Server rack components for advanced fluid placement

Abstract

An adapter core device is proposed in the present application, including a motherboard, a server connector module, a leakage sensor, and an electromagnetic device. In an embodiment, the motherboard includes a fluid channel assembled by a manual mating connector through a hose and a blind mating connector fixed on the other side. In an embodiment, the manual mating connector is connected to a rack connector of a rack manifold of an electronic rack, which is connected to an external cooling fluid source to receive cooling fluid from the external cooling fluid source and return cooling fluid to the external cooling fluid source. For example, the blind mating connector is capable of engaging or disengaging with a server fluid connector of a server chassis. In an embodiment, the server chassis includes a leakage sensor configured to detect leakage of cooling fluid within the server chassis.

Description

Technical Field

[0001] Embodiments of the present invention generally relate to electronics cooling, cooling hardware and packaging, liquid cooling, etc. More particularly, embodiments of the present invention relate to server rack components for advanced fluidic arrangements. Background Art

[0002] Cooling is a prominent factor in the design of electronic systems and data centers. The number of high-performance electronic components (such as high-performance processors) packaged inside servers has steadily increased, thereby increasing the amount of heat generated and dissipated during normal operation of the servers. If the environment in which the servers used in the data center operate is allowed to increase in temperature over time, the reliability of the servers will decrease. Maintaining an appropriate thermal environment is critical to the normal operation of these servers in the data center, as well as the server performance and lifespan. More effective and efficient cooling solutions are needed, especially when cooling these high-performance servers.

[0003] Maintaining high reliability of liquid cooling is important. Therefore, minimizing the amount of fluid leakage exposed to electronic equipment is important for deploying this technology in large-scale data centers.

[0004] Additionally, designing solutions that minimize the impact of leaked fluid in the event of a leak is also critical to deploying the solution on a large scale.

[0005] Conventional solutions can use fluid shutoff valves to isolate the fluid circuit, but this design introduces additional fluid components. Other conventional solutions can use separate pumps for each circuit, shutting off the pumps in the event of a leak. However, none of these existing solutions are adequate or suitable for server liquid cooling and electronics cooling. Summary of the Invention

[0006] In order to solve the technical problems existing in the prior art, the present invention proposes an adapter core device, an electronic rack and a server liquid cooling fluid cut-off system.

[0007] The present invention provides an adapter core device, comprising:

[0008] a motherboard comprising a fluid channel assembled by a manual-mate connector and a blind-mate connector, wherein the manual-mate connector is connected to a rack connector of a rack manifold of an electronics rack, the rack manifold being coupled to an external cooling fluid source to receive cooling fluid from the external cooling fluid source and return cooling fluid to the external cooling fluid source, wherein the blind-mate connector is engageable with and disengageable from a server fluid connector of a server chassis, wherein the server fluid connector is configured to supply cooling fluid to one or more cooling devices attached to one or more electronic devices for providing liquid cooling, the one or more electronic devices being housed within the server chassis, wherein the server chassis comprises a leak sensor configured to detect a leak of the cooling fluid within the server chassis;

[0009] an electromagnetic device attached to the server side of the motherboard, wherein the electromagnetic device is coupled to a server connector module and the leakage sensor, the electromagnetic device comprising:

[0010] electromagnets; and

[0011] a controller coupled to the electromagnet, the controller modifying the magnetic field associated with the electromagnet in response to receiving a leak signal from the leak sensor, the leak signal indicating a fluid leak,

[0012] The blind-mate connector is disengaged from the server fluid connector.

[0013] In some embodiments, a spring structure is attached to the chassis side of the mainboard to provide an opposing force to the magnetic field.

[0014] In some embodiments, the manual mating connector is connected to the rack connector of a rack manifold of the electronics rack via a hose.

[0015] In some embodiments, the server connector module with the server fluid connector is attached within the server chassis on a rear side of the server chassis.

[0016] In some embodiments, the electromagnet is connected to an electrical circuit coupled to a DC voltage source.

[0017] In some embodiments, the controller is coupled to a switch on the circuit to provide power to or remove power from the electromagnet in response to a leakage signal received from the leakage sensor.

[0018] In some embodiments, when the magnetic field associated with the electromagnet is modified to lose magnetism, the adapter core device is urged away from the server chassis, causing the blind-mate connector to disengage from the server fluid connector.

