Separate system architecture for immersion cooling

Abstract

In one embodiment, a cooling system includes an information technology (IT) cluster tier having a plurality of immersion tanks, each immersion tank including electronic components immersed in a two-phase liquid coolant, and a cooling capacity tier including a vapor subsystem, a liquid subsystem, and a condenser chiller. The system also includes a distribution tier including vapor lines for carrying vapor from each of the immersion tanks to the vapor subsystem, and liquid lines for distributing liquid from the liquid subsystem to each of the immersion tanks in the IT cluster tier. The two subsystems operate independently to effectively maintain proper liquid levels in the immersion tanks.

Description

Technical Field

[0001] Embodiments of this disclosure generally relate to cooling systems. More specifically, embodiments of this disclosure relate to a separate immersion cooling system. Background Technology

[0002] Effective thermal management solutions can reduce the cooling costs of electronic equipment in data centers. For a thermal management solution to be effective, it should meet the power consumption of the data center at any given time with minimal cooling capacity buffering, be self-adjusting as power consumption changes in the data center, have sufficient hardware design flexibility to adapt to evolving IT needs, and support phase change cooling systems.

[0003] Immersion cooling has been widely used as a cooling method in which IT components and other electronic devices (including complete servers) are immersed in a thermally conductive liquid or coolant. The liquid is circulated to direct contact with the hot IT components or servers, and then heat is removed from the IT components or other electronic devices via a heat exchanger.

[0004] However, existing cooling systems using immersion cooling often include excessively large cooling buffers that may never be used throughout the entire lifespan of the data center and servers, resulting in wasted cooling capacity. Furthermore, existing cooling systems are not easily scalable to accommodate varying heat loads or are not fully self-adjusting at the system level. Summary of the Invention

[0005] One aspect of this disclosure provides an immersion cooling system, comprising:

[0006] The information technology (IT) cluster layer includes multiple immersion chambers, each of which includes electronic components immersed in a two-phase liquid coolant.

[0007] A cooling capacity layer includes a vapor subsystem, a liquid subsystem, and a condenser cooler connecting the vapor subsystem and the liquid subsystem; and

[0008] The distribution layer includes a vapor line for conveying vapor from each of the plurality of immersion tanks to the vapor subsystem, and a liquid line for distributing liquid from the liquid subsystem to each of the plurality of immersion tanks in the IT cluster layer, wherein the vapor subsystem and the liquid subsystem operate independently to provide adequate cooling to the immersion tanks.

[0009] Another aspect of this disclosure provides an immersion-cooled data center, comprising:

[0010] The first IT cluster layer includes a first set of immersion chambers, wherein each of the first set of immersion chambers includes electronic components immersed in a two-phase liquid coolant.

[0011] The second IT cluster layer includes a second set of immersion chambers, each of which includes electronic components immersed in a two-phase liquid coolant.

[0012] The cooling capacity layer includes a first vapor subsystem, a first liquid subsystem, a second vapor subsystem, a second liquid subsystem, and a condenser cooler connected to the first vapor subsystem and the second vapor subsystem, as well as the first liquid subsystem and the second liquid subsystem;

[0013] The first distribution layer includes steam lines for conveying steam from each of the first set of immersion tanks to the first steam subsystem and liquid lines for distributing liquid from the first liquid subsystem to each of the first set of immersion tanks in the first IT cluster layer; and

[0014] The second distribution layer includes a steam line for conveying steam from each of the second set of immersion tanks to the second steam subsystem and a liquid line for distributing liquid from the second liquid subsystem to each of the second set of immersion tanks in the second IT cluster layer. Attached Figure Description

[0015] Embodiments of the invention are shown in the accompanying drawings by way of example rather than limitation, in which the same reference numerals denote similar elements.

[0016] Figure 1 An immersion cooling system according to one embodiment is shown.

[0017] Figure 2 An immersion cooling system according to one embodiment is also shown.

[0018] Figure 3 An immersion cooling system according to one embodiment is also shown.

