Resonant sensors, batteries, battery packs, and energy storage systems

Abstract

The present application provides a resonant sensor, battery, battery pack, and energy storage system. A first substrate is disposed outside the sensor body and protects the sensor body. Within the sensor body, a second substrate and a third substrate are stacked. The third substrate includes a first conductor portion and a second conductor portion. The first conductor portion and the second conductor portion are both located on a side of the third substrate away from the second substrate, and a first hollow portion is defined between the first conductor portion and the second conductor portion. The first hollow portion is used to isolate the first conductor portion from the second conductor portion. One or more sensitive elements are disposed on the outside of the first and second conductor portions away from the second substrate, and each sensitive element is electrically connected to the first and second conductor portions. A support component is disposed on the outside of the third substrate away from the second substrate and is used to support the first substrate. Because the first, second, and third substrates are all flexible substrates, the resonant sensor can operate in environments requiring flexibility.

Description

Technical Field

[0001] The present application relates to the field of microelectronic devices, and in particular to a resonant sensor, a battery, a battery pack, and an energy storage system. Background Art

[0002] Currently, resonant sensors consist of a sensor housing, a sensitive element, and a substrate for protecting the sensitive element, and are manufactured using rigid packaging technology. The sensitive element and the substrate for protecting the sensitive element are housed within the sensor housing, and both are made of rigid materials. Due to the poor ductility of rigid materials, resonant sensors cannot withstand significant deformation. Consequently, when placed in environments requiring flexible features (such as flexible electronic systems or flexible circuits), resonant sensors suffer from poor detection performance or may even fail to function properly. Summary of the Invention

[0003] The present application provides a resonant sensor, a battery, a battery pack, and an energy storage system, which enable the resonant sensor to operate in an environment with flexible feature requirements, and improve the detection performance of the resonant sensor, with strong applicability.

[0004] In a first aspect, the present application provides a resonant sensor comprising a sensor body and a first substrate. The first substrate is disposed outside the sensor body and serves to protect the sensor body. The sensor body comprises a second substrate, a third substrate, a support member, and one or more sensitive elements. The first, second, and third substrates are all flexible substrates, enabling the resonant sensor to operate in environments requiring flexibility, thereby expanding the application areas and scenarios of resonant sensors. In the sensor body, the second and third substrates are stacked. The third substrate comprises a first conductor portion and a second conductor portion. The first and second conductor portions are both located on a side of the third substrate away from the second substrate, and a first hollow portion is defined between the first and second conductor portions. The first hollow portion serves to isolate the first and second conductor portions, thereby preventing short circuits in the resonant sensor. One or more sensitive elements are disposed on the outside of the first and second conductor portions, away from the second substrate, and each sensitive element is electrically connected to the first and second conductor portions. In this case, the third substrate serves as an electrical connection carrier for the one or more sensitive elements and physically protects the one or more sensitive elements, thereby improving the stability and reliability of the sensitive elements. The supporting component is arranged on the outer side of the third substrate away from the second substrate and is used to support the first substrate so as to isolate the first substrate and one or more sensitive elements. The first substrate can also physically protect the one or more sensitive elements, thereby improving the stability and reliability of the sensitive elements and further improving the detection performance of the resonant sensor.

[0005] In combination with the first aspect, in a first possible implementation, the flexible substrate includes a high molecular polymer.

[0006] In conjunction with the first aspect or the first possible implementation manner of the first aspect, in a second possible implementation manner, the support component includes M sub-support portions. Each of the one or more sensitive elements corresponds to at least two sub-support portions. Each sensitive element has at least one sub-support portion at one end electrically connected to the first conductor portion, and also has at least one sub-support portion at the other end electrically connected to the second conductor portion. The M sub-support portions are used to support the first substrate to isolate the first substrate from the one or more sensitive elements, thereby improving the stability and reliability of the sensitive elements and further enhancing the detection performance of the resonant sensor.

[0007] In conjunction with the second possible implementation manner of the first aspect, in a third possible implementation manner, at least two sub-support portions corresponding to each sensitive element are used to bond to the corresponding sensitive element. The at least two sub-support portions are used to support the first substrate to isolate the first substrate from the corresponding sensitive element, thereby improving the stability and reliability of the sensitive element and further enhancing the detection performance of the resonant sensor.

[0008] In conjunction with the third possible implementation manner of the first aspect, in a fourth possible implementation manner, at least two sub-support portions corresponding to each sensitive element are bonded to an outer surface of the corresponding sensitive element away from the third substrate. The at least two sub-support portions are used to support the first substrate to isolate the first substrate from the corresponding sensitive element, thereby improving the stability and reliability of the sensitive element and further enhancing the detection performance of the resonant sensor.

[0009] In combination with the third possible implementation manner of the first aspect or the fourth possible implementation manner of the first aspect, in a fifth possible implementation manner, at least two sub-support portions corresponding to each sensitive element are bonded to an end of the corresponding sensitive element that is away from the outer surface of the third substrate. The at least two sub-support portions are used to support the first substrate to isolate the first substrate from the corresponding sensitive element, thereby improving the stability and reliability of the sensitive element and further enhancing the detection performance of the resonant sensor.

[0010] In combination with any one of the third possible implementation of the first aspect to the fifth possible implementation of the first aspect, in one possible implementation, the thickness of each of the at least two sub-support portions may be greater than or equal to 25 μm and less than or equal to 100 μm, and the length and width of each sub-support portion may be greater than or equal to 1 mm and less than or equal to 3 mm.

[0011] In conjunction with the second possible implementation manner of the first aspect, in a sixth possible implementation manner, the thickness of the at least two sub-support portions corresponding to each sensitive element is greater than the thickness of the corresponding sensitive element, and the at least two sub-support portions are disposed outside the corresponding sensitive element and bonded to the third substrate. The at least two sub-support portions are used to support the first substrate to isolate the first substrate from the corresponding sensitive element, thereby improving the stability and reliability of the sensitive element and further enhancing the detection performance of the resonant sensor.

[0012] In conjunction with the sixth possible implementation manner of the first aspect, in a seventh possible implementation manner, at least two sub-support portions corresponding to each sensitive element are disposed outside the corresponding sensitive element and spaced apart from the corresponding sensitive element. The at least two sub-support portions are used to support the first substrate to isolate the first substrate from the corresponding sensitive element, thereby improving the stability and reliability of the sensitive element and further enhancing the detection performance of the resonant sensor.

[0013] In conjunction with the seventh possible implementation manner of the first aspect, in one possible implementation manner, the distance between each of the at least two sub-support portions and the corresponding sensitive element is greater than or equal to 2 mm and less than or equal to 2.5 mm. The thickness of each of the at least two sub-support portions is 1.5 to 2 times the thickness of the corresponding sensitive element, and the area of ​​each sub-support portion is greater than or equal to 1 mm x 2 mm and less than or equal to 1.5 mm x 2.5 mm.

[0014] In conjunction with the sixth possible implementation manner of the first aspect, in an eighth possible implementation manner, at least two sub-support portions corresponding to each sensitive element are wedge-shaped support portions, the at least two sub-support portions are disposed outside the corresponding sensitive element, and the wedge-shaped surfaces of the at least two sub-support portions engage with the ends of the corresponding sensitive element. The at least two sub-support portions are used to support the first substrate to isolate the first substrate from the corresponding sensitive element, thereby improving the stability and reliability of the sensitive element and thereby enhancing the detection performance of the resonant sensor. Furthermore, the wedge-shaped surfaces reduce the force applied to the corresponding sensitive element, further improving the detection performance of the resonant sensor.

[0015] In combination with any one of the second possible implementation manner of the first aspect to the eighth possible implementation manner of the first aspect, in a ninth possible implementation manner, each sensitive element in at least one of the one or more sensitive elements corresponds to two sub-support parts, and the two sub-support parts are symmetrically arranged, which can improve the stability of the entire sensor structure.

[0016] In combination with the first aspect or the second possible implementation of the first aspect, in a tenth possible implementation, the support component includes at least one second hollow portion, each of the at least one second hollow portion penetrates the support component along the thickness direction of the support component, the thickness of the support component is greater than the thickness of each of the one or more sensitive elements, and the support component is used to bond to the third substrate. Each sensitive element is correspondingly arranged in an area enclosed by the end of a second hollow portion. The support component is used to support the first substrate to isolate the first substrate and the one or more sensitive elements, thereby improving the stability and reliability of the sensitive elements, thereby improving the detection performance of the resonant sensor.

[0017] In combination with the tenth possible implementation of the first aspect, in one possible implementation, the thickness of the supporting component is 1.5 to 2 times the thickness of each sensitive element in one or more sensitive elements, and the area of ​​the second hollow portion corresponding to each sensitive element is 1.2 times the area of ​​the corresponding sensitive element.

[0018] In combination with any one of the first aspect to the tenth possible implementation of the first aspect, in an eleventh possible implementation, the first substrate includes a protective portion and two connecting portions, wherein the two ends of the protective portion are fixedly contacted with the second substrate to form a protective space, the third substrate, one or more sensitive elements, and a supporting component are disposed within the protective space, and each of the two connecting portions is used to fixedly connect to one end of the protective portion and one end of the second substrate. The protective space is used to physically protect the third substrate, one or more sensitive elements, and the supporting component, and the protective portion and the two connecting portions are used together to physically protect the second substrate, thereby improving the reliability of the resonant sensor and extending the service life of the resonant sensor.

[0019] In conjunction with the eleventh possible implementation manner of the first aspect, in a twelfth possible implementation manner, the resonant sensor includes a first cavity, the first cavity being enclosed by a surface of the one or more sensitive elements facing the protective portion, the support member, and the protective portion. It will be appreciated that the first cavity is located above the one or more sensitive elements and is used to reduce the force applied to the one or more sensitive elements, thereby further improving the detection performance of the resonant sensor.

[0020] In combination with any one of the first aspect to the twelfth possible implementation manner of the first aspect, in a thirteenth possible implementation manner, the resonant sensor includes a second cavity, where the second cavity is enclosed by the first conductor portion, the second conductor portion, one or more sensitive elements, and an area on the second substrate corresponding to the first hollow portion. It will be appreciated that the second cavity is located below the one or more sensitive elements and is used to reduce the force applied to the one or more sensitive elements, thereby further improving the detection performance of the resonant sensor.

[0021] In combination with any one of the first aspect to the thirteenth possible implementation manner of the first aspect, in a fourteenth possible implementation manner, each of the one or more sensitive elements includes a crystal oscillator, a first electrode, and a second electrode, the first electrode and the second electrode being disposed oppositely to each other on either side of the crystal oscillator. The first electrode of each sensitive element is electrically connected to the first conductor portion, and the second electrode of each sensitive element is electrically connected to the second conductor portion, thereby improving the reliability and stability of each sensitive element.

[0022] In combination with any one of the first aspect to the fourteenth possible implementation manner of the first aspect, in a fifteenth possible implementation manner, when the resonant sensor includes multiple sensitive elements, the multiple sensitive elements are arranged on an outer side of the first conductor portion and the second conductor portion away from the second substrate to form one or more sensitive element arrays. The one or more sensitive element arrays are used to implement arrayed detection of the resonant sensor, which has greater applicability.

[0023] In conjunction with the fifteenth possible implementation of the first aspect, in one possible implementation, for each of the one or more sensitive element arrays, the row and column spacing of the sensitive elements in each sensitive element array is greater than or equal to 5.5 mm and less than or equal to 30.5 mm, and the distance between the edge of each sensitive element array and the edge of the third substrate is greater than or equal to 2.5 mm and less than or equal to 7.5 mm. It will be understood that at least one sensitive element array manufactured according to the above-mentioned dimensional parameters meets the technical requirements for the preparation of small-element, high-density, large-scale array devices, while also achieving a high number of parameter perceptions to achieve arrayed detection of resonant sensors, thus having greater applicability.

