Removable heat sink

Abstract

A heat sink with a disassembly function includes a heat dissipation structure and a disassembly device. The heat dissipation structure includes a base and a heat dissipation element disposed on the base, and a through hole passes through the base. The disassembly device includes a shell, which is disposed on the base and covers the through hole, wherein the shell has an air cavity and an air hole connected to the air cavity, wherein the air hole is connected to the through hole or is located in the through hole; and an adjustment element, which is movably disposed in the air cavity. By moving the adjustment element, the gas in the shell is discharged through the air hole.

Description

Technical Field

[0001] The present invention relates to a heat sink, and more particularly to a heat sink with a removal function. Background Art

[0002] In order to quickly dissipate heat from a chip, a heat sink is generally disposed on the chip to conduct the heat generated by the chip to the heat sink. In addition, a thermal conductive material is coated between the chip and the heat sink to increase the thermal conductivity efficiency therebetween.

[0003] However, when the heat sink needs to be removed from the chip, the paste-like thermal conductive material will cause suction force between the heat sink and the chip, making it difficult to separate the heat sink from the chip. In particular, for the chips used in servers, the processing efficiency of the chips is increased by increasing the area of the chips. When the area of the chip is larger, the suction force between the heat sink and the chip caused by the thermal conductive material is greater, making it even more difficult to separate the heat sink from the chip. Therefore, an improved solution for the heat sink is needed. Summary of the Invention

[0004] In view of this, in the present invention, a removal device is provided on the heat sink to assist in separating the heat sink from a chip with a large surface area.

[0005] An embodiment of the present invention discloses a heat sink with a removal function, including a heat dissipation structure and a removal device. The heat dissipation structure includes a base and a heat dissipation element disposed on the base, and a through hole penetrates through the base. The removal device includes a housing disposed on the base and covering the through hole, wherein the housing has a gas chamber and a gas hole communicating with the gas chamber, and the gas hole communicates with the through hole or is located within the through hole; and an adjustment element movably disposed in the gas chamber. By moving the adjustment element, the gas in the housing is discharged through the gas hole.

[0006] According to an embodiment of the present invention, the base is used to attach to a chip via a thermal conductive layer. The through hole contacts the thermal conductive layer, and by moving the adjustment element, the gas in the housing is discharged to the thermal conductive layer through the gas hole.

[0007] According to an embodiment of the present invention, the heat sink further includes a clamping mechanism disposed on the base and used to connect to a circuit board. The clamping mechanism is used to clamp the chip between the circuit board and the base.

[0008] According to an embodiment of the present invention, the clamping mechanism includes a rod passing through the base and connecting to the circuit board; and a side elastic element sleeved on the rod and abutting against the base.

[0009] According to an embodiment of the present invention, the air hole includes a connection section connected to the air cavity, a receiving section connecting the connection section, and an exhaust opening connected to the receiving section. The remover further includes a stop element movably disposed within the receiving section; and an elastic element disposed within the receiving section and applying an elastic force to the stop element to cause the stop element to cover the connection section. When the adjustment element moves toward the air hole, the gas in the air cavity pushes the stop element toward the exhaust opening.

[0010] According to an embodiment of the present invention, the housing further includes a main body and a cover connected to the main body, wherein the air cavity and the air hole are located within the main body, and the exhaust opening is located within the cover.

[0011] According to an embodiment of the present invention, the cover and the exhaust opening are located within the through hole.

[0012] According to an embodiment of the present invention, the diameter of the stop element is greater than the diameter of the exhaust opening and the diameter of the connection section. The diameter of the stop element, the diameter of the exhaust opening, and the diameter of the connection section are measured in the same direction.

[0013] According to an embodiment of the present invention, the air cavity includes a first section and a second section connected to the air hole. The adjustment element includes a rotating portion screwed to the inner sidewall of the first section; and a piston portion contacting the inner sidewall of the second section. When the rotating portion is rotated, the piston portion moves toward the air hole.

[0014] According to an embodiment of the present invention, the through hole is located at the center of the base, the housing extends perpendicular to the base, and is connected to the inner wall of the through hole. Description of the Drawings

[0015] Figure 1 A perspective view of a radiator with a removal function according to an embodiment of the present invention.

