cooling device

Abstract

Provided is a cooling device with improved cooling efficiency. The cooling device is a cooling device that cools a semiconductor component mounted on a surface of a substrate, and includes: a base that is attached to a back surface of the substrate; and a bottom plate that is disposed apart from the base, wherein a recessed portion that is recessed toward the substrate is formed in a region of a surface of the base that faces the bottom plate and corresponds to the semiconductor component.

Description

Technical Field

[0001] This disclosure relates to cooling devices. Background Technology

[0002] As a device for cooling semiconductor components (chips), there are known devices, such as the one described in Patent Document 1 below. In the device described in Patent Document 1, a recess is formed in the housing on which the semiconductor component is fixed, and a plate-shaped metal base is mounted to cover the recess. The semiconductor component is mounted on the metal base, and a cooling water channel is formed directly below the semiconductor component.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2003-116282 Summary of the Invention

[0006] The problem the invention aims to solve

[0007] However, when the metal base is merely plate-shaped as described above, it creates a significant thermal resistance between the refrigerant and the semiconductor components. Consequently, efficient cooling of the semiconductor components may not be possible.

[0008] This disclosure was made to solve the above-mentioned problems, and its purpose is to provide a cooling device that further improves cooling efficiency.

[0009] Technical solution

[0010] To solve the above problems, the cooling device disclosed herein is a cooling device for cooling semiconductor components mounted on the surface of a substrate. The cooling device includes: a base, which is mounted on the back side of the substrate; a plurality of heat sinks protruding from the base; and a base plate that supports the plurality of heat sinks between the base plate and the base. A recess is formed in the area of ​​the base facing the base plate that corresponds to the semiconductor component, and the recess is recessed toward the base plate side.

[0011] Beneficial effects

[0012] According to this disclosure, a cooling device with further improved cooling efficiency can be provided. Attached Figure Description

[0013] Figure 1 This is a cross-sectional view showing the configuration of the cooling device according to the first embodiment of this disclosure.

[0014] Figure 2 This is a cross-sectional view showing the configuration of the cooling device according to the second embodiment of this disclosure.

[0015] Figure 3 This is a cross-sectional view showing the configuration of the cooling device according to the third embodiment of this disclosure.

[0016] Figure 4 This is a cross-sectional view showing the configuration of the cooling device according to the fourth embodiment of this disclosure.

[0017] Figure 5 This is a top view of a heat sink of a modified embodiment of the present disclosure.

[0018] Explanation of reference numerals in the attached figures

[0019] 100 Cooling device

[0020] 1 substrate

[0021] 1a, 1c Copper Pattern

[0022] 1b Substrate Body

[0023] 1d bonding material

[0024] 2 Semiconductor components

[0025] 2a Bonding material

[0026] 10 bases

[0027] 10b Back

[0028] 11 Heat sink

[0029] 11' pin

[0030] 12, 12b base plate

[0031] 12t convex part Detailed Implementation

[0032] <First Implementation Method>

[0033] (Composition of substrate and cooling device)

[0034] The following is for reference Figure 1 The cooling apparatus 100 of the first embodiment of this disclosure will now be described. This cooling apparatus 100 is used to cool a semiconductor component 2 mounted on a substrate 1 using a liquid refrigerant. Figure 1 As shown, substrate 1 has: copper patterns 1a and 1c; substrate body 1b; and bonding materials 1d and 2a.

[0035] The substrate body 1b is formed into a plate shape using materials such as epoxy glass resin or phenolic resin. Copper patterns 1a and 1c are deposited on the front and back sides of the substrate body 1b, respectively. The desired printed circuit is formed on the copper patterns 1a and 1c by etching. The bonding material 2a is provided for fixing the semiconductor component 2 to the copper pattern 1a.

[0036] Multiple semiconductor components 2 (three are used as an example) are disposed on the substrate 1. The semiconductor components 2 are, for example, power transistors or power FETs (Field Effect Transistors), which generate heat when they are in operation. These semiconductor components 2 are arranged in a spaced-apart manner on the substrate 1. Furthermore, the semiconductor components 2 are electrically connected to the copper pattern 1a described above.