[0019] In some embodiments, when the adapter-core device is pushed away from the server chassis, the server chassis and the rack manifold remain stationary.

[0020] In some embodiments, the adapter core device is urged toward a connected position when the magnetic field associated with the electromagnet is modified to be magnetic.

[0021] The present invention provides an electronic rack, comprising:

[0022] a rack manifold coupled to an external cooling fluid source to receive cooling fluid from the external cooling fluid source and to return cooling fluid to the external cooling fluid source, wherein the rack manifold includes a plurality of connectors; and

[0023] A plurality of adapter core devices are stacked and arranged, wherein the adapter core devices are the adapter core devices according to the above embodiment.

[0024] The present invention also provides a server liquid cooling fluid shut-off system, comprising:

[0025] A plurality of server chassis, wherein the plurality of server chassis are stacked;

[0026] a rack manifold coupled to an external cooling fluid source to receive cooling fluid from the external cooling fluid source and to return cooling fluid to the external cooling fluid source, wherein the rack manifold includes a plurality of connectors; and

[0027] A plurality of adapter core devices are stacked and arranged, wherein the adapter core devices are the adapter core devices according to the above embodiment. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Embodiments of the invention are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings and in which like references indicate similar elements.

[0029] Figure 1 An adapter core design according to an embodiment of the present application is shown.

[0030] Figure 2A and Figure 2B An adapter core design with a server according to certain embodiments of the present application is shown.

[0031] Figure 3An adapter core is shown assembled in a system according to an embodiment of the present application.

[0032] Figure 4 An adapter core with a fluid connection engaged therewith for a server liquid cooling fluid shutoff system according to an embodiment of the present application is shown.

[0033] Figure 5 An adapter core is shown disengaged from a fluid connection in accordance with an embodiment of the present application.

[0034] Figure 6 A plan view of a rack-level implementation according to an embodiment of the present application is shown.

[0035] Figure 7 A flow chart showing a system operation design according to an embodiment of the present application is shown.

[0036] Figure 8 is a block diagram illustrating an example of an electronics rack according to one embodiment. DETAILED DESCRIPTION

[0037] Various embodiments and aspects of the present invention will be described with reference to the details discussed below, and the accompanying drawings will illustrate various embodiments. The following description and drawings are illustrative of the present invention and should not be construed as limiting the present invention. Many specific details are described to provide a thorough understanding of various embodiments of the present invention. However, in some cases, in order to provide a concise discussion of embodiments of the present invention, known or conventional details are not described.

[0038] References in this specification to "one embodiment" or "an embodiment" mean that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present disclosure. The phrase "in one embodiment" appearing everywhere in the specification is not necessarily referring to the same embodiment.

[0039] The information technology (IT) hardware industry is a critical market for many reasons: it plays a key role in business competitiveness, service quality, and availability, and also plays a significant role in infrastructure total cost of ownership (TCO). IT hardware is closely tied to an organization's bottom line. IT hardware is a core competency for internet giants, cloud computing service providers, and users and providers of business services related to high-performance computing and artificial intelligence (AI) computing. These users and providers build, operate, compute, store, and manage other IT hardware platforms (e.g., servers) and infrastructure. Most hyperscalers customize full stacks of these hardware systems. For example, in the rapidly growing cloud computing business, the performance and cost (both capital and operating) of compute and storage hardware systems, clusters, and infrastructure require service providers to create customized systems that best suit their individual needs. These markets require continuous innovation. Efficient system design and operation benefit service providers in multiple long-term ways. The key is to continuously develop solutions and architectures that are more resilient, efficient, interoperable, and cost-effective.

[0040] The present disclosure aims to provide an advanced rack liquid cooling fluid management solution and leak shutoff system for server and rack liquid system designs, as well as liquid servers and leak response systems. This system is particularly important when leak response systems are involved. The following items are additional challenges that the current work aims to address: adaptation of server and rack system designs; integration of leak shutoff features into existing server and rack architectures, as adding additional fluid shutoff valves is not feasible on existing architectures; self-regulating rapid system shutdown in leak scenarios; high reliability; ease of implementation and maintenance; reduced costs; modular design for high compatibility; and compatibility with different use cases.