[0024] In combination with any one of the first aspect to the fifteenth possible implementation manner of the first aspect, in one possible implementation manner, the thickness of each of the first substrate, the second substrate and the third substrate is greater than or equal to 25 μm and less than or equal to 100 μm, the length and width of each substrate is greater than or equal to 25 mm and less than or equal to 160 mm, and the thickness of each of the first conductor portion and the second conductor portion is greater than or equal to 5 μm and less than or equal to 35 μm.

[0025] In combination with any one of the first aspect to the fifteenth possible implementation manner of the first aspect, in one possible implementation manner, the thickness of each of the one or more sensitive elements is greater than or equal to 100 μm and less than or equal to 600 μm. When the shape of at least one of the one or more sensitive elements is rectangular, the area of ​​each of the at least one sensitive element is greater than or equal to 2.8 mm x 4 mm and less than or equal to 5.5 mm x 3.5 mm. When the shape of at least one sensitive element is circular, the diameter of each of the at least one sensitive element is greater than or equal to 3 mm and less than or equal to 6 mm.

[0026] In a second aspect, the present application provides a battery comprising a positive electrode, a negative electrode, and a resonant sensor provided in any one of the first through fifteenth possible embodiments of the first aspect, wherein the positive electrode is electrically connected to a first conductor portion of the resonant sensor, and the negative electrode is electrically connected to a second conductor portion of the resonant sensor. Because resonant sensors are more flexible, they are more compatible with the corrosive electrochemical environment within the battery, thereby not affecting the performance and accuracy of the resonant sensor. Furthermore, resonant sensors are smaller in size, have little impact on the battery's capacity, and facilitate industrial production of batteries.

[0027] In a third aspect, the present application provides a battery pack comprising a plurality of batteries connected in series or in parallel. Each of the plurality of batteries includes a resonant sensor provided in any one of the first through fifteenth possible implementations of the first aspect. The resonant sensor in each battery can be used to collect internal battery parameters of each battery to determine whether each battery is experiencing thermal runaway, thereby improving the safety and reliability of the battery pack and extending its service life.

[0028] In a fourth aspect, the present application provides an energy storage system, comprising a battery pack and a DC converter, wherein the battery pack includes a plurality of batteries, and each of the plurality of batteries includes a resonant sensor provided in any one of the possible implementations of aspects 1 to 15 above. During power supply by the energy storage system, the resonant sensor in each battery can collect internal groundwater parameters of each battery to determine whether each battery is experiencing thermal runaway, thereby improving the power supply safety and reliability of the energy storage system.

[0029] In a fifth aspect, the present application provides a method for preparing a resonant sensor, which is performed by an apparatus having a resonant sensor manufacturing function (hereinafter referred to as a sensor manufacturing apparatus). In this method, the sensor manufacturing apparatus can form a polymer into a first substrate, a second substrate, and a third substrate, and form one or more sensitive elements and a support component, wherein the first substrate, the second substrate, and the third substrate are all flexible substrates. The sensor manufacturing apparatus can form a sensor body from the second substrate, the third substrate, the one or more sensitive elements, and the support component, wherein the second substrate and the third substrate are stacked, the third substrate includes a first conductor portion and a second conductor portion, the first conductor portion and the second conductor portion are both located on a side of the third substrate away from the second substrate, and a first hollow portion is provided between the first conductor portion and the second conductor portion, the first hollow portion being used to separate the first conductor portion and the second conductor portion; one or more sensitive elements are provided on an outer side of the third substrate away from the second substrate, and each sensitive element is electrically connected to the first conductor portion and the second conductor portion; the support component is provided on an outer side of the third substrate away from the second substrate and is used to support the first substrate to isolate the first substrate and the one or more sensitive elements. Furthermore, the sensor manufacturing equipment can form a resonant sensor with the sensor body and the first substrate, wherein the first substrate is disposed outside the sensor body and serves to protect the sensor body. In this application, a resonant sensor with a flexible package can be manufactured to operate in environments requiring flexibility, thereby expanding the application fields and scenarios of resonant sensors and improving the detection performance of resonant sensors, thereby enhancing their applicability.

[0030] In the present application, the resonant sensor can work in an environment with flexible feature requirements, thereby expanding the application fields and application scenarios of the resonant sensor and having strong applicability; in addition, the supporting component can prevent the first substrate from directly contacting one or more sensitive elements, and the first substrate can also physically protect one or more sensitive elements, thereby improving the stability and reliability of the sensitive elements, and further improving the detection performance of the resonant sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 This is a structural block diagram of the resonant sensor provided by this application;

[0032] Figure 2A is a graphical diagram of the first conductor portion provided by the present application;

[0033] Figure 2B is a graphical schematic diagram of the second conductor portion provided by the present application;

[0034] Figure 2C is a structural schematic diagram of the third substrate provided by this application;

[0035] Figure 3Ais another graphical schematic diagram of the first conductor portion provided by the present application;

[0036] Figure 3B is a graphical diagram of the second conductor portion provided by the present application;

[0037] Figure 3C is another structural schematic diagram of the third substrate provided by this application;

[0038] Figure 4A is a top view of the rectangular sensitive element provided by this application;

[0039] Figure 4B It is the main view of the rectangular sensitive element provided by this application;

[0040] Figure 5A is a top view of the circular sensitive element provided by this application;

[0041] Figure 5B This is the main view of the circular sensitive element provided by this application;

[0042] Figure 6 This is a schematic structural diagram of a resonant sensor provided by the present application;

[0043] Figure 7 This is a structural diagram of the sensor body provided by this application;

[0044] Figure 8 is another structural schematic diagram of the sensor body provided by this application;

[0045] Figure 9 is another structural schematic diagram of the sensor body provided by this application;

[0046] Figure 10A is another structural schematic diagram of the sensor body provided by this application;

[0047] Figure 10B is a top view of the sensor body provided by this application;

[0048] Figure 11 is another structural schematic diagram of the resonant sensor provided by this application;

[0049] Figure 12 This is a front view of the resonant sensor provided by the present application;

[0050] Figure 13 is another structural schematic diagram of the sensor body provided by this application;

[0051] Figure 14 This is a front view of the sensor body provided by this application;

[0052] Figure 15It is a structural block diagram of the battery provided by this application;

[0053] Figure 16 This is a structural block diagram of the battery pack provided by this application;

[0054] Figure 17 It is a structural block diagram of the energy storage system provided by this application;

[0055] Figure 18 It is a schematic flow chart of the method for preparing the resonant sensor provided in this application;

[0056] Figure 19 This is a schematic structural diagram of the sensor body provided by the present application without the second substrate;

[0057] Figure 20 This is a schematic diagram of the force analysis of the sub-support portion provided in this application;

[0058] Figure 21A This is a structural diagram of the sensor base provided by this application;

[0059] Figure 21B This is a schematic structural diagram of a sensor base having one or more sensitive elements provided by the present application;

[0060] Figure 21C This is a schematic structural diagram of a resonant sensor provided by the present application;

[0061] Figure 22A is another structural schematic diagram of the sensor base provided by this application;

[0062] Figure 22B This is another structural schematic diagram of a sensor base with one or more sensitive elements provided by the present application;

[0063] Figure 22C This is another structural diagram of the resonant sensor provided by this application. DETAILED DESCRIPTION

[0064] The resonant sensor provided in this application is suitable for environmental monitoring, traffic management, medical health, agriculture and animal husbandry, fire safety, production and manufacturing, aerospace, electronic products and other fields.

[0065] The resonant sensor, battery, battery pack and energy storage system provided in this application will be described below with reference to the accompanying drawings.

[0066] See also Figure 1 , Figure 1 This is a structural block diagram of the resonant sensor provided by this application. Figure 1As shown, the resonant sensor 1 includes a sensor body 10 and a first substrate 20. The first substrate 20 is disposed outside the sensor body 10 and is used to protect the sensor body 10. The outside of the sensor body 10 refers to the side outside the sensor body 10 and in contact with the sensor body 10. It will be understood that the first substrate 20 can physically protect the sensor body 10, thereby improving the stability and reliability of the resonant sensor 1 and extending the service life of the resonant sensor 1.

[0067] The sensor body 10 includes a second substrate 100, a third substrate 101, sensitive elements 102a to 102n, and a support member 103. The first substrate 20, the second substrate 100, and the third substrate 101 are all flexible substrates. Therefore, the resonant sensor 1 can operate in environments requiring flexibility, thereby expanding the application areas and application scenarios of the resonant sensor 1 and enhancing its applicability. The flexible substrate includes a polymer, including but not limited to at least one of polyimide (PI), polyvinylidene fluoride (PVDF), polyethylene (PE), and polypropylene (PP).

[0068] In the sensor body 10, the second substrate 100 and the third substrate 101 are stacked. The third substrate 101 includes a first conductor portion 1011 and a second conductor portion 1012. Both the first conductor portion 1011 and the second conductor portion 1012 are located on one side of the third substrate 101, specifically on the side of the third substrate 101 away from the second substrate 100. A first hollow portion 104 is defined between the first conductor portion 1011 and the second conductor portion 1012. This hollow portion 104 serves to isolate the first conductor portion 1011 and the second conductor portion 1012 from contact, thereby preventing short circuits in the resonant sensor 1. In one embodiment, both the first conductor portion 1011 and the second conductor portion 1012 are located on the side of the third substrate 101 facing away from the second substrate 100.

[0069] Sensitive elements 102a through 102n are disposed outside the first and second conductor portions 1011 and 1012, specifically outside the first and second conductor portions 1011 and 1012, away from the second substrate 100. Each sensitive element is electrically connected to the first and second conductor portions 1011 and 1012. The term "outside" of the first and second conductor portions 1011 and 1012 refers to a side that is external to and electrically connected to the first and second conductor portions 1011 and 1012. It will be appreciated that the third substrate 101 serves as an electrical connection carrier for the sensitive elements 102a through 102n and physically protects the sensitive elements 102a through 102n, thereby improving the stability and reliability of the sensitive elements 102a through 102n. In one embodiment, the sensitive elements 102 a to 102 n are specifically disposed on the outer sides of the first conductor portion 1011 and the second conductor portion 1012 away from the second substrate 100 .

[0070] The support member 103 is disposed outside the third substrate 101, specifically outside the third substrate 101 away from the second substrate 100, and is used to support the first substrate 20, thereby isolating the first substrate 20 and the sensitive elements 102a through 102n, where isolation means no contact. It will be understood that the support member 103 prevents the sensitive elements 102a through 102n from directly contacting the first substrate 20, and the first substrate 20 physically protects the sensitive elements 102a through 102n, thereby improving the stability and reliability of the sensitive elements 102a through 102n and further enhancing the detection performance of the resonant sensor 1.

[0071] In one embodiment, the thickness of each of the first substrate 20, the second substrate 100, and the third substrate 101 is greater than or equal to 25 μm and less than or equal to 100 μm, and the length and width of each substrate is greater than or equal to 25 mm and less than or equal to 160 mm.

[0072] In one embodiment, the length and width of each of the first substrate 20, the second substrate 100, and the third substrate 101 may be the same or different. The shapes of the first substrate 20, the second substrate 100, and the third substrate 101 include, but are not limited to, at least one of a square, a rectangle, and an irregular shape, and may be determined by the actual processing technology and operational requirements of the resonant sensor 1.

[0073] In one embodiment, the first conductor portion 1011 and the second conductor portion 1012 are made of materials including, but not limited to, aluminum (Al), gold (Au), platinum (Pt), copper (Cu), platinum titanium (PtTi), AuPtTi, or NiCr. The thickness of each of the first conductor portion 1011 and the second conductor portion 1012 is greater than or equal to 5 μm and less than or equal to 35 μm.