[0019] Figure 4 An immersion cooling system according to one embodiment is also shown.

[0020] Figure 5 This illustrates how multiple IT clusters can share a single condenser cooler according to one implementation.

[0021] Figure 6 This is a flowchart illustrating the asynchronous process of immersion in the cooling system. Detailed Implementation

[0022] Various embodiments and aspects of the invention will be described with reference to the details discussed below, and the accompanying drawings will illustrate various embodiments. The following description and drawings are illustrative of the invention and do not constitute a limitation thereof. Numerous specific details are described to provide a thorough understanding of various embodiments of the invention. However, in some cases, well-known or conventional details have not been described in order to provide a concise discussion of embodiments of the invention.

[0023] The reference to "one embodiment" or "implementation" in the specification means that a particular feature, structure, or characteristic described in connection with that embodiment may be included in at least one embodiment of the invention. The phrase "in one embodiment" appearing in various places in the specification does not necessarily refer to the same embodiment.

[0024] According to various embodiments, this document describes a system architecture and design method for separating vapor storage and liquid distribution in an immersion cooling system to effectively handle dynamic changes in power and heat load. A three-layer structure is described. The first layer is the IT cluster layer, comprising various immersion tanks with electronic components at least partially immersed in a two-phase liquid coolant. The second layer is the distribution layer. The third layer is the cooling capacity layer, comprising the vapor subsystem, condenser, and liquid subsystem. The distribution layer connects the IT cluster layer and the cooling capacity layer.

[0025] In one implementation, the vapor subsystem and the liquid subsystem are separated, meaning that vapor from the immersion tank does not immediately condense into liquid but is stored in the vapor subsystem to create a vapor buffer for heat load and power variations. A condenser cooler with a compressor is used to connect the vapor subsystem and the liquid subsystem.

[0026] In one embodiment, each immersion tank includes a vapor line connected to a vapor subsystem and one or more liquid lines connected to a liquid subsystem. A liquid return port on the immersion tank is extendable to connect to an additional liquid source. The distribution layer utilizes the vapor and liquid lines to transfer vapor from the immersion tank to the vapor subsystem and to distribute liquid from the liquid subsystem to the immersion tank. The liquid lines may be regulated by level sensors within the immersion tank to regulate the volume of fluid flow from the liquid subsystem to the immersion tank. Furthermore, as an example, each immersion tank may include a fluid pump to facilitate liquid flow, particularly when liquid is needed due to a low liquid level within the immersion tank caused by a high vapor generation rate.

[0027] In one embodiment, the cooling system includes: an information technology (IT) cluster layer having multiple immersion tanks, each immersion tank including electronic components (e.g., processors, memory, storage devices, etc.) immersed in a two-phase liquid coolant; and a cooling capacity layer including a vapor subsystem, a liquid subsystem, and a condenser. The system also includes a distribution layer comprising vapor lines for conveying vapor from each of the immersion tanks to the vapor subsystem, and liquid lines for distributing liquid from the liquid subsystem to each immersion tank in the IT cluster layer, wherein the first vapor subsystem and the first liquid subsystem operate independently to provide adequate cooling to the immersion tanks.

[0028] In one embodiment, each immersion tank includes a level sensor for measuring the level of liquid coolant within the tank. A fluid pump is located either inside or outside the immersion tank. When the ambient temperature, as measured by a temperature sensor, falls below a threshold, a first vapor subsystem releases vapor to the condenser.

[0029] In one embodiment, the cooling capacity layer further includes a second liquid subsystem that distributes liquid via an extended port on the immersion tank to at least one of the immersion containers and to a first liquid vapor subsystem.

[0030] In one embodiment, the first IT cluster layer further includes an additional immersion tank, wherein the additional immersion tank receives liquid from the first liquid subsystem and the second liquid subsystem via an extension port on the additional immersion tank.

[0031] In one embodiment, the cooling capacity layer further includes a second vapor subsystem and a second liquid subsystem. The second vapor subsystem is used to receive vapor from the immersion tanks in the second IT cluster layer and release the vapor to the condenser. The second liquid subsystem is used to receive liquid from the condenser for distribution to each of the immersion tanks in the second IT cluster layer via a second distribution layer.

