A method for selecting a fixture pin point on a circuit board

Abstract

The application discloses a kind of selection point method of selecting clamp needle point on circuit board, comprising the following steps: one: store the image information of circuit board, wherein it contains avoidance area;Two: establish coordinate system, and circuit board surface is divided into several units;Three: establish first set and second set, and the coordinates of all units are stored into first set;Four: select the unit with intersection with avoidance area;Five: the unit selected in step four is deleted from first set;Six: select all units with minimum X or Y coordinate in first set;Seven: select another coordinate minimum unit in the unit selected in step six;Eight: the unit selected in step seven is copied to second set;Nine: draw exclusion zone;Ten: select the unit with intersection with exclusion zone;Eleven: the unit selected in step ten is deleted from first set;Twelve: repeat step six to ten until the coordinates of first set are all deleted;Thirteen: output the coordinates preserved in second set.

Description

Technical Field

[0001] This invention relates to a method for selecting clamp pin points on a circuit board. Background Technology

[0002] With the rapid development of electronic communication equipment and automotive products, printed circuit boards (PCBs), which serve as carriers for electronic components, are constantly being upgraded. Automated equipment is widely used in the PCB manufacturing process, among which three-machine continuous printing equipment is widely applied. The production of PCBs using three-machine continuous printing equipment requires multiple processes, each corresponding to different machines. Therefore, the clamps used to hold the PCBs and move them between machines have high requirements. The clamps must not only meet the requirements of the three-machine continuous printing equipment but also meet the ejector pin setting requirements of the corresponding PCB workpiece.

[0003] Firstly, to avoid scratching the solder mask, the ejector pins of the fixture must be placed in areas without it. Simultaneously, a certain distance must be maintained between the ejector pins; too small a distance will increase costs due to an excessive number of pins, while too large a distance will reduce support, potentially causing circuit board deformation and affecting production yield. Currently, the industry generally uses manual selection to set the ejector pins. However, since the areas available for setting the ejector pins are not regularly distributed, and the distance between the pins needs to be maintained, manual selection is extremely inefficient. Furthermore, manual selection cannot accurately guarantee the distance between the pins and is prone to errors and omissions.

[0004] Therefore, overcoming the aforementioned shortcomings has become an important issue that urgently needs to be addressed by those skilled in the art. Summary of the Invention

[0005] This invention overcomes the shortcomings of the above-mentioned technologies and provides a method for selecting clamp pin points on a circuit board.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A method for selecting clamp pin points on a circuit board includes the following steps:

[0008] Step 1: Store the image information of the circuit board 1 for which the corresponding fixture needs to be made. The image information of the circuit board 1 includes a top view of one side of the circuit board 1 and the distribution of all the clearance areas 2 on that side. The clearance area 2 is the area on that side of the circuit board 1 where the fixture pins cannot be installed.

[0009] Step 2: Based on the image information of circuit board 1, establish an XY rectangular coordinate system with any one of the four corners of circuit board 1 as the origin. Divide the surface of circuit board 1 into several horizontally and vertically arranged pixel units 3 of the same size and with consistent spacing. The XY coordinates of the center point of each pixel unit 3 are used as the positioning coordinates of the pixel unit 3.

[0010] Step 3: Establish a first set and a second set that can be used to store the positioning coordinate information of pixel unit 3 respectively, and store the positioning coordinates of all pixel units 3 divided in Step 2 into the first set;

[0011] Step 4: Select all pixel units 3 that intersect with the empty area 2 from the first set;

[0012] Step 5: Remove the location coordinates of those pixel units 3 selected in Step 4 from the first set;

[0013] Step 6: Select all pixel units 3 with the smallest X coordinate from the first set, or select all pixel units 3 with the smallest Y coordinate from the first set;

[0014] Step 7: Select the pixel unit 3 with the smallest coordinates from those pixel units 3 selected in Step 6;

[0015] Step 8: Copy and save the positioning coordinates of pixel unit 3 selected in Step 7 from the first set to the second set;

[0016] Step 9: Using the location coordinates of the pixel unit 3 selected in Step 6 as the center, divide a circular exclusion area 4 with a radius of R;

[0017] Step 10: Select all pixel units 3 that intersect with the excluded region 4 from the first set;

[0018] Step 11: Delete the positioning coordinates of all pixel units 3 selected in Step 10 from the first set;

[0019] Step 12: Repeat steps 6 through 11 until all location coordinates in the first set are deleted;

[0020] Step 13: Output the positioning coordinates of all pixel units 3 stored in the second set as the fixture pin points.

