An L-band low-earth orbit satellite multi-channel TR module

Abstract

The present application discloses an L-band low-earth orbit satellite multi-channel TR module, which includes a first module. The first module includes at least three receiving boards, at least three transmitting boards and a radio frequency interface: the three receiving boards and the three transmitting boards are alternately arranged in sequence to form a circular structure; the radio frequency interface specifically includes three receiving interfaces and three transmitting interfaces; the receiving interfaces and the transmitting interfaces are alternately arranged to form a circular structure; the three receiving boards are respectively connected to the three receiving interfaces to form receiving channels; the three transmitting boards are respectively connected to the three transmitting interfaces to form transmitting channels. By arranging the receiving boards and the transmitting boards that are alternately arranged in sequence to form a circular structure, and arranging the radio frequency interface to be correspondingly connected to the receiving boards and the transmitting boards to form receiving channels and transmitting channels respectively, the receiving and transmitting channels of the TR module work simultaneously, and full-duplex communication is realized by using different frequencies for receiving and transmitting. By integrating three receiving and transmitting channels in the module, the size is reduced and the integration degree is improved, while meeting the requirements of the antenna array layout.

Description

Technical Field

[0001] This application relates to the field of satellite communication, and particularly to an L-band low-earth orbit satellite multi-channel TR module. Background Art

[0002] The low-earth orbit satellite is configured with an L-band digital phased array to complete functions such as signal transceiver, digital beamforming, channelization, sub-band mapping, and physical layer modulation and demodulation for mobile communication services and data collection services, and supports voice, data communication, and data collection Internet of Things services. It has the DBF digital processing function and realizes satellite coverage of the ground through beamforming. To implement the DBF function, each transceiver channel requires a set of independent TR modules, and beamforming is implemented in the baseband.

[0003] In the prior art, the receiver uses single-stage frequency conversion, which may result in situations where the gain and power consumption cannot meet the requirements of current low-earth orbit communication satellites. To meet the power consumption and gain requirements, the signals of multiple channels are first down-converted, filtered, and numerically controlled twice at the receiving end, and then sent to the AD. The signal output by the DA at the transmitting end is filtered and then up-converted twice for output. Although signal transceiver can be achieved, due to the use of two-stage frequency conversion, problems such as increased power consumption, difficult thermal control management caused by large heat generation, increased cost caused by the increase in components, and decreased reliability will occur.

[0004] Traditional L-band high-power TR modules use gallium nitride power transistors, which have a large operating voltage, multiple operating voltage rails, a large number of protection devices, a large size, high power consumption, and low reliability, making it difficult to integrate multiple channels. More reliable products mostly use bare die devices, which are costly and difficult to mass-produce. The number of channels is mostly one receive and one transmit, two receive and two transmit, or four receive and four transmit, etc., and the structure is mostly square. The TR module is externally connected to a large-sized duplexer through a radio frequency cable, and the radio frequency cable will bring additional losses, making it difficult to integrate into a large-scale digital phased array. In a digital phased array system, it is necessary to calibrate the amplitude and phase of each channel. In a traditional DBF system, the amplitude and phase control function is implemented in the baseband, and there is no gain control device in the TR module. In a low-earth orbit satellite communication system, the gain required by the receiving channel is very large, and how to perform calibration is also a problem that needs to be solved. Summary of the Invention

[0005] The technical problem to be solved by this application is the limitation of the shape of traditional TR modules, which makes it difficult to integrate multiple channels into a limited space. The purpose is to provide an L-band low-earth orbit satellite multi-channel TR module. By setting three receiving boards and three transmitting boards in each TR module, and setting radio frequency interfaces including receiving interfaces and transmitting interfaces arranged alternately to form a circular structure and respectively connecting to the receiving boards and transmitting boards to form receiving channels and transmitting channels, multiple transceiver channels are integrated in the module by alternately arranging the transceiver channels, reducing the size while improving the integration degree.

[0006] This application is realized through the following technical solutions:

[0007] An L-band low-earth orbit satellite multi-channel TR module, including a first module, the first module includes at least three receiving boards, at least three transmitting boards and a radio frequency interface:

[0008] The three receiving boards and the three transmitting boards are alternately arranged in sequence to form a circular structure;

[0009] The radio frequency interface specifically includes three receiving interfaces and three transmitting interfaces;

[0010] The receiving interfaces and the transmitting interfaces are alternately arranged to form a circular structure;

[0011] The three receiving boards are respectively connected to the three receiving interfaces to form a receiving channel;

[0012] The three transmitting boards are respectively connected to the three transmitting interfaces to form a transmitting channel.