[0032] In one embodiment, each of the first vapor subsystem and the second vapor subsystem includes a vapor container and a pressure sensor, wherein each of the first liquid subsystem and the second liquid subsystem includes a liquid container and a level sensor. The first liquid subsystem and the second liquid subsystem are interconnected such that liquid flows directly between the two liquid subsystems.

[0033] In one implementation, the condenser is triggered or activated to operate when the ambient temperature, as measured by a temperature sensor, is below a specified threshold, the first vapor subsystem is filled with vapor at a level measured by a pressure sensor, and / or the liquid subsystem has a liquid level below a threshold measured by a level sensor.

[0034] In one embodiment, the cooling capacity layer and the first distribution layer work together to manage the vapor and liquid flows to maintain the appropriate liquid level in each of the plurality of immersion tanks.

[0035] The above-described embodiments are not exhaustive of all aspects of the invention. The invention is intended to include all embodiments that can be practiced from all suitable combinations of the various embodiments outlined above, and also includes embodiments disclosed in the following detailed description.

[0036] Various architectural designs in the various embodiments of this disclosure provide a fully self-regulating immersion cooling system with appropriately sized vapor buffers to accommodate changes in thermal load. The system is efficient in phase change management and power management, and therefore can meet the increasing power density in IT clusters, adapt to dynamic environmental changes, and effectively balance the mismatch between thermal load and cooling capacity.

[0037] Figure 1 An immersion cooling system 100 according to one embodiment is illustrated. The immersion cooling system 100 includes three layers: an IT cluster layer 121, a distribution layer 119, and a cooling capacity layer 117. The IT cluster layer 121 includes a plurality of immersion tanks 111, 113, and 115, each immersion tank including electronic components (e.g., servers) at least partially immersed in a two-phase immersion coolant. Examples of two-phase immersion liquid coolants include dielectric heat transfer liquids and water or oil. When the electronic components generate heat to bring the immersion liquid coolant to its boiling point, the immersion liquid coolant boils and turns into vapor.

[0038] like Figure 1 As shown, the vapor subsystem 103 and liquid subsystem 109 in cooling capacity layer 117 are shared by immersion tanks 111, 113, and 115. Vapor subsystem 103 includes a vapor container for storing and buffering vapor generated from each of immersion tanks 111, 113, and 115. Liquid subsystem 109 includes a liquid container for storing and buffering liquid for distribution to each of immersion tanks 111, 113, and 115.

[0039] like Figure 1As shown, the vapor subsystem 103 and liquid subsystem 109, located outside and above immersion tanks 111, 113, and 115, are completely separable. As used herein, separation means that the vapor stored in the vapor subsystem 103 does not immediately condense into liquid for storage in the liquid subsystem 109. Instead, the vapor subsystem 103 acts as a buffer for vapor that condenses into liquid to be distributed to each of immersion tanks 111, 113, and 115 when the liquid level in one or more immersion tanks drops to a certain level. The vapor subsystem 103 may release vapor to the condenser cooler 107 in response to determining that the vapor pressure within the vapor subsystem 103 exceeds a predetermined pressure threshold.

[0040] The immersion cooling system 100 needs to maintain sufficient immersion liquid coolant to at least partially immerse the electronic components in the immersion tank. For example, a specific range of immersion coolant levels can be specified for each immersion tank. If the level of immersion coolant in the immersion tank falls outside this range, more liquid needs to be dispensed from the liquid subsystem 109. Thus, the immersion cooling system 100 can release more vapor into the condenser 107, which may include a compressor for facilitating the condensation of vapor into liquid.

[0041] In one embodiment, the liquid levels in immersion tanks 111, 113, and 115 are not the only indicators that can trigger the dispensing of liquid from the liquid subsystem 109. Ambient temperature may also be considered. In one embodiment, since different IT units may require different immersion liquid levels, the liquid level sensors can be tuned to different thresholds for different IT units.

