Camera device

Abstract

A camera device includes a bracket including a first hole and a second hole, a first camera module disposed in the first hole of the bracket, a second camera module disposed in the second hole of the bracket, a first magnet disposed on an outer surface of the first camera module, and a second magnet disposed on an outer surface of the bracket at a position corresponding to the first magnet, wherein the first magnet is fixed to the outer surface of the first camera module, and the second magnet is movably disposed on the bracket.

Description

Technical Field

[0001] This embodiment relates to a camera device. Background Technology

[0002] Because it is difficult to apply the technology of voice coil motors (VCMs) used in typical general-purpose camera modules to ultra-small and low-power camera modules, relevant research has been actively carried out.

[0003] In the case of camera modules installed in small electronic products such as smartphones, the camera modules may be frequently subjected to impacts during use, and the camera modules may shake slightly during shooting due to factors such as user hand tremors. Taking these aspects into consideration, a technique for attaching a hand shaking prevention device to the camera module has recently been developed.

[0004] Meanwhile, a camera device for arranging two camera modules side by side has recently been studied. However, in typical camera devices, fine-tuning is not possible after the camera modules are assembled onto the bracket, thus making it difficult to align the camera modules.

[0005] Meanwhile, recent research has explored the application of high-resolution image sensors, which are used for sharp image quality, in camera modules. However, since high-resolution image sensors generate more heat than typical image sensors, methods are needed to reduce the heat of both the high-resolution image sensor and the printed circuit board on which it is mounted. Summary of the Invention

[0006] Technical topics

[0007] The first embodiment of the present invention provides a camera module and an optical device, which are capable of: reducing the length in the optical axis direction and the dimension in the direction perpendicular to the optical axis; increasing the spacing between the lens module and the filter; and improving the connection force between the retainer and the circuit board.

[0008] A second embodiment of the present invention provides a camera device capable of fine-tuning the optical axis alignment after the camera module is inserted into the bracket.

[0009] A third embodiment of the present invention provides a printed circuit board including structures for attenuating heat generated in an image sensor. Furthermore, the present invention aims to provide a camera module including a printed circuit board and a high-resolution image sensor.

[0010] Technical solution

[0011] A camera module according to a first embodiment of the present invention includes: a circuit board; a base connected to an upper surface of the circuit board; a holder disposed inside the base; an image sensor disposed on the upper surface of the circuit board and inside the holder; a filter positioned on the image sensor and disposed on the holder; and a circuit element disposed on the upper surface of the circuit board, wherein a groove is formed on the lower surface of the holder, and wherein at least a portion of the circuit element can be accommodated inside the groove.

[0012] At least a portion of the retainer may overlap with the optical axis and circuit elements.

[0013] The retainer may include a seat portion recessed from the upper surface and an opening formed on the bottom surface of the seat portion, and the edge of the filter may be disposed on the bottom surface of the seat portion.

[0014] The base may include a first opening, wherein the retainer may include a second opening positioned below and facing the first opening, and wherein the image sensor may be disposed inside the second opening.

[0015] The retainer can be spaced apart from the base, and the base can overlap with the image sensor in a direction perpendicular to the optical axis.

[0016] The camera module may include: a housing disposed on a base; and a lens module disposed inside the housing and movable along an optical axis, wherein circuit elements are positioned between a holder and the base and may overlap with at least a portion of the lens module in the optical axis direction.

[0017] The lower surface of the retainer may include a first region that overlaps with the bottom surface of the seat portion in the optical axis direction, wherein the first region may be connected to a circuit board.

[0018] The lower surface of the retainer may include a second region that does not overlap with the bottom surface of the seat portion in the optical axis direction, wherein the second region may be connected to a circuit board.

[0019] A groove can be formed in the second region.

[0020] The groove may include a first surface having a stepped difference relative to the lower surface of the retainer in the optical axis direction and a second surface connecting the lower surface of the retainer and the first surface, wherein the first surface may be positioned higher than the bottom surface.

[0021] According to another embodiment, a camera module includes: a circuit board; a lens moving device including a base disposed on the circuit board and having a first opening, a housing disposed on the base, and a coil holder disposed inside the housing and movable in the optical axis direction; a lens module coupled to the coil holder and facing the first opening; a holder including a second opening facing the lens module, coupled to an upper surface of the circuit board, and disposed inside the base; an image sensor disposed on the upper surface of the circuit board and positioned inside the second opening of the holder; a filter disposed in the holder and on the image sensor; and a circuit element disposed on the upper surface of the circuit board and disposed between the holder and the base, wherein a lower portion of the base is coupled to the circuit board, wherein the circuit element is disposed between the base and the holder, and wherein at least a portion of the circuit element may overlap with the holder in the optical axis direction.

[0022] A camera device according to a second embodiment of the present invention includes: a bracket including a first hole and a second hole; a first camera module disposed in the first hole of the bracket; a second camera module disposed in the second hole of the bracket; a first magnet disposed on the outer surface of the first camera module; and a second magnet disposed on the outer surface of the bracket at a position corresponding to the first magnet, wherein the first magnet is fixed to the outer surface of the first camera module, and wherein the second magnet is movably disposed in the bracket.

[0023] The support may include a groove formed on the outer surface of the support, and the second magnet may move within the groove of the support.

[0024] The attraction can act between the first magnet and the second magnet.

[0025] When the second magnet moves within the groove of the bracket, the first camera module can move together with the second magnet through the attraction between the first and second magnets.

[0026] The first magnet includes a first internal magnet through which a first axis perpendicular to the optical axis of the first camera module passes, and a second internal magnet through which the optical axis of the first camera module and a second axis perpendicular to the first axis pass, wherein the second magnet may include a first external magnet through which the first axis passes and a second external magnet through which the second axis passes.

[0027] The first and second external magnets can move in different directions.

[0028] The first external magnet can move in the direction of the optical axis, and the second external magnet can move in the direction of the first axis.

[0029] The movement of the first external magnet in the direction of the first axis and the direction of the second axis is restricted, and the movement of the second external magnet in the direction of the optical axis and the direction of the second axis is restricted.

[0030] The first external magnet can move in the direction of the optical axis and the direction of the second axis.

[0031] The bracket includes: a first groove in which a first external magnet is disposed; and a second groove in which a second external magnet is disposed, wherein the length of the first groove in the optical axis direction may be longer than the length of the first groove in the second axis direction.

[0032] The length of the first groove in the direction of the second axis can be the same as the length of the first external magnet in the direction of the second axis.

[0033] The length of the second groove in the direction of the first axis can be longer than the length of the second groove in the direction of the optical axis.

[0034] The length of the second groove in the optical axis direction can be the same as the length of the second external magnet in the optical axis direction.

[0035] The first magnet includes a first internal magnet disposed on a first outer surface of the first camera module and a second internal magnet disposed on a second outer surface. The second outer surface is obliquely disposed on the first outer surface of the first camera module. The second magnet includes a first external magnet disposed on the outer surface of a first sidewall of the bracket and a second external magnet disposed on the outer surface of a second sidewall of the bracket. The first internal magnet and the first external magnet are disposed at corresponding positions to each other, and the first sidewall of the bracket is inserted between the first internal magnet and the first external magnet. The second internal magnet and the second external magnet can be disposed at corresponding positions to each other, and the second sidewall of the bracket is inserted between the second internal magnet and the second external magnet.

[0036] The grooves of the bracket can be spaced apart from the edges of the outer surface of the bracket.

[0037] The first and second magnets can be formed into corresponding shapes.

[0038] The surface of the first magnet facing the second magnet can be formed into a circular shape, and the surface of the second magnet facing the first magnet can be formed into a circular shape.

[0039] The first camera module and the second camera module can be configured such that the optical axis of the first camera module and the optical axis of the second camera module are parallel.

[0040] It may include a sealing member disposed between the second camera module and the bracket.

[0041] The second camera module may include a cover member, a coil frame disposed inside the cover member, and a coil and magnet disposed inside the cover member and moving the coil frame.

[0042] An optical device according to a second embodiment of the present invention includes: a main body; a camera device disposed in the main body; and a display disposed in the main body and outputting images captured by the camera device.

[0043] A camera device according to a second embodiment of the present invention includes: a bracket including a first hole and a second hole; a first camera module disposed in the first hole of the bracket; a second camera module disposed in the second hole of the bracket; a first magnet disposed on the first camera module; and a second magnet movably disposed on the bracket, wherein the first magnet and the second magnet are disposed at corresponding positions and the bracket is inserted between the first magnet and the second magnet, and wherein, when the second magnet moves, the first camera module can move together with the second magnet by the attraction between the first magnet and the second magnet.

[0044] A camera module according to a third embodiment of the present invention includes: a printed circuit board; an image sensor disposed on the printed circuit board; a lens driving device disposed on the printed circuit board; and a lens coupled to the lens driving device. The printed circuit board includes an insulating layer and a conductive layer disposed on the insulating layer. The insulating layer of the printed circuit board includes an upper surface facing the lens driving device, a lower surface disposed on the opposite side of the upper surface, and a side surface connecting the upper and lower surfaces. The image sensor is disposed on the upper surface of the insulating layer. The conductive layer includes a first conductive layer disposed on the upper surface of the insulating layer, and the first conductive layer extends from an edge of the upper surface of the insulating layer.

[0045] The edge of the insulating layer includes a first edge disposed in a first direction perpendicular to the optical axis; the first conductive layer includes a first portion extending from the first edge of the insulating layer; and the length of the first portion of the first conductive layer in the first direction may be longer than the length of the image sensor in the first direction.

[0046] The edge of the insulating layer includes a second edge disposed in a second direction perpendicular to the optical axis and the first direction; the first conductive layer includes a second portion extending from the second edge; and the first portion and the second portion of the first conductive layer can be connected at the upper surface of the insulating layer.

[0047] The first conductive layer may be spaced apart from the corner where the first edge and the second edge of the insulating layer intersect.

[0048] The length of the second portion of the first conductive layer in the second direction can be longer than the length of the image sensor in the second direction.

[0049] The conductive layer may include a second conductive layer disposed in the side surface of the insulating layer, and the first conductive layer may be directly connected to the second conductive layer at the edge of the insulating layer.

[0050] The side surface of the insulating layer includes a first side surface to a fourth side surface; the second conductive layer includes a first portion disposed on the first side surface of the insulating layer; and the first portion of the second conductive layer may cover 90% or more of the area of ​​the first side surface of the insulating layer.

[0051] The conductive layer of the printed circuit board may include a third conductive layer disposed on the lower surface of the insulating layer, and the second conductive layer may connect the first conductive layer and the third conductive layer.

[0052] Printed circuit boards may include through holes that penetrate the insulating layer in the direction of the optical axis.

[0053] The conductive layer may include a fourth conductive layer disposed on the inner peripheral surface of the through hole and connecting the first conductive layer and the third conductive layer.

[0054] The insulating layer includes multiple insulating layers; the conductive layer includes a fifth conductive layer disposed between the multiple insulating layers; and the fifth conductive layer can be connected to at least one of the first conductive layer and the third conductive layer through the fourth conductive layer.

[0055] The side surfaces of the insulating layer may include four side surfaces, and the second conductive layer may be disposed on two of the four side surfaces of the insulating layer located on opposite sides.

[0056] The upper surface of the insulating layer may include four side surfaces, and the second conductive layer may be disposed on at least three of the four side surfaces of the insulating layer.

[0057] The side surface of the insulating layer includes four side surfaces; the edge of the upper surface of the insulating layer includes four edges corresponding to the four side surfaces; and the first conductive layer may be spaced apart from at least one of the four edges of the insulating layer.

[0058] The second conductive layer may include holes formed in the second conductive layer to expose a portion of the side surface of the insulating layer.

[0059] The lens driving device includes: a metal cover member; a coil holder disposed inside the cover member and connected to the lens; and a coil and a magnet disposed inside the cover member to move the coil holder, wherein the cover member can be electrically connected to a first conductive layer.

[0060] The second conductive layer can dissipate heat generated in the image sensor.

[0061] The conductive layer can be electrically connected to the image sensor.

[0062] The conductive layer may include copper.

[0063] An optical device according to a third embodiment of the present invention includes: a main body; a camera module disposed in the main body; and a display disposed in the main body and outputting images captured by the camera module.

[0064] A printed circuit board according to a third embodiment of the present invention includes an insulating layer and a conductive layer disposed on the insulating layer; the insulating layer includes an upper surface, a lower surface disposed on the opposite side of the upper surface, and a side surface connecting the upper surface and the lower surface; the conductive layer includes a first conductive layer disposed on the upper surface of the insulating layer and a second conductive layer disposed on the side surface of the insulating layer; and the first conductive layer extends from the edge of the upper surface of the insulating layer and can be directly connected to the second conductive layer at the edge.

[0065] Beneficial effects

[0066] In a first embodiment of the present invention, the retainer is disposed inside the base of the lens driving device, and the lower surface of the base is directly connected to the upper surface of the circuit board, thereby reducing the height of the camera module.

[0067] In the first embodiment of the present invention, since the lower surface of the support portion of the holder for supporting the filter is directly connected to the upper surface of the circuit board, the spacing distance between the filter and the lens module in the optical axis direction can be increased, and collisions between the wires connecting the image sensor and the circuit board and the support portion of the holder can be prevented.

[0068] In a first embodiment of the present invention, the size of the camera module in the horizontal direction can be reduced by setting or arranging circuit elements on a circuit board such that at least a portion of the circuit elements overlaps with the holder in the optical axis direction.

[0069] According to a first embodiment of the present invention, the connection force between the retainer and the circuit board can be improved, the shear force can be increased, and the retainer and the circuit board can be prevented from separating from each other due to external impact.

[0070] With the second embodiment of the present invention, the optical axis alignment can be fine-tuned even after the camera module is inserted into the bracket.

[0071] More specifically, after the main camera module is assembled onto the bracket and inserted into the secondary camera module, alignment can be achieved by fine-tuning the optical axis of the secondary camera module relative to the optical axis of the main camera module using magnets.

[0072] According to the third embodiment of the present invention, the heat generated by the image sensor can be distributed throughout the printed circuit board to reduce heat generation.

[0073] In addition, the increased ground signal area on the printed circuit board is advantageous in terms of noise reduction.

[0074] Furthermore, the number of through holes can be reduced. This makes the management of image sensor mounting easier. Consequently, the defect rate of the camera module due to tilting can be reduced. Attached Figure Description

[0075] Figure 1 This is an exploded view of a camera module according to a first embodiment of the present invention.

[0076] Figure 2 yes Figure 1 A 3D view of the camera module.

[0077] Figure 3a This is an exploded view of the lens driving device according to an embodiment.

[0078] Figure 3b This is an exploded view of a lens driving device according to another embodiment.

[0079] Figure 3c This is an exploded view of a lens driving device according to another embodiment.

[0080] Figure 3d This is an exploded view of a lens driving device according to another embodiment.

[0081] Figure 4 yes Figure 2 A cross-sectional view of the camera module taken along the AB direction.

[0082] Figure 5 It is a three-dimensional view of the base, filter, retainer, and circuit board of the lens drive device.

[0083] Figure 6 This is a top-view perspective of the retainer.

[0084] Figure 7 This is a bottom-view perspective of the retainer.

[0085] Figure 8a It is a 3D view of the circuit board, circuit components, retainer, and filter.

[0086] Figure 8b yes Figure 8a A plan view of the configuration.

[0087] Figure 9aThis is a top perspective view of the retainer in another embodiment.

[0088] Figure 9b yes Figure 9a A bottom-view perspective of the retainer.

[0089] Figure 10 It includes Figure 9a A cross-sectional view of the camera module holding the retainer.

[0090] Figure 11a It is a cross-sectional view illustrating the collision between the filter and lens modules in a typical camera module.

[0091] Figure 11b The support portion of the retainer is shown. Figure 11a Collisions between wires in the camera module.

[0092] Figure 12 It shows Figure 11a The length of a general camera module and a camera module according to an embodiment in the optical axis direction.

[0093] Figure 13 The diagram illustrates the spacing between the filter and lens module in the optical axis direction according to an embodiment.

[0094] Figure 14 It shows the attachment to Figure 10 The adhesive component on the lower surface of the retainer and attached to Figure 6 The adhesive component on the lower surface of the retainer.

[0095] Figure 15 This is a perspective view of a portable terminal according to an embodiment.

[0096] Figure 16 yes Figure 15 The diagram shows a block diagram of a portable terminal.

[0097] Figure 17 This is a perspective view of a camera device according to a second embodiment of the present invention.

[0098] Figure 18 The camera device according to the second embodiment of the present invention is in conjunction with... Figure 17 Three-dimensional images in different directions.

[0099] Figure 19 This is a plan view of a camera device according to a second embodiment of the present invention.

[0100] Figure 20 This is a bottom view of a camera device according to a second embodiment of the present invention.

[0101] Figures 21 to 24This is a side view of a camera device according to a second embodiment of the present invention.

[0102] Figure 25 It is along Figure 19 The cross-sectional view taken from line AA.

[0103] Figure 26 It is along Figure 19 The cross-sectional view of line BB.

[0104] Figure 27 It is along Figure 19 The cross-sectional view taken from line CC.

[0105] Figure 28 This is an exploded perspective view of a camera device according to a second embodiment of the present invention.

[0106] Figure 29 This is a perspective view of the bracket and magnet of the camera device according to the second embodiment of the present invention.

[0107] Figure 30 This is a perspective view of the first camera module of a camera device according to a second embodiment of the present invention.

[0108] Figure 31 This is an exploded perspective view of the first camera module of the camera device according to a second embodiment of the present invention.

[0109] Figure 32 This is an exploded perspective view of the second camera module of the camera device according to the second embodiment of the present invention.

[0110] Figure 33 This is an exploded perspective view of the lens driving device of the second camera module of the camera device according to the second embodiment of the present invention.

[0111] Figure 34 This is a perspective view illustrating an optical device according to a second embodiment of the present invention.

[0112] Figure 35 This is a block diagram of an optical device according to a second embodiment of the present invention.

[0113] Figure 36a This is a plan view of a printed circuit board according to a third embodiment of the present invention.

[0114] Figure 36b This is a plan view of a printed circuit board according to another embodiment.

[0115] Figure 37 This is a conceptual diagram of a printed circuit board based on a modified implementation.

[0116] Figure 38This is a conceptual diagram of a printed circuit board according to another modified embodiment.

[0117] Figure 39 This is a conceptual diagram illustrating a printed circuit board and an image sensor according to a third embodiment of the present invention.

[0118] Figure 40 This is a conceptual diagram illustrating a printed circuit board according to a modified implementation, viewed from above.

[0119] Figure 41 This is an exploded perspective view of a lens driving device according to a third embodiment of the present invention.

[0120] Figures 42 to 45 This is an exploded perspective view of a portion of a lens driving device according to a third embodiment of the present invention.

[0121] Figure 46 This is a perspective view illustrating an optical device according to a third embodiment of the present invention.

[0122] Figure 47 This is a block diagram of an optical device according to a third embodiment of the present invention. Detailed Implementation

[0123] In the following description, embodiments of the present invention that can specifically achieve the above objectives will be described with reference to the accompanying drawings.

[0124] In the following, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0125] However, the technical concept of the present invention is not limited to the embodiments described, but can be implemented in various forms, and within the scope of the technical concept of the present invention, one or more constituent elements can be selectively combined or replaced among the embodiments.

[0126] Furthermore, unless explicitly defined and described, the terms (including technical and scientific terms) used in embodiments of the present invention may be interpreted as meanings that are commonly understood by those skilled in the art, and commonly used terms, such as those defined in dictionaries, may be interpreted in the context of the relevant art.

[0127] Furthermore, the terminology used in this application is for describing embodiments and is not intended to limit the invention.

[0128] In this application, unless specifically stated in the phrase, the singular form may include the plural form, and when described as “at least one (or more than one) of A, B and C”, it may include one or more of all combinations that can be combined with A, B and C.

[0129] Furthermore, when describing components of embodiments of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are intended only to distinguish components from other components, and they do not limit the nature, order, or sequence of the components.

[0130] Additionally, when a component is described as “connected,” “linked,” or “interconnected” to another component, the component is not only directly connected, linked, or interconnected to the other component, but may also include situations where the component is “connected,” “linked,” or “interconnected” due to another component between the other components.

[0131] Furthermore, when described as being formed or arranged "above" or "below" each component, "above" or "below" means not only the case where two components are in direct contact, but also the case where one or more other components are formed or arranged between the two components. Additionally, when expressed as "above" or "below," it can include not only the meaning of an upward direction based on a component, but also the meaning of a downward direction based on a component.

[0132] In the following description, a camera module according to an embodiment and an optical device including the camera module will be described with reference to the accompanying drawings. For ease of description, the camera module according to the embodiment is described using a Cartesian coordinate system (x, y, z), but other coordinate systems may also be used, and the embodiment is not limited thereto. In each figure, the x-axis and y-axis refer to directions perpendicular to the z-axis, which is the direction of the optical axis (OA); the z-axis direction, which is the direction of the optical axis (OA), is called the "first direction"; the x-axis direction is called the "second direction"; and the y-axis direction may be called the "third direction".

[0133] The "shake correction function" applied to camera modules of mobile devices such as smartphones or tablets can be the following function: moving the lens in a direction perpendicular to the optical axis or tilting the lens relative to the optical axis in order to eliminate vibration (or movement) caused by the user's hand tremors.

[0134] In addition, the "autofocus function" can be the following function: automatically focusing on the object by moving the lens along the optical axis according to the distance of the object, so as to obtain a clear image of the object on the image sensor.

[0135] Figure 1 This is an exploded view of a camera module 200 according to a first embodiment of the present invention; Figure 2 yes Figure 1 A stereoscopic view of the camera module 200; Figure 3a This is an exploded view of the lens driving device 100 according to the embodiment. Figure 3bThis is an exploded view of a lens driving device 100A according to another embodiment. Figure 3c This is an exploded view of a lens driving device 100B according to another embodiment. Figure 3d This is an exploded view of a lens driving device 100B according to another embodiment. Figure 4 yes Figure 2 A cross-sectional view of the camera module 200 taken along the AB direction; Figure 5 This is a perspective view of the base 210, filter 510, retainer 310, and circuit board 800 of the lens drive device 100. Figure 6 This is a top-view perspective view of the retainer 310; Figure 7 This is a bottom-view perspective view of the retainer 310; Figure 8a It is a perspective view of circuit board 800, circuit element 95, holder 310, and filter 610; and Figure 8b yes Figure 8a A plan view of the configuration.

[0136] Reference Figures 1 to 8b The camera module 200 may include a lens module 400, a lens drive device 100, a filter 610, a retainer 600, a circuit board 800, and an image sensor 810.

[0137] Here, "camera module" can be replaced with "image capture device" or "photography device", and holder 310 can be replaced with housing, base or "sensor base".

[0138] Furthermore, the lens module 400 can be referred to as a "lens," "lens unit," or "lens assembly." The lens module 400 is coupled to the lens drive device 100 and may include at least one of a lens and a lens barrel.

[0139] In addition, the camera module 200 is disposed between the lens drive device 100 (e.g., base 210) and the circuit board 810, and may also include an adhesive member 612 for connecting or attaching the lens drive device 100 (e.g., base 210) and the circuit board 810.

