Electronics packaging for phase change cooling systems

Abstract

An electronics system package / enclosure may include an external chassis, an internal chassis housed within the external chassis, and a condenser chassis housed within the external chassis, wherein the condenser chassis is located on top of the internal chassis. The electronics system package may include: a condenser unit housed in the condenser chassis for condensing vapor into a two-phase liquid coolant; and IT electronics housed within the internal chassis, wherein the internal chassis is at least partially immersed in the two-phase liquid coolant, wherein heat generated within the internal chassis is transferred to the two-phase liquid coolant, thereby converting at least some of the two-phase liquid coolant into vapor.

Description

Technical Field

[0001] Embodiments of the present invention generally relate to server and data center cooling. More specifically, embodiments of the present invention relate to electronics packaging for phase change cooling systems. Background Art

[0002] Thermal management of data centers containing numerous active electronic racks is crucial to ensure proper performance of servers and / or other IT equipment operating in the racks (e.g., performing IT services). However, without proper thermal management, the thermal environment (e.g., temperature) within the racks may exceed thermal operating thresholds, which can lead to adverse consequences (e.g., server failures, etc.). One approach to managing the thermal environment is to use chilled air to cool the IT equipment. The chilled air is recirculated through cooling units. Heat generated by the IT equipment is captured by the chilled air and extracted by the cooling units.

[0003] Recently, data centers have been deploying more high-power density electronic racks, where more high-density chips are packed more tightly together to provide more computing power. Cooling these high-density racks by maintaining an appropriate thermal environment can be a problem for existing cooling systems (such as any air-cooled based system). For example, while cooling air can maintain the thermal environment of more conventional (or lower density) racks, the unit may not be able to effectively cool high-power density racks because they may generate heat loads at a higher rate due to the higher density of electronic components. Or it may require a large cost to upgrade the air cooling system to meet the cooling requirements of the high-density deployment. Another challenge for air cooling high-density racks is moving a large amount of airflow sufficient to cool the racks.

[0004] Immersion cooling, on the other hand, involves at least partially immersing electronics in a dielectric solution, a viable solution for high-density electronics. However, implementing immersion cooling in existing data centers presents challenges. Existing solutions for immersion systems are primarily container-based, with IT equipment immersed in a tank. This approach clearly lacks adaptability. BRIEF DESCRIPTION OF THE DRAWINGS

[0005] Embodiments of the invention are illustrated by way of example and not limitation in the figures of the accompanying drawings in which like references indicate similar elements.

[0006] Figure 1 is a block diagram illustrating a side view of a cooling system 100 according to one embodiment.

[0007] Figure 2 is a block diagram illustrating a top view of a cooling system 100 according to one embodiment.

[0008] Figure 3 is a block diagram illustrating a side view of a cooling system 100 having a cooling fluid management module according to one embodiment.

[0009] Figure 4 is a block diagram illustrating a cooling system 100 mounted on an electronics rack according to one embodiment.

[0010] Figure 5 is a flow chart illustrating a method of managing cooling fluid flow according to one embodiment.

[0011] Figure 6 is a flow chart illustrating a method of packaging a server chassis according to one embodiment. DETAILED DESCRIPTION

[0012] Various embodiments and aspects of the present invention will be described with reference to the details discussed below, and the accompanying drawings will illustrate various embodiments. The following description and drawings are illustrative of the present invention and should not be construed as limiting the present invention. Many specific details are described to provide a thorough understanding of the various embodiments of the present invention. However, in some cases, well-known or conventional details are not described in order to provide a concise discussion of embodiments of the present invention.

[0013] Reference in this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present invention. The phrase "in one embodiment" appearing in various places in the specification does not necessarily refer to the same embodiment.

[0014] Aspects of the present disclosure relate to a two-phase immersion cooling system with a reliable chassis enclosure. The chassis enclosure may include a chassis within a chassis to enhance enclosure reliability, wherein each chassis is fully sealed. One or more management modules are connected between the internal chassis and the external chassis to manage the cooling fluid and / or two-phase coolant used by the chassis.

