An imaging method and system

Abstract

The embodiment of the present specification provides an imaging method and system, the method comprising: acquiring a first image of an object to be imaged by a photographic device; acquiring a second image of the object to be imaged by an X-ray imaging assembly; determining a thickness of the object to be imaged based on the first image; the ray source emits a ray for electron computed tomography imaging; determining a first distance from a reference point of the object to be imaged to the ray source based on the thickness; determining a correction factor based on the first distance, the correction factor being used to reflect the size corresponding to each pixel point on the second image.

Description

TECHNICAL FIELD

[0001] The present specification relates to the field of medical imaging computation, and in particular, to an imaging method and system. BACKGROUND

[0002] In recent years, medical imaging technology has been widely used in clinical examination and medical diagnosis. For example, with the development of computed tomography imaging technology (such as X-ray imaging technology), C-shaped X-ray imaging systems have become increasingly important in, for example, digital subtraction angiography, breast tomosynthesis, chest examination, and the like.

[0003] Therefore, there is a need to provide an imaging method and system for improving the accuracy of measuring the size of a to-be-imaged object based on medical imaging technology. SUMMARY

[0004] One of the embodiments of the present specification provides an imaging method, the method comprising: acquiring a first image of a to-be-imaged object by a photography device; acquiring a second image of the to-be-imaged object by an X-ray imaging assembly; determining a thickness of the to-be-imaged object based on the first image; determining a first distance from a reference point of the to-be-imaged object to a ray source based on the thickness; determining a correction factor based on the first distance, the correction factor being used to reflect a corresponding size of each pixel point on the second image.

[0005] In some embodiments, the determining the correction factor based on the first distance comprises: determining the correction factor based on the following formula, L1 = h1 * L / H; wherein L1 is the correction factor, h1 is the first distance, L is a corresponding size of each pixel point on a ray detection mechanism, and H is a distance between the ray source and the ray detection mechanism along the emission direction of the ray, wherein the ray detection mechanism is used to receive the ray emitted by the ray source.

[0006] In some embodiments, the correction factor can be determined relatively quickly and accurately by the above formula.

[0007] In some embodiments, the determining the first distance from the reference point of the to-be-imaged object to the ray source based on the thickness comprises: acquiring a second distance from a patient bed to the ray source; determining a third distance from the reference point of the to-be-imaged object to the patient bed based on the thickness; and determining the first distance based on the second distance and the third distance.

[0008] In some embodiments, by acquiring the second distance from the patient bed to the ray source and determining the third distance from the reference point of the to-be-imaged object to the patient bed based on the thickness, the determined first distance is more accurate.

[0009] In some embodiments, the determining the thickness of the object to be imaged based on the first image comprises: determining the thickness of the object to be imaged along a direction of emission of the X-ray based on the first image and a direction of emission of the X-ray source of the X-ray imaging assembly relative to the object to be imaged when the second image is acquired.

[0010] In some embodiments, the depth image can include depth information of the object to be imaged, and the thickness of the object to be imaged along the direction of emission of the X-ray can be determined more accurately.

[0011] In some embodiments, the determining the thickness of the object to be imaged along the direction of emission of the X-ray based on the first image and a direction of emission of the X-ray source of the X-ray imaging assembly relative to the object to be imaged when the second image is acquired comprises: establishing a three-dimensional model of the object to be imaged based on the first image; and determining the thickness of the object to be imaged along the direction of emission of the X-ray based on the direction of emission of the X-ray and the three-dimensional model.

[0012] In some embodiments, the three-dimensional model of the object to be imaged is established based on the image, and the thickness of the object to be imaged along the direction of emission of the X-ray is determined based on the direction of emission of the X-ray and the three-dimensional model, which can make the determined thickness of the object to be imaged along the direction of emission of the X-ray more accurate, and thus make the subsequently determined correction factor more accurate.

[0013] In some embodiments, the method further comprises: determining a size of a target part of the object to be imaged based on the correction factor and a number of pixels of the target part on the imaging image of the imaging device.

[0014] In some embodiments, the imaging device comprises at least two cameras, and the at least two cameras are arranged above the X-ray imaging assembly.

[0015] In some embodiments, by arranging at least two cameras, when one camera is damaged, the image of the object to be imaged can be acquired by another camera, and the correction can be ensured to be performed.

[0016] In some embodiments, the imaging device comprises a 3D camera.

[0017] In some embodiments, the method is applied to a digital subtraction angiography X-ray machine.

[0018] One of the embodiments of the present specification provides an imaging system, comprising a photography device configured to acquire a first image of an object to be imaged; an X-ray imaging assembly configured to acquire a second image of the object to be imaged; a thickness determination module configured to determine a thickness of the object to be imaged along a ray emission direction based on the first image and a ray emission direction of a ray source of the X-ray imaging assembly relative to the object to be imaged when acquiring the second image; a distance determination module configured to determine a first distance from a reference point of the object to be imaged to the ray source based on the thickness; and a size correction module configured to determine a correction factor based on the first distance, the correction factor being used to reflect a corresponding size of each pixel point on the second image.