[0074] In one embodiment, the first conductor portion 1011 and the second conductor portion 1012 can be made by a flexible printed circuit board process. The flexible printed circuit board process refers to a process for making the first conductor portion 1011 and the second conductor portion 1012 by using a photoimaging pattern transfer and etching process on the surface of the third substrate 101, wherein the surface of the third substrate 101 refers to the surface of the third substrate 101 facing away from the second substrate 100.

[0075] In one embodiment, the pattern of the first conductor portion 1011 and the pattern of the second conductor portion 1012 may be determined by the number and arrangement of the sensitive elements 102 a to 102 n , which is not limited herein.

[0076] In one embodiment, when the resonant sensor 1 includes multiple sensitive elements (such as the sensitive elements 102a to 102n described above), the sensitive elements 102a to 102n are arranged outside the first conductor portion 1011 and the second conductor portion 1012 away from the second substrate 100 to form one or more sensitive element arrays. The one or more sensitive element arrays are used to implement arrayed detection of the resonant sensor 1, which has greater applicability.

[0077] In one embodiment, the number and arrangement of sensitive elements 102a through 102n are determined by the array order of one or more sensitive element arrays, where the array order of each sensitive element array can be expressed as the number of rows of each sensitive element array x the number of columns of each sensitive element array, where both the number of rows and the number of columns of each sensitive element array are positive integers. When sensitive elements 102a through 102n form a sensitive element array, and the array order of the sensitive element array is 3 x 3, the number of sensitive elements 102a through 102n is 9, and the arrangement is 3 rows and 3 columns. When the array order of the sensitive element array is 4 x 4, the number of sensitive elements 102a through 102n is 16, and the arrangement is 4 rows and 4 columns.

[0078] In one embodiment, for each of the one or more sensitive element arrays, the row and column spacing of the sensitive elements in each sensitive element array is greater than or equal to 5.5 mm and less than or equal to 30.5 mm, and the distance between the edge of each sensitive element array and the edge of the third substrate 101 is greater than or equal to 2.5 mm and less than or equal to 7.5 mm. It can be understood that the one or more sensitive element arrays manufactured according to the above-mentioned dimensional parameters meet the technical requirements for the preparation of small-dimension, high-density, large-scale array devices, and can also obtain a high number of parameter perceptions to achieve array detection of the resonant sensor 1, thereby enhancing applicability.

[0079] In one embodiment, when the number of the sensitive elements 102a to 102n is 16 and the arrangement is 4 rows and 4 columns, the pattern of the first conductor portion 1011 can be seen in FIG. Figure 2A , Figure 2A This is a diagram of a first conductor portion provided by this application. Figure 2A As shown, the first conductor portion 1011 includes a plurality of square sensitive element electrodes 10111. The number of the sensitive element electrodes 10111 in the first conductor portion 1011 is the same as the number of the sensitive elements 102a to 102n. For example, the number of the sensitive element electrodes 10111 can be 16.

[0080] In one embodiment, when the number of the sensitive elements 102a to 102n is 16 and the arrangement is 4 rows and 4 columns, the pattern of the second conductor portion 1012 can be seen in FIG. Figure 2B , Figure 2B : is a schematic diagram of the second conductor portion provided by this application. Figure 2B As shown, the second conductor portion 1012 includes a plurality of square sensitive element electrodes 10121. The number of the sensitive element electrodes 10121 in the second conductor portion 1012 is the same as the number of the sensitive elements 102a to 102n. For example, the number of the sensitive element electrodes 10121 can be 16.

[0081] In one embodiment, each sensitive element among the sensitive elements 102a to 102n corresponds to a sensitive element electrode 10111 and a sensitive element electrode 10121, and a sensitive element electrode 10111 and a sensitive element electrode 10121 corresponding to each sensitive element are used to electrically connect with the corresponding sensitive element.

[0082] In one embodiment, Figure 2A The first conductor portion 1011 and Figure 2B The arrangement of the second conductor portion 1012 on the third substrate 101 can be seen in Figure 2C , Figure 2CSchematic diagram of the structure of the third substrate provided by this application. Figure 2C As shown, the first hollow portion 104 includes multiple sub-hollow portions, and the electrode on the left side of each sub-hollow portion is the sensitive element electrode 10111 in the first conductor portion 1011, and the electrode on the right side of each sub-hollow portion is the sensitive element electrode 10121 in the second conductor portion 1012.

[0083] In one embodiment, when the number of the sensitive elements 102a to 102n is 16 and the arrangement is 4 rows and 4 columns, the pattern of the first conductor portion 1011 can also be seen in FIG. Figure 3A , Figure 3A This is another schematic diagram of the first conductor portion provided by this application. Figure 3A As shown, the first conductor portion 1011 includes a plurality of sensitive element electrodes 10112, and one side of the sensitive element electrode 10112 is arc-shaped. The number of sensitive element electrodes 10112 in the first conductor portion 1011 is the same as the number of sensitive elements 102a to 102n. For example, the number of sensitive element electrodes 10112 can be 16.

[0084] In one embodiment, when the number of the sensitive elements 102a to 102n is 16 and the arrangement is 4 rows and 4 columns, the pattern of the second conductor portion 1012 can also be seen in FIG. Figure 3B , Figure 3B : is a schematic diagram of the second conductor portion provided by this application. Figure 3B As shown, the second conductor portion 1012 includes a plurality of sensitive element electrodes 10122, each of which has an arc-shaped side. The number of sensitive element electrodes 10122 in the second conductor portion 1012 is the same as the number of sensitive elements 102a to 102n. For example, the number of sensitive element electrodes 10122 may be 16.

[0085] In one embodiment, each of the sensitive elements 102a to 102n corresponds to a sensitive element electrode 10112 and a sensitive element electrode 10122, and the sensitive element electrode 10112 and the sensitive element electrode 10122 corresponding to each sensitive element are used to electrically connect with the corresponding sensitive element.

[0086] In one embodiment, Figure 3A The first conductor portion 1011 and Figure 3B The arrangement of the second conductor portion 1012 on the third substrate 101 can also be seen in Figure 3C , Figure 3C This is another structural diagram of the third substrate provided by this application. Figure 3CAs shown, the first hollow portion 104 includes multiple sub-hollow portions, and the electrode on the left side of each sub-hollow portion is the sensitive element electrode 10112 in the first conductor portion 1011, and the electrode on the right side of each sub-hollow portion is the sensitive element electrode 10122 in the second conductor portion 1012.

[0087] In one embodiment, the number of the plurality of sub-hollow portions in the first hollow portion 104 is determined by the arrangement of the sensitive elements 102a to 102n, for example. Figure 2C and Figure 3C As shown, when the sensitive elements 102a to 102n are arranged in 4 rows and 4 columns, the number of the multiple sub-hollow portions in the first hollow portion 104 is 4.

[0088] In one embodiment, the above-mentioned sensitive elements 102a to 102n can be sensitive elements of the same type or different types. In this application, the electronic components in the resonant sensor 1 that are capable of sensitively sensing certain physical, chemical, or biological information and converting it into electrical information are referred to as sensitive elements. Sensitive elements can also be referred to as sensitive components or sensitive components.

[0089] In one embodiment, the sensing elements 102a through 102n include at least one of crystal oscillator temperature sensors and crystal oscillator pressure sensors. Specifically, the sensing elements 102a through 102n are crystal oscillator temperature sensors; or the sensing elements 102a through 102n are crystal oscillator pressure sensors; or some of the sensing elements 102a through 102n are crystal oscillator temperature sensors, while others are crystal oscillator pressure sensors. The crystal oscillator temperature sensors are used to acquire the temperature of the object to be detected, and the crystal oscillator pressure sensors are used to acquire the pressure of the object to be detected.

[0090] In one embodiment, the resonant sensor 1 can be set inside the object to be detected, or it can be set outside the object to be detected. In the case where the resonant sensor 1 is set outside the object to be detected, the resonant sensor 1 can be close to the outer surface of the object to be detected, or it can be set at a certain distance from the object to be detected. The certain distance can be a distance that ensures the detection performance of the resonant sensor 1. The object to be detected provided in this application can be determined by the actual application scenario of the resonant sensor 1, and is not limited here. For example, in the application scenario of electric vehicles, the object to be detected can be a power battery.

[0091] In one embodiment, each of the sensitive elements 102a through 102n includes a crystal oscillator, a first electrode, and a second electrode. The first electrode of each sensitive element is electrically connected to the first conductor portion 1011, and the second electrode of each sensitive element is electrically connected to the second conductor portion 1012, thereby improving the reliability and stability of the sensitive element. The crystal oscillator includes, but is not limited to, a piezoelectric crystal oscillator or a temperature-compensated crystal oscillator. If the crystal oscillator is a piezoelectric crystal oscillator, the sensitive element is a crystal oscillator pressure sensitive element; if the crystal oscillator is a temperature-compensated crystal oscillator, the sensitive element is a crystal oscillator temperature sensitive element.

[0092] In one embodiment, the first electrode and the second electrode of at least one of the sensitive elements 102a to 102n are made by processes such as radio frequency magnetron sputtering and electroplating, which can improve the corrosion resistance of the sensitive element.

[0093] In one embodiment, the first electrode of each of the sensitive elements 102a to 102n is electrically connected to the first conductor portion 1011 via conductive adhesive, and the second electrode of each of the sensitive elements is electrically connected to the second conductor portion 1012 via conductive adhesive. The conductive adhesive is an adhesive that exhibits a certain degree of conductivity after curing or drying. The conductive adhesive is used to connect the first electrode of each sensitive element to the first conductor portion 1011, thereby forming an electrical path between the first electrode of each sensitive element and the first conductor portion 1011; and to connect the second electrode of each sensitive element to the second conductor portion 1012, thereby forming an electrical path between the first electrode of each sensitive element and the second conductor portion 1012, thereby providing power to each sensitive element.

[0094] In one embodiment, at least one of the first electrode of each sensitive element and the first conductor portion 1011 is coated with conductive adhesive. Specifically, the first electrode of at least one sensitive element is coated with conductive adhesive, or the first conductor portion 1011 is coated with conductive adhesive, which reduces costs; or the first electrode and first conductor portion 1011 of at least one sensitive element are both coated with conductive adhesive, which can establish a more reliable and stable electrical connection between the first electrode of at least one sensitive element and the first conductor portion 1011, thereby improving the reliability and stability of the sensitive element, reducing costs, and simplifying the operation process.

[0095] In one embodiment, at least one of the second electrode and the second conductor portion 1012 of each sensitive element is coated with conductive adhesive. Specifically, the second electrode of at least one sensitive element is coated with conductive adhesive, or the second conductor portion 1012 is coated with conductive adhesive, which reduces costs; or both the second electrode and the second conductor portion 1012 of at least one sensitive element are coated with conductive adhesive, which can establish a more reliable and stable electrical connection between the second electrode and the second conductor portion 1012 of at least one sensitive element, thereby improving the reliability and stability of the sensitive element, reducing costs, and simplifying the operation process.

[0096] In one embodiment, the electrode materials of the first electrode and the second electrode of each of the sensitive elements 102a to 102n include, but are not limited to, aluminum (Al), gold (Au), platinum (Pt), copper (Cu), platinum titanium (PtTi), AuPtTi, or NiCr. The materials used to make each sensitive element include, but are not limited to, quartz (SiO2) crystal, Ca3TaGa3Si2O14 (CTGS) crystal, and lanthanum gallium silicate (La2Ga5SiO 14 , which can be referred to as LGS) crystals, the crystal cut includes but is not limited to at least one of AT cut, SC cut, X cut and Y cut.

