A LTCC combiner and a processing method thereof

Abstract

The present invention discloses an LTCC combiner and a processing method thereof, wherein the processing method of the LTCC combiner comprises the following steps: a via processing step, processing high-frequency vias and low-frequency vias on a raw tape; a pattern printing step, printing the required layer inductance, layer capacitance and layer electrode patterns, as well as isolation wall layer electrode patterns on the raw tape with the vias; obtaining a high-frequency port network, a low-frequency port network and an isolation ground wall by stacking printing; a single product manufacturing step, manufacturing a single combiner by cutting and sintering processes, and then correspondingly connecting the outer electrodes of the insulating main frame and the inner electrodes on the single combiner. The combiner obtained by the LTCC combiner processing method of the present invention improves the margin of the isolation index of the product, thereby having fewer interference signals when in use, and since there is no need to add circuit elements, it has less impact on other electrical indicators and does not increase the process difficulty.

Description

Technical Field

[0001] The present invention relates to the design and processing of microwave circuits in the field of wireless communication technology, and in particular to an LTCC (Low Temperature Co-fired Ceramic) combiner and a processing method thereof. Background Art

[0002] Combiners are used in the input and output of antennas and have the function of classifying or mixing two different frequency signals during transmission and reception. With the continuous enrichment of various frequency bands supported by communication equipment, the interference between various working frequency bands is becoming increasingly serious. Therefore, in order to improve the quality of communication and anti-interference ability, there is an urgent need for high-performance combiners. At present, the requirements for high-performance systems in RF communication systems continue to increase, and the performance of combiners plays a decisive role in the performance of the entire communication system. For example, in a transceiver-integrated system, the isolation of the transceiver end of the duplexer determines the degree of interference between signals. Improving isolation can not only greatly reduce interference, but also reduce the use of peripheral components. However, the limitation of the quality factor of the resonator and some other electrical losses make it difficult to further improve the isolation, which has become a bottleneck for the continuous improvement of the performance of the communication system. Therefore, the demand for improving the isolation performance of the duplexer is becoming increasingly urgent, especially for ultra-miniaturized duplexers. In particular, as wireless communication systems develop in the direction of multi-function, multi-band, and multi-protocol, this poses a higher challenge to the RF front end in wireless communication equipment.

[0003] At present, the development of LTCC combiners tends to be miniaturized and highly integrated. The multifunctional combination of Netcom, mobile phone terminals, GPS, 4G-LTE, 5G and 2.4G / 5G WIFI also determines the diversification of the combiner's frequency division. The degree of signal interference in each frequency band varies. At the same time, some customer-customized products have high requirements for the isolation index of the combiner. Therefore, some combiners need to significantly improve the isolation and reduce the interference between signals.

[0004] It should be noted that the information disclosed in the above background technology section is only used for understanding the background of the present application, and therefore may include information that does not constitute prior art known to ordinary technicians in the field. Summary of the invention

[0005] In order to overcome the defects of the prior art, the present invention provides a method for processing a LTCC combiner, comprising the following steps:

[0006] A via processing step, opening holes in the cut ceramic green tape and filling them with silver paste to form a green tape with vias, wherein the vias include high-frequency vias and low-frequency vias;

[0007] A pattern printing step, printing patterns of layer inductors, layer capacitors and layer electrodes on the raw tape with the via holes, wherein the layer inductors include high-frequency layer inductors and low-frequency layer inductors, the layer capacitors include high-frequency layer capacitors and low-frequency layer capacitors, the layer electrodes include high-frequency layer electrodes and low-frequency layer electrodes, and also include an isolation wall layer electrode located between the high-frequency layer electrode and the low-frequency layer electrode, wherein the isolation wall layer electrode has a layer through hole; and also include a ground layer;