[0019] According to the imaging method of the present specification, the thickness of the object to be imaged along the ray emission direction is determined based on the first image and the ray emission direction of the ray source of the X-ray imaging assembly relative to the object to be imaged when acquiring the second image, the first distance from the reference point of the object to be imaged to the ray source is determined based on the thickness, the correction factor is determined based on the first distance, the correction factor is used to reflect the corresponding size of each pixel point on the second image, for each object to be imaged, the corresponding correction factor can be determined according to the specific position and thickness of the object to be imaged, so that the correction is more accurate, the operation process is reduced, the efficiency is improved, and the size of the target part of the object to be detected determined according to the correction factor is more real. At the same time, the determination of the correction factor can be realized without a known size reference, which is more convenient for users to use, and the object to be imaged does not need to be placed at the isocenter, so the operation is simpler. BRIEF DESCRIPTION OF DRAWINGS

[0020] The present specification will be further illustrated in the form of exemplary embodiments, which will be described in detail with reference to the accompanying drawings. These embodiments are not limiting, and in these embodiments, the same numbers represent the same structures, wherein:

[0021] Figure 1 is a schematic diagram of an application scenario of an imaging system according to some embodiments of the present specification;

[0022] Figure 2 is an exemplary flowchart of an imaging method according to some embodiments of the present specification;

[0023] Figure 3 is a schematic diagram of the thickness of the object to be imaged along the ray emission direction according to some embodiments of the present specification;

[0024] Figure 4 is a schematic diagram of the thickness of the object to be imaged along the ray emission direction according to some other embodiments of the present specification;

[0025] Figure 5is an exemplary flowchart of determining the first distance based on the second distance and the third distance according to some embodiments of the present specification. DETAILED DESCRIPTION

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present specification, the following will briefly introduce the drawings needed to be used in the embodiment description. Obviously, the drawings in the following description are only some examples or embodiments of the present specification, and for those skilled in the art, the present specification can also be applied to other similar scenarios without creative labor. Unless it is clear from the language context or otherwise indicated, the same reference numbers in the drawings represent the same structure or operation.

[0027] It should be understood that the "system", "device", "unit" and / or "module" used herein is a method for distinguishing different components, elements, parts, sections or assemblies at different levels. However, if other words can achieve the same purpose, the words can be replaced by other expressions.

[0028] As shown in the specification and claims, unless the context clearly indicates otherwise, "a", "one", "kind" and / or "the" do not refer to the singular, but can also include the plural. Generally speaking, the terms "include" and "contain" only indicate the inclusion of the steps and elements explicitly identified, and these steps and elements do not constitute an exclusive list, and the method or device can also include other steps or elements.

[0029] Flowcharts are used in the present specification to illustrate the operations performed by the system according to the embodiments of the present specification. It should be understood that the preceding or subsequent operations are not necessarily performed in sequence. On the contrary, each step can be processed in reverse order or simultaneously. At the same time, other operations can also be added to these processes, or one or more steps of the operation can be removed from these processes.

[0030] Figure 1 is a schematic diagram of an application scenario 100 of an imaging system according to some embodiments of the present specification.

[0031] As shown in Figure 1 In some embodiments, the application scenario 100 can include a processing device 110, a network 120, a user terminal 130, a storage device 140, an imaging device 150 and a photographic device 160. The application scenario 100 can quickly and accurately correct the response data of the detected object by implementing the methods and / or processes disclosed in the present specification.

[0032] The processing device 110 can be configured to process data and / or information from at least one component of the application scenario 100 or an external data source (e.g., a cloud data center). The processing device 110 can access data or information from the user terminal 130, the storage device 140, the imaging device 150, and / or the photography device 160 through the network 120. The processing device 110 can be directly connected to the user terminal 130, the storage device 140, the imaging device 150, and / or the photography device 160 to access information and / or data. For example, the processing device 110 can obtain a first image of an object to be imaged from the photography device 160. The processing device 110 can process the obtained data and / or information. For example, the processing device 110 can determine a thickness of the object to be imaged along a ray emission direction of the object to be imaged based on the first image and a ray emission direction of a ray source relative to the object to be imaged when a second image is obtained; determine a first distance from a reference point of the object to be imaged to the ray source based on the thickness; and determine a correction factor based on the first distance. In some embodiments, the processing device 110 can be a single server or a group of servers. The processing device 110 can be local or remote. More descriptions about the processing device 110 can be found in Figure 2 and related descriptions, which are not repeated here.

[0033] In some embodiments, the processing device 110 can include a thickness determination module, a distance determination module, and a size correction module. The thickness determination module can be configured to determine a thickness of the object to be imaged along a ray emission direction of the object to be imaged based on the first image and a ray emission direction of a ray source relative to the object to be imaged when a second image is obtained; the distance determination module can be configured to determine a first distance from a reference point of the object to be imaged to the ray source based on the thickness; and the size correction module can be configured to determine a correction factor based on the first distance, the correction factor reflecting a size corresponding to each pixel point on the second image.

[0034] The network 120 can include any suitable network that can facilitate the exchange of information and / or data of the application scenario 100. In some embodiments, one or more components of the application scenario 100 (e.g., the processing device 110, the user terminal 130, the storage device 140, the imaging device 150, and / or the photography device 160) can exchange information and / or data through the network 120.

[0035] In some embodiments, the network 120 can be any one or more of a wired network or a wireless network. In some embodiments, the network 120 can include one or more network access points. For example, the network 120 can include wired or wireless network access points, such as base stations and / or network switching points, through which one or more components of the application scenario 100 can connect to the network 120 to exchange data and / or information.

