Silicon Wafer Production Method

Abstract

An embodiment of the present application provides a method for producing silicon wafers, including: cutting a silicon rod adhered to a crystal carrier assembly by a slicing machine to obtain silicon wafers, and pre-cleaning the silicon wafers during the process of removing the rod. After the pre-cleaning is completed, the silicon wafers and the crystal carrier assembly are placed in a tooling basket; transporting the tooling basket containing the silicon wafers and the crystal carrier assembly to a degumming device by a transport cart; degumming the silicon wafers by the degumming device to separate them from the crystal carrier assembly; transporting the silicon wafers to a plug washing device by a silicon wafer transfer mechanism arranged between the degumming device and the plug washing device; and performing plug washing on the silicon wafers by the plug washing device. The method for producing silicon wafers provided by the embodiment of the present application can achieve automated production of silicon wafers, improve production efficiency, and reduce the workload of personnel.

Description

Technical Field

[0001] This application relates to silicon wafer production technology, and in particular to a method for producing silicon wafers. Background Art

[0002] In traditional solutions, small monocrystalline silicon cells are usually formed by first cutting a monocrystalline silicon rod into large silicon wafers, and then using laser technology to scribe and cut the large silicon wafers into small silicon wafers.

[0003] A slicing machine is a device that cuts a hard and brittle material rod into thin slices. The slicing machine usually has two parallel main rollers arranged horizontally, and a single diamond wire is wound around the two main rollers to form at least 2,000 wire saws. The silicon rod moves downward from above and passes between the two main rollers. The main rollers rotate, driving the diamond wire to move at high speed to cut the silicon rod into thin slices.

[0004] A group of silicon wafers formed by cutting a silicon rod are placed in a kind of tooling basket, and baffles are inserted on both sides of the silicon wafers to prevent the silicon wafers from tipping over. Workers manually carry the tooling basket into the degumming device and sequentially enter the cleaning tank for pre-cleaning and the degumming tank for degumming. After the silicon wafers are degummed in the degumming tank, workers visually inspect whether there is residual glue on the silicon wafers, and manually wipe the residual glue on the adhesive surface of the silicon wafers with a cleaning cloth. Then the silicon wafers are transferred to another tooling basket and carried to the wafer inserting and cleaning device for wafer inserting and cleaning. In addition, the crystal carrier after degumming is also taken away manually by an electric hoist, and the thick wafers on the crystal carrier and the silicon wafers adhered to the thick wafers are manually removed.

[0005] As can be seen from the above: In traditional solutions, a large amount of manual work is involved, which greatly affects production efficiency and product quality. Summary of the Invention

[0006] In order to solve one of the above technical defects, an embodiment of the present application provides a method for producing silicon wafers.

[0007] According to the first aspect of the embodiment of the present application, a method for producing silicon wafers is provided, including:

[0008] Cutting a silicon rod bonded to a crystal carrier assembly by a slicing machine to obtain silicon wafers, and pre-cleaning the silicon wafers during the silicon rod withdrawing process. After the pre-cleaning is completed, the silicon wafers and the crystal carrier assembly are placed in a tooling basket;

[0009] Transporting the tooling basket containing the silicon wafers and the crystal carrier assembly to the degumming device by a transport cart;

[0010] Degumming the silicon wafers in the degumming device to separate them from the crystal carrier assembly;

[0011] Transporting the silicon wafers to the wafer inserting and cleaning device by a silicon wafer transfer mechanism arranged between the degumming device and the wafer inserting and cleaning device;

[0012] Performing wafer inserting on the silicon wafers by the wafer inserting and cleaning device.

[0013] The technical solution provided by the embodiments of the present application pre-cleans the silicon wafer during the process of retracting the rod after the slicing machine finishes cutting, which can shorten the production time of the silicon wafer and simplify the structure of the degumming device. Automatically transporting the tooling basket from the slicing machine to the degumming device by the transport cart can improve production efficiency and reduce the workload of personnel. Automatically degumming, rubbing, and slicing the silicon wafer by the degumming device has a high degree of automation and high production efficiency. Description of the Drawings

[0014] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The schematic embodiments and descriptions thereof of the present application are used to explain the present application and do not constitute an improper limitation to the present application. In the drawings:

[0015] Figure 1 is a flowchart of the silicon wafer production method provided by the embodiments of the present application;

[0016] Figure 2 is a schematic structural diagram of the silicon wafer production system provided by the embodiments of the present application;

[0017] Figure 3 is a schematic structural diagram of the degumming device provided by the embodiments of the present application;

[0018] Figure 4 is a schematic structural diagram of the silicon wafer placed in the tooling basket provided by the embodiments of the present application;

[0019] Figure 5 is a schematic structural diagram of the silicon wafer degumming treatment method applied to the degumming device provided by the embodiments of the present application;

[0020] Figure 6 is a schematic structural diagram of the susceptor assembly and the silicon wafer provided by the embodiments of the present application;

[0021] Figure 7 is Figure 5 an enlarged view of area A in;

[0022] Figure 8 is a schematic structural diagram of the image acquisition component in the degumming device provided by the embodiments of the present application;

[0023] Figure 9 is a schematic structural diagram of the conveying manipulator mechanism in the degumming device provided by the embodiments of the present application;

[0024] Figure 10 is another schematic structural diagram of the silicon wafer placed in the tooling basket provided by the embodiments of the present application;

[0025] Figure 11 is Figure 3 a partial enlarged schematic diagram in;

[0026] Figure 12 Schematic structural diagram of the rubber wiping manipulator mechanism in the degumming device provided by the embodiment of the present application;

[0027] Figure 13 Schematic structural diagram of the rubber wiping mechanism in the degumming device provided by the embodiment of the present application;

[0028] Figure 14 Schematic structural diagram of the rubber wiping manipulator mechanism in the degumming device provided by the embodiment of the present application for rubber wiping;

[0029] Figure 15 For Figure 3 Partial enlarged view;

[0030] Figure 16 Schematic structural diagram of the thick wafer located on the crystal carrier assembly provided by the embodiment of the present application;

[0031] Figure 17 Schematic structural diagram of the thick wafer removing manipulator mechanism in the degumming device provided by the embodiment of the present application;

[0032] Figure 18 Schematic structural diagram of the thick wafer gripper assembly in the degumming device provided by the embodiment of the present application;

[0033] Figure 19 Schematic structural diagram of the thick wafer gripper assembly in the degumming device provided by the embodiment of the present application for gripping the thick wafer;

[0034] Figure 20 Stereogram of the tooling basket provided by the embodiment of the present application;

[0035] Figure 21 Side view of the tooling basket provided by the embodiment of the present application;

[0036] Figure 22 Top view of the tooling basket provided by the embodiment of the present application;

[0037] Figure 23 For Figure 22 Enlarged view of area B in

[0038] Figure 24 Schematic structural diagram of the tooling basket entering the rubber wiping station provided by the embodiment of the present application;

[0039] Figure 25 Stereogram of the tooling basket provided by the embodiment of the present application;

[0040] Figure 26 Stereogram of the tooling basket with silicon wafers installed provided by the embodiment of the present application;

[0041] Figure 27Side view of the tooling basket provided by the embodiment of the present application;

[0042] Figure 28 Stereogram of the cooperation between the tooling basket and the trigger plate provided by the embodiment of the present application;

[0043] Figure 29 Top view of the cooperation between the tooling basket and the trigger plate provided by the embodiment of the present application;

[0044] Figure 30 is Figure 23 Enlarged view of area C in

[0045] Figure 31 is Figure 27 Cross-sectional view taken along the D-D direction in

[0046] Figure 32 is Figure 31 Enlarged view of area E in

[0047] Figure 33 Structural schematic diagram of the baffle;

[0048] Figure 34 Top view of another tooling basket applied to the rubber rubbing station provided by the embodiment of the present application.

[0049] Reference numerals:

[0050] 1 - Slicing machine;

[0051] 2 - Degumming device; 21 - Silicon wafer operation line; 211 - Degumming tank; 212 - Transfer tank; 22 - Crystal carrier recovery line; 23 - Thick wafer collection basket; 24 - Conveyor manipulator mechanism; 241 - Longitudinal guide rail; 242 - Transverse guide rail; 243 - Vertical guide rail; 2441 - Tooling top plate; 2442 - Tooling basket jaw; 2443 - Crystal carrier jaw; 25 - Thick wafer removing manipulator mechanism; 251 - Thick wafer removing manipulator base; 252 - Thick wafer removing robotic arm; 253 - Thick wafer gripper assembly; 2531 - Gripper support; 2532 - Clamping plate; 2533 - Gripper driver; 254 - Thick wafer acquisition camera; 255 - Thick wafer light source; 26 - Rubber rubbing manipulator mechanism; 261 - Rubber rubbing manipulator base; 262 - Rubber rubbing robotic arm; 263 - Rubber rubbing mechanism; 2631 - Roller support; 2632 - Rubber rubbing roller; 264 - Residual glue acquisition camera; 265 - Rubber rubbing light source; 271 - Slide rail; 272 - Degumming acquisition camera; 273 - Camera support; 274 - Degumming light source;

[0052] 31 - Crystal carrier assembly; 311 - Metal plate; 312 - Resin plate; 32 - Thick wafer; 33 - Silicon wafer;

[0053] 41 - Belt transportation mechanism;

[0054] 5-tool basket; 511-frame front plate; 5111-front plate through hole; 512-frame rear plate; 513-frame bottom plate; 52-side support assembly; 521-elastic rope; 522-magnetic ring; 523-buffer sleeve; 524-threaded fastener; 525-threaded sleeve; 53-bottom support assembly; 531-stainless steel rod; 532-rubber sleeve; 54-tool rack; 541-bottom frame plate; 542-front frame plate; 5421-frame plate through hole; 543-rear frame plate; 55-side baffle assembly; 551-grip baffle rod; 552-first support rod; 553-second support rod; 56-grip assembly; 561-baffle plate; 5611-middle part; 56111-ring; 5612-clamping part; 5613-trigger part; 562-torsion spring; 563-clamping gasket; 57-bottom receiving assembly;

[0055] 71-slicing workbench; 721-slicing conveying mechanism; 722-magnetic member; 723-slicing nozzle; 73-trigger plate;

[0056] 8- Plug and wash device. DETAILED DESCRIPTION

[0057] This embodiment provides a silicon wafer production method, which can realize automatic silicon wafer production, improve production efficiency, and reduce manual participation.