[0013] This application is based on the DBF system of the spaceborne platform. The receiving and transmitting channels of the TR module work simultaneously, and FDD full-duplex communication is realized by using different frequencies for receiving and transmitting. By setting three receiving boards and three transmitting boards in each TR module, the three receiving boards and the three transmitting boards are alternately arranged in sequence to form a circular structure, and the radio frequency interface is set to specifically include three receiving interfaces and three transmitting interfaces, which are respectively connected to the receiving boards and the transmitting boards to form a receiving channel and a transmitting channel. By alternately arranging the receiving and transmitting channels, multiple receiving and transmitting channels are integrated in the module, reducing the size while improving the integration degree, and simultaneously meeting the requirements of the antenna array layout.

[0014] Further, the circular arrangement structure formed by the receiving boards and the transmitting boards is arranged in a first cavity module, and the first cavity module includes a first cavity formed by enclosing together, a first upper cover plate and a first lower cover plate.

[0015] Further, a power supply board is arranged in the first cavity module. The power supply board is used for integrated circuits and providing power. The power supply board is provided with an analog temperature sensor, and the analog temperature sensor is used to report the temperature analog information of each TR module to the external baseband module. The baseband module adjusts the calibration amount in real time according to the temperature of each TR module to compensate for the influence brought by the temperature change. Using the analog temperature sensor has high reliability and can meet the reliability requirements while reducing costs.

[0016] Further, the angle between each receiving radio frequency interface and each transmitting radio frequency interface is uniformly arranged at 60°. The channel occupied space is reduced.

[0017] Further, the RF interface is disposed at one end of the first lower cover away from the first cavity. The RF interface is connected to the duplexer assembly. The duplexer assembly includes three duplexers that form an annular arrangement structure. Each duplexer includes a receiving channel and a transmitting channel. One duplexer corresponds to two adjacent receiving RF interfaces and transmitting RF interfaces in the RF interface. The positions of the receiving and transmitting channels of the RF interface correspond to the positions of the connectors of the duplexer assembly one by one, directly connecting the duplexer assembly and eliminating the RF cable for interconnection, which can reduce costs and improve the performance indicators of the transmitting power and receiving noise figure.

[0018] Further, the TR assembly is fixedly connected to the duplexer assembly, and a thermal conductive silicone grease is coated on the contact surface between the duplexer assembly and the TR assembly. Coating the contact surface between the duplexer and the TR with thermal conductive silicone grease can improve the thermal conductivity.

[0019] Further, it further includes a second module, and the second module includes an intermediate frequency interface and a second cavity assembly:

[0020] The second cavity assembly includes a second cavity, a second upper cover, and a second lower cover;

[0021] The intermediate frequency interface is disposed at one end of the second upper cover away from the second cavity. The intermediate frequency interface is used to connect an external local oscillator module and a baseband module;

[0022] An intermediate frequency board is disposed between the second upper cover and the second cavity. The intermediate frequency board is used to amplify, attenuate, and filter the intermediate frequency signal;

[0023] A frequency conversion board is disposed between the second cavity and the second lower cover. The frequency conversion board is used to perform up / down frequency conversion processing on the received and transmitted signals.

[0024] Further, the intermediate frequency interface includes three receiving intermediate frequency interfaces, three transmitting intermediate frequency interfaces, one receiving local oscillator interface, and one transmitting local oscillator interface. The receiving intermediate frequency interface is connected to the receiving board, the transmitting intermediate frequency interface is connected to the transmitting board, the receiving local oscillator interface is connected to the receiving channel, and the transmitting local oscillator interface is connected to the transmitting channel.

[0025] Further, the RF interface between the first module and the second module is connected through an SMP connector. The SMP connector is a threaded connector, and threaded holes matching the SMP connector are provided on the TR assembly. The external RF cable is eliminated through the vertical interconnection structure, reducing the connection loss in this part, improving the final transmitting power, and reducing the overall noise figure of the machine. The SMP connector is fixed to the housing of the TR assembly by setting the SMP connector to match the threaded holes, reducing the stress between the SMP connector and the PCB.