[0016] Figure 2 An exploded view of a radiator with a removal function according to an embodiment of the present invention.

[0017] Figure 3 A cross-sectional view of a radiator with a removal function according to an embodiment of the present invention.

[0018] Figure 4 An exploded view of a remover according to an embodiment of the present invention.

[0019] Figure 5An enlarged cross-sectional view of a radiator with a removal function according to an embodiment of the present invention, where the adjustment element is in an initial position.

[0020] Figure 6 An enlarged cross-sectional view of a radiator with a removal function according to an embodiment of the present invention, where the adjustment element is in a pushed position.

[0021] Main element symbol description

[0022] Radiator 1

[0023] Heat dissipation structure 10

[0024] Base 11

[0025] Through hole 111

[0026] Heat dissipation element 12

[0027] Clamping mechanism 20

[0028] Rod 21

[0029] Side elastic element 22

[0030] Remover 30

[0031] Housing 31

[0032] Body 311

[0033] Protrusion 311a

[0034] Cover 312

[0035] Air cavity 313

[0036] First section 313a

[0037] Second section 313b

[0038] Air hole 314

[0039] Connection section 314a

[0040] Accommodation section 314b

[0041] Exhaust opening 314c

[0042] Adjustment element 32

[0043] Rotating part 321

[0044] Piston part 322

[0045] First sealing ring 323

[0046] Stop element 33

[0047] Elastic element 34

[0048] Second sealing ring 35

[0049] Chip A1

[0050] Thermal conductive layer A2

[0051] Circuit board A3

[0052] Housing A4

[0053] Bottom plate A41

[0054] Spacer element A5

[0055] Arrangement direction D1

[0056] The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings. Specific embodiments

[0057] For the convenience of those of ordinary skill in the art to understand and implement the present invention, the following provides a further detailed description of the present invention in conjunction with the drawings and embodiments. It should be understood that the present invention provides many applicable creative concepts, which can be implemented in various specific forms. The specific embodiments discussed in the text are only specific ways of manufacturing and using the present invention, and are not intended to limit the scope of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present invention.

[0058] In addition, repeated reference numerals or signs may be used in different embodiments. These repetitions are only for the purpose of simply and clearly describing the present invention, and do not represent any correlation between the different embodiments and / or structures discussed. It should be noted that when an element is considered to be "connected" to another element, it may be directly connected to the other element or there may be intervening elements present. When an element is considered to be "disposed on" another element, it may be directly disposed on the other element or there may be intervening elements present.

[0059] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0060] Figure 1 A perspective view of a radiator 1 having a removal function according to an embodiment of the present invention. Figure 2Exploded view of the radiator 1 with a removal function according to an embodiment of the present invention. Figure 3 Cross-sectional view of the radiator 1 with a removal function according to an embodiment of the present invention. The radiator 1 is used to be disposed on the chip A1 and dissipate heat from the chip A1. In this embodiment, there is a thermal conductive layer A2 between the radiator 1 and the chip A1. The chip A1 is disposed on the circuit board A3, and the radiator 1, the chip A1, and the circuit board A3 are disposed within the housing A4. For the purpose of simplicity, in the drawing, part of the housing A4 is omitted, and only the bottom plate A41 of the housing A4 is drawn. In addition, an electronic device may include the radiator 1, the thermal conductive layer A2, the chip A1, the circuit board A3, and the housing A4. The aforementioned electronic device may be a personal computer, a server, a notebook computer, a smart phone, or a tablet computer, etc., but is not limited thereto.

[0061] The radiator 1 may include a heat dissipation structure 10, a plurality of clamping mechanisms 20, and a remover 30. The heat dissipation structure 10 is disposed on the chip A1. The remover 30 and the clamping mechanisms 20 are disposed on the heat dissipation structure 10. The remover 30 may be a vacuum breaker. When removing the heat dissipation structure 10 from the chip A1, the remover 30 provides gas between the chip A1 and the heat dissipation structure 10 to reduce the adsorption force between the chip A1 and the heat dissipation structure 10.

