematically illustrating the manufacturing method of the light-emitting device according to the first embodiment.

[0028] Figure 9H This is a top view schematically illustrating the manufacturing method of the light-emitting device according to the first embodiment.

[0029] Figure 10A This is a schematic top view of the light-emitting device according to the second embodiment.

[0030] Figure 10B yes Figure 10A A cross-sectional view of the XB-XB line.

[0031] Figure 10C It is Figure 10B A magnified partial cross-sectional view.

[0032] Figure 11 This is a flowchart illustrating the manufacturing method of the light-emitting device according to the second embodiment.

[0033] Figure 12A This is a cross-sectional view schematically illustrating the manufacturing method of the light-emitting device according to the second embodiment.

[0034] Figure 12B This is a cross-sectional view schematically illustrating the manufacturing method of the light-emitting device according to the second embodiment.

[0035] Figure 12C This is a cross-sectional view schematically illustrating the manufacturing method of the light-emitting device according to the second embodiment.

[0036] Figure 12D This is a cross-sectional view schematically illustrating the manufacturing method of the light-emitting device according to the second embodiment.

[0037] Figure 13 This is a cross-sectional view schematically representing a modified example of the first embodiment. Detailed Implementation

[0038] The light-emitting device according to the embodiments will now be described with reference to the accompanying drawings. It should be noted that the dimensions and positional relationships of the components shown in the drawings may be exaggerated for clarity. Furthermore, the dimensions and arrangement of the components may not be strictly consistent in the top view and the corresponding sectional view. To avoid making the drawings overly complex, sometimes illustrations of some major components are omitted, or end views showing only the cut surfaces are used as sectional views. In addition, in the following description, up, down, left, right, front, and back are relative terms and do not represent absolute directions. Moreover, for the same names and designations, in principle, they represent the same or homogeneous components, and detailed descriptions are sometimes appropriately omitted. Furthermore, regarding the embodiments, "covering" or "covering" is not limited to direct contact, but also includes indirect coverage, such as coverage via other components. The top view mentioned in this specification refers to the view from the light extraction surface side of the light-emitting device.

[0039] <First Implementation>

[0040] [Structure of the light-emitting device in the first embodiment]

[0041] Reference Figures 1 to 7 The structure of the light-emitting device according to the first embodiment will be described.

[0042] Figure 1 This is a perspective view schematically representing the overall structure of the light-emitting device according to the embodiment. Figure 2 This is a schematic top view showing the overall structure of the light-emitting device according to the first embodiment. Figure 3 yes Figure 2 A cross-sectional view along line III-III. Figure 4 yes Figure 2 A cross-sectional view along line IV-IV. Figure 5 yes Figure 2 A cross-sectional view of the VV line. Figure 6 yes Figure 2 A sectional view along line VI-VI. Figure 7 This is a top view schematically showing the first protrusion and the second protrusion, the light-transmitting component, and the lead wire in the light-emitting device of the first embodiment.

[0043] The light-emitting device 100 includes: a light-emitting element 1; a first substrate 10 having an element mounting region 13 on its upper surface for mounting the light-emitting element 1; a light-transmitting member 5 covering the light-emitting element 1, with the outer edge of its lower surface contacting the outer upper surface of the element mounting region 13 of the first substrate 10; and a first protrusion 41 extending across the upper surface of the first substrate 10 and the upper surface of the light-transmitting member 5, and disposed along the outer edge of the upper surface of the light-transmitting member 5. The first protrusion 41 may be configured as a continuous frame covering all the outer edges of the upper surface of the light-transmitting member 5, or multiple first protrusions may be disposed intermittently along the outer edge of the upper surface of the light-transmitting member 5. Alternatively, it may be configured as a shape in which a portion of the frame is cut off. Here, the first protrusion 41 is configured as a rectangular frame to surround the element mounting region 13. The light-emitting device 100 here has multiple light-emitting elements 1. Moreover, the multiple light-emitting elements 1 are arranged and disposed in the element mounting region 13.

[0044] Furthermore, the light-emitting device 100 may also include: a second substrate 20 having a substrate mounting region 23 on which the first substrate 10 is mounted; a lead 130 connecting a first terminal 110 disposed on the upper surface of the first substrate 10 further outward than the element mounting region 13 and a second terminal 120 disposed on the upper surface of the second substrate 20 further outward than the substrate mounting region 23; and a cover member 40 covering the lead 130. In this case, the cover member 40 is in contact with the first protrusion 41 and covers the upper surface of the first substrate 10 further outward than the first protrusion 41.

[0045] It should be noted that the light-emitting device 100 may have a reflective member 7 on the element placement area 13 on the first substrate 10, which exposes the upper surface of the light-emitting element 1 and covers the side surface. In addition, the light-emitting device 100 may also have a second protrusion 42 on the upper surface of the second substrate 20, which is disposed further outward than the second terminal 120 and is in contact with the covering member 40.

[0046] The following is an explanation of each structure.

[0047] (First substrate)

[0048] The first substrate 10 includes a flat support member and wiring disposed on the upper surface of the support member. The first substrate 10 has a component mounting region 13 on its upper surface, on which a plurality of light-emitting elements 1 are mounted. Wiring connected to the light-emitting elements 1 is disposed in the component mounting region 13. As wiring disposed on the upper surface further outward than the component mounting region 13, the first substrate 10 has a plurality of first terminals 110. The first terminals 110 are electrically connected to the wiring disposed in the component mounting region 13. The first substrate 10 is, for example, a semiconductor substrate such as silicon, and the area on the upper surface where no wiring is disposed is covered by an insulating film. The wiring may also be disposed inside the support member or on its lower surface. For example, the first substrate 10 may be an integrated circuit (IC) substrate with an integrated circuit for driving and controlling the plurality of light-emitting elements 1.

[0049] Multiple light-emitting elements 1 are arranged in a matrix in the element placement area 13. As an example, the element placement area 13 can be a rectangular area when viewed from above. In this case, the element placement area 13 is rectangular, and the first terminals 110 are arranged in a row along the opposite long sides of the rectangle, separated by the element placement area 13.