[0058] Figure 1 The flowchart of the silicon wafer production method provided in the embodiment of the present application. Figure 1 As shown, the silicon wafer production method provided in this embodiment includes:

[0059] Step 10: Use a slicer to cut the silicon rod bonded to the wafer tray assembly to obtain silicon wafers, and pre-clean the silicon wafers during the rod withdrawal process. After pre-cleaning, the silicon wafers and the wafer tray assembly are placed in a tooling basket.

[0060] Step 20: Use a transport trolley to transport the tooling basket containing the silicon wafers and the wafer tray assembly to the debonding device.

[0061] Step 30: Debonding the silicon wafer using a debonding device to separate it from the wafer support assembly.

[0062] Step 40: transport the silicon wafer to the inserting and cleaning device through a silicon wafer transfer mechanism disposed between the degumming device and the inserting and cleaning device.

[0063] Step 50: insert the silicon wafer using an insert and wash device.

[0064] The above steps are specifically described below in conjunction with a silicon wafer production system:

[0065] Figure 2 This is a schematic diagram of the structure of the silicon wafer production system provided in the embodiment of the present application. Figure 1 andFigure 2 As shown in the figure, the silicon wafer production system includes: a slicing machine 1, a degumming device 2, and an inserting and cleaning device 8.

[0066] The slicing machine 1 is used to cut a silicon rod into silicon wafers and place the silicon wafers and the crystal carrier assembly in a tooling basket. Before slicing by the slicing machine, glue is first applied to the side of the square rod and adhered to the crystal carrier assembly. The crystal carrier assembly is clamped by the silicon rod clamping jaws on the slicing machine 1 and moved to the cutting area for cutting. The cut silicon wafers are adhered to the lower part of the crystal carrier assembly and will not fall off immediately. Then, the silicon wafers together with the crystal carrier assembly are integrally loaded into the tooling basket, and after the subsequent degumming process, the silicon wafers fall off from the crystal carrier assembly.

[0067] A cutting main roller is provided in the slicing machine 1, and a cutting wire is wound around the cutting main roller. The silicon rod moves along the feeding direction, and the silicon rod is cut into several silicon wafers by the cutting wire. After cutting, during the process of retracting the rod, a cleaning device provided in the slicing machine sprays a cleaning liquid onto the silicon wafers to pre-clean the silicon wafers. Placing the pre-cleaning step in the slicing machine and using the process of retracting the rod for pre-cleaning do not require a pre-cleaning device to be provided in the degumming device. On the one hand, it can shorten the production time, and on the other hand, it can also simplify the structure of the degumming device 2.

[0068] After pre-cleaning, the crystal carrier clamping jaws in the slicing machine put the crystal carrier assembly and the silicon wafers into the tooling basket together.

[0069] A transport trolley is used to transport the tooling basket to the degumming device 2. The transport trolley can be a trolley running along a track or a trolley running on the ground, and the tooling basket is placed on the top of the trolley. The tooling basket 5 is automatically transferred from the slicing machine to the degumming device by the transport trolley, saving manual handling operations. A staying space for accommodating the transport trolley is provided in the degumming device 2, and the transport trolley directly enters the staying space.

[0070] The degumming device 2 is used to degum the silicon wafers to separate them from the crystal carrier assembly. The degumming device 2 can also perform a slicing process on the silicon wafers so that each silicon wafer can be separated from adjacent silicon wafers and taken out.

[0071] The inserting and cleaning device 8 is used to perform an inserting process on each silicon wafer. The inserting and cleaning device 8 is provided with an inserting and cleaning tooling basket, and each silicon wafer is inserted into the inserting and cleaning tooling basket.

[0072] The technical solution provided in this embodiment pre-cleans the silicon wafers during the process of retracting the rod after the slicing machine finishes cutting, which can shorten the production time of the silicon wafers and also simplify the structure of the degumming device. Automatically transporting the tooling basket from the slicing machine to the degumming device by the transport trolley can improve the production efficiency and reduce the workload of personnel. Automatically degumming and slicing the silicon wafers by the degumming device has a high degree of automation and high production efficiency.

[0073] Further, a silicon wafer transfer mechanism is also provided between the degumming device and the inserting and washing device for transferring the silicon wafers after dicing to the inserting and washing device. In this embodiment, the silicon wafer transfer mechanism is specifically a belt conveyor mechanism for transferring each silicon wafer to the inserting and washing device.

[0074] This embodiment provides a specific implementation manner of the degumming device 2. The degumming device provided in this embodiment is used for degumming silicon wafers.

[0075] Figure 3 It is a schematic structural diagram of the degumming device provided in the embodiment of the present application. Figure 4 It is a schematic structural diagram of the silicon wafer placed in the tooling basket provided in the embodiment of the present application. As Figure 3 and Figure 4 shown, the degumming device provided in this embodiment includes: a silicon wafer operation line 21.

[0076] Among them, the silicon wafer operation line 21 is successively provided with a degumming station and a glue wiping station. The degumming station is used for degumming the silicon wafers 33 and the crystal carrier assembly 31 contained in the tooling basket 5 so that the silicon wafers 33 are separated from the crystal carrier assembly 31. The wiping station is used for further wiping the residual glue on the silicon wafers 33.

[0077] In addition, the degumming device is also provided with a conveying manipulator mechanism 24 for grasping the tooling basket 5 and driving the tooling basket 5 to move. Specifically, the silicon wafers 33 and the crystal carrier assembly 31 after being cut by the slicing machine are placed in the tooling basket 5, and the transport cart transports the tooling basket 5 into the degumming device. The conveying manipulator mechanism 24 grasps the tooling basket 5 and transports the tooling basket 5 to the degumming station for degumming, and then transports the tooling basket 5 to the glue wiping station for glue wiping after degumming is completed.

[0078] Specifically, the degumming station is provided with a degumming tank 211, and the glue wiping station is provided with a transfer tank. The degumming of the silicon wafers by the degumming device to separate the silicon wafers from the crystal carrier assembly specifically includes: first, the conveying manipulator mechanism 24 in the degumming device 2 transports the tooling basket 5 containing the silicon wafers and the crystal carrier assembly into the degumming tank 211 for degumming; after degumming is completed, the conveying manipulator mechanism 24 raises the tooling basket 5 from the degumming tank 211; the image acquisition component above the degumming tank 211 acquires the side images of the silicon wafers and the crystal carrier assembly; the processor confirms whether the silicon wafers are completely separated from the crystal carrier assembly according to the side images; when it is confirmed that all the silicon wafers are separated from the crystal carrier assembly, the conveying manipulator mechanism 24 transports the tooling basket 5 containing the silicon wafers 33 and the crystal carrier assembly 31 to the transfer tank.

[0079] Preferably, a waiting area is provided inside the degumming device. After the transport trolley enters the degumming device, the conveying manipulator mechanism 24 transports the tooling basket 5 containing the silicon wafer and the crystal holder assembly to the waiting area for waiting, and then the transport trolley returns to the slicing machine for reuse. After the degumming station is idle, the conveying manipulator mechanism 24 transports the tooling basket 5 containing the silicon wafer and the crystal holder assembly located in the waiting area to the degumming station to degum the silicon wafer.

[0080] Furthermore, the degumming device is also provided with a crystal holder recovery line 22, which is arranged side by side with the silicon wafer operation line 21. A thick wafer removal station is provided beside the crystal holder recovery line 22 for removing the thick wafers adhered to the crystal holder assembly. The above-mentioned conveying manipulator mechanism 24 is also used to grab the crystal holder assembly with thick wafers adhered thereto and drive the crystal holder assembly to move to the thick wafer removal station to remove the thick wafers after the tooling basket moves to the glue wiping station. Then, the conveying manipulator mechanism 24 places the crystal holder assembly on the crystal holder recovery line 22 so that the crystal holder assembly returns to the slicing machine for recovery and reuse.