[0041] According to an embodiment, an advanced rack structure for fluid management and regulation in server and rack liquid cooling is proposed. For example, the main components proposed in the current work include a double-sided fluid connector with a blind-mate side and a manual-mate side. In an embodiment, the side for the rack manifold side is designed to have a manual-mate connector through a flexible hose. In some embodiments, the blind-mate side is connected to the server fluid connector. In an embodiment, the adapter core includes a main board, and inside is a fluid channel built into the body. For example, the fluid channel is assembled with both a blind-mate connector and a manual-mate connector. In an embodiment, the adapter is designed to have an electromagnet on one side and a spring structure on the other end. For example, the two units make it possible to change the displacement of the entire adapter together with the blind-mate connector. In an embodiment, the electromagnet structure is connected from the server board to a DC source.

[0042] In an embodiment, the adapter core device includes a motherboard and an electromagnetic device. For example, the motherboard includes a fluid channel assembled by a manual mating connector and a blind mate connector. In some embodiments, the manual mating connector is connected to a rack connector of a rack manifold of an electronic rack, which is coupled to an external cooling fluid source to receive cooling fluid from the external cooling fluid source and return cooling fluid to the external cooling fluid source. In an embodiment, the blind mate connector is capable of engaging or disengaging with a server fluid connector of a server chassis. In an embodiment, the server fluid connector is configured to supply cooling fluid to one or more cooling devices attached to one or more electronic devices for providing liquid cooling, the one or more electronic devices being housed within the server chassis. In some embodiments, the server chassis includes a leak sensor configured to detect leakage of cooling fluid within the server chassis.

[0043] In an embodiment, the electromagnetic device includes an electromagnet and a controller coupled to the electromagnet. For example, in response to receiving a leak signal from a leak sensor indicating a fluid leak, the controller can modify a magnetic field associated with the electromagnet to disengage a blind-mate connector from a server fluid connector.

[0044] In an embodiment, a spring structure is attached to a rack side of a motherboard. In an embodiment, a manual mating connector is connected to a rack connector of a rack manifold of an electronics rack via a hose. In an embodiment, a server connector module having a server fluid connector is attached to a rear side of a server chassis within the server chassis. In an embodiment, an electromagnet is connected to a circuit coupled to a direct current (DC) voltage source. In an embodiment, a controller is coupled to a switch on the circuit to provide power to or disconnect power to the electromagnet in response to a leakage signal received from a leak sensor.

[0045] For example, in response to a leak detected by the leak sensor, the controller sends a signal to control the power supplied to the electromagnet, i.e., to reduce or cut off the power to the electromagnet. The reduced or cut off power can cause the electromagnet to reduce or lose the magnetic force that attracts the adapter core device toward the server chassis. As a result, the adapter core device can be pushed away from the server chassis, causing the blind-mate connector of the adapter core device to disengage from the corresponding server fluid connector of the server chassis.

[0046] In an embodiment, the server connector module is attached to a rear side of the server chassis within the server chassis. In an embodiment, when the server fluid connector is disengaged from the blind-mate connector, cooling fluid is prevented from flowing from the rack manifold to the server chassis. In an embodiment, when a magnetic field associated with the electromagnet is modified to be magnetic, the adapter core device is pulled toward the server chassis, causing the blind-mate connector to engage with the server fluid connector.

[0047] In an embodiment, an electronics rack includes a rack manifold and a plurality of adapter core devices arranged in a stack. For example, the rack manifold is coupled to an external cooling fluid source to receive cooling fluid from the external cooling fluid source and return cooling fluid to the external cooling fluid source. In an embodiment, the rack manifold includes a plurality of connectors. In an embodiment, each adapter core device includes a motherboard and an electromagnetic device.

[0048] In one embodiment, a server liquid cooling fluid shutoff system includes multiple server chassis, a rack manifold, and multiple adapter core devices. For example, the multiple server chassis are arranged in a stack. In one embodiment, the rack manifold is coupled to an external cooling fluid source to receive cooling fluid from the external cooling fluid source and return cooling fluid to the external cooling fluid source. In one embodiment, the rack manifold includes multiple connectors. In one embodiment, each adapter core device includes a motherboard and an electromagnetic device.