[0036] User terminal 130 refers to one or more terminals or software used by a user. In some embodiments, user terminal 130 refers to a terminal or software used by a medical staff (e.g., a nurse, a doctor, etc.). In some embodiments, user terminal 130 can include, but is not limited to, a smart phone, a tablet, a laptop, a desktop computer, etc. In some embodiments, user terminal 130 can interact with other components in application scenario 100 through network 120. For example, user terminal 130 can send one or more control instructions to processing device 110 to control processing device 110 to determine a correction factor based on a first distance.

[0037] Storage device 140 can be used to store data, instructions, and / or any other information. In some embodiments, storage device 140 can store data and / or information obtained from user terminal 130, storage device 140, imaging device 150, and / or photography device 160, etc. For example, storage device 140 can store an image of a to-be-imaged object taken by photography device 160. For another example, storage device 140 can store a trained machine learning model. In some embodiments, storage device 140 can include a mass storage, a removable storage, etc., or any combination thereof.

[0038] Imaging device 150 (may also be referred to as an X-ray imaging component) can be a device for obtaining a medical image of a to-be-imaged object. In some embodiments, imaging device 150 can scan a to-be-imaged object, obtain scanning data, and generate a medical image of a user. The to-be-imaged object can include a human body, an animal, etc. The to-be-imaged object can be a whole human body or animal body; the to-be-imaged object can also include a target part, which can include an organ, a tissue, a lesion part, a tumor part, or any combination thereof. For example, the target part can be a head, a chest, an abdomen, a heart, a liver, an upper limb, a lower limb, etc., or any combination thereof. In some embodiments, imaging device 150 can be one device or a group of devices. Specifically, imaging device 150 can be one medical imaging system, for example, a PET (Positron Emission Tomography) device, a SPECT (Single Photon Emission Computed Tomography) device, a CT (Computed Tomography) device, an MRI (Magnetic Resonance Imaging) device, etc. Further, the medical imaging system can be used alone or in combination. For example, a PET-CT device, a PET-MRI device, or a SPECT-MRI device, etc. In some embodiments, the imaging device can include a digital subtraction angiography X-ray machine.

[0039] In some embodiments, the imaging device 150 can include a couch 151, a gantry 152, a movable assembly 153 connected to the gantry 152, a radiation source 154 fixed on the movable assembly 153, and a radiation detection mechanism 155. The gantry 152 can be used to support the movable assembly 153. The movable assembly 153 can rotate the radiation source 154 and the radiation detection mechanism 155 around a rotation center, and a projection image of an object to be imaged on the radiation detection mechanism 155 at different angles can be obtained. In some embodiments, the movable assembly 153 can be a C-arm, and the radiation source 154 and the radiation detection mechanism 155 can be located at two ends of the C-arm, respectively. The couch 151 can be used for the object to be imaged to lie down. The radiation source 154 can emit radioactive rays to irradiate the target object. The radiation detection mechanism 155 can be used to receive the radioactive rays. The radioactive rays can include one or a combination of particle rays, photon rays, etc. The particle rays can include one or a combination of neutrons, protons, electrons, muons, heavy ions, etc. The photon rays can include one or a combination of X-rays, γ-rays, α-rays, β-rays, ultraviolet rays, laser rays, etc. As an example, the photon rays can be X-rays, and the corresponding imaging device 150 can be one or more of a CT system, a digital radiography system (DR), a multi-modal medical imaging system, etc. Further, in some embodiments, the multi-modal medical imaging system can include one or more of a CT-PET system, a SPECT-MRI system, etc. As an example, the radiation source 154 can be an X-ray tube. The X-ray tube can emit X-rays, which are received by the radiation detection mechanism 155. It can be understood that when the radiation emitted by the radiation source 154 is X-rays, the imaging device 150 can also be referred to as an X-ray imaging assembly.

[0040] The radiation detection mechanism 155 can include a plurality of detector pixel units. In some embodiments, the plurality of detector pixel units on the radiation detection mechanism 155 can be arranged in a preset manner, for example, the plurality of detector pixel units can be arranged in m rows and n columns, where the rows can be the arrangement direction of the radiation detection mechanism 155, and the columns can be the channel direction of the radiation detection mechanism 155. In some embodiments, the radiation detection mechanism 155 can be a circular radiation detection mechanism, a square radiation detection mechanism, or an arc-shaped radiation detection mechanism, etc. The rotation angle of the arc-shaped radiation detection mechanism can be between 0 degrees and 360 degrees. In some embodiments, the rotation angle of the arc-shaped radiation detection mechanism can be fixed. In some embodiments, the rotation angle of the arc-shaped radiation detection mechanism can be adjusted as needed. For example, the rotation angle of the arc-shaped radiation detection mechanism can be adjusted according to the resolution of the image required, the size of the image, the sensitivity of the radiation detection mechanism, the stability of the radiation detection mechanism, or a combination of one or more thereof. In some embodiments, the radiation detection mechanism 155 can be a one-dimensional radiation detection mechanism, a two-dimensional radiation detection mechanism, or a three-dimensional radiation detection mechanism.

[0041] In some embodiments, the imaging device 150 can further include an image generator for generating an image. In some embodiments, the image generator can perform operations such as image preprocessing, image reconstruction, and / or region of interest extraction, etc. to generate a medical image of the object to be imaged. The image generator can be associated with the radiation detection mechanism 155, the operation control computer device, and / or an external data source (not shown in the figure). In some embodiments, the image generator can receive data from the radiation detection mechanism 155 or the external data source, and generate a medical image of the object to be imaged based on the received data. The external data source can be one or more of a hard disk, a floppy disk, a random access memory (RAM), a dynamic random access memory (DRAM), a static random access memory (SRAM), a bubble memory, a thin film memory, a magnetic plated wire memory, a phase change memory, a flash memory, a cloud disk, etc.

