A test fixture for PCBs with multi-specification stamp holes

Abstract

The application discloses a test fixture suitable for multi-specification stamp-hole PCBs, which comprises a plurality of test needles, an on-board connector and a printed circuit board, the printed circuit board is arranged with a plurality of clamping hole groups, each clamping hole group comprises a plurality of clamping hole units, each clamping hole unit comprises a strip-shaped hole and a round hole; the test needle is in a U-shaped form, one end of the test needle is fixed in the round hole, the other end is located in the strip-shaped hole, and the part of the test needle located in the strip-shaped hole is in abutment with the half hole of the stamp-hole PCB, when the test needle located in the strip-shaped hole is extruded by the half hole of the stamp-hole PCB, the test needle will swing and deform along the length direction of the strip-shaped hole; the on-board connector is used for providing a signal transmission port; the test fixture can be suitable for stamp-hole PCBs with different specifications and sizes, the test fixture solves the problem that the existing test fixture is suitable for only corresponding stamp-hole PCBs, and each stamp-hole PCB does not need to be customized with a corresponding test tool, thereby effectively reducing the test cost and period of the stamp-hole PCB.

Description

Technical Field

[0001] This invention relates to the field of circuit board packaging technology, and in particular to a test fixture adapted to PCB boards with various sizes of stamp holes. Background Technology

[0002] Stamp hole packaging, also known as half-hole pad packaging, was originally a panel connection method used in PCB manufacturing. However, due to its ease of processing, low cost, and reliable soldering, it has gradually become a popular packaging form for core circuit modules with relatively independent or concentrated functions. Examples include WiFi / Bluetooth modules and MCU core modules. Stamp hole packaging is suitable for surface mount soldering, with pins directly soldered to the base plate, thereby reducing costs, shortening development cycles, and facilitating mass production.

[0003] The unique nature of the stamp hole packaging presents challenges for module debugging and testing. Currently, a common practice is to solder the module onto the product substrate for testing. If the test results are satisfactory, product soldering and testing can be completed; if problems arise, the entire module must be removed. Since the stamp hole module itself contains various chips and components, removal is time-consuming, labor-intensive, and highly likely to damage the entire module. Another common approach is to create a test fixture base plate to mount the stamp hole PCB module for debugging and testing. However, due to the different package sizes of various modules, a suitable test fixture base plate needs to be made for each module. If the number of modules used is small, this directly increases product cycle time and cost. Therefore, there is an urgent need to design a test fixture applicable to different package sizes. This would allow for the testing and debugging of stamp hole PCB modules of different sizes using a single test fixture, eliminating the need for custom-made test fixtures for each stamp hole PCB module, reducing fixture manufacturing costs and cycle time, and significantly improving the testing efficiency of stamp hole PCB modules. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a test fixture for PCB boards with multiple specifications of stamp holes. It solves the problem that existing test fixtures cannot be adapted to PCB boards with different specifications of stamp holes at the same time. The test fixture can be adapted to test PCB boards with stamp holes of different sizes, solving the problem that existing test fixtures can only be adapted to corresponding PCB boards with stamp holes. Moreover, it eliminates the need to customize corresponding test fixtures or flywire tests for each type of PCB board with stamp holes, effectively reducing the testing cost and cycle of PCB boards with stamp holes, thereby overcoming the shortcomings of the prior art.

[0005] To address the aforementioned technical problems, this invention provides a test fixture adapted to PCBs with various stamp perforation sizes, comprising a plurality of test probes, onboard connectors, and a printed circuit board.

[0006] The printed circuit board has multiple rows of snap-fit ​​hole groups arranged on it. Each row of snap-fit ​​hole groups includes several snap-fit ​​hole units. Each snap-fit ​​hole unit includes a strip hole and a round hole. The snap-fit ​​hole units are used to fix and connect test probes.

[0007] The test needle is U-shaped and connected to the snap-fit ​​hole unit. One end of the test needle is fixed in the round hole and the other end is located in the strip hole. The part of the test needle located in the strip hole abuts against the half hole of the stamp hole PCB board. When the test needle located in the strip hole is squeezed by the half hole of the stamp hole PCB board, it will swing and deform along the length of the strip hole.