[0062] The heat dissipation structure 10 includes a base 11 and one or more heat dissipation elements 12. The base 11 may be a plate-like structure. The base 11, the thermal conductive layer A2, the chip A1, the circuit board A3, and the bottom plate A41 of the housing A4 may be arranged in sequence along the arrangement direction D1 and may extend perpendicular to the arrangement direction D1. The base 11 and the heat dissipation elements 12 may be made of a thermal conductive material or metal. In addition, a through hole 111 penetrates through the base 11 and may be located at the center of the base 11. The heat dissipation elements 12 are disposed on the base 11. In this embodiment, the heat dissipation elements 12 may be fins and are arranged parallel to each other on the base 11. In another embodiment, the heat dissipation elements 12 may be heat pipes or water cooling cavities.

[0063] The clamping mechanism 20 is disposed on the base 11 and is used to connect to the circuit board A3. The clamping mechanism 20 is used to clamp the chip A1 between the circuit board A3 and the base 11. The clamping mechanism 20 is located at the edge of the base 11. When the clamping mechanism 20 clamps the circuit board A3 and the base 11, the clamping mechanism 20 is separated from the chip A1. In this embodiment, each clamping mechanism 20 includes a rod 21 and a side elastic element 22. The rod 21 may extend along the arrangement direction D1. The rod 21 penetrates through the base 11 and is connected to the circuit board A3. The side elastic element 22 is sleeved on the rod 21. The side elastic element 22 may be a spring. One end of the side elastic element 22 abuts against the top end of the rod 21, and the other end of the side elastic element 22 abuts against the upper surface of the base 11.

[0064] In this embodiment, a plurality of spacer elements A5 are disposed on the bottom plate A41 of the housing A4, and the circuit board A3 is disposed on the spacer elements A5. In other words, the circuit board A3 is separated from the bottom plate A41 of the housing A4 by the spacer elements A5. The bottom end of the rod member 21 can pass through the circuit board A3 and be connected to the spacer element A5. In this embodiment, the spacer element A5 is a hollow columnar body, and the bottom end of the rod member 21 is inserted into the spacer element A5.

[0065] Figure 4 It is an exploded view of the remover 30 according to an embodiment of the present invention. Figure 5 It is an enlarged cross-sectional view of the radiator 1 with a removal function according to an embodiment of the present invention, wherein the adjustment element 32 is in an initial position. The remover 30 includes a housing 31, an adjustment element 32, a stop element 33, and an elastic element 34. The housing 31 is disposed on the base 11 and covers the through hole 111. The housing 31 extends perpendicular to the base 11. The housing 31 further includes a main body 311 and a cover 312. The main body 311 extends perpendicular to the base 11. In this embodiment, the main body 311 may have a protrusion 311a. The outer sidewall of the protrusion 311a and the inner sidewall of the through hole 111 have threads. The protrusion 311a can be screwed into the through hole 111.

[0066] The cover 312 is connected to the protrusion 311a of the main body 311 and is located within the protrusion 311a of the main body 311. In this embodiment, the outer sidewall of the cover 312 and the inner sidewall of the protrusion 311a have threads. The cover 312 can be screwed onto the protrusion 311a.

[0067] The main body 311 and the cover 312 are hollow structures. The housing 31 has an air chamber 313 and an air hole 314. The air chamber 313 is located within the main body 311. The air hole 314 communicates with the air chamber 313. In addition, part of the air hole 314 can be located within the main body 311, and part of the air hole 314 can be located within the cover 312. In another embodiment, all of the air holes 314 can be located within the cover 312. The air chamber 313 and the air hole 314 are filled with gas. In this embodiment, the aforementioned gas is air.

[0068] In this embodiment, the housing 31 (or the main body 311) can be connected to the inner sidewall of the through hole 111, and the cover 312 and the air hole 314 are located within the through hole 111. In another embodiment, the main body 311 does not include a protrusion 311a. The housing 31 (or the main body 311) can cover the upper opening of the through hole 111, and the cover 312 and the air hole 314 are connected or communicate with the upper opening of the through hole 111. The aforementioned upper opening is connected to the upper surface of the bottom plate A41.