[0081] Furthermore, a tooling basket recovery line is also provided inside the degumming device, which is arranged side by side with the silicon wafer operation line 21 and the crystal holder recovery line 22. The conveying manipulator mechanism 24 is also used to transport the empty tooling basket to the tooling basket recovery line for recovery after the silicon wafer is sliced and taken away.

[0082] In the above solution, the conveying manipulator mechanism drives the tooling basket containing the silicon wafer to move to the degumming station for degumming, then to the glue wiping station for automatic glue wiping, and can also drive the crystal holder assembly to move to the thick wafer removal station to automatically remove the thick wafers. Then, the crystal holder assembly after removing the thick wafers is transported to the crystal holder recovery line to recover the crystal holder, and the empty tooling basket is transported to the tooling basket recovery line to recover the tooling basket. All the above steps can be carried out automatically, enabling the degumming device to have more functions and automatically completing various processes, which improves the production efficiency of the silicon wafer. Compared with the traditional manual glue wiping and manual breaking off of thick wafers, the technical solution provided in this embodiment can also avoid the probability of damaging the silicon wafer during the glue wiping process, thereby improving the yield.

[0083] A specific implementation method: As Figure 2 shown, the silicon wafer operation line 21, the tooling basket recovery line, and the crystal holder recovery line 22 are arranged side by side. The transport trolley loads the tooling basket 5 and enters the degumming device 2 from the left. The conveying manipulator mechanism 24 grabs the tooling basket and moves it to the right, first entering the waiting area, and then successively entering the degumming station and the glue wiping station. Both the crystal holder recovery line 22 and the tooling basket recovery line are transported from right to left to transport the crystal holder assembly and the tooling basket to the left.

[0084] The degumming station is used to degum the silicon wafer. This embodiment provides a specific solution:

[0085] Figure 5The structural schematic diagram of the wafer degumming treatment method provided by the embodiment of the present application is applied to a degumming device. Figure 6 The structural schematic diagram of the susceptor assembly and the wafer provided by the embodiment of the present application. As Figure 5 and Figure 6 shown, a degumming tank 211 is provided at the degumming station, and an image acquisition component is provided above the degumming tank 211. The conveying manipulator mechanism 24 hoists the tooling basket 5 and moves downward into the degumming tank 211 for degumming. After the degumming is initially completed, the conveying manipulator mechanism 24 hoists the tooling basket 5 and raises it to the height where the image acquisition component is located, and the side images of the wafer and the susceptor assembly are acquired through the image acquisition component. The image acquisition component performs data interaction with the processor.

[0086] First, the processor acquires the side images of the wafer and the susceptor assembly, and then determines the distance between the top of the wafer and the bottom surface of the susceptor assembly according to the side images, and judges whether the distance meets the degumming end condition. If so, the degumming ends. During the degumming process, the wafer is separated from the susceptor assembly and falls into the tooling basket, and the distance between the wafer and the susceptor assembly increases. Therefore, it is possible to determine whether the wafer is completely degummed according to the distance between the wafer and the susceptor assembly, realizing automatic identification, with high efficiency and high accuracy, which is beneficial to improving the yield.

[0087] A specific implementation manner: acquiring the side images of the wafer and the susceptor assembly can specifically be: first, controlling the image acquisition component to move uniformly along the length direction of the susceptor assembly, and acquiring multiple side images of the wafer and the susceptor assembly during the movement, and then performing stitching processing on the multiple acquired side images to obtain a set of side images of the whole wafer.

[0088] Specifically, Figure 7 is Figure 5 the enlarged view of area A in Figure 8 The structural schematic diagram of the image acquisition component in the degumming device provided by the embodiment of the present application. As Figure 7 and Figure 8 shown, a slide rail 271 extending in the horizontal direction and a driving mechanism are provided on the frame of the degumming device. The image acquisition component is specifically a degumming acquisition camera 272, which is arranged on the slide rail 271 through a camera support 273.

[0089] Further, control the image acquisition component to move uniformly along the length direction of the crystal carrier component, which specifically includes: controlling the driving mechanism to work, driving the image acquisition component to move uniformly along the slide rail 271. The slide rail 271 is in the same length direction as the crystal carrier component, that is, it extends along the horizontal direction. The driving mechanism drives the camera support 273 to slide horizontally relative to the slide rail 271 and drives the debonding acquisition camera 272 to move synchronously. The length of the slide rail 271 is adapted to the length of the crystal carrier component, so that the moving stroke of the debonding acquisition camera 272 can capture the images of the entire crystal carrier component and the silicon wafer.

[0090] Further, a light source is provided at the top of the camera support 273, and the light source moves together with the camera support 273. This light source is called the debonding light source 274, which emits light in the direction of the silicon wafer, and is used to increase the brightness within the shooting field of view of the camera and improve the image clarity. The brightness of the debonding light source 274 can be constant or adjustable. In this embodiment, during the movement of the camera, the light source brightness is adjusted in real time according to the collected side image, so as to adapt to different ambient brightnesses within the debonding device, obtain an image with uniform brightness, and make a clear light and dark contrast between the top of the silicon wafer and the bottom edge of the crystal carrier component, which is convenient for subsequent image analysis and feature extraction to obtain the edge contour.

[0091] Alternatively, the debonding light source 274 is an induction type light source, and an inductor is provided thereon to automatically adjust the output light brightness by sensing the brightness of the reflected light.

[0092] A specific implementation method: adjusting the light source brightness according to the collected side image includes: determining the gray values of each pixel in the collected side image; when the average gray value of each pixel is less than the lower gray limit value, controlling the light source to increase the brightness; when the average gray value of each pixel is greater than the upper gray limit value, controlling the light source to decrease the brightness.

[0093] Since the gray value in the image can represent the brightness of the image, the gray value ranges from 0 to 255. The smaller the gray value, the darker the image; the larger the gray value, the brighter the image. Extract the gray value of each pixel in the image and calculate the average value of all pixel gray values. If the average value is less than the lower gray limit value, it indicates that the image is darker and the light source needs to be controlled to increase the brightness; if the average value is greater than the upper gray limit value, it indicates that the image is brighter and the light source needs to be controlled to decrease the brightness.

[0094] Further, in the above steps, to determine the distance between the top of the silicon wafer and the bottom surface of the crystal carrier component according to the side image, the following method can be specifically used to achieve it:

[0095] First, the image processing and analysis technology is used to identify the wafer contour in the side image. The wafer contour at least includes the top and the side contour. Then, the top edge contours of each wafer are fitted into a curve. After the wafers are degummed, they fall downward. Some wafers that are not completely degummed still stick to the susceptor assembly and are at a higher position. Therefore, the wafers are uneven in height.

[0096] Next, the bottom edge contour of the susceptor assembly is identified. The susceptor assembly includes a susceptor, a metal plate 311, and a resin plate 312 arranged in sequence from top to bottom. The wafers are stuck to the resin plate 312 before degumming. The bottom edge contour of the lowermost resin plate 412 in the susceptor assembly is fitted into a straight line.

[0097] Finally, the vertical distances between the above-mentioned fitted straight line and the fitted curve at various places are obtained to obtain the shortest distance D, which is used as the distance between the top of the wafer and the bottom surface of the susceptor assembly.

[0098] When the shortest distance is within the preset range, the degumming condition is satisfied, the degumming ends, and the subsequent processes can be entered; when it is not within the preset range, the degumming condition is not satisfied, and re-degumming is required. The preset range can be set according to different degumming processes or the sizes of the wafers. For example: the preset range is 5 mm - 20 mm. When the shortest distance is between 5 mm and 20 mm, it indicates that the degumming condition is satisfied.

[0099] Assume that the degumming acquisition camera 272 and the degumming light source 274 are at a fixed height. After the preliminary degumming is completed, the conveying manipulator mechanism 24 is controlled to work to drive the tooling basket 5 containing the wafers 33 to rise to the preset position, where it is ensured that the degumming acquisition camera 272 can completely acquire the image of the glue-bonding part between the wafers 33 and the susceptor assembly during the movement.

[0100] After the separation of the wafers and the susceptor assembly is confirmed by the above solution, the tooling basket 5 is driven by the conveying manipulator mechanism 24 to move to the transfer slot at the glue-wiping station.

[0101] On the basis of the above technical solution, this embodiment also provides an implementation manner of the conveying manipulator mechanism 24:

[0102] Figure 9 It is a schematic structural diagram of the conveying manipulator mechanism in the degumming device provided by the embodiment of the present application. As Figure 9 shown, the conveying manipulator mechanism 24 includes: a longitudinal guide rail 241, a transverse guide rail 242, a vertical guide rail 243, a jaw assembly, a vertical driver, a transverse driver, and a longitudinal driver.

[0103] Among them, the longitudinal guide rails 241 extend along the direction of the crystal carrier recovery line. The number of the longitudinal guide rails 241 is two, and they are arranged side by side. The transverse guide rail 242 is perpendicular to the direction of the crystal carrier recovery line and is arranged between the two longitudinal guide rails 241. The longitudinal driver is used to drive the transverse guide rail 242 and the jaw assembly as a whole to move along the longitudinal guide rail 241.

[0104] The vertical guide rail 243 extends along the vertical direction. The vertical driver drives the jaw assembly to move up and down along the vertical guide rail 243. The transverse driver is used to drive the jaw assembly and the vertical guide rail 243 as a whole to move along the transverse guide rail. So that the jaw assembly can move in three directions: longitudinal, transverse and vertical.