[0015] According to a first aspect, an electronics system package includes an external chassis, an internal chassis housed within the external chassis, and a condenser chassis housed within the external chassis, the condenser chassis being located on top of the internal chassis. The electronics system package includes a condenser unit housed in the condenser chassis, configured to condense vapor into a liquid phase; and IT electronics housed within the internal chassis, wherein the IT electronics are at least partially immersed in a two-phase liquid coolant. When the IT electronics provide IT services, heat generated by the IT electronics is transferred to the two-phase liquid coolant, thereby converting at least some of the two-phase liquid coolant into vapor.

[0016] In one embodiment, the inner chassis, the outer chassis, and / or the condenser chassis include a sealed container. In one embodiment, the electronics rack further includes a liquid level sensor coupled to the inner chassis to sense the level of the two-phase liquid coolant contained within the inner chassis. In one embodiment, the electronics rack further includes a two-phase coolant management module housed within the outer chassis but external to the inner chassis.

[0017] In one embodiment, a two-phase coolant management module is coupled between the first inlet port of the external chassis and the inlet port of the internal chassis, wherein the two-phase coolant management module is configured to regulate the flow of two-phase liquid coolant from the coolant unit to the IT electronics within the internal chassis. In one embodiment, the electronics system package further comprises a coolant management module housed within the external chassis but external to the condenser chassis.

[0018] In one embodiment, the coolant management module couples the second inlet port of the external chassis to the inlet port of the condenser chassis, wherein the coolant management module is configured to regulate the flow of coolant from the external cooling source to the condenser unit within the condenser chassis. In one embodiment, a liquid level sensor is configured to cause the two-phase coolant management module to regulate the flow of the two-phase liquid coolant and to cause the coolant management module to regulate the flow of the coolant.

[0019] In one embodiment, the electronics system package further comprises a coolant unit coupled to the electronics system package. The coolant unit comprises an infusion pump, a drainage pump, and a first three-way valve having a first port coupled to the infusion pump, a second port coupled to the inlet port of the internal chassis, and a third port coupled to the central coolant system. The coolant unit comprises a second three-way valve having a fourth port coupled to the drainage pump, a fifth port coupled to the outlet port of the internal chassis, and a sixth port coupled to the central coolant system. In one embodiment, the electronics system package further comprises a condenser pump for circulating coolant from a cooling source to the condenser unit, causing the condenser unit to condense vapor into a liquid phase.

[0020] In one embodiment, the internal chassis housed within the external chassis includes a plurality of internal chassis, wherein each internal chassis houses corresponding IT electronics that provide IT services. In one embodiment, each internal chassis includes a corresponding liquid level sensor and a corresponding two-phase coolant management module coupled to the internal chassis, wherein the corresponding liquid level sensor causes the corresponding two-phase coolant management module to regulate the flow of two-phase liquid coolant from the coolant unit to the internal chassis. In one embodiment, the condenser chassis and the internal chassis are enclosed within the external chassis, wherein the internal chassis includes a plurality of internal chassis.

[0021] According to a second aspect, a system monitors the level of a two-phase liquid coolant within an internal chassis, wherein the internal chassis houses IT electronics, wherein the IT electronics are at least partially immersed in the two-phase liquid coolant. When the IT electronics provide IT services, heat generated by the IT electronics is transferred to the two-phase liquid coolant, thereby converting at least some of the two-phase liquid coolant into vapor. The system controls the operation of a two-phase coolant pump coupled to the internal chassis and a priming pump coupled to a coolant unit, including increasing the speed of the two-phase coolant pump and / or the priming pump if the level falls below a first predetermined threshold. The system also controls the operation of a condenser pump coupled to a condenser chassis, including increasing the speed of the condenser pump if the level falls below a second predetermined threshold.

[0022] In one embodiment, the system further controls operation of a valve coupled to the two-phase coolant pump, wherein if the valve is open, the two-phase liquid coolant will flow to the internal chassis, wherein if the valve is closed, the two-phase liquid coolant will flow to the other internal chassis.

[0023] According to a third aspect, an information technology (IT) equipment cooling system includes a coolant unit that supplies a two-phase liquid coolant, and an electronics system package coupled to the coolant unit. The electronics system package includes an external chassis, an internal chassis housed within the external chassis, and a condenser chassis housed within the external chassis, the condenser chassis being located on top of the internal chassis. The electronics system package includes: a condenser unit housed in the condenser chassis for condensing vapor into the two-phase liquid coolant; and IT electronics housed within the internal chassis, wherein the IT electronics are at least partially immersed in the two-phase liquid coolant. When the IT electronics provide IT services, heat generated by the IT electronics is transferred to the two-phase liquid coolant, thereby converting at least some of the two-phase liquid coolant into vapor.