[0042] For more description of the imaging device 150, please refer to Figure 2 and the related description thereof, which will not be repeated here.

[0043] The photography device 160 (may also be referred to as a camera) can be used to take images of the object to be imaged. In some embodiments, the photography device 160 includes at least two cameras. In some embodiments, the at least two cameras are positioned above the imaging device 150. In some embodiments, the cameras can be planar cameras, such as black and white cameras, color cameras, scanners, or any combination thereof. In some embodiments, the planar cameras can capture two-dimensional images of the object to be imaged from different angles, and the processing device 110 can reconstruct a depth image of the object to be imaged based on the two-dimensional images of the object to be imaged captured from different angles by the planar cameras. In some embodiments, the planar cameras can include black and white cameras, color cameras, scanners, or any combination thereof. In some embodiments, the photography device 160 can include 3D cameras, which can be used to directly capture a depth image of the object to be imaged. For example, a structured light camera that projects specific light information (e.g., vertical and horizontal laser lines, black and white squares, a circular ring, etc.) onto the object to be imaged. For another example, a binocular camera, a TOF (Time of Fight Camera) camera, etc.

[0044] Further description of the photography device 160 can be found in Figure 2 and related descriptions, which are not repeated here.

[0045] It should be noted that the application scenario 100 is provided only for illustrative purposes, and is not intended to limit the scope of the present specification. Those of ordinary skill in the art can make various modifications or changes based on the description of the present specification. For example, the application scenario 100 can also include a database. However, these changes and modifications will not depart from the scope of the present specification.

[0046] The correction factor is used to reflect the real size of each pixel point on the imaging image of the imaging device, for example, the real length and width of the to-be-imaged object corresponding to each pixel point. The correction factor can be determined in various ways. For example, in some embodiments, the correction factor can be determined by reference, that is, by the imaging device 150 acquiring the image corresponding to the reference object (for example, a catheter, a ruler or a steel ball) of a known size, and determining the correction factor based on the real size of the reference object and the size of the reference object on the image. For another example, the to-be-imaged object is placed at the isocenter of the imaging device 150, and the correction factor is determined. Wherein, the ray source 154 and the ray detection mechanism 155 rotate around a common center point, the radiation axis of the ray source 154 passes through the smallest sphere with this point as the center, and this common center point is the isocenter. Both of the above two methods have disadvantages. For example, based on the reference object to determine the correction factor, the size of the reference object needs to be obtained in advance, and the absence of a reference object of a known size will make the correction factor unable to be determined. For another example, by the isocenter to determine the correction factor, if the to-be-imaged object is not placed at the isocenter of the imaging device 150, the determined correction factor will be deviated, resulting in a deviation between the determined size of the to-be-imaged object and its real size.

[0047] The embodiments of the present application provide an imaging system and method, which can acquire an image of a to-be-imaged object, determine the thickness of the to-be-imaged object along the ray emission direction of the ray source of the X-ray imaging assembly when acquiring the second image based on the image and the ray emission direction, determine the first distance from the reference point of the to-be-imaged object to the ray source based on the thickness, and determine the correction factor based on the first distance. The correction factor can be determined without a reference object of a known size, and the determined correction factor is related to the position and thickness of the to-be-imaged object, so that the correction factor determined by the method is more accurate.

[0048] Figure 2 is an exemplary flowchart of an imaging method 200 according to some embodiments of the present specification. As shown in Figure 2 , the imaging method 200 includes the following steps. In some embodiments, the imaging method 200 can be performed by the processing device 110.

[0049] Step 210, acquiring a first image of a to-be-imaged object by a photographic device.

[0050] In some embodiments, the processing device 110 can acquire the image of the to-be-imaged object by the photographic device 160.

[0051] In some embodiments, the first image can be a two-dimensional (2D) image or a three-dimensional (3D) image, and the format of the first image can be Joint Photographic Experts Group (JPEG), Tagged Image File Format (TIFF), Graphics Interchange Format (GIF), Digital Imaging and Communications in Medicine (DICOM), etc. In some embodiments, the first image captured by the photographing device 160 can be a depth image.

[0052] In some embodiments, the photographing device 160 can acquire at least two images respectively by at least two cameras, and the processing device 110 can screen the at least two images and take the screened images as the first image for determining the thickness of the object to be imaged. The processing device 110 can screen the at least two images according to the related information (e.g., definition, brightness, authenticity, etc.) of the images.

[0053] In some embodiments, by setting at least two cameras, when a certain camera is damaged, the first image can be acquired by another camera, thereby ensuring the correction.

[0054] For more description of the photographing device 160, please refer to Figure 1 and the related description thereof, which will not be repeated here.

[0055] In step 220, a second image of the object to be imaged is acquired by an X-ray imaging assembly.

[0056] The second image can be acquired by scanning the object to be imaged by an X-ray imaging assembly (which can also be referred to as an imaging device). For description of the X-ray imaging assembly, please refer to Figure 1 and the related description thereof, which will not be repeated here.

[0057] In step 230, the thickness of the object to be imaged is determined based on the first image.

[0058] In some embodiments, the processing device 110 can determine the thickness of the object to be imaged based on the first image by any means.