[0105] The jaw assembly is used to grip the tooling basket. Specifically, the jaw assembly includes: a tooling top plate 2441 and a tooling basket jaw 2442. Among them, the tooling top plate 2441 is connected to the vertical driver. The tooling basket jaw 2442 is arranged on the bottom surface of the tooling top plate. The tooling basket jaw 2442 extends along the vertical direction, and its bottom end is bent reversely to form a hook-like structure, which is hooked on the tooling basket and can lift the tooling basket.

[0106] During operation, the jaw assembly is adjusted to above the tooling basket by the transverse driver and the longitudinal driver, and then the vertical driver drives the jaw assembly to descend until the hook-like structure of the tooling basket jaw 2442 is located on the side of the tooling basket. Then the transverse driver drives the jaw assembly to move transversely so that the hook-like structure of the tooling basket jaw 2442 is inserted under the hanging rod in the tooling basket. Then the vertical driver drives the jaw assembly to rise to realize lifting and moving the tooling basket.

[0107] Further, the jaw assembly further includes: a crystal carrier jaw 2443 for clamping the crystal carrier assembly and a driving mechanism for driving the crystal carrier jaw 2443 to move transversely, both of which are arranged on the bottom surface of the tooling top plate 2441. The crystal carrier jaw 2443 can move transversely or extend transversely to meet the dimensional requirements of the crystal carrier assembly. The structure of the crystal carrier jaw 2443 can be set according to the hanging structure of the crystal carrier assembly. For example, if the top of the crystal carrier assembly is provided with a T-shaped groove, the crystal carrier jaw 2443 is a T-shaped structure and is inserted into the T-shaped groove at the top of the crystal carrier assembly to lift the crystal carrier assembly.

[0108] The above-mentioned conveying manipulator mechanism 24 lifts away the crystal carrier assembly, and the remaining silicon wafers and tooling baskets are as Figure 10 shown. Figure 10 This is another schematic structural diagram of the silicon wafers placed in the tooling basket provided by the embodiment of the present application.

[0109] Figure 11 It is Figure 3 a partial enlarged schematic diagram. As Figure 3 and Figure 11As shown in the figure, a transfer groove 212 is provided at the rubber rubbing station, and an image acquisition component and a rubber rubbing manipulator mechanism 26 are provided beside the transfer groove 323. The image acquisition component is used to identify the residual glue on the silicon wafer, and the rubber rubbing manipulator mechanism 26 is used to erase the residual glue on the silicon wafer. Compared with the traditional manual erasing method, the solution provided in this embodiment has higher efficiency and does not require many operators. On the one hand, it reduces the labor input and alleviates the work burden of the personnel; on the other hand, it also improves the production rate.

[0110] This embodiment provides an implementation manner of a rubber rubbing manipulator mechanism: Figure 12 It is a schematic structural diagram of the rubber rubbing manipulator mechanism in the degumming device provided in the embodiment of the present application. As Figure 12 shown, the rubber rubbing manipulator mechanism 26 includes: a rubber rubbing manipulator base 261, a rubber rubbing manipulator arm 262, and a rubber rubbing mechanism 263. Among them, the rubber rubbing manipulator base 261 is fixed on the workbench. The rubber rubbing manipulator arm 262 is rotatably arranged on the rubber rubbing manipulator base 261 and can rotate relative to the rubber rubbing manipulator base 261. The rubber rubbing manipulator arm 262 has at least 2 degrees of freedom. For example, it can have 2, 3, 4, 5, 6 or more than 6 degrees of freedom, so that the working end of the rubber rubbing manipulator arm 262 can move precisely. The rubber rubbing mechanism 263 is arranged at the working end of the rubber rubbing manipulator arm 262 and is used to erase the residual glue on the silicon wafer.

[0111] A specific implementation manner: Figure 13 It is a schematic structural diagram of the rubber rubbing mechanism in the degumming device provided in the embodiment of the present application. As Figure 13 shown, the rubber rubbing mechanism 263 includes: a roller support 2631 and a rubber rubbing roller 2632. Among them, the roller support 2631 is arranged at the working end of the rubber rubbing manipulator arm 262. The rubber rubbing roller 2632 is arranged on the roller support 2631, and the rubber rubbing roller 2632 can rotate freely. The surface of the rubber rubbing roller 2632 is provided with a degumming layer capable of adhering to the glue. The rubber rubbing roller 2632 rolls on the side of the silicon wafer 33, and can take away the residual glue on the silicon wafer 33 to achieve the effect of degumming. The degumming layer is made of a soft and sticky material.

[0112] Furthermore, the image acquisition component can be arranged on the roller support 2631. Specifically, the image acquisition component can be a residual glue acquisition camera 264, which is arranged on the roller support 2631, and the residual glue acquisition camera 264 acquires images in the direction facing the silicon wafer. The rubber rubbing manipulator arm 262 can act according to the acquired images to drive the rubber rubbing roller 2632 to contact the silicon wafer and roll on the silicon wafer.

[0113] Furthermore, a light source (i.e., Figure 13The rubber rubbing light source 265) is arranged on the roller bracket 2631. The light emission direction of the rubber rubbing light source 265 faces the silicon wafer to be rubber rubbed, so as to improve the brightness of this area and facilitate the acquisition of clear images. The rubber rubbing light source 265 can be a monochromatic light source, and its brightness can be set according to the brightness of the working environment of the degumming device.

[0114] A specific solution: As Figure 10 shown, a plurality of silicon wafers 33 are accommodated in the tooling basket 5, and the side of the silicon wafer 33 with residual glue faces upward. The residual glue acquisition camera 264 is arranged on the lower surface of the roller bracket 2631 to acquire the residual glue image below. The light emission direction of the rubber rubbing light source 265 faces downward to improve the brightness of the lower area.

[0115] Based on the above implementation manner of the rubber rubbing station, this embodiment further provides a rubber rubbing method: First, the silicon wafer image of the adhesive surface of the silicon wafer is acquired through the image acquisition component. The image acquisition component interacts with the processor, and the processor obtains the silicon wafer image of the adhesive surface of the silicon wafer, and then determines whether there is residual glue on the adhesive surface of the silicon wafer according to the silicon wafer image. When there is residual glue, the rubber rubbing manipulator mechanism is controlled to rub the residual glue on the adhesive surface of the silicon wafer.

[0116] Further, in the above steps, controlling the rubber rubbing manipulator mechanism to rub the residual glue on the adhesive surface of the silicon wafer can specifically be implemented in the following manner:

[0117] First, obtain the current position of the rubber rubbing manipulator mechanism and the position of the silicon wafer, and then control the rubber rubbing manipulator mechanism to move to the adhesive surface of the silicon wafer according to the current position of the rubber rubbing manipulator mechanism and the position of the silicon wafer; control the rubber rubbing manipulator mechanism to rub on the adhesive surface of the silicon wafer according to the preset rubber rubbing trajectory.

[0118] Figure 14 It is a schematic structural diagram of the rubber rubbing of the rubber rubbing manipulator mechanism in the degumming device provided by the embodiment of the present application. As Figure 14 shown, specifically, controlling the rubber rubbing manipulator mechanism to rub on the adhesive surface of the silicon wafer according to the preset rubber rubbing trajectory includes: starting from the end of a group of silicon wafers, controlling the rubber rubbing manipulator mechanism to reciprocate and rub on the adhesive surface of the silicon wafer along the width direction of a group of silicon wafers until reaching the other end of a group of silicon wafers. A group of silicon wafers is a set of all silicon wafers obtained by slicing a silicon rod.

[0119] After rubbing a group of silicon wafers, it further includes: controlling the rubber rubbing manipulator mechanism to move to the preset starting position, re-acquiring the image of the adhesive surface of the silicon wafer; determining again whether there is residual glue on the adhesive surface of the silicon wafer according to the re-acquired image; when there is residual glue, controlling the rubber rubbing manipulator mechanism to rub the residual glue on the adhesive surface of the silicon wafer again until the residual glue is completely removed.

[0120] This embodiment also provides another way of glue wiping: controlling the glue wiping manipulator mechanism to wipe on the glue surface of the silicon wafer according to a preset glue wiping track, or the following way can also be adopted: obtaining the length of a group of silicon wafers and dividing the length into at least two segments; respectively wiping at least two segments of silicon wafers repeatedly for at least two times, omitting the step of re-obtaining the image in the above solution, and improving the glue wiping quality.

[0121] For example: dividing the length into three segments; respectively wiping the three segments of silicon wafers repeatedly for two times.

[0122] In addition, after respectively wiping at least two segments of silicon wafers, the glue surface images of each segment of silicon wafers can be respectively collected; determining whether there is residual glue on each segment of silicon wafers according to the glue surface images of each segment of silicon wafers, and if so, re-wiping the segment of silicon wafers.