[0042] In one embodiment, even if vapor needs to be released to the condenser 107 based on the liquid levels in the immersion tanks 111, 113, and 115, the immersion cooling system 100 will not release vapor immediately. Instead, the immersion cooling system 100 can utilize changes in ambient temperature to improve vapor-liquid conversion efficiency.

[0043] Therefore, when it is necessary to release vapor to the condenser 107, the immersion cooling system 100 may wait until the ambient temperature, as measured by the temperature sensor 104, drops below a threshold before releasing the vapor to the condenser 107. At lower ambient temperatures, the atmosphere tends to have greater cooling capacity, thereby increasing the efficiency of the condenser 107. When the ambient temperature is higher, for example above a predetermined threshold, the immersion cooling system 100 will not release vapor to the condenser 107, even if it is necessary due to a low liquid level (i.e., liquid coolant level) in one of the immersion tanks. In this case, the immersion cooling system 100 may rely on the existing liquid coolant in the liquid subsystem 109 to create a low liquid level in one or more immersion tanks. Alternatively, when the vapor pressure in the vapor subsystem 103 reaches a level measured by a pressure sensor (not shown) within the vapor subsystem 103, the vapor may be released to the condenser 107. Similarly, when the liquid level in the liquid subsystem 109 drops below a certain level, which can be measured by a level sensor within the liquid subsystem 109, the condenser cooler 107 is activated to receive vapor from the vapor subsystem 103, condense the vapor into liquid, and transfer the liquid to the liquid subsystem 109 for storage. The cooling capacity layer 117 is configured to ensure that the vapor pressure in the vapor subsystem is maintained at a safe level and / or that the liquid level in the liquid subsystem 109 is maintained at a sufficient level.

[0044] The distribution layer 119 between the cooling capacity layer 117 and the IT cluster layer 121 includes steam lines (e.g., steam line 123) and liquid lines (e.g., liquid line 125). The steam lines are configured to connect the steam subsystem 103 to each immersion tank, and the liquid lines are configured to connect the liquid subsystem 109 to each immersion tank. In one embodiment, the layer may include custom lines, such as lines with different diameters, for auxiliary steam delivery.

[0045] Figure 2 An immersion cooling system 100 according to one embodiment is also shown. More specifically, Figure 2 This demonstrates how to control and regulate the liquid supplied to each immersion tank. (For example...) Figure 2As shown, level sensors 203, 207, and 211 are used to measure the liquid level in each immersion tank, and control valves 201, 205, and 209 are used to regulate the liquid distributed from the liquid subsystem 109 to each immersion tank to ensure an appropriate liquid level in each immersion tank. In one embodiment, variations in the opening of adjustable valves 201, 205, and 209 alter the volumetric flow rate of the liquid delivered to the tank. The distribution layer 119 operates independently to ensure that each of the immersion tanks 111, 113, and 115 uses the liquid supplied by the liquid subsystem 109 to maintain an appropriate coolant level therein, while the cooling capacity level operates independently to maintain an appropriate liquid level in the liquid subsystem 109.

[0046] Figure 3 An immersion cooling system 100 according to one embodiment is also shown. More specifically, Figure 3 The immersion cooling system 100 is shown to be expandable to include one or more additional liquid subsystems. In such cases... Figure 3 In the embodiment shown, the liquid subsystem 301 may be installed in the cooling capacity layer 117 and may be connected to the immersion tank 115 via the distribution / expansion port 303.

[0047] This embodiment illustrates a scenario where the immersion tank 115 has been upgraded to include a high-power-density electronic system that may require additional cooling capacity for short periods. If needed, the additional liquid subsystem 301 can provide additional cooling capacity by distributing additional cooling liquid to the immersion tank 115 to maintain the level of the immersion coolant within a predetermined range. Figure 3 As shown, the immersion tank can receive liquid from liquid subsystem 109 and liquid subsystem 301. Liquid subsystem 301 can be understood as a cooling capacity extension subsystem. This extension port can be designed as a module added to the immersion tank.