[0008] a lamination step, wherein a high-frequency laminated inductor, a low-frequency laminated inductor, a high-frequency laminated capacitor, a low-frequency laminated capacitor, a high-frequency internal electrode, a low-frequency internal electrode and an isolation wall laminated electrode with a through hole are obtained by lamination printing, wherein the high-frequency laminated inductor, the high-frequency laminated capacitor, the high-frequency internal electrode and the high-frequency via hole together constitute a high-frequency port network, the low-frequency laminated inductor, the low-frequency laminated capacitor, the low-frequency internal electrode and the low-frequency via hole together constitute a low-frequency port network, the isolation wall laminated electrode with a through hole and a ground constitute an isolation ground wall, and the ground layer respectively forms a grounding capacitor with the high-frequency port network, the low-frequency port network and the isolation ground wall;

[0009] The single product manufacturing steps include cutting and sintering to obtain a single combiner;

[0010] The internal and external circuit connection step is to print a predetermined number of external electrodes on the outer side surface of the insulating main frame, and connect each of the external electrodes to the high-frequency internal electrode and the low-frequency internal electrode on the single combiner located in the insulating main frame respectively.

[0011] The present application embodiment may also adopt the following optional / preferred solutions:

[0012] The via in the via processing step also includes at least one third frequency via; the layer inductor printed in the pattern printing step also includes at least one third frequency layer inductor, the layer capacitor also includes at least one third frequency layer capacitor, and the layer electrode also includes at least one third frequency layer electrode; after printing in the lamination step, the third frequency layer inductor, the third frequency layer capacitor, the third frequency layer electrode and the third frequency via together constitute at least one third frequency port network.

[0013] An additional isolation wall layer electrode is also printed between the third frequency layer electrode and the high frequency layer electrode and / or between the third frequency layer electrode and the low frequency layer electrode, and the additional isolation wall layer electrode has a layer through hole; after the lamination step printing, an additional isolation wall laminated electrode with a through hole is formed, and the additional isolation wall laminated electrode with a through hole and the ground constitute an additional isolation ground wall.

[0014] The line spacing between the isolation ground wall and the high-frequency port network and the line spacing between the isolation ground wall and the low-frequency port network are both ≥60um.

[0015] In the printing step, the printing area of ​​the isolation wall layer electrode is 50um×200um, 100um×500um or 100um×800um.

[0016] The isolation ground wall is at least one of a single-column electrode structure, a multi-column electrode connection structure, a multi-column electrode capacitive coupling structure, and an electrode through-hole whole-piece structure.

[0017] An embodiment of the present application also provides an LTCC combiner, which is obtained by processing the LTCC combiner processing method as described in any of the above items, including an insulating main frame and a single combiner located inside the frame, wherein the single combiner includes a high-frequency port network and its internal electrodes, a low-frequency port network and its internal electrodes, and an isolation ground wall composed of an isolation wall laminated electrode with a through hole and a ground; a predetermined number of external electrodes are printed on the outer side surface of the insulating main frame, and the internal electrodes of the high-frequency port network and the internal electrodes of the low-frequency port network are respectively connected to the external electrodes.

[0018] The LTCC combiner further comprises a third frequency port network and an additional isolation ground wall, wherein the additional isolation ground wall is located between the third frequency port network and the high frequency port network, or the additional isolation ground wall is located between the third frequency port network and the low frequency port network.

[0019] The LTCC combiner is any one of the packaging structures of 4 electrodes on the side, 6 electrodes on the side, 2 electrodes on the side 6 electrodes, 4 electrodes on the bottom, 6 electrodes on the bottom, 8 electrodes on the bottom, and 9 electrodes on the bottom.

[0020] The LTCC combiner has an outer dimension of L×W×T≥0.6×0.5×0.4 mm, where L represents length, W represents width, and T represents thickness.

[0021] One or more technical solutions provided in the embodiments of the present application have at least the following beneficial effects compared with the prior art:

[0022] The combiner obtained by the LTCC combiner processing method of the present invention improves the margin of the isolation index of the product, so that there are fewer interference signals when in use, and because there is no need to add circuit elements, it has little impact on other electrical indicators and does not increase the process difficulty. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 is a flow chart of a method for processing a LTCC combiner according to an embodiment;

[0024] Figure 2 is a schematic diagram of a LTCC combiner structure module and layout of an embodiment;

[0025] Figure 3 is a diagram showing the internal structure layout of an LTCC combiner according to an embodiment;