[0059] For example, the processing device 110 can identify the size information of the object to be imaged based on the first image, thereby acquiring the thickness at different positions and calculating the average value of the thickness at different positions, and taking the average value as the thickness of the object to be imaged.

[0060] For another example, the processing device 110 can identify information (e.g., a human face, etc.) of the object to be imaged based on the first image, and obtain a historical thickness or a preset thickness of the object to be imaged based on the identified information of the object to be imaged, and take the obtained historical thickness or preset thickness of the object to be imaged as the thickness of the object to be imaged.

[0061] In some embodiments, the processing device 110 can determine the thickness of the object to be imaged along the ray emission direction based on the first image and the ray emission direction of the ray source of the X-ray imaging assembly when the second image is obtained relative to the object to be imaged. The focal point of the ray source (e.g., the ray source 154) can have a vertical projection point on the ray detection mechanism (e.g., the ray detection mechanism 155), and the ray emission direction of the ray source can be based on the direction from the focal point of the ray source to the vertical projection point. The ray emission direction of the ray source can be different when the ray source 154 and the ray detection mechanism 155 rotate to different angles around the rotation center. For example, Figure 3 is a schematic diagram of the thickness of the object to be imaged along the ray emission direction according to some embodiments of the present specification, as shown in Figure 3 When the ray source 310 and the ray detection mechanism 320 rotate to an angle 1 around the rotation center, the ray emission direction 330 of the ray source 310 is the direction from the focal point 340 of the ray source to the vertical projection point 350 on the ray detection mechanism 320; Figure 4 is a schematic diagram of the thickness of the object to be imaged along the ray emission direction according to some embodiments of the present specification, as shown in Figure 4 When the ray source 410 and the ray detection mechanism 420 rotate to an angle 2 around the rotation center, the ray emission direction 430 of the ray source 420 is the direction from the focal point 440 of the ray source 410 to the vertical projection point 450 on the ray detection mechanism 420.

[0062] In some embodiments, the processing device 110 can obtain the ray emission direction of the ray source from the user terminal 130, the storage device 140, the imaging device 150, and / or the photography device 160.

[0063] The thickness of the object to be imaged along the ray emission direction can be different when the ray source and the ray detection mechanism rotate to different angles around the rotation center. Still taking Figure 3 and Figure 4 as examples, as shown in Figure 3 When the ray source 310 and the ray detection mechanism 320 rotate to an angle 1 around the rotation center, the thickness of the object to be imaged along the ray emission direction 330 can be the distance between the point 370 and the point 380; as shown in Figure 4 When the ray source 410 and the ray detection mechanism 420 rotate to an angle 2 around the rotation center, the thickness of the object to be imaged along the ray emission direction 430 can be the distance between the point 470 and the point 480.

[0064] The processing device 110 can determine the thickness of the object to be imaged along the ray emission direction based on the first image of the object to be imaged acquired by the imaging device 160 and the ray emission direction of the ray source relative to the object to be imaged when the second image is acquired by any feasible manner.

[0065] For example, the processing device 110 can determine the thickness of the object to be imaged along the ray emission direction based on the two-dimensional image of the object to be imaged acquired by the imaging device 160 and the ray emission direction of the ray source. For example only, the processing device 110 can determine the number of pixels in the two-dimensional image of the object to be imaged along the ray emission direction of the object to be imaged, and determine the thickness of the object to be imaged along the ray emission direction based on the number of pixels.

[0066] In some embodiments, the processing device 110 can establish a three-dimensional model of the object to be imaged based on the first image, and determine the thickness of the object to be imaged along the ray emission direction based on the ray emission direction and the three-dimensional model.

[0067] In some embodiments, the first image acquired by the imaging device 160 can include two-dimensional images of the object to be imaged acquired from different angles. The processing device 110 can establish a three-dimensional model of the object to be imaged based on the two-dimensional images of the object to be imaged acquired from different angles by the imaging device 160. For example, the processing device 110 can reconstruct a depth image of the object to be imaged based on the two-dimensional images of the object to be imaged acquired from different angles by the imaging device 160, and the processing device 110 can establish a three-dimensional model of the object to be imaged based on the reconstructed depth image. For example, the algorithm for reconstructing the depth information can include the patch-based MVS algorithm, the Marching Cube algorithm, the Dual Contouring algorithm, etc.

[0068] In some embodiments, the processing device 110 can establish a three-dimensional model of the object to be imaged based on the reconstructed depth image by any feasible manner. For example only, the processing device 110 can convert the reconstructed depth image into a three-dimensional point cloud by coordinate conversion, and establish a three-dimensional model of the object to be imaged based on the three-dimensional point cloud.

[0069] In some embodiments, the first image acquired by the imaging device 160 can include a depth image of the object to be imaged. The processing device 110 can establish a three-dimensional model of the object to be imaged based on the depth image of the object to be imaged acquired by the imaging device 160 directly.

[0070] In some embodiments, the processing device 110 can determine the thickness of the object to be imaged along the ray emission direction based on the ray emission direction and a three-dimensional model. For example, the processing device 110 can determine two contour points characterizing the thickness of the object to be imaged, located at opposite ends of the ray emission direction, based on the ray emission direction. The processing device 110 can determine the thickness of the object to be imaged along the ray emission direction based on the distance between the two contour points. This is merely an example, still using... Figure 3 and Figure 4 For example, Figure 3 As shown, when the X-ray source 310 and the X-ray detection mechanism 320 rotate around the rotation center to an angle of 1, the thickness of the object to be imaged along the X-ray emission direction 330 can be the distance between contour point 370 and contour point 380; as Figure 4 As shown, when the X-ray source 410 and the X-ray detection mechanism 420 rotate around the rotation center to an angle of 2, the thickness of the object to be imaged along the X-ray emission direction 430 can be the distance between the contour point 470 and the contour point 480.