[0008] The onboard connector is disposed on the surface of the printed circuit board. The onboard connector is electrically connected to the snap-fit ​​hole group with test probes. The onboard connector is used to provide a signal transmission port to facilitate signal input or output of the stamp hole PCB board.

[0009] As a further improvement of the present invention, the test probe is made of a strip of conductive material bent into shape. The test probe includes a fixed part, an elastic connecting part, and a movable part. The fixed part and the movable part are respectively located on both sides of the elastic connecting part. The fixed part is vertically inserted into the round hole, and the movable part is located in the strip hole. When the stamp hole PCB board is installed on the printed circuit board, the half hole of the stamp hole PCB board abuts against the movable part of the test probe. After being squeezed by the half hole of the stamp hole PCB board, the movable part deforms and swings along the length direction of the strip hole. The elastic connecting part generates elastic force and reacts to the movable part, so that the movable part of the test probe applies pressure to the half hole of the stamp hole PCB board, thereby restricting the relative position of the stamp hole PCB board on the printed circuit board.

[0010] As an improvement of the present invention, the end of the movable part of the test needle is provided with a guide portion that is biased towards the fixed part, and the guide portion and the movable part form an obtuse angle.

[0011] As an improvement of the present invention, the strip holes and round holes in the same row are arranged in an alternating manner.

[0012] As a further improvement of the present invention, the onboard connectors are symmetrically distributed on both sides of the printed circuit board.

[0013] As an improvement of the present invention, each row of snap-fit ​​hole groups is equally divided into a first hole group portion and a second hole group portion, and the first hole group portion and the second hole group portion are symmetrically arranged along the middle position of the printed circuit board.

[0014] As a further improvement of the present invention, the snap-fit ​​hole units in the first hole group and the second hole group are distributed in a matrix structure.

[0015] As a further improvement of the present invention, the snap-fit ​​hole units in the first hole group of the snap-fit ​​hole group are connected in series with the same microstrip line; the snap-fit ​​hole units in the second hole group are connected in series with the same microstrip line.

[0016] As a further improvement of the present invention, the diameter length of the strip hole in the snap-fit ​​hole group is greater than the distance between the strip hole and the strip hole in the adjacent snap-fit ​​hole unit.

[0017] As a further improvement of the present invention, the onboard connector is a board-to-wire connector, and each pair of terminals in the onboard connector is electrically connected to a microstrip line corresponding to a row of snap-fit ​​holes.

[0018] With this design, the present invention has at least the following advantages:

[0019] 1. In this invention, the printed circuit board is equipped with several snap-fit ​​hole units, and test pins are installed on the printed circuit board according to the edge size of the stamp hole PCB. The test pins, which can be elastically deformed, can be adapted to stamp hole PCBs of different sizes, making the test fixture highly versatile. There is no need to customize test fixtures for each specification of stamp hole PCB module, which improves the test range and can significantly reduce the manufacturing cost of the test fixture, thereby reducing the test cycle and debugging cost of the stamp hole PCB module.

[0020] 2. The test probe used in the test fixture of this invention is made of bent strip conductive material. Its fixed part is connected and fixed to the printed circuit board, and its movable part can elastically deform when compressed. In this invention, the movable part of the test probe matches the half-hole on the edge of the stamp-hole PCB board. When the stamp-hole PCB board is fixed to the printed circuit board, the stamp-hole PCB board will compress the movable part of the test probe, so that the movable part completely abuts against the inner wall of the half-hole of the stamp-hole PCB board. Thus, the stamp-hole PCB board is clamped and fixed by the test probe. This structure makes the test probe abut against the half-hole of the stamp-hole PCB board, improving the connection reliability between the stamp-hole PCB board and the printed circuit board. Attached Figure Description

[0021] The above is merely an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0022] Figure 1 This is a schematic diagram of the test fixture adapted to PCB boards with multiple stamp perforations in this invention.

[0023] Figure 2 yes Figure 1 A magnified structural diagram of position C in the middle.

[0024] Figure 3 This is a schematic diagram of the test needle in this invention.

[0025] Figure 4 This is an assembly diagram of the stamp-hole PCB board installed on the test fixture in this invention.

[0026] Figure 5 This is a schematic diagram of the distribution structure of the snap-fit ​​hole unit on the test fixture in this invention.