[0097] In one embodiment, the thickness of each of the sensitive elements 102a to 102n is greater than or equal to 100 μm and less than or equal to 600 μm. The shape of each sensitive element includes but is not limited to a rectangle, a square, or a circle.

[0098] In one embodiment, when at least one of the sensitive elements 102a to 102n is rectangular in shape, the area of ​​each of the at least one sensitive element is greater than or equal to 2.8 mm x 4 mm and less than or equal to 5.5 mm x 3.5 mm. For ease of description, the structure of the sensitive element will be described below using the sensitive element 102a as an example, and no further details will be given below. The structure of the sensitive element 102a can be found in Figure 4A , Figure 4A This is a top view of the rectangular sensitive element provided by this application. Figure 4A As shown, the sensitive element 102a includes a crystal oscillator 1021a, a first electrode 1022a and a second electrode 1023a, and the shape of the sensitive element 102a is rectangular.

[0099] In one embodiment, the above Figure 4A The corresponding main view can be found in Figure 4B , Figure 4B This is the main view of the rectangular sensitive element provided by this application. Figure 4B As shown, the first electrode 1022a and the second electrode 1023a are disposed oppositely on either side of the crystal oscillator 1021a. The first electrode 1022a is disposed above the crystal oscillator 1021a, and therefore the first electrode 1022a can also be referred to as the upper electrode; the second electrode 1023a is disposed below the crystal oscillator 1021a, and therefore the second electrode 1023a can also be referred to as the lower electrode.

[0100] It is understandable that, when at least one of the sensitive elements 102a to 102n is rectangular in shape, the structure of at least one of the sensitive elements is as follows: Figure 4A and Figure 4B shown.

[0101] In one embodiment, when the shape of at least one sensitive element is circular, the diameter of each sensitive element in the at least one sensitive element is greater than or equal to 3 mm and less than or equal to 6 mm. The structure of the sensitive element is described by taking the sensitive element 102a as an example. The structure of the sensitive element 102a can also be referred to. Figure 5A , Figure 5A This is a top view of the circular sensitive element provided by this application. Figure 5A As shown, the sensitive element 102a includes a crystal oscillator 1024a, a first electrode 1025a and a second electrode 1026a, and the shape of the sensitive element 102a is circular.

[0102] In one embodiment, the above Figure 5A The corresponding main view can be found in Figure 5B , Figure 5B This is the main view of the circular sensitive element provided by this application. Figure 5B As shown, the first electrode 1025a and the second electrode 1026a are disposed oppositely on both sides of the crystal oscillator 1024a, the first electrode 1025a is disposed above the crystal oscillator 1024a, and the second electrode 1026a is disposed below the crystal oscillator 1024a.

[0103] It is understandable that, when at least one of the sensitive elements 102a to 102n is circular in shape, the structure of at least one of the sensitive elements is as follows: Figure 5A and Figure 5B shown.

[0104] In one embodiment, a portion of the first substrate 20 is isolated from a corresponding portion of the sensor body 10 . Isolation means that they are not in contact. Along the thickness direction of the second substrate 100 , the projection of the portion of the first substrate 20 onto the surface of the second substrate 100 falls on the area where the corresponding portion of the sensor body 10 is located. The surface of the second substrate 100 refers to the surface of the second substrate 100 that faces the first substrate 20 .

[0105] Specifically, if Figure 6 As shown, the first substrate 20 includes a protective portion 200, a connecting portion 201, and a connecting portion 202. The edge of the protective portion 200 is fixedly contacted with the second substrate 100 to form a protective space. The third substrate 101, sensitive elements 102a to 102n, and the supporting member 103 are disposed within the protective space. Each of the connecting portions 201 and 202 is configured to be fixedly connected to one end of the protective portion 200 and one end of the second substrate 100. The connecting portion 201 is configured to be fixedly connected to the end 2001 of the protective portion 200 and the end 1001 of the second substrate 100, and the connecting portion 202 is configured to be fixedly connected to the end 2002 of the protective portion 200 and the end 1002 of the second substrate 100.

[0106] Among them, the protective space is used to physically protect the third substrate 101, the sensitive elements 102a to 102n and the supporting component 103, and the protective part 200, the connecting part 201 and the connecting part 202 are jointly used to physically protect the second substrate 100, thereby improving the reliability of the resonant sensor 1 and extending the service life of the resonant sensor 1.

[0107] In one embodiment, the portion of the first substrate 20 may be the protective portion 200, and the corresponding portion of the sensor body 10 may be the third substrate 101, the sensitive elements 102a to 102n, and the supporting component 103, and the protective portion 200 is not in contact with the third substrate 101, the sensitive elements 102a to 102n, and the supporting component 103. The structure of the first substrate 20 provided in this application includes but is not limited to Figure 6 The structure shown may also be other structures, wherein other structures meet the requirements of being arranged outside the sensor body 10 and used to protect the sensor body 10, and are not limited here.

[0108] In one embodiment, the resonant sensor 1 includes a first cavity, which is enclosed by the surfaces of the sensitive elements 102a through 102n facing the protective portion 200, the support member 103, and the protective portion 200. It will be appreciated that the first cavity is located above the sensitive elements 102a through 102n and serves to reduce the forces acting on the sensitive elements 102a through 102n, thereby further improving the detection performance of the resonant sensor 1.

[0109] In one embodiment, the resonant sensor 1 further includes a second cavity, which is enclosed by the first conductor portion 1011, the second conductor portion 1012, the sensitive elements 102a through 102n, and the area on the second substrate 100 corresponding to the first hollow portion 104. It will be appreciated that the second cavity is located below the sensitive elements 102a through 102n and is used to reduce the force applied to the sensitive elements 102a through 102n, further improving the detection performance of the resonant sensor 1.

[0110] In one embodiment, when the resonant sensor 1 includes a first cavity and a second cavity, a cavity structure can be formed in which the sensitive elements 102a to 102n have cavities above and below, thereby further reducing the force on the sensitive elements 102a to 102n and improving the detection performance of the resonant sensor 1.

[0111] In one embodiment, the material of the supporting component 103 includes but is not limited to at least one of a flexible substrate, a high-temperature wear-resistant resin, and other rigid materials.

[0112] In one embodiment, the support component 103 includes M sub-support portions, where M is a positive integer greater than or equal to 2. Each of the sensitive elements 102a to 102n corresponds to at least two sub-support portions. Each sensitive element has at least one sub-support portion at one end electrically connected to the first conductor portion 1011, and each sensitive element also has at least one sub-support portion at the other end electrically connected to the second conductor portion 1012. The number of sub-support portions at the end electrically connected to the first conductor portion 1011 and the number of sub-support portions at the other end electrically connected to the second conductor portion 1012 may be the same or different. It will be understood that the M sub-support portions are used to support the first substrate 20 to isolate the first substrate 20 from the sensitive elements 102a to 102n, thereby improving the stability and reliability of the sensitive elements and further enhancing the detection performance of the resonant sensor 1.

[0113] In one embodiment, the shapes of the M sub-support portions include at least one of a rectangle, a square, a wedge, a circle, and an irregular shape.

[0114] In one embodiment, each of at least one of the above-mentioned sensitive elements 102a to 102n corresponds to two sub-support parts, and the two sub-support parts are symmetrically arranged, which can improve the stability of the entire sensor structure.

[0115] In one embodiment, each of at least one of the sensitive elements 102a to 102n corresponds to three sub-support portions, and the three sub-support portions are staggered or arranged in a triangular shape.

[0116] In one embodiment, each of at least one of the sensitive elements 102a to 102n corresponds to four sub-support portions, and the four sub-support portions are symmetrically arranged, staggered, or arranged in a quadrilateral.

[0117] In one embodiment, at least two sub-support portions corresponding to each of the sensitive elements 102a through 102n are bonded to the corresponding sensitive element. Specifically, the at least two sub-support portions are bonded to the corresponding sensitive element using a high-temperature adhesive. The at least two sub-support portions support the first substrate 20 to isolate the first substrate 20 from the corresponding sensitive element, thereby improving the stability and reliability of the sensitive element and further enhancing the detection performance of the resonant sensor 1.

[0118] In one embodiment, at least two sub-support portions corresponding to each sensitive element are used to bond to the outer surface of the corresponding sensitive element away from the third substrate 101, specifically to the outer surface of the corresponding sensitive element facing away from the third substrate 101. In another embodiment, at least two sub-support portions corresponding to each sensitive element are used to bond to the end of the outer surface of the corresponding sensitive element away from the third substrate 101, specifically to the end of the outer surface of the corresponding sensitive element facing away from the third substrate 101, where the end refers to the outermost edge portion. It can be understood that at least two sub-support portions are used to support the first substrate 20 to isolate the first substrate 20 and the corresponding sensitive element, thereby improving the stability and reliability of the sensitive element and further improving the detection performance of the resonant sensor 1.

[0119] In one embodiment, the thickness of each of the at least two sub-support portions may be greater than or equal to 25 μm and less than or equal to 100 μm, and the length and width of each sub-support portion may be greater than or equal to 1 mm and less than or equal to 3 mm.

[0120] In one embodiment, when each of the sensitive elements 102a to 102n corresponds to two sub-supporting parts, the structure of the sensor body 10 is as follows: Figure 7 As shown, support member 103 includes sub-support portions 1031a to 1031n and sub-support portions 1032a to 1032n, which can be referred to as sub-support portions 1031a to 1032n. Sub-support portions 1031a to 1032n are rectangular in shape. Sensitive element 102a corresponds to sub-support portions 1031a and 1032a, and sub-support portions 1031a and 1032a are symmetrically bonded to the two ends of the outer surface of sensitive element 102a facing away from the third substrate 101. Sensitive element 102n corresponds to sub-support portions 1031n and 1032n, and sub-support portions 1031n and 1032n are symmetrically bonded to the two ends of the outer surface of sensitive element 102n facing away from the third substrate 101.

[0121] In one embodiment, when the support component 103 includes M sub-support portions, the thickness of at least two sub-support portions corresponding to each of the sensitive elements 102a to 102n is greater than the thickness of the corresponding sensitive element, and the at least two sub-support portions are arranged outside the corresponding sensitive element and bonded to the third substrate 101. Specifically, the at least two sub-support portions are bonded to the third substrate 101 via a high-temperature adhesive. The outside of the corresponding sensitive element refers to the area outside the corresponding sensitive element and not in contact with the outer surface of the corresponding sensitive element that is away from the first conductor portion 1011 and the second conductor portion 1012. It can be understood that the at least two sub-support portions are used to support the first substrate 20 to isolate the first substrate 20 from the corresponding sensitive element, thereby improving the stability and reliability of the sensitive element and further enhancing the detection performance of the resonant sensor 1.

[0122] In one embodiment, at least two sub-support portions corresponding to each sensitive element are arranged outside the corresponding sensitive element and spaced apart from the corresponding sensitive element, wherein the spaced apart arrangement means not in contact. It can be understood that the at least two sub-support portions are used to support the first substrate 20 to isolate the first substrate 20 from the corresponding sensitive element, thereby improving the stability and reliability of the sensitive element and further improving the detection performance of the resonant sensor 1. The distance between each of the at least two sub-support portions and the corresponding sensitive element is greater than or equal to 2 mm and less than or equal to 2.5 mm, the thickness of each sub-support portion is 1.5 to 2 times the thickness of the corresponding sensitive element, and the area of ​​each sub-support portion is greater than or equal to 1 mm x 2 mm and less than or equal to 1.5 mm x 2.5 mm.