[0024] Figure 1 is a block diagram illustrating a side view of a cooling system 100 according to one embodiment. As shown, cooling system 100 may include an electronics system package that may include an external chassis 101, an internal chassis 103, and a cooling chassis 105. Cooling chassis 105 and internal chassis 103 may be entirely enclosed within external chassis 101. In one embodiment, cooling chassis 105 may be located on top of internal chassis 103. In one embodiment, only internal chassis 103, and not cooling chassis 105, may be enclosed within external chassis 101.

[0025] The internal chassis 103 can operate as an immersed container and can include IT electronics 104 at least partially immersed in a two-phase liquid coolant. The liquid coolant is a dielectric coolant. The IT electronics 104 can include processors, memory, and storage devices typically used by data processing systems such as servers. The IT electronics 104 generate heat during operation. The cooling chassis 105 can include a condenser unit 106, which can be used to condense vapor into a liquid phase. The cooling chassis 105 includes a port 119 to receive / release coolant circulating in the condenser unit 106. Vapor from the internal chassis 103 rises to the cooling chassis 105 and condenses back into a liquid phase.

[0026] In one embodiment, the external chassis 101 includes a coolant inlet port 107 and a coolant outlet port 109 located on the external chassis 101. The coolant inlet port 107 can be used to transfer the two-phase liquid coolant from a two-phase liquid coolant container such as a Figure 4 The coolant outlet port 109 can be used to release the two-phase liquid coolant from the cooling system 100 to a two-phase liquid coolant container such as a Figure 4 container 411).

[0027] In one embodiment, the cooling system 100 may include a management module 111 between the inlet port 107 of the external chassis 101 and the inlet port of the internal chassis 103. The management module 111 may include a controller 121, a pump 113, and a valve 115. It should be noted that the management module 111 may be a separate module or may be packaged as part of the external chassis 101.

[0028] In one embodiment, the internal chassis 103 includes a liquid level sensor 117. The controller 121 can receive a signal from the liquid level sensor 117 to monitor the liquid level within the internal chassis 103. The controller 121 can use the received signal to control the pump 113 and the valve 115 of the management module 111. In one scenario, if the controller 121 detects a low liquid level (e.g., the level of the two-phase liquid coolant) within the internal chassis 103 via the liquid level sensor 117, the controller 121 activates the pump 113 and the valve 115 to pump in the two-phase liquid coolant from the two-phase liquid coolant container.

[0029] Figure 2 is a block diagram illustrating a top view of a cooling system 100 according to one embodiment. Figure 2 The inner housing 103 is shown contained within the outer housing 101. In one embodiment, a fluid level sensor 117 is housed within the inner housing 103, wherein a signal indicator from the fluid level sensor 117 can be used to activate / deactivate the valve 115 and / or the pump 113.

[0030] In one embodiment, the internal chassis 103 includes inlet / output ports 201, 203, which are coupled to the fluid ports 107, 109, respectively, via fluid connection lines. In one embodiment, the cooling system 100 includes a valve 205 at the fluid connection line between the ports 203 and 109. For service and maintenance purposes, the valve 205 can be opened to release fluid from the internal chassis 103.

[0031] In one embodiment, the cooling system 100 may include a management module 111 at the connection line between the port 201 and the port 107. The management module 111 may interconnect the internal chassis 103 to the external chassis 101. Signals from the fluid level sensor 117 may activate / deactivate the valve 115 and the pump 113 of the management module 111 to pump fluid into the internal chassis 103.

[0032] In summary, the overall architecture of cooling system 100 shows that inner chassis 103 is completely enclosed within outer chassis 101, wherein inner chassis 103 can be filled with a two-phase liquid coolant. Because both chassis 101, 103 are designed to be sealed in the two-phase liquid coolant, this chassis-within-a-chassis design doubles the protection against potential leaks of the coolant fluid compared to a single chassis design. In addition, a fluid control and management module, such as management module 111, can be designed between inner chassis 103 and outer chassis 103. That is, the fluid control and management module can be fixed within outer chassis 101 but outside the two-phase liquid coolant maintained in inner chassis 103, thereby further increasing the design flexibility of the components of the fluid control and management module.