[0037] Next, the configuration of the cooling device 100 will be described. For example... Figure 1 As shown, the cooling device 100 includes a base 10 and a base plate 12. These bases 10 and base plates 12 are integrally formed using a metal material with good thermal conductivity, such as aluminum or copper. The cooling device 100 can be shaped using Additive Manufacturing (AM modeling method).

[0038] The base 10 is fixed to the back side of the substrate 1 (that is, the side facing the opposite side to the surface where the semiconductor components 2 are mounted) by a bonding material 1d. The base 10 is plate-shaped with an area larger than that of the substrate 1. As will be described in detail later, a recess 10r is formed in the central portion of the back side 10b of the base 10 (that is, the central portion of the area corresponding to the plurality of semiconductor components 2) facing the substrate 1. In other words, the thickness of the base 10 in the area where the recess 10r is formed is smaller than that in other areas. Furthermore, the cross-sectional shape of the recess 10r is triangular, for example. It should be noted that the recess 10r may also have a rectangular cross-section or an arc-shaped cross-section. Moreover, the recess 10r is a groove extending throughout the entire length of the base 10.

[0039] (Effects)

[0040] Next, the operation of the cooling device 100 described above will be explained. When the semiconductor component 2 is operated, it generates heat due to its internal resistance. In the case where multiple semiconductor components 2 are integrated as described above, the temperature is particularly high in the center of the integrated area due to the generation of thermal noise. When such heat generation is excessive, it may cause thermal runaway and damage to the semiconductor component 2. Here, in this embodiment, a configuration using the cooling device 100 is adopted to cool these semiconductor components 2.

[0041] First, refrigerant introduced from the outside into the flow path F flows along the extending direction of the recess 10r within the flow path F. During this process, the semiconductor component 2 is cooled based on the heat absorption achieved by the refrigerant through the base 10. Furthermore, unlike the above embodiment, when the base 10 is merely plate-shaped, it creates a large thermal resistance between the refrigerant and the semiconductor component 2. Consequently, efficient cooling of the semiconductor component may not be possible. Here, in this embodiment, a recess 10r is formed in the base 10.

[0042] According to the above configuration, a recess 10r is formed on the base 10 in the region corresponding to the semiconductor component 2. This reduces the thermal resistance of the base 10 in this region to be lower than in other regions. As a result, it promotes thermal movement between the refrigerant and the semiconductor component 2, enabling efficient cooling of the semiconductor component 2. Furthermore, compared to reducing the overall thickness of the base 10, by forming the recess 10r only in a limited area, the reduction in the pressure resistance of the base 10 to the refrigerant pressure can be minimized.

[0043] The first embodiment of this disclosure has been described above. It should be noted that various changes and modifications can be made to the above-described configuration without departing from the spirit of this disclosure.

[0044] <Second Implementation Method>

[0045] Next, refer to Figure 2 The second embodiment of this disclosure will now be described. It should be noted that the same reference numerals are used for the same components as in the first embodiment described above, and detailed descriptions thereof are omitted. For example... Figure 2 As shown, in this embodiment, a plurality of heat sinks 11 are provided on the back surface 10b of the base 10. Each heat sink 11 protrudes in a direction separate from the base 10. Furthermore, the plurality of heat sinks 11 are arranged at intervals in the extending direction of the recess 10r.

[0046] The aforementioned heat sink 11 is supported by a base plate 12 between the base plate 12 and the base 10. The space enclosed by the base 10 and the base plate 12 is configured as a flow path F for the refrigerant guided in from the outside. In this embodiment, the base 10 side surface on the base plate 12 is flat. The recess 10r is a groove extending over the entire length of the base 10, and a plurality of heat sinks 11 extend in a plate-like shape along the extension direction of the groove (recess 10r).

[0047] According to the above configuration, the contact area between the refrigerant and the cooling device is increased by the heat sink 11, thereby further improving the cooling efficiency.