[0123] In the case where each of the sensitive elements 102a to 102n corresponds to two sub-supporting parts, the structure of the sensor body 10 is as follows: Figure 8 As shown, support member 103 includes sub-support portions 1033a to 1033n and sub-support portions 1034a to 1034n, which can be referred to as sub-support portions 1033a to 1034n. Sub-support portions 1033a to 1034n are rectangular in shape. Sensitive element 102a corresponds to sub-support portion 1033a and sub-support portion 1034a, which are symmetrically arranged outside of sensitive element 102a and spaced apart from sensitive element 102a. ..., sensitive element 102n corresponds to sub-support portion 1033n and sub-support portion 1034n, which are symmetrically arranged outside of sensitive element 102n and spaced apart from sensitive element 102n.

[0124] In one embodiment, at least two sub-support portions corresponding to each sensitive element are wedge-shaped support portions, at least two sub-support portions are arranged outside the corresponding sensitive element, and the wedge-shaped surfaces of at least two sub-support portions are engaged with the ends of the corresponding sensitive element. It can be understood that at least two sub-support portions are used to support the first substrate 20 to isolate the first substrate 20 and the corresponding sensitive element, thereby improving the stability and reliability of the sensitive element, thereby improving the detection performance of the resonant sensor 1; in addition, the wedge-shaped surfaces reduce the force on the corresponding sensitive element, further improving the detection performance of the resonant sensor 1. The material made of the wedge-shaped support portion is a high-temperature wear-resistant resin, and the wedge-shaped support portion is made by three-dimensional (3D) printing technology, which can also be called 3D printing technology.

[0125] In the case where each of the sensitive elements 102a to 102n corresponds to two sub-supporting parts, the structure of the sensor body 10 is as follows: Figure 9 As shown, the support component 103 includes sub-support portions 1035a to 1035n and sub-support portions 1036a to 1036n, which can be simply referred to as sub-support portions 1035a to 1036n. The sub-support portions 1035a to 1036n are all wedge-shaped support portions. Among them, the sensitive element 102a corresponds to the sub-support part 1035a and the sub-support part 1036a, the sub-support part 1035a and the sub-support part 1036a are adhered to the third substrate 101 and symmetrically arranged on the outside of the sensitive element 102a, and the wedge-shaped surface of the sub-support part 1035a and the wedge-shaped surface of the sub-support part 1036a are respectively clamped with the two ends of the sensitive element 102a;..., the sensitive element 102n corresponds to the sub-support part 1035n and the sub-support part 1036n, the sub-support part 1035n and the sub-support part 1036n are adhered to the third substrate 101 and symmetrically arranged on the outside of the sensitive element 102n, and the wedge-shaped surface of the sub-support part 1035n and the wedge-shaped surface of the sub-support part 1036n are respectively clamped with the two ends of the sensitive element 102n.

[0126] In one embodiment, the structure of the sensor body 10 can also be as follows Figure 10AAs shown, the support component 103 includes second hollow portions 1037a to second hollow portions 1037n, and each second hollow portion of the second hollow portions 1037a to the second hollow portions 1037n penetrates the support component 103 along the thickness direction of the support component 103, and the thickness of the support component 103 is greater than the thickness of each sensitive element of the sensitive elements 102a to 102n. The support component 103 is used to bond with the third substrate 101. Specifically, the support component 103 is used to bond with the outer surface of the third substrate 101 away from the second substrate 100 through a high-temperature adhesive. Each sensitive element is correspondingly arranged in the area enclosed by a second hollow portion, that is, the orthographic projection of a second hollow portion corresponding to each sensitive element on the third substrate 101 completely covers the orthographic projection of the corresponding sensitive element on the third substrate 101. Figure 10A In the embodiment, the sensitive element 102a is arranged in the area enclosed by the second hollow portion 1037a, ..., the sensitive element 102n is arranged in the area enclosed by the second hollow portion 1037n. Figure 10A The corresponding top view is as follows Figure 10B shown.

[0127] The thickness of support member 103 is 1.5 to 2 times the thickness of each of sensitive elements 102a through 102n, and the area of ​​the second hollow portion corresponding to each sensitive element is 1.2 times the area of ​​the corresponding sensitive element. It is understood that support member 103 is used to support first substrate 20 to isolate first substrate 20 from sensitive elements 102a through 102n, thereby improving the stability and reliability of the sensitive elements and thereby enhancing the detection performance of resonant sensor 1.

[0128] In one embodiment, the shapes of the second hollow portions 1037a to 1037n include but are not limited to at least one of a rectangle, a square, and a circle, which can be determined according to the shape of the corresponding sensitive element and the actual processing technology of the resonant sensor 1 and is not limited here. Figure 10A As shown, when the shapes of the sensitive elements 102a to 102n are rectangular, the shapes of the second hollow portions 1037a to 1037n are also rectangular.

[0129] In one embodiment, when the resonant sensor 1 includes a sensitive element and the shape of the sensitive element is circular, the overall structure of the resonant sensor 1 can be seen as follows: Figure 11 , Figure 11 This is another structural diagram of the resonant sensor provided by this application. Figure 11As shown, the resonant sensor 1 includes a first substrate 20, a second substrate 100, a third substrate 101, a sensitive element 102a, a sub-support portion 1031a, and a sub-support portion 1032a. The sensitive element 102a is circular, and the sub-support portions 1031a and 1032a are rectangular.

[0130] In one embodiment, Figure 11 The main view can be seen in Figure 12 , Figure 12 This is the main view of the resonant sensor provided by this application. Figure 12 As shown, the resonant sensor 1 includes a first cavity 30 and a second cavity 40, wherein the first cavity 30 is enclosed by a side of the sensitive element 102a facing the protective portion 200, the sub-support portion 1031a, the sub-support portion 1032a and the protective portion 200 and is located above the sensitive element 102a, and the second cavity 40 is enclosed by the first conductor portion 1011, the second conductor portion 1012, the sensitive elements 102a to 102n, and the area on the second substrate 100 corresponding to the first hollow portion 104 and is located below the sensitive element 102a, thereby forming a cavity structure with cavities above and below the sensitive element 102a to reduce the force on the sensitive element 102a, thereby further improving the detection performance of the resonant sensor 1.

[0131] In one embodiment, after removing Figure 11 In the case of the first substrate 20, see Figure 13 , Figure 13 This is another structural diagram of the sensor body provided by this application. Figure 13 As shown, the sub-support portion 1031 a and the sub-support portion 1032 a are symmetrically bonded to two ends of the crystal oscillator 1024 a facing away from the outer surface of the third substrate 101 . Figure 13 The corresponding main view is as follows Figure 14 As shown, the sensing element 102a has a first cavity 30 above it and a second cavity 40 below it. The first cavity 30 and the second cavity 40 are used to reduce the force F on the sensing element 102a, further improving the detection performance of the resonant sensor 1.

[0132] See also Figure 15 , Figure 15 This is a structural diagram of the battery provided by this application. Figure 15As shown, battery 2 includes a positive electrode 21, a negative electrode 22, and a resonant sensor 23. The positive electrode 21 is electrically connected to a first conductor 231 of the resonant sensor 23, and the negative electrode 22 is electrically connected to a second conductor 232 of the resonant sensor 23. Because the resonant sensor 23 is more flexible, it is more compatible with the corrosive electrochemical environment within the battery 2, thereby not affecting the performance and accuracy of the resonant sensor 23. Furthermore, the resonant sensor 23 is smaller in size, has little impact on the capacity of the battery 2, and facilitates the industrial production of the battery 2.

[0133] In one embodiment, when powered by battery 2, resonant sensor 23 is used to collect internal battery parameters of battery 2. These internal battery parameters can be used to determine whether battery 2 is experiencing thermal runaway. These internal battery parameters may include, but are not limited to, the internal temperature and internal pressure of battery 2, as well as parameters corresponding to the operating state. It will be appreciated that real-time collection of internal battery parameters of battery 2 by resonant sensor 23 to determine whether battery 2 is experiencing thermal runaway can provide higher sampling accuracy, thereby improving battery safety and reliability and extending battery life.

[0134] It is understood that the specific structure of the resonant sensor 23 can be found in Figures 1 to 14 The description of the structure of the resonant sensor 1 in the corresponding embodiment will not be repeated here.

[0135] See also Figure 16 , Figure 16 This is the structural diagram of the battery pack provided by this application. Figure 16 As shown, battery pack 3 includes batteries 31a through 31n. Battery 31a includes resonant sensors 311a, ..., and battery 31n includes resonant sensor 311n. The resonant sensors in each of batteries 31a through 31n can be used to collect internal battery parameters of each battery to determine whether each battery is experiencing thermal runaway, thereby improving the safety and reliability of battery pack 3 and extending the service life of battery pack 3.

[0136] It is understood that the specific structures of the resonant sensors 311a to 311n can be found in Figures 1 to 14 The description of the structure of the resonant sensor 1 in the corresponding embodiment will not be repeated here.

[0137] See also Figure 17 , Figure 17 This is the structural diagram of the energy storage system provided by this application. Figure 17As shown, the energy storage system 4 includes a battery pack 41 and a direct current-direct current (DC-DC) converter 42, wherein the battery pack 41 includes batteries 411a to 411n, battery 411a includes a resonant sensor 4111a, ..., and battery 411n includes a resonant sensor 4111n.

[0138] In one embodiment, DC converter 42 is configured to power DC load 5 based on the DC power provided by batteries 411a through 411n. While powering DC load 5, a resonant sensor within each battery can collect internal battery parameters to determine whether each battery is experiencing thermal runaway, thereby improving the power supply safety and reliability of energy storage system 4.

[0139] It is understood that the specific structures of the resonant sensors 4111a to 4111n can be found in Figures 1 to 14 The description of the structure of the resonant sensor 1 in the corresponding embodiment will not be repeated here.

[0140] See also Figure 18 , Figure 18 The figure is a flow chart of the method for preparing the resonant sensor provided in the present application. The method is performed by a sensor manufacturing device, such as Figure 18 As shown, the method includes the following steps S101 to S103:

[0141] Step S101: forming a first substrate, a second substrate, and a third substrate from a high molecular polymer, and forming one or more sensitive elements and a supporting component.

[0142] In one embodiment, the first, second, and third substrates are all flexible substrates, so that the resulting resonant sensor can operate in environments requiring flexibility, thereby expanding the application areas and scenarios of the resonant sensor. The flexible substrate comprises a polymer, including but not limited to at least one of polyimide, polyvinylidene fluoride, polyethylene, and polypropylene.

[0143] In one embodiment, the sensor manufacturing equipment can cut the polymer according to the dimensions of each of the first substrate, the second substrate, and the third substrate to produce the first substrate, the second substrate, and the third substrate. The dimensions of each substrate include: a thickness greater than or equal to 25 μm and less than or equal to 100 μm, and a length and width greater than or equal to 25 mm and less than or equal to 160 mm.

[0144] In one embodiment, the sensor manufacturing equipment can perform photo-imaging pattern transfer and etching on a third substrate based on the pattern of the first conductor part and the pattern of the second conductor part to form the first conductor part and the second conductor part on the third substrate, wherein the photo-imaging pattern transfer and etching processes are collectively referred to as flexible printed circuit board processes. The materials used to make the first conductor part and the second conductor part include but are not limited to aluminum (Al), gold (Au), platinum (Pt), copper (Cu), platinum titanium (PtTi), AuPtTi or NiCr. The thickness of each conductor part in the first conductor part and the second conductor part is greater than or equal to 5μm and less than or equal to 35μm. The pattern of the first conductor part and the pattern of the second conductor part can be determined by the number and arrangement of the sensitive elements in the resonant sensor. For example, the pattern of the first conductor part and the pattern of the second conductor part are as described above. Figure 2A and Figure 2B As shown, or the pattern of the first conductor part and the pattern of the second conductor part are as above Figure 3A and Figure 3B shown.