[0049] Figure 1 An adapter core design 100 according to an embodiment of the present application is shown. In particular, Figure 1 The solution design 100 proposed in the present disclosure is shown, and it can be seen that the adapter core 101 is designed to have a body shown in area 105. Further, in an embodiment, a fluid channel (e.g., 105) is built into the body 103. For example, the fluid channel is connected to the connector through a hose 109, with a blind-mate connector 107 at one end and a conventional connector 111 at one end. In an embodiment, both sides of the body 103 are assembled and designed with a spring structure 113 and an electromagnetic unit 115. In an embodiment, the function of the electromagnetic unit 115 is to enable force to be applied along the positive x-direction on the entire core unit 101, and this is to engage the blind-mate connection 107 with the connection on the server side. In an embodiment, no force is generated before the electromagnetic unit 115 is connected to an active power source 121, and therefore, the reverse force from the spring structure 113 disengages the blind-mate connection 107 from the server.

[0050] In an embodiment, the force generated from the electromagnetic device 115 and the force generated from the elastic structure 113 (e.g., a spring) are in opposite directions. For example, the elastic structure 113 (e.g., a spring) can use the open space of the elastic structure 113 to pull the body 103 in the negative x-direction to disconnect the blind mate 107 from the server connector module (e.g., Figure 2A or Figure 2B 125); according to an embodiment, the disconnection occurs when the reaction force generated by the electromagnetic device 115 is released.

[0051] In an embodiment, electromagnetic unit 115 is connected to server DC power supply 121, and the connection circuit is designed with switch 117. According to an embodiment, switch 117 is connected to server leak detection sensor 119 via a controller. For example, due to the use of flexible hose 109, the displacement of adapter core 101 does not affect manual connector 111.

[0052] In an embodiment, the motherboard 103 includes a fluid channel 105 assembled by a manual mating connector 111 and a blind mate connector 107. For example, the fluid channel 105 is connected to a rack connector 111 of a rack manifold of an electronic rack through a hose 109, which is connected to an external cooling fluid source to receive cooling fluid from the external cooling fluid source and return cooling fluid to the external cooling fluid source. In an embodiment, 111 is a manual connector. In an embodiment, 107 is a blind mate connector. In an embodiment, 111 is used to connect to a rack connector (not shown). In an embodiment, the blind mate connector 107 is a blind mate connector that mates with a server blind mate connector. In an embodiment, the body 103 is a retainer. In an embodiment, 105 is fluid channel hardware. In an embodiment, the movement of the blind mate connector 107 is controlled by an electromagnetic unit 115. In an embodiment, the fluid channel 105 and the blind mate connector 107 are completely fixed together.

[0053] Figures 2A to 2B An adapter core design 200 with a server 123 according to an embodiment of the present application is shown. FIG2 illustrates the connection of the adapter core 101 to the server chassis 123, and it can be seen that the connection includes a fluid blind-mate connector 107 and a power interface 127. For example, once the electromagnet 115 from the server 123 is connected to the DC source 121, it can achieve positive x-direction displacement due to magnetic force, and then the blind-mate connector 107 is connected to the server connector 125.

[0054] In an embodiment, Figure 2A As shown, when the server chassis 123 is inserted from the front end of the electronic rack, the rear end of the server chassis 123 engages with the adapter core 101. The adapter core 101 can be fixedly mounted on the electronic rack. In addition, the electromagnetic device 115 is connected to the DC source 121 via a power interface between the adapter core 101 and the server chassis 123 (not shown). Once power is supplied to the electromagnetic device 115, the electromagnetic device 115 generates a magnetic force that attracts the main body (or mainboard) 103 toward the electromagnetic device 115 (from left to right in this example). In one embodiment, the fluid channel 105 and the connector 107 are fixedly attached to the main body 103, and they move together. In one embodiment, the main body 103 is contained in a container made of metal so that the main body 103 can be attracted toward the electromagnetic device 115 due to the magnetic force when power is supplied.