[0033] Figure 3 is a block diagram showing a side view of a cooling system 300 having cooling fluid management modules 111, 311 according to one embodiment. The cooling system 300 may represent Figure 11. As shown, the cooling chassis 105 is enclosed within the external chassis 103. In one embodiment, the cooling chassis 105 is interconnected with the external chassis 103 via a cooling fluid management module 311. The cooling fluid management module can be used to manage the cooling fluid of the cooling chassis 105. In one embodiment, the cooling fluid management module 311 includes a pump 313 and a valve 315. The pump 313 and the valve 315 can receive a start signal for circulating the fluid to the condenser unit 106. In one embodiment, the pump 313 and the valve 315 receive a control signal from the management module 111 or the liquid level sensor 117. For example, the controller 121 can receive a signal from the liquid level sensor 117 to monitor the liquid level within the internal chassis 103. The controller 121 can use the received signal to control the pumps 113, 313 and the valves 115, 315 of the management modules 111, 311. In one scenario, if the controller 121 detects a low liquid level (e.g., the level of the two-phase liquid coolant) within the internal chassis 103 via the liquid level sensor 117, the controller 121 may activate the pumps 113, 313 and valves 115, 315 to pump the coolant into the condenser unit 106 and the two-phase liquid coolant into the internal chassis 103. Thus, when the liquid level is low, the controller 121 may increase the flow rate of the cooling fluid to condense the vapor back into the liquid coolant more quickly, or increase the flow rate to remove the two-phase liquid coolant from the coolant container (such as a coolant container). Figure 4 Container 411) is pumped into the internal chassis 103. The controller 121 can be adjusted to provide a more optimized design. In the case where the liquid level reaches a high value, the controller 121 can open a valve (such as Figure 2 valve 205) to release the two-phase liquid coolant from the internal chassis 103.

[0034] Figure 4 is a block diagram illustrating a cooling system 300 installed on an electronics rack 403 according to one embodiment. System 400 illustrates that cooling system 300 can be integrated with electronics rack 403, and a coolant unit 405 adjacent to electronics rack 403 can serve as an intermediate for storing a two-phase liquid coolant for cooling system 300.

[0035] In one embodiment, the coolant unit 405 may include a container 411 for intermediate storage of a two-phase liquid coolant. The coolant unit 405 may include pumps 413, 415 and three-way valves 407, 409. The three-way valves 407, 409 may be used to control the functions of the pumps 413, 415, respectively.

[0036] For example, the fill pump 413 can be used to pump coolant from the coolant unit 405 into the chassis 101, or to pump coolant from the coolant unit 405 into the central coolant system (outlet) of the data center facility. The discharge pump 415 can be used to pump coolant from the external chassis 101 into the coolant unit 405, or to pump coolant from the central coolant system (inlet) into the coolant unit 405. The status of each valve is shown below.

[0037] In one embodiment, for valve 407, if ports 1 and 2 are open, priming pump 413 is operated to pump coolant from coolant unit 405 into chassis 101. If ports 1 through 3 of valve 407 are open, priming pump 413 is operated to pump coolant from coolant unit 405 into the central coolant system (outlet).

[0038] In one embodiment, for valve 409, if ports 4 and 5 are open, the bleed pump 415 is operated to pump coolant from chassis 101 into coolant unit 405. If ports 4 through 6 of valve 409 are open, the bleed pump 415 is operated to pump coolant from the central coolant system (inlet) into coolant unit 405. Although a three-way valve is shown in this embodiment, different two-way valve combinations may be used in place of the three-way valve.

[0039] In one embodiment, the system 400 may include a circulation pump 419 to circulate the coolant to be delivered to the cooling chassis 105. The circulation pump 419, the filling pump 407, and the drain pump 409 may be designed at the rack level for fluid control and management.

[0040] In summary, cooling system 300 can be a stand-alone cooling system for server units / IT electronics, or can be installed in an electronics rack, where the electronics rack can include one or more cooling systems 300. Cooling system 300 includes local pumps 113 and 311, and system 400 includes a recirculation pump 419, a priming pump 413, and a drain pump 415. Figure 4 The set of five pumps 113, 311, 413, 415, and 419 shown in FIG include some pumping redundancy and allow for a failure scenario where any one pump ceases operation and the cooling system will remain operational. Note that while one cooling system 300 is shown, system 400 may include multiple cooling systems 300 mounted on electronics rack 403.