[0145] In one embodiment, since both the first and second conductor portions are fabricated on the third substrate, to prevent the first and second conductor portions from contacting and causing a short circuit in the resonant sensor, the sensor manufacturing equipment further hollows out a portion of the third substrate between the first and second conductor portions based on the shape of the first hollow portion, thereby forming a first hollow portion between the first and second conductor portions. The shape of the first hollow portion is determined by the patterns of the first and second conductor portions, and can specifically be a rectangle, square, or irregular shape.

[0146] In one embodiment, sensor manufacturing equipment can fabricate one or more sensing elements from a crystal based on the crystal orientation, size, shape, and processing technology of the sensing element. The crystal includes, but is not limited to, at least one of quartz crystal, CTGS crystal, and lanthanum gallium silicate crystal. The crystal cut includes, but is not limited to, at least one of AT cut, SC cut, X cut, and Y cut.

[0147] In one embodiment, the shape of the sensitive element includes but is not limited to at least one of a rectangle, a square, and a circle. The dimensions of the sensitive element include: the thickness of the sensitive element is greater than or equal to 100 μm and less than or equal to 600 μm; when the shape of the sensitive element is rectangular, the area of ​​the sensitive element is greater than or equal to 2.8 mm x 4 mm and less than or equal to 5.5 mm x 3.5 mm; or, when the shape of the sensitive element is circular, the diameter of the sensitive element is greater than or equal to 3 mm and less than or equal to 6 mm. The processing technology of the sensitive element includes, in sequence: cutting, thickness grinding, shape processing, beveling processing, etching or cleaning, electrode deposition, frequency adjustment, radio frequency magnetron sputtering and electroplating.

[0148] In one embodiment, each of the one or more sensitive elements includes a crystal oscillator, a first electrode, and a second electrode, the first electrode and the second electrode being disposed oppositely on opposite sides of the crystal oscillator. The aforementioned processes of cutting, thickness grinding, contour processing, beveling, etching or cleaning, electrode deposition, and frequency adjustment used in the processing of the sensitive elements are used to prepare the crystal oscillator in each sensitive element. Processes such as radio frequency magnetron sputtering and electroplating used in the processing of the sensitive elements are used to prepare the first electrode and the second electrode in each sensitive element. The electrode materials of the first and second electrodes include, but are not limited to, aluminum (Al), gold (Au), platinum (Pt), copper (Cu), platinum titanium (PtTi), AuPtTi, or NiCr.

[0149] In one embodiment, the material of the supporting component includes but is not limited to at least one of a flexible substrate, a high-temperature wear-resistant resin, and a rigid material.

[0150] In one embodiment, when the support component includes M sub-supports, the sensor manufacturing equipment may fabricate the M sub-supports from a polymer or high-temperature wear-resistant resin based on the size, shape, and processing of the sub-supports. Each of the one or more sensitive elements corresponds to at least two sub-supports, and M is a positive integer greater than or equal to 2. The size of the sub-supports may be determined by their specific positions in the resonant sensor. The shape of the sub-supports may include, but is not limited to, at least one of a rectangle, a square, a wedge, a circle, and an irregular shape. The processing of the sub-supports may include cutting or 3D printing.

[0151] In one embodiment, when the sub-support portion is made of a polymer, the sub-support portion has a shape including, but not limited to, at least one of a rectangle, a square, a circle, and an irregular shape, and is processed by cutting. When the sub-support portion is made of a high-temperature, wear-resistant resin, the sub-support portion has a wedge shape, and is processed by 3D printing.

[0152] In one embodiment, sensor manufacturing equipment can form a support component from a polymer according to the size, shape, and processing technology of the support component, wherein the support component includes at least one second hollow portion, each of the at least one second hollow portion extends through the support component along the thickness direction of the support component, and the thickness of the support component is greater than the thickness of each of the one or more sensitive elements. The size of the support component includes: the overall size of the support component and the size of each of the at least one second hollow portion; the shape of the support component includes: the overall shape of the support component and the shape of the at least one second hollow portion; the overall shape of the support component includes, but is not limited to, square, rectangular, circular, or irregular; the shape of the at least one second hollow portion includes, but is not limited to, at least one of square, rectangular, and circular; and the processing technology of the support component includes a cutting process.

[0153] The thickness of the supporting component is 1.5 to 2 times the thickness of each of the one or more sensitive elements, and the area of ​​the second hollow portion corresponding to each sensitive element is 1.2 times the area of ​​the corresponding sensitive element.

[0154] Step S102 : manufacturing a sensor body by combining the second substrate, the third substrate, one or more sensitive elements, and a supporting component.

[0155] In one embodiment, a second substrate and a third substrate are stacked, and the third substrate includes a first conductor portion and a second conductor portion. The first conductor portion and the second conductor portion are both located on a side of the third substrate away from the second substrate, and a first hollow portion is defined between the first conductor portion and the second conductor portion. The first hollow portion is used to isolate the first conductor portion from the second conductor portion, thereby preventing a short circuit in the resonant sensor. One or more sensitive elements are disposed on the outside of the third substrate away from the second substrate, and each sensitive element is electrically connected to the first conductor portion and the second conductor portion. In this case, the third substrate serves as an electrical connection carrier for the one or more sensitive elements and physically protects the one or more sensitive elements, thereby improving the stability and reliability of the sensitive elements. A support component is disposed on the outside of the third substrate away from the second substrate and is used to support the first substrate, thereby isolating the first substrate from the one or more sensitive elements. The first substrate also physically protects the one or more sensitive elements, thereby improving the stability and reliability of the sensitive elements and further enhancing the detection performance of the resonant sensor.

[0156] In one embodiment, the sensor manufacturing equipment can form the second and third substrates into a sensor base. Specifically, the second and third substrates are hot pressed to form the sensor base. Hot pressing refers to the process of heating and pressurizing the second and third substrates after paving and forming to form a sensor base with a certain mechanical strength and water resistance.

[0157] Furthermore, the sensor manufacturing equipment may place one or more sensitive elements on the sensor base to obtain a sensor base having one or more sensitive elements, wherein the first electrode of each of the one or more sensitive elements is electrically connected to the first conductor portion, and the second electrode of each of the one or more sensitive elements is electrically connected to the second conductor portion. Specifically, the sensor manufacturing equipment adheres the one or more sensitive elements to the sensor base using conductive adhesive, wherein the first electrode of each sensitive element is electrically connected to the first conductor portion, and the second electrode of each sensitive element is electrically connected to the second conductor portion. Furthermore, at least one of the first electrode and the first conductor portion of each sensitive element is coated with conductive adhesive, and at least one of the second electrode and the second conductor portion of each sensitive element is coated with conductive adhesive.

[0158] Furthermore, the sensor manufacturing equipment may dispose a support component on a sensor base having one or more sensitive elements to form a sensor body. Specifically, for each of the one or more sensitive elements, the sensor manufacturing equipment may dispose at least one of the M sub-support portions at one end of each sensitive element electrically connected to the first conductor portion, and at least one sub-support portion at the other end of each sensitive element electrically connected to the second conductor portion.

[0159] In one embodiment, the sensor manufacturing equipment may bond at least two sub-support portions corresponding to each sensitive element to the corresponding sensitive element to form a sensor body. Specifically, the sensor manufacturing equipment may bond at least two sub-support portions corresponding to each sensitive element to the corresponding sensitive element by a high-temperature adhesive to form a sensor body. Wherein, at least two sub-support portions are bonded to the outer surface of the corresponding sensitive element away from the third substrate, or at least two sub-support portions are bonded to the end of the outer surface of the corresponding sensitive element away from the third substrate. The thickness of each of the at least two sub-support portions may be greater than or equal to 25 μm and less than or equal to 100 μm, and the length and width of each sub-support portion may be greater than or equal to 1 mm and less than or equal to 3 mm.

[0160] In one embodiment, the sensor manufacturing equipment may bond at least two sub-support portions corresponding to each sensitive element to a third substrate to form a sensor body, wherein the at least two sub-support portions are disposed outside the corresponding sensitive element. Specifically, the sensor manufacturing equipment may bond the at least two sub-support portions corresponding to each sensitive element to the third substrate using a high-temperature adhesive to form the sensor body.

[0161] In one embodiment, at least two sub-support portions are disposed outside corresponding sensitive elements and spaced apart from the corresponding sensitive elements. The distance between each of the at least two sub-support portions and the corresponding sensitive element is greater than or equal to 2 mm and less than or equal to 2.5 mm. The thickness of each of the at least two sub-support portions is 1.5 to 2 times the thickness of the corresponding sensitive element, and the area of ​​each sub-support portion is greater than or equal to 1 mm x 2 mm and less than or equal to 1.5 mm x 2.5 mm.

[0162] In one embodiment, when at least two sub-support portions are wedge-shaped support portions, at least two sub-support portions are arranged on the outside of the corresponding sensitive elements, and the wedge-shaped surfaces of at least two sub-support portions are clamped with the ends of the corresponding sensitive elements, thereby reducing the force on the corresponding sensitive elements through the wedge-shaped surfaces, thereby further improving the detection performance of the resonant sensor.

[0163] In one embodiment, when the support member includes at least one second hollow portion, the sensor manufacturing equipment may bond the support member to the third substrate. Specifically, the support member is bonded to the outer surface of the third substrate facing away from the second substrate using a high-temperature adhesive, with each sensitive element correspondingly disposed within the area enclosed by one of the second hollow portions. The thickness of the support member is 1.5 to 2 times the thickness of each of the one or more sensitive elements, and the area of ​​the second hollow portion corresponding to each sensitive element is 1.2 times the area of ​​the corresponding sensitive element.

[0164] In one embodiment, when at least two sub-support portions corresponding to each sensitive element are wedge-shaped support portions, the sensor body is a force-releasing structure and is used to reduce the force on one or more sensitive elements, further improving the detection performance of the resonant sensor. When the sensor body includes a circular sensitive element and the second substrate is removed, see Figure 19 , Figure 19 This is a schematic diagram of the structure of the sensor body provided by this application without the second substrate. Figure 19 As shown, the third substrate 11 includes a first conductor portion 111 and a second conductor portion 112, with a first hollow portion 14 defined between the first conductor portion 111 and the second conductor portion 112. The sensitive element 12a includes a crystal oscillator 121a, a first electrode 122a, and a second electrode 123a. The first electrode 122a is electrically connected to the first conductor portion 111, and the second electrode 123a is electrically connected to the second conductor portion 112. The wedge-shaped surfaces of the sub-support portion 13a and the wedge-shaped surfaces of the sub-support portion 13b are respectively engaged with the two ends of the crystal oscillator 121a.

[0165] In one embodiment, along Figure 19 When observing in the direction A shown, you can see Figure 20 , Figure 20This is a schematic diagram of the force analysis of the sub-support part provided in this application. Figure 20 As shown in FIG. 1 , the forces acting on the wedge-shaped surface of sub-support portion 13a are shown as F1, F2, and F3, and the forces acting on the wedge-shaped surface of sub-support portion 13b are shown as F2, F3, and F4. The included angle θ represents the oblique angle between sub-support portions 13a and 13b. Analysis of the forces acting on the wedge-shaped surfaces of sub-support portions 13a and 13b reveals that sub-support portions 13a and 13b can reduce the forces acting on sensor 12a through their wedge-shaped surfaces, thereby improving the detection performance of the resonant sensor.

[0166] Step S103: manufacturing the sensor body and the first substrate into a resonant sensor.

[0167] In one embodiment, the sensor manufacturing equipment can perform hot-press packaging on the first substrate and the sensor body using a groove mold to produce a resonant sensor. The hot-press packaging can be a process of simultaneously heating and pressurizing the assembled first substrate and the sensor body to produce a resonant sensor with a certain mechanical strength and water resistance.