[0026] Furthermore, digital attenuators are provided in both the transmitting channel and the receiving channel. The digital attenuators are used to adjust the dynamic range of the signals. The digital attenuators independently control the receiving channel and the transmitting channel respectively. A power detector is provided in the transmitting channel. The power detector is used to detect the transmitting power of each transmitting channel in real time. The power detector outputs a detection voltage and reports it to an external baseband module. The baseband module calculates the transmitting power based on the detection voltage.

[0027] Compared with the prior art, the present application has the following advantages and beneficial effects:

[0028] 1. Compared with other single-channel or multi-channel TR components, according to the layout design of the whole machine phased array antenna panel, a three-channel sequential rotation and alternating arrangement design is adopted to maximize the utilization of available space, and the present application is more in line with the layout requirements of large-scale digital phased arrays.

[0029] 2. An intermediate frequency conversion architecture is adopted without integrating AD and DA. The intermediate frequency input and output in the whole machine are connected to the baseband part through a bundled RF cable;

[0030] 3. It operates with a single power supply, has high reliability, and can reduce the cost of the spaceborne secondary power supply;

[0031] 4. It has higher gain and lower power consumption. Self-developed low-power chips are used to achieve power consumption reduction. The gain of a single chip is relatively high, reaching more than 30 dB. The high-gain amplifier can also reduce the number of amplifiers used, further reducing power consumption;

[0032] 5. It generates less heat and has good heat dissipation effects. The self-developed power amplifier has high efficiency, and the efficiency can reach more than 50% under P-1. The high efficiency brings the effect of low heat generation. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solutions of the exemplary embodiments of the present application, the drawings required for the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present application and should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts. In the drawings:

[0034] Figure 1 is an exploded view of the multi-channel TR component in the embodiment of the present application;

[0035] Figure 2 is the transceiver channel arrangement diagram of the multi-channel TR component in the embodiment of the present application;

[0036] Figure 3 is the installation and interconnection sectional view of the SMP connector in the embodiment of the present application;

[0037] Figure 4 This is the simulation diagram of the phase consistency of the local oscillator network in the embodiments of this application.

[0038] Marks in the attached drawings and corresponding component names:

[0039] 1. Intermediate frequency interface; 2. Second upper cover plate; 3. Intermediate frequency board; 4. RF insulator; 5. Second cavity; 6. Frequency conversion board; 7. Second lower cover plate; 8. SMP connector; 9. Low-frequency cable; 10. First upper cover plate; 11. Transmitting board; 12. Receiving board; 13. First cavity; 14. Power supply board; 15. First lower cover plate; 16. RF interface; 17. Receiving channel; 18. Transmitting channel. Specific embodiments

[0040] To make the objectives, technical solutions, and advantages of this application clearer and more understandable, the following further details this application in combination with embodiments and the attached drawings. The illustrative embodiments of this application and their descriptions are only used to explain this application and are not intended to limit this application.

[0041] Embodiment 1

[0042] As Figure 1 and Figure 2 shown, this embodiment provides an L-band low-earth orbit satellite multi-channel TR assembly, including a first module. The first module includes at least three receiving boards 12, at least three transmitting boards 11, and an RF interface 16:

[0043] The three receiving boards 12 and the three transmitting boards 11 are alternately arranged in sequence to form a circular structure;

[0044] The RF interface 16 specifically includes three receiving interfaces and three transmitting interfaces;

[0045] The receiving interfaces and the transmitting interfaces are alternately arranged to form a circular structure;

[0046] The three receiving boards 12 are respectively connected to the three receiving interfaces to form a receiving channel 17;

[0047] The three transmitting boards 11 are respectively connected to the three transmitting interfaces to form a transmitting channel 18.

[0048] This application is based on the DBF system on a spaceborne platform. The receiving and transmitting channels of the TR component work simultaneously, and FDD full-duplex communication is achieved by using different frequencies for receiving and transmitting. By arranging three receiving boards 12 and three transmitting boards 11 alternately in each TR component, the three receiving boards 12 and the three transmitting boards 11 are arranged alternately in sequence to form a circular structure. The RF interface 16 is provided, which specifically includes three receiving interfaces and three transmitting interfaces. The structures are respectively connected to the receiving board 12 and the transmitting board 11 to form a receiving channel 17 and a transmitting channel 18. By arranging the receiving and transmitting channels alternately, multiple receiving and transmitting channels are integrated in the component, reducing the size while improving the integration degree, and at the same time meeting the requirements of the antenna array layout.