[0071] In some embodiments, the processing device 110 establishes a three-dimensional model of the object to be imaged from the image, and determines the thickness of the object to be imaged along the ray emission direction based on the ray emission direction and the three-dimensional model when the second image is acquired. This can make the determined thickness of the object to be imaged along the ray emission direction more accurate, thereby making the subsequently determined correction factor more accurate.

[0072] Step 240: Determine the first distance from the reference point of the object to be imaged to the X-ray source based on the thickness.

[0073] A reference point can characterize any point on the thickness of the object being imaged along the ray emission direction. For example, the center point. Figure 3 For example, when the X-ray source 310 and the X-ray detection mechanism 320 rotate around the rotation center to an angle of 1, the reference point 390 of the object to be imaged can be the center point between point 370 and point 380.

[0074] The first distance characterizes the distance from the reference point of the object to be imaged to the focal point of the X-ray source. This first distance can change with the rotation angle of the X-ray source and the X-ray detection mechanism. (The last sentence appears to be incomplete and possibly refers to a different context.) Figure 3 and Figure 4 For example, Figure 3 As shown, when the radiation source 310 and the radiation detection mechanism 320 rotate around the rotation center to an angle of 1, the first distance can be the distance between point 390 along the radiation emission direction and the focal point 340 of the radiation source; as Figure 4 As shown, when the X-ray source 410 and the X-ray detection mechanism 420 rotate around the rotation center to an angle of 2, the first distance can be the distance between point 490 along the X-ray emission direction and the focal point 440 of the X-ray source.

[0075] In some embodiments, the processing device 110 can determine the first distance from the reference point of the object to be imaged to the radiation source in any manner. For example, the processing device 110 can first determine the reference point on the two-dimensional image of the object to be imaged, then determine a line connecting the focal point of the radiation source and the reference point, and determine the first distance based on the number of pixel points on the line. For another example, the processing device 110 can obtain the image acquired by the imaging device 160, establish a three-dimensional model of the imaging device, and fuse the three-dimensional model of the imaging device with the three-dimensional model of the object to be imaged based on the spatial positional relationship, and determine the distance from the reference point of the object to be imaged to the focal point of the radiation source according to the fused three-dimensional model.

[0076] In some embodiments, the processing device 110 can obtain the second distance from the patient bed to the radiation source, determine the third distance from the reference point of the object to be imaged to the patient bed based on the thickness, and determine the first distance based on the second distance and the third distance. More description about determining the first distance based on the second distance and the third distance can be referred to Figure 5 and related descriptions, which will not be repeated here.

[0077] In step 250, a correction factor is determined based on the first distance, and the correction factor is used to reflect the size corresponding to each pixel point on the second image.

[0078] The correction factor is used to reflect the size corresponding to each pixel point on the second image, i.e., the real size of the object to be imaged corresponding to each pixel point.

[0079] In some embodiments, the processing device 110 can determine the correction factor based on the first distance in any manner, and the correction factor is used to reflect the size corresponding to each pixel point on the second image. For example, the processing device 110 can first determine the distance between the isocenter point of the imaging device 150 and the focal point of the radiation source (also referred to as isocenter distance), then determine the ratio of the first distance to the isocenter distance (also referred to as distance ratio), and adjust based on the distance ratio and the initial correction factor. The initial correction factor can be the correction factor obtained by the processing device 110 based on the isocenter point of the imaging device 150. For example only, the processing device 110 can take the product of the initial correction factor and the distance ratio as the correction factor.

[0080] In some embodiments, the processing device 110 can determine the correction factor based on the following formula:

[0081] L1 = h1 * L / H;

[0082] wherein L1 is the correction factor, h1 is the first distance, L is the pixel size of the radiation detection mechanism, i.e., the size corresponding to each pixel point on the radiation detection mechanism, and H is the distance between the radiation source and the radiation detection mechanism along the radiation emission direction.

[0083] In some embodiments, the correction factor can be determined quickly and accurately by the above formula.

[0084] In some embodiments, the imaging method 200 can further include a step 260 of determining the size of the target part of the object to be imaged based on the correction factor and the number of pixels of the target part on the second image.

[0085] In some embodiments, the processing device 110 can determine the size of the object to be imaged based on the correction factor and the number of pixels of the target part on the second image. For example, the processing device 110 can take the product of the number of pixels of the target part and the correction factor as the size of the target part of the object to be imaged.

[0086] In some embodiments, the imaging method 200 determines the thickness of the object to be imaged along the ray emission direction based on the first image and the ray emission direction of the ray source relative to the object to be imaged when acquiring the second image, determines the first distance from the reference point of the object to be imaged to the ray source based on the thickness, determines the correction factor based on the first distance, and the correction factor is used to reflect the size corresponding to each pixel point on the second image. For each object to be imaged, the imaging method 200 can determine the corresponding correction factor based on the specific position and thickness of the object to be imaged, so that the correction is more accurate, can be completed without additional reference, reduces the operation process, improves the efficiency, and makes the size of the target part of the object to be imaged determined based on the correction factor more real. At the same time, the determination of the correction factor can be realized without a known size reference, which is more convenient for users to use, and the object to be imaged does not need to be placed at the isocenter, which is more simple to operate.