[0069] The adjustment element 32 is movably disposed within the air chamber 313. By moving the adjustment element 32, the gas within the housing 31 is discharged through the air hole 314. In the present embodiment, the adjustment element 32 may be a T-shaped structure. The adjustment element 32 includes a rotating portion 321 and a piston portion 322. The outer sidewall of the rotating portion 321 and the inner sidewall of the first section 313a have threads. The rotating portion 321 is screwed to the inner sidewall of the first section 313a. The piston portion 322 contacts the inner sidewall of the second section 313b. When the aforementioned rotating portion 321 is rotated, the piston portion 322 moves toward the air hole 314. At this time, the gas within the air chamber 313 is pushed by the piston portion 322 and flows toward the air hole 314.

[0070] In the present embodiment, the adjustment element 32 may further include a first sealing ring 323. The first sealing ring 323 is disposed on the piston portion 322 and is located between the piston portion 322 and the inner sidewall of the second section 313b. The first sealing ring 323 can prevent the gas within the air chamber 313 from leaking out of the housing 31 through the gap between the adjustment element 32 and the housing 31.

[0071] The air hole 314 includes a connecting section 314a, a receiving section 314b, and an exhaust opening 314c. The connecting section 314a is connected to the bottom of the air chamber 313. The receiving section 314b is connected to the bottom of the connecting section 314a. The exhaust opening 314c is connected to the bottom of the receiving section 314b and is located within the cover body 312. The air chamber 313, the connecting section 314a, the receiving section 314b, and the exhaust opening 314c may be arranged in sequence along the arrangement direction D1. In the present embodiment, the exhaust opening 314c is located within the through hole 111. In another embodiment, the exhaust opening 314c is connected or communicated with the upper opening of the through hole 111.

[0072] The stop element 33 is movably disposed within the receiving section 314b. In the present embodiment, the stop element 33 may be a sphere and is adjacent to the connecting section 314a. The elastic element 34 is disposed within the receiving section 314b. One end of the elastic element 34 may abut against the bottom of the receiving section 314b, and the other end of the elastic element 34 abuts against the stop element 33. The elastic element 34 can apply an elastic force to the stop element 33 to cause the stop element 33 to cover the connecting section 314a.

[0073] Figure 6 A magnified cross-sectional view of the radiator 1 having a discharging function according to an embodiment of the present invention, wherein the adjustment element 32 is in a pushing position. As Figure 6As shown, when the adjusting element 32 moves towards the air hole 314, the gas in the air chamber 313 pushes the elastic element 34 towards the exhaust opening 314c. In other words, at this time, the gas in the air chamber 313 can flow into the accommodating section 314b, and then the gas in the air hole 314 is discharged out of the housing 31 through the exhaust opening 314c.

[0074] In this embodiment, the discharger 30 may further include a second sealing ring 35 disposed on the housing 31. The second sealing ring 35 may be located between the housing 31 and the through hole 111 to prevent the gas discharged by the discharger 30 from leaking through the gap between the housing 31 and the base 11. In addition, the diameter of the stop element 33 is larger than the diameter of the exhaust opening 314c and the diameter of the connecting section 314a. The diameters of the stop element 33, the exhaust opening 314c, and the connecting section 314a are measured in the same direction. Therefore, the stop element 33 can completely cover the lower opening of the connecting section 314a. In addition, the elastic element 34 or the sphere will not detach from the housing 31 through the exhaust opening 314c.

[0075] As Figure 3 and Figure 5 shown, when the radiator 1 is mounted on the chip A1 and the circuit board A3, the base 11 is attached to the chip A1 via the heat conducting layer A2 to increase the heat dissipation efficiency of the chip A1. In addition, the air between the base 11 and the chip A1 will be exhausted as much as possible to prevent the air from reducing the heat conduction efficiency between the base 11 and the chip A1. As Figure 5 shown, the through hole 111 contacts the heat conducting layer A2. By the stop of the adjusting element 32, the gas in the housing 31 (or the air chamber 313 and the air hole 314) will not flow into the heat conducting layer A2 or between the base 11 and the chip A1 through the exhaust opening 314c. Furthermore, by the stop element 33 covering the connecting section 314a of the air hole 314, the gas in the housing 31 (or the air chamber 313 and the air hole 314) can be further stopped from flowing into the heat conducting layer A2 or between the base 11 and the chip A1 through the exhaust opening 314c. Therefore, when the adjusting element 32 is in the initial position, air will not enter between the base 11 and the chip A1 due to the discharger 30, nor will the heat dissipation efficiency of the chip A1 be significantly reduced.