[0168] In one embodiment, the first substrate includes a protective portion and two connecting portions, wherein the protective portion is made of a groove mold. The two ends of the protective portion are fixedly contacted with the second substrate to form a protective space, and the third substrate, one or more sensitive elements, and a supporting component are disposed within the protective space. Each of the two connecting portions is used to fixedly connect to one end of the protective portion and one end of the second substrate. The protective space is used to physically protect the third substrate, one or more sensitive elements, and the supporting component, and the protective portion and the two connecting portions are used together to physically protect the second substrate, thereby improving the reliability of the resonant sensor and extending the service life of the resonant sensor.

[0169] In one embodiment, during the process of manufacturing the resonant sensor, the structure of the sensor base can be seen in FIG. Figure 21A , Figure 21A This is a schematic diagram of the structure of the sensor base provided by this application. Figure 21A As shown, the sensor base includes a second substrate and a third substrate 11. Since the second substrate is located below the third substrate 11, the second substrate is not Figure 21A. The third substrate 11 includes a first conductor portion 111 and a second conductor portion 112, with a first hollow portion 14 defined between the first conductor portion 111 and the second conductor portion 112. The sensitive element electrodes in the first conductor portion 111 and the second conductor portion 112 are square electrodes. The third substrate 11 also includes lead electrodes 113 between the first conductor portion 111 and the second conductor portion 112. The lead electrodes 113 are used to electrically connect the first conductor portion 111 to the positive electrode of the object to be detected, and to electrically connect the second conductor portion 112 to the negative electrode of the object to be detected, thereby enabling the object to be detected to power the resonant sensor.

[0170] The structure of the sensor base with one or more sensitive elements can be found in Figure 21B , Figure 21B This is a schematic diagram of the structure of a sensor base with one or more sensitive elements provided by this application. Figure 21B As shown, the sensor base having one or more sensitive elements includes Figure 21A The sensor base and the sensitive elements 12a to 12n are shown, wherein the sensitive elements 12a to 12n are located above the first hollow portion 14, and the shapes of the sensitive elements 12a to 12n are circular.

[0171] The structure of the resonant sensor can be found in Figure 21C , Figure 21C This is a schematic diagram of the structure of the resonant sensor provided by this application. Figure 21C As shown, the resonant sensor includes Figure 21B The sensor base shown has sensitive elements 12a to 12n, a first substrate 15 and a cavity 16, wherein the cavity 16 includes a first cavity above the sensitive elements 12a to 12n and a second cavity below the sensitive elements 12a to 12n.

[0172] In one embodiment, during the process of manufacturing the resonant sensor, the structure of the sensor base can be seen in FIG. Figure 22A , Figure 22A This is another structural diagram of the sensor base provided by this application. Figure 22A As shown, the sensor base includes a second substrate and a third substrate 17. Since the second substrate is located below the third substrate 17, the second substrate is not Figure 22A. The third substrate 17 includes a first conductor portion 171 and a second conductor portion 172, with a first hollow portion 18 defined between the first and second conductor portions 171, 172. The sensitive element electrodes in the first and second conductor portions 171, 172 are square electrodes. The third substrate 17 also includes lead electrodes 173 between the first and second conductor portions 171, 172. These lead electrodes 173 are used to electrically connect the first conductor portion 171 to the positive electrode of the object to be detected, and to electrically connect the second conductor portion 172 to the negative electrode of the object to be detected, thereby enabling the object to be detected to power the resonant sensor.

[0173] The structure of the sensor base with one or more sensitive elements can be found in Figure 22B , Figure 22B This is another structural diagram of a sensor base with one or more sensitive elements provided by this application. Figure 22B As shown, the sensor base having one or more sensitive elements includes Figure 22A The sensor base and the sensitive elements 19a to 19n are shown, wherein the sensitive elements 19a to 19n are located above the first hollow portion 18, and the shapes of the sensitive elements 19a to 19n are circular.

[0174] The structure of the resonant sensor can be found in Figure 22C , Figure 22C This is another structural diagram of the resonant sensor provided by this application. Figure 22C As shown, the resonant sensor includes Figure 22B The sensor base shown has sensitive elements 19a to 19n, a first substrate 21 and a cavity 22, wherein the cavity 22 includes a first cavity above the sensitive elements 19a to 19n and a second cavity below the sensitive elements 19a to 19n.

[0175] In one embodiment, the specific preparation process of the resonant sensor includes the following steps 1 to 6. For the convenience of description, the following description will be made by taking a polymer film as an example, and no further details will be given below.

[0176] Step 1, the sensor manufacturing equipment can cut the polymer film into the first substrate based on the size of the first substrate, cut the polymer film into the second substrate based on the size of the second substrate, and cut the polymer film into the third substrate based on the size of the third substrate; perform photoimaging pattern transfer and etching on the third substrate based on the pattern of the first conductor part and the pattern of the second conductor part to form the first conductor part and the second conductor part on the third substrate; hollow out part of the third substrate between the first conductor part and the second conductor part based on the shape of the first hollow part to form the first hollow part between the first conductor part and the second conductor part; hot press the second substrate and the third substrate to obtain a sensor base, wherein the third substrate includes the first conductor part and the second conductor part.

[0177] Step 2: The sensor manufacturing equipment sequentially cuts, grinds, shapes, bevels, etches or cleans, deposits electrodes, and adjusts the frequency of the crystal according to the crystal orientation, size, shape, and processing technology of the sensitive element, thereby producing one or more sensitive elements. The crystal is a crystal with an X, Y, and Z axis surface that has been ground and clarified. A Ti layer with a thickness of 35 nm ± 5 nm and a first electrode with a thickness of 200 nm ± 10 nm are sequentially formed on the upper surface of each of the one or more sensitive elements by radio frequency magnetron sputtering. The thickness of the first electrode is increased to the target thickness by electroplating. A second electrode with a target thickness is formed on the lower surface of each sensitive element by radio frequency magnetron sputtering. For details, see the description of the preparation of the first electrode. The Ti layer is used to enhance the adhesion between the first and second electrodes.

[0178] In step 3, the sensor manufacturing equipment coats conductive adhesive on the first and second conductor portions, so that the first electrode of each of the one or more sensitive elements is electrically connected to the first conductor portion, and the second electrode of each sensitive element is electrically connected to the second conductor portion, via the conductive adhesive. At this point, the one or more sensitive elements can be arranged on a third substrate to form a sensitive element array, thereby obtaining a sensor base having a sensitive element array. The sensor base having a sensitive element array includes a second substrate, a third substrate, and the sensitive element array.

[0179] Step 4: The sensor manufacturing equipment cuts the polymer film into M sub-support parts according to the size, shape and processing technology of the sub-support parts, wherein each sensitive element in the one or more sensitive elements corresponds to at least two sub-support parts; in at least one of a nitrogen environment and an air environment, at least two sub-support parts corresponding to each sensitive element are bonded to the end of the corresponding sensitive element away from the outer surface of the third substrate by a high-temperature adhesive to form a sensor body.

[0180] Step 5: The sensor manufacturing equipment makes M sub-support parts from high-temperature wear-resistant resin according to the size, shape and processing technology of the sub-support parts, wherein each sensitive element in one or more sensitive elements corresponds to at least two sub-support parts, and the processing technology is 3D printing technology; at least two sub-support parts corresponding to each sensitive element are bonded to the third substrate by a high-temperature adhesive to make the sensor body, wherein at least two sub-support parts are arranged outside the corresponding sensitive element, and the wedge-shaped surfaces of at least two sub-support parts are clamped with the ends of the corresponding sensitive element. The structure of the sub-support part is as described above. Figure 16 It is understandable that when step 4 is executed, step 5 is not executed, and when step 5 is executed, step 4 is not executed.

[0181] Step 6: The sensor manufacturing equipment performs hot pressing packaging on the first substrate and the sensor body to produce a resonant sensor.

[0182] In one embodiment, in step 1, the polymer film is polyimide, and the thicknesses of the polymer films used to prepare the first, second, and third substrates are 25 μm, 25 μm, and 60 μm, respectively. The dimensions of the first, second, and third substrates are 75 mm x 75 mm. The first and second conductors are made of Cu and have a thickness of 12.5 μm. The hot pressing process parameters include a temperature of 165°C, a pressure of 150 MPa, and a time of 45 minutes. In step 2, the crystal is a quartz crystal, the crystal cut of the sensitive element is SC, the diameter is 5.5 mm, the resonant frequency is 23.7 MHz, the type is a temperature sensitive element, and the shape is circular. The electrode material of the first and second electrodes is Au, and the target thickness is 3 μm ± 0.2 μm. In step 3, the array of sensor elements has a 4x4 array order, the row spacing u and column spacing v of the sensor elements are 10 mm, and the distance w between the edge of the sensor element array and the edge of the third substrate is 6.5 mm. In step 4, the thickness of the sub-support portion is 25 μm and the area is 1.5 mm x 1.5 mm. The polymer film used to form the sub-support portion is a polyimide film. In step 6, the hot pressing process parameters include a temperature of 125°C, a pressure of 150 MPa, and a time of 90 minutes.

[0183] In one embodiment, in step 1, the polymer film is polyimide, and the thicknesses of the polymer films used to prepare the first, second, and third substrates are 25 μm, 25 μm, and 60 μm, respectively. The dimensions of the first, second, and third substrates are 55 mm x 45 mm. The first and second conductors are made of Cu and have a thickness of 35 μm. The hot pressing process parameters include a temperature of 165°C, a pressure of 150 MPa, and a time of 45 minutes. In step 2, the crystal is a quartz crystal, the crystal cut of the sensitive element is SC, the area is 2.8 mm x 4 mm, the resonant frequency is 60.5 MHz, the type is a force sensor, and the shape is rectangular. The electrode material of the first and second electrodes is Ag, and the target thickness is 8 μm ± 0.2 μm. In step 3, the number of sensor array levels is 3 x 3, the row spacing u and column spacing v of the sensor elements are 9 mm, and the distance w between the edge of the sensor array and the edge of the third substrate is 3 mm. In step 4, the thickness of the sub-support portion is 25 μm and the area is 2.8 mm x 1.5 mm. The polymer film used to form the sub-support portion is polyimide. In step 6, the hot pressing process parameters include: temperature of 125°C, pressure of 150 MPa, and time of 90 minutes.

[0184] In one embodiment, in step 1, the polymer film is polypropylene, and the thicknesses of the polymer films used to prepare the first, second, and third substrates are 75 μm, 30 μm, and 75 μm, respectively. The dimensions of the first, second, and third substrates are 70 mm x 95 mm. The first and second conductors are made of Cu and have a thickness of 35 μm. The hot pressing process parameters include a temperature of 165°C, a pressure of 150 MPa, and a time of 45 minutes. In step 2, the crystal is a quartz crystal, the crystal cut of the sensitive element is Y-cut, the diameter is 6 mm, the resonant frequency is 12.9 MHz, the type is a temperature sensitive element, and the shape is circular. The electrode material of the first and second electrodes is Au, and the target thickness is 8 μm ± 0.2 μm. In step 3, the array of sensor elements has a 4 x 4 array order, a row spacing u of 12 mm, a column spacing v of 16 mm, and a distance w between the edge of the sensor element array and the edge of the third substrate of 3.5 mm. In step 4, the thickness of the sub-support portion is 30 μm, the area is 1 mm x 1.5 mm, and the polymer film used to form the sub-support portion is polypropylene. In step 6, the hot pressing process parameters include a temperature of 165°C, a pressure of 200 MPa, and a time of 90 minutes.