[0050] The first terminal 110 is, for example, a power supply terminal for the first substrate. Here, the first substrate 10 is connected to one end of the lead 130, which is electrically connected to the second substrate via the lead 130. Here, as an example, the plurality of first terminals 110 are generally rectangular in shape, and are spaced apart from each other on the upper surface of the first substrate 10, arranged in a row along the long side of the component mounting area 13.

[0051] Multiple light-emitting elements 1 are arranged in a matrix on the first substrate 10 and electrically connected to any of the first terminals. The multiple light-emitting elements 1 can also be connected in series or in parallel with the first terminals to form a predetermined number of groups.

[0052] Wiring can be formed using metals such as Cu, Ag, Au, Al, Pt, Ti, W, Pd, Fe, Ni, or alloys thereof. This wiring can be formed through electroplating, electroless plating, deposition, sputtering, or other methods.

[0053] (Second substrate)

[0054] The second substrate 20 includes a flat substrate and wiring disposed on at least the upper surface of the substrate. The second substrate 20 has a substrate mounting region 23 on the upper surface for mounting the first substrate 10, and a second terminal 120 on the upper surface further outward than the substrate mounting region 23.

[0055] The substrate mounting area 23 is the area where the first substrate 10 is mounted. This substrate mounting area 23 is configured to have the same area as the top view shape of the first substrate 10. Here, "same" means within an acceptable range, including errors caused by component tolerances and mounting tolerances. As long as the first substrate 10 is rectangular in top view, the substrate mounting area 23 can also be rectangular.

[0056] Multiple second terminals 120 are arranged in rows along the long sides of the rectangular substrate mounting area 23 on the outer side of the substrate mounting area 23. Each second terminal 120 is a terminal connected to the other end of a lead 130, one end of which is connected to the first terminal 110. Here, as an example, each second terminal 120 is generally rectangular in shape, spaced apart from each other, and arranged in rows along the substrate mounting area 23 on the upper surface of the second substrate 20.

[0057] The second terminal 120 can be formed, for example, using the same material and forming method as the wiring of the first substrate 10 already described.

[0058] The substrate is preferably made of a material with high heat dissipation properties, and even more preferably, a material with high light-shielding properties and substrate strength. Specifically, examples include ceramics such as bauxite, aluminum nitride, and mullite; phenolic resins, epoxy resins, polyimide resins, BT resins (bismaleimide triazine resin), polyphthalamide (PPA), and composite materials made of resins and metals or ceramics. The substrate can be a flat substrate or a substrate with a cavity on its upper surface. In this case, the second substrate 20 can use the bottom of the cavity as a substrate mounting area, and the first substrate 10 can be mounted within the cavity.

[0059] The second substrate 20 may also have wiring on the surface of the substrate mounting area 23 for mounting the first substrate 10. The first substrate 10 and the second substrate 20 may be bonded together by bonding materials such as Ag sintered body, solder, or adhesive resin.

[0060] (lead)

[0061] As the lead 130, conductive leads made of metals such as Au, Cu, Pt, and Al, and / or alloys containing at least the aforementioned metals, can be used. Au, with its good thermal resistance, is particularly preferred. The diameter of the lead can be, for example, 15 μm or more and 50 μm or less. It should be noted that the lead 130 here includes a first lead 31, a second lead 32, and a third lead 33, each with a different length. The first lead 31, the second lead 32, and the third lead 33 can each be formed from the same component.

[0062] The lead 130 may span the long side of the first substrate 10, which is generally rectangular when viewed from above, for example, in a manner that is generally orthogonal to the long side.

[0063] (Light-emitting element)

[0064] The light-emitting element 1, for example, has a generally rectangular shape when viewed from above, and includes a semiconductor laminate and positive / negative electrodes disposed on the surface of the semiconductor laminate. The light-emitting element 1 has positive / negative electrodes on the same side, with the surface having the electrodes serving as the lower surface, and is mounted on the first substrate 10 facing the upper surface of the first substrate 10. In this case, the upper surface facing the surface with the electrodes becomes the main light-extraction surface of the light-emitting element 1. It should be noted that in the light-emitting device 100, the light-emitting elements 1 are arranged at predetermined intervals in a matrix direction and placed on the first substrate 10. The size and number of light-emitting elements 1 used can be appropriately selected according to the desired form of the light-emitting device. Preferably, a larger number of smaller light-emitting elements 1 are placed in a high density. This allows for control of the illumination range with a greater number of divisions, enabling its use as a light source for a high-resolution illumination system. For example, 1000 to 20000 rectangular light-emitting elements 1, each with sides of 40 μm to 100 μm when viewed from above, can be formed as a whole and arranged in a rectangular matrix.

[0065] The light-emitting element 1 can be selected from elements of any wavelength. For example, as a blue or green light-emitting element 1, it can be selected from elements utilizing ZnSe or nitride semiconductors (In). X Al Y Ga 1-X-Y The light-emitting element 1 can be made of GaAlAs or AlInGaP materials, where N, 0≦X, 0≦Y, X+Y≦1, and so on. Additionally, semiconductors such as GaAlAs and AlInGaP can be used as the red light-emitting element 1. Furthermore, semiconductor light-emitting elements made of materials other than those mentioned above can also be used. The composition and emission color of the light-emitting element 1 can be appropriately selected according to the intended purpose.

[0066] (Jointing components)

[0067] It should be noted that, as Figure 6As shown, the light-emitting element 1 is bonded by conductive bonding members to wiring arranged in the element mounting region 13 of the first substrate 10. When the light-emitting element 1 is flip-chip mounted on the first substrate 10, bumps formed of metal materials such as Au, Ag, Cu, and Al can be used as bonding members. Alternatively, solders such as AuSn alloys and Sn-based lead-free solders can also be used. In this case, the light-emitting element 1 can be bonded to the first substrate 10 by reflow bonding. Alternatively, conductive adhesive materials containing conductive particles in resin can also be used as bonding members. The bonding between the light-emitting element 1 and the first substrate 10 can also be formed using electroplating. Cu can be used as an example of an electroplating material.

[0068] Alternatively, the bonding between the light-emitting element 1 and the first substrate 10 can be achieved without the bonding component, by directly bonding the electrodes of the light-emitting element 1 to the wiring of the first substrate 10.