[0123] A specific implementation method: setting a preset starting position for taking pictures. When glue wiping is required, first control the glue wiping manipulator mechanism to move to this starting position to take pictures and collect the glue surface image of the silicon wafer. Divide the glue surface of a group of silicon wafers into three segments, move from the starting position to the first segment and reciprocate to wipe twice along the width direction of a group of silicon wafers, then move to the next segment and reciprocate to wipe twice, and finally move to the third segment and reciprocate to wipe twice. Then take pictures of the three segments of silicon wafers respectively, analyze whether there is residual glue in the image of each segment of silicon wafers, and if so, control the glue wiping manipulator mechanism to move to the corresponding position to wipe the glue again.

[0124] Further, a light source is arranged in the glue removing device, and the light source emits light towards the glue surface of the silicon wafer to improve the field of view brightness of the image acquisition component. During the process of the image acquisition component collecting images, adjust the brightness of the light source according to the collected silicon wafer images. The light source can be arranged on the glue wiping manipulator mechanism or on the frame of the glue removing device.

[0125] In the above solution, through the cooperation of the glue wiping manipulator mechanism and the image acquisition component, automatic glue wiping on the glue surface of the silicon wafer is realized. Compared with the traditional manual glue wiping method, the solution provided by this embodiment can reduce manual participation, not only improve production efficiency, but also reduce the problem that the silicon wafer is easily damaged due to manual glue wiping, and improve the yield.

[0126] The glue removal device 2 is also provided with a susceptor recovery line 22, which is arranged side by side with the silicon wafer operation line 21. A thick wafer removal station is provided beside the susceptor recovery line 22 for removing the thick wafers adhered to the susceptor assembly. After the transfer manipulator mechanism 24 transports the tooling basket 5 containing the silicon wafers and the susceptor assembly to the transfer tank 212, the transfer manipulator mechanism 24 lifts the susceptor assembly in the transfer tank 212 and transports it to the thick wafer removal station. At the thick wafer removal station, the thick wafers are broken off from the susceptor assembly. The thick wafer removal station is provided with an image acquisition component for identifying the thick wafers and a thick wafer removal manipulator mechanism for clamping the thick wafers and separating them from the susceptor assembly. Then, the transfer manipulator mechanism 24 places the susceptor assembly into the susceptor recovery line 22 to transport the susceptor assembly back to the slicing machine for reuse.

[0127] Figure 15 is Figure 3 a partial enlarged view of, Figure 16 is a schematic structural view of the thick wafer on the susceptor assembly provided by the embodiment of the present application. As Figure 3 and Figure 15 、 Figure 16 shown, specifically, when the transfer manipulator mechanism 24 drives the susceptor assembly to move near the thick wafer removal manipulator mechanism 25, the image acquisition component acquires the front image and identifies the thick wafers. When the processor identifies the thick wafers based on the image and determines their positions, it controls the thick wafer removal manipulator mechanism 25 to move into position to clamp the thick wafers, and drives the thick wafers to move horizontally, move downward, and / or rotate to remove the thick wafers from the susceptor assembly, and then places the thick wafers in the thick wafer collection area.

[0128] The above-mentioned thick wafer removal manipulator mechanism 25 can be fixed on the ground or on a workbench higher than the ground. In this embodiment, a workbench is provided in the glue removal device, and the thick wafer removal manipulator mechanism 25 is fixed on the workbench. A thick wafer collection basket 23 is provided in the thick wafer collection area, and the thick wafer removal manipulator mechanism 25 places the broken thick wafers into the thick wafer collection basket 23.

[0129] Further, this embodiment provides an implementation manner of the thick wafer removal manipulator mechanism:

[0130] Figure 17 is a schematic structural view of the thick wafer removal manipulator mechanism in the glue removal device provided by the embodiment of the present application. As Figure 17As shown, the thick sheet removing manipulator mechanism includes: a thick sheet removing manipulator base 251, a thick sheet removing robotic arm 252, and a thick sheet gripper assembly 253. Among them, the thick sheet removing manipulator base 251 is disposed on the workbench. The thick sheet removing robotic arm 252 is rotatably disposed on the thick sheet removing manipulator base 251 and can rotate relative to the thick sheet removing manipulator base 251. The thick sheet removing robotic arm 252 has at least 2 degrees of freedom. For example, it can have 2, 3, 4, 5, 6, or more than 6 degrees of freedom, so that the working end of the thick sheet removing robotic arm 252 can move precisely. The thick sheet gripper assembly 253 is disposed at the working end of the thick sheet removing robotic arm 252 for gripping the thick sheet.

[0131] This embodiment provides an implementation method: The thick sheet gripper assembly 253 includes: a gripper bracket, a gripper, and a gripper driver. Among them, the gripper bracket is rotatably disposed at the working end of the thick sheet removing robotic arm 252, and an accommodation cavity is provided inside the gripper bracket. The gripper is disposed inside the accommodation cavity. The gripper driver is disposed on the gripper bracket for driving the gripper to perform a gripping action.

[0132] The structure of the gripper can be various. For example, the following method can be adopted:

[0133] Figure 18 It is a schematic structural diagram of the thick sheet gripper assembly in the degumming device provided by the embodiment of the present application. Figure 19 It is a schematic structural diagram of the thick sheet gripper assembly in the degumming device provided by the embodiment of the present application for gripping a thick sheet. As Figure 18 and Figure 19 shown, in this embodiment, the gripper bracket 2531 has a cuboid structure, an accommodation cavity is provided inside it, and an opening communicating with the accommodation cavity is provided at one end.

[0134] The gripper includes: two parallel and oppositely disposed clamping plates 2532, which are disposed inside the accommodation cavity. The gripper driver 2533 is respectively connected to the two clamping plates 2532 for driving the two clamping plates 2532 to approach each other to generate a clamping action and move away from each other.

[0135] During application, the thick sheet removing robotic arm 252 drives the thick sheet gripper assembly to move below the thick sheet 32, adjusts the distance between the two clamping plates 2532 to be greater than the thickness of the thick sheet 32. The thick sheet removing robotic arm 252 drives the thick sheet gripper assembly to slowly move upward until the two clamping plates 2532 are located on both sides of the thick sheet 32, and then drives the two clamping plates 2532 to approach each other to contact the thick sheet 32 and apply a clamping force to the thick sheet 32. After that, the thick sheet removing robotic arm 252 drives the thick sheet gripper assembly to move downward or horizontally, and can also rotate horizontally to separate the thick sheet 32 from the crystal carrier assembly 31.

[0136] The gripper driver 2533 can specifically be a cylinder, or a hydraulic cylinder or a driving motor.

[0137] Further, the thick wafer gripper assembly 253 further includes: a gripper telescopic driver, which is arranged in the accommodation cavity and is connected to the gripper, and is used to drive the gripper to extend out of the accommodation cavity to perform a clamping action. Still taking the clamping plate 2532 as an example, specifically, in the non-working state, the gripper telescopic driver drives the clamping plate 2532 to retract into the accommodation cavity, and the gripper bracket 2531 can protect the clamping plate 2532 to avoid being damaged. In the working state, the clamping plate 2532 is driven to move outwards by the gripper telescopic driver and extends out from the opening of the gripper bracket 2531 to perform the operation of clamping the thick wafer.

[0138] The above image acquisition component can specifically be the thick wafer acquisition camera 254, which is arranged on the outer surface of the gripper bracket 2531, and the thick wafer acquisition camera 254 acquires images in the direction towards the crystal carrier assembly. In addition to the thick wafer robotic arm 252 can perform actions according to the acquired images.

[0139] Further, a light source (i.e., Figure 18 the thick wafer light source 255 in) can also be adopted, which is arranged on the gripper bracket 2531. The light emission direction of the thick wafer light source 255 is towards the crystal carrier assembly to improve the brightness of this area and facilitate the acquisition of clear images. The thick wafer light source 255 can be a monochromatic light source, and its brightness can be set according to the brightness of the working environment of the debonding device.

[0140] After the thick wafer is broken off, the image acquisition component can recognize this state, and then the controller controls the conveying robotic arm mechanism 24 to put the crystal carrier assembly into the crystal carrier recovery line 22, and conveys the crystal carrier assembly back to the slicing station for reuse.

[0141] Further, this embodiment of the present application also provides an implementation manner of the above tooling basket 5. The tooling basket 5 is used to hold the silicon wafers generated by cutting with a slicing machine and transport the silicon wafers to the debonding device for debonding, rubbing, and slicing. By using one tooling basket to transport the silicon wafers between different stations, it is no longer necessary to transfer the silicon wafers from one tooling basket to another.

[0142] Figure 20 is a perspective view of the tooling basket provided by the embodiment of the present application, Figure 21 is a side view of the tooling basket provided by the embodiment of the present application, Figure 22 is a top view of the tooling basket provided by the embodiment of the present application. As Figures 20 to 22 shown, the tooling basket provided by this embodiment includes: a tooling basket frame and a side support assembly 52.

[0143] Among them, the tooling basket frame can be a cuboid-shaped structure, and the length direction of the tooling basket frame is Figure 21 the Y direction in; the width direction of the tooling basket frame is Figure 22 the X direction in; the height direction of the tooling basket frame is consistent with the vertical direction, as Figure 21in the Z direction.

[0144] An accommodation space for accommodating silicon wafers is formed therein, and an opening for the silicon wafers to enter and exit the accommodation space is provided at the top of the tooling basket frame. A group of silicon wafers coming down from the slicing machine fall from the opening into the accommodation space. The silicon wafers are vertically inserted into the accommodation space, perpendicular to the length direction of the tooling basket frame, and multiple silicon wafers are arranged side by side and arranged in sequence along the length direction.