[0021] Preferably, the radius R in step nine is in the range of 1.4 inch ≤ R ≤ 1.6 inch.

[0022] Preferably, the pixel unit 3 is square or circular.

[0023] Preferably, when the pixel unit 3 is a square, its side length is 59 mil, and when the pixel unit 3 is a circle, its diameter is 59 mil.

[0024] Preferably, the distance between each pixel unit 3 and its four adjacent pixel units 3 (top, bottom, left, and right) is 10 mil.

[0025] Preferably, the edge of the clearance area 2 is extended outward by 8mil to form the insurance area 5. Step four also includes selecting all pixel units 3 from the first set that do not intersect with the clearance area 2 but intersect with the insurance area 5.

[0026] Preferably, the XY rectangular coordinate system established in step two has a unit length of 1 mil.

[0027] Preferably, the clearance area 2 includes the area covered by the solder resist layer on the surface of the circuit board 1.

[0028] Compared with the prior art, the beneficial effects of the present invention are:

[0029] The selection method in this case involves dividing the circuit board into several pixel units and saving the positioning coordinates of all pixel units in a first set as candidate ejector pin locations. Then, by comparing coordinates, pixel units that intersect with the clearance area are filtered out, and their positioning coordinates are removed from the first set to prevent the final selected ejector pin from falling on the clearance area. Next, by comparing positioning coordinates again, a pixel unit with relatively small X and Y coordinates is selected from the first set, and its positioning coordinates are copied and saved to a second set as the fixture ejector pin location coordinates. After copying and saving, a circular exclusion area with radius R is drawn with the newly selected fixture ejector pin coordinates as the center. Again, by comparing coordinates, pixel units that intersect with the exclusion area are filtered out from the first set, and their positioning coordinates are removed from the first set to prevent the next selected fixture ejector pin from being too close to the previously selected fixture ejector pin. This process of selecting, copying, saving, and deleting too-close points is repeated until all positioning coordinates in the first set are deleted. The positioning coordinates saved in the second set are then the final fixture ejector pin locations. The point selection method in this case can quickly select a series of clamp pin points with the same spacing that will not fall in the clearance area. This can ensure that the distance between each clamp pin point is not too close or too far, and can also avoid the situation of incorrect or missed selection. Compared with the manual point selection method, it can greatly improve the efficiency and accuracy of point selection. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the circuit board and the sheltered area in this case.

[0031] Figure 2This is a schematic diagram of the pixel unit division in step two of the point selection method in this case, where the pixel unit is a square.

[0032] Figure 3 This is a schematic diagram of the remaining pixel units in the first set after completing step five of the point selection method in this case, where the pixel units are squares.

[0033] Figure 4 This is a schematic diagram of the exclusion area selected in this case.

[0034] Figure 5 This is a schematic diagram of the pixel unit output from step thirteen of the point selection method in this case, where the pixel unit is a square. Detailed Implementation

[0035] The following examples further illustrate the features and other related characteristics of the present invention to facilitate understanding by those skilled in the art:

[0036] like Figures 1 to 5 As shown, a method for selecting clamp pin points on a circuit board includes the following steps:

[0037] Step 1: Store the image information of the circuit board 1 for which the corresponding fixture needs to be made. The image information of the circuit board 1 includes a top view of one side of the circuit board 1 and the distribution of all the clearance areas 2 on that side. The clearance area 2 is the area on that side of the circuit board 1 where the fixture pins cannot be installed.

[0038] Step 2: Based on the image information of circuit board 1, establish an XY rectangular coordinate system with any one of the four corners of circuit board 1 as the origin. Divide the surface of circuit board 1 into several horizontally and vertically arranged pixel units 3 of the same size and with consistent spacing. The XY coordinates of the center point of each pixel unit 3 are used as the positioning coordinates of the pixel unit 3.