[0140] In addition, the camera module 200 may also include an adhesive member 613 disposed between the retainer 310 and the circuit board 800 (see Figure 4 ).

[0141] In addition, the camera module 200 may also include circuitry 95 (or electronic devices) set or mounted on the circuit board 800.

[0142] The lens module 400 can be positioned inside the housing 140 facing the opening 201 of the base 210 and can move in the direction of the optical axis.

[0143] For example, the lens module 400 can be mounted on the coil holder 110 of the lens drive device 100.

[0144] The lens drive device 100 can drive the lens module 400 and can move the lens module in the optical axis direction.

[0145] Camera module 200 can be a camera module for autofocus (AF) or a camera module for optical image stabilization (OIS). In essence, a camera module for AF can only perform autofocus functions. A camera module for OIS refers to a camera module that can perform both autofocus and optical image stabilization (OIS) functions.

[0146] Figure 3a The lens driving device 100 shown in the figure is a lens driving device for AF, but the implementation is not limited to this. In another embodiment, the lens driving device may be a lens driving device for OIS. Here, "for AF" and "for OIS" may have the same meaning as described in the camera module for AF and the camera module for OIS.

[0147] In addition, although the coil frame and housing are made of Figure 3a The coil frame and housing are supported by elastic members, but are not limited to this, and in another embodiment, the coil frame and housing may be supported by ball bearings or ball bearings.

[0148] Reference Figure 3a The lens driving device 100 may include: a housing 140; a coil holder 110 disposed inside the housing 140 and used to mount the lens module 400; a coil 120 disposed on the coil holder 110; a magnet 130 disposed in the housing 140 and facing the coil 120; at least one upper elastic member 150 connected to the upper portion of the coil holder 110 and the upper portion of the housing 140; at least one lower elastic member 160 connected to the lower portion of the coil holder 110 and the lower portion of the housing 140; and a base 210.

[0149] In another embodiment, the coil can be housed in the housing, and the magnet can be housed in the coil holder.

[0150] In addition, the lens driving device 100 may also include a cover member 300, which is coupled to the base 210 and provides space for accommodating the components of the lens driving device 100 and the base 210. The cover member 300 may include an upper plate 301, a side plate 302 connected to the upper plate 301, and an opening 303 formed in the upper plate 301.

[0151] The base 210 is located below the coil holder 110 (or housing 140). For example, the base 210 may be located below the lower elastic member 160.

[0152] The housing 140 may be disposed on the base 210. For example, the base 210 may be connected to the housing 140. In another embodiment, the base 210 and the housing 140 may be integrally constructed, and this construction may be defined as "base" or "housing".

[0153] The base 210 may have an opening 201 corresponding to the opening of the coil holder 110 and / or the opening of the housing 140, and the base 210 may have a shape that matches or corresponds to the cover member 300, such as a rectangular shape. For example, the opening 201 of the base 210 may be in the form of a through hole penetrating the base 210 in the optical axis direction.

[0154] A column portion (or protrusion) 216 protruding toward the housing 140 may be formed on the upper surface of the base 210.

[0155] For example, the base 210 may include a column portion 216 that protrudes upward from each corner portion or all corner portions to a predetermined height. For example, the base 210 may include four column portions disposed at the four corners. In another embodiment, the column portions 216 may be omitted.

[0156] The column portion of the base 210 can be inserted, fastened, or connected to a groove formed at the lower part of the corner of the housing 140 by an adhesive component such as epoxy resin or silicone resin.

[0157] For example, coil 120 may be connected to at least one of upper elastic member 150 and lower elastic member 160. For example, lower elastic member 160 may include two lower elastic members 160-1 and 160-2, such as a lower spring, and coil 120 may be connected to the two lower elastic members 160-1 and 160-2.

[0158] The upper elastic member 150 may include: a first inner frame (or a first inner portion) connected to the coil frame 110; a first outer frame (or a first outer portion) connected to the housing 140; and a first connecting portion connecting the first inner frame and the first outer frame.

[0159] In addition, the lower elastic members 160-1 and 160-2 may include: a second inner frame (or second inner portion) connected to the coil frame 110; a second outer frame (or second outer portion) connected to the housing 140; and a second connecting portion connecting the second inner frame and the second outer frame.

[0160] For example, one end of the coil 120 may be connected to the second inner frame of the first lower elastic member 160-1, and the other end of the coil 120 may be connected to the second inner frame of the second lower elastic member 160-2.

[0161] The first lower elastic member 160-1 may include a first terminal 64-1, and the second lower elastic member 160-2 may include a second terminal 64-2. The drive signal for the coil 120 can be input from the outside through the first terminal 64-1 of the first lower elastic member 160-1 and the second terminal 64-2 of the second lower elastic member 160-2.

[0162] For example, the first terminal 64-1 can be bent from the second outer frame 162 of the first lower elastic member 160-1 toward the outer surface (or "first outer surface") of the base 210.

[0163] The second terminal 64-2 can be bent from the second outer frame 162 of the second lower elastic member 160-2 toward the outer surface (or “first outer surface”) of the base 210.

[0164] At least a portion of each of the first terminal 64-1 and the second terminal 64-2 may be disposed on the outer surface of the retainer 310 and may be electrically connected to the circuit board 800.

[0165] The circuit board 800 can provide a drive signal to the coil 120 through the first terminal 64-1 of the first lower elastic member 160-1 and the second terminal 64-2 of the second lower elastic member 160-2, and the circuit board 800 can include pads (or terminals) electrically connected to the first terminal 64-1 and the second terminal 64-2 by solder or the like.

[0166] In another embodiment, the terminals may not be integrally formed with the lower elastic members 160-1 and 160-2, and may be separately provided on the base 210. The terminals and the outer frames of the lower elastic members 160-1 and 160-2 may be connected to each other by solder or the like, and may also be electrically connected to each other.

[0167] The coil 120 may be disposed on the outer surface of the coil holder 110. For example, the coil 120 may be wound in a loop on the outer surface of the coil holder 110, but is not limited thereto. A drive signal may be provided to the coil 120. The drive signal may be in the form of current or voltage, and may include at least one of a DC signal or an AC signal.

[0168] The magnet 130 may be disposed on a side portion of the housing 140. In other embodiments, the magnet may be disposed at a corner or corner portion of the housing.

[0169] The magnet 130 may include a plurality of magnets 130-1 to 130-4, and the magnet 130 disposed in the housing 140 may correspond to, face or overlap with the coil 120 in a direction perpendicular to the optical axis OA.

[0170] The movable part can move in the optical axis direction through the interaction between the magnet 130 and the coil 120 to which a drive signal is provided. AF drive can be achieved by controlling the displacement of the coil frame 110 in the optical axis direction by providing a drive signal to the coil 120.

[0171] The movable part may include a coil holder 110 and a structure connected to the coil holder 110. For example, the movable part may include the coil holder 110 and the coil 120. In addition, for example, the movable part may also include a lens module 400.

[0172] In addition, for AF feedback drive, the lens drive device 100 of the camera module 200 may also include: a sensing magnet (not shown) disposed in the coil holder; a housing; a base; or an AF position sensor (e.g., a Hall sensor, not shown) disposed in the cover member and corresponding to, opposite to or overlapping with the sensing magnet.

[0173] Furthermore, the lens drive device 100 may also include a circuit board for AF, which is disposed in the housing 140, and the AF position sensor is mounted on the circuit board. In this case, the circuit board can be electrically connected to the coil 120 and the AF position sensor, and a drive signal can be provided to each of the coil 120 and the AF position sensor through the circuit board.

[0174] When the AF position sensor is implemented as a Hall sensor, the drive signal is provided to the circuit board from the outside, and the drive signal can be provided to the coil 120 through the circuit board and two elastic members 160-1 and 160-2 connected to the circuit board.

[0175] When the AF position sensor is a driver IC that includes a Hall sensor, a drive signal is provided from the AF position sensor to the circuit board, and the drive signal can be provided to the coil 120 through two elastic members 160-1 and 160-2 connected to the circuit board.

[0176] The AF position sensor can output an output signal based on the result of the magnetic field strength of the sensing magnet detected by the movement of the coil frame 100, and the output of the AF position sensor can be transmitted to the circuit board and output to the outside through the circuit board.

[0177] In another embodiment, the AF position sensor can be disposed in the coil holder, and the sensing magnet can be disposed in the housing. Furthermore, the lens drive device 100 may also include a balancing magnet disposed in the coil holder 110 and located on the side opposite the sensing magnet.

[0178] According to another embodiment, the camera module may include a lens module 400 coupled to and fixing the lens module 400 instead of Figure 1 The housing of the lens drive device 100, and the housing can be attached to or attached to the upper surface of the circuit board 800.

[0179] The housing attached or fixed to the upper surface of the circuit board 800 will not move, and the housing will be in the state of being attached to the circuit board 800, and the lens module can be fixedly connected to the housing.

[0180] Figure 3b The lens drive device 100A shown in the figure can be a lens drive device for OIS.

[0181] Reference Figure 3b The lens driving device 100A may include: a housing 140A; a coil holder 110A disposed in the housing 140A and used for mounting the lens module 400; a first coil 120A disposed in the coil holder 110A; a magnet 130A disposed in the housing 140A and facing the first coil 120; at least one upper elastic member 150A connected to the upper portion of the coil holder 110A and the upper portion of the housing 140A; at least one lower elastic member 160A connected to the lower portion of the coil holder 110A and the lower portion of the housing 140A; a second coil 230 disposed below the housing 140A and / or the lower elastic member 160A; a circuit board 250 disposed below the second coil 230; and a base 210 disposed below the circuit board 250.

[0182] The lens driving device 100A may also include a support member 220 that connects the elastic member 150A and the circuit board 250.

[0183] The lens driving device 100A may further include a sensing magnet 180 disposed on the coil holder 110A and a first position sensor 170 disposed in the housing 140. Furthermore, the lens driving device 100A may also include a balancing magnet 185 disposed in the coil holder 110A.

[0184] right Figure 3a The description of the coil frame 110, coil 120, magnet 130, housing 140, AF position sensor, sensing magnet, and balancing magnet can be applied to Figure 3b The implementation method.

[0185] The lens driving device 100A may also include a circuit board 190 disposed on the housing 140, and the circuit board 190 may be disposed on any side portion of the housing 140A.

[0186] The first position sensor 170 can be disposed in the circuit board 190 and can be electrically connected to the circuit board 190. Furthermore, for Figure 3a The description of the AF position sensor and circuit board can be applied to Figure 3b The implementation method.

[0187] Furthermore, the lens driving device may also include a capacitor 195 disposed in the circuit board 190. The capacitor 195 is connected in parallel with two terminals of the circuit board 190, which are electrically connected to two input terminals of the first position sensor 170 to provide power or a drive signal. Alternatively, the capacitor 195 can be connected in parallel with the two input terminals of the first position sensor 170. The capacitor 195 can protect the first position sensor 170 from externally introduced high-frequency noise or ESD.

[0188] The upper elastic member 150A may include a plurality of upper elastic members 150-1 to 150-4. The plurality of elastic members may be electrically connected to the circuit board 190. For example, four upper elastic members 150-1 to 150-4 may be coupled and electrically connected to a corresponding one of the first to fourth terminals of the circuit board 190.

[0189] The first position sensor 170 can be implemented as a Hall sensor alone or as a driver IC that includes a Hall sensor.

[0190] The first position sensor 170 may include four terminals, and the four terminals of the first position sensor may be electrically connected to the first to fourth terminals of the circuit board 190.

[0191] Magnet 130A may include a plurality of magnets 130-1A to 130-4A, which are disposed at the corners of housing 140A, but are not limited thereto, and in another embodiment, Figure 3a The magnet shown can be installed on the side portion of the housing 140A.

[0192] The support member 220 may include a plurality of support members 220-1 to 220-4.

[0193] Support members 220-1 to 220-4 may be provided at the corner portion or corner of the housing 140A. The corner of the housing 140 may be formed with a groove or hole to avoid spatial interference with the support member 220, and the support member 200 may pass through the groove or hole.

[0194] One end of each of the plurality of support members 220-1 to 220-4 may be connected to a corresponding one of the plurality of upper elastic members 150-1 to 150-4 and may be electrically connected.

[0195] Furthermore, one end of each of the plurality of support members 220-1 to 220-4 may be connected to the circuit board 250 or the circuit member 231 and may be electrically connected to each other.

[0196] Circuit board 190 can be electrically connected to circuit board 250 via a plurality of upper elastic members 150-1 to 150-4 and support members 220-1 to 220-4, and therefore, the first position sensor 170 can be electrically connected to circuit board 250.

[0197] The lower elastic member 160 may include two lower elastic members 160-1A and 160-2A, and may be electrically connected to the first coil 120A. The first coil 120A may be electrically connected to the circuit board 250 or the first position sensor 170.

[0198] The drive signal can be provided or transmitted from the first position sensor 170 or the circuit board 250 to the first coil 120.

[0199] The second coil 230 may be disposed below the coil holder 110A and / or the housing 140A. For example, the second coil 230 may be disposed below the magnet 130A.

[0200] The second coil 230 may include magnets 130-1A to 130-4A disposed in housing 140A and coil units 230-1 to 230-4 facing each other or overlapping each other in the optical axis direction.

[0201] For example, the second coil 230 may include a circuit component 231 disposed in the circuit board 250 and a plurality of coil units 230-1 to 230-4 formed in the circuit component 231. Here, the circuit component 231 may be referred to as a "board", "circuit board" or "coil board". In another embodiment, the second coil 230 may include the circuit component 231 and the coil units 230-1 to 230-4.

[0202] The second coil 230 can be electrically connected to the circuit board 250 and receive power or drive signals from the circuit board 250.

[0203] Through the interaction between magnets 130-1A to 130-4A and second coils 230-1 to 230-4 provided with a drive signal, housing 140A can move in a second and / or third direction, such as along the X-axis and / or Y-axis, thereby enabling hand shake correction.

[0204] The circuit board 250 is disposed on the upper surface of the base 210A, and may have an opening corresponding to the coil holder 110A, the housing 140A, and / or the opening 201A of the base 210. The opening of the circuit board 250 may be a through hole or a hollow portion.

[0205] The circuit board 250 may include: a body disposed on the upper surface of the base 210A and having an opening; and at least one terminal surface 253 bent from the body toward the outer surface of the base 210A. A plurality of terminals 251 for receiving electrical signals from the outside or transmitting electrical signals to the outside may be formed on the terminal surface 253 of the circuit board 250.

[0206] Multiple terminals 251 of the circuit board 250 can be electrically connected to at least one of the first coil 120, the first position sensor 170, the circuit board 190, the second position sensor 240, and the second coil 230.

[0207] The base 210A may include an opening 201A. (Regarding...) Figure 3a The description of the base 210 of the implementation method can be applied to Figure 3b In another embodiment, the base 210A and the housing 140A may be integrally constructed, and this construction may be defined as "base" or "housing".

[0208] To avoid spatial interference with the support member 220, a groove, a concave groove, or a hole 212 may be formed at the corner of the base 210A.

[0209] The lens drive device 100A may also include a second position sensor 240 electrically connected to the circuit board 250.

[0210] The second position sensor 240 may include two sensors 240a and 240b and may be electrically connected to the circuit board 250. Each of the two sensors 240a and 240b may be implemented individually as a position detection sensor, such as a Hall sensor, or may be implemented as a driver including a Hall sensor. The base 210A may have a recess 215 for receiving the sensors 240a and 240b.

[0211] When the housing 140 moves in a direction perpendicular to the optical axis, each of the sensors 240a and 240b detects the magnetic field strength of the magnets 130-1A to 130-4A and can output a signal based on the detected result. The output signal of each of the sensors 240a and 240b can be used to detect displacement in a direction perpendicular to the optical axis of the housing 140A, and the control units 830 and 780 can use the output signals of the sensors 240a and 240b to perform OIS feedback shakiness correction.

[0212] Figure 3c The lens driving device 100B shown in the figure can be a spherical lens driving device.

[0213] Reference Figure 3c The lens drive device 100B may include: a housing 1400; a coil holder 1230 disposed inside the housing 1400 and for connection to the lens module 400; a coil 1320 disposed in the housing 1400 and a magnet 1310 disposed in the coil holder 1230; a spherical member 1600 disposed between the housing 1400 and the coil holder 1230; and a yoke 1340 disposed in the housing 1400. The spherical member 1600 may be replaced by a "spherical component" or a "ball bearing".

[0214] The lens drive device 100B may also include a cover member 1100, which is coupled to the housing 1400 to cover the outer surface of the housing 1400.

[0215] The lens driving device 100B may further include a position sensor 1350 disposed within the housing 1400. Additionally, the lens driving device 100B may also include a circuit board 1330 disposed within the housing 1400, and the position sensor 1350 may be mounted in and electrically connected to the circuit board 1330. Figure 3a and Figure 3b The description of the position sensor can be applied to Figure 3c Position sensor 1350.

[0216] The coil holder 1230 may have an opening for connection with the lens module, and the opening of the coil holder 1230 may be in the form of a through hole penetrating the coil holder in the optical axis direction.

[0217] The magnet 1310 can be disposed on the outer surface of the coil holder 1230. For example, a groove for disposing of the magnet 1310 can be formed on the outer surface of the coil holder 1230.

[0218] The coil 1320 may be disposed on a side portion 1420 of the housing 1400 facing the magnet 1310. For example, a groove for arranging the magnet 1310 may be formed in a side portion of the housing 1400.

[0219] In another embodiment, the magnet can be disposed in the housing and the coil can be disposed in the coil holder.

[0220] The housing 1400 may include an opening 1401 corresponding to the lens module 400, and the opening 1401 of the housing 140 may be in the form of a through hole penetrating the housing 1400 in the optical axis direction.

[0221] Coil 1320 can be electrically connected to circuit board 1330.

[0222] The spherical member 1600 can support relative movement of the coil holder 1230 to the housing 1400. At least a portion of the spherical member 1600 can contact at least a portion of the housing 1400 and at least a portion of the coil holder 1230, and can reduce friction between the housing 1400 and the coil holder 1230.

[0223] The yoke 1340 may be disposed on a side portion of the housing 1400 and may face the magnet 1310 in a direction perpendicular to the optical axis. For example, the yoke 1340 may be disposed on the outer side of the circuit board 1330 and the coil 1320 may be disposed between the yoke 1340 and the magnet 1310.

[0224] The yoke 1340 can be made of a material capable of generating an attractive force between the magnet 1310, such as a magnet or metal, and correspondingly, the attractive force can act between the yoke 1340 and the magnet 1310 in a direction perpendicular to the optical axis. Through this attractive force, the spherical member 1600 can maintain contact with the coil frame 1230 and the housing 1400.

[0225] For example, a first receiving groove 1410 may be formed in the housing 1400 for receiving at least a portion of the spherical member 1600 or for disposing at least a portion of the spherical member 1600 therein.

[0226] In addition, for example, a second receiving groove 1231 for receiving at least another portion of the spherical member 1600 or for disposing at least another portion of the spherical member 1600 therein may be formed in the coil holder 1230.

[0227] For example, a first receiving groove 1410 may be formed on the inner side or inner surface of at least one corner of the housing 1400, while a second receiving groove 1231 may be formed on the outer side or outer surface of at least one corner of the coil holder 1230. The first receiving groove 1410 and the second receiving groove 1231 may face each other or be opposite each other, a spherical member 1600 may be disposed between the first receiving groove 1410 and the second receiving groove 1231, and the first receiving groove 1410 and the second receiving groove 1231 may contact each other.

[0228] The number of spherical pieces 1600 disposed between the first receiving groove 1410 and the second receiving groove 1231 can be one or more.

[0229] For example, in Figure 3c In this case, the first receiving groove may be formed in each of the two corners of the housing 1400 that face each other or are opposite to each other, while the second receiving groove may be formed in each of the two corners of the coil holder 1230 that correspond to the two corners of the housing 140.

[0230] In another embodiment, a first receiving groove may be formed in each of the four corners of the housing 1400, while a second receiving groove may be formed in each of the four corners of the coil holder 1230 corresponding to the four corners of the housing 140.

[0231] In another embodiment, a first receiving groove may be formed in each of two corners of a side portion 1420 adjacent to the housing 1400, in which the coil 1320 and / or circuit board 1330 are disposed.

[0232] Furthermore, a second receiving groove may be formed in each of the two corners of the coil holder 1230 that correspond to the two corners of the side portion 1420 of the adjacent housing 1400 of the two housings 1400.

[0233] In another embodiment, a first receiving groove may be formed in each of two corners of the side portion 1420 adjacent to the opposite side of the side portion 1420 of the housing 1400. A second receiving groove may be formed in each of two corners of the coil holder 1230 corresponding to the two corners of the side portion 1420 adjacent to the opposite side of the side portion 1420 of the housing 1400.

[0234] like Figure 3c As shown, the housing 1400 can be implemented as a single body, but is not limited thereto.

[0235] In another embodiment, housing 1400 may include a housing and a base coupled to the housing, such as Figure 3a and Figure 3b As shown in the diagram. At this time, the base may have the same or similar opening as the opening 1401 of the housing 1400.

[0236] In the following description, for ease of description, the base 210 of the lens drive device 100 will be described as an example, but is not limited thereto. The following description can be applied or similarly applied to the base 210A of the lens drive device 100A and the housing 1400 of the lens drive device 100B.

[0237] Figure 3d It can be Figure 3c Modified implementation method 100C1.

[0238] exist Figure 3d In the middle, the spherical member 1600 may be disposed between two corners of the side portion 1420 of the housing 1400 on which the coil 1320 and / or circuit board 1330 are disposed and the outer surface of the coil holder 1230 corresponding to the corners.

[0239] For example, in Figure 3d In the case of housing 1400, a first receiving groove 1410 may be formed in each of two corners of the side portion 1420 of housing 1400 adjacent to the housing 1400 in which the coil 1320 and / or circuit board 1330 are disposed, and a second receiving groove 1231 may be formed in the corner of the coil holder 1230 corresponding to the two corners of housing 1400.

[0240] The magnet 1310A can be disposed between the spherical members 1600 that are housed in the second receiving grooves 1231 formed at the two corners of the coil frame 1230. For example, the magnet 1310A can be disposed between the two second receiving grooves 1231 formed at the two corners of the coil frame 1230.

[0241] The retainer 310 may be disposed on the upper surface of the circuit board 800. The retainer 310 may be disposed on the inner side of the base 210. The retainer 310 may be referred to as "base", "inner base" or "sensor base".

[0242] For example, the retainer 310 may be provided at the inner side of the opening 201 of the base 210 and the opening 201A of the base 210A of the lens drive device 100, or at the opening 1401 of the housing 1400.

[0243] For example, the retainer 310 can be located below the lens module 400.

[0244] Reference Figures 5 to 8b The holder 310 may include an opening 501 corresponding to the image sensor 810.

[0245] For example, the opening 501 of the retainer 310 may be located below the opening 201 of the base 210 and may face the opening 201 of the base 210 and / or the lens module 400 in the optical axis direction.