[0049] In some possible embodiments, the RF interface 16 uses an SMP-J connector, and the intermediate frequency interface 1 uses an SSMA-J connector.

[0050] In some possible embodiments, the circular arrangement structure formed by the receiving board 12 and the transmitting board 11 is arranged in the first cavity component. The first cavity component includes a first cavity 13, a first upper cover plate 10, and a first lower cover plate 15 that enclose together to form a cavity.

[0051] In some possible embodiments, a power supply board 14 is arranged in the first cavity component. The power supply board 14 is used for integrated circuits and provides power. The power supply board 14 is provided with an analog temperature sensor, and the analog temperature sensor is used to report the temperature analog information of each TR component to the external baseband module. The baseband module adjusts the calibration amount in real time according to the temperature of each TR component to compensate for the influence brought by temperature changes. The reason for using an analog temperature sensor instead of a digital temperature sensor is that the analog temperature sensor has high reliability, while ordinary digital temperature sensors have low reliability and cannot perform on-orbit tasks, and the price of aerospace-grade digital temperature sensors is too high. Using an analog temperature sensor can meet the reliability requirements while reducing costs.

[0052] The power supply board 14 is also used to install an LDO voltage regulator, a PMOS switch, a control driver, etc., to provide clean and reliable 5V and 3.3V power for each channel. To improve the isolation degree between channels, each channel is independently equipped with an LDO. This method can also improve reliability and avoid the problem that when all channels use only one LDO, once the LDO fails, all channels cannot be used. After the six SMP connectors 8 connecting the duplexer pass through the metal housing, they are welded on the power supply board 14, and then connected to a glass insulator welded on the cavity B through a section of microstrip transmission line, and transmitted to the receiving board 12 and the transmitting board 11 through the glass insulator. The two ends of the glass insulator are respectively welded to the power supply board 14, the receiving board 12, and the transmitting board 11. In this way, the power supply board 14 can also provide the function of RF signal transfer.

[0053] In some possible embodiments, each receiving radio frequency interface 16 and each transmitting radio frequency interface 16 are evenly arranged at 60°. This reduces the channel occupancy space.

[0054] In some possible embodiments, the radio frequency interface 16 is disposed at one end of the first lower cover plate 15 away from the first cavity 13. The radio frequency interface 16 is connected to the duplexer assembly. The duplexer assembly includes three duplexers that form an annular arrangement structure. Each duplexer includes a receiving channel 17 and a transmitting channel 18. One duplexer corresponds to two adjacent receiving radio frequency interfaces 16 and transmitting radio frequency interfaces 16 of the radio frequency interface 16. The transceiver channel positions of the radio frequency interface 16 correspond one-to-one with the positions of the connectors 8 of the duplexer assembly, directly connecting the duplexer assembly, eliminating the need for an interconnecting radio frequency cable, which can reduce costs and improve the performance indicators of the transmit power and receive noise figure. The reason for arranging the three duplexers in an annular arrangement structure is that there are three duplexers in the duplexer assembly. To minimize the size of the duplexer assembly, the three duplexers are arranged in a circular shape, with each duplexer spaced 120°.

[0055] In some possible embodiments, the TR component is fixedly connected to the duplexer assembly, and a thermal conductive silicone grease is coated on the contact surface between the duplexer assembly and the TR component. The TR component is fixed to the duplexer assembly by M3 screws, and the contact surface between the duplexer and the TR is coated with thermal conductive silicone grease, which can improve the thermal conductivity. After the duplexer assembly and the TR component are fixed into a whole using screws, they are then installed on the external phased array antenna mounting plate using screws. Using the duplexer assembly as a radiator for the TR component, the heat generated by the TR component is conducted to the duplexer and then to the external phased array antenna mounting plate, and the overall machine thermal control management is carried out by the external phased array antenna thermal control unit. The radio frequency port arrangement of the TR component is determined according to the transceiver port positions of the duplexer assembly, and the TR component and the duplexer are directly interconnected vertically using SMP connectors 8. By this structural design, the external radio frequency cable is eliminated, reducing the connection loss in this part, improving the final transmit power, and reducing the overall machine noise figure.

[0056] In the present application, the TR component is powered by a single power supply, which is beneficial to reducing the cost of the on-board secondary power supply. Each transceiver channel has an independent power supply circuit, and each channel can independently turn on / off the power supply.