[0041] Figure 5 is a flow chart illustrating a method of managing cooling fluid flow according to one embodiment. Process 500 may be performed by processing logic that may include software, hardware, or a combination thereof. For example, process 500 may be performed by Figure 1 Cooling system 100 or Figure 3The controller 121 of the cooling system 300 is executed.

[0042] refer to Figure 5 At block 501 , processing logic monitors the level of the two-phase liquid coolant within the internal chassis. The controller 121 receives a signal from the level sensor 117 .

[0043] At block 503 , processing logic controls the operation of the priming pump, the two-phase coolant pump, and the valves based on the liquid level.

[0044] For example, Figure 4 As shown, controller 121 can activate priming pump 413, two-phase coolant pump 113, and / or valve 115. If valve 115 is open, the two-phase liquid coolant will flow to internal chassis 103, wherein if valve 115 is closed, the two-phase liquid coolant will flow to another internal chassis (not shown) of another cooling system mounted on electronics rack 403.

[0045] At block 505 , if the liquid level is below a first predetermined threshold, processing logic increases the speed of the priming pump and / or the two-phase coolant pump.

[0046] For example, if the fluid level is below a first preset level, the controller 121 may increase the speed of the priming pump 413 and / or the two-phase coolant pump 113 , thereby increasing the fluid flow rate and cooling capacity provided by the circulating fluid.

[0047] At block 507 , if the liquid level is below the second predetermined threshold, processing logic controls the condenser pump 313 to pump coolant into the cooling chassis 105 .

[0048] For example, if the liquid level is lower than a second preset liquid level, the controller 121 may activate the coolant pump 313 to obtain additional cooling capacity.

[0049] Figure 6 6 is a flow chart illustrating a method for packaging a server chassis according to one embodiment. Process 600 may be performed by processing logic that may include software, hardware, or a combination thereof. For example, process 600 may be performed at a manufacturing facility through an automated packaging process.

[0050] refer to Figure 6 At block 601 , processing logic packages the internal chassis 103 with IT electronics such as compute and storage electronics, high-density accelerators, and server systems.

[0051] At block 603 , processing logic packages the cooling chassis 105 with the condenser unit 106 (eg, condenser).

[0052] At block 605 , processing logic encloses the inner chassis 103 and the cooling chassis 105 entirely within the outer chassis 101 , with the cooling chassis 105 positioned above the inner chassis 103 .

[0053] At block 607, processing logic packages the fluid management module 311 and the two-phase management module 111 within the external chassis 101. In one embodiment, the cooling management module 311 and the two-phase management module 111 may be built into the external chassis 101 or may be separate modules from the external chassis 101.

[0054] At block 609 , processing logic connects the two-phase management module 111 and the cooling management module 311 between the external chassis 101 and the internal chassis 103 and between the external chassis 101 and the cooling chassis 105 , respectively.

[0055] In the foregoing description, embodiments of the present invention have been described with reference to specific exemplary embodiments thereof. It will be apparent that various modifications may be made thereto without departing from the broader spirit and scope of the present invention as set forth in the appended claims. Accordingly, the present description and drawings are to be construed as illustrative rather than restrictive.

Claims

1. An electronic component system package, comprising: External chassis; an internal chassis housed within the external chassis; a condenser chassis housed within the outer chassis, the condenser chassis being located on top of the inner chassis; a condenser unit housed in the condenser enclosure for condensing the vapor into a two-phase liquid coolant; Information technology (IT) electronic components housed within the internal chassis, wherein the IT electronic components are at least partially immersed in the two-phase liquid coolant, wherein when the IT electronic components operate, heat generated by the IT electronic components is transferred to the two-phase liquid coolant, thereby converting at least some of the two-phase liquid coolant into vapor; a liquid level sensor coupled to the internal chassis to sense a liquid level of the two-phase liquid coolant contained within the internal chassis; a two-phase coolant management module housed within the outer chassis but external to the inner chassis; and a coolant management module housed within the external chassis but external to the condenser chassis; The liquid level sensor is used to enable the two-phase coolant management module to regulate the flow of the two-phase liquid coolant, and to enable the cooling liquid management module to regulate the flow of the cooling liquid.

2. The electronic system package according to claim 1, wherein: The inner chassis, the outer chassis, or the condenser chassis includes a sealed container.