[0246] The opening 501 of the retainer 310 can penetrate the retainer 310 in the optical axis direction, and can be represented by replacing it with "hole", "hollow part" or "through hole".

[0247] For example, opening 501 may penetrate the center of retainer 310 and may be configured to correspond to or face the active region of image sensor 810 (e.g., image sensor 810).

[0248] The retainer 310 is recessed from the upper surface and may include a seat portion 500 for mounting the filter 610, and the filter 610 may be disposed inside the seat portion 500.

[0249] The opening 501 of the retainer 310 may correspond to or be opposite to the openings of the base 201 and 201A or the opening 1401 of the housing 1400. For example, the size or area of ​​the opening 501 of the retainer 310 may be smaller than the size or area of ​​the openings of the base 201 and 201A or the opening 1401 of the housing 1400.

[0250] The adhesive component 612 can be disposed between the upper surface of the circuit board 800 and the bases 210 and 210A of the lens drive devices 100, 100A and 100B or the housing 1400.

[0251] For example, the adhesive member 612 may be disposed between the upper surface of the circuit board 800 and the lower surface of the bases 210 and 210A of the lens drive devices 100, 100A and 100B or the lower surface of the housing 1400. The bases 210 and 210A or the housing 1400 may be coupled to or attached to the upper surface of the circuit board 800.

[0252] For example, the bases 210 and 210A or the housing 1400 may be supported by the upper surface of the circuit board 800. For example, the lower portion of the bases 210 and 210A or the housing 1400 may be attached to the upper surface of the circuit board 400.

[0253] The seat portion 500 may be in the form of a recess, cavity, or hole recessed from the upper surface 51a of the retainer 310, but is not limited thereto.

[0254] The seat portion 500 of the retainer 310 may include a bottom surface 511 and an inner surface 512, and the edge portion of the filter 610 may be disposed on the bottom surface 511 of the seat portion 500 of the retainer 310.

[0255] The bottom surface 511 may have a stepped difference relative to the upper surface 51a of the holder 310 in the optical axis direction. For example, the stepped difference or distance between the upper surface 51a and the bottom surface 511 of the holder 310 may be less than or equal to the thickness of the filter 610 (or the length of the filter 610 in the optical axis direction). In another embodiment, the stepped difference or distance between the upper surface 51a and the bottom surface 511 of the holder 310 may be greater than the thickness of the filter 610.

[0256] For example, the bottom surface 511 may be located below the upper surface 51a of the retainer 310.

[0257] For example, in the bottom surface 511 and the upper surface 51a of the retainer 310, the bottom surface 511 can be positioned closer to the lower surface 51b of the retainer 312.

[0258] For example, the inner surface 512 may connect the upper surface 51a and the bottom surface 511 of the seat portion 500. The interior angle between the inner surface 512 and the bottom surface 511 may be a right angle, but is not limited thereto, and in another embodiment, the interior angle may be an obtuse angle or an acute angle. For example, the inner surface 512 may have a chamfered shape.

[0259] For example, the opening 501 can be formed in the bottom surface 511 of the seat portion 500 and can be configured to be spaced apart from the inner surface 512 of the seat portion 500.

[0260] Based on the horizontal and vertical lengths of the filter 610, the area of ​​the opening 501 of the filter 610 can be smaller than the area of ​​the filter 610, so that the filter 610 can be disposed on the bottom surface 511 of the seat portion 500 of the holder 310.

[0261] For example, the edge portion of the lower surface of the filter 610 may face the bottom surface 511 of the seat portion 500, and may be joined or attached to the bottom surface 511 by an adhesive or the like.

[0262] For example, the inner surface 512 of the seat portion 500 of the retainer 310 may face or be opposite to the side surface of the filter 610.

[0263] For example, the inner surface 512 of the seat portion 500 may include four inner surfaces, but is not limited thereto, and in another embodiment, the inner surface 512 of the seat portion may have three or more inner surfaces.

[0264] The retainer 310 may include a foreign matter collection portion 506 in the form of a recess that extends from the upper surface 51a. The foreign matter collection portion 506 may be positioned adjacent to the seat portion 500 or the filter 610, but is not limited thereto.

[0265] For example, the foreign object collection portion 506 may have an opening that opens toward the inner surface 512 of the seat portion 500, but is not limited thereto. In another embodiment, the foreign object collection portion may also be in the form of a recess without an opening.

[0266] For example, the foreign object collection portion 506 may be located between the seat portion 500 and the outer surface of the retainer 310.

[0267] The foreign object collection section 506 can collect foreign objects introduced from the lens drive device 100. The foreign object collection section 506 can be represented by replacing it with a dust collector. Figure 6 In this embodiment, the retainer 310 may include four foreign matter collection portions formed by the four inner surfaces of the adjacent seat portion 500, but is not limited thereto, and in another embodiment, one or two or more foreign matter collection portions may be present.

[0268] The foreign object collection section 506 may be in the shape of a groove and may include a bottom surface and a side surface.

[0269] The bottom surface of the foreign object collection section 506 may have a stepped difference in the optical axis direction relative to the upper surface 51a of the retainer 310.

[0270] For example, the step difference (e.g., "first step difference or first height difference") between the upper surface 51a of the retainer 310 and the bottom surface of the foreign matter collection portion 506 may be smaller than the step difference (e.g., "second step difference or second height difference") between the upper surface 51a of the retainer 310 and the bottom surface 511 of the seat portion 500. In another embodiment, the first step difference and the second step difference may be equal to each other.

[0271] Furthermore, the retainer 310 may include a recessed portion 508 disposed in the corner region of the inner surface 512 of the seat portion 500. The recessed portion 508 may have a structure that is recessed from the center of the opening 501 of the seat member 500 along a direction toward the corner region (or corner) of the inner surface 512 of the seat portion 500.

[0272] For example, when viewed from above, the shape of the recessed portion 508 can be semi-circular, sector-shaped, polygonal (e.g., square), or circular, but is not limited to these.

[0273] The recessed portion 508 can prevent adhesives, such as UV epoxy resin, used to attach the filter 610 to the base portion 500 from overflowing from the base portion 500.

[0274] The filter 610 can be disposed inside the base portion 500. The filter 610 can have a plate shape or a flat rectangular shape, but is not limited thereto.

[0275] The shape of the opening 501 of the retainer 310 can be matched with the shape of the filter 610 or the shape of the image sensor (e.g., the shape of the active area of ​​the image sensor).

[0276] For example, as viewed from above, the opening 501 of the retainer 310 may be polygonal (e.g., quadrilateral) in shape, but is not limited thereto, and in another embodiment may be circular or elliptical.

[0277] Light passing through lens module 400 can pass through filter 610 to be incident on image sensor 810.

[0278] Filter 610 can be used to prevent light of a specific frequency band from passing through lens module 400 from incident on image sensor 810. For example, filter 610 can be an infrared cut-off filter, but is not limited thereto, and in another embodiment, the filter can be an infrared pass-through filter. For example, filter 610 can be configured to be parallel to the xy plane perpendicular to the optical axis OA.

[0279] For example, filter 610 can be a glass filter.

[0280] An adhesive may be provided between the filter 610 and the retainer 310, and the adhesive may bond the filter 610 and the retainer 310 together. For example, the adhesive may be an epoxy resin, a thermosetting adhesive (e.g., a thermosetting epoxy resin), or a UV-curing adhesive (e.g., a UV-curing epoxy resin), etc.

[0281] For example, the filter 610 can be attached to the bottom surface 511 of the seat portion 500 of the retainer 310 by an adhesive (not shown).

[0282] The camera module 200 may also include a blocking member 1500 disposed on the filter 610. The blocking member 1500 may be disposed on the upper surface of the filter 610. The blocking member 1500 can be referred to as a "blocking unit" instead.

[0283] For example, the blocking member 1500 may be disposed in the edge region of the upper surface of the filter 610 and may be used to block at least a portion of the light that passes through the lens module 400 and is incident toward the edge region of the filter 610 from passing through the filter 610. For example, the blocking member 1500 may be attached to or bonded to the upper surface of the filter 1610 by an adhesive.

[0284] For example, when viewed from above, filter 610 may be quadrilateral, and blocking member 1500 may be formed symmetrically with respect to filter 610 along each side of the upper surface of filter 610. For example, blocking member 1500 may be formed to have a constant width at each side of the upper surface of filter 610. For example, blocking member 1500 may be formed of an opaque material. For example, blocking member may be provided in the form of an opaque adhesive material applied to filter 610 or in the form of a film attached to filter 610.

[0285] The active regions of the filter 610 and the image sensor 810 can be configured to face or overlap each other in the optical axis direction. For example, the blocking member 1500 may not overlap with the active region of the image sensor 810 in the optical axis direction. Furthermore, for example, the blocking member 1500 may at least partially overlap with the terminals and / or wires 81 of the circuit board 800 in the optical axis direction.

[0286] Since the blocking member 1500 is configured to at least partially overlap with the terminals and / or wires 81 of the circuit board 800 in the optical axis direction, flare can be prevented by blocking light pointing towards the terminals and / or wires 81 of the circuit board 800 in the light passing through the lens module 400, and accordingly, the image formed on the image sensor 810 can be prevented from being distorted or the image quality can be prevented from deteriorating.

[0287] For example, the blocking member 1500 may overlap with the bottom surface 511 of the retainer 310 in the optical axis direction.

[0288] Circuit board 800 may be a printed circuit board (PCB). Circuit board 800 may be a printed circuit board 3010 according to a third embodiment of the present invention.

[0289] The circuit board 800 is disposed at the lower part of the holder 310 and the base 210 of the lens drive device 100.

[0290] The circuit board 800 may include a first board 811, a second board 812 connected to the first board 811, and a third board 813 connected to the second board 812.

[0291] For example, the first board 811 and the third board 192 may be rigid printed circuit boards, and the second board 812 may be a flexible printed circuit board electrically connecting the first board 811 and the third board 813, but is not limited thereto. In another embodiment, at least one of the first to third boards may be a rigid printed circuit board or a flexible printed circuit board. In another embodiment, the first to third boards may be an integrally implemented board.

[0292] The circuit board 800 may include a connector (not shown) formed in the third board 813 for electrical connection to an external device.

[0293] The image sensor 810 and circuit element 95 can be disposed in the circuit board 800.

[0294] For example, the image sensor 810 and circuit element 95 may be mounted or attached to the upper surface of the circuit board 800.

[0295] For example, circuit element 85 can be set or installed in the first board 811.

[0296] Furthermore, the circuit board 800 may include at least one terminal disposed or formed in the first board 811. For example, the number of terminals of the circuit board 800 may be multiple, and the multiple terminals of the circuit board 800 may be electrically connected to the image sensor 810 and the circuit element 95.

[0297] For example, the holder 310, the image sensor 810, and the circuit element 95 can be disposed on the first board 811.

[0298] Image sensor 810 can be mounted on circuit board 800 and can be electrically connected to circuit board 800. Image sensor 810 can be electrically connected to circuit board 800 via wire 81. For example, one end of wire 81 can be connected to a terminal formed on the upper surface of image sensor 810, and the other end of wire 81 can be connected to a terminal formed on the upper surface of circuit board 800.

[0299] For example, the image sensor 810 may be located on the inner side of the retainer 310.

[0300] For example, the image sensor 810 may be disposed inside the opening 501 of the retainer 310. Alternatively, the image sensor 810 may be disposed below the opening 501 of the retainer 310.

[0301] Image sensor 810 may include an active region (or effective image region) into which light passing through filter 610 is incident to form an image included in the light.

[0302] The optical axis of the image sensor 810 and the optical axis of the lens module 400 can be aligned. The image sensor 810 can convert light incident on the active area into an electrical signal and output the converted electrical signal.

[0303] For example, the active regions of filter 610 and image sensor 810 can be spaced apart from each other facing each other in the optical axis OA direction.

[0304] Circuit element 95 can be electrically connected to the first board 811 and can form a control unit for controlling the image sensor 810 and the lens drive device 100.

[0305] For example, circuit element 95 may include passive elements and active elements.

[0306] For example, circuit element 95 may include at least one of a capacitor, memory, controller, sensor (e.g., motion sensor), or integrated circuit (IC).

[0307] The circuit board 800 can be electrically connected to the lens drive device 100.

[0308] Alternatively, in another embodiment, the circuit board 800 may be electrically connected to the circuit board of the lens drive device.

[0309] For example, a drive signal can be provided to the coil 120 of the lens drive device 100 via the circuit board 800. Alternatively, in another embodiment, a drive signal can be provided to the AF position sensor (or OIS position sensor) via the circuit board 800. Furthermore, the output of the AF position sensor (or / and the OIS position sensor) can be transmitted to the circuit board 800.

[0310] Despite Figure 1 Not shown, but another embodiment may include a reinforcing member disposed below the circuit board 800 and attached to the lower surface of the circuit board 800 and / or the lower surface of the image sensor. In this case, the reinforcing member is a plate-like member with a predetermined thickness and rigidity, which can stably support the circuit board and the image sensor, and can suppress damage to the circuit board caused by external impacts or contact. Furthermore, the reinforcing member can improve heat dissipation from the image sensor to the outside.

[0311] For example, the reinforcing member can be formed of a metal material with high thermal conductivity, such as SUS or aluminum, but is not limited thereto. In another embodiment, the reinforcing member can be formed of glass epoxy resin, plastic, or synthetic resin.

[0312] For example, in an embodiment where a reinforcing member is provided, the circuit board 800 may include an opening or a through hole, and the image sensor may be disposed inside the opening or through hole of the circuit board, wherein the image sensor 810 may be disposed on the upper surface of the reinforcing member.

[0313] In addition, the reinforcement can be used as a ground wire to protect the camera module from electrostatic discharge (ESD) by being electrically connected to the ground terminal of the circuit board 800.

[0314] The adhesive member 612 can connect or attach the base 210 of the lens drive device 100 to the circuit board 800. For example, the adhesive member 612 can be disposed between the lower surface of the base 210 and the upper surface of the first circuit board 811, and can attach the lower surface of the base 210 and the upper surface of the first circuit board 811 to each other.

[0315] In addition to the adhesive effect described above, the adhesive member 612 can also be used to prevent foreign objects from being introduced into the lens drive device 100. For example, the adhesive member 612 can be epoxy resin, thermosetting adhesive, or UV-curing adhesive.

[0316] For example, the adhesive member 612 may be configured to have an annular shape on the upper surface of the first circuit board 811, but is not limited thereto.

[0317] The retainer 310 is mounted on the circuit board 800 and can support the filter 610.

[0318] For example, the lower surface of the base 210 of the lens drive device 100 and the upper surface of the circuit board 800 may face each other in the optical axis direction, and the two may be attached to each other by adhesive member 612.

[0319] For example, the lower surface of the base 210 of the lens drive device 100 can contact the upper surface of the circuit board 800 and can be supported by the upper surface of the circuit board 800.

[0320] Reference Figure 6 and Figure 7 The retainer 310 may include the bottom surface 511 of the connecting seat portion 500 and the side surface 513 of the lower surface 51b.

[0321] For example, the side surface 513 may be perpendicular to the lower surface 51b of the retainer 310, but is not limited thereto. In another embodiment, the interior angle formed by the side surface 513 and the lower surface 51b of the retainer 310 may be an acute angle. In another embodiment, the interior angle formed by the side surface 513 and the lower surface 51b of the retainer 310 may be an obtuse angle. For example, the side surface 513 may have a chamfered shape.

[0322] The lower surface 51b of the retainer 310 may include a first region 58A located on the opposite side of the bottom surface 511 of the seat portion 500.

[0323] For example, the bottom surface 511 of the seat portion 500 of the retainer 310, the first region 58A of the lower surface 51b of the retainer 310, and the side surface 513 can form a "support portion 38A" (see reference). Figure 13 The support portion 38A is configured to support the filter 610. At this time, the lower surface of the support portion 38A can be attached or connected to the upper surface of the circuit board 800 by means of the adhesive member 613.

[0324] In addition, the lower surface 51b of the retainer 310 may include a second region 58B located between the first region 58A and the periphery (or edge) of the lower surface 51b.

[0325] For example, the second region 58B can be located on the outer side of the first region 58A.

[0326] For example, the second region 58B can connect the first region 58A and the outer surface of the retainer 310.

[0327] For example, the first region 58A may overlap with the bottom surface 511 of the seat portion 500 in the optical axis direction. In addition, the second region 58B may not overlap with the bottom surface 511 of the seat portion 500 in the optical axis direction.

[0328] For example, the first region 58A may overlap with the edge portion of the filter 510 disposed on the bottom surface 511 of the seat portion 500. Furthermore, for example, the second region 58B may not overlap with the edge portion of the filter 510 disposed on the bottom surface 511 of the seat portion 500.

[0329] For example, the first region 58A may be formed along the periphery of the opening 501 of the retainer 310 and may be formed adjacent to the opening 501. For example, when viewed from below, the first region 58A may have a shape that coincides with the opening 501, such as a polygonal (e.g., quadrilateral) shape.

[0330] The first region 58A can be connected to the upper surface of the circuit board 800. In addition, the second region 58B can be connected to the upper surface of the circuit board 800.

[0331] For example, at least a portion of the adhesive member 613 may be disposed between the first region 58A and the upper surface of the circuit board 800, and the first region 58A of the lower surface 51b of the retainer 310 may be attached to the upper surface of the circuit board 800.

[0332] Furthermore, at least another portion of the adhesive member 613 may be disposed between the second region 58B and the upper surface of the circuit board 800, and the second region 58B of the lower surface 51b of the retainer 310 may be attached to the upper surface of the circuit board 800.

[0333] A groove 53 may be formed in the lower surface 51b of the retainer 310. The groove 53 of the retainer 310 may be recessed from the lower surface 51b.

[0334] At least a portion of the circuit element 95 may be accommodated or disposed inside the recess 53.

[0335] The groove 53 may overlap with at least a portion of the circuit element 95 in the optical axis direction and may be used to prevent the holder 310 and the circuit element 95 from interfering with each other in space.

[0336] For example, circuit element 95 may be positioned between holder 310 and base 210, and may overlap with at least a portion of lens module 400 in the optical axis direction. Alternatively, for example, at least a portion of circuit element 95 may overlap with coil holder 100 of lens drive device 100 in the optical axis direction.

[0337] For example, at least a portion of the retainer 310 and at least a portion of the circuit element 95 may overlap each other in the optical axis direction, at least a portion of the circuit element 95 may be located below the groove 53 of the retainer 310, and the circuit element 95 and the retainer 310 are spatially avoided from each other by the groove 53 of the retainer 310.

[0338] For example, the groove 53 may include: a lower surface 51b and a first surface 53a of a retainer 310 having a stepped difference in the optical axis direction; and a second surface 53b for connecting the first surface 53a and the lower surface 51b. The first surface 53a can be represented by replacing it with "bottom surface", and the second surface 53b can be represented by replacing it with "side surface".

[0339] The second surface 53a may be inclined relative to the first surface 53b. For example, the second surface 53a may have a chamfered shape.

[0340] The first surface 53a can be positioned above the lower surface 51b of the retainer 310. For example, of the first surface 53a and the lower surface 51b, the first surface 53a can be closer to the upper surface 51a of the retainer 310.

[0341] For example, the groove 53 may not overlap with the first region 58A of the lower surface 51b of the retainer 310 in the optical axis direction.

[0342] For example, a groove 53 may be formed in a second region 58B of the lower surface 51b of the retainer 310. This is to prevent the height or step difference of the bottom surface 511 required for placing the filter 610 from being limited by the formation of the groove 53.

[0343] For example, refer to Figure 4 The first surface 53a can be positioned higher than the bottom surface 511 of the seat portion 500. For example, in the bottom surface 511 of the seat portion 500 and the first surface 53a of the groove 53, the first surface 53a can be closer to the upper surface 51a of the retainer 310.

[0344] Furthermore, for example, in the bottom surface 511 of the seat portion 500 and the first surface 53a of the groove 53, the bottom surface 511 may be closer to the lower surface 51b of the retainer 310.

[0345] For example, the groove 53 may include an opening that opens toward the outer surface of the retainer 310, but is not limited thereto, and in other embodiments, the opening may be omitted.

[0346] Reference Figure 7 The groove 53 may include a plurality of grooves spaced apart from each other. At least one groove may be formed in at least one of the four sides of the lower surface 51b of the base 210. For example, two grooves 53 spaced apart from each other may be formed on each of the four sides of the lower surface of the base 210, but it is not limited thereto, and one or more grooves may be formed in at least one of the four sides.

[0347] Reference Figures 4 to 6The base 210 and the retainer 310 can be disposed on the upper surface of the circuit board 800. The retainer 310 can be disposed on the inner side of the base 210 or inside the base 210.

[0348] For example, the lower portion of the base 210 may be configured to surround the retainer 310 on the upper surface of the circuit board 800.

[0349] For example, at least a portion of the base 210 may overlap with the holder 310 in a direction perpendicular to the optical axis.

[0350] Furthermore, for example, at least a portion of the base 210 may overlap with the image sensor 810 in a direction perpendicular to the optical axis.

[0351] Furthermore, for example, at least a portion of the base 210 may overlap with the filter 610 in a direction perpendicular to the optical axis.

[0352] For example, the retainer 310 may be spaced apart from the base 210. In other embodiments, the retainer and the base may be in contact with each other.

[0353] For example, the base 210 may overlap with the image sensor 810 in a direction perpendicular to the optical axis.

[0354] For example, the retainer 310 may be disposed inside the opening 201 of the base 210. Alternatively, for example, the retainer 310 may be disposed below the opening 201 of the base 210.

[0355] For example, the opening 501 of the retainer 310 may be smaller than the opening 201 of the base 210.

[0356] For example, the retainer 310 may be disposed between the opening 201 of the base 210 and the upper surface of the circuit board 800.

[0357] For example, the base 210 may have a recess or stepped portion 57 recessed from its lower surface. The stepped portion 57 of the base 210 may include: a lower surface 54 and a first surface 57a of the base 210 having a stepped difference in the optical axis direction; and a second surface 57b for connecting the first surface 57a and the lower surface 54.

[0358] For example, the first surface 57a may be positioned above the upper surface of the retainer 310, but is not limited thereto, and in another embodiment, the first surface 57a may be at the same height as the upper surface 51a of the retainer 310, or may be positioned below the upper surface 51a of the retainer 310.

[0359] For example, at least a portion of the groove or stepped portion 57 of the base 210 may overlap with the circuit element 95 in the optical axis direction, and spatial interference between the circuit element 95 and the base 210 may be avoided by the groove or stepped portion. In the base according to another embodiment, the aforementioned groove or stepped portion 57 may be omitted.

[0360] For example, at least a portion of the circuit element 95 may overlap with the coil frame 110 or lens module 400 of the lens drive device 100 in the optical axis direction.

[0361] The lower surface 54 of the base 210 and the first region of the upper surface of the circuit board 800 can be connected to each other by an adhesive member 612, and the lower surface 51b of the retainer 310 and the second region of the upper surface of the circuit board 800 can be connected to each other by an adhesive member 613. For example, the second region of the circuit board 800 can be located inside the first region of the circuit board 800.