[0057] In some possible embodiments, it further includes a second module. The second module includes an intermediate frequency interface 1 and a second cavity assembly:

[0058] The second cavity assembly includes a second cavity 5, a second upper cover plate 2, and a second lower cover plate 7;

[0059] The intermediate frequency interface 1 is disposed at one end of the second upper cover plate 2 away from the second cavity 5. The intermediate frequency interface 1 is used to connect an external local oscillator module and a baseband module;

[0060] An intermediate frequency board 3 is disposed between the second upper cover plate 2 and the second cavity 5. The intermediate frequency board 3 is used for amplifying, attenuating, and filtering intermediate frequency signals;

[0061] A frequency conversion board 6 is disposed between the second lower cover plate 7 of the second cavity 5. The frequency conversion board 6 is used for performing up / down frequency conversion processing on the transceiver signals.

[0062] As Figure 4 shown, the frequency conversion board 6 includes a mixer, a transceiver local oscillator power distribution network, and a local oscillator drive amplifier for performing intermediate frequency / radio frequency spectrum shifting. The length error of the local oscillator network is within 0.5 mm. After verification by three-dimensional electromagnetic field simulation, the phase difference between the local oscillator networks is within 1.3°.

[0063] The intermediate frequency board 3 includes an intermediate frequency amplifier, an LC filter, amplitude and phase consistency debugging positions, etc.

[0064] The power consumption of a single receiving channel 17 is 0.45 W, and the receiving gain is greater than 90 dB under low power consumption; the power consumption of a single transmitting channel 18 is 6.9 W under P-1 transmit power.

[0065] The signals input at intermediate frequency are further filtered and amplified by the intermediate frequency board 3, then sent to the frequency conversion board 6 through the radio frequency insulator 4 for up-conversion processing, and signal processing such as amplification and attenuation is performed. Among them, the radio frequency insulator 4 is disposed in the second cavity 5. The signals output by the frequency conversion board 6 are output to the transmitting board 11 through the SMP connector 8, and after filtering, power amplification, power detection, isolation protection, etc., they are output through the SMP connector 8.

[0066] The signals received by the antenna first enter the receiving board 12, are amplified, filtered, etc., then sent to the frequency conversion board 6 through the SMP connector 8, down-converted, and then sent to the intermediate frequency board 3 through the radio frequency insulator 4, and further amplified, filtered, amplitude and phase consistency adjustment, etc., and finally output through the SSMA connector 8.

[0067] In some possible embodiments, the intermediate frequency interface 1 includes three receiving interfaces, three transmitting interfaces, one receiving local oscillator interface, and one transmitting local oscillator interface. The receiving interfaces are connected to the receiving board 12, the transmitting interfaces are connected to the transmitting board 11, the receiving local oscillator interface is connected to the receiving channel 17, and the transmitting local oscillator interface is connected to the transmitting channel 18.

[0068] As Figure 3As shown, the radio frequency interface 16 between the first module and the second module is connected through the SMP connector 8. The SMP connector 8 is a threaded connector, and a threaded hole matching the SMP connector 8 is provided on the TR component. The external radio frequency cable is eliminated through the vertical interconnection structure, reducing the connection loss of this part, increasing the final transmission power, and reducing the overall noise figure of the machine. The SMP connector 8 is set to match the threaded hole, and the SMP connector 8 is fixed on the housing of the TR component to reduce the stress between the SMP connector 8 and the PCB. The power supply and control lines are interconnected through the low-frequency cable 9. To improve reliability, all SMP connectors 8 are not directly soldered to the PCB. Instead, by selecting a threaded connector and opening a matching threaded hole on the metal housing, the connector 8 is rotated and screwed into the metal housing to fix the SMP connector 8 on the metal housing, reducing the stress between the SMP connector 8 and the PCB.

[0069] In some possible embodiments, each transceiver channel has an independent digital control attenuator. The digital control attenuator is used to adjust the dynamic range of the signal, facilitating the calibration of the entire phased array antenna. To reduce the control lines and improve reliability, the digital control attenuators of the receiving and transmitting channels 18 are independently controlled respectively, and the digital control attenuators of all receiving channels 17 are controlled simultaneously, and the digital control attenuators of the transmitting channels 18 are controlled simultaneously.