[0048] Figure 4 An immersion cooling system 100 according to one embodiment is also shown. (e.g.) Figure 4 As shown, the liquid subsystem 301 can be used to expand an existing liquid system (including the vapor subsystem 103, the condenser 107, and the liquid subsystem 109) and can be used to add a separate immersion tank 401.

[0049] In this embodiment, liquid coolant from liquid subsystem 301 can be distributed to liquid subsystem 109, and distributed to immersion tank 115 via expansion port 303, and distributed to additional immersion tank 401 via expansion port 411.

[0050] As shown in the figure, each of the immersion tanks 111, 113, 115 and 401 is equipped with one of the liquid pumps 401, 403, 405 and 409. Each liquid pump is controlled by a liquid level sensor in the immersion tank, which is used to measure the liquid level in the immersion tank.

[0051] In one implementation, pumps 401, 403, 405, and 409 may be required to ensure that liquid coolant in one or more liquid subsystems is timely distributed to immersion tanks 111, 113, 115, and 401. This is especially true when the distribution lines are long, requiring the liquid coolant to travel a long distance before reaching the immersion tanks, and / or when the liquid coolant has a high viscosity.

[0052] As described above, level sensors 203, 207, and 211 can be used to measure the liquid level in immersion tanks 111, 113, and 115. Level sensor 407 can be used to measure the liquid level in immersion tank 401. When the liquid level in the immersion tank drops below a predetermined level, the level sensor in the immersion tank can trigger an associated fluid pump configured for the immersion tank to draw additional liquid coolant into the immersion tank, thereby maintaining an appropriate level of liquid coolant in the immersion tank for immersing the electronic components.

[0053] Each fluid pump may be located within the immersion tank; for example, fluid pumps 401 and 405 are located within immersion tanks 111 and 115, respectively. Each fluid pump may also be located outside the immersion tank and directly connected to the distribution line; for example, fluid pumps 403 and 409 are integrated into the distribution line. Fluid pump 409 may draw liquid coolant from the liquid subsystem 301 into both immersion tank 115 and immersion tank 401.

[0054] Thus, various embodiments of the present architecture can increase cooling expansion, including cooling fluid, cooling fluid ports, and additional fluid pumps such as 409.

[0055] Figure 5 This illustrates how multiple IT clusters, according to one implementation, can share a single condenser cooler. Figure 5 In this example, two IT clusters are used to illustrate the sharing of condenser cooler 508 by multiple IT clusters. In different embodiments, more IT clusters / cluster layers may share condenser cooler 508.

[0056] As shown in the figure, the first IT cluster in the first IT cluster layer 504 includes immersion chambers 501, 503, and 505, and the second IT cluster in the second IT cluster layer 506 includes immersion chambers 507, 509, and 511. Each of the IT cluster layers 504 and 506 is connected to... Figure 1 The IT cluster layer 121 described herein is the same. Each immersion box in IT cluster layers 504 and 506 can be connected to... Figure 1 One of the immersion tanks 111, 113, and 115 shown is identical; and similarly connected to one of the liquid subsystems 513 and 519, and via a distribution layer ( Figure 5 (Not shown) is connected to one of the steam subsystems 517 and 515.

[0057] However, in Figure 5 In this configuration, capability layer 502 is shared by two IT cluster layers 504 and 506. A condenser cooler 508 receives steam from steam subsystems 517 and 515 and distributes the liquid condensed from the received steam to both liquid subsystems 513 and 519. Furthermore, the two liquid subsystems 513 and 519 are connected, and therefore liquid from each liquid subsystem can be shared with each other.

[0058] This configuration will allow capacity layer 502 to buffer more vapor because the vapor to be buffered comes from more immersion chambers. The additional buffered vapor allows capacity layer 502 to better utilize atmospheric temperature variations.