[0362] Figure 9a This is a top perspective view of the retainer 310-1 in another embodiment; Figure 9b yes Figure 9a A bottom-view perspective view of the retainer 310-1; and Figure 10 It includes Figure 9a Cross-sectional view of the camera module of the retainer 310-1.

[0363] Reference Figures 9a to 10 The retainer 310-1 may include a seat portion 500A, which includes a bottom surface 511A and a side surface 512A. Furthermore, the retainer 310-1 may include an opening 502 formed in the bottom surface 511A. A foreign matter collection portion 506A may be formed on the upper surface 52a of the retainer 310-1.

[0364] The description of the bottom surface 511 and side surface 512, opening 501 and foreign matter collection portion 506 of the seat portion 500A of the retainer 310 can be applied or similarly applied to the bottom surface 511A and side surface 512A, opening 501A and foreign matter collection portion 506A of the retainer 310-1.

[0365] The lower surface 52b of the retainer 310 may include a first surface 52-1 and a second surface 52-2, the second surface 52-2 having a step difference relative to the first surface 52-1 in the optical axis direction.

[0366] For example, the second surface 52-2 can be positioned higher than the first surface 52-1.

[0367] For example, in the first surface 52-1 and the second surface 52-2, the second surface 52-2 may be closer to the bottom surface 511A of the seat portion 500A.

[0368] The second surface 52-2 may overlap with the bottom surface 511 of the seat portion 500A in the optical axis direction. For example, the second surface 52-2 may be a surface located on the opposite side of the bottom surface 511A of the seat portion 500A.

[0369] The adhesive member 613 can be disposed between the first surface 52-1 of the lower surface 52b of the retainer 310-1 and the upper surface of the circuit board 800, and the second surface 52-2 of the lower surface 52b of the retainer 310 can be spaced apart from the upper surface of the circuit board 800 in the optical axis direction.

[0370] For example, the second surface 52-2 of the lower surface 52b of the holder 310 can be positioned above the upper surface of the image sensor 810.

[0371] The retainer 310-1 may include a side surface 513A connecting the bottom surface 511A and the second surface 52-2. For example, the side surface 513A may be an inclined surface. For example, the interior angle between the side surface 513A and the bottom surface 511A may be an acute angle, an obtuse angle, or a right angle, and the interior angle between the side surface 513A and the second surface 52-2 may be an obtuse angle, but is not limited thereto.

[0372] The bottom surface 511A of the seat portion 500A of the retainer 310-1, the second surface 52-2 of the lower surface 52b of the retainer 310-1, and the side surface 513A can form a "support portion 38B" for supporting the 610 (see reference). Figure 13 The support portion 38B can be spaced apart from the upper surface of the circuit board 800.

[0373] For example, circuit element 95 may be disposed between retainer 310-1 and base 210. For example, circuit element 95 may not overlap with retainer 310-1 in the optical axis direction.

[0374] Generally, there are design specifications for the spacing between the image sensor and the lens module. Based on these preset design specifications, the height of the wires that electrically connect the image sensor and the circuit board, the thickness of the filter, the retainer structure, and / or the travel range in the optical axis direction of the lens module can be set.

[0375] Figure 11a This diagram illustrates a cross-sectional view of the collision between the filter 40 and the lens module 50 in a typical camera module; and Figure 11b The support portion 45 of the retainer 30 is shown. Figure 11a The collision between wires 25 in the camera module.

[0376] Reference Figure 11aThe image sensor 20 and the holder 30 are disposed on the upper surface of the circuit board 10, and the base 60 of the lens drive device is disposed on the upper surface of the holder 30. The image sensor 20 and the circuit board 10 can be electrically connected to each other via wire 25.

[0377] The base 60 of the lens drive device is disposed on the upper surface of the holder 30, and the holder 30 includes a support portion 25 for supporting the filter 40.

[0378] For example, the retainer 30 may have an opening corresponding to the filter 40 and may include a support portion 45 (or "seat portion") for supporting the edge portion of the filter 40. In this case, the support portion 45 may be spaced apart from the upper surface of the circuit board 10 or have a structure with a stepped difference in the optical axis direction.

[0379] When manufacturing a retainer as an injection-molded product, it is necessary to ensure the minimum injection molding thickness of the support portion 45. This may be due to the limitation on the thickness of the camera module in the optical axis direction when designing the camera module, and the distance or gap between the lens module 50 and the filter 40 can be reduced.

[0380] Therefore, when the spacing between the lens module 50 and the filter 40 is not sufficiently guaranteed, when a physical impact is applied to the camera module from the outside, such as... Figure 11a As shown, the lens module 50 and the filter 40 may collide with each other, and therefore the filter 40 and the lens module 50 may be damaged.

[0381] Furthermore, when the distance or gap between the lens module 50 and the filter 40 is reduced, it may limit the size of the lens included in the lens module, the travel of the lens module in the optical axis direction may be limited, and therefore, the reliability of autofocus cannot be guaranteed.

[0382] In addition, Figure 11a and Figure 11b In this case, since the base 60 of the lens driving device is located on the upper surface of the holder 30, it is difficult to reduce the length of the camera module in the optical axis direction.

[0383] In this case, the length of the camera module in the optical axis direction can be a length that may affect the thickness of the optical device (e.g., a mobile phone or smartphone). For example, the length of the camera module in the optical axis direction can be the height or distance from the lower surface of the circuit board 10 to the upper surface of the cover member of the camera module.

[0384] In addition, refer to Figure 11bThe support portion 45 of the retainer 30 may be bent due to a physical impact applied to the camera module from the outside, which may cause the support portion 45 and the wire 25 to collide and thus the wire 25 may be damaged, resulting in the wire being disconnected from the electrical connection.

[0385] In line with the trend of miniaturization or miniaturization of terminal devices, it is necessary to reduce the size of the camera module mounted on the terminal device in both the optical axis direction (e.g., the Z-axis direction) and the direction perpendicular to the optical axis (e.g., the X-axis and Y-axis directions).

[0386] The camera module according to this embodiment has the following effects.

[0387] First, since the retainer 310 is located inside the base 210 of the lens drive device 100, and the lower surface of the base 210 is directly connected to the upper surface of the circuit board 800, when it is in contact with... Figure 11a and Figure 11b In contrast to the previous case, in the implementation method, the height or length of the camera module in the optical axis direction can be reduced.

[0388] Figure 12 It shows Figure 11a The general camera module and the length of the camera module according to this embodiment in the optical axis direction. Example 1 shows... Figure 11a A partial cross-sectional view of a typical camera module, and Example 2 shows a module including... Figure 10 A partial cross-sectional view of the camera module of the retainer 310-1.

[0389] Reference Figure 12 In Example 2, since the lower surface of the base 210 of the lens drive device 100 is directly connected to the upper surface of the circuit board 800, the height of the upper plate 301 of the cover member 300 of the lens drive device 100 can be reduced compared to the height of the retainer 30 in Example 1. For this reason, the length H2 of the camera module in the optical axis direction of Example 2 can be less than the length H1 (H2) of the camera module in the optical axis direction of Example 1.

[0390] For example, H1 can be the height or distance from the lower surface of the circuit board 800 to the upper surface of the upper plate 301 of the cover member 300 of the camera module. Similarly, H2 can be the height or distance from the lower surface of the circuit board 10 to the upper surface of the upper plate 60A of the cover member 60 of the camera module.

[0391] although Figure 12 The diagram illustrates the following: Figure 10 The retainer 310-1 in the implementation method, but​ Figure 12 The description can also be applied to including Figure 6 and Figure 7 The camera module with retainer 310 shown.

[0392] Secondly, this embodiment can increase the distance between the filter 610 and the lens module 400 along the optical axis.

[0393] Figure 13 The illustration shows the spacing along the optical axis between the filter 610 and the lens module 400 according to an embodiment. Example 2 shows a configuration including... Figure 10 A partial cross-sectional view of the camera module of the retainer 310-1, and Example 3 shows a camera module including... Figure 6 and Figure 7 A partial cross-sectional view of the camera module of the retainer 310.

[0394] Reference Figure 13 In Example 2, a window-shaped support portion 38B is provided for mounting the filter 610, and this support portion 38B has a minimum thickness required for injection molding (e.g., 0.1 mm to 0.2 mm). For example, the cross-sectional shape of the window-shaped support portion 38B can be a Korean letter. The shape.

[0395] On the other hand, in Example 3, since the support portion 38A is directly attached to the upper surface of the circuit board 800, a window as in Example 2 is not required. The spacing distance may be increased. For example, the cross-sectional shape of the support portion 38A could have Korean characters. The structure of a shape.

[0396] For example, in Example 3, the distance D1 between the lower end of the lens module 400 and the upper surface of the filter 600 can be greater than the distance D2 between the lower end of the lens module 400 and the upper surface of the filter 600 in Example 2 (D1>D2). For example, D1 can be from 0.35mm to 0.45mm, and D2 can be from 0.2mm to 0.33mm.

[0397] Furthermore, in Example 3, since the support portion 38A is directly attached to the upper surface of the circuit board 800, bending of the support portion 38A due to external impact will not occur, and thus, collision between the retainer 310 and the wire 81 may not occur.

[0398] In Example 3, the distance d1 between the lower surface of the filter 610 and the image sensor can be smaller than the distance d2 between the lower surface of the filter 610 and the image sensor 810 in Example 2. <d2)。

[0399] Third, this embodiment can reduce the size of the camera module in the direction perpendicular to the optical axis. (Refer to...) Figure 8a and Figure 8b There are design guidelines that require minimum spacing between components of the camera module (e.g., image sensor 810, wire 81, circuit element 95, and holder 310).

[0400] In this embodiment, by setting or arranging circuit elements 95 on the circuit board 810 such that at least a portion of the circuit elements 95 overlaps with the holder 310 in the optical axis direction, wherein the areas of the holder 310 and the circuit elements 95 disposed on the upper surface of the circuit board 800 can be partially shared, and thereby the size of the camera module in the horizontal direction can be reduced.

[0401] Fourth, since the entire area of ​​the lower surface 51b of the retainer 310, except for the groove 53, is attached to the upper surface of the circuit board 800, the bonding force can be improved, the shear force between the retainer 310 and the circuit board 800 can be increased, and the retainer 310 and the circuit board 800 can be prevented from separating from each other due to external impact.

[0402] Furthermore, fifthly, since D1 in Example 3 is greater than D2 in Example 2, if the distance between the lens module 400 and the upper surface of the filter 610 in Example 3 is designed to be D1 in Example 2, then the height from the lower surface of the circuit board 800 in Example 3 to the upper surface of the upper plate 301 of the cover member 300 of the camera module will be greater than... Figure 12 The H2 described in the text can be further reduced, thereby allowing the size of the camera module to be further reduced.

[0403] Figure 14 It shows the attachment to Figure 10 The adhesive member 612A on the lower surface of the retainer 310-1 and attached to Figure 6 The adhesive member 612 is attached to the lower surface of the retainer 310. Example 3 shows a retainer 310 with an adhesive member 612 attached to the lower surface. Figure 6 Implementation of the retainer 310.

[0404] Reference Figure 14 In Example 2, the area where the adhesive member 612A is provided can be 46.72% of the total area of ​​the lower surface of the retainer 310-1. In Example 3, the area where the adhesive member 612A is provided can be 80.14% of the total area of ​​the lower surface of the retainer 310.

[0405] In other words, since the area of ​​the lower surface of the retainer 310 connected to the upper surface of the circuit board 800 is larger than the area of ​​the lower surface of the retainer 310-1 connected to the upper surface of the circuit board 800 compared to Example 2, the bonding force between the retainer 310 and the circuit board 800 can be further improved in Example 3, the shear force can be increased more, and the retainer 310 and the circuit board 800 can be prevented from separating from each other due to external impact.

[0406] The thickness T2 of the support portion 38A in Example 3 can be greater than the thickness T1 of the support portion 38B in Example 2. Compared with Example 2, the rigidity of the support portion 38A in Example 3 can be increased, and the displacement caused by impact can be suppressed.

[0407] For example, T1 can be 0.1 mm to 0.2 mm, and T2 can be 0.3 mm to 0.4 mm.

[0408] The camera module according to this embodiment may be included in an optical device for forming an image of an object in space by utilizing the properties of light, such as reflection, refraction, absorption, interference, and diffraction; and is intended to improve the visual acuity of the eye, or to record images through lenses and image reproduction, or for purposes such as optical measurement, image propagation, or transmission. For example, the optical device according to this embodiment may include a portable terminal equipped with a smartphone and a camera.

[0409] Figure 15 This is a perspective view of the portable terminal 200A according to the embodiment; and Figure 16 yes Figure 15 The block diagram of the portable terminal 200A shown in the figure.

[0410] Reference Figure 15 and Figure 16 The portable terminal 200A (hereinafter referred to as the "terminal") may include a main body 850, a wireless communication unit 710, an A / V input unit 720, a sensing unit 740, an input / output unit 750, a memory unit 760, an interface unit 770, a control unit 780, and a power supply unit 790.

[0411] Figure 15 The main body 850 shown in the figure is strip-shaped, but not limited to this, and it can have various structures, such as sliding type, folding type, swing type, rotating type, etc., in which two or more sub-bodies are connected to be able to move relative to each other.

[0412] The body 850 may include a shell (outer shell, housing, cover, etc.) forming the external appearance. For example, the body 850 may be divided into a front shell 851 and a rear shell 852. Various electronic components of the terminal may be embedded in the space formed between the front shell 851 and the rear shell 852.

[0413] The wireless communication unit 710 may include one or more modules capable of wireless communication between the terminal 200A and the wireless communication system or between the terminal 200A and the network where the terminal 200A is located. For example, the wireless communication unit 710 may include a broadcast receiving module 711, a mobile communication module 712, a wireless internet module 713, a short-range communication module 714, and a location information module 715.

[0414] The A / V input unit 720 is used to input audio or video signals, and may include a camera 721, a microphone 722, etc.

[0415] According to an embodiment, camera 721 may include camera module 200.

[0416] The sensing unit 740 can generate sensing signals for controlling the operation of the terminal 200A by detecting the current state of the terminal 200A, such as the open / closed state of the terminal 200A, the position of the terminal 200A, the presence or absence of user contact, the orientation of the terminal 200A, and the acceleration / deceleration of the terminal 200A. For example, when the terminal 200A is in the form of a slider phone, the sensing unit 740 can sense whether the slider phone is open or closed. In addition, the sensing unit 740 is also responsible for sensing functions related to whether the power supply unit 790 is being supplied with power and whether the interface unit 770 is connected to an external device.

[0417] The input / output unit 750 is used to generate inputs or outputs related to vision, hearing, or touch. The input / output unit 750 can generate input data for controlling the operation of the terminal 200A and can display the information processed in the terminal 200A.

[0418] The input / output unit 750 may include a keyboard unit 730, a display module 751, a sound output module 752, and a touch screen panel 753. The keyboard unit 730 can generate input data in response to keyboard input.

[0419] Display module 751 may include a plurality of pixels, the color of which changes according to an electrical signal. For example, display module 751 may include at least one of a liquid crystal display, a thin-film transistor liquid crystal display, an organic light-emitting diode, a flexible display, or a 3D display.

[0420] The audio output module 752 outputs audio data received from the wireless communication unit 710 in various modes such as call signal reception, call mode, recording mode, voice recognition mode, or broadcast reception mode, or it can output audio data stored in the memory unit 760.

[0421] The touchscreen panel 753 can convert the capacitance change caused by the user touching a specific area of ​​the touchscreen into an electrical input signal.

[0422] The memory unit 760 can store programs for processing and controlling the control unit 780, and can temporarily store input / output data (e.g., phone books, messages, audio, still images, photos, videos, etc.). For example, the memory unit 760 can store images captured by the camera 721, such as photos or videos.

[0423] Interface unit 770 serves as a channel for connecting to external devices connected to terminal 200A. Interface unit 770 can receive data from external devices, or be powered and deliver power to each component inside terminal 200A, or enable data inside terminal 200A to be transmitted to external devices. For example, interface unit 770 may include: a wired / wireless headphone port; an external charger port; a wired / wireless data port; a memory card port; a port for connecting a device equipped with an identification module; an audio input / output (I / O) port; a video input / output (I / O) port; and a headphone port, etc.

[0424] The control unit 780 can control the overall operation of the terminal 200A. For example, the control unit 780 can perform related control and processing for voice calls, data communications, video calls, etc.

[0425] The control unit 780 may include a multimedia module 781 for playing multimedia. The multimedia module 781 may be implemented inside the control unit 780 or may be implemented separately from the control unit 780.

[0426] The control unit 780 can perform a pattern recognition process that can recognize handwritten or drawing input performed on the touch screen as characters and images, respectively.

[0427] The power supply unit 790 can receive external or internal power under the control of the control unit 780, and can supply the power required for the operation of each component.

[0428] The camera module according to the first embodiment of the present invention can be applied to dual cameras. In this case, the position of the camera module according to the first embodiment can be adjusted using the bracket 2100 and magnet according to the second embodiment of the present invention.

[0429] In the following description, the configuration of the camera device according to the second embodiment of the present invention will be described with reference to the accompanying drawings.

[0430] Figure 17 This is a perspective view of a camera device according to a second embodiment of the present invention; Figure 18 The camera device according to the second embodiment of the present invention is in conjunction with... Figure 17 Three-dimensional images in different directions; Figure 19 This is a plan view of a camera device according to a second embodiment of the present invention; Figure 20 This is a bottom view of a camera device according to a second embodiment of the present invention; Figures 21 to 24 This is a side view of a camera device according to a second embodiment of the present invention; Figure 25 It is along Figure 19 A cross-sectional view of line AA; Figure 26 It is along Figure 19 A cross-sectional view of line BB; Figure 27 It is along Figure 19 A cross-sectional view of line CC; Figure 28 This is an exploded perspective view of a camera device according to a second embodiment of the present invention; Figure 29 This is a perspective view of the bracket and magnet of the camera device according to a second embodiment of the present invention; Figure 30 This is a perspective view of the first camera module of the camera device according to a second embodiment of the present invention; Figure 31 This is an exploded perspective view of the first camera module of the camera device according to a second embodiment of the present invention; Figure 32 This is an exploded perspective view of the second camera module of the camera device according to a second embodiment of the present invention; and Figure 33 This is an exploded perspective view of the lens driving device of the second camera module of the camera device according to the second embodiment of the present invention.

[0431] A camera device may include a dual-camera module. A camera device may include a triple-camera module. A camera device may include multiple camera modules.

[0432] The camera device may include a bracket 2100. The bracket 2100 may secure a first camera module 2200 and a second camera module 2300. The first camera module 2200 and the second camera module 2300 may be disposed within the bracket 2100. The bracket 2100 may be configured to surround the first camera module 2200 and the second camera module 2300.

[0433] The bracket 2100 may include multiple sidewalls. The bracket 2100 may include four sidewalls. The bracket 2100 may include first to fourth sidewalls 2101, 2102, 2103, and 2104. The bracket 2100 may include a partition wall 2105 located between the first hole 2110 and the second hole 2120. The partition wall 2105 may be disposed between the first camera module 2200 and the second camera module 2300. That is, the distance between the first camera module 2200 and the second camera module 2300 may be determined by the width of the partition wall 2105. At least a portion of the first to fourth sidewalls 2101, 2102, 2103, and 2104 may be formed as a rounded shape. The intersecting portions of the first to fourth sidewalls 2101, 2102, 2103, and 2104 may be formed as a rounded shape.

[0434] The bracket 2100 may include holes. The bracket 2100 may include multiple holes. The bracket 2100 may include a first hole 2110 and a second hole 2120. A first camera module 2200 may be disposed in the first hole 2110. The first hole 2110 may be formed in a shape and size corresponding to the shape and size of the first camera module 2200. A second camera module 2300 may be disposed in the second hole 2120. The second hole 2120 may be formed in a shape and size corresponding to the shape and size of the second camera module 2300. The first hole 2110 and the second hole 2120 may penetrate the bracket 2100 along the optical axis. The first hole 2110 and the second hole 2120 may be spaced apart from each other. Each of the first hole 2110 and the second hole 2120 may be formed as a groove.

[0435] The support 2100 may include a groove 2130. The groove 2130 may be a magnet recess. The groove 2130 may be formed on the outer surface of the support 2100. A second magnet 2500 may be disposed in the groove 2130. At least a portion of the second magnet 2500 may be accommodated in the groove 2130. The groove 2130 may be spaced apart from the edge of the outer surface of the support 2100. The width of the groove 2130 in a first direction may correspond to the width in the direction corresponding to the second magnet 2500. The width of the groove 2130 in a second direction may be greater than the width of the second magnet 2500 in the corresponding direction. Therefore, the movement of the second magnet 2500 within the groove 2130 along the first direction can be restricted, and the second magnet 2500 may move along the second direction. The area of ​​the bottom surface of the groove 2130 may be greater than the area of ​​the opposite surface of the second magnet 2500. The second magnet 2500 may reciprocate within the groove 2130 along a single axis.

[0436] The groove 2130 may include multiple grooves. The groove 2130 may include two grooves. The grooves 2130 may be formed in a number corresponding to the second magnet 2500. In a modified embodiment, the groove 2130 may include three grooves.

[0437] The groove 2130 may include a first groove 2131. A first external magnet 2510 may be disposed in the first groove 2131. The first groove 2131 may be recessed along the first axis direction. The length of the first groove 2131 in the optical axis direction (refer to...) Figure 21 L1) can be longer than the length of the first groove 2131 in the second axial direction (refer to) Figure 21 The length L1 of the first groove 2131 in the optical axis direction can be longer than the length D1 of the first external magnet 2510 in the optical axis direction. In this case, the optical axis can be the z-axis, and the second axis can be the y-axis. The first external magnet 2510 can move inside the first groove 2131 along the optical axis direction. The length L2 of the first groove 2131 in the second axis direction can be the same as the length of the first external magnet 2510 in the second axis direction (refer to L2). Figure 21 The length of the first external magnet 2510 along the optical axis within the first groove 2131 can be limited. The length of the first external magnet 2510 along the optical axis can be the same as the length of the first groove 2131 along the optical axis. The length L1 of the first groove 2131 along the optical axis can be within twice the length D1 of the first external magnet 2510 along the optical axis.

[0438] The groove 2130 may include a second groove 2132. A second external magnet 2520 may be disposed in the second groove 2132. The second groove 2132 may be recessed along the second axis direction. The length of the second groove 2132 along the first axis direction (refer to...) Figure 22 D3) can be longer than the second groove 2132 in the optical axis direction (refer to...). Figure 22 The length D3 of the second groove 2132 in the first axial direction can be longer than the length D2 of the second external magnet 2520 in the first axial direction. In this case, the first axis can be the x-axis. The second external magnet 2520 can move inside the second groove 2132 along the first axial direction. The length L4 of the second groove 2132 in the optical axis direction can be the same as the length of the second external magnet 2520 in the optical axis direction (refer to...). Figure 22 The length of the second external magnet 2520 along the optical axis within the second groove 2132 can be limited. The length of the second external magnet 2520 along the optical axis can be the same as its length along the first axis. The length D3 of the second groove 2132 along the first axis can be within twice the length D2 of the second external magnet 2520 along the first axis.