[0026] Figure 4 is a schematic diagram of a laminated molding structure of an isolation ground wall according to an embodiment;

[0027] Figure 5 The figure is a comparison diagram of isolation curves of a 1005-type LTCC combiner without an isolation ground wall and with an isolation ground wall according to an embodiment. DETAILED DESCRIPTION

[0028] The inventors have found that the methods for improving isolation in the related prior art and the problems therein are as follows:

[0029] Method 1: By increasing the number of orders, the suppression at both ends is increased to improve the isolation. Problems: The circuit and structure become more complicated, which will lead to deterioration of indicators such as insertion loss, fluctuation of electrical properties, and deterioration of yield.

[0030] Method 2: External matching circuit, through external link matching to increase the second and third frequency suppression and improve isolation. Problems: Matching is not universally applicable, affecting indicators such as sensitivity, and difficult to adjust.

[0031] In addition, there are also LTCC microwave multilayer combining networks using LTCC isolation walls, such as the Chinese invention patent application with application publication number CN114126209A, which can improve the isolation between channels to a certain extent, but the isolation optimization effect is not obvious, especially for ultra-small combiners, the effect is minimal.

[0032] The method proposed in the embodiment of the present application is: an isolation ground wall with a predetermined length and area is set in the middle position of the two-frequency division port structure inside the LTCC combiner, the two-port network is isolated by the grounding structure, it plays a self-shielding role, and the interference signal between the two paths is guided to the ground, so as to achieve the purpose of improving the isolation.

[0033] The following is combined with Figure 1-5 The present invention is further described in the following specific embodiments, wherein the same reference numerals represent the same components unless otherwise specifically stated. It should be emphasized that the following description is merely exemplary and is not intended to limit the scope of the present invention and its application.

[0034] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element. In addition, connection can be used for fixing as well as for coupling or communication.

[0035] It should be understood that the high frequency and low frequency mentioned in this application are relative high frequency and low frequency, not absolute concepts, and all terms named at the beginning of high frequency and low frequency should also be understood as relative concepts. The orientation or position relationship indicated by the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. is based on the orientation or position relationship shown in the accompanying drawings, and is only for the convenience of describing the embodiments of the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present invention.

[0036] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined. Embodiment 1

[0037] A processing method of a LTCC combiner, such as Figure 1 As shown, the following steps are included:

[0038] The via processing step is to open holes on the cut ceramic green tape and fill them with silver paste to form a green tape with vias, wherein the vias include high-frequency vias and low-frequency vias. The high-frequency vias and the low-frequency vias are respectively located in predetermined areas on the ceramic green tape and are opened in predetermined numbers.

[0039] The pattern printing step is to print the patterns of layer inductance, layer capacitance and layer electrode on the raw tape with the via hole, wherein the layer inductance includes high-frequency layer inductance and low-frequency layer inductance, the layer capacitance includes high-frequency layer capacitance and low-frequency layer capacitance, and the layer electrode includes high-frequency layer electrode and low-frequency layer electrode. It also includes an isolation wall layer electrode located between the high-frequency layer electrode and the low-frequency layer electrode, wherein the isolation wall layer electrode has a layer through hole; and also includes a ground G1 layer.

[0040] The lamination step comprises: obtaining a high-frequency laminated inductor, a low-frequency laminated inductor, a high-frequency laminated capacitor, a low-frequency laminated capacitor, a high-frequency internal electrode, a low-frequency internal electrode and an isolation wall laminated electrode with a through hole by lamination printing; the high-frequency laminated inductor, the high-frequency laminated capacitor, the high-frequency internal electrode and the high-frequency via hole together constitute a high-frequency port network; the low-frequency laminated inductor, the low-frequency laminated capacitor, the low-frequency internal electrode and the low-frequency via hole together constitute a low-frequency port network; the isolation wall laminated electrode with a through hole and the ground constitute an isolation ground wall; the ground G1 layer respectively forms a grounding capacitor with the high-frequency port network, the low-frequency port network and the isolation ground wall.

[0041] The steps of manufacturing a single product are to manufacture a single combiner through cutting and sintering processes.