[0039] Step 3: Establish a first set and a second set that can be used to store the positioning coordinate information of pixel unit 3 respectively, and store the positioning coordinates of all pixel units 3 divided in Step 2 into the first set;

[0040] Step 4: Select all pixel units 3 that intersect with the empty area 2 from the first set;

[0041] Step 5: Remove the location coordinates of those pixel units 3 selected in Step 4 from the first set;

[0042] Step 6: Select all pixel units 3 with the smallest X coordinate from the first set, or select all pixel units 3 with the smallest Y coordinate from the first set;

[0043] Step 7: Select the pixel unit 3 with the smallest coordinates from those pixel units 3 selected in Step 6;

[0044] Step 8: Copy and save the positioning coordinates of pixel unit 3 selected in Step 7 from the first set to the second set;

[0045] Step 9: Using the location coordinates of the pixel unit 3 selected in Step 6 as the center, divide a circular exclusion area 4 with a radius of R;

[0046] Step 10: Select all pixel units 3 that intersect with the excluded region 4 from the first set;

[0047] Step 11: Delete the positioning coordinates of all pixel units 3 selected in Step 10 from the first set;

[0048] Step 12: Repeat steps 6 through 11 until all location coordinates in the first set are deleted;

[0049] Step 13: Output the positioning coordinates of all pixel units 3 stored in the second set as the fixture pin points.

[0050] As described above, the point selection method in this case divides the circuit board into several pixel units 3 and saves the positioning coordinates of all pixel units 3 in a first set as candidate ejector pin positions. Then, by comparing coordinates, pixel units 3 that intersect with the clearance area 2 are selected and their positioning coordinates are deleted from the first set to avoid the final selected ejector pin position falling on the clearance area 2. Next, by comparing positioning coordinates, a pixel unit 3 with relatively small X and Y coordinates is selected from the first set and its positioning coordinates are copied and saved to a second set as the fixture ejector pin position coordinates. After copying and saving, a circular exclusion area 4 with radius R is divided with the coordinates of the just selected fixture ejector pin position as the center. Then, by comparing coordinates, pixel units 3 that intersect with the exclusion area 4 are selected from the first set and their positioning coordinates are deleted from the first set to avoid the next selected fixture ejector pin position being too close to the previously selected fixture ejector pin position. The above steps of point selection, copying and saving, and deleting too close points are repeated until all positioning coordinates in the first set are deleted. In this way, the positioning coordinates saved in the second set are the final fixture ejector pin positions. The point selection method in this case can quickly select a series of clamp pin points with the same spacing that will not fall in the clearance area 2. This can ensure that the distance between each clamp pin point is not too close or too far, and can also avoid the situation of incorrect or missed selection. Compared with the manual point selection method, it can greatly improve the efficiency and accuracy of point selection.

[0051] like Figures 1 to 4As shown, preferably, the radius R in step nine is 1.4 inch ≤ R ≤ 1.6 inch. This ensures that the distance between the selected fixture pins is not too close, which would lead to too many fixture pins and increase costs, and that the distance between the fixture pins is not too far, which would result in low fixture support and cause the circuit board 1 to deform.

[0052] like Figures 2 to 5 As shown, preferably, the pixel unit 3 is a square or a circle, but the pixel unit 3 can also be other regular shapes.

[0053] like Figures 2 to 5 As shown, preferably, when the pixel unit 3 is square, its side length is 59mil, and when the pixel unit 3 is circular, its diameter is 59mil. In this way, it can be ensured that the circuit board has enough space at the position corresponding to the positioning coordinates finally output by the second set for contacting the fixture pin.

[0054] like Figures 2 to 5 As shown, preferably, the spacing between each pixel unit 3 and its four adjacent pixel units 3 (top, bottom, left, and right) is 10 mil.

[0055] like Figures 2 to 3 As shown, preferably, the edge of the clearance area 2 is extended outward by 8mil to form the insurance area 5. Step four also includes selecting all pixel units 3 from the first set that do not intersect with the clearance area 2 but intersect with the insurance area 5. In this way, it can be ensured that the positioning coordinates finally output by the second set will not be too close to the clearance area 2.