[0439] The bracket 2100 may include a step difference 2140. The step difference 2140 can be formed when a portion of the upper surface is recessed. The step difference 2140 may be formed on the outer side of the second camera module 2300. The bracket 2100 may include an additional step difference 2141 formed within the step difference 2140. That is, the bracket 2100 may have two step differences 2140 and 2141 formed in two layers. The step differences 2140 and 2141 may be structures for protecting the OIS D-IC and gyroscope IC. The step differences 2140 and 2141 may serve as shielding.

[0440] The bracket 2100 may include a step difference 2150. The step difference 2150 is formed when the upper surface of the bracket 2100 is recessed, and within this step difference 2150, the first camera module 2200 is disposed around the second camera module 2300. An adhesive or sealing member may be provided within the step difference 2150 for securing the first camera module 2200 and / or the second camera module 2300 to the bracket 2100. The adhesive or sealing member may include epoxy resin. The epoxy resin may include a shape corresponding to the step difference 2150.

[0441] The bracket 2100 may include a recess. The recess may be recessed from the side surface of the bracket 2100. The recess may be recessed from the lower surface of the bracket 2100. The bracket 2100 may use the recess to prevent interference with the connection plate 2211 of the first camera module 2200 and the connection substrate 2311 of the second camera module 2300.

[0442] The camera device may include a first camera module 2200. The first camera module 2200 may be disposed in a first hole 2110 of a bracket 2100. The first camera module 2200 may be disposed side-by-side with a second camera module 2300. The first camera module 2200 may be configured to face the same direction as the second camera module 2300. The first camera module 2200 may be a fixed-focus (FF) module with a fixed focal point. The first camera module 2200 may have a different viewing angle than the second camera module 2300. The first camera module 2200 may have a different resolution than the second camera module 2300. Images captured by the first camera module 2200 may at least partially overlap with images captured by the second camera module 2300. The first camera module 2200 may be a sub-camera module.

[0443] The first camera module 2200 may include a board 2210. Board 2210 may be a circuit board. Board 2210 may be a printed circuit board (PCB). Board 2210 may be a rigid printed circuit board. A retainer 2240 may be disposed in board 2210. An image sensor 2220 may be disposed in board 2210. Various circuits, devices, control units, etc., may be disposed on board 2210 to convert the image formed on the image sensor 2220 into an electrical signal and transmit the electrical signal to an external device. The first camera module 2200 may include a connecting board 2211. Connecting board 2211 can connect board 2210 and connector 2212. Connecting board 2211 may be a flexible printed circuit board (FPCB). The first camera module 2200 may include connector 2212. Connector 2212 may be electrically connected to board 2210. Connector 2212 may include a port for electrical connection to an external device. Board 2210 may be a printed circuit board 3010 according to the third embodiment.

[0444] The board 2210 of the first camera module 2200 can be configured to have a height difference with the board 2310 of the second camera module 2300. The board 2210 of the first camera module 2200 can be positioned higher than the board 2310 of the second camera module 2300. The board 2310 of the second camera module 2300 can be positioned lower than the board 2210 of the first camera module 2200. The first camera module 2200 can be positioned higher than the second camera module 2300. The second camera module 2300 can be positioned lower than the first camera module 2200.

[0445] The first camera module 2200 may include an image sensor 2220. The image sensor 2220 may have a configuration in which light passing through a lens 2230 and a filter is incident to form an image. The image sensor 2220 may be disposed in a board 2210. The image sensor 2220 may be disposed above the board 2210. The image sensor 2220 may be disposed on the board 2210. The image sensor 2220 may be mounted on the board 2210. The image sensor 2220 may be electrically connected to the board 2210. For example, the image sensor 2220 may be connected to the board 2210 via surface mount technology (SMT). As another example, the image sensor 2220 may be connected to the board 2210 via flip-chip technology. The image sensor 2220 may be configured such that the lens coincides with the optical axis. That is, the optical axis of the image sensor 2220 and the optical axis of the lens may be aligned. The image sensor 2220 can convert light incident on the effective image area of ​​the image sensor 2220 into an electrical signal. The image sensor 2220 can be any of a charge-coupled device (CCD), metal-oxide-semiconductor (MOS), CPD, and CID.

[0446] The first camera module 2200 may include a lens module. The lens module may include at least one lens 2230. The lens 2230 may be positioned corresponding to the image sensor 2220. The lens module may include the lens 2230 and a lens barrel. The lens module may be coupled to a retainer 2240. The lens module may be coupled to the retainer 2240 by screws and / or adhesive. The lens module may be fixed to the retainer 2240.

[0447] The first camera module 2200 may include a retainer 2240. The retainer 2240 may be disposed in the plate 2210. The retainer 2240 may secure the lens 2230. The retainer 2240 may include a hole. The lens 2230 may be disposed in the hole of the retainer 2240. The inner peripheral surface of the hole in the retainer 2240 may be threaded. The retainer 2240 may be formed of an insulating material. The first camera module 2200 may include a cover member separate from the retainer 2240. The cover member may include an upper plate and side plates extending downward from the upper plate. The cover member may include a shield made of metal.

[0448] The camera device may include a second camera module 2300. The second camera module 2300 may be disposed in the second hole 2120 of the bracket 2100. The second camera module 2300 may have a larger volume than the first camera module 2200. The first camera module 2200 and the second camera module 2300 may be configured such that the optical axis of the first camera module 2200 is parallel to the optical axis of the second camera module 2300. The second camera module 2300 may be a main camera module.

[0449] The second camera module 2300 includes a cover member 2340, a coil holder 2350 disposed inside the cover member 2340, a coil 2335 disposed inside the cover member 2340 and moving the coil holder 2350, and a magnet 2365.

[0450] The second camera module 2300 may include a board 2310. Board 2310 may be a circuit board. Board 2310 may be a printed circuit board (PCB). Board 2310 may be a rigid printed circuit board. A lens driving device may be disposed in board 2310. The lens driving device may be disposed on board 2310. The lens driving device may be disposed above board 2310. An image sensor 2320 may be disposed in board 2310. Various circuits, devices, control units, etc., may be disposed in board 2310 to convert the image formed in image sensor 2320 into electrical signals and transmit the electrical signals to an external device. The second camera module 2300 may include a connecting board 2311. Connecting board 2311 can connect board 2310 and connector 2312. Connecting board 2311 may be a flexible printed circuit board (FPCB). The second camera module 2300 may include connector 2312. Connector 2312 may be electrically connected to board 2310. Connector 2312 may include a port for electrical connection to an external device. Board 2310 may be a printed circuit board 3010 according to the third embodiment.

[0451] The second camera module 2300 may include an image sensor 2320. The image sensor 2320 may have a configuration in which light passing through a lens 2330 and a filter 2395 is incident to form an image. The image sensor 2320 may be disposed in a board 2310. The image sensor 2320 may be disposed on the board 2310. The image sensor 2320 may be disposed above the board 2310. The image sensor 2320 may be mounted on the board 2310. The image sensor 2320 may be electrically connected to the board 2310. For example, the image sensor 2320 may be connected to the board 2310 via surface mount technology (SMT). As another example, the image sensor 2320 may be connected to the board 2310 via flip-chip technology. The image sensor 2320 may be configured such that the lens coincides with the optical axis. That is, the optical axis of the image sensor 2320 may be aligned with the optical axis of the lens. The image sensor 2320 can convert light incident on the effective image area of ​​the image sensor 2320 into an electrical signal. The image sensor 2220 can be any of a charge-coupled device (CCD), metal-oxide-semiconductor (MOS), CPD, and CID.

[0452] The second camera module 2300 may include a lens module. The lens module may include at least one lens 2330. The lens 2330 may be positioned corresponding to the image sensor 2320. The lens module may include the lens 2330 and a lens barrel. The lens module may be coupled to the coil holder 2350. The lens module may be coupled to the coil holder 2350 via threaded connection and / or adhesive. The lens module may move together with the coil holder 2350. Therefore, the distance between the lens 2330 and the image sensor 2320 may be changed.

[0453] The second camera module 2300 may include a lens driving device. The second camera module 2300 may include a voice coil motor. The second camera module 2300 may include an AF drive actuator that performs an autofocus (AF) function. The second camera module 2300 may include an OIS drive actuator that performs an optical image stabilization (OIS) function.

[0454] The lens driving device may include a cover member 2340. The cover member 2340 may include a "cover". The cover member 2340 may be disposed on the outer side of the housing 2360. The cover member 2340 may be connected to the base 2370. The cover member 2340 may house the housing 2360 therein. The cover member 2340 may form the appearance of the lens driving device. The cover member 2340 may have a hexahedral shape with an open lower surface. The cover member 2340 may be made of a non-magnetic material. The cover member 2340 may be formed of metal. The cover member 2340 may be formed of a metal plate. The cover member 2340 may be connected to the grounding terminal of the plate 2310. Thus, the cover member 2340 may be grounded. The cover member 2340 may block electromagnetic interference (EMI). In this case, the cover member 2340 may be referred to as an "EMI shield".

[0455] The cover member 2340 may include a top plate and a side plate. The cover member 2340 may include a top plate containing holes and a side plate extending downward from the outer periphery or edge of the top plate. The lower end of the side plate of the cover member 2340 may be disposed on a stepped portion of the base 2370. The inner surface of the side plate of the cover member 2340 may be fixed to the base 2370 by an adhesive.

[0456] The lens driving device may include a coil holder 2350. The coil holder 2350 may be disposed inside a housing 2360. The coil holder 2350 may be disposed in a hole in the housing 2360. The coil holder 2350 may be movably connected to the housing 2360. The coil holder 2350 may move against the housing 2360 along the optical axis. A lens 2330 may be connected to the coil holder 2350. The coil holder 2350 and the lens 2330 may be connected by threaded connection and / or adhesive. A coil 2355 may be connected to the coil holder 2350. An upper elastic member 2381 may be connected to the upper portion or upper surface of the coil holder 2350. A lower elastic member 2382 may be connected to the lower portion or lower surface of the coil holder 2350. The coil holder 2350 may be connected to the upper elastic member 2381 and / or the lower elastic member 2382 by thermal fusion and / or adhesive. The adhesive that connects the coil frame 2350 and the lens, as well as the coil frame 2350 and the elastic member 2380, may be an epoxy resin that is cured by at least one of ultraviolet (UV), heat, and laser.

[0457] The lens driving device may include a coil 2355. The coil 2355 may be an "AF drive coil" for AF driving. The coil 2355 may be disposed within a coil holder 2350. The coil 2355 may be disposed between the coil holder 2350 and the housing 2360. The coil 2355 may be disposed on the outer surface or outer peripheral surface of the coil holder 2350. The coil 2355 may be directly wound in the coil holder 2350. Alternatively, the coil 2355 may be directly wound and connected to the coil holder 2350. The coil 2355 may face the magnet 2365. The coil 2355 may be positioned to face the magnet 2365. The coil 2355 may electromagnetically interact with the magnet 2365. In this case, when current is supplied to the coil 2355, thereby forming an electromagnetic field around the coil 2355, the electromagnetic interaction between the coil 2355 and the magnet 2365 may cause the coil 2355 to move against the magnet 2365. The coil 2355 may be formed as a single coil. Alternatively, coil 2355 may include multiple coils spaced apart from each other.

[0458] The coil 2355 may include a pair of leads for supplying power. One end portion (leads) of the coil 2355 is connected to a first lower elastic unit, and the other end portion (leads) of the coil 2355 may be connected to a second lower elastic unit. That is, the coil 2355 may be electrically connected to the lower elastic member 2382. More specifically, the coil 2355 may receive power through the lower elastic member 2382.

[0459] The lens driving device may include a housing 2360. The housing 2360 may be coupled to a base 2370. The housing 2360 may be disposed on the outer side of a coil holder 2350. The housing 2360 may accommodate at least a portion of the coil holder 2350. The housing 2360 may be disposed inside a cover member 2340. The housing 2360 may be disposed between the cover member 2340 and the coil holder 2350. The housing 2360 may be formed of a material different from that of the cover member 2340. The housing 2360 may be formed of an insulating material. The housing 2360 may be formed of an injection-molded material. A magnet 2365 may be disposed within the housing 2360. The housing 2360 and the magnet 2365 may be joined by an adhesive. An upper elastic member 2381 may be coupled to the upper portion or upper surface of the housing 2360. A lower elastic member 2382 may be coupled to the lower portion or lower surface of the housing 2360. The housing 2360 may be joined to the upper elastic member 2510 and the lower elastic member 2520 by heat fusion and / or adhesive. The adhesive used to join the housing 2360 and the magnet 2365, and the housing 2360 and the elastic member 2380 may be an epoxy resin that is cured by any or more of ultraviolet (UV), heat and laser.

[0460] The lens driving device may include a magnet 2365. The magnet 2365 may be disposed within a housing 2360. The magnet 2365 may be fixed to the housing 2360 by adhesive. The magnet 2365 may be disposed between the coil holder 2350 and the housing 2360. The magnet 2365 may face the coil 2355. The magnet 2365 may electromagnetically interact with the coil 2355. The magnet 2365 may be used for AF driving. The magnet 2365 may be disposed on a side surface of the housing 2360. In this case, the magnet 2365 may be a flat magnet with a plate shape. Alternatively, the magnet 2365 may be disposed in a corner portion of the housing 2360. In this case, the magnet 2365 may be a corner magnet whose inner surface has a hexahedral shape larger than its outer surface.

[0461] The lens driving device may include a base 2370. The base 2370 may be disposed below the coil holder 2350. The base 2370 may be spaced apart from the coil holder 2350. The base 2370 may be disposed below the housing 2360. The base 2370 may be connected to the cover member 2340. The base 2370 may be disposed above the plate 2310.

[0462] The lens driving device may include an elastic member 2380. The elastic member 2380 may be at least partially elastic. The elastic member 2380 may be formed of metal. The elastic member 2380 may be formed of a conductive material. The elastic member 2380 can connect the coil holder 2350 and the housing 2360. The elastic member 2380 can be coupled to the coil holder 2350 and the housing 2360. The elastic member 2380 can elastically support the coil holder 2350. The elastic member 2380 can movably support the coil holder 2350. During AF driving, the elastic member 2380 can support the movement of the coil holder 2350. That is, the elastic member 2380 may include an "AF support member".

[0463] The elastic member 2380 may include an upper elastic member 2381. The upper elastic member 2381 connects the housing 2360 and the coil holder 2350. The upper elastic member 2381 can be connected to the upper portion of the coil holder 2350 and the upper portion of the housing 2360. The upper elastic member 2381 can be connected to the upper surface of the coil holder 2350. The upper elastic member 2381 can be connected to the upper surface of the housing 2360. The upper elastic member 2381 may be formed of a leaf spring. The upper elastic member 2381 may include an inner portion connected to the coil holder 2350, an outer portion connected to the housing 2360, and a connecting portion connecting the inner and outer portions.

[0464] The elastic member 2380 may include a lower elastic member 2382. The lower elastic member 2382 may be disposed below the upper elastic member 2381. The lower elastic member 2382 can connect the coil frame 2350 and the base 2370. The lower elastic member 2382 can connect the coil frame 2350 and the housing 2360. The lower elastic member 2382 may be disposed below the coil frame 2350. The lower elastic member 2382 may be coupled to the lower surface of the coil frame 2350. The lower elastic member 2382 may be coupled to the upper surface of the base 2370. The lower elastic member 2382 may be formed of a leaf spring. The lower elastic member 2382 may include an inner portion coupled to the coil frame 2350, an outer portion coupled to the base 2370, and a connecting portion connecting the inner portion and the outer portion. The lower elastic member 2382 may include a first lower elastic unit and a second lower elastic unit spaced apart from each other.

[0465] The second camera module 2300 may include a sensor base 2390. The sensor base 2390 may be disposed between the lens drive device and the plate 2310. The sensor base 2390 may include a protrusion in which a filter 2395 is disposed. An opening may be formed in the portion of the sensor base 2390 in which the filter 2395 is disposed, allowing light passing through the filter 2395 to be incident on the image sensor 2320. An adhesive member may connect or attach the base 2370 of the lens drive device to the sensor base 2390. The adhesive member may also be used to prevent foreign objects from being introduced into the lens drive device. The adhesive member may include any or more of epoxy resin, thermosetting adhesive, and UV-curable adhesive.

[0466] The second camera module 2300 may include a filter 2395. The filter 2395 can be used to block light of a specific frequency band passing through the lens module from incident on the image sensor 2320. The filter 2395 may be arranged perpendicular to the optical axis. The filter 2395 may be disposed between the lens 2330 and the image sensor 2320. The filter 2395 may be disposed in the sensor base 2390. In a modified embodiment, the filter 2395 may be disposed in the base 2370. The filter 2395 may include an infrared filter. The infrared filter can block light in the infrared region from incident on the image sensor 2320.

[0467] The second camera module 2300 may include a motion sensor. The motion sensor may be mounted on board 2310. The motion sensor can be electrically connected to the control unit via a circuit pattern provided on board 2310. The motion sensor can output rotational angular velocity information caused by the movement of the camera module. The motion sensor may include a 2-axis gyroscope sensor or a 3-axis gyroscope sensor, or may include an angular velocity sensor.

[0468] The second camera module 2300 may include a control unit. The control unit may be located in board 2310. The control unit may be electrically connected to the coil 2335 of the lens drive device. The control unit may independently control the direction, intensity, and amplitude of the current supplied to the coil 2335. The control unit may control the lens drive device to perform autofocus and / or image stabilization functions. Furthermore, the control unit may perform autofocus feedback control and / or image stabilization feedback control on the lens drive device.

[0469] The camera device may include a first magnet 2400. The first magnet 2400 may include a permanent magnet. The first magnet 2400 may be disposed on the outer surface of the first camera module 2200. The first magnet 2400 may be inserted into and injected into the holder 2240 of the first camera module 2200. The first magnet 2400 may be integrally formed with the first camera module 2200.

[0470] The first magnet 2400 may include multiple magnets. The first magnet 2400 may include two magnets. The first magnet 2400 may be formed in a number corresponding to the number of second magnets 2500. In a modified embodiment, the first magnet 2400 may include three magnets.

[0471] The first magnet 2400 may include a first internal magnet 2410 and a second internal magnet 2420. The first internal magnet 2410 may be configured such that a first axis perpendicular to the optical axis of the first camera module 2200 passes through it. The second internal magnet 2420 may be configured such that the optical axis of the first camera module 2200 and a second axis perpendicular to the first axis pass through it. In this case, the optical axis may be the z-axis, the first axis may be the x-axis, and the second axis may be the y-axis. Alternatively, the first axis may be the y-axis, and the second axis may be the x-axis.

[0472] The first magnet 2400 may include: a first internal magnet 2410 disposed on a first outer surface of the first camera module 2200; and a second internal magnet 2420 disposed on a second outer surface inclined relative to the first outer surface of the first camera module 2200. In this case, the first and second outer surfaces may be arranged adjacent to each other. Alternatively, they may be arranged close together. Or, they may be orthogonal to each other.

[0473] The second magnet 2500 may include a permanent magnet. The second magnet 2500 may be disposed on the outer surface of the support 2100 at a position corresponding to the first magnet 2400. The second magnet 2500 may move within the groove 2130 of the support 2100. An attractive force may act between the first magnet 2400 and the second magnet 2500. That is, a mutual attractive force may act between the first magnet 2400 and the second magnet 2500. Therefore, the first magnet 2400 may also be pulled when the second magnet 2500 moves. That is, the first magnet 2400 may move together with the second magnet 2500.

[0474] In this embodiment, when the second magnet 2500 moves within the groove 2130 of the bracket 2100, the first camera module 2200 can move together with the second magnet 2500 due to the attractive force between the first magnet 2400 and the second magnet 2500. When the second magnet 2500 moves within the groove 2130 of the bracket 2100, the first camera module 2200 can move to correspond to the second magnet 2500 due to the attractive force between the first magnet 2400 and the second magnet 2500. Therefore, in this embodiment, when the first camera module 2200 is inserted into the bracket 2100, the first camera module 2200 can be fine-tuned by moving the second magnet 2500.

[0475] The first magnet 2400 and the second magnet 2500 can be formed in corresponding shapes. The first magnet 2400 can be formed with a circular surface facing the second magnet 2500. The second magnet 2500 can be formed with a circular surface facing the first magnet 2400. That is, each of the first magnet 2400 and the second magnet 2500 can be in the shape of a cylinder with a thinner height or thickness. That is, each of the first magnet 2400 and the second magnet 2500 can be in the shape of a coin.

[0476] The second magnet 2500 may include multiple magnets. The second magnet 2500 may include two magnets. The second magnet 2500 may be formed in a number corresponding to the number of the first magnets 2400. As a modified embodiment, the second magnet 2500 may include three magnets.

[0477] The second magnet 2500 may include a first external magnet 2510 and a second external magnet 2520. The first external magnet 2510 and the second external magnet 2520 may move in different directions. The first external magnet 2510 may be configured such that a first axis passes through it. The second external magnet 2520 may be configured such that a second axis passes through it. The second internal magnet 2420 and the second external magnet 2520 may be arranged along the direction of the first axis. The first internal magnet 2410 and the first external magnet 2510 may be arranged along the direction of the second axis.

[0478] The second magnet 2500 may include a first external magnet 2510 disposed on the outer surface of the first sidewall 2101 of the bracket 2100. The second magnet 2500 may include a second external magnet 2520 disposed on the outer surface of the second sidewall 2102 of the bracket 2100.

[0479] The first internal magnet 2410 and the first external magnet 2510 can be positioned at corresponding locations with the first sidewall 2101 of the bracket 2100 inserted therebetween. An attractive force can act between the first internal magnet 2410 and the first external magnet 2510. Thus, the first internal magnet 2410 can also move when the first external magnet 2510 moves.

[0480] The second internal magnet 2420 and the second external magnet 2520 can be positioned at corresponding locations with the second sidewall 2102 of the bracket 2100 inserted therebetween. An attractive force can act between the second internal magnet 2420 and the second external magnet 2520. Thus, the second internal magnet 2420 can also move when the second external magnet 2520 moves.

[0481] The first external magnet 2510 is movable along the optical axis. The first internal magnet 2410 and the first camera module 2200 can move together when the first external magnet 2510 moves along the optical axis. That is, the first external magnet 2510 can cause the first camera module 2200 to move along the optical axis. The movement of the first external magnet 2510 can be restricted to a first axial direction perpendicular to the optical axis and a second axial direction perpendicular to both the optical axis and the first axial direction.

[0482] As a modified implementation, the first external magnet 2510 can move along the optical axis and the second axis. In this case, the first external magnet 2510 can move the first camera module 2200 along the optical axis and the second axis. Furthermore, in one embodiment, the first external magnet 2510 can move along either the optical axis, the first axis, or the second axis. In this case, movement can be restricted to the directions of the two axes other than one of the axes.

[0483] The second external magnet 2520 is movable along the first axis. The second internal magnet 2420 and the first camera module 2200 can move together when the second external magnet 2520 moves along the first axis. That is, the second external magnet 2520 can move the first camera module 2200 along the first axis. The movement of the second external magnet 2520 in the optical axis direction and the second axis direction may be restricted. In one embodiment, the second external magnet 2520 can move along either the optical axis, the first axis, or the second axis. In this case, the movement can be restricted to the directions of the two axes other than one axis. However, the second external magnet 2520 can move in a direction different from that of the first external magnet 2510.