[0042] In the step of connecting the internal and external circuits, a predetermined number of external electrodes are arranged on the outer side of the insulating main frame by silver dipping or the like, and each of the external electrodes is connected to the high-frequency internal electrode and the low-frequency internal electrode on the single combiner located in the insulating main frame. Specifically, the connection method can be that after cutting the magnet, the internal electrode lead end P1 of the product is exposed, and after silver dipping, the internal electrode is connected to the side external electrode, or the internal electrode lead end Q1 is connected to the printed bottom external electrode.

[0043] This embodiment adopts the following preferred approach:

[0044] The line spacing between the isolation ground wall and the high-frequency port network and the line spacing between the isolation ground wall and the low-frequency port network are: L1≥60um, L2≥60um, so as to ensure the isolation effect of the isolation ground wall and achieve the required isolation degree.

[0045] In the printing step, the single-layer printing area of ​​the isolation wall layer electrode is = 50 um×200um. Experiments show that within this printing area range, an ideal isolation effect of an LTCC combiner with an outer dimension of L×W×T≥0.6×0.5×0.4mm can be achieved, where L represents length, W represents width, and T represents thickness. However, those skilled in the art understand that the size of the printing area is related to the space and size of the product and is not limited thereto. For example, the single-layer printing area can also be 100um×500um or 100um×800um, etc.

[0046] The isolation ground wall in the embodiment of the present application can be any one of a single-column electrode structure, a multi-column electrode connection structure, a multi-column electrode capacitive coupling structure, and an electrode through-hole whole-piece structure. The isolation optimization performance of the electrode will be better, but if the internal space of some products is insufficient and the isolation ground wall is not suitable for the electrode structure, then the simple structure without electrode can also optimize the isolation to a certain extent.

[0047] like Figure 5 As shown in the figure, it is a comparison of the isolation curves of the 1005 (also called 0402) LTCC combiner without an isolation ground wall and with an isolation ground wall. The combiner has two frequency bands of 2400-2500MHz / 4900-5950MHz. Without an isolation ground wall, the isolation between the two ports at 4800-7200MHz (i.e., the second and third times the center frequency of the low-frequency port) is relatively small, only 18-20dB. After adding an isolation ground wall, the isolation can reach 22-24dB. Embodiment 2

[0048] The main difference between this embodiment and the previous embodiment 1 is that: the via in the via processing step also includes at least one third frequency via; the layer inductor printed in the pattern printing step also includes at least one third frequency layer inductor, the layer capacitor also includes at least one third frequency layer capacitor, and the layer electrode also includes at least one third frequency layer electrode; after printing in the lamination step, the third frequency layer inductor, the third frequency layer capacitor, the third frequency layer electrode and the third frequency via together constitute at least one third frequency port network.

[0049] An additional isolation wall layer electrode is also printed between the third frequency layer electrode and the high frequency layer electrode and / or between the third frequency layer electrode and the low frequency layer electrode, and the additional isolation wall layer electrode has a layer through hole; after the lamination step printing, an additional isolation wall laminated electrode with a through hole is formed, and the additional isolation wall laminated electrode with a through hole and the ground constitute an additional isolation ground wall.

[0050] A grounding capacitor is formed between the third frequency port network and the ground G1 layer, and a grounding capacitor is formed between the additional isolation ground wall and the ground G1 layer.

[0051] However, those skilled in the art understand that an isolation ground wall does not necessarily need to be set between each port. Generally speaking, it is only required when there is a high requirement for isolation between two ports. Embodiment 3

[0052] like Figure 2 As shown, the LTCC combiner of this embodiment includes an insulating main frame and a single combiner located inside the frame, which is obtained by the processing method of the above embodiment 1. The outer dimensions of the LTCC combiner are L×W×T≥0.6×0.5×0.4mm, where L represents the length, W represents the width, and T represents the thickness. The side of the insulating main frame C has symmetrical terminals, namely, external electrodes (D1, D2, D3, and D4). Figure 3 As shown, the single combiner includes a high-frequency port network and its internal electrodes, a low-frequency port network and its internal electrodes, and an isolation ground wall composed of an isolation wall laminated electrode with a through hole and a ground. The high-frequency port network is formed by a capacitor layer H1 and an inductor layer (E1, E2, E3, E4) and a via, and forms a grounding capacitor with the ground G1; the low-frequency port network is formed by an inductor layer (F1, F2, F3) and a capacitor layer H2 and a via, and forms a grounding capacitor with the ground G1.