[0055] In addition, a spring structure (e.g., a spring) is attached between the rear end of the adapter core 101 and the rear end of the body 103, wherein the spring can be compressed or stretched. When the electromagnetic device 115 is powered, the magnetic force pulls the body 103 together with the fluid channel 105 and the connector 107 toward the electromagnetic device 115, so that the connector 107 is connected to the server connector 125. In this case, the spring is as shown in FIG. Figure 2A When the electromagnetic device 115 is disconnected from the DC source 121, the magnetic force disappears and the spring 113 is released back to its neutral state. The spring 113 pulls the body (and the fluid channel 105 and the connector 107) away from the electromagnetic device 115, while the adapter core 101 and the electromagnetic device 115 remain stable, as shown. Figure 2B As shown, connector 107 is disconnected from server connector 125.

[0056] In an embodiment, a controller (not shown) is coupled to a switch 117 on the circuit to provide or remove power to the electromagnet 115 in response to a leakage signal received from the leakage sensor 119 .

[0057] In an embodiment, the server connector module 125 is attached to the rear side or back panel of the server chassis 123 outside the server chassis. For example, when the server fluid connector 125 is disengaged from the blind-mate connector 107 (e.g., Figure 2B ), preventing cooling fluid from flowing from the rack manifold to the server chassis 123.

[0058] In an embodiment, the blind-mate connector 107 is capable of engaging with a server fluid connector 125 of a server chassis 123 (e.g., Figure 2A ) or disengage therefrom (e.g. Figure 2B In an embodiment, server fluid connector 125 is a blind-mate connector configured to supply cooling fluid to one or more cooling devices attached to one or more electronic devices housed within server chassis 123 for providing liquid cooling. In an embodiment, server chassis 123 includes a leak sensor 119 configured to detect leakage of cooling fluid within server chassis 123. Connectors 125 and 107 are both blind-mate connectors.

[0059] In an embodiment, the electromagnetic device 115 can be attached to the server side of the motherboard 103. For example, the electromagnetic device 115 is coupled to the server connector module 125 and the leak sensor 119. In an embodiment, in response to a leak signal received from the leak sensor 119 indicating that a fluid leak has occurred, the magnetic field associated with the electromagnet 115 is modified by a controller (not shown) coupled to the electromagnet 115 such that the blind-mate connector 107 is disengaged from the server fluid connector 125 (e.g., Figure 2B).

[0060] Figure 3 An adapter core assembled in a system 300 according to an embodiment of the present application is shown. For example, Figure 3 A plurality of adapter cores (eg, 101a, 101b, 101c, 101d) are shown assembled in a system, and it can be seen that the adapter cores (eg, 101a, 101b, 101c, 101d) are integrated together for rack-level components.

[0061] In an embodiment, the adapter core position (e.g., 101a) can be customized to accommodate different racks and servers. In an embodiment, a spring structure 113 is attached to the rack side of the motherboard. In an embodiment, the manual mating connector is connected to the rack connector (e.g., 111a, 111b, 111c, 111d) of the rack manifold of the electronics rack via a hose (e.g., 109a, 109b, 109c, 109d).

[0062] In an embodiment, the Figure 3 The illustrated design 300 is implemented into a liquid cooling rack, and the modular design can be used in different scenarios to construct different solutions.

[0063] Figure 4 1 shows an adapter core with a fluid connection engaged for a server liquid cooling fluid shut-off system 400 according to an embodiment of the present application. For example, Figure 4 A rack level adapter system 400 is shown for use in a rack for a plurality of servers 123a, 123b, 123c. In an embodiment, the rack connectors 111a, 111b, 111c are manually mated connectors and the connection between the two comprises sections of flexible hoses 109a, 109b, 109c and it can be seen that the exiting rack manifold does not support a fluid shutoff feature. In an embodiment, the rack adapter unit is Figure 3 The rack adapter unit shown is a rack-level structure having multiple adapter cores 101a, 101b, 101c, and 101d. For example, Figure 4 All blind-mate connectors 107a, 107b, 107c, 107d are shown connected, and leakage detection sensors (e.g., 119a, 119b, 119c) are used to regulate the movement of the adapter core via an electromagnetic unit. In an embodiment, each sensor (e.g., 119a, 119b, 119c) in each server (e.g., 123a, 123b, 123c) is used to control the DC power supply of the adapter core.

[0064] Figure 5 1 shows an adapter core disengaged from a fluid connection for a server liquid cooling fluid shut-off system 500 according to an embodiment of the present application. For example, Figure 5 The server fluid is shown to be cut off by the adapter core 505 on the rack adapter structure when the electromagnetic unit is deactivated. In an embodiment, the spring force disconnects the blind mate 501 as shown. In addition, Figure 5 , it is shown that the adaptation structure 503 may include pre-designed channels for assembling the modular adaptation core as illustrated by the cutout areas.