[0048] Furthermore, according to the above configuration, since the heat sink 11 extends along the extension direction of the groove, the possibility of the refrigerant flow being obstructed by the heat sink 11 can be minimized. Therefore, the refrigerant flow rate can be guaranteed, enabling more efficient cooling of the semiconductor component 2.

[0049] The second embodiment of this disclosure has been described above. It should be noted that various changes and modifications can be made to the above-described configuration without departing from the spirit of this disclosure.

[0050] <Third Implementation Method>

[0051] Next, refer to Figure 3 The third embodiment of this disclosure will now be described. It should be noted that the same reference numerals are used for components identical to those in the first embodiment described above, and detailed descriptions thereof are omitted. For example... Figure 3 As shown, in this embodiment, in the cooling device 100 described above, for the heat sink 11 provided in the recess 10r among the plurality of heat sinks 11, the spacing between the heat sinks 11 is narrower than the spacing between the other heat sinks 11.

[0052] According to the above configuration, since the heat sinks 11 provided in the recess 10r are spaced narrowly together, the contact area between these heat sinks 11 and the refrigerant can be ensured to be larger than that of other areas. As a result, the semiconductor component 2 can be cooled more efficiently.

[0053] The third embodiment of this disclosure has been described above. It should be noted that various changes and modifications can be made to the above-described configuration without departing from the spirit of this disclosure.

[0054] <Fourth Implementation Method>

[0055] Next, refer to Figure 4 The fourth embodiment of this disclosure will now be described. It should be noted that the same reference numerals are used for components identical to those in the embodiments described above, and detailed descriptions thereof are omitted. For example... Figure 4 As shown, in this embodiment, the shape of the base plate 12b differs from that in the first embodiment. Specifically, a protrusion 12t with a shape corresponding to the recess 10r is formed in the region of the base plate 12b facing the recess 10r. That is, in Figure 4 In the example, a convex portion 12t having the same triangular cross-sectional shape is provided corresponding to the concave portion 10r having a triangular cross-sectional shape.

[0056] According to the above configuration, the cross-sectional area of ​​the flow path F is fixed between the region sandwiched between the recess 10r and the protrusion 12t and other regions. As a result, the possibility of refrigerant stagnation or pressure loss when flowing into the recess 10r is reduced. This allows for a more stable refrigerant flow, thereby enabling more efficient cooling of the semiconductor component 2.

[0057] The fourth embodiment of this disclosure has been described above. It should be noted that various changes and modifications can be made to the above configuration without departing from the spirit of this disclosure. For example, in the above embodiments, an example was described where only one recess 10r is formed at the center of each of the plurality of semiconductor components 2. However, the number of recesses 10r is not limited to one; one recess 10r may be formed corresponding to each semiconductor component 2. In this case, it is ideal that the protrusions 12t described in the fourth embodiment are also provided in the same number as the recesses 10r. Furthermore, the flow direction of the refrigerant does not necessarily need to be consistent with the extension direction of the heat sink 11; it may be a direction intersecting the extension direction of the heat sink 11. Furthermore, as... Figure 5 As shown, the shape of the heat sink 11 is not limited to a plate, and pins 11' can also be used instead of the heat sink 11. In this case, as described in the third embodiment, the pins 11' provided in the recess 10r can be configured such that the spacing between the pins 11' is narrower than the spacing between the other pins 11'.

[0058] <Postscript>

[0059] For example, the cooling device 100 described in each embodiment is understood as follows.

[0060] (1) The cooling device 100 of the first embodiment is a cooling device 100 for cooling a semiconductor component 2 mounted on the surface of a substrate 1. The cooling device 100 includes: a base 10, which is mounted on the back side of the substrate; and a base plate 12, which is separately disposed from the base 10. A recess 10r is formed in the area of ​​the surface of the base 10 facing the base plate 12 that corresponds to the semiconductor component 2, and is recessed toward the base 1.