[0053] like Figure 4As shown, the electrodes (A1, A2, A3, A4) and vias (B1-1, B1-2, B1-3, B2-1, B2-2, B2-3, B3-1, B3-2, B3-3, B4-1, B4-2, B4-3) and ground G1 together constitute an isolation ground wall. The line spacing between the isolation ground wall and the high-frequency port network is: L1≥60um, and the line spacing between the isolation ground wall and the low-frequency port network is L2≥60um, and the L1 and L2 can be equal or unequal. The setting position and direction of the isolation ground wall are not limited to those shown in the figure, but can be selected according to the different internal structures of each product. The inductor layer in the high-frequency port network and the inductor layer in the low-frequency port network are not limited to the number of layers in the figure, but can be selected according to the specific product size and structure.

[0054] Four external electrodes (D1, D2, D3, D4) are printed on the outer side surface of the insulating main body frame, and the internal electrodes of the high-frequency port network and the internal electrodes of the low-frequency port network are respectively connected to the external electrodes.

[0055] The LTCC combiner of this embodiment is not only applicable to the side 4-electrode packaging structure, but also applicable to any of the side 6-electrode, side 6-electrode port 2-electrode, bottom 4-electrode, bottom 6-electrode, bottom 8-electrode, and bottom 9-electrode packaging structures.

[0056] According to the test, the isolation of the LTCC combiner of this embodiment can reach 24dB, which is significantly higher than the isolation index of similar products. Embodiment 4

[0057] The LTCC combiner further comprises a third frequency port network and an additional isolation ground wall, wherein the additional isolation ground wall is located between the third frequency port network and the high frequency port network, or the additional isolation ground wall is located between the third frequency port network and the low frequency port network.

[0058] The isolation ground wall design of the LTCC combiner in the embodiment of the present application improves the margin of the isolation index of the product, and the interference signal is less during use, and the impact on other electrical indicators is smaller, because only an isolation ground wall is added, and no circuit elements are added from the circuit point of view. From the structural point of view, because the isolation ground wall and the electrode layers at both ends are perpendicular to each other, the coupling area is small, and a large coupling structure will not be formed. This structure also only receives the interference signal between the two ends, so it has basically no effect on other indicators, effectively ensuring the anti-interference ability of the product itself and the user end. In addition, the processing method of the LTCC combiner does not increase the difficulty of the process, which is conducive to batch / large-scale production.

[0059] The above content is a further detailed description of the present invention in combination with specific / preferred embodiments, and it cannot be determined that the specific implementation of the present invention is limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, without departing from the concept of the present invention, it can also make several substitutions or modifications to these described embodiments, and these substitutions or modifications should be regarded as belonging to the protection scope of the present invention. In the description of this specification, the description of the reference terms "an embodiment", "some embodiments", "preferred embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in combination with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily target the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In the absence of mutual contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples. Although the embodiments of the present invention and their advantages have been described in detail, it should be understood that various changes, substitutions and modifications can be made herein without departing from the scope of protection of the patent application.