3. The electronic system package according to claim 1, wherein: The two-phase coolant management module is coupled between the first inlet port of the external chassis and the inlet port of the internal chassis, wherein the two-phase coolant management module is used to regulate the flow of two-phase liquid coolant from a coolant unit to the IT electronics within the internal chassis.

4. The electronic system package according to claim 1, wherein: The coolant management module couples the second inlet port of the external chassis to the inlet port of the condenser chassis, wherein the coolant management module is used to regulate the flow of coolant from an external cooling source to the condenser unit within the condenser chassis.

5. The electronic system package according to claim 1, wherein: The internal chassis housed in the external chassis includes a plurality of internal chassis, wherein each of the plurality of internal chassis houses corresponding IT electronic components that provide IT services.

6. The electronic system package according to claim 5, wherein: Each of the plurality of internal chassis includes a respective liquid level sensor and a respective two-phase coolant management module coupled to the internal chassis, wherein the respective liquid level sensor causes the respective two-phase coolant management module to regulate a flow of two-phase liquid coolant from a coolant unit to the internal chassis.

7. The electronic system package according to claim 1, wherein: The condenser chassis and the inner chassis are enclosed within the outer chassis, wherein the inner chassis comprises a plurality of inner chassis.

8. A method of managing a cooling fluid flow, comprising: monitoring a level of a two-phase liquid coolant within an internal chassis, wherein the internal chassis houses information technology (IT) electronics, wherein the IT electronics are at least partially immersed in the two-phase liquid coolant, wherein heat generated by the IT electronics when providing IT services is transferred to the two-phase liquid coolant, thereby converting at least some of the two-phase liquid coolant into vapor; controlling operation of a two-phase coolant pump coupled to the internal chassis and a priming pump coupled to a coolant unit, the operation comprising increasing the speed of the two-phase coolant pump and / or the priming pump if the liquid level is below a first predetermined threshold; and Operation of a condenser pump coupled to the condenser case is controlled, the operation including increasing a speed of the condenser pump if the liquid level is below a second predetermined threshold.

9. The method of claim 8, further comprising controlling operation of a valve coupled to the two-phase coolant pump, wherein If the valve is open, the two-phase liquid coolant will flow toward the internal chassis, wherein if the valve is closed, the two-phase liquid coolant will flow toward the other internal chassis.

10. An information technology (IT) equipment cooling system comprising: a coolant unit for supplying a two-phase liquid coolant; as well as A cooling fluid circuit for conveying cooling fluid; as well as an electronics system package coupled to the coolant unit and connected to the cooling fluid circuit, the electronics system package comprising: External chassis; an internal chassis housed within the external chassis; a condenser chassis housed within the outer chassis, the condenser chassis being located on top of the inner chassis; a condenser unit housed in the condenser enclosure for condensing the vapor into a two-phase liquid coolant; Information technology (IT) electronic components housed within the internal chassis, wherein the IT electronic components are at least partially immersed in the two-phase liquid coolant, wherein when the IT electronic components provide IT services, heat generated by the IT electronic components is transferred to the two-phase liquid coolant, thereby converting at least some of the two-phase liquid coolant into vapor; a liquid level sensor coupled to the internal chassis to sense a liquid level of the two-phase liquid coolant contained within the internal chassis; a two-phase coolant management module housed within the outer chassis but external to the inner chassis; and a coolant management module housed within the external chassis but external to the condenser chassis; The liquid level sensor is used to enable the two-phase coolant management module to regulate the flow of the two-phase liquid coolant, and to enable the cooling liquid management module to regulate the flow of the cooling liquid.

11. The IT equipment cooling system according to claim 10, wherein: The inner chassis, the outer chassis, or the condenser chassis includes a sealed container.

12. The IT equipment cooling system according to claim 10, wherein: The two-phase coolant management module is coupled between the first inlet port of the external chassis and the inlet port of the internal chassis, wherein the two-phase coolant management module is used to regulate the flow of two-phase liquid coolant from the coolant unit to the IT electronics within the internal chassis.

13. The IT equipment cooling system according to claim 10, wherein: The coolant management module couples the second inlet port of the external chassis to the inlet port of the condenser chassis, wherein the coolant management module is used to regulate the flow of coolant from an external cooling source to the condenser unit within the condenser chassis.

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