[0065] In an embodiment, when the magnetic field associated with the electromagnet is modified to lose its magnetism, the adapter core device 505 is pushed away from the server chassis 123b, causing the blind-mate connector 501 to disengage from the server fluid connector. For example, when the adapter core device 505 is pushed away from the server chassis 123b, the server chassis 123b and the rack manifold 507 remain stationary.

[0066] In an embodiment, when the magnetic field associated with the electromagnet is modified to be magnetic, the adapter core device 505 is pulled toward the server chassis 123b, causing the blind-mate connector to return to the connected position. In an embodiment, the server may be removed due to maintenance. For example, the reconnection of the two connectors may only occur when the server is reinstalled.

[0067] Figure 6 600 according to an embodiment of the present application. Figure 6 A plan view of the solution in a rack 605 is shown and it can be seen that the adapter system 607 enables fluid blind-mate connections 601, 603 as well as fluid self-regulating and automatic shut-off features. For example, 603 is a connector built into the rack manifold.

[0068] In an embodiment, the electromagnet is connected to an electrical circuit coupled to a direct current (DC) voltage source 609. In an embodiment, a server connector module having a server fluid connector 601 is attached to the back side of a server chassis 611 within the server chassis.

[0069] Figure 7 A flowchart 700 is shown of a system operation design according to an embodiment of the present application. For example, Figure 7 A flow chart 700 of system operation with the solutions proposed in this disclosure is shown, including normal operation and fluid shut-off features.

[0070] In an embodiment, at operation 701, upon insertion into the server 123, the rack adapter unit will be connected to the DC power source 121. In an embodiment, at operation 703, a fluid connection will exist between the adapter unit 101 and the server 123 via the blind mate 107. In an embodiment, at operation 705, during normal operation, the adapter core 101 functions in its operating mode in which the electromagnet 115 is turned on and also: engages the fluid connection. In an embodiment, at operation 707, upon triggering the leak sensor 119, the server 123 will trigger the disconnection of the switch 117 to turn off the electromagnet 115. In another embodiment, at operation 709, if the server power supply 119 is disconnected, the electromagnet power is disconnected. In an embodiment, after operation 707 or 709, at operation 711, the deactivation of the electromagnet 115 is engaged with the displacement of the adapter core 101, causing the fluid to be disconnected.

[0071] Figure 8 1 is a block diagram illustrating an electronics rack according to one embodiment. Electronics rack 1200 may represent any electronics rack as described throughout this application. According to one embodiment, electronics rack 1200 includes, but is not limited to, a coolant distribution unit (CDU) 1201, a rack management unit (RMU) 1202, and one or more server chassis 1203A-1203E (collectively, server chassis 1203). The server chassis 1203 may be inserted into a server slot array (e.g., a standard shelf) from either the front end 1204 or the rear end 1205 of the electronics rack 1200, respectively. Note that while five server chassis 1203A-1203E are shown, more or fewer server chassis may be maintained within the electronics rack 1200. It should also be noted that the specific locations of the CDU 1201, RMU 1202, and / or server chassis 1203 are shown for illustration purposes only; other arrangements or configurations of the CDU 1201, RMU 1202, and / or server chassis 1203 may also be implemented. In one embodiment, the electronics rack 1200 may be open to the environment or partially contained by a rack container, as long as the cooling fans can generate airflow from front to back.

[0072] In addition, for at least some of the server chassis 1203, an optional fan module (not shown) is associated with the server chassis. Each fan module includes one or more cooling fans. The fan modules can be mounted on the rear end of the server chassis 1203 or on the electronics rack to generate an airflow that flows from the front end 1204, travels through the air space of the server chassis 1103, and is present at the rear end 1205 of the electronics rack 1200.