[0069] (Reflective component)

[0070] like Figure 6 As shown, the reflective component 7 covers the upper surface of the first substrate 10 and the side surface of the light-emitting element 1. The upper surface of the light-emitting element 1 is exposed through the reflective component 7. The reflective component 7 may also cover the area between the lower surface of the light-emitting element 1 and the first substrate 10. The reflective component 7 can reflect light emitted from the side surface of the light-emitting element 1 and emit it from the upper surface of the light-emitting surface of the light-emitting device 100, i.e., the light-transmitting component 5. Therefore, the light extraction efficiency of the light-emitting device 100 can be improved. In addition, when the light-emitting element 1 is lit alone, the boundary between the light-emitting area and the non-light-emitting area can be clearly defined. As a result, the contrast between the light-emitting area and the non-light-emitting area is improved. Furthermore, the reflective component 7 may be disposed spaced apart from the first protrusion 41 or disposed in contact with the first protrusion 41.

[0071] It should be noted that the reflective component 7 is preferably made of a soft resin with relatively low elasticity and good shape conformability. Specifically, the reflective component 7 is preferably made of a white resin containing light-reflecting material particles in a light-transmitting resin used as the base material. As the light-transmitting resin, for example, silicone resin, modified silicone resin, epoxy resin, modified epoxy resin, acrylic resin, or a mixed resin including at least one of the above resins can be used. Among these, silicone resin with good heat resistance and light resistance is preferred, and dimethyl silicone resin is more preferred. Because dimethyl silicone resin has higher reliability, such as high-temperature resistance, it is suitable for use as a material in automotive applications. As the light-reflecting material, for example, titanium dioxide, aluminum oxide, zinc oxide, barium carbonate, barium sulfate, boron nitride, aluminum nitride, glass filler, etc., can be appropriately used. It should be noted that the reflective component 7 may also contain light-absorbing materials such as carbon black and graphite.

[0072] (Transparent components)

[0073] The light-transmitting component 5 is light-transmitting and covers the upper surfaces of multiple light-emitting elements 1. The light-transmitting component 5 uniformly covers the upper surfaces of the multiple light-emitting elements 1 and the upper and side surfaces of the reflective component 7. The upper surface of the light-transmitting component 5 constitutes the light-emitting surface of the light-emitting device 100. The light-transmitting component 5 includes at least a light-transmitting resin as a base material, and may also contain a wavelength conversion component. Here, as an example, the light-transmitting component 5 includes a wavelength conversion component that performs wavelength conversion on at least a portion of the light emitted from the light-emitting element 1 and extracts it to the outside.

[0074] The light-transmitting component 5 is a sheet-like structure that is roughly rectangular in plan view, and is arranged to include a plurality of light-emitting elements 1 internally. Furthermore, the outer edge 51 of the lower surface of the light-transmitting component 5 is arranged to contact the upper surface of the outer side of the element mounting area 13 of the first substrate 10. As an example, in the manufacturing process described later, after the uncured light-transmitting component 5, processed into a sheet shape, is arranged to cover the light-emitting element 1 and the reflective component 7, the light-transmitting component 5 is softened by heating or the like, causing the outer edge of the lower surface of the light-transmitting component 5 to deform along the reflective component 7 where it contacts the upper surface of the first substrate 10, thereby obtaining the aforementioned light-transmitting component 5. Moreover, the light-transmitting component 5 is cured while in contact with the upper surface of the light-emitting element 1, the upper surface of the reflective component, the outer side surface, and the upper surface of the first substrate 10. Furthermore, the sheet-like light-transmitting component 5 is arranged along the upper surface of the light-emitting element 1 and the upper surface of the first substrate 10. Therefore, the light-emitting device 100 has a step on the upper surface of the light-transmitting component 5 caused by the height difference between the upper surface of the first substrate 10 and the upper surface of the light-emitting element 1.

[0075] The light-transmitting component 5 can be disposed on the light-emitting element 1 by processing it into a sheet or plate shape, or it can be coated onto the light-emitting element 1 and the reflective component 7 in a layered form by spraying or the like. Alternatively, it can be formed into a sheet shape on the light-emitting element 1 by injection molding, transfer molding, compression molding, or the like using a mold. The light-transmitting component 5 is configured such that the outer edge 51 of its lower surface is in contact with the upper surface of the first substrate 10, thereby improving the tightness of contact with the first substrate 10.

[0076] As a light-transmitting component 5 containing a wavelength conversion element, it is possible to exemplify that the light-transmitting resin used as a base material contains phosphor powder. The same resin as exemplified in the base material of the reflective component 7 can be used as the base material. The thickness of the light-transmitting component 5 can be, for example, 20 μm or more and 100 μm or less. It should be noted that the light-transmitting component 5 covers the entire upper surface of the plurality of light-emitting elements 1 and the reflective component 7, and is formed such that the outer edge 51 of its lower surface is in contact with the first substrate 10. Specifically, it is possible to exemplify that the outer edge of the light-transmitting component 5 is located at least twice the thickness of the light-emitting element 1 from the outer edge of the reflective component 7, and at least twice the thickness of the light-transmitting component 5 from the outer edge of the reflective component 7. Furthermore, the light-transmitting component 5 extends on the first substrate 10 to a position covered by the first protrusion 41, which will be described later.

[0077] As a phosphor, yttrium / aluminum / garnet phosphors (e.g., Y3(Al,Ga)5O) can be used. 12 Ce), lutetium / aluminum / garnet phosphors (e.g., Lu3(Al,Ga)5O) 12 Ce), terbium / aluminum / garnet phosphors (e.g., Tb3(Al,Ga)5O) 12 Ce), CCA-type fluorophores (e.g., Ca), 10 (PO4)6C l2 Eu), SAE-type phosphors (e.g., Sr4Al) 14 O 25 Eu), chlorosilicate phosphors (e.g., Ca8MgSi4O) 16 Cl2:Eu), β-type silron phosphors (e.g., (Si,Al)3(O,N)4:Eu), α-type silron phosphors (e.g., Ca(Si,Al)). 12 (O, N) 16 Nitrogen-based phosphors such as Eu, SLA-type phosphors (e.g., SrLiAl3N4:Eu), CASN-type phosphors (e.g., CaAlSiN3:Eu) or SCASN-type phosphors (e.g., (Sr,Ca)AlSiN3:Eu), fluoride-based phosphors such as KSF-type phosphors (e.g., K2SiF6:Mn), KSAF-type phosphors (e.g., K2(Si,Al)F6:Mn) or MGF-type phosphors (e.g., 3.5MgO / 0.5MgF2 / GeO2:Mn), phosphors with perovskite structure (e.g., CsPb(F,Cl,Br,I)3), or quantum dot phosphors (e.g., CdSe, InP, AgInS2 or AgInSe2), etc.