[0185] In one embodiment, in step 1, the polymer film is polyethylene, and the thicknesses of the polymer films used to prepare the first, second, and third substrates are 25 μm, 25 μm, and 60 μm, respectively. The dimensions of the first, second, and third substrates are 120 mm x 160 mm. The first and second conductors are made of Cu and have a thickness of 12.7 μm. The hot pressing process parameters include a temperature of 135°C, a pressure of 150 MPa, and a time of 45 minutes. In step 2, the crystal is a quartz crystal, the crystal cut of the sensitive element is Y-cut, the diameter is 6 mm, the resonant frequency is 12.9 MHz, the type is a temperature sensitive element, and the shape is circular. The electrode material of the first and second electrodes is Pt, and the target thickness is 8 μm ± 0.2 μm. In step 3, the array of sensor elements is 4 x 4, the row spacing u and column spacing v of the sensor elements are 30.2 mm, and the distance w between the edge of the sensor element array and the edge of the third substrate is 7.5 mm. In step 4, the thickness of the sub-support portion is 25 μm and the area is 1.5 mm x 1.5 mm. The polymer film used to form the sub-support portion is polyethylene. In step 6, the hot pressing process parameters include a temperature of 135°C, a pressure of 190 MPa, and a time of 90 minutes.

[0186] In one embodiment, in step 1, the polymer film is polyethylene, and the thicknesses of the polymer films used to prepare the first, second, and third substrates are 25 μm, 25 μm, and 60 μm, respectively. The dimensions of the first, second, and third substrates are 120 mm x 160 mm. The first and second conductors are made of Cu and have a thickness of 12.7 μm. The hot pressing process parameters include a temperature of 135°C, a pressure of 150 MPa, and a time of 45 minutes. In step 2, the crystal is a quartz crystal, the crystal cut of the sensitive element is Y-cut, the diameter is 6 mm, the resonant frequency is 12.9 MHz, the type is a temperature sensitive element, and the shape is circular. The electrode material of the first and second electrodes is Pt, and the target thickness is 8 μm ± 0.2 μm. In step 3, the array of sensor elements is 4x4, the row spacing u and column spacing v of the sensor elements are 30.2 mm, and the distance w between the edge of the sensor element array and the edge of the third substrate is 7.5 mm. In step 5, the sub-support portion is 6 mm long and has a right-angled trapezoidal cross-section with an upper base of 1 mm, a lower base of 2.5 mm, and a height of 200 μm. In step 6, the hot pressing process parameters include a temperature of 135°C, a pressure of 190 MPa, and a time of 90 minutes.

[0187] In one embodiment, in step 1, the polymer film is polyethylene, and the thicknesses of the polymer films used to prepare the first, second, and third substrates are 25 μm, 25 μm, and 60 μm, respectively. The dimensions of the first, second, and third substrates are 120 mm x 160 mm. The first and second conductors are made of Cu and have a thickness of 12.7 μm. The hot pressing process parameters include a temperature of 135°C, a pressure of 150 MPa, and a time of 45 minutes. In step 2, the crystal is a quartz crystal, the crystal cut of the sensitive element is SC, the area is 2.8 mm x 4 mm, the resonant frequency is 60.5 MHz, the type is a force sensor, and the shape is rectangular. The electrode material of the first and second electrodes is Pt, and the target thickness is 8 μm ± 0.2 μm. In step 3, the array of sensor elements is 4x4, the row spacing u and column spacing v of the sensor elements are 30.2 mm, and the distance w between the edge of the sensor element array and the edge of the third substrate is 7.5 mm. In step 5, the sub-support portion is 6 mm long and has a right-angled trapezoidal cross-section with an upper base of 1 mm, a lower base of 2.5 mm, and a height of 200 μm. In step 6, the hot pressing process parameters include a temperature of 135°C, a pressure of 190 MPa, and a time of 90 minutes.

[0188] In one embodiment, in step 1, the polymer film is polyimide, and the thicknesses of the polymer films used to prepare the first, second, and third substrates are 25 μm, 25 μm, and 60 μm, respectively. The dimensions of the first, second, and third substrates are 55 mm x 45 mm. The first and second conductors are made of Cu and have a thickness of 35 μm. The hot pressing process parameters include a temperature of 165°C, a pressure of 150 MPa, and a time of 45 minutes. In step 2, the crystal is a CTGS crystal, the crystal cut of the sensitive element is SC, the area is 2.8 mm x 4 mm, the resonant frequency is 60.5 MHz, the type is a force sensor, and the shape is rectangular. The electrode material of the first and second electrodes is Au, and the target thickness is 5 μm ± 0.2 μm. In step 3, the number of sensor array levels is 3 x 3, the row spacing u and column spacing v of the sensor elements are 9 mm, and the distance w between the edge of the sensor array and the edge of the third substrate is 3 mm. In step 4, the thickness of the sub-support portion is 25 μm and the area is 2.8 mm x 1.5 mm. The polymer film used to form the sub-support portion is polyimide. In step 6, the hot pressing process parameters include: temperature of 125°C, pressure of 150 MPa, and time of 90 minutes.

[0189] In one embodiment, in step 1, the polymer film is polyimide, and the thicknesses of the polymer films used to prepare the first, second, and third substrates are 25 μm, 25 μm, and 60 μm, respectively. The dimensions of the first, second, and third substrates are 55 mm x 45 mm. The first and second conductors are made of Cu and have a thickness of 35 μm. The hot pressing process parameters include a temperature of 165°C, a pressure of 150 MPa, and a time of 45 minutes. In step 2, the crystal is an LGS crystal, the crystal cut of the sensitive element is SC, the area is 2.8 mm x 4 mm, the resonant frequency is 33 MHz, the type is a force sensor, and the shape is rectangular. The electrode material of the first and second electrodes is Au, and the target thickness is 6 μm ± 0.2 μm. In step 3, the number of sensor array levels is 3 x 3, the row spacing u and column spacing v of the sensor elements are 9 mm, and the distance w between the edge of the sensor array and the edge of the third substrate is 3 mm. In step 4, the thickness of the sub-support portion is 25 μm and the area is 2.8 mm x 1.5 mm. The polymer film used to form the sub-support portion is polyimide. In step 6, the hot pressing process parameters include: temperature of 125°C, pressure of 150 MPa, and time of 90 minutes.

[0190] It should be noted that the specific structure of the resonant sensor manufactured by the sensor manufacturing equipment according to the above steps S101 to S103 is as described above. Figures 1 to 14 As shown, no further details are given here.

[0191] In this method, sensor manufacturing equipment can produce a flexible packaged resonant sensor to work in an environment with flexible feature requirements, thereby expanding the application fields and application scenarios of the resonant sensor, and improving the detection performance of the resonant sensor, with strong applicability.

[0192] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any modifications or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A resonant sensor, characterized in that: The sensor comprises a sensor body and a first substrate, wherein the first substrate is arranged outside the sensor body and is used to protect the sensor body. The sensor body comprises a second substrate, a third substrate, one or more sensitive elements, and a supporting component. The first substrate, the second substrate, and the third substrate are all flexible substrates. The second substrate and the third substrate are stacked, the third substrate includes a first conductor portion and a second conductor portion, the first conductor portion and the second conductor portion are both located on a side of the third substrate away from the second substrate, and a first hollow portion is provided between the first conductor portion and the second conductor portion, the first hollow portion being used to isolate the first conductor portion from the second conductor portion; the one or more sensitive elements are provided on the outside of the first conductor portion and the second conductor portion away from the second substrate, and each sensitive element is electrically connected to the first conductor portion and the second conductor portion; the supporting component is provided on the outside of the third substrate away from the second substrate and is used to support the first substrate so as to isolate the first substrate from the one or more sensitive elements; The first substrate includes a protective part and two connecting parts. The two ends of the protective part are fixedly contacted with the second substrate to form a protective space. The third substrate, the one or more sensitive elements and the supporting component are arranged in the protective space. Each of the two connecting parts is used to be fixedly connected to one end of the protective part and one end of the second substrate.

2. The resonant sensor according to claim 1, wherein: The flexible substrate comprises a high molecular polymer.

3. The resonant sensor according to claim 1, wherein The support component includes M sub-support parts; Each of the one or more sensitive elements corresponds to at least two sub-support parts, and each sensitive element has at least one sub-support part at one end electrically connected to the first conductor part, and also has at least one sub-support part at the other end electrically connected to the second conductor part.

4. The resonant sensor according to claim 3, characterized in that The at least two sub-support portions corresponding to each sensitive element are used for bonding with the corresponding sensitive element.

5. The resonant sensor according to claim 4, characterized in that The at least two sub-support portions corresponding to each sensitive element are used to be bonded to the outer surface of the corresponding sensitive element away from the third substrate.

6. The resonant sensor according to claim 5, characterized in that The at least two sub-support portions corresponding to each sensitive element are used to be bonded to the end portion of the corresponding sensitive element away from the outer surface of the third substrate.

7. The resonant sensor according to claim 3, wherein: The thickness of the at least two sub-support portions corresponding to each sensitive element is greater than the thickness of the corresponding sensitive element. The at least two sub-support portions are arranged outside the corresponding sensitive element and bonded to the third substrate.

8. The resonant sensor according to claim 7, characterized in that The at least two sub-support portions corresponding to each sensitive element are arranged outside the corresponding sensitive element and spaced apart from the corresponding sensitive element.

9. The resonant sensor according to claim 7, wherein: The at least two sub-support portions corresponding to each sensitive element are both wedge-shaped support portions, the at least two sub-support portions are arranged outside the corresponding sensitive element, and the wedge-shaped surfaces of the at least two sub-support portions are clamped with the ends of the corresponding sensitive element.

10. The resonant sensor according to any one of claims 3 to 9, characterized in that: Each sensitive element in at least one of the one or more sensitive elements corresponds to two sub-support parts, and the two sub-support parts are symmetrically arranged.

11. The resonant sensor according to claim 1 or 2, characterized in that: The support component includes at least one second hollow portion, each of the at least one second hollow portion penetrates the support component along the thickness direction of the support component, the thickness of the support component is greater than the thickness of each of the one or more sensitive elements, and the support component is used to be bonded to the third substrate; Each sensitive element is correspondingly arranged in an area enclosed by a second hollow portion.

12. The resonant sensor according to any one of claims 1 to 9, characterized in that: The resonant sensor includes a first cavity, which is enclosed by a surface of the one or more sensitive elements facing the protective portion, the supporting component, and the protective portion.

13. The resonant sensor according to any one of claims 1 to 9, characterized in that: The resonant sensor includes a second cavity, which is enclosed by the first conductor portion, the second conductor portion, the one or more sensitive elements, and a region on the second substrate corresponding to the first hollow portion.

14. The resonant sensor according to any one of claims 1 to 9, characterized in that: Each of the one or more sensitive elements includes a crystal oscillator, a first electrode and a second electrode, wherein the first electrode and the second electrode are oppositely arranged on two sides of the crystal oscillator; The first electrode of each sensitive element is electrically connected to the first conductor portion, and the second electrode of each sensitive element is electrically connected to the second conductor portion.

15. The resonant sensor according to any one of claims 1 to 9, characterized in that: In the case where the resonant sensor includes a plurality of sensitive elements, the plurality of sensitive elements are arranged on the outer sides of the first conductor portion and the second conductor portion away from the second substrate to form one or more sensitive element arrays.

16. A battery, characterized in that: The battery includes a positive electrode, a negative electrode, and the resonant sensor according to any one of claims 1 to 15, wherein the positive electrode is electrically connected to the first conductor portion of the resonant sensor, and the negative electrode is electrically connected to the second conductor portion of the resonant sensor.

17. A battery pack, characterized in that: The battery pack includes a plurality of batteries, which are connected in series or in parallel, and each of the plurality of batteries includes the resonant sensor according to any one of claims 1 to 15.

18. An energy storage system, characterized in that: The energy storage system includes a battery pack and a DC converter, wherein the battery pack includes a plurality of batteries, and each of the plurality of batteries includes the resonant sensor according to any one of claims 1 to 15.

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