[0484] The camera assembly may include a sealing member 2600. The sealing member 2600 may be disposed between the second camera module 2300 and the bracket 2100. The sealing member 2600 can secure the second camera module 2300 to the bracket 2100. The sealing member 2600 may include epoxy resin. The sealing member 2600 may be an adhesive member. The sealing member 2600 may be adhesive. The sealing member 2600 may be non-conductive. The sealing member 2600 may be disposed at the step difference 2150 of the bracket 2100.

[0485] In this embodiment, by moving the second magnet 2500 up, down, left, and right, the optical axis of the first camera module 2200 can be aligned with the optical axis of the second camera module 2300. In a comparative example, the first camera module 2200 can be fixed to the bracket 2100 by a sealing member 2600 or an adhesive member. In this case, the first camera module 2200 cannot be fine-tuned after the sealing member 2600 or the adhesive member has cured. However, in this embodiment, the first camera module 2200 can be fine-tuned at a desired stage of the assembly process. Furthermore, in this embodiment, after aligning the optical axis of the first camera module 2200 with the optical axis of the second camera module 2300 using the second magnet 2500, the first camera module 2200 can be fixed to the bracket 2100 using the sealing member 2600 or the adhesive member.

[0486] The manufacturing process of this embodiment can be performed according to the following steps: In a first step, a first camera module 2200 having a fixed focus (ff) and a second camera module 2300 having an autofocus (AF) are prepared. In a second step, the second camera module 2300 is fixed to a bracket 2100. In a third step, the first camera module 2200 is inserted into the bracket 2100. As a fourth step, the first camera module 2200 is fine-tuned using a second magnet 2500.

[0487] In this embodiment, since the first magnet 2400 can be fixed by an insertion method when the holder 2240 of the first camera module 2200 is injected, this embodiment has the advantage of not requiring a separate assembly process. Furthermore, this embodiment has the advantage of easily dispersing the magnet fastening positions. Additionally, in this embodiment, the position of the magnets is managed, making it easy to manage the center of gravity when assembling with the bracket 2100. Furthermore, according to this embodiment, precise control can be performed by adjusting the number of magnets according to the module concept. This embodiment uses two pairs of magnets to finely assemble the first camera module 2200 along two axial directions; however, as a modified embodiment, three pairs of magnets can be used to finely assemble the first camera module 2200 along three axial directions.

[0488] According to this embodiment, the magnet recess can be easily implemented in the bracket 2100. Furthermore, the first camera module 2200 has the advantage that it can be fixed to the bracket 2100 without using a sealing member 2600, such as epoxy resin. However, the first camera module 2200 can also be fixed to the bracket 2100 using an additional sealing member 2600.

[0489] In the following description, an optical device according to a second embodiment of the present invention will be described with reference to the accompanying drawings.

[0490] Figure 34 This is a perspective view illustrating an optical device according to a second embodiment of the present invention; and

[0491] Figure 35 This is a block diagram of an optical device according to a second embodiment of the present invention.

[0492] Optical device 2010B may include portable terminals. Optical device 2010B may be any of the following: handheld telephone, mobile phone, smartphone, portable smart device, digital camera, laptop computer, digital broadcasting terminal, personal digital assistant (PDA), portable multimedia player (PMP), and navigation. However, the type of optical device 2010B is not limited to these, and any device for capturing video or images may be included in optical device 2010B.

[0493] Optical device 2010B may include a main body 2850. The main body 2850 may have a strip shape. Alternatively, the main body 2850 may have various structures, such as sliding, folding, swinging, or rotating types, wherein two or more sub-body parts are connected to be movable relative to each other. The main body 2850 may include a shell (outer shell, housing, and cover) forming the exterior. For example, the main body 2850 may include a front shell 2851 and a rear shell 2852. Various electronic components of optical device 2010B may be embedded in the space formed between the front shell 2851 and the rear shell 2852. A display module 2753 may be disposed on one surface of the main body 2850. A camera 2721 may be disposed on one or more surfaces of the main body 2850 and another surface disposed on the opposite side of said one surface.

[0494] In this embodiment, a camera-radar composite device may be provided in the space corresponding to the border between the edge of the main body 2860 and the display.

[0495] Optical device 2010B may include wireless communication unit 2710. Wireless communication unit 2710 may include one or more modules capable of wireless communication between optical device 2010B and a wireless communication system, or between optical device 2010B and the network in which optical device 2010B resides. For example, wireless communication unit 2710 may include any one or more of the following: broadcast receiving module 2711, mobile communication module 2712, wireless internet module 2713, short-range communication module 2714, and location information module 2715.

[0496] Optical device 2010B may include an A / V input unit 2720. The A / V input unit 2720 is used to input audio or video signals and may include either or more of a camera 2721 and a microphone 2722. In this case, camera 2721 may include a camera module according to this embodiment.

[0497] The optical device 2010B may include a sensing unit 2740. The sensing unit 2740 can generate sensing signals for controlling the operation of the optical device 2010B by detecting the current state of the optical device 2010B, such as its on / off state, position, presence or absence of user contact, orientation, acceleration / deceleration, etc. For example, when the optical device 2010B is in the form of a sliding phone, it can sense whether the sliding phone is on or off. Additionally, the sensing unit 2740 is responsible for sensing functions related to whether the power supply unit 2790 is supplying power and whether the interface unit 2770 is connected to an external device.

[0498] Optical device 2010B may include input / output unit 2750. Input / output unit 2750 may be configured to generate inputs or outputs related to vision, hearing, or touch. Input / output unit 2750 may generate input data for controlling the operation of optical device 2010B and may output information processed by optical device 2010B.

[0499] Input / output unit 2750 may include any or more of keyboard unit 2751, touchscreen panel 2752, display module 2753, and sound output module 2754. Keyboard unit 2751 may generate input data in response to keyboard input. Touchscreen panel 2752 may convert capacitance changes caused by a user touching a specific area of ​​the touchscreen into electrical input signals. Display module 2753 may output images captured by camera 2721. Display module 2753 may include multiple pixels whose colors change according to electrical signals. For example, display module 2753 may include at least one of liquid crystal display, thin-film transistor liquid crystal display, organic light-emitting diode, flexible display, and 3D display. Sound output module 2754 may output audio data received from wireless communication unit 2710 in call signal receiving, call mode, recording mode, voice recognition mode, or broadcast receiving mode, or output audio data stored in memory unit 2760.

[0500] Optical device 2010B may include memory unit 2760. Programs for processing and controlling control unit 2780 may be stored in memory unit 2760. Additionally, memory unit 2760 may store input / output data, such as phone books, messages, audio, still images, photographs, and moving pictures, or one or more of these. Memory unit 2760 may also store images, such as photographs or videos, captured by camera 2721.

[0501] Optical device 2010B may include interface unit 2770. Interface unit 2770 serves as a path for connecting to external devices connected to optical device 2010B. Interface unit 2770 can receive data from external devices, receive power and transmit it to each component inside optical device 2010B, or transmit data from inside optical device 2010B to external devices. Interface unit 2770 may include any one or more of the following: a wired / wireless headphone port, an external charger port, a wired / wireless data port, a memory card port, a port for connecting a device equipped with an identification module, and an audio I / O port, a video I / O port, and a headphone port.

[0502] Optical device 2010B may include control unit 2780. Control unit 2780 can control the overall operation of optical device 2010B. Control unit 2780 can perform related control and processing for voice calls, data communication, video calls, etc. Control unit 2780 may include display control unit 2781, which controls display module 2753, which serves as the display of optical device 2010B. Control unit 2780 may include camera control unit 2782, which controls camera module. Control unit 2780 may include multimedia module 2783 for playing multimedia. Multimedia module 2783 may be located inside control unit 2180 or may be located separately from control unit 2780. Control unit 2780 can perform pattern recognition processing, which can recognize handwritten input or drawing input performed on the touchscreen as characters and images, respectively.

[0503] The optical device 2010B may include a power supply unit 2790. The power supply unit 2790 may receive external or internal power under the control of the control unit 2780 to supply the power required for the operation of each component.

[0504] The bracket 2100 and magnet of the second embodiment of the present invention can be used to dual-configure the camera module of the first embodiment of the present invention and the camera module of the third embodiment of the present invention. That is, either the camera module of the second embodiment of the present invention or the camera module of the third embodiment of the present invention can replace the first camera module 2200, and the other of the camera module of the second embodiment of the present invention or the camera module of the third embodiment of the present invention can replace the second camera module 2300.

[0505] In the following description, the configuration of a printed circuit board according to a third embodiment of the present invention will be described with reference to the accompanying drawings.

[0506] Figure 36a This is a plan view of a printed circuit board according to a third embodiment of the present invention; Figure 36b This is a plan view of a printed circuit board according to another embodiment; Figure 37 This is a conceptual diagram of a printed circuit board based on a modified implementation method; Figure 38 This is a conceptual diagram of a printed circuit board according to another modified embodiment; Figure 39 This is a conceptual diagram illustrating a cross-section of a printed circuit board and an image sensor according to a third embodiment of the present invention; and Figure 40 This is a conceptual diagram of a printed circuit board according to a modified implementation, as shown when viewed from above.

[0507] Printed circuit board (PCB) 3010 may be a component of the camera module. PCB 3010 may be a board or circuit board. PCB 3010 may include a rigid PCB. PCB 3010 may include a flexible PCB. A lens driving device may be disposed within PCB 3010. The lens driving device may be disposed on PCB 3010. The lens driving device may be disposed above PCB 3010. A sensor base may be disposed between PCB 3010 and the lens driving device. PCB 3010 may be electrically connected to the lens driving device. An image sensor 3020 may be disposed within PCB 3010. PCB 3010 may include various circuits, devices, control units, etc., to convert the image formed on the image sensor 3020 into an electrical signal and send the electrical signal to an external device.

[0508] The printed circuit board 3010 may include an insulating layer 3011. The insulating layer 3011 may be formed of an insulating material. The insulating layer 3011 may be formed of a non-conductive material. The insulating layer 3011 may form the body of the printed circuit board 3010. The insulating layer 3011 may be disposed perpendicular to the direction of the optical axis.

[0509] The insulating layer 3011 may include an upper surface facing the lens driving device, a lower surface disposed on an opposite side of the upper surface, and a side surface connecting the upper and lower surfaces. The side surfaces of the insulating layer 3011 may include multiple side surfaces. The side surfaces of the insulating layer 3011 may include four side surfaces. The side surfaces of the insulating layer 3011 may include a first side surface to a fourth side surface.

[0510] Insulating layer 3011 may include multiple insulating layers. Insulating layer 3011 may include three insulating layers. Insulating layer 3011 may include a first insulating layer, a second insulating layer disposed on the first insulating layer, and a third insulating layer disposed on the second insulating layer. A conductive layer 3012 may be disposed between the multiple insulating layers. That is, the insulating layers and the conductive layer 3012 may be alternately stacked multiple times.

[0511] The insulating layer 3011 may include edges formed where the upper surface meets the side surfaces. The edges may be corners, sides, or boundaries. The edges of the insulating layer 3011 may include multiple edges. The edges of the insulating layer 3011 may be formed to correspond to the number of side surfaces. The edges of the upper surface of the insulating layer 3011 may include four edges corresponding to the four side surfaces. The edges of the insulating layer 3011 may include four edges. The edges of the insulating layer 3011 may include first edges to fourth edges 3011a, 3011b, 3011c, and 3011d. The edges of the insulating layer 3011 may include a first edge 3011a disposed along a first direction perpendicular to the optical axis. The edges of the insulating layer 3011 may include a second edge 3011b disposed along a second direction perpendicular to both the optical axis and the first direction. In this case, the first direction may be the x-axis direction, and the second direction may be the y-axis direction. Conversely, the first direction may be the y-axis direction, and the second direction may be the x-axis direction.

[0512] The printed circuit board may include a conductive layer 3012. The conductive layer 3012 may be an electrically conductive layer or a thermally conductive layer. The conductive layer 3012 may include conductive lines. The conductive layer 3012 may be disposed on an insulating layer 3011. The conductive layer 3012 may be electrically connected to an image sensor 3020. The conductive layer 3012 may be conductive. Electricity can flow through the conductive layer 3012. The conductive layer 3012 may include a conductive material. The conductive layer 3012 may include copper. The conductive layer 3012 may be formed of copper. The conductive layer 3012 may be connected to the image sensor 3020. The conductive layer 3012 may be electrically connected to the image sensor 3020. The conductive layer 3012 may dissipate heat generated by the image sensor 3020. That is, a conductive layer 3012 disposed over a large area can facilitate heat dissipation of the image sensor 3020. In this embodiment, the conductive layer 3012 may be disposed over an area larger than that of a typical conductive layer.

[0513] The conductive layer 3012 may include a first conductive layer 3012a. The first conductive layer 3012a may be disposed on the upper surface of the insulating layer 3011. The first conductive layer 3012a may be spaced apart from the corner where the first edge 3011a and the second edge 3011b of the insulating layer 3011 meet. A first hole may be formed between the corner where the first edge 3011a and the second edge 3011b of the first conductive layer 3012a meet the insulating layer 3011. The printed circuit board 3010 may be connected to a camera module or optical device through the first hole. More specifically, screws may be inserted into or connected to the first hole of the printed circuit board 3010.

[0514] The first conductive layer 3012a can extend from the edge of the upper surface of the insulating layer 3011. In this embodiment, the first conductive layer 3012a can extend from the first region 314 where the image sensor 3020 is disposed to the edge of the upper surface of the insulating layer 3011. This ensures the area of ​​the conductive layer 3012, that is, ensures the area for dissipating heat generated from the image sensor 3020. Furthermore, the first conductive layer 3012a and the second conductive layer 3012b can be connected.

[0515] The first conductive layer 3012a may include a first portion 3012a-1. The first portion 3012a-1 may extend from the first edge 3011a of the insulating layer 3011. The first portion 3012a-1 may be disposed on the first edge 3011a of the insulating layer 3011. The first portion 3012a-1 may extend to the first edge 3011a of the insulating layer 3011. The length of the first portion 3012a-1 of the first conductive layer 3012a in a first direction perpendicular to the optical axis may be longer than the length of the image sensor 3020 in the first direction. In this case, the first edge 3011a may be disposed along the first direction. The first portion 3012a-1 of the first conductive layer 3012a may be continuously disposed within the length segment in the first direction.

[0516] The first conductive layer 3012a may include a second portion 3012a-2. The second portion 3012a-2 may extend from the second edge 3011b of the insulating layer 3011. The second portion 3012a-2 may be disposed on the second edge 3011b of the insulating layer 3011. The second portion 3012a-2 may extend to the second edge 3011b of the insulating layer 3011. The length of the second portion 3012a-2 of the first conductive layer 3012a in the second direction may be longer than the length of the image sensor 3020 in the second direction. In this case, the second edge 3011b may be disposed along the second direction. The second portion 3012a-2 of the first conductive layer 3012a may be continuously disposed within the length segment in the second direction.

[0517] The first portion 3012a-1 and the second portion 3012a-2 of the first conductive layer 3012a can be connected on the upper surface of the insulating layer 3011. The first portion 3012a-1 and the second portion 3012a-2 can be interconnected. The first portion 3012a-1 and the second portion 3012a-2 can be integrally formed.

[0518] The first conductive layer 3012a may include a third portion 3012a-3. The third portion 3012a-3 may be connected from the third edge 3011c of the insulating layer 3011. The third portion 3012a-3 may be disposed within the third edge 3011c of the insulating layer 3011. The third portion 3012a-3 may extend to the third edge 3011c of the insulating layer 3011. The third portion 3012a-3 may be disposed intermittently. As a modified embodiment, the third portion 3012a-3 may also be continuously disposed in a length segment in the second direction, like the second portion 3012a-2. The third portion 3012a-3 may be disposed on the opposite side of the second portion 3012a-2 relative to the center of the printed circuit board 3010.

[0519] The first conductive layer 3012a may be spaced apart from at least one of the four edges of the upper surface of the insulating layer 3011. In a modified embodiment, the first conductive layer 3012a may be connected to all four edges of the upper surface of the insulating layer 3011.

[0520] In another embodiment, such as Figure 36b As shown, the first and second portions of the first conductive layer 3012a can be omitted, and only the third portion 3012a-3 can be formed. That is, in another embodiment, the first conductive layer 3012a is connected to one of the four edges of the upper surface of the insulating layer 3011, and can be spaced apart from the other three edges.

[0521] The conductive layer 3012 may include a second conductive layer 3012b. The second conductive layer 3012b may be disposed on a side surface of the insulating layer 3011. The second conductive layer 3012b may dissipate heat generated in the image sensor 3020. The second conductive layer 3012b may be continuously disposed on the side surface of the insulating layer 3011. The second conductive layer 3012b may be disposed on each of the plurality of side surfaces of the insulating layer 3011. However, the second conductive layer 3012b may not be disposed on some of the plurality of side surfaces of the insulating layer 3011. The second conductive layer 3012b may be disposed on at least three of the four side surfaces of the insulating layer 3011. As a modified embodiment, such as... Figure 37 As shown, the second conductive layer 3012b can be disposed on two side surfaces, which are disposed on opposite sides of the four side surfaces of the insulating layer 3011. The first conductive layer 3012a can be directly connected to the second conductive layer 3012b at the edge of the insulating layer 3011.

[0522] The second conductive layer 3012b may include a first portion disposed on the first side surface of the insulating layer 3011. In this case, the first portion of the second conductive layer 3012b may cover 90% or more of the area of ​​the first side surface of the insulating layer 3011. Alternatively, the first portion of the second conductive layer 3012b may cover 80% or more of the area of ​​the first side surface of the insulating layer 3011.

[0523] As a modified implementation method, such as Figure 38 As shown, the second conductive layer 312b-1 may include a hole 312b-2 formed in the second conductive layer 312b-1 and exposing a portion of the side surface of the insulating layer 3011. The second conductive layer 312b-1 may be provided intermittently. The length of the first conductive layer 3012a may be different from the length of the second conductive layer 312b-1 in the corresponding direction.

[0524] The conductive layer 3012 may include a third conductive layer 3012c. The third conductive layer 3012c may be disposed on the lower surface of the insulating layer 3011. The second conductive layer 3012b can connect the first conductive layer 3012a and the third conductive layer 3012c. That is, the third conductive layer 3012c can be connected to the first conductive layer 3012a through the second conductive layer 3012b. In addition, the third conductive layer 3012c can be connected to the first conductive layer 3012a through a fourth conductive layer 3012d.

[0525] The conductive layer 3012 may include a fourth conductive layer 3012d. The fourth conductive layer 3012d may be disposed on the inner peripheral surface of the through hole 3013. The fourth conductive layer 3012d may connect the first conductive layer 3012a and the third conductive layer 3012c.

[0526] The conductive layer 3012 may include a fifth conductive layer 3012e. The fifth conductive layer 3012e may be disposed between multiple insulating layers. The fifth conductive layer 3012e may be alternately stacked on multiple insulating layers. The fifth conductive layer 3012e may include multiple conductive layers. The fifth conductive layer 3012e may include two conductive layers. The fifth conductive layer 3012e may include a fifth-first conductive layer and a fifth-second conductive layer disposed between the first insulating layer and the third insulating layer. The fifth conductive layer 3012e may be connected to at least one of the first conductive layer 3012a and the third conductive layer 3012c via a fourth conductive layer 3012d. The fifth conductive layer 3012e may be connected to at least one of the first conductive layer 3012a and the third conductive layer 3012c via a second conductive layer 3012b.

[0527] The printed circuit board 3010 may include through-holes 3013. The through-holes 3013 can penetrate the insulating layer 3011 along the optical axis. Through-holes 3013 can be formed for electrical connections between conductive layers 3012. That is, through-holes 3013 can be provided to electrically connect the first conductive layer 3012a, the third conductive layer 3012c, and the fifth conductive layer 3012e. Alternatively, the through-holes 3013 can dissipate heat generated in the image sensor 3020. In this embodiment, as the area of ​​the conductive layer 3012 increases, at least some of the through-holes 3013 used for heat dissipation can be omitted. Through-holes 3013 may include multiple through-holes.

[0528] In the following description, the configuration of a camera module according to a third embodiment of the present invention will be described with reference to the accompanying drawings.

[0529] Figure 41 This is an exploded perspective view of a lens driving device according to a third embodiment of the present invention; and Figures 42 to 45 This is an exploded perspective view of a portion of a lens driving device according to a third embodiment of the present invention.

[0530] A camera module can be a camera device.

[0531] The camera module may include a printed circuit board (PCB) 3010. The above can be applied to the printed circuit board 3010 of the camera module.

[0532] The camera module may include an image sensor 3020. The image sensor 3020 may be configured such that light passing through a lens and a filter is incident to form an image. The image sensor 3020 may be disposed in a printed circuit board 3010. The image sensor 3020 may be disposed on the printed circuit board 3010. The image sensor 3020 may be disposed above the printed circuit board 3010. The image sensor 3020 may be disposed on the upper surface of an insulating layer 3011 of the printed circuit board 3010. The image sensor 3020 may be disposed above the insulating layer 3011 of the printed circuit board 3010. The image sensor 3020 may be mounted on the printed circuit board 3010. The image sensor 3020 may be electrically connected to the printed circuit board 3010. For example, the image sensor 3020 may be coupled to the printed circuit board 3010 via surface mount technology (SMT). As another example, the image sensor 3020 may be coupled to the printed circuit board 3010 via flip-chip technology. The image sensor 3020 may be configured such that the lens and optical axis coincide. In other words, the optical axis of the image sensor 3020 and the optical axis of the lens can be aligned. The image sensor 3020 can convert light illuminating the effective image area of ​​the image sensor 3020 into electrical signals. The image sensor 3020 can be any of a charge-coupled device (CCD), metal-oxide-semiconductor (MOS), CPD, and CID.

[0533] The camera module may include a lens module. The lens module may include at least one lens. The lens may be positioned corresponding to an image sensor. The lens module may include a lens and a lens barrel. The lens module may be coupled to the coil holder 3210 of the lens drive device. The lens module may be coupled to the coil holder 3210 via threaded connections and / or adhesives. The lens module may be integrally movable with the coil holder 3210.

[0534] The camera module may include a filter. The filter can be used to block light of a specific frequency band passing through the lens module from incident on the image sensor. The filter can be configured to be parallel to the xy plane. The filter can be disposed between the lens module and the image sensor. The filter can be disposed on the sensor base. In a modified embodiment, the filter can be disposed in the base 3410. The filter may include an infrared filter. The infrared filter can block light in the infrared region from incident on the image sensor.

[0535] The camera module may include a sensor base. The sensor base may be disposed between the lens drive unit and the printed circuit board 3010. The sensor base may include a protruding portion with a filter. An opening may be formed in the portion of the sensor base with the filter, allowing light passing through the filter to enter the image sensor. An adhesive member may connect or attach the base 3410 of the lens drive unit to the sensor base. The adhesive member may also be used to prevent foreign objects from entering the interior of the lens drive unit. The adhesive member may include any or more of epoxy resin, thermosetting adhesive, and UV-curable adhesive.