[0078] As a KSAF-type phosphor, it may also have components represented by the following formula (I).

[0079] M2[Si p Al q Mn r F s (I)

[0080] In formula (I), M represents an alkali metal, containing at least K. Mn can be a tetravalent Mn ion. p, q, r and s can satisfy 0.9≦p+q+r≦1.1, 0<q≦0.1, 0<r≦0.2, 5.9≦s≦6.1. Preferably, the inequalities are 0.95≦p+q+r≦1.05 or 0.97≦p+q+r≦1.03, 0<q≦0.03, 0.002≦q≦0.02 or 0.003≦q≦0.015, 0.005≦r≦0.15, 0.01≦r≦0.12 or 0.015≦r≦0.1, and 5.92≦s≦6.05 or 5.95≦s≦6.025. For example, the inequalities can be exemplified by K2[Si]. 0.946 Al 0.005 Mn 0.049 F 5.995 ]、K2[Si 0.942 Al 0.008 Mn 0.050 F 5.992 ]、K2[Si 0.939 Al 0.014 Mn 0.047 F 5.968 The component is indicated by ] . Based on the above KSAF-type phosphors, red light with high brightness and a narrow half-width at the emission peak wavelength can be obtained.

[0081] (Covered parts)

[0082] The masking member 40 is a light-shielding resin that covers the lead 130 further outward than the component mounting area 13. It should be noted that, as an example, the masking member 40 is configured in a frame shape from a top view, covering the lead 130 and surrounding the component mounting area 13. The masking member 40 is configured to engage with the first protrusion described later.

[0083] The frame-shaped cover member 40 has a wider area on the long side of the rectangle of the first substrate 10, which is generally rectangular in top view, than on the short side. Furthermore, the height of the cover member 40 (i.e., the distance from the upper surface of the second substrate 20 to the upper surface of the cover member 40) is positioned such that it is highest directly above the top 130a of the lead 130 (here, the top of the lead loop). In other words, the cover member 40 is positioned such that the top 40a of the cover member 40 overlaps with the top 130a of the lead 130. It should be noted that the top 40a of the cover member 40 is positioned higher than the top 41a of the first protrusion 41, which will be described later.

[0084] As a light-shielding covering component 40, examples include resins containing light-shielding fillers. Examples of resins used as the base material include silicone resins, modified silicone resins, epoxy resins, modified epoxy resins, and acrylic resins. Examples of light-shielding fillers include light-absorbing substances such as pigments, carbon black, and graphite, as well as light-reflecting substances similar to those contained in the aforementioned reflective components. Specifically, examples include white resins with good light reflectivity, black resins with good light absorption, or gray resins with both light reflectivity and light absorption. Furthermore, the covering component 40 may also be laminated with multiple layers of the aforementioned resins.

[0085] Considering the degradation of resin due to light absorption, the covering component 40 preferably uses a white resin that is light reflective at least on the outermost surface.

[0086] The cover member 40 is light-shielding and is disposed in contact with the first protrusion 41, which will be described later. Because the cover member 40 contains light-reflecting and / or light-absorbing materials as fillers for light-shielding, the amount of resin in the cover member 40 can be reduced compared to using a light-transmitting resin without such fillers. This suppresses the load on the leads caused by the thermal expansion of the resin. Because the thermal impact on the leads is reduced, the lead connectivity is improved, resulting in a highly reliable light-emitting device.

[0087] (First convex part, second convex part)

[0088] The light-emitting device 100 has a first protrusion 41 extending across the upper surface of the first substrate 10 and the upper surface of the light-transmitting member 5, and disposed along the outer edge of the upper surface of the light-transmitting member 5. The first protrusion 41, viewed from above, is frame-shaped to surround the element mounting region 13. Specifically, the first protrusion 41 is disposed on the first substrate 10 between the element mounting region 13 and the first terminal 110, along the outer edge of the upper surface of the light-transmitting member 5, covering the outer edge 51 of the upper surface of the light-transmitting member 5, and is disposed in contact with the upper surface of the first substrate 10. This improves the tight contact between the light-transmitting member 5 and the first substrate 10 in the light-emitting device 100, resulting in a highly reliable light-emitting device 100. Furthermore, because the area of ​​the upper surface of the first substrate 10 surrounded by the first protrusion 41 in the upper surface of the light-emitting device 100 is not exposed, wiring and other components disposed in the element mounting region 13 can be protected from dust, moisture, external forces, etc. This further enhances the reliability of the light-emitting device 100.

[0089] In the light-emitting device 100, the first protrusion 41 is configured such that its top 41a is positioned higher than the upper surface of the light-emitting element 1. This allows light emitted laterally from the light-emitting element 1 to be reflected upwards, resulting in a light-emitting device 100 with higher frontal brightness. Furthermore, the top 41a of the first protrusion 41 is preferably positioned higher than the top of the light-transmitting member 5 located in the element mounting region 13. This allows light emitted laterally through the light-transmitting member 5 to be reflected.

[0090] Furthermore, the light-emitting device 100 may also have a second protrusion 42 on the upper surface of the second substrate 20 that contacts the covering member 40. In this case, the second protrusion 42 is configured in a frame shape to surround the first substrate 10, and the covering member 40 extends from the upper surface of the first substrate 10 across the upper surface of the second substrate 20, disposed between the first protrusion 41 and the second protrusion 42. That is, the covering member 40 is disposed between the first protrusion 41 on the first substrate 10 that surrounds the element mounting region 13 and the second protrusion 42 on the second substrate 20 that surrounds the substrate mounting region 23. The above-described arrangement of the covering member 40 can be formed by supplying uncured resin constituting the covering member 40 into the frame surrounded by the first protrusion 41 and the second protrusion 42. In other words, the first protrusion 41 and the second protrusion 42 can be used as dams to prevent the flow of uncured resin when the covering member 40 is supplied. As an example, the covering member 40 is disposed in contact with the tops of the first protrusion 41 and the second protrusion 42.