[0056] like Figures 1 to 5 As shown, preferably, the XY rectangular coordinate system established in step two has a unit length of 1 mil. This can minimize the occurrence of decimals in the positioning coordinate data and reduce the complexity of coordinate comparison.

[0057] like Figures 1 to 5 As shown, preferably, the clearance area 2 includes the area covered by the solder resist layer on the surface of the circuit board 1.

[0058] As stated above, this case protects a method for selecting clamp pin points on a circuit board, and all technical solutions that are the same as or similar to this case should be considered to fall within the protection scope of this case.

Claims

1. A method for selecting clamp pin points on a circuit board, characterized in that... The method comprises the following steps: Step one: store the image information of the circuit board (1) for which a corresponding fixture is to be made, the image information of the circuit board (1) including the top view of one side of the circuit board (1) and the distribution of all the clearance areas (2) on the side, the clearance areas (2) being the areas on the side of the circuit board (1) where no fixture contact pin can be arranged; Step two: on the basis of the image information of the circuit board (1), establish an X-Y rectangular coordinate system with any corner of the four corners of the circuit board (1) as the origin, and divide the surface of the circuit board (1) into a plurality of pixel units (3) arranged in horizontal and vertical rows and having the same size and consistent spacing, the X-Y coordinates of the center point of each pixel unit (3) being taken as the positioning coordinates of the pixel unit (3); Step three: establish a first set and a second set capable of respectively storing the positioning coordinate information of the pixel units (3), and store the positioning coordinates of all the pixel units (3) divided in step two into the first set; Step four: select all the pixel units (3) having intersection with the clearance areas (2) from the first set; Step five: delete the positioning coordinates of those pixel units (3) selected in step four from the first set; Step six: select all the pixel units (3) with the smallest X coordinate from the first set, or select all the pixel units (3) with the smallest Y coordinate from the first set; Step seven: select one pixel unit (3) with the smallest other coordinate from those pixel units (3) selected in step six; Step eight: copy and save the positioning coordinates of the pixel unit (3) selected in step seven from the first set into the second set; Step nine: divide a circular exclusion area (4) with a radius R from the positioning coordinates of the pixel unit (3) selected in step six as the center; Step ten: select all the pixel units (3) having intersection with the exclusion area (4) from the first set; Step eleven: delete the positioning coordinates of all the pixel units (3) selected in step ten from the first set; Step twelve: repeat steps six to ten until all the positioning coordinates in the first set are deleted; Step thirteen: output all the positioning coordinates of the pixel units (3) saved in the second set as the contact pin points of the fixture.

2. The method of claim 1, wherein the method further comprises: determining a center of the circuit board; and determining a center of the selected pin point. The radius R in step nine ranges from 1.4 inch to 1.6 inch.

3. The method of claim 1, wherein the method further comprises: determining a center of the circuit board; and determining a center of the selected pin point. The pixel units (3) are square or circular.

4. The method of claim 3, wherein the method further comprises: determining a center of the circuit board; and determining a center of the selected pin point. When the pixel units (3) are square, the side length of each pixel unit (3) is 59 mil, and when the pixel units (3) are circular, the diameter of each pixel unit (3) is 59 mil.

5. The method of claim 1, wherein the method further comprises: determining a center of the circuit board; and determining a center of the selected pin point. The distance between each pixel unit (3) and its four adjacent pixel units (3) is 10 mil.

6. The method of claim 1, wherein the method further comprises: determining a center of the circuit board; and determining a center of the selected pin point. An insurance area (5) is formed by extending the edges of the clearance areas (2) outward by 8 mil, and step four further comprises selecting all the pixel units (3) having no intersection with the clearance areas (2) but having intersection with the insurance area (5) from the first set.

7. The method of claim 1 to 6, wherein The X-Y rectangular coordinate system established in step two has a unit length of 1 mil.

8. The method of claim 1, wherein the method further comprises: determining a location of a center of the circuit board; and determining a location of a center of the fixture. The clearance areas (2) include the areas covered by the solder mask layer on the surface of the circuit board (1).

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