[0536] The camera module may include a motion sensor. The motion sensor may be mounted on a printed circuit board 3010. The motion sensor can be electrically connected to the control unit via a circuit pattern provided in the printed circuit board 3010. The motion sensor can output rotational angular velocity information caused by the movement of the camera module. The motion sensor may include a 2-axis gyroscope sensor or a 3-axis gyroscope sensor, or may include an angular velocity sensor.

[0537] The camera module may include a control unit. The control unit may be disposed in a printed circuit board 3010. The control unit may be electrically connected to the first coil 3220 and the second coil 3430 of the lens drive device. The control unit may independently control the direction, intensity, and amplitude of the current supplied to the first coil 3220 and the second coil 3430. The control unit may control the lens drive device to perform autofocus and / or image stabilization functions. Furthermore, the control unit may perform autofocus feedback control and / or image stabilization feedback control on the lens drive device.

[0538] The camera module may include a connector. The connector may be electrically connected to the printed circuit board 3010. The connector may include a port for electrical connection to an external device.

[0539] The camera module may include a lens drive device. The lens drive device may be a voice coil motor (VCM). The lens drive device may be a lens drive motor. The lens drive device may be a lens drive actuator. The lens drive device may include an autofocus (AF) module. The lens drive device may include an optical image sensor (OIS) module.

[0540] The lens driving device may include a cover member 3100. The cover member 3100 may include a "cover". The cover member 3100 may be disposed on the outer side of the housing 3310. The cover member 3100 may be coupled to the base 3410. The cover member 3100 may house the housing 3310 therein. The cover member 3100 may form the appearance of the lens driving device. The cover member 3100 may have a hexahedral shape with an open lower surface. The cover member 3100 may be made of a non-magnetic material. The cover member 3100 may be directly soldered to the first conductive layer 3012a of the printed circuit board 3010 or connected to the first conductive layer 3012a of the printed circuit board 3010 via conductive adhesive. The cover member 3100 may be connected to the ground terminal of the printed circuit board 3010. Thus, the cover member 3100 may be grounded. The cover member 3100 may block electromagnetic interference (EMI). In this case, the cover member 3100 may be referred to as an "EMI shield".

[0541] The cover member 3100 may include a top plate and a side plate. The top plate includes a hole 3111, and the side plate extends downward from the outer periphery or edge of the top plate. The lower end of the side plate of the cover member 3100 may be disposed in a stepped portion 3412 of the base 3410. The inner surface of the side plate of the cover member 3100 may be fixed to the base 3410 by an adhesive.

[0542] The lens driving device may include a first mover 3200. The first mover 3200 may be coupled to the lens. The first mover 3200 may be connected to a second mover 3300 via an upper elastic member 3510 and / or a lower elastic member 3520. The first mover 3200 may move through interaction with the second mover 3300. At this time, the first mover 3200 may move integrally with the lens. Simultaneously, the first mover 3200 may move during AF driving. In this case, the first mover 3200 may be referred to as an "AF mover". However, even during OIS driving, the first mover 3200 may move together with the second mover 3300.

[0543] The first mover 3200 may include a coil holder 3210. The coil holder 3210 may be disposed inside a housing 3310. The coil holder 3210 may be disposed in a hole 3311 in the housing 3310. The coil holder 3210 may be movably coupled to the housing 3310. The coil holder 3210 may move against the housing 3310 along the optical axis. A lens may be coupled to the coil holder 3210. The coil holder 3210 and the lens may be coupled by threaded connection and / or adhesive. A first coil 3220 may be coupled to the coil holder 3210. An upper elastic member 3510 may be coupled to the upper portion or upper surface of the coil holder 3210. A lower elastic member 3520 may be coupled to the lower portion or lower surface of the coil holder 3210. The coil holder 3210 may be coupled to the upper elastic member 3510 and / or the lower elastic member 3520 by thermal fusion and / or adhesive. The adhesive that connects the coil frame 3210 and the lens, as well as the coil frame 3210 and the elastic member 3500, may be an epoxy resin that is cured by at least one of ultraviolet (UV), heat, and laser.

[0544] The coil holder 3210 may include an upper surface 3211. The inner portion 3511 of the upper elastic member 3510 may be disposed on the upper surface 3211 of the coil holder 3210. The upper surface 3211 of the coil holder 3210 may be disposed at a position higher than the upper surface 3611 of the second magnet 3610. The upper surface 3211 of the coil holder 3210 may be spaced apart from the upper surface 3611 of the second magnet 3610.

[0545] The coil holder 3210 may include a groove 3212. The groove 3212 may be a recess. A second magnet 3610 may be disposed in the groove 3212. A portion of the coil holder 3210 corresponding to the upper surface 3611 of the second magnet 3610 may be opened through the groove 3212 of the coil holder 3210. The groove 3212 of the coil holder 3210 may be formed in the upper surface 3211 of the coil holder 3210. The groove 3212 of the coil holder 3210 may be formed on the inner circumferential surface of the coil holder 3210. At least a portion of the groove 3212 of the coil holder 3210 may be formed to correspond to the shape and size of the second magnet 3610. The coil holder 3210 may include a groove formed below the first region 3514. This groove may be connected to the groove (recess) 3212 of the coil holder 3210. That is, this groove may be identified as a single groove without being distinguished from the groove 3212 of the coil holder 3210. The groove 3212 may be a portion where the second magnet 3610 is provided, or the groove may be a portion where the second magnet 3610 is not provided.

[0546] The coil holder 3210 may include a recessed portion 3213. The recessed portion 3213 may be formed in a portion corresponding to the connecting portion 3513 of the upper elastic member 3510. The recessed portion 3213 may be recessed from the upper surface 3211 of the coil holder 3210. Therefore, when the connecting portion 3513 of the upper elastic member 3510 moves downward from its initial state, interference between the connecting portion 3513 and the coil holder 3210 can be prevented. The recessed portion 3213 may be spaced apart from the groove 3212 of the coil holder 3210.

[0547] The coil holder 3210 may include a hole 3214. The hole 3214 can penetrate the coil holder 3210 along the optical axis. The lens module can be accommodated in the hole 3214. For example, a thread corresponding to a thread formed on the outer peripheral surface of the lens module can be provided on the inner peripheral surface of the coil holder 3210 where the hole 3214 is formed.

[0548] The coil holder 3210 may include a protrusion 3215. The protrusion 3215 may include a projection. The protrusion 3215 may be formed on the upper surface 3211 of the coil holder 3210. The protrusion 3215 may protrude from the upper surface 3211 of the coil holder 3210. The protrusion 3215 may be connected to the inner portion 3511 of the upper elastic member 3510. The protrusion 3215 may be inserted into a hole 3511a in the inner portion 3511 of the upper elastic member 3510. The protrusion 3215 may be connected to the hole 3511a in the inner portion 3511.

[0549] The coil holder 3210 may include a coil receiving groove 3216. A first coil 3220 may be coupled to the coil receiving groove 3216. The coil receiving groove 3216 may be formed on the outer peripheral surface of the coil holder 3210. The coil receiving groove 3216 may include a groove formed as a portion of the outer surface of the coil holder 3210 is recessed. The first coil 3220 may be received in the groove of the coil receiving groove 3216. The coil receiving groove 3216 may include a protrusion for supporting the lower surface of the first coil 3220.

[0550] The coil holder 3210 may include an upper stop 3217. The upper stop 3217 may be formed on the upper surface 3211 of the coil holder 3210. The upper stop 3217 may be formed to protrude from the upper surface 3211 of the coil holder 3210. The upper stop 3217 may overlap with the upper plate of the cover member 3100 along the optical axis. The upper stop 3217 may form the uppermost end of the coil holder 3210. Therefore, when the coil holder 3210 moves upward, the upper stop 3217 may contact the upper plate of the cover member 3100. That is, the upper stop 3217 can physically limit the upward travel of the coil holder 3210.

[0551] The coil holder 3210 may include a side stop 3218. The side stop 3218 may be formed on a side surface of the coil holder 3210. The side stop 3218 may be formed to protrude from the side surface of the coil holder 3210. At least a portion of the side stop 3218 may be disposed in a second recess 3313 of the housing 3310. When the coil holder 3210 rotates through this structure, the side stop 3218 of the coil holder 3210 may contact the housing 3310. That is, the side stop 3218 of the coil holder 3210 can restrict the rotation of the coil holder 3210.

[0552] The first mover 3200 may include a first coil 3220. The first coil 3220 may be an "AF drive coil" for AF driving. The first coil 3220 may be disposed within a coil holder 3210. The first coil 3220 may be disposed between the coil holder 3210 and the housing 3310. The first coil 3220 may be disposed on the outer surface or outer peripheral surface of the coil holder 3210. The first coil 3220 may be directly wound in the coil holder 3210. Alternatively, the first coil 3220 may be directly wound and connected to the coil holder 3210. The first coil 3220 may face the first magnet 3320. The first coil 3220 may be configured to face the first magnet 3320. The first coil 3220 may electromagnetically interact with the first magnet 3320. In this case, when current is supplied to the first coil 3220 and an electromagnetic field is formed around the first coil 3220, the first coil 3220 and the first magnet 3320 may interact with each other through electromagnetic interaction. The coil 3220 can move against the first magnet 3320. The first coil 3220 can be formed as a single coil. Alternatively, the first coil 3220 can include multiple coils spaced apart from each other.

[0553] The first coil 3220 may include a pair of leads for supplying power. One end portion (leads) of the first coil 3220 is connected to the first lower elastic unit 3520-1, while the other end portion (leads) of the first coil 3220 may be connected to the second lower elastic unit 3520-2. That is, the first coil 3220 may be electrically connected to the lower elastic member 3520. More specifically, the first coil 3220 may be supplied with power sequentially through a printed circuit board, a first plate 3420, a side elastic member 3530, an upper elastic member 3510, a second plate 3640, and the lower elastic member 3520. As a modified embodiment, the first coil 3220 may be electrically connected to the upper elastic member 3510.

[0554] The lens driving device may include a second mover 3300. The second mover 3300 is movably connected to the stator 3400 via a side elastic member 3530. The second mover 3300 supports the first mover 3200 via an upper elastic member 3510 and a lower elastic member 3520. The second mover 3300 can move the first mover 3200 or can move together with the first mover 3200. The second mover 3300 can move through interaction with the stator 3400. The second mover 3300 can move during OIS driving. In this case, the second mover 3300 may be referred to as an "OIS mover". During OIS driving, the second mover 3300 can move integrally with the first mover 3200.

[0555] The second mover 3300 may include a housing 3310. The housing 3310 may be spaced apart from the base 3410. The housing 3310 may be disposed on the outer side of the coil holder 3210. The housing 3310 may accommodate at least a portion of the coil holder 3210. The housing 3310 may be disposed inside the cover member 3100. The housing 3310 may be disposed between the cover member 3100 and the coil holder 3210. The housing 3310 may be formed of a material different from that of the cover member 3100. The housing 3310 may be formed of an insulating material. The housing 3310 may be formed of an injection-molded material. The outer surface of the housing 3310 may be spaced apart from the inner surface of the side plate of the cover member 3100. The housing 3310 may be movable through the space between the housing 3310 and the cover member 3100 for OIS actuation. A first magnet 3320 may be disposed within the housing 3310. The housing 3310 and the first magnet 3320 may be joined by an adhesive. The upper elastic member 3510 can be attached to the upper portion or upper surface of the housing 3310. The lower elastic member 3520 can be attached to the lower portion or lower surface of the housing 3310. The housing 3310 can be attached to the upper elastic member 3510 and the lower elastic member 3520 by heat fusion and / or adhesive. The adhesive used to attach the housing 3310 and the first magnet 3320, and the housing 3310 and the elastic member 3500, can be an epoxy resin that is cured by at least one of ultraviolet (UV), heat, and laser.

[0556] The housing 3310 may include four side portions and four corner portions disposed between the four side portions. The side portions of the housing 3310 may include: a first side portion, a second side portion disposed on an opposite side of the first side portion, and a third and a fourth side portion disposed on opposite sides of the first side portion. The corner portions of the housing 3310 may include: a first corner portion disposed between the first and third side portions; a second corner portion disposed between the first and fourth side portions; a third corner portion disposed between the second and third side portions; and a fourth corner portion disposed between the second and fourth side portions. The side portions of the housing 3310 may include "sidewalls".

[0557] The housing 3310 may include a hole 3311. The hole 3311 may be formed in the housing 3310. The hole 3311 may be formed to penetrate the housing 3310 along the optical axis. A coil holder 3210 may be disposed in the hole 3311. The hole 3311 may be formed in a shape that at least partially corresponds to the coil holder 3210. The inner peripheral surface or inner side surface of the housing 3310 with the hole 3311 may be spaced apart from the outer peripheral surface of the coil holder 3210. However, the housing 3310 and the coil holder 3210 may at least partially overlap along the optical axis to limit the travel distance of the coil holder 3210 in the optical axis direction.

[0558] The housing 3310 may include a first groove 3312. The first groove 3312 may be formed by recessing into the upper surface of the housing 3310. The first groove 3312 may be formed at a position corresponding to the connecting portion 3513 of the upper elastic member 3510. When the connecting portion 3513 of the upper elastic member 3510 moves downward from its initial position, the first groove 3312 can prevent interference between the upper elastic member 3510 and the housing 3310.

[0559] The housing 3310 may include a second recess 3313. The second recess 3313 may accommodate at least a portion of the side stop portion 3218 of the coil holder 3210. The second recess 3313 may be formed to have a predetermined gap between the second recess 3313 and the side stop portion 3218.

[0560] The housing 3310 may include a magnet receiving recess 3314. A first magnet 3320 may be coupled to the magnet receiving recess 3314. The magnet receiving recess 3314 may include a groove formed by recessing a portion of the inner peripheral surface and / or lower surface of the housing 3310. The magnet receiving recess 3314 may be formed in each of the four corner portions of the housing 3310. In a modified embodiment, the magnet receiving recess 3114 may be formed in each of the four side portions of the housing 3310.

[0561] The housing 3310 may include a hole 3315. The hole 3315 may be formed in a corner portion of the housing 3310. The hole 3315 may be formed to penetrate the housing 3310 along the optical axis. The wire of the side elastic member 3530 may be disposed in the hole 3315 of the housing 3310.

[0562] The housing 3310 may include a protrusion 3316. A protrusion 3318 may be formed on the upper surface of the housing 3310. The protrusion 3316 may protrude from the upper surface of the housing 3310. The protrusion 3316 may be coupled to the outer portion 3512 of the upper elastic member 3510. The protrusion 3316 may be inserted into a hole in the outer portion 3512 of the upper elastic member 3510.

[0563] The housing 3310 may include an upper stop 3317. The upper stop 3317 may protrude from the upper surface of the housing 3310. The upper stop 3317 may be formed on the upper surface of the housing 3310. The upper stop 3317 may overlap with the upper plate of the cover member 3100 along the optical axis. The upper stop 3317 may form the uppermost end of the housing 3310. Therefore, when the housing 3310 moves upward, the upper stop 3317 may contact the upper plate of the cover member 3100. That is, the upper stop 3317 may restrict the upward movement of the housing 3310.

[0564] The housing 3310 may include a side stop 3318. The side stop 3318 may protrude from the outer surface of the housing 3310. The side stop 3318 may face the inner surface of the side plate of the cover member 3100. When the housing 3310 moves in the lateral direction, the side stop 3318 may contact the side plate of the cover member 3100. That is, the side stop 3318 may physically limit the travel of the housing 3310 in the lateral direction.

[0565] The second mover 3300 may include a first magnet 3320. The first magnet 3320 may be disposed within the housing 3310. The first magnet 3320 may be fixed to the housing 3310 by adhesive. The first magnet 3320 may be disposed between the coil holder 3210 and the housing 3310. The first magnet 3320 may face the first coil 3220. The first magnet 3320 may electromagnetically interact with the first coil 3220. The first magnet 3320 may face the second coil 3430. The first magnet 3320 may electromagnetically interact with the second coil 3430. The first magnet 3320 may be used for both AF drive and OIS drive. The first magnet 3320 may be disposed in a corner portion of the housing 3310. In this case, the first magnet 3320 may be a corner magnet with a hexahedral shape on its inner surface larger than that on its outer surface. As a modified embodiment, the first magnet 3320 may be disposed in a side portion of the housing 3310. At this time, the first magnet 3320 can be a flat magnet with a flat plate shape.

[0566] The lens driving device may include a stator 3400. The stator 3400 may be disposed below the first mover 3200 and the second mover 3300. The stator 3400 may movably support the second mover 3300. The stator 3400 may move the second mover 3300. At this time, the first mover 3200 may also move together with the second mover 3300.

[0567] The stator 3400 may include a base 3410. The base 3410 may be disposed below the housing 3310. The base 3410 may be disposed below a first plate 3420. The first plate 3420 may be disposed on the upper surface of the base 3410. The base 3410 may be connected to a cover member 3100. The base 3410 may be disposed above a printed circuit board.

[0568] The base 3410 may include a hole 3411. The hole 3411 may be a hollow hole formed in the base 3410. The hole 3411 may penetrate the base 3410 along the optical axis. Light passing through the lens module through the hole 3411 may be incident on the image sensor 360.

[0569] The base 3410 may include a stepped portion 3412. The stepped portion 3412 may be formed on a side surface of the base 3410. The stepped portion 3412 may be formed around the outer peripheral surface of the base 3410. The stepped portion 3412 may be formed when a portion of the side surface of the base 3410 protrudes or is recessed. The lower end of the side plate of the cover member 3100 may be disposed in the stepped portion 3412.

[0570] The base 3410 may include a recess 3413. A terminal portion 3422 of the first plate 3420 may be disposed in the recess 3413. The recess 3413 may be formed when a portion of the side surface of the base 3410 is recessed. The width of the recess 3413 may be formed to correspond to the width of the terminal portion 3422 of the first plate 3420. The length of the recess 3413 may be formed to correspond to the length of the terminal portion 3422 of the first plate 3420. Alternatively, since the length of the terminal portion 3422 of the first plate 3420 is longer than the length of the recess 3413, a portion of the terminal portion 3422 may protrude below the base 3410.

[0571] The base 3410 may include a sensor receiving groove 3414. An OIS sensor 3650 may be disposed in the sensor receiving groove 3414. The sensor receiving groove 3414 may accommodate at least a portion of the OIS sensor 3650. The sensor receiving groove 3414 may include a groove formed as the upper surface of the base 3410 is recessed. The sensor receiving groove 3414 may include two grooves. In this case, the OIS sensor 3650 is disposed in each of the two grooves to detect the movement of the first magnet 3320 in the X-axis direction and the movement in the Y-axis direction.

[0572] The base 3410 may include a groove 3415. The groove 3415 may be formed on the upper surface of the base 3410. An adhesive may be disposed in the groove 3410. The adhesive disposed in the groove 3415 can fix the first plate 3420 to the base 3410.

[0573] The base 3410 may include a protrusion 3416. The protrusion 3416 may be formed on the upper surface of the base 3410. The protrusion 3416 may be formed on the outer peripheral surface of the base 3410. The protrusion 3416 may be formed on the outer side of the first plate 3420. The protrusion 3416 is formed on both sides of the first plate 3420, thereby guiding the position of the first plate 3420.

[0574] The stator 3400 may include a first plate 3420. The first plate 3420 may be disposed between the base 3410 and the housing 3310. The first plate 3420 may be disposed on the upper surface of the base 3410. The first plate 3420 may include a second coil 3430 facing the first magnet 3320. The first plate 3420 may supply power to the second coil 3430. A lateral elastic member 3530 may be coupled to the first plate 3420. The first plate 3420 may be coupled with solder to a printed circuit board disposed below the base 3410. The first plate 3420 may include a flexible printed circuit board (FPCB). The first plate 3420 may be partially bent.

[0575] The first plate 3420 may include a body portion 3421. Holes may be formed in the body portion 3421. The first plate 3420 may include a terminal portion 3422. The terminal portion 3422 may extend downward from the body portion 3421 of the first plate 3420. The terminal portion 3422 may be formed when a portion of the first plate 3420 is bent. At least a portion of the terminal portion 3422 may be exposed to the outside. The terminal portion 3422 may be soldered to a printed circuit board disposed below the base 3410. The terminal portion 3422 may be disposed in a recess 3413 of the base 3410. The terminal portion 3422 may include a plurality of terminals.

[0576] The stator 3400 may include a second coil 3430. The second coil 3430 may be a configuration of the first plate 3420, or it may be a configuration separate from the first plate 3420. The second coil 3430 may electromagnetically interact with the first magnet 3320. In this case, when current is supplied to the second coil 3430 and a magnetic field is formed around the second coil 3430, the first magnet 3320 may move against the second coil 3430 through the electromagnetic interaction between the second coil 3430 and the first magnet 3320. The second coil 3430 may cause the housing 3310 and the coil holder 3210 to move against the base 3410 in a direction perpendicular to the optical axis through the electromagnetic interaction with the first magnet 3320. The second coil 3430 may be a fine pattern coil (FP coil) integrally formed in the body portion 3421.

[0577] The lens driving device may include an elastic member 3500. The elastic member 3500 may be at least partially elastic. The elastic member 3500 may be formed of metal. The elastic member 3500 may be formed of a conductive material. The elastic member 3500 may be coupled to the coil holder 3210 and the housing 3310. The elastic member 3500 may elastically support the coil holder 3210. The elastic member 3500 may movably support the coil holder 3210. During AF driving, the elastic member 3500 may support the movement of the coil holder 3210. That is, the elastic member 3500 may include an "AF member". The elastic member 3500 may movably support the housing 3310. That is, the elastic member 3500 may include an "OIS member".

[0578] The elastic member 3500 may include an upper elastic member 3510. The upper elastic member 3510 may be connected to the housing 3310 and the coil holder 3210. The upper elastic member 3510 may be connected to the upper portion of the coil holder 3210 and the upper portion of the housing 3310. The upper elastic member 3510 may be connected to the upper surface of the coil holder 3210. The upper elastic member 3510 may be connected to the upper surface of the housing 3310. The upper elastic member 3510 may be connected to the side elastic member 3530. The upper elastic member 3510 may be formed of a leaf spring.

[0579] The upper elastic member 3510 may include multiple upper elastic units. The upper elastic member 3510 may include four upper elastic units. The upper elastic member 3510 may include first upper elastic units to fourth upper elastic units 3510-1, 3510-2, 3510-3, and 3510-4. The first upper elastic units to fourth upper elastic units 3510-1, 3510-2, 3510-3, and 3510-4 can connect the four upper terminals 3641 of the second plate 3640 and four wires. Each of the four upper elastic units may include a body portion coupled to the housing 3310 and a connecting terminal coupled to the terminals of the second plate 3640.

[0580] The upper elastic member 3510 may include an inner portion 3511. The inner portion 3511 may be coupled to the coil holder 3210. The inner portion 3311 may be coupled to the upper surface of the coil holder 3210. The inner portion 3411 may include a hole 3511a or groove that engages with a protrusion 3215 of the coil holder 3210. The inner portion 3511 may be secured to the coil holder 3210 by adhesive.