[0091] The first protrusion 41 and the second protrusion 42 can be formed to a predetermined height by arranging multiple uncured resins that overlap in the height direction. For example, a layer of resin adjusted to a predetermined viscosity is applied to the substrate from a nozzle, and this operation is repeated, thereby making the first protrusion 41 and the second protrusion 42 to a predetermined height.

[0092] The first protrusion 41 and the second protrusion 42 can each be either translucent or light-blocking relative to light emitted from the light-emitting element 1 and the translucent member 5. The first protrusion 41 and the second protrusion 42 can be made of the material exemplified as the aforementioned covering member 40. It should be noted that the resin constituting the first protrusion 41 and the second protrusion 42 is preferably a resin with a higher viscosity than the resin constituting the covering member 40. The viscosity of the resin can be adjusted, for example, by adjusting the amount of filler used to adjust the viscosity of the resin.

[0093] The first protrusion 41, when viewed from above, covers the outer edge of the upper surface of the light-transmitting member 5 and is grounded to both the upper surface of the light-transmitting member 5 and the upper surface of the first substrate 10. Specifically, the first protrusion 41 is configured such that the upper surface corresponding to the lower surface of the light-transmitting member 5, which is connected to the upper surface of the first substrate 10, is grounded to the upper surface of the first substrate 10. In this way, by positioning the end of the light-transmitting member 5, including its outer edge, between the lower surface of the first protrusion 41 and the upper surface of the first substrate 10, it is possible to prevent the light-transmitting member 5 from detaching from the first substrate 10, thus improving the tight contact between the light-transmitting member 5 and the first substrate 10. In other words, by having the first protrusion 41, the light-emitting device prevents the light-transmitting member 5 from detaching from the upper surface of the first substrate 10, making it a highly reliable light-emitting device.

[0094] To avoid obstructing light emitted upwards from the light-emitting element 1 via the light-transmitting member 5, the first protrusion 41 is positioned so as not to overlap with the light-emitting element 1 when viewed from above. Furthermore, the first protrusion 41 is preferably configured as a frame surrounding the element mounting area 13, with the inner edge of the frame preferably positioned above the light-transmitting member 5, which contacts the upper surface of the first substrate 10. Moreover, the first protrusion 41 is more preferably positioned at a distance from the step on the upper surface of the light-transmitting member 5 (i.e., not obstructing the step). As a result, the thickness of the light-transmitting member 5 disposed between the first protrusion 41 and the first substrate 10 remains constant, further improving the tight contact between the first protrusion 41 and the first substrate 10.

[0095] Furthermore, the light-transmitting component 5 has a step between the upper surface of the light-transmitting component 5 disposed in the element mounting region 13 and the upper surface of the light-transmitting component 5 covered by the first protrusion 41. That is, the upper surface of the light-transmitting component 5 has a region lower than the element mounting region 13 along the first protrusion 41. As a result, it is possible to suppress the resin components that seep out from the resin-formed first protrusion 41 from wetting and spreading into the element mounting region 13.

[0096] As an example, the light-emitting device 100 with the above structure can be used as a light source for a vehicle's headlights. In this case, for example, a structure is adopted that projects light from the light source to the outside via a lens. The light-emitting device 100 uses an external power switch to illuminate the light-emitting element 1. It should be noted that the light-emitting device 100 is configured to allow some or all of the pre-set light-emitting elements 1 to be driven individually.

[0097] [Manufacturing method of the light-emitting device according to the first embodiment]

[0098] Next, refer to Figure 8 , Figures 9A to 9H The manufacturing method of the light-emitting device will be explained.

[0099] Figure 8This is a flowchart illustrating the manufacturing method of the light-emitting device according to the first embodiment. Figures 9A to 9H This is a top view schematically illustrating the manufacturing method of the light-emitting device according to the first embodiment. It should be noted that the light-emitting elements 1 are placed at predetermined intervals, but... Figure 9C In figures other than the top-down magnified view, intervals are not shown.

[0100] The manufacturing method of the light-emitting device includes: an element placement step S11 in which a light-emitting element is placed in an element placement area on the upper surface of a first substrate; a reflective component placement step S12 in which a reflective component that exposes the upper surface of the light-emitting element and covers the side surface is placed on the first substrate; a light-transmitting component placement step S15 in which a light-transmitting component is placed on the upper surface of the light-emitting element and the reflective component and the outer edge of the lower surface is grounded to the first substrate; and a first protrusion placement step S16 in which a first protrusion is placed extending across the upper surface of the first substrate and the outer edge of the upper surface of the light-transmitting component and along the outer edge of the upper surface of the light-transmitting component. Furthermore, the manufacturing method of the light-emitting device may also include: a substrate mounting step S13 in which a first substrate is mounted on a substrate mounting area on the upper surface of a second substrate; a lead connection step S14 in which a first terminal disposed on the upper surface of the first substrate further outward than the element mounting area and a second terminal disposed on the second substrate further outward than the substrate mounting area are connected by leads; a second protrusion mounting step S17 in which a second protrusion disposed on the second substrate further outward than the second terminal is mounted; and a cover member mounting step S18 in which a light-shielding cover member that is connected to the first protrusion and covers the leads is mounted further outward than the first protrusion. It should be noted that the first protrusion mounting step S16 and the second protrusion mounting step S17 are not sequential and may be performed simultaneously. The following describes each step.

[0101] The component placement process S11 is a process of placing a plurality of light-emitting elements 1 in the component placement area 13 of the first substrate 10. It should be noted that before performing the component placement process S11, it is preferable to prepare the first substrate 10 with wiring such as the first terminal 110 in advance.