[0145] The side support assemblies 52 are arranged in the accommodation space and are respectively connected to both sides of the tooling basket frame for clamping the silicon wafers from both sides to prevent the silicon wafers from tipping over. The side support assemblies 52 extend along the length direction of the tooling basket frame, and the length of the side support assemblies 52 can be set according to the length of a group of silicon wafers or the length of the silicon rod before slicing. The length of the side support assemblies 52 is slightly greater than the length of a group of silicon wafers and can clamp all the silicon wafers.

[0146] The side support assemblies 52 are provided with magnetic attracting members. When a magnetic member is provided on the side surface of the tooling basket, a magnetic attraction force is generated between the magnetic member and the magnetic attracting members, causing the side support assemblies 52 near the magnetic attracting members to deform outward, so that the clamping force on the silicon wafers disappears, and the silicon wafers without the clamping force are in a free state. The slicing medium is sprayed toward the side of the silicon wafers through the slicing nozzle on the side of the tooling basket to increase the distance between the silicon wafer and the adjacent silicon wafers, achieving the effect of slicing. Subsequently, the separated silicon wafers are taken out for subsequent production processes.

[0147] The tooling basket provided in this embodiment is used to hold the silicon wafers produced by the slicing machine and then send them to the degumming device for degumming and slicing. This tooling basket can adapt to the degumming station, the rubber wiping station, and the slicing station. There is no need to transfer the silicon wafers to another tooling basket between each station, and the same tooling basket can meet the operation requirements of each station, realizing the automation of the technological process of the degumming and inserting and washing links. On the one hand, it saves time and improves production efficiency; on the other hand, it also reduces the situation of the silicon wafers being knocked and damaged during the transfer process, improves the yield rate, and reduces the production cost.

[0148] The above-mentioned tooling basket frame can be a box-shaped structure or a hollow skeleton structure. This embodiment provides a specific implementation manner: as Figures 20 to 22 shown, the tooling basket frame includes: a frame front plate 511, a frame rear plate 512, and a frame bottom plate 513. Among them, the frame bottom plate 513 is a rectangular plate, the frame front plate 511 and the frame rear plate 512 are parallel and relatively arranged, and the frame front plate 511 and the frame rear plate 512 are respectively vertically connected to both ends of the length direction of the frame bottom plate 513.

[0149] The side support assembly 52 is connected between the front frame plate 511 and the rear frame plate 512. The height of the side support assembly 52 is set according to the height of the silicon wafer, and the side support assembly 52 is located at the central height of the silicon wafer or higher than the central height. The number of the side support assemblies 52 is two, which are respectively connected to the X-direction edge positions of the front frame plate 511 and the rear frame plate 512.

[0150] Figure 23 For Figure 22 an enlarged view of area B in. As Figure 22 and Figure 23 shown, in one implementation: the side support assembly 52 includes: an elastic rope 521, a magnetic ring 522, and a buffer sleeve 523. Among them, the elastic rope 521 extends along the length direction of the tooling basket frame and is connected between the front frame plate 511 and the rear frame plate 512. The elastic rope 521 has a certain stretching and deformation ability.

[0151] The magnetic ring 522, as a magnetic attraction member, is sleeved on the elastic rope. The number of the magnetic rings 522 is multiple, and the multiple magnetic rings are arranged at intervals. The buffer sleeve 523 is sleeved on the outside of the multiple magnetic rings 522 and is in pressing fit with the magnetic ring 522 without relative sliding. The buffer sleeve 523 and the magnetic ring 522 can rotate relative to the elastic rope together. The magnetic ring 522 can be a circular ring, and its diameter can be about 10 mm. Specifically, the magnetic ring 522 can be made of a material that can generate a magnetic attraction effect with a magnetic member, such as: an electromagnet, a permanent magnet, or iron. In this embodiment, the magnetic ring 522 is an iron ring.

[0152] The buffer sleeve 523 can be made of a material with a certain buffering ability, such as: rubber, silica gel, sponge, etc. In this embodiment, taking the sponge as an example, the buffer sleeve 523 is specifically a sponge sleeve, which will not damage the silicon wafer while clamping the silicon wafer.

[0153] The elastic rope 521 can be connected to the front frame plate 511 and the rear frame plate 512 respectively in the same way. For its connection method, for example, the following scheme can be adopted:

[0154] Taking the front frame plate 511 as an example, a front plate through hole 5111 is provided on the front frame plate 511. One end of the threaded sleeve 525 is connected to the elastic rope 521, and the other end passes through the front plate through hole 5111. A threaded hole for cooperating with the threaded fastener 524 is provided in the threaded sleeve 525. The threaded fastener 524 is inserted into the threaded hole and is tightly connected to the threaded sleeve 525 to fix the threaded sleeve 525 on the front frame plate 511.

[0155] One way is as follows: The center line of the above-mentioned threaded hole is perpendicular to the center line of the threaded sleeve 525. On the side of the front plate 51 of the frame, there is a front plate connection hole whose center line is perpendicular to the through hole of the front plate. The threaded fastener 524 passes through the front plate connection hole and then is screwed into the threaded hole of the threaded sleeve 525 for fixation. The threaded fastener 524 also plays a role in limiting the position, preventing the threaded sleeve 525 from slipping out of the through hole of the front plate. By adjusting the threaded fastener 524, the position of the side support assembly can also be adjusted to adapt to wafers of different specifications.

[0156] Another way is as follows: The center line of the threaded hole is parallel to the center line of the threaded sleeve 525. It is set that the opening at the end of the front plate through hole 5111 far from the elastic rope is smaller than the head of the threaded fastener 524, so that the tail of the threaded fastener 524 enters from the front plate through hole 5111 and is screwed and fixed with the threaded hole of the threaded sleeve 525. The head of the threaded fastener 524 is located on the side of the front plate 511 of the frame far from the elastic rope 521, which can prevent the threaded sleeve 525 from slipping out of the through hole of the front plate.

[0157] Furthermore, the front plate through hole 5111 is an oblong hole extending along the width direction of the tooling basket frame. By adjusting the position of the threaded sleeve 525 in the oblong hole, the width between the two side support assemblies 52 can be adjusted, and thus wafers of different width sizes can be adapted.

[0158] Based on the above technical solution, the tooling basket further includes a bottom support assembly 53, which is arranged at the bottom of the accommodating space. After the wafers enter the accommodating space, they are placed on the bottom support assembly 53, and the bottom support assembly 53 plays a role in supporting the wafers from the bottom. Specifically, the bottom support assembly 53 is connected between the front plate 511 and the rear plate 512 of the frame. The number of the bottom support assemblies 53 is two, which are arranged at intervals.

[0159] The bottom support assembly 53 includes: a stainless steel rod 531 and a rubber sleeve 532. Among them, the stainless steel rod 531 is vertically connected between the front plate 511 and the rear plate 512 of the frame, and the rubber sleeve 532 is sleeved on the outside of the stainless steel rod 531. The stainless steel rod 531 plays a rigid support role, and the rubber sleeve 532 plays a buffering and protective role to avoid damaging the wafers.

[0160] A group of wafers 33 taken from the slicing machine adhere to the crystal carrier assembly 31, and the whole of them together with the crystal carrier assembly 31 are placed into the tooling basket 5, as shown in Figure 4 . Then the tooling basket is sent into the degumming device for degumming. After degumming, the wafers 33 are separated from the crystal carrier assembly 31, the wafers 33 remain in the tooling basket 5, and the crystal carrier assembly 31 is recycled. As shown in Figure 10 , after the degumming station and the glue wiping station, there is further a wafer slicing station arranged. After glue wiping, the tooling basket 5 is sent into the wafer slicing station.

[0161] Figure 24This is a schematic structural diagram of the tooling basket entering the slicing station provided by the embodiments of the present application. As Figure 24 shown, the slicing station of the degumming device is provided with a slicing workbench 71, a slicing transportation mechanism 721, a magnetic part 722, and a slicing nozzle 723.

[0162] Among them, the slicing transportation mechanism 721 is arranged on the slicing workbench 71. The tooling basket 5 is arranged on the slicing transportation mechanism 721 and can move along the length direction of the tooling basket 5 under the drive of the slicing transportation mechanism 721, that is, along Figure 7 the Y direction in

[0163] The magnetic part 722 is arranged on both sides of the travel area of the tooling basket. For example, magnetic parts 722 are symmetrically arranged on both sides of the travel area of the tooling basket. The magnetic part 722 can generate a magnetic attraction force with the magnetic part (magnetic ring 522) on the tooling basket 5. The slicing nozzle 723 is arranged on both sides of the travel area of the tooling basket and is adjacent to the magnetic part 722. The outlet direction of the slicing nozzle 723 faces the travel area of the tooling basket. The slicing nozzle 723 can spray slicing medium, and the slicing medium can be gas or liquid.

[0164] Taking Figure 24 as an example, the tooling basket 5 moves from left to right. When it moves to the position of the magnetic part 722, the magnetic force between the magnetic part 722 and the magnetic ring 522 causes the side support assembly 52 in the area of the magnetic ring 522 to be stretched and deformed outward, away from the silicon wafer 33 at this position, losing the clamping force on the silicon wafer. The slicing nozzle 723 sprays water between two adjacent silicon wafers to separate the adjacent silicon wafers and increase the distance, facilitating the removal of the silicon wafers from the tooling basket.