[0059] Figure 6 This is a flowchart illustrating the asynchronous process in an immersion cooling system. As shown, vapor generation and condensation, as well as liquid supply and return, are completely separated. Through this asynchronous process, the immersion cooling system ensures an appropriate thermal environment in each individual immersion chamber and can effectively regulate the condensation process based on changes in heat load, power, and other system or environmental variations. The asynchronous process also allows the immersion cooling system to operate non-perceptibly to accommodate these changes.

[0060] At box 601, vapor is generated in each of the many immersion tanks due to the heating of electronic components immersed in the two-phase coolant. At box 603, the vapor is raised to a vapor container in the vapor subsystem and stored in the vapor subsystem, as shown in box 605. At box 607, the vapor stored in the vapor subsystem is not immediately released to the condenser, but is released based on the liquid level in one or more immersion tanks as measured by a level sensor. This delayed vapor release provides a buffer for the vapor to adapt to changes in heat load, power, and other internal and external factors. At box 609, the condenser compresses and condenses the vapor into liquid and delivers the liquid to a liquid subsystem with a liquid container (box 611). At box 613, the liquid is stored in the liquid subsystem. At box 615, the liquid is distributed from the liquid subsystem to the immersion tanks and stored in the immersion tanks for cooling the electronic components within the immersion tanks. It should be noted that boxes 601 to 607 and boxes 617 to 611 can operate asynchronously.

[0061] In the foregoing description, embodiments of this disclosure have been described with reference to specific exemplary embodiments. It will be apparent that various modifications may be made thereto without departing from the broader spirit and scope of this disclosure as set forth in the appended claims. Therefore, the description and drawings are to be considered illustrative rather than restrictive.

[0062] As previously described, embodiments of this disclosure may be (or include) a non-transitory machine-readable medium (such as a microelectronic memory) having instructions stored thereon that program one or more data processing components (collectively referred to herein as "processors") to perform airflow management operations, such as controlling the fan speed of one or more fans of a battery module (and / or BBU rack). In other embodiments, some of these operations may be performed by specific hardware components containing hard-wired logic. Alternatively, these operations may be performed by any combination of a programmable data processing component and a fixed hard-wired circuit component of any of the battery modules described herein.

[0063] Although certain aspects have been described and illustrated in the accompanying drawings, it will be understood that these aspects are merely illustrative and not intended to limit the broad disclosure, and that this disclosure is not limited to the specific structures and arrangements shown and described, as various other modifications will be apparent to those skilled in the art. Therefore, this specification is to be considered illustrative rather than restrictive.

Claims

1. An immersion cooling system for use in a data center, comprising: The information technology (IT) cluster layer includes multiple immersion chambers, each of which includes electronic components immersed in a two-phase liquid coolant. A cooling capacity layer includes a vapor subsystem, a liquid subsystem, and a condenser cooler connecting the vapor subsystem and the liquid subsystem, wherein the liquid subsystem is a first liquid subsystem; and The distribution layer includes a vapor line for conveying vapor from each of the plurality of immersion tanks to the vapor subsystem, and a liquid line for distributing liquid from the liquid subsystem to each of the plurality of immersion tanks in the IT cluster layer, wherein the vapor subsystem and the liquid subsystem operate independently to provide adequate cooling to the immersion tanks; The cooling capacity layer further includes a second liquid subsystem that distributes liquid to at least one of the plurality of immersion tanks via an extension port on the immersion tank. Each of the immersion tanks includes a level sensor for measuring the level of liquid coolant in the immersion tank, wherein the level sensors in different immersion tanks are adjusted to different thresholds; The vapor subsystem stores and buffers vapor from the immersion tanks and releases vapor to the condenser based on the liquid level in one or more of the immersion tanks as measured by the liquid level sensor.

2. The system according to claim 1, wherein, Each of the immersion tanks is associated with a fluid pump located inside or outside the immersion tank to dispense liquid from the liquid subsystem based on the liquid level of the respective immersion tank.

3. The system according to claim 1, wherein, When the ambient temperature measured by the temperature sensor is lower than a predetermined temperature threshold or the vapor pressure in the vapor subsystem is higher than a predetermined pressure threshold, the vapor subsystem releases vapor into the condenser.