[0102] The light-emitting element 1 can be flip-chip mounted on the element mounting area 13 of the first substrate 10 via conductive bonding components such as eutectic solder, conductive paste, bumps, and plating. The light-emitting elements 1 are arranged and mounted in a matrix direction at predetermined intervals in the element mounting area 13. The light-emitting element 1 can be prepared by undergoing some or all of the manufacturing processes such as semiconductor growth. Alternatively, it can be prepared by purchasing.

[0103] The reflective component placement step S12 is a step in which the side surface of the light-emitting element 1 is covered by a reflective component after the light-emitting element 1 is placed in the element placement area 13 of the first substrate 10. Here, after the light-emitting element 1 is placed on the first substrate 10, a reflective component, such as white resin, is placed between the light-emitting elements 1 on the side surface of the light-emitting element 1. The reflective component can be formed by methods such as compression molding, transfer molding, casting, printing, and spraying.

[0104] The substrate placement process S13 is a process of placing the first substrate 10 on the substrate placement area 23 of the second substrate 20. Here, the first substrate 10 on which the light-emitting element 1 is placed is disposed in the substrate placement area 23 of the second substrate 20, for example, by bonding with a bonding material such as Ag. It should be noted that before performing the substrate placement process S13, it is preferable to prepare the second substrate 20 in advance, which is provided with wiring such as the second terminal 120.

[0105] In the lead wire connection process S14, the first terminal 110 of the first substrate 10 is connected to the second terminal 120 of the second substrate 20 by the lead wire 130.

[0106] The lead 130 is preferably connected to the second terminal 120 on the second substrate after being first connected to the first terminal 110 on the first substrate 10. By connecting the lead 130 in the above order, the top of the lead 130 can be positioned closer to the first terminal 110. That is, because the lead 130 can be formed along the step between the first substrate 10 and the second substrate 20, the amount of resin disposed below the lead 130 can be controlled in the masking member placement process S18 described later, and the breakage of the lead 130 caused by the thermal expansion of the masking member can be suppressed.

[0107] The light-transmitting component arrangement step S15 is a step of arranging a light-transmitting component 5 that covers multiple light-emitting elements 1 and reflective components 7, and whose lower surface outer edge is in contact with the upper surface of the first substrate 10. In this step, firstly, an uncured or semi-cured light-transmitting component 5 containing a wavelength conversion component and pre-processed to a predetermined size is prepared and arranged on the light-emitting elements 1 and reflective components 7. At this time, the lower surface outer edge of the light-transmitting component 5 may also be spaced from the upper surface of the first substrate 10. The light-transmitting component 5 can be arranged on the light-emitting elements 1 via a light-transmitting bonding component such as resin, or it can be arranged without a bonding component but by utilizing the adhesiveness of the light-transmitting component. Furthermore, a curing step is performed here to cure the uncured or semi-cured light-transmitting component 5 by heating. In the curing step, the light-transmitting component 5 is heated using a heating device such as an oven. During the curing process, the uncured or semi-cured sheet-like light-transmitting component is temporarily softened by heating, and deforms along the light-emitting element 1 and the reflective component 7 due to its own weight. It is then cured in a state where the outer edge 51 of the lower surface is in contact with the upper surface of the first substrate 10.

[0108] The first protrusion configuration step S16 is a process of configuring a light-transmitting first protrusion 41 across the upper surface of the light-transmitting member 5 and the upper surface of the first substrate 10, between the upper surface of the first substrate 10, i.e., the element placement area 13 and the first terminal 110. In the first protrusion configuration step S16, the first protrusion 41 is configured by supplying uncured resin forming the first protrusion 41 from the nozzle of a dispenser and moving the nozzle along the element placement area 13 of the light-transmitting member 5. It should be noted that the height from the upper surface of the first substrate 10 to the upper surface of the light-transmitting member 5 is lower than the height to the center of the upper surface of the light-transmitting member 5 (i.e., the area directly above the light-emitting element 1) to the outer edge of its upper surface (i.e., the area in contact with the upper surface of the first substrate). The first protrusion 41 covers this lower area. Therefore, when the first protrusion 41 is supplied, the uncured resin forming the first protrusion 41 can be prevented from spreading to the upper surface of the light-transmitting component 5 covering the light-emitting element 1 (that is, the light-emitting surface of the light-emitting device 100).

[0109] In the second protrusion configuration process S17, the second protrusion 42 is configured on the upper surface of the second substrate 20, further outward than the second terminal 120. It should be noted that the first protrusion 41 and the second protrusion 42 are preferably made of the same material, so the first protrusion configuration process S16 and the second protrusion configuration process S17 can be performed as the same process.

[0110] It should be noted that in the first protrusion configuration step S16 and the second protrusion configuration step S17, the second protrusion 42 can be configured first in the second protrusion configuration step S17, and then the first protrusion 41 can be configured in the first protrusion configuration step S16. Alternatively, the first protrusion configuration step S16 can be performed simultaneously with the second protrusion configuration step S17, configuring the first protrusion 41 and the second protrusion 42 approximately simultaneously.

[0111] The masking member arrangement step S18 is a step of arranging a light-shielding masking member 40 that is connected to the first protrusion 41 and covers the lead wire 130, further outward than the first protrusion 41. Specifically, it is a step of arranging a light-shielding masking member 40, which uses a resin with a lower viscosity than the first protrusion 41 and the second protrusion 42 as a base material, between the first protrusion 41 and the second protrusion 42. The masking member 40 is arranged across the first substrate 10 and the second substrate 20. Therefore, the masking member 40 also covers the side of the first substrate 10. It should be noted that the top 40a of the masking member 40 arranged by the masking member arrangement step S18 is formed to be at a position higher than the top 41a of the first protrusion 41. In order to make the top 40a of the masking member 40 at a position higher than the top 41a of the first protrusion 41, as an example, it is preferable to repeatedly supply resin before the supplied resin cures. The supply of the masking member 40 is preferably performed directly above the top of the lead wire. Therefore, the top of the lead wire is easily covered by the shielding component 40.