[0073] In one embodiment, CDU 1201 primarily includes a heat exchanger 1211, a liquid pump 1212, and a pump controller (not shown), as well as other components such as a liquid reservoir, a power supply, and monitoring sensors. Heat exchanger 1211 can be a liquid-to-liquid heat exchanger. Heat exchanger 1211 includes a first circuit having an inlet port and an outlet port, each having a first pair of liquid connectors that connect to external liquid supply / return lines 1231-1232 to form a primary circuit. Connectors connected to external liquid supply / return lines 1231-1232 can be arranged or mounted on the rear end 1205 of electronics rack 1200. Liquid supply / return lines 1231-1232 (also referred to as room liquid supply / return lines) can be connected to an external cooling system.

[0074] In addition, heat exchanger 1211 also includes a secondary loop having two ports with a second pair of liquid connectors coupled to liquid manifold 1225 (also referred to as a rack manifold) to form a secondary loop. This secondary loop can include a supply manifold (also referred to as a rack liquid supply line or rack supply manifold) that supplies cooled liquid to server chassis 1203 and a return manifold (also referred to as a rack liquid return line or rack return manifold) that returns warmer liquid to CDU 1201. Note that CDU 1201 can be any type of commercially available or custom CDU. Therefore, the details of CDU 1201 will not be described herein.

[0075] Each server chassis 1203 may include one or more IT components (e.g., a central processing unit or CPU, a general / graphics processing unit (GPU), memory, and / or storage devices). Each IT component may perform data processing tasks, wherein the IT component may include software installed in the storage device, loaded into the memory, and executed by one or more processors to perform the data processing tasks. The server chassis 1203 may include a host server (referred to as a master node) coupled to one or more computing servers (also referred to as computing nodes, such as CPU servers and GPU servers). The host server (having one or more CPUs) typically interfaces with clients over a network (e.g., the Internet) to receive requests for specific services, such as storage services (e.g., cloud-based storage services such as backup and / or recovery), executing applications to perform certain operations (e.g., image processing, deep data learning algorithms or modeling as part of a software-as-a-service or SaaS platform, etc.). In response to the request, the host server assigns the task to one or more of the computing nodes or computing servers (having one or more GPUs) managed by the host server. The computing servers perform the actual tasks and may generate heat during operation.

[0076] The electronics rack 1200 also includes an optional RMU 1202 configured to provide and manage power to the servers 1203 and the CDU 1201. The RMU 1202 can be coupled to a power supply unit (not shown) to manage the power consumption of the power supply unit. The power supply unit can include the necessary circuitry (e.g., an alternating current (AC) to direct current (DC) or DC to DC power converter, a battery, a transformer, or a regulator, etc.) to power the remaining components of the electronics rack 1200.

[0077] In one embodiment, the RMU 1202 includes an optimization module 1221 and a rack management controller (RMC) 1222. The RMC 1222 may include a monitor that monitors the operating status of various components within the electronic rack 1200, such as the compute nodes 1203, the CDU 1201, and the fan modules. Specifically, the monitor receives operational data from various sensors representing the operating environment of the electronic rack 1200. For example, the monitor may receive operational data representing the temperature of the processor, coolant, and airflow, which may be captured and collected via various temperature sensors. The monitor may also receive data representing the fan power and pump power generated by the fan module and the liquid pump 1212, which may be proportional to their respective speeds. These operational data are referred to as real-time operational data. Note that the monitor may be implemented as a separate module within the RMU 1202.

[0078] Based on the operational data, the optimization module 1221 performs optimization using a predetermined optimization function or optimization model to derive a set of optimal fan speeds for the fan module and an optimal pump speed for the liquid pump 1212, such that the total power consumption of the liquid pump 1212 and the fan module is minimized, while the operational data associated with the liquid pump 1212 and the cooling fan of the fan module are within their respective design specifications. Once the optimal pump speed and the optimal fan speed are determined, the RMC 1222 configures the liquid pump 1212 and the cooling fan of the fan module based on the optimal pump speed and the fan speed.

[0079] As an example, based on the optimal pump speed, RMC 1222 communicates with the pump controller of CDU 1201 to control the speed of liquid pump 1212, which in turn controls the liquid flow rate of the coolant supplied to liquid manifold 1225 for distribution to at least some of server chassis 1203. Similarly, based on the optimal fan speed, RMC 1222 communicates with each fan module to control the speed of each cooling fan of the fan module, which in turn controls the airflow rate of the fan module. Note that each fan module can be individually controlled with its own specific optimal fan speed, and different fan modules and / or different cooling fans in the same fan module can have different optimal fan speeds.