Claims

1. A method for processing a LTCC combiner, characterized in that The steps include: A via processing step, opening holes in the cut ceramic green tape and filling them with silver paste to form a green tape with vias, wherein the vias include high-frequency vias and low-frequency vias; a pattern printing step, printing patterns of layer inductors, layer capacitors and layer electrodes on the raw tape with the via holes, wherein the layer inductors include high-frequency layer inductors and low-frequency layer inductors, the layer capacitors include high-frequency layer capacitors and low-frequency layer capacitors, the layer electrodes include high-frequency layer electrodes and low-frequency layer electrodes, and also include an isolation wall layer electrode located between the high-frequency layer electrode and the low-frequency layer electrode, wherein the isolation wall layer electrode has a layer through hole, and also includes a ground layer; a lamination step, wherein a high-frequency laminated inductor, a low-frequency laminated inductor, a high-frequency laminated capacitor, a low-frequency laminated capacitor, a high-frequency internal electrode, a low-frequency internal electrode and an isolation wall laminated electrode with a through hole are obtained by lamination printing, wherein the high-frequency laminated inductor, the high-frequency laminated capacitor, the high-frequency internal electrode and the high-frequency via hole together constitute a high-frequency port network, the low-frequency laminated inductor, the low-frequency laminated capacitor, the low-frequency internal electrode and the low-frequency via hole together constitute a low-frequency port network, the isolation wall laminated electrode with a through hole and a ground constitute an isolation ground wall, and the ground layer respectively forms a grounding capacitor with the high-frequency port network, the low-frequency port network and the isolation ground wall; The single product manufacturing steps include cutting and sintering to obtain a single combiner; In the internal and external circuit connection step, a predetermined number of external electrodes are printed on the outer side surface of the insulating main frame, and each of the external electrodes is correspondingly connected to the high-frequency internal electrode and the low-frequency internal electrode on the single combiner located in the insulating main frame.

2. The method for processing the LTCC combiner according to claim 1, characterized in that: The vias in the via processing step further include at least one third frequency via; The layer inductor printed in the pattern printing step further includes at least one third frequency layer inductor, the layer capacitor further includes at least one third frequency layer capacitor, and the layer electrode further includes at least one third frequency layer electrode; After the lamination step is performed and printed, the third frequency layer inductor, the third frequency layer capacitor, the third frequency layer electrode and the third frequency via hole together form at least one third frequency port network.

3. The method for processing the LTCC combiner according to claim 2, characterized in that: An additional isolation wall layer electrode is further printed between the third frequency layer electrode and the high frequency layer electrode and / or between the third frequency layer electrode and the low frequency layer electrode, and the additional isolation wall layer electrode has a layer through hole; After the lamination step and printing, an additional isolation wall laminated electrode with a through hole is formed, and the additional isolation wall laminated electrode with a through hole and the ground constitute an additional isolation ground wall.

4. The method for processing the LTCC combiner according to claim 1, wherein: The line spacing between the isolation ground wall and the high-frequency port network and the line spacing between the isolation ground wall and the low-frequency port network are both ≥60um.

5. The method for processing the LTCC combiner according to claim 1, wherein: In the printing step, the single-layer printing area of ​​the isolation wall layer electrode is 50um×200um, 100um×500um or 100um×800um.

6. The method for processing the LTCC combiner according to claim 1, characterized in that: The isolation ground wall is at least one of a single-column electrode structure, a multi-column electrode connection structure, a multi-column electrode capacitive coupling structure, and an electrode through-hole whole-piece structure.

7. A LTCC combiner, characterized in that: The LTCC combiner is obtained by the processing method of claim 1, comprising an insulating main frame and a single combiner located inside the frame, wherein the single combiner comprises a high-frequency port network and its internal electrodes, a low-frequency port network and its internal electrodes, and an isolation ground wall composed of an isolation wall laminated electrode with a through hole and a ground; A predetermined number of external electrodes are printed on the outer side surface of the insulating main body frame, and the internal electrodes of the high-frequency port network and the internal electrodes of the low-frequency port network are respectively connected to the external electrodes.

8. The LTCC combiner according to claim 7, characterized in that: The LTCC combiner further comprises a third frequency port network and an additional isolation ground wall, wherein the additional isolation ground wall is located between the third frequency port network and the high frequency port network, or the additional isolation ground wall is located between the third frequency port network and the low frequency port network.

9. The LTCC combiner according to claim 7 or 8, characterized in that: The LTCC combiner is any one of the packaging structures of 4 electrodes on the side, 6 electrodes on the side, 2 electrodes on the side 6 electrodes, 4 electrodes on the bottom, 6 electrodes on the bottom, 8 electrodes on the bottom, and 9 electrodes on the bottom.

10. The LTCC combiner according to claim 7 or 8, characterized in that: The outer dimensions of the LTCC combiner are L×W×T≥0.6×0.5×0.4 mm.

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