[0112] In the first protrusion configuration step S16, the second protrusion configuration step S17, and the cover member configuration step S18, for example, the first protrusion 41 and the second protrusion 42 are made of silicone resin, and the cover member 40 is also made of silicone resin. The viscosity of the uncured resin forming the cover member 40 can be adjusted by utilizing the physical properties of the resin used in the resin and by adding fillers to adjust the viscosity. Furthermore, the configuration of the first protrusion 41 and the second protrusion 42 mentioned in this process includes the case of configuring uncured, or preferably temporarily cured, resin material, and is not limited to the case of completion to actual curing.

[0113] <Second Implementation>

[0114] [Structure of the light-emitting device in the second embodiment]

[0115] Next, refer to Figures 10A to 10C The light-emitting device of the second embodiment will be described. Figure 10A This is a schematic top view of the light-emitting device 101 according to the second embodiment. Figure 10B yes Figure 10A A cross-sectional view of the XB-XB line. Figure 10C It is an enlarged representation Figure 10BA partial enlarged sectional view. It should be noted that components with the same structure as those already described are marked with an "H" after the same designation, with appropriate omitting of description.

[0116] The light-emitting device 101 includes: a light-emitting element 1H; a first substrate 10H having an element mounting region 13H on its upper surface where the light-emitting element 1H is disposed; a light-transmitting member 5H covering the light-emitting element 1H, and the outer edge 51 of its lower surface being in contact with the upper surface of the outer side of the element mounting region 13H of the first substrate 10H; and a first protrusion 41H extending across the upper surface of the first substrate 10H and the upper surface of the light-transmitting member 5H, and being disposed along the outer edge 51 of the upper surface of the light-transmitting member 5H.

[0117] The first substrate 10H has a component mounting region 13H on its upper surface, and wiring for connecting to the light-emitting element 1H is disposed in the component mounting region 13H. In addition, the wiring of the first substrate 10H for making electrical connections with the second substrate or the outside is disposed at at least one position on the lower surface, the side surface, or the outer edge of the upper surface of the substrate.

[0118] The light-transmitting member 5H extends from the upper surface of the light-emitting element 1H and is disposed on the upper surface outside the element mounting area of ​​the first substrate 10H, such that the outer edge 51 of its lower surface is in contact with the upper surface of the first substrate 10H. As described in the first embodiment, the light-transmitting member 5H can be, for example, a light-transmitting resin such as silicone resin. Additionally, the light-transmitting member 5H may contain a wavelength conversion component. Viewed from above, the light-transmitting member 5H is disposed such that it at least internally includes the upper surface of one light-emitting element 1H, and extends to the upper surface of the first substrate 10H, with the outer edge of its lower surface in contact with the upper surface of the first substrate 10H. It should be noted that the outer edge 51 of the light-transmitting member 5H is preferably located at a distance W1 from the outer edge of the light-emitting element 1H, which is at least twice the thickness D1 of the light-emitting element 1H.

[0119] Furthermore, the first protrusion 41H is configured to span the outer edge 51 of the upper surface of the light-transmitting member 5H and the upper surface of the first substrate 10H. As an example, such as... Figure 10BAs shown, the first protrusion 41H is preferably configured such that approximately half of its lower surface covers the outer edge 51 of the upper surface of the light-transmitting member 5H, and the remaining approximately half is grounded to the upper surface of the first substrate 10H, as observed in cross-section. It should be noted that in the light-emitting device 101, the light-transmitting member 5H can also be configured such that a reflective member is disposed on the side with the upper surface of the light-emitting element 1H exposed. When a reflective member is disposed, the light-transmitting member 5H covers the upper surface of the light-emitting element 1H, the upper surface and side of the reflective member, and is grounded to the upper surface of the first substrate 10H. By configuring the first protrusion 41H to cover the outer edge 51 of the upper surface of the light-transmitting member 5H, in other words, by configuring the end of the light-transmitting member 5H between the first protrusion 41H and the first substrate 10H, the close contact between the light-transmitting member 5H and the first substrate 10H is improved, resulting in a highly reliable light-emitting device 101. It should be noted that the first protrusion 41H is preferably positioned at a location separate from the step of the light-transmitting component 5H formed by covering the light-emitting element 1H with the light-transmitting component 5H.

[0120] [Manufacturing method of the light-emitting device according to the second embodiment]

[0121] Next, refer to Figure 11 , Figures 12A to 12D The manufacturing method of the light-emitting device 101 will be described. Figure 11 This is a flowchart illustrating the manufacturing method of the light-emitting device according to the second embodiment. Figures 12A to 12D This is a cross-sectional view schematically illustrating the manufacturing method of the light-emitting device according to the second embodiment.

[0122] The manufacturing method of the light-emitting device 101 includes: an element placement step S21, a light-transmitting component arrangement step S22, a light-transmitting component curing step S23, and a first protrusion arrangement step S24. It should be noted that the manufacturing method of the light-emitting device 101 may also include a reflective component arrangement step between the element placement step S21 and the light-transmitting component arrangement step S22.

[0123] The component placement process S21 is a process of placing the light-emitting element 1H in the component placement area 13H of the first substrate 10H. The light-emitting element 1H can be mounted in the component placement area 13H on the first substrate 10H, for example via conductive bonding components such as eutectic solder, conductive paste, bumps, and plating, using a flip chip.

[0124] The light-transmitting component arrangement step S22 is the step of arranging a light-transmitting component 5H covering the upper surface of the light-emitting element 1H. The light-transmitting component 5H can be, for example, a component made by processing resin containing a wavelength conversion component into a sheet shape. Specifically, an uncured light-transmitting component 5H pre-processed into a sheet shape of a predetermined size is prepared and arranged on the light-emitting element 1H. The light-transmitting component 5H can be fixed to the light-emitting element 1H via a light-transmitting bonding component such as resin, or it can be fixed by the adhesive properties of the light-transmitting component without a bonding component. The light-transmitting component 5H uses a component with an area larger than the upper surface of the light-emitting element 1H so that the outer edge of its lower surface is in contact with the upper surface of the first substrate 10H during the softening process in the next step.

[0125] For example, when the light-emitting element 1H is roughly rectangular in shape when viewed from above, the light-transmitting component 5H is roughly rectangular in shape when viewed from above. When covering the upper surface of the light-emitting element 1H, the distance W1 between the outer edge of the light-transmitting component 5H and the outer edge of the light-emitting element is preferably formed to be more than twice the height D1 of the side of the light-emitting element 1H.