[0165] The tooling basket 5 continues to move to the right. The magnetic rings 522 are successively subjected to magnetic force in the direction from right to left. The side support assemblies 52 are successively stretched and deformed outward, and the silicon wafers that have lost the clamping force are separated from the adjacent silicon wafers after being sprayed with water and are taken out. In the above solution, through the cooperation of the magnetic part 722 and the magnetic part, only a small part of the silicon wafers lose the clamping force and can be taken out, and the remaining silicon wafers are still in the clamped state and will not fall.

[0166] The above transportation mechanism 721 may specifically include: a transportation screw, a transportation slide table, and a driving motor. Among them, the transportation screw extends along the length direction of the tooling basket 5. The transportation slide table is in threaded cooperation with the transportation screw, and the transportation slide table is connected to the tooling basket. The driving motor drives the transportation screw to rotate to drive the transportation slide table and the tooling basket 5 to move along the Y direction.

[0167] As Figure 11As shown in the figure, a belt conveying mechanism 41 is provided at the front end of the conveying screw. The belt in the belt conveying mechanism 41 includes a part that moves vertically and a part that moves horizontally. Among them, the part that moves vertically is close to the tooling basket 5, and the belt is coated with glue. After being sliced through the above steps, the silicon wafers come into contact with the surface of the belt, stick to the belt, and then move upward along the belt and horizontally in a direction away from the tooling basket to the insertion and washing device in sequence. An insertion tooling basket is provided in the insertion and washing device, and each silicon wafer is inserted into the insertion tooling basket.

[0168] Another implementation manner of the tooling basket 5 is provided in this embodiment, which can clamp the silicon wafers to avoid lodging and can cooperate with the operation of the slicing station to separate the silicon wafers.

[0169] Figure 25 It is a perspective view of the tooling basket provided by the embodiment of the present application. Figure 26 It is a perspective view of the tooling basket provided by the embodiment of the present application with silicon wafers installed. Figure 27 It is a side view of the tooling basket provided by the embodiment of the present application. Figure 28 It is a perspective view of the tooling basket provided by the embodiment of the present application in cooperation with the trigger plate. Figure 29 It is a top view of the tooling basket provided by the embodiment of the present application in cooperation with the trigger plate.

[0170] As Figures 25 to 29 As shown in the figure, the tooling basket provided in this embodiment includes: a tooling frame 54, a side baffle assembly 55, and a clamping plate assembly 56. Among them, the tooling frame 54 is a basic structure for supporting the silicon wafers and installing various components. In this embodiment, it is set that the tooling frame 54 has a length direction Y, a width direction X, and a height direction Z.

[0171] The side baffle assembly 55 is arranged on both sides of the tooling frame 54. The side baffle assembly 55 and the tooling frame 54 enclose a receiving space for accommodating the silicon wafers 33. A group of silicon wafers 33 enter the receiving space from above, and the silicon wafers 33 are vertically inserted into the receiving space. The silicon wafers 33 are perpendicular to the Y direction, and multiple silicon wafers 33 are arranged side by side and arranged in sequence along the Y direction.

[0172] At the slicing station, there is a trigger plate 73 that cooperates with the clamping plate assembly 53 to clamp or loosen the silicon wafers 33. The clamping plate assembly 56 is rotatably arranged on the side baffle assembly 55. The clamping plate assembly 56 is in the first position of clamping the silicon wafers 33 in the initial state, and rotates relative to the side baffle assembly 55 to the second position of loosening the silicon wafers 33 when subjected to the force of the trigger plate 73.

[0173] The number of the clamping plate assemblies 56 is multiple and they are arranged in sequence along the Y direction. The arrangement length of the clamping plate assemblies 56 can be set according to the length of a group of silicon wafers, or can be set according to the length of the silicon rod before slicing. The arrangement length of the clamping plate assemblies 56 is slightly larger than the length of a group of silicon wafers and can clamp all the silicon wafers.

[0174] After the silicon wafer is placed in the tooling basket, the clamping plate assembly 56 is in the first position to clamp the silicon wafer 33. When the tooling basket is placed in the slicing station and is subjected to the acting force applied by the trigger plate 73, a certain clamping plate assembly 56 rotates to the second position to release the silicon wafer 33, and the clamping force on the silicon wafer disappears, so that the silicon wafer that loses the clamping force is in a free state. The slicing medium is sprayed towards the side of the silicon wafer through the slicing nozzle on the side of the tooling basket to increase the distance between the silicon wafer and the adjacent silicon wafers, achieving the effect of slicing. Subsequently, the separated silicon wafers are taken out for subsequent production processes. The remaining clamping plate assemblies 56 still clamp the remaining silicon wafers 33.

[0175] The above-mentioned tooling rack can be of a box-shaped structure or a hollow skeleton structure. This embodiment provides a specific implementation method: The tooling rack 54 includes a bottom frame plate 541, a front frame plate 542, and a rear frame plate 543. Among them, the bottom frame plate 541 is a rectangular plate structure, and its length direction is the Y direction. The front frame plate 542 and the rear frame plate 543 are parallel, and the front frame plate 542 and the rear frame plate 543 are respectively connected to both ends of the bottom frame plate 541 in the length direction and are perpendicular to the length direction of the bottom frame plate 541. The side baffle assembly 55 is connected between the front frame plate 542 and the rear frame plate 543.

[0176] A specific implementation method: The bottom ends of the rear frame plate 543 and the front frame plate 542 are connected to the bottom frame plate 541, and the top end of the rear frame plate 543 is higher than the front frame plate 542. The top end of the rear frame plate 543 can be higher than the silicon wafer 33, and the silicon wafer 33 can abut against the rear frame plate 543. The front frame plate 542 is detachably connected to the bottom frame plate 541, which is convenient for disassembly and assembly and also convenient for placing the silicon wafer.

[0177] This embodiment also provides an implementation method of the side baffle assembly. Figure 30 is Figure 23 the enlarged view of area C in Figure 31 is Figure 27 the cross-sectional view taken along the D-D direction in Figure 32 is Figure 31 the enlarged view of area E in Figure 33 is the structural schematic diagram of the baffle. As Figures 25 to 33 shown, the side baffle assembly 55 includes a clamping plate stop bar 551, a first support rod 552, and a second support rod 553. Among them, the clamping plate stop bar 551, the first support rod 552, and the second support rod 553 are parallel and are all vertically connected between the front frame plate 542 and the rear frame plate 543. The clamping plate stop bar 551, the first support rod 552, and the second support rod 553 are distributed on three different vertical planes. The height of the clamping plate stop bar 551 is higher than that of the first support rod 552, and the height of the first support rod 552 is higher than that of the second support rod 553.

[0178] For example, the clamping plate retaining bars 551, the first support rod 552, and the second support rod 553 on both sides of the tooling rack are symmetrically arranged. The distance between the two second support rods 553 is less than the distance between the two first support rods 552, and the distance between the two clamping plate retaining bars 551 is less than the distance between the two first support rods 552.

[0179] Specifically, the front frame plate 542 and the rear frame plate 543 are respectively provided with through holes for the clamping plate retaining bars 551, the first support rod 552, and the second support rod 553 to pass through, which are called the frame plate through holes 5421. The frame plate through holes 5421 are oblong holes extending along the width direction of the bottom frame plate. The clamping plate retaining bars 551, the first support rod 552, and the second support rod 553 can all move within the oblong holes to adjust their positions to adapt to silicon wafers of different specifications.

[0180] The ends of the clamping plate retaining bars 551, the first support rod 552, and the second support rod 553 passing through the frame plate through holes 5421 are fixedly connected to nuts to fix the clamping plate retaining bars 551, the first support rod 552, and the second support rod 553.

[0181] Furthermore, the clamping plate assembly 56 includes: a baffle plate 561 and a torsion spring 562. Among them, the baffle plate 531 is rotatably connected to the first support rod 522 and is located outside the clamping plate retaining bars 551 and the second support rod 553. The middle part of the torsion spring 562 is sleeved on the first support rod 552. The bottom end of the torsion spring 562 penetrates into the connection hole opened in the second support rod 553, and the top end of the torsion spring 562 is clamped outside the baffle plate 561. In this embodiment, the inner side is the direction pointing to the accommodation space; the outer side is opposite to the inner side.

[0182] The torsion spring 562 can rotate relative to the first support rod 552, but one end of the torsion spring 562 is restricted by the second support rod 553, and the other end is restricted by the baffle plate 561 and cannot generate a large rotation angle, and it returns to its original state by elastic force when the external force disappears.

[0183] The trigger plate 73 exerts an inward moving force on the bottom end of the baffle plate 561, prompting the top of the baffle plate 561 to rotate outward to release the silicon wafer 33. When the force exerted by the trigger plate disappears, the baffle plate 561 rotates in the reverse direction to return to its original state.