[0061] According to the above configuration, a recess 10r is formed on the base 10 in the region corresponding to the semiconductor component 2. This reduces the thermal resistance of the base 10 in this region to be lower than in other regions. As a result, it promotes thermal movement between the refrigerant and the semiconductor component 2, enabling efficient cooling of the semiconductor component 2.

[0062] (2) The cooling device 100 of the second embodiment also includes a plurality of heat sinks 11 protruding from the base 10.

[0063] According to the above configuration, the contact area between the refrigerant and the cooling device is increased by the heat sink 11, thereby further improving the cooling efficiency.

[0064] (3) In the cooling device 100 of the third embodiment, the recess 10r is a groove extending over the entire length of the base 10, and the plurality of heat sinks 11 extend in a plate-like shape along the extension direction of the groove.

[0065] Based on the above configuration, since the heat sink 11 extends along the extension direction of the groove, the possibility of the refrigerant flow being obstructed by the heat sink 11 can be minimized. Therefore, the refrigerant flow rate can be guaranteed, enabling more efficient cooling of the semiconductor component 2.

[0066] (4) In the cooling device 100 of the fourth embodiment, for the heat sink 11 provided in the recess 10r among the plurality of heat sinks 11, the spacing between the heat sinks 11 is narrower than the spacing between the other heat sinks 11.

[0067] According to the above configuration, since the heat sinks 11 provided in the recess 10r are spaced narrowly together, the contact area between these heat sinks 11 and the refrigerant can be ensured to be larger than that of other areas. As a result, the semiconductor component 2 can be cooled more efficiently.

[0068] (5) In the cooling device 100 of the fifth embodiment, a protrusion 12t with a shape corresponding to the recess 10r is formed in the region of the base plate 12b facing the recess 10r.

[0069] According to the above configuration, the cross-sectional area of ​​the flow path F is fixed between the region sandwiched between the recess 10r and the protrusion 12t and other regions. As a result, the possibility of refrigerant stagnation or pressure loss when flowing into the recess 10r can be reduced.

[0070] (6) The cooling device 100 of the sixth embodiment also has a plurality of pins 11' protruding from the base 10.

[0071] According to the above configuration, the contact area between the refrigerant and the cooling device is increased by pin 11', thus further improving the cooling efficiency.

[0072] (7) In the cooling device 100 of the seventh embodiment, for the pin 11' provided in the recess 10r among the plurality of pins 11', the spacing between the pins 11' is narrower than the spacing between the other pins 11'.

[0073] According to the above configuration, since the pins 11' located in the recess 10r are spaced narrowly together, the contact area between these pins 11' and the refrigerant can be ensured to be larger than that of other areas. As a result, the semiconductor component 2 can be cooled more efficiently.

[0074] (8) In the cooling device 100 of the eighth embodiment, a protrusion 12t with a shape corresponding to the recess 10r is formed in the region of the base plate 12 facing the recess 10r.

[0075] According to the above configuration, the cross-sectional area of ​​the flow path F is fixed between the region sandwiched between the recess 10r and the protrusion 12t and other regions. As a result, the possibility of refrigerant stagnation or pressure loss when flowing into the recess 10r can be reduced.

Claims

1. A cooling device for cooling semiconductor components mounted on the surface of a substrate, the cooling device comprising: The base, primarily plate-shaped, is mounted on the back of the substrate; and The base plate is configured separately from the base. A recess is formed in the area corresponding to the semiconductor component on the surface of the base facing the base plate. The cooling device also includes multiple heat sinks protruding from the base. The recess is a groove extending over the entire length of the base. The plurality of heat sinks extend in a plate-like shape along the extension direction of the groove.

2. The cooling device according to claim 1, wherein, For the heat sink located in the recess among the plurality of heat sinks, the spacing between the heat sinks is narrower than the spacing between the heat sinks other than the heat sinks located in the recess.

3. The cooling device according to claim 1 or 2, wherein, A protrusion with a shape corresponding to the recess is formed in the region of the base plate facing the recess.

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