[0087] It should be noted that the above description of the imaging method 200 is only for example and illustration, and does not limit the scope of the present specification. Those skilled in the art can make various modifications and changes to the imaging method 200 under the guidance of the present specification. However, these modifications and changes are still within the scope of the present specification.

[0088] Figure 5 is an exemplary flowchart for determining the first distance based on the second distance and the third distance according to some embodiments of the present specification. As shown in Figure 5 , the flow 500 includes the following steps. In some embodiments, the flow 500 can be performed by the processing device 110.

[0089] Step 510, acquiring the second distance from the patient bed to the ray source.

[0090] The second distance can represent a distance between a focal point of the ray source and the patient bed along the ray emission direction. In some embodiments, the processing device 110 can obtain the second distance as a distance between a focal point of the ray source and a patient bed reference point along the ray emission direction, where the patient bed reference point can be a point on the patient bed that is located along the ray emission direction, e.g., a point on the top of the patient bed that is located along the ray emission direction. As shown in FIG. 3B, the second distance can represent a distance between the focal point 340 of the ray source and the patient bed reference point (coinciding with point 380) along the ray emission direction 330. Figure 3 The processing device 110 can obtain the second distance directly from the user terminal 130, the storage device 140, the imaging device 150, and / or the photography device 160 in some embodiments.

[0091] In some embodiments, the processing device 110 can determine the second distance based on the image obtained by the photography device. For example, the processing device 110 can determine a line between a focal point of the ray source and the patient bed along the ray emission direction on the image obtained by the photography device, and determine the second distance based on a number of pixels located on the line. For another example, the processing device 110 can establish a three-dimensional model of the imaging device based on the image obtained by the photography device, and determine the second distance based on the three-dimensional model.

[0092] At step 520, the processing device 110 determines a third distance from the reference point of the object to be imaged to the patient bed based on the thickness.

[0093] The third distance can represent a distance between the reference point of the object to be imaged and the patient bed. In some embodiments, the processing device 110 can obtain the second distance as a distance between the reference point of the object to be imaged and a patient bed reference point. As shown in FIG. 3B, the third distance can represent a distance between the reference point 390 of the object to be imaged and the patient bed reference point (coinciding with point 380) along the ray emission direction 330. Figure 3

[0094] In some embodiments, the processing device 110 can determine the third distance from the reference point of the object to be imaged to the patient bed based on the thickness. For example, when the ray emission direction of the ray source is a vertical direction and the patient bed reference point is located on the top of the patient bed, the third distance can be half of the thickness of the object to be imaged along the ray emission direction.

[0095] In some embodiments, the processing device 110 can also determine the third distance based on the image obtained by the photography device. For example, the processing device 110 can determine a line between the reference point of the object to be imaged and the patient bed reference point along the ray emission direction on the image obtained by the photography device, and determine the third distance based on a number of pixels located on the line.

[0096] ​For another example, the processing device 110 can establish a three-dimensional model of the patient bed based on the image acquired by the imaging device, and fuse the three-dimensional model of the patient bed with the three-dimensional model of the object to be imaged based on the spatial positional relationship, and determine the third distance according to the fused three-dimensional model.

[0097] At step 530, the first distance is determined based on the second distance and the third distance.

[0098] In some embodiments, the processing device 110 can determine the first distance based on the second distance and the third distance. For example, when the patient bed is located between the radiation source and the object to be imaged, the first distance can be the sum of the second distance and the third distance. For another example, when the object to be imaged is located between the radiation source and the patient bed, the first distance can be the difference between the second distance and the third distance.

[0099] In some embodiments, the process 500 makes the determined first distance more accurate by acquiring the second distance of the patient bed to the radiation source, and determining the third distance of the reference point of the object to be imaged to the patient bed based on the thickness.

[0100] The above description has been made to the basic concept, and it is obvious that the above detailed disclosure is only taken as an example, and does not constitute a limitation to the present specification. Although it is not explicitly stated herein, those skilled in the art can make various modifications, improvements and corrections to the present specification. Such modifications, improvements and corrections are suggested in the present specification, so such modifications, improvements and corrections still belong to the spirit and scope of the exemplary embodiments of the present specification.

[0101] Meanwhile, specific words are used in the present specification to describe the embodiments of the present specification. As "one embodiment", "an embodiment", and / or "some embodiments" means a certain feature, structure or characteristic related to at least one embodiment of the present specification. Therefore, it should be emphasized and noted that the "an embodiment" or "one embodiment" or "one alternative embodiment" mentioned in the present specification twice or more in different positions does not necessarily mean the same embodiment. In addition, certain features, structures or characteristics in one or more embodiments of the present specification can be properly combined.

[0102] Furthermore, the order of the processing elements and sequences described in this specification are not intended to be construed as a limitation, unless specifically stated, but are included to provide a complete description of one or more embodiments of the present specification. Regardless of the particular sequence of processing elements and sequences, however, the description herein of a process should be understood to include any and all combinations of one or more elements, and sequences that can be perceived as either open-ended or specific.