[0184] A specific implementation method: The baffle plate 561 has a middle part 5611, a clamping part 5612, and a trigger part 5613. The clamping part 5612 is located at the top end of the middle part 5611, and the trigger part 5613 is located at the bottom end of the middle part 5611. The middle part 5611 extends vertically, and a collar 56111 is provided thereon, which is sleeved on the first support rod 522. The clamping part 5612 bends inward from the top of the middle part 5611, and a clamping gasket 563 is provided on the inner surface of the clamping part 5612. The clamping gasket 563 is made of a soft material and can protect the silicon wafer while applying a clamping force to the silicon wafer to avoid damage to the silicon wafer, such as: rubber, silica gel, felt, sponge, etc.

[0185] The trigger part 5613 bends outward from the bottom end of the middle part and extends forward and inward in the direction of the front support plate 542 to cooperate with the trigger plate 73.

[0186] The trigger part 5613 has a connecting section, a supporting section and a triggering section. Among them, the connecting section is connected to the bottom end of the middle part 5611. The supporting section extends along the width direction of the bottom support plate 541 (i.e., the X direction), one end of which is connected to the connecting section and the other end is connected to the triggering section; the triggering section extends along the length direction of the bottom support plate (i.e., the Y direction) to cooperate with the trigger plate.

[0187] Furthermore, a bottom receiving component 57 can also be adopted, which is connected between the front support plate 542 and the rear support plate 543 and is located at the bottom of the accommodation space. The number of the bottom receiving components 57 is two, which are arranged at intervals. The bottom receiving component 57 includes: a stainless steel rod and a rubber sleeve. Among them, the stainless steel rod is vertically connected between the front support plate 542 and the rear support plate 543, and the rubber sleeve is sleeved on the outside of the stainless steel rod. The stainless steel rod plays a rigid supporting role, and the rubber sleeve plays a buffering and protecting role to avoid damaging the silicon wafer. The rubber sleeve can also be replaced with a sponge sleeve, or other soft materials can be used.

[0188] Figure 34 It is a top view of another tooling basket provided by the embodiment of the present application applied to the slicing station. As Figure 34 shown, the slicing station is provided with a slicing workbench 71, a slicing conveying mechanism 721, a slicing nozzle 723 and a trigger plate 73.

[0189] Among them, the slicing conveying mechanism 721 is arranged on the slicing workbench 71. The tooling basket 5 is arranged on the slicing conveying mechanism 721 and can move along the length direction of the tooling basket 5 (i.e., the Y direction in the figure) under the drive of the slicing conveying mechanism 721. The area where the tooling basket 5 moves is the stroke area.

[0190] The trigger plate 73 is arranged on both sides of the stroke area of the tooling basket and is used to apply a force to the clamping plate assembly 56 in the tooling basket 5. Trigger plates 73 are arranged on both the left and right sides of the tooling basket 5, and the trigger plates 73 on both sides are symmetrically arranged to cooperate with the clamping plate assembly to release both sides of the silicon wafer simultaneously.

[0191] The slicing nozzle 723 is arranged on both sides of the stroke area of the tooling basket and is close to the trigger plate 73. The outlet direction of the slicing nozzle 723 faces the stroke area of the tooling basket.

[0192] To Figure 34For example, the tooling basket 5 moves from left to right. When it moves to the position of the trigger plate 73, the trigger plate 73 exerts a force on the baffle 561 to make the baffle 561 rotate, releasing the silicon wafer 33 at this position. The slicing nozzle 723 sprays water between two adjacent silicon wafers to separate the adjacent silicon wafers and increase the distance, facilitating the removal of the silicon wafers from the tooling basket.

[0193] The tooling basket 5 continues to move to the right. The trigger plate 73 applies a force to each baffle 561 in the direction from right to left in turn, causing them to rotate in turn and then release the silicon wafers. The silicon wafers that lose the clamping force are separated from the adjacent silicon wafers after being sprayed with water, and then stick to the belt conveying mechanism 41 and are transported to the chip inserting and washing device for chip insertion.

[0194] In the above solution, through the cooperation of the baffle 561 and the trigger plate 73, only a small part of the silicon wafers lose the clamping force and can be taken out, and the rest of the silicon wafers are still in the clamped state and will not fall over.

[0195] Specifically, the above-mentioned conveying mechanism 721 may include: a conveying screw, a conveying slide table and a driving motor. Among them, the conveying screw extends along the length direction of the tooling basket 5. The conveying slide table is in threaded cooperation with the conveying screw, and the conveying slide table is connected to the tooling basket. The driving motor drives the conveying screw to rotate to drive the conveying slide table and the tooling basket 5 to move in the Y direction.

Claims

1. A method for producing a silicon wafer, characterized in that Including: Cutting a silicon rod adhered to a crystal carrier assembly by a slicing machine to obtain silicon wafers, and pre-cleaning the silicon wafers during the process of removing the rod. After the pre-cleaning is completed, the silicon wafers and the crystal carrier assembly are placed in a tooling basket. Transporting the tooling basket containing the silicon wafers and the crystal carrier assembly to a debonding device by a transport cart. Debonding the silicon wafers in the debonding device to separate them from the crystal carrier assembly. Transporting the silicon wafers to a pickling device by a silicon wafer transfer mechanism provided between the debonding device and the pickling device. Performing pickling on the silicon wafers by the pickling device. The debonding device is provided with a silicon wafer operation line, and the silicon wafer operation line is sequentially provided with a debonding station and a glue wiping station. Debonding the silicon wafers by the debonding device to separate them from the crystal carrier assembly, including: Transporting the tooling basket containing the silicon wafers and the crystal carrier assembly to the debonding station by a conveying manipulator mechanism in the debonding device for debonding. After the debonding is completed, raising the tooling basket by the conveying manipulator mechanism. Collecting side images of the silicon wafers and the crystal carrier assembly by an image acquisition component at the debonding station. After confirming that all the silicon wafers are separated from the crystal carrier assembly according to the side images, transporting the tooling basket containing the silicon wafers and the crystal carrier assembly to the glue wiping station by the conveying manipulator mechanism. Confirming whether the silicon wafers are completely separated from the crystal carrier assembly by a processor according to the side images, including: Determining the distance between the top of the silicon wafer and the bottom surface of the crystal carrier assembly according to the side images. Judging whether the distance is within a preset range. If so, the debonding end condition is satisfied, and the debonding ends.

2. The method according to claim 1, wherein After debonding the silicon wafers, it further includes: Transporting the crystal carrier assembly to a thick wafer removal station in the debonding device by a conveying manipulator mechanism in the debonding device. Collecting a crystal carrier image by an image acquisition component provided at the thick wafer removal station. After confirming the position of the thick wafer according to the crystal carrier image, removing the thick wafer by a thick wafer removal manipulator mechanism at the thick wafer removal station.

3. The method according to claim 2, wherein After removing the thick wafer, it further includes: Putting the crystal carrier assembly into a crystal carrier recovery line by the conveying manipulator mechanism, so that the crystal carrier assembly is transported back to the slicing machine through the crystal carrier recovery line for reuse; the crystal carrier recovery line is arranged in the debonding device.

4. The method according to claim 2, wherein Determining the distance between the top of the silicon wafer and the bottom surface of the crystal carrier assembly according to the side images, including: Identifying the silicon wafer contour in the side images. Fitting the top edge contours of each silicon wafer into a curve. Fitting the bottom edge contour of the crystal carrier assembly into a straight line. Obtaining the shortest distance between the straight line and the curve in the side images as the distance between the top of the silicon wafer and the bottom surface of the crystal carrier assembly.

5. The method according to claim 2, wherein It further includes: Collecting an image of the glue-bonded surface of the silicon wafer by an image acquisition component at the glue wiping station. When confirming that there is residual glue on the glue-bonded surface of the silicon wafer according to the image of the glue-bonded surface, wiping the glue-bonded surface of the silicon wafer by a glue wiping manipulator mechanism at the glue wiping station to remove the residual glue.

6. The method according to claim 5, characterized in that, Wiping the glue-bonded surface of the silicon wafer by the glue wiping manipulator mechanism, including: Obtaining the current position of the glue wiping manipulator mechanism and the position of the silicon wafer. Controlling the glue wiping manipulator mechanism to move to the glue-bonded surface of the silicon wafer according to the current position of the glue wiping manipulator mechanism and the position of the silicon wafer. Controlling the glue wiping manipulator mechanism to wipe on the glue-bonded surface of the silicon wafer according to a preset glue wiping trajectory.

7. The method according to claim 1, characterized in that, It further includes: Slicing the silicon wafers by a slicing station provided in the debonding device to separate the silicon wafers from the tooling basket.

8. The method according to claim 7, wherein Slicing the silicon wafers through a slicing station in a degumming device, including: Driving a tooling basket loaded with silicon wafers to move through a slicing and transporting mechanism arranged in the slicing station; When the tooling basket moves to the position where a slicing nozzle arranged in the slicing station is located, controlling the slicing nozzle to spray a slicing medium towards the silicon wafers so that the silicon wafers that lose the clamping force are separated from the adjacent silicon wafers.

9. The method according to claim 7, characterized in that, After slicing the silicon wafers, it further includes: grasping an empty tooling basket at the slicing station through a conveying manipulator mechanism and putting the empty tooling basket into a tooling basket recovery line, and the tooling basket recovery line is arranged in the degumming device.

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