[0080] Note that the rack configuration shown is described for illustrative purposes only; other configurations or arrangements are also applicable. For example, the CDU 1201 may be an optional unit. The cold plate of the server chassis 1203 can be connected to a rack manifold, which can be directly connected to the room manifolds 1231-1232 without the use of a CDU. Although not shown, a power supply unit can be arranged within the electronics rack 1200. The power supply unit can be implemented as a standard chassis that is the same as or similar to the server chassis, wherein the power supply chassis can be inserted into any standard shelf and replace any server chassis 1203. In addition, the power supply chassis can also include a backup battery unit (BBU) to provide battery power to the server chassis 1203 when the main power source is unavailable. The BBU can include one or more battery packs, and each battery pack includes one or more battery cells and the necessary charging and discharging circuits for charging and discharging the battery cells.

[0081] In the foregoing specification, embodiments of the present invention have been described with reference to specific exemplary embodiments thereof. However, it will be apparent that various modifications may be made thereto without departing from the broader spirit and scope of the invention as set forth in the appended claims. Accordingly, the specification and drawings are to be regarded as illustrative rather than restrictive.

Claims

1. An adapter core device, comprising: a motherboard comprising a fluid channel assembled by a manual-mate connector and a blind-mate connector, wherein the manual-mate connector is connected to a rack connector of a rack manifold of an electronics rack, the rack manifold being coupled to an external cooling fluid source to receive cooling fluid from the external cooling fluid source and return cooling fluid to the external cooling fluid source, wherein the blind-mate connector is engageable with and disengageable from a server fluid connector of a server chassis, wherein the server fluid connector is configured to supply cooling fluid to one or more cooling devices attached to one or more electronic devices for providing liquid cooling, the one or more electronic devices being housed within the server chassis, wherein the server chassis comprises a leak sensor configured to detect a leak of the cooling fluid within the server chassis; an electromagnetic device attached to the server side of the motherboard, wherein the electromagnetic device is coupled to a server connector module and the leakage sensor, the electromagnetic device comprising: electromagnets; and a controller coupled to the electromagnet, the controller, in response to receiving a leak signal from the leak sensor, the leak signal indicating a fluid leak, the controller modifying a magnetic field associated with the electromagnet to disengage the blind-mate connector from the server fluid connector; The electromagnet is connected to an electrical circuit coupled to a DC voltage source; The controller is coupled to a switch on the circuit to provide power to or remove power from the electromagnet in response to a leakage signal received from the leakage sensor.

2. The adapting core device according to claim 1, wherein: A spring structure is attached to the chassis side of the mainboard to provide an opposing force to the magnetic field.

3. The adapting core device according to claim 1, wherein: The manual mating connector is connected to the rack connector of the rack manifold of the electronics rack via a hose.

4. The adapting core device according to claim 1, wherein: The server connector module with the server fluid connector is attached within the server chassis on a rear side of the server chassis.

5. The adapting core device according to claim 1, wherein: When the magnetic field associated with the electromagnet is modified to lose magnetism, the adapter core device is urged away from the server chassis, causing the blind-mate connector to disengage from the server fluid connector.

6. The adapting core device according to claim 5, wherein: When the adapter core device is pushed away from the server chassis, the server chassis and the rack manifold remain stationary.

7. The adapting core device according to claim 6, wherein: When the magnetic field associated with the electromagnet is modified to be magnetic, the adapter core device is urged toward a connected position.

8. An electronic rack comprising: a rack manifold coupled to an external cooling fluid source to receive cooling fluid from the external cooling fluid source and to return cooling fluid to the external cooling fluid source, wherein the rack manifold includes a plurality of connectors; and A plurality of adapter core devices are stacked and arranged, wherein the adapter core device is the adapter core device according to any one of claims 1-7.

9. A server liquid cooling fluid shut-off system, comprising: A plurality of server chassis, wherein the plurality of server chassis are stacked; a rack manifold coupled to an external cooling fluid source to receive cooling fluid from the external cooling fluid source and to return cooling fluid to the external cooling fluid source, wherein the rack manifold includes a plurality of connectors; and A plurality of adapter core devices are stacked and arranged, wherein the adapter core device is the adapter core device according to any one of claims 1-7.

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