[0103] It should be understood that all the terminology used herein is for the purpose of describing particular embodiments only, and is not intended to be limiting. It should also be understood that the use of terminology, such as "for example," "for instance," "e.g.", "in one embodiment", "in another embodiment," or "in some embodiments," throughout this document is meant to convey that a particular feature, description, or example is included in, or applicable to, at least one embodiment, but not necessarily all embodiments. Likewise, the use of "may" is meant to convey that an element is included in some embodiments, but not necessarily all embodiments. Likewise, the use of "may" is meant to convey that an element is included in some embodiments, but not necessarily all embodiments. Furthermore, the particular features, structures, or characteristics can be combined in any suitable manner on all or any embodiments of the present specification. One having ordinary skill in the art will understand that information and signals can be represented using any of a variety of technologies and techniques. For the purposes of this description, the terms "information" and "signals" can be regarded as being synonymous.

[0104] Some embodiments use numerical descriptors, quantities of attributes, and the like. It should be understood that such numerical descriptors used in the description of embodiments can, in some examples, be modified by the terms "about," "approximately," or "generally." Unless otherwise indicated, "about," "approximately," or "generally" indicates that a numerical value is within ±20% of the stated value. Accordingly, numerical values used in the description and claims are approximations that can vary depending on the desired properties sought to be obtained in a particular embodiment. In some embodiments, numerical values should be considered in the context of the number of significant figures used in the description and the common number of significant figures used in the art. Although the numerical ranges and parameters setting forth the broadest scope of the embodiments described herein are approximations, the numerical values set forth in the specific examples are reported as precisely as practicable. The numerical values set forth in the specific examples are provided to be as precise as reasonably possible. However, some variations can occur depending on the implementation desired.

[0105] Each patent, patent application, publication, and other material cited in this specification is incorporated herein by reference in its entirety. Nothing herein is to be construed as an admission that the application is not entitled to antedate such material by virtue of prior application. To the extent the material incorporated by reference contradicts or contradicts specifically identified definitions, statements, or figures set forth in this specification, including attached claims, the incorporated material is hereby expressly disclaimed. It is specifically noted that, where a description, definition, and / or a term in the attached claims is contrary to that of any document incorporated by reference herein, the latter dominates.

[0106] Finally, it should be understood that the embodiments described herein are only given by way of example and that other modifications can occur to persons skilled in the art. Therefore, the scope of the present description is not intended to be limited to the embodiments described herein but is only limited by the claims that follow.

Claims

1. An imaging method, characterized in that, include: Acquire a first image of the object to be imaged using a photographic device; A second image of the object to be imaged is obtained using an X-ray imaging component; The thickness of the object to be imaged is determined based on the first image, and the thickness includes the thickness of the object to be imaged along the ray emission direction; The first distance from the reference point of the object to be imaged to the X-ray source of the X-ray imaging assembly is determined based on the thickness, wherein the reference point includes any point on the thickness of the object to be imaged along the X-ray emission direction; Determining the correction factor based on the first distance includes: The correction factor is determined based on the first distance, the size of each pixel on the ray detection mechanism, and the distance between the ray source and the ray detection mechanism along the ray emission direction. The correction factor is used to reflect the size of each pixel on the second image, and the ray detection mechanism is used to receive the rays emitted by the ray source.

2. The method as described in claim 1, characterized in that, The determination of the first distance from the reference point of the object to be imaged to the X-ray source of the X-ray imaging assembly based on the thickness includes: Obtain the second distance from the hospital bed to the radiation source; The third distance from the reference point of the object to be imaged to the hospital bed is determined based on the thickness. The first distance is determined based on the second distance and the third distance.

3. The method as described in claim 1, characterized in that, Determining the thickness of the object to be imaged based on the first image includes: Based on the first image and the ray emission direction of the X-ray imaging component relative to the object to be imaged when acquiring the second image, the thickness of the object to be imaged along the ray emission direction is determined.

4. The method as described in claim 3, characterized in that, The method of determining the thickness of the object to be imaged along the ray emission direction relative to the ray emission direction when acquiring the second image based on the first image and the ray source of the X-ray imaging component includes: A three-dimensional model of the object to be imaged is established based on the first image; The thickness of the object to be imaged along the ray emission direction is determined based on the ray emission direction and the three-dimensional model.

5. The method as described in claim 4, characterized in that, The method further includes: The size of the target part of the object to be imaged is determined based on the correction factor and the number of pixels of the target part in the second image.

6. The method as described in claim 1, characterized in that, The imaging device includes at least two cameras; the at least two cameras are positioned above the X-ray imaging assembly.

7. The method as described in claim 6, characterized in that, The photographic equipment includes a 3D camera.

8. The method as described in claim 1, characterized in that, The method is applied to digital subtraction angiography X-ray machines.

9. An imaging system, characterized in that, include: Photographic equipment used to acquire a first image of an object to be imaged; An X-ray imaging component for acquiring a second image of the object to be imaged; A thickness determination module is used to determine the thickness of the object to be imaged along the ray emission direction based on the first image and the ray emission direction of the X-ray source of the X-ray imaging component relative to the object to be imaged when acquiring the second image, wherein the thickness includes the thickness of the object to be imaged along the ray emission direction; A distance determination module is used to determine a first distance from a reference point of the object to be imaged to the X-ray source of the X-ray imaging assembly based on the thickness, wherein the reference point includes any point on the thickness of the object to be imaged along the X-ray emission direction; A size correction module, used to determine a correction factor based on the first distance, includes: The correction factor is determined based on the first distance, the size of each pixel on the ray detection mechanism, and the distance between the ray source and the ray detection mechanism along the ray emission direction. The correction factor is used to reflect the size of each pixel on the second image, and the ray detection mechanism is used to receive the rays emitted by the ray source.

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