[0581] The upper elastic member 3510 may include an outer portion 3512. The outer portion 3512 may be coupled to the housing 3310. The outer portion 3512 may be coupled to the upper surface of the housing 3310. The outer portion 3512 may include a hole or groove that engages with a protrusion 3316 of the housing 3310. The outer portion 3512 may be secured to the housing 3310 by an adhesive.

[0582] The upper elastic member 3510 may include a connecting portion 3513. The connecting portion 3513 can connect the inner portion 3511 and the outer portion 3512. The connecting portion 3513 may be elastic. In this case, the connecting member 3513 may be referred to as an "elastic member". The connecting portion 3513 can be formed by bending two or more times. The connecting portion 3513 may not overlap with the second magnet 3610 along the optical axis. That is, in this embodiment, the connecting portion 3513 can be distinguished from the first region 3514 that overlaps with the second magnet 3610 along the optical axis.

[0583] The upper elastic member 3510 may include a first region 3514. The first region 3514 may be represented as an extension, an extended covering region, a covering portion, a covering extension, a cover portion, a shielding portion, a light-blocking portion, a UV beam-blocking portion, etc. The first region 3514 may extend from the inner side portion 3511. The first region 3514 may overlap with the second magnet 3610 along the optical axis. The first region 3514 may be disposed above the second magnet 3610. When viewed from above, the first region 3514 may cover the upper surface 3611 of the second magnet 3610. When viewed from above, the first region 3514 may cover 90% or more of the area of ​​the upper surface 3611 of the second magnet 3610. The first region 3514 may overlap with at least 40% of the upper surface of the second magnet 3610 along the optical axis. The first region 3514 may overlap with a portion of the upper surface 3611 of the second magnet 3610 along the optical axis. At least a portion of the first region 3514 may overlap with the entire upper surface 3611 of the second magnet 3610 along the optical axis. The first region 3514 may be configured to cover the groove 3212 of the coil holder 3210 that accommodates the second magnet 3610. The first region 3514 may have dimensions that completely cover the upper portion of the groove 3212 of the coil holder 3210.

[0584] The upper elastic member 3510 may include a connecting portion 3515. The connecting portion 3515 may extend from the outer outer portion 3512. The connecting portion 3515 may be connected to the side elastic member 3530. The connecting portion 3515 may include a hole through which wires of the side elastic member 3530 pass. The connecting portion 3515 and the wires may be joined by solder.

[0585] The upper elastic member 3510 may include a terminal portion 3516. The terminal portion 3516 may extend from the outer portion 3512. The terminal portion 3516 may be soldered to the second plate 3640. The upper elastic member 3510 may include four terminal portions 3516 corresponding to the first to fourth upper elastic units 3510-1, 3510-2, 3510-3 and 3510-4.

[0586] The elastic member 3500 may include a lower elastic member 3520. The lower elastic member 3520 may be disposed below the upper elastic member 3510. The lower elastic member 3520 can connect the coil frame 3210 and the housing 3310. The lower elastic member 3520 may be disposed below the coil frame 3210. The lower elastic member 3520 may be connected to the coil frame 3210 and the housing 3310. The lower elastic member 3520 may be connected to the lower surface of the coil frame 3210. The lower elastic member 3520 may be connected to the lower surface of the housing 3310. The lower elastic member 3520 may be formed of a leaf spring.

[0587] The lower elastic member 3520 may include multiple lower elastic units. The lower elastic member 3520 may include two lower elastic units. The lower elastic member 3520 may include a first lower elastic unit 3520-1 and a second lower elastic unit 3520-2. The first lower elastic unit 3520-1 and the second lower elastic unit 3520-2 can connect the two lower terminals 3642 of the second plate 3640 to the first coil 3220.

[0588] The lower elastic member 3520 may include an inner portion 3521. The inner portion 3521 may be coupled to the coil holder 3210. The inner portion 3521 may be coupled to the lower surface of the coil holder 3210. The inner portion 3521 may include a hole or groove that engages with a protrusion of the coil holder 3210. The inner portion 3521 may be secured to the coil holder 3210 by adhesive.

[0589] The lower elastic member 3520 may include an outer portion 3522. The outer portion 3522 may be coupled to the housing 3310. The outer portion 3522 may be coupled to the lower surface of the housing 3310. The outer portion 3522 may include a hole or groove for engaging with a protrusion of the housing 3310. The outer portion 3522 may be secured to the housing 3310 by an adhesive.

[0590] The lower elastic member 3520 may include a connecting portion 3523. The connecting portion 3523 can connect the inner portion 3521 and the outer portion 3522. The connecting portion 3523 may be elastic. In this case, the connecting member 3523 may be referred to as the "elastic portion". The connecting portion 3523 can be formed by bending two or more times.

[0591] The elastic member 3500 may include a side elastic member 3530. The side elastic member 3530 can connect the first plate 3420 and the upper elastic member 3510. The side elastic member 3530 can be soldered to each of the upper elastic member 3510 and the first plate 3420. The side elastic member 3530 can movably support the housing 3310. The side elastic member 3530 can elastically support the housing 3310. The side elastic member 3530 can be at least partially elastic. The side elastic member 3530 can support the movement of the housing 3310 and the coil holder 3210 during OIS actuation. In this case, the side elastic member 3530 may be referred to as an "OIS member". The side elastic member 3530 may include an elastic member. The side elastic member 3530 may be formed of wire. In a modified embodiment, the side elastic member 3530 may be formed as a leaf spring.

[0592] The side elastic member 3530 may include wires. The side elastic member 3530 may include a wire spring. The side elastic member 3530 may include multiple wires. The side elastic member 3530 may include four wires connected in pairs to four upper elastic units. The side elastic member 3530 may include first wires to fourth wires 3531, 3532, 3533, and 3534. The first wire 3531 may be electrically connected to the first upper elastic unit 3510-1. The second wire 3532 may be electrically connected to the second upper elastic unit 3510-2. The third wire 3533 may be electrically connected to the third upper elastic unit 3510-3. The fourth wire 3534 may be electrically connected to the fourth upper elastic unit 3510-4.

[0593] The lens driving device may include a second magnet 3610. The second magnet 3610 may be a "sensing magnet." The second magnet 3610 may be disposed in the coil holder 3210. The second magnet 3610 may be disposed on the upper surface 3611 of the first coil 3220. The second magnet 3610 may be detected by a sensor 3630. The second magnetic field 3610 may face the sensor 3630. The second magnet 3610 may be disposed on a side portion of the coil holder 3210. That is, the second magnet 3610 may be disposed facing the side portion of the housing 3310. The second magnet 3610 is disposed in a groove 3212 of the coil holder 3210 such that the upper surface 3611 of the second magnet 3610 may face the upper elastic member 3510.

[0594] The second magnet 3610 may include: an upper surface 3611; a lower surface disposed on the opposite side of the upper surface 3611 of the second magnet 3610; and an inner surface, an outer surface, and two side surfaces connecting the upper surface 3611 and the lower surface of the second magnet 3610. In this case, the lower surface of the second magnet 3610 can be fixed to the first coil 3220. The inner surface and the two side surfaces of the second magnet 3610 can be fixed to the coil holder 3210.

[0595] In this embodiment, an adhesive can be provided between the first region 3514 of the upper elastic member 3510 and the upper surface 3611 of the second magnet 3610. That is, in addition to being fixed to the lower surface, inner surface, and two side surfaces, the second magnet 3610 can also be fixed to the upper surface. Therefore, the fixing force of the second magnet 3610 can be improved.

[0596] The lens driving device may include a third magnet 3620. The third magnet 3620 may be a "compensating magnet." The third magnet 3620 may be disposed within the coil holder 3210. The third magnet 3620 may be configured to achieve magnetic force balance with the second magnet 3610. The third magnet 3620 may be symmetrical with the second magnet 3610 about the optical axis. The third magnet 3620 may be disposed around the optical axis in a position corresponding to the second magnet 3610. The third magnet 3620 may have dimensions and / or shape around the optical axis corresponding to the dimensions and / or shape of the second magnet 3610. The second magnet 3610 is disposed in one side of the coil holder 3210, while the third magnet 3620 may be disposed in the other side of the coil holder 3210. The third magnet 3620 may be disposed in a side portion of the coil holder 3210. That is, the third magnet 3620 may be disposed in a side portion facing the housing 3310.

[0597] The lens driving device may include a sensor 3630. The sensor 3630 can be used for AF feedback driving. In this case, the sensor 3630 can be referred to as an "AF feedback driving sensor". The sensor 3630 can detect the second magnet 3610. The sensor 3630 can be disposed in the second plate 3640. The sensor 3630 can be disposed in the housing 3310. In a modified embodiment, the sensor 3630 can be disposed in the coil holder 3210. The sensor 3630 can detect the movement of the first mover 3200. The sensor 3630 may include a Hall sensor. In this case, the Hall sensor can detect the movement of the coil holder 3210 and the lens by detecting the magnetic force of the second magnet 3610. The detection value detected by the sensor 3630 can be used for AF feedback control.

[0598] The lens driving device may include a second plate 3640. The second plate 3640 may be disposed within the housing 3310. The second plate 3640 may be disposed within a side wall of the housing 3310. The second plate 3640 may be coupled to a sensor 3630. The second plate 3640 may be electrically connected to the sensor 3630. The second plate 3640 may be coupled to an upper elastic member 3510. The second plate 3640 may not overlap with the imaginary line connecting the first corner portion of the housing 3310 and the optical axis.

[0599] The second plate 3640 may include a body portion having a first terminal and a second terminal, and an extension portion extending downward from the body portion. In this case, the first terminal and the second terminal may be configured to be adjacent to two ends of the body portion of the second plate 3640, respectively.

[0600] The second plate 3640 may include terminals. The second plate 3640 may include multiple terminals. The second plate 3640 may include an upper terminal 3641. The second plate 3650 may include four terminals disposed at the upper portion of the second plate 3640. That is, the upper terminal 3640 may include four terminals. The four terminals of the second plate 3640 can be electrically connected to the first plate 3420 through four upper elastic units and four wires. The terminals of the second plate 3640 may include a first terminal, a second terminal, a third terminal and a fourth terminal disposed between the first terminal and the second terminal. At this time, the housing 3310 may include a first corner portion and a second corner portion adjacent to the first corner portion, the first terminal may be adjacent to the first corner portion, and the second terminal may be adjacent to the second corner portion. The first terminal can be connected to the first wire 3531 through the first upper elastic unit 3510-1. The second terminal can be connected to the fourth wire 3534 through the fourth upper elastic unit 3510-4. The first terminal and the second terminal of the second plate 3640 may be terminals for providing power signals to the sensor 3630.

[0601] The third terminal can be connected to the second wire 3532 via the second upper elastic unit 3510-2. The fourth terminal can be connected to the third wire 3533 via the third upper elastic unit 3510-3. In this case, the second wire 3532 can be disposed in the third corner portion of the housing 3310, and the third wire 3533 can be disposed in the fourth corner portion of the housing 3310. The third terminal can be a terminal for providing a clock signal to the sensor 3630. The fourth terminal can be a terminal for providing a data signal to the sensor 3630.

[0602] The second plate 3640 may include a lower terminal 3642. The second plate 3650 may include two terminals disposed at the lower portion of the second plate 3640. That is, the lower terminal 3642 may include two terminals. The two terminals of the second plate 3640 can be electrically connected to the first coil 3220 through two lower elastic units.

[0603] The second plate 3640 may include a groove. The groove of the second plate 3640 may include a first groove formed between the first terminal and the third terminal, and a second groove formed between the second terminal and the fourth terminal. A portion of the first upper elastic unit 3510-1 may be connected to the first terminal. A portion of the fourth upper elastic unit 3510-4 may be connected to the second terminal. A portion of the second upper elastic unit 3510-2 passes through the first groove of the second plate 3640 and may be connected to the third terminal. A portion of the third upper elastic unit 3510-3 passes through the second groove of the second plate 3640 and may be connected to the fourth terminal.

[0604] The lens driving device may include an OIS sensor 3650. The OIS sensor 3650 can be used for OIS feedback control. In this case, the OIS sensor 3650 can be referred to as a "sensor for OIS feedback driving". The OIS sensor 3650 can be disposed between the base 3410 and the first plate 3420. The OIS sensor 3650 can detect the movement of the second mover 3300. The OIS detector 3650 may include a Hall sensor. In this case, the Hall sensor detects the magnetic force of the first magnet 3320 and can detect the movement of the housing 3310 and the first magnet 3320. The detection value detected by the OIS sensor 3650 can be used for OIS feedback control.

[0605] In the following description, an optical device according to a third embodiment of the present invention will be described with reference to the accompanying drawings.

[0606] Figure 46 This is a perspective view illustrating an optical device according to a third embodiment of the present invention; and

[0607] Figure 47 This is a block diagram of an optical device according to a third embodiment of the present invention.

[0608] Optical device 3010B may include a portable terminal. Optical device 3010B may be any of a handheld telephone, mobile phone, smartphone, portable smart device, digital camera, laptop computer, digital broadcasting terminal, personal digital assistant (PDA), portable multimedia player (PMP), and navigation device. However, the type of optical device 3010B is not limited to this, and any device used for capturing video or pictures may be included in optical device 3010B.

[0609] Optical device 3010B may include a main body 3850. The main body 3850 may have a strip shape. Alternatively, the main body 3850 may have various structures, such as sliding, folding, swinging, rotating, etc., wherein two or more sub-bodies are connected to be movable relative to each other. The main body 3850 may include a shell (outer shell, housing, and cover) forming the exterior. For example, the main body 3850 may include a front shell 3851 and a rear shell 3852. Various electronic components of optical device 3010B may be embedded in the space formed between the front shell 3851 and the rear shell 3852. A display module 3753 may be disposed on one surface of the main body 3850. A camera 3721 may be disposed on one or more surfaces of the main body 3850 and another surface disposed opposite to said one surface.

[0610] In this embodiment, the camera-radar composite device can be disposed in the space corresponding to the edge of the main body 3860 and the bezel between the display.

[0611] Optical device 3010B may include wireless communication unit 3710. Wireless communication unit 3710 may include one or more modules that enable wireless communication between optical device 3010B and a wireless communication system, or between optical device 3010B and the network in which optical device 3010B resides. For example, wireless communication unit 3710 may include any one or more of a broadcast receiving module 3711, a mobile communication module 3712, a wireless internet module 3713, a short-range communication module 3714, and a location information module 3715.

[0612] The optical device 3010B may include an A / V input unit 3720. The A / V input module 3720 is used to input audio or video signals and may include either or more of a camera 3721 and a microphone 3722. In this case, the camera 3721 may include a camera module according to this embodiment.

[0613] The optical device 3010B may include a sensing unit 3740. The sensing unit 3740 can generate sensing signals for controlling the operation of the optical device 3010B by detecting the current state of the optical device 3010B. The current state of the optical device 3010B may include, for example, its on / off state, its position, the presence or absence of user contact, its orientation, or its acceleration / deceleration. For example, when the optical device 3010B is in the form of a slider phone, it can sense whether the slider is on or off. Furthermore, the sensing unit 3740 is responsible for sensing functions related to whether the power supply unit 3790 is supplying power and whether the interface unit 3770 is connected to an external device.

[0614] Optical device 3010B may include an input / output unit 3750. The input / output unit 3750 can be configured to generate inputs or outputs related to vision, hearing, or touch. The input / output unit 3750 can generate input data for controlling the operation of optical device 3010B and can output information processed by optical device 3010B.

[0615] The input / output unit 3750 may include any or more of a keyboard unit 3751, a touchscreen panel 3752, a display module 3753, and a sound output module 3754. The keyboard unit 3750 can generate input data in response to keyboard input. The touchscreen panel 3752 can convert capacitance changes caused by a user touching a specific area of ​​the touchscreen into electrical input signals. The display module 3753 can output images captured by the camera 3721. The display module 3753 may include multiple pixels whose colors change according to electrical signals. For example, the display module 3753 may include at least one of a liquid crystal display, a thin-film transistor liquid crystal display, an organic light-emitting diode, a flexible display, and a 3D display. The sound output module 3754 can output audio data received from the wireless communication unit 3710, or audio data stored in the memory unit 3760, in call signal receiving, call mode, recording mode, voice recognition mode, or broadcast receiving mode.

[0616] The optical device 3010B may include a memory unit 3760. Programs for processing and controlling the control unit 3780 may be stored in the memory unit 3760. Furthermore, the memory unit 3760 may store input / output data, such as phone books, messages, audio, still images, photographs, and moving pictures, or one or more of these. The memory unit 3760 may also store images captured by the camera 3721, such as photographs or videos.

[0617] Optical device 3010B may include interface unit 3770. Interface unit 3770 serves as a path for connecting to external devices connected to optical device 3010B. Interface unit 3770 can receive data from external devices, receive power and transmit it to each component inside optical device 3010B, or transmit data from inside optical device 3010B to external devices. Interface unit 3770 may include a wired / wireless headphone port, an external charger port, a wired / wireless data port, a memory card port, a port for connecting a device equipped with an identification module, and any or more of an audio I / O port, a video I / O port, and a handset port.

[0618] Optical device 3010B may include a control unit 3780. The control unit 3780 can control the overall operation of optical device 3010B. The control unit 3780 can perform related control and processing for voice calls, data communication, video calls, etc. The control unit 3780 may include a display control unit 3781, which controls the display module 3753, which serves as the display of optical device 3010B. The control unit 3780 may include a camera control unit 3782 for controlling the camera module. The control unit 3780 may include a multimedia module 3783 for playing multimedia. The multimedia module 3783 may be located inside the control unit 3180 or may be separate from the control unit 3780. The control unit 3780 can perform pattern recognition processing, which can recognize handwritten input or drawing input performed on the touchscreen as characters and images, respectively.

[0619] The optical device 3010B may include a power supply unit 3790. The power supply unit 3790 may receive external or internal power under the control of the control unit 3780 to supply the power required for the operation of each component.

[0620] The first to third embodiments of the present invention have been described separately above. Some configurations of the first embodiment may be included in the second embodiment. Some configurations of the first embodiment may be included in the third embodiment. For example, the retainer 310 of the first embodiment may be applied to both the second and third embodiments. The camera module according to the first embodiment and the camera module according to the third embodiment may be applied to the first camera module 200 and the second camera module 300 of the second embodiment. Some configurations of the third embodiment may be included in the first embodiment. Some configurations of the third embodiment may be included in the second embodiment. For example, the printed circuit board 3010 of the third embodiment may be applied to both the first and second embodiments.

[0621] Although embodiments of the invention have been described above with reference to the accompanying drawings, those skilled in the art will understand that the invention can be implemented in other specific forms without altering its technical spirit or essential characteristics. Therefore, it should be understood that the above embodiments are illustrative in all respects and not restrictive.

Claims

1. A camera device, comprising: The bracket includes a first hole and a second hole; A first camera module is disposed on the first hole of the bracket; The second camera module is disposed on the second hole of the bracket; A first magnet is disposed on the outer surface of the first camera module; as well as A second magnet is disposed on the outer surface of the bracket at a position corresponding to the first magnet. The first magnet is fixed to the outer surface of the first camera module. The second magnet is movably mounted on the support. The bracket includes a groove formed on the outer surface of the bracket, and The second magnet is movable within the groove of the bracket.

2. The camera device according to claim 1, wherein, The first magnet has a circular surface facing the second magnet, and The second magnet has a circular surface facing the first magnet.

3. The camera device according to claim 1, wherein, An attractive force acts between the first magnet and the second magnet.

4. The camera device according to claim 1, wherein, As the second magnet moves within the groove of the bracket, the first camera module moves together with the second magnet via the attraction between the first magnet and the second magnet.

5. The camera device according to claim 1, wherein, The first magnet includes a first internal magnet through which a first axis perpendicular to the optical axis of the first camera module passes, and a second internal magnet through which a second axis perpendicular to both the first axis and the optical axis of the first camera module passes. The second magnet includes a first external magnet through which the first axis passes and a second external magnet through which the second axis passes.

6. The camera device according to claim 5, wherein, The first external magnet and the second external magnet are capable of moving in different directions.

7. The camera device according to claim 5, wherein, The first external magnet is capable of moving in the direction of the optical axis, and The second external magnet is capable of moving in the direction of the first axis.

8. The camera device according to claim 7, wherein, The movement of the first external magnet in the directions of the first axis and the second axis is restricted, and The movement of the second external magnet in the directions of the optical axis and the second axis is restricted.

9. The camera device according to claim 5, wherein, The first external magnet is capable of moving in the direction of the optical axis and the second axis.

10. The camera device according to claim 5, wherein, The groove of the bracket includes a first groove for the first external magnet and a second groove for the second external magnet. Wherein, the length of the first groove in the direction of the optical axis is greater than the length of the first groove in the direction of the second axis.

11. The camera device according to claim 10, wherein, The length of the first groove in the direction of the second axis is the same as the length of the first external magnet in the direction of the second axis.

12. The camera device according to claim 10, wherein, The length of the second groove in the direction of the first axis is greater than the length of the second groove in the direction of the optical axis.

13. The camera device according to claim 12, wherein, The length of the second groove in the direction of the optical axis is the same as the length of the second external magnet in the direction of the optical axis.

14. The camera device according to claim 1, wherein, The groove of the bracket is spaced apart from the edge of the outer surface of the bracket.

15. A camera device, comprising: support; A first camera module is mounted on the bracket. A second camera module is mounted on the bracket and faces the same direction as the first camera module. A first magnet is disposed on the first camera module; as well as A second magnet, which is movably mounted on the support, The first magnet and the second magnet are configured such that an attractive force is formed between the first magnet and the second magnet. The bracket includes a groove formed on the outer surface of the bracket, and The second magnet is disposed in the groove of the bracket.

16. The camera device according to claim 15, wherein, The bracket is positioned between the first magnet and the second magnet.

17. The camera device according to claim 15, wherein, The first magnet has a circular surface facing the second magnet, and The second magnet has a circular surface facing the first magnet.

18. The camera device according to claim 15, wherein, The first magnet includes a first internal magnet and a second internal magnet. The second magnet includes a first external magnet disposed at a position corresponding to the first internal magnet and a second external magnet disposed at a position corresponding to the second internal magnet. The first external magnet is capable of moving along the optical axis, and The second external magnet is capable of moving in a first direction perpendicular to the optical axis.

19. A camera device, comprising: The bracket includes a first hole and a second hole; A first camera module is disposed on the first hole of the bracket; The second camera module is disposed on the second hole of the bracket; A first magnet is disposed on the first camera module; as well as A second magnet, which is movably mounted on the support, The first magnet and the second magnet are positioned at corresponding locations, and the bracket is inserted between the first magnet and the second magnet. When the second magnet moves, the first camera module moves along with the second magnet due to the attractive force between the first and second magnets. The bracket includes a groove formed on the outer surface of the bracket, and The second magnet is movable within the groove of the bracket.

20. An optical device, comprising: main body; The camera device according to any one of claims 1 to 19, wherein the camera device is disposed on the main body; as well as A display is mounted on the main body and outputs images captured by the camera device.

Images