4. The system according to claim 3, wherein, The second liquid subsystem also distributes liquid to the first liquid subsystem.

5. The system according to claim 3, wherein, The IT cluster layer also includes an additional immersion tank, wherein the additional immersion tank receives liquid from the first liquid subsystem and the second liquid subsystem via an extension port on the additional immersion tank.

6. The system according to claim 1, wherein, In response to determining that the ambient temperature is below a predetermined temperature threshold, the vapor pressure of the vapor subsystem is above a predetermined pressure level threshold, or the liquid level in the liquid subsystem drops below a predetermined liquid level threshold, the condenser is triggered to operate.

7. The system according to claim 1, wherein, The cooling capacity layer and the distribution layer work together to manage the vapor and liquid flows to maintain appropriate liquid levels in each of the plurality of immersion tanks.

8. The system according to claim 1, wherein, The steam subsystem includes a steam container for buffering the steam received from the immersion tank before transferring it to the condenser.

9. The system according to claim 1, wherein, The liquid subsystem includes a liquid container that holds fluid that serves as a coolant buffer for the immersion tank.

10. An immersion-cooled data center, comprising: The first IT cluster layer includes a first set of immersion chambers, wherein each of the first set of immersion chambers includes electronic components immersed in a two-phase liquid coolant. The second IT cluster layer includes a second set of immersion chambers, each of which includes electronic components immersed in a two-phase liquid coolant. The cooling capacity layer includes a first vapor subsystem, a first liquid subsystem, a second vapor subsystem, a second liquid subsystem, and a condenser cooler connected to the first vapor subsystem and the second vapor subsystem, as well as the first liquid subsystem and the second liquid subsystem; The first distribution layer includes steam lines for conveying steam from each of the first set of immersion tanks to the first steam subsystem and liquid lines for distributing liquid from the first liquid subsystem to each of the first set of immersion tanks in the first IT cluster layer; and The second distribution layer includes a steam line for conveying steam from each of the second set of immersion tanks to the second steam subsystem and a liquid line for distributing liquid from the second liquid subsystem to each of the second set of immersion tanks in the second IT cluster layer. Each of the immersion tanks in the first IT cluster layer and the second IT cluster layer includes a level sensor for measuring the level of liquid coolant in the respective immersion tank, wherein the level sensors in different immersion tanks are adjusted to different thresholds; The first vapor subsystem and the second vapor subsystem store and buffer vapor from the respective immersion tanks, and release vapor to the condenser based on the liquid level in one or more of the immersion tanks as measured by the liquid level sensor.

11. The data center according to claim 10, wherein, The condenser is connected between the first vapor subsystem and the first liquid subsystem, and wherein the condenser is connected between the second vapor subsystem and the second liquid subsystem.

12. The data center according to claim 11, wherein, The condenser is configured to operate in response to determining that the ambient temperature is below a predetermined temperature threshold.

13. The data center according to claim 11, wherein, The condenser is configured to operate in response to determining that the vapor pressure in either the first vapor subsystem or the second vapor subsystem is higher than a predetermined pressure level threshold, or that the liquid level in either the first liquid subsystem or the second liquid subsystem drops below a predetermined liquid level threshold.

14. The data center according to claim 10, wherein, The first liquid subsystem is fluidly connected to the second liquid subsystem.

15. The data center according to claim 10, wherein, The first liquid subsystem is configured to maintain the liquid level in each of the first set of immersion tanks based on the level of the liquid coolant in the respective immersion tank, and the second liquid subsystem is configured to maintain the liquid level in each of the second set of immersion tanks based on the level of the liquid coolant in the respective immersion tank.

16. The data center according to claim 10, wherein, The first steam subsystem and the second steam subsystem operate independently, including independently buffering the steam received from the respective immersion tanks before transferring it to the condenser.

17. The data center according to claim 10, wherein, The first liquid subsystem and the second liquid subsystem operate independently, including independently buffering the liquid before supplying it from the condenser to the respective immersion tank.

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