[0076] As Figure 3 and Figure 6As shown, when removing the radiator 1 from the chip A1, the clamping mechanism 20 can be removed first. Then rotate the adjusting element 32 so that the adjusting element 32 moves towards the air hole 314. At this time, driven by the piston part 322, the gas in the air chamber 313 pushes the stop element 33 and flows into the air hole 314. Furthermore, the gas in the housing 31 (or the air hole 314 and / or the air chamber 313) is discharged to the heat conduction layer A2 or between the base 11 and the chip A1 through the exhaust opening 314c of the air hole 314. Therefore, the gas entering between the base 11 and the chip A1 can reduce the adsorption force between the base 11 and the chip A1, and thus the user can more easily remove the heat dissipation structure 10 from the chip A1.

[0077] In summary, the radiator with a removal function of the present invention helps the radiator to separate from the chip by providing a remover on the radiator. When removing the heat dissipation structure from the chip, rotate the remover so that the remover provides gas between the chip and the heat dissipation structure, thereby reducing the adsorption force between the chip and the heat dissipation structure. Therefore, the user can more easily remove the radiator from the chip.

[0078] For those of ordinary skill in the art, other corresponding changes or adjustments can be made according to the actual needs generated by combining the creative solutions and concepts of the present invention, and these changes and adjustments should fall within the protection scope of the claims of the present invention.

Claims

1. A heat sink with a disassembly function, characterized in that: include: A heat dissipation structure includes a base and a heat dissipation element disposed on the base, and a through hole passes through the base; as well as A remover, comprising: a shell, disposed on the base and covering the through hole, wherein the shell has an air cavity and an air hole connected to the air cavity, wherein the air hole is connected to the through hole or located in the through hole, and the air hole includes a connecting section connected to the air cavity, a containing section connected to the connecting section, and an exhaust opening connected to the containing section; an adjusting element movably disposed in the air cavity; a stopper element movably disposed in the accommodating section; and an elastic element, disposed in the accommodating section and applying an elastic force to the stop element so that the stop element covers the connecting section, When the adjusting element moves toward the air hole, the gas in the air cavity pushes the stop element to move toward the exhaust opening, so that the gas in the shell is discharged through the air hole by moving the adjusting element.

2. The heat sink with removal function as claimed in claim 1, characterized in that: The base is used to be attached to a chip via a heat conducting layer. The through hole contacts the heat-conducting layer, and the gas in the shell is discharged to the heat-conducting layer through the air hole by moving the adjusting element.

3. The heat sink with removal function as claimed in claim 2, characterized in that: Also includes: A clamping mechanism is disposed on the base and is used to connect to a circuit board; The clamping mechanism is used to clamp the chip between the circuit board and the base.

4. The heat sink with removal function as claimed in claim 3, characterized in that: The above-mentioned clamping mechanism comprises: a rod member, penetrating the base and connected to the circuit board; and The elastic element on one side is sleeved on the rod and abuts against the base.

5. The heat sink with removal function as claimed in claim 1, characterized in that: The shell further comprises a main body and a cover connected to the main body, wherein the air cavity and the air hole are located in the main body, and the exhaust opening is located in the cover.

6. The heat sink with removal function as claimed in claim 5, characterized in that: The cover body and the exhaust opening are located in the through hole.

7. The heat sink with disassembly function as claimed in claim 1, characterized in that: The diameter of the stop element is larger than the diameter of the exhaust opening and the diameter of the connecting section, wherein the diameter of the stop element, the diameter of the exhaust opening and the diameter of the connecting section are measured in the same direction.

8. The heat sink with disassembly function as claimed in claim 1, characterized in that: The air cavity includes a first section and a second section connected to the air hole, and the adjustment element includes: a rotating portion, screwed to the inner wall of the first section; and a piston portion, contacting the inner side wall of the second section, When the rotating part is rotated, the piston part moves toward the air hole.

9. The heat sink with disassembly function as claimed in claim 1, characterized in that: The through hole is located at the center of the base, and the shell extends perpendicularly to the base and is connected to the inner wall of the through hole.

Images