[0126] The light-transmitting component curing step S23 is a step in which the light-transmitting component 5H disposed on the light-emitting element 1H is deformed so that the outer edge 51 of its lower surface is in contact with the first substrate 10H, and then the light-transmitting component 5H is cured. In the light-transmitting component curing step S23, the light-transmitting component 5H is cured by heating. In the light-transmitting component curing step S23, the uncured sheet-like light-transmitting component 5H is softened by heating and deformed along the upper surface and side surface of the light-emitting element 1H, and then cured while the outer edge 51 of the lower surface of the light-transmitting component 5H is in contact with the upper surface of the first substrate 10H.

[0127] The first protrusion configuration step S24 is a process of configuring the first protrusion 41H along the outer edge 51 of the upper surface of the light-transmitting member 5H, extending across the upper surface of the first substrate 10H and the upper surface of the light-transmitting member 5H. In the first protrusion configuration step S24, the first protrusion 41H is configured by supplying uncured resin for forming the first protrusion 41H from the nozzle of the dispenser and moving the nozzle along the outer edge 51 of the upper surface of the light-transmitting member 5H. Here, the height of the upper surface of the light-transmitting member 5H (that is, the distance from the upper surface of the first substrate to the upper surface of the light-transmitting member 5H) is lower at the outer edge of the upper surface of the light-transmitting member 5H that is in contact with the first substrate 10H compared to the height of the upper surface of the light-transmitting member 5H located on the light-emitting element 1H. As a result, when configuring the first protrusion 41H, it is difficult for the uncured resin forming the first protrusion to spread to the upper surface of the light-transmitting member 5H.

[0128] The light-emitting device 101 can be manufactured through the above-described processes. It should be noted that the light-emitting device 101 can also be used by placing the first substrate 10H on a second substrate.

[0129] (Modified Example)

[0130] It should be noted that, as Figure 13 As shown, the light-emitting device 100D may also have a recess 24 on the upper surface of the second substrate 20D, and a substrate mounting area 23D is provided in the recess 24. Figure 13 This is a schematic cross-sectional view illustrating a variation of the first embodiment. The structures already described are referred to using the same reference numerals. Thus, by having a recess 24 constituting the substrate mounting region 23D in the second substrate 20D, the overall thickness of the light-emitting device 100D can be reduced.

[0131] Furthermore, in the various light-emitting devices already described, the first protrusion may also be configured as a partial arrangement, for example, a structure in which it is arranged in a straight line along the opposite edge of the light-transmitting member. In this case, the first protrusion also extends across the outer edge of the upper surface of the light-transmitting member and the upper surface of the first substrate.

[0132] The light-emitting device and its manufacturing method of the present invention have been specifically described above using methods for implementing the invention. However, the scope of the present invention is not limited to the above description and must be interpreted broadly based on the scope of the technical solution. Furthermore, various modifications and alterations based on the above description are naturally included within the scope of the present invention.

[0133] Industrial applicability

[0134] The light-emitting devices 100, 100D, and 101 of the embodiments of this disclosure can be used in various light sources such as vehicle headlights, projectors, and lighting.

[0135] Explanation of reference numerals in the attached figures

[0136] 1 Light-emitting element; 5 Light-transmitting component; 7 Reflective component; 10 First substrate; 110 First terminal; 13 Element placement area; 20, 20D Second substrate; 120 Second terminal; 23 Substrate placement area; 24 Recess; 130 Lead; Top of 130a Lead; 31 First lead; 32 Second lead; 33 Third lead; 40 Covering component; 41 First protrusion; 42 Second protrusion; 100, 101, 100D Light-emitting device; S11 Element placement process; S12 Reflective component arrangement process; S13 Substrate placement process; S14 Lead connection process; S15 Light-transmitting component arrangement process; S16 First protrusion arrangement process; S17 Second protrusion arrangement process; S18 Covering component arrangement process.

Claims

1. A light-emitting device, characterized in that, have: Light-emitting elements; A first substrate having an element placement area on its upper surface on which the light-emitting element is placed; A light-transmitting component, which is a sheet-shaped light-transmitting component covering the light-emitting element, and the outer edge of the lower surface is in contact with the upper surface of the outer side of the element placement area of ​​the first substrate; A first protrusion extends across the upper surface of the first substrate and the upper surface of the light-transmitting member, is disposed along the outer edge of the upper surface of the light-transmitting member, and has a top that is higher than the upper surface of the light-emitting element.

2. The light-emitting device as described in claim 1, characterized in that, The first protrusion is configured to surround the component mounting area.

3. The light-emitting device as described in claim 1 or 2, characterized in that, The light-transmitting component is rectangular when viewed from above. The first protrusion is configured as a rectangular frame when viewed from above.

4. The light-emitting device as described in any one of claims 1 to 3, characterized in that, The light-emitting elements are arranged and configured in multiples in the element placement area.

5. The light-emitting device as described in any one of claims 1 to 4, characterized in that, It has a reflective component that exposes the upper surface of the light-emitting element and covers the sides. The light-transmitting component covers the light-emitting element and the reflective component.

6. The light-emitting device as described in any one of claims 1 to 5, characterized in that, The top of the first protrusion is positioned higher than the top of the light-transmitting component.

7. The light-emitting device according to any one of claims 1 to 6, characterized in that, The light-transmitting component contains a phosphor.

8. The light-emitting device according to any one of claims 1 to 7, characterized in that, It also has: The second substrate has a substrate placement area on which the first substrate is placed on its upper surface. A lead wire is provided, wherein a first terminal disposed on the upper surface of the first substrate further outward than the component placement area is connected to a second terminal disposed on the upper surface of the second substrate further outward than the substrate placement area. A covering component that covers the lead wire; The covering component is connected to the first protrusion and is positioned further outward than the first protrusion.

9. The light-emitting device as described in claim 8, characterized in that, The upper surface of the second substrate has a second protrusion that connects with the covering member. The second protrusion is configured to surround the first substrate. The covering component is disposed between the first protrusion and the second protrusion.

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