[0070] A power detector is provided in each of the transmitting channels 18. The power detector is used to detect the transmission power of each transmitting channel 18 in real time. After the isolator output, a 20 dB coupler is connected, and the coupled signal is sent into the power detector. The power detector outputs a detection voltage and reports it to the external baseband module. The baseband module calculates the transmission power based on the detection voltage.

[0071] The above specific embodiments have further elaborated on the purpose, technical solutions, and beneficial effects of the present application. It should be understood that the above is only the specific embodiments of the present application and is not used to limit the protection scope of the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. An L-band low-earth orbit satellite multi-channel TR module, characterized in that, Comprising a first module, the first module includes at least three receiving boards (12), at least three transmitting boards (11) and a radio frequency interface (16): The three receiving boards (12) and the three transmitting boards (11) are alternately arranged in sequence to form a circular structure; The radio frequency interface (16) specifically includes three receiving interfaces and three transmitting interfaces; The receiving interfaces and the transmitting interfaces are alternately arranged to form a circular structure; The three receiving boards (12) are respectively connected to the three receiving interfaces correspondingly to form a receiving channel (17); The three transmitting boards (11) are respectively connected to the three transmitting interfaces correspondingly to form a transmitting channel (18); Specifically, the circular arrangement structure formed by the receiving boards (12) and the transmitting boards (11) is arranged in a first cavity assembly, and the first cavity assembly includes a first cavity (13), a first upper cover plate (10) and a first lower cover plate (15) that enclose together to form a cavity; Each of the receiving interfaces and each of the transmitting interfaces are evenly arranged at 60° intervals; The radio frequency interface (16) is arranged at one end of the first lower cover plate (15) away from the first cavity (13), and the radio frequency interface (16) is connected to a duplexer assembly. The duplexer assembly includes three duplexers that form a circular ring arrangement structure. Each duplexer includes a receiving channel (17) and a transmitting channel (18), and one duplexer corresponds to two adjacent receiving interfaces and transmitting interfaces in the radio frequency interface (16); Comprising a second module, the second module includes an intermediate frequency interface (1) and a second cavity assembly: The second cavity assembly includes a second cavity (5), a second upper cover plate (2) and a second lower cover plate (7); The intermediate frequency interface (1) is arranged at one end of the second upper cover plate (2) away from the second cavity (5), and the intermediate frequency interface (1) is used to connect an external local oscillator module and a baseband module; An intermediate frequency board (3) is arranged between the second upper cover plate (2) and the second cavity (5), and the intermediate frequency board (3) is used to amplify, attenuate and filter intermediate frequency signals; A frequency conversion board (6) is arranged between the second cavity (5) and the second lower cover plate (7), and the frequency conversion board (6) is used to perform up / down frequency conversion processing on the transceiver signals; The intermediate frequency interface (1) includes three receiving interfaces, three transmitting interfaces, a receiving local oscillator interface and a transmitting local oscillator interface. The receiving interfaces are connected to the receiving boards (12), the transmitting interfaces are connected to the transmitting boards (11), the receiving local oscillator interface is connected to the receiving channel (17), and the transmitting local oscillator interface is connected to the transmitting channel (18); Digital control attenuators are arranged in both the transmitting channel (18) and the receiving channel (17). The digital control attenuators are used to adjust the dynamic range of the signals. The digital control attenuators independently control the receiving channel (17) and the transmitting channel (18) respectively. Power detectors are arranged in the transmitting channel (18), and the power detectors are used to detect the transmitting power of each transmitting channel (18) in real time.

2. The L-band low-earth orbit satellite multi-channel TR module according to claim 1, characterized in that, A power supply board (14) is provided inside the first cavity component. The power supply board (14) is used for integrated circuits and providing power. The power supply board (14) is provided with an analog temperature sensor, and the analog temperature sensor is used to report temperature analog information of each TR component to an external baseband module.

3. The L-band low-earth orbit satellite multi-channel TR module according to claim 1, characterized in that, The TR component is fixedly connected to the duplexer component, and a thermal conductive silicone grease is coated on the contact surface between the duplexer component and the TR component.

4. The L-band low-earth orbit satellite multi-channel TR module according to claim 1, characterized in that, The radio frequency interface (16) between the first module and the second module is connected through an SMP connector (8). The SMP connector (8) adopts a threaded connector (8), and a threaded hole matching the SMP connector (8) is provided on the TR component.

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