[0027] Figure 6 This is an assembly diagram of different types of stamp hole PCB boards installed on the test fixture in this invention.

[0028] The reference numerals in the attached figure are as follows:

[0029] 1-Test probe, 11-Fixing part, 12-Elastic connection part, 13-Moving part, 14-Guide part, 2-Printed circuit board, 21-Strip hole, 22-Round hole, 3-Onboard connector. Detailed Implementation

[0030] Examples of embodiments described in this invention are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the invention, and should not be construed as limiting the invention.

[0031] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0032] refer to Figure 1 and Figure 2 As shown, this embodiment specifically discloses a test fixture adapted to PCB boards with multiple stamp perforations, which includes several test pins 1, multiple onboard connectors 3, and a printed circuit board 2.

[0033] In this embodiment, multiple rows of card connection hole groups are arranged on the printed circuit board 2. Each row of card connection hole groups includes several card connection hole units. Each card connection hole unit includes a strip hole 21 and a round hole 22. The card connection hole unit is used to fix and connect the test pin 1. Since one strip hole 21 and one round hole 22 form a card connection hole unit in this embodiment, the strip holes 21 and the round holes 22 in the same row are arranged in an alternating and spaced manner. At the same time, the aperture length of the strip hole 21 in the card connection hole group is greater than the distance between the strip hole 21 and the strip hole 21 in the adjacent card connection hole unit, which can ensure that the stamp hole PCB board with the maximum or minimum size can be normally clamped without special requirements for the size of the stamp hole PCB board, improving the adaptability of the test fixture. The purpose of the above structural setting is that when the arrangement distribution of the card connection hole groups does not meet the above requirements, there will be a situation where the stamp hole PCB boards with certain width dimensions cannot be clamped. That is, one side of the stamp hole on the stamp hole PCB board is within the aperture of the strip hole 21 in the card connection hole group and can be clamped by the card connection copper pin, but the stamp holes on the other side can never be within the aperture of the strip hole 21 in the card connection hole group, resulting in the inability to clamp these size stamp hole PCB boards.

[0034] For example: As Figure 5 and Figure 6 shown, the distance between the left and right card connection hole groups of the test fixture is L0, the length of the strip hole 21 is L1, the distance between the strip hole 21 and the strip hole 21 in the adjacent card connection hole unit is L2, and the width of the stamp hole PCB board is L. That is, for clamping by the two innermost holes, it needs to satisfy L0 < L < L0 + 2L1; when one side remains unchanged and the other side is changed to clamping by the adjacent hole, it needs to satisfy L0 + L1 + L2 < L < L0 + L1 + L2 + 2L1; if L0 + 2L1 > L0 + L1 + L2, that is, L1 > L2, it can ensure that the stamp hole PCB board is normally clamped; otherwise, if L0 + 2L1 < L0 + L1 + L2, that is, L1 < L2, when L takes the length of L0 + 2L1 < L < L0 + L1 + L2, the condition for being clamped cannot be met, resulting in the unusability of the fixture.

[0035] In this embodiment, the test pin 1 is in a U shape, and the test pin 1 is connected within the card connection hole unit. One end of the test pin 1 is fixed in the round hole 22, and the other end is located in the strip hole 21. The part of the test pin 1 located in the strip hole 21 abuts against the half hole of the stamp hole PCB board. When the test pin 1 located in the strip hole 21 is squeezed by the half hole of the stamp hole PCB board, it will swing and deform along the length direction of the strip hole 21. In this structure, multiple rows of card connection hole groups are arranged on the printed circuit board 2, and each row includes several card connection hole units. Therefore, the card connection hole units on the printed circuit board 2 are arranged in a matrix as a whole. When the stamp hole PCB board needs to be fixed on the printed circuit board 2, the test pin 1 can be installed in the corresponding card connection hole unit on the printed circuit board 2 according to the edge size of the stamp hole PCB board, so as to adapt to different size stamp hole PCB boards.

[0036] Specifically, in this embodiment, the test needle 1 is made of a bent strip of conductive material, such as... Figure 3 As shown, the test probe 1 includes a fixed part 11, an elastic connecting part 12, and a movable part 13. The fixed part 11 and the movable part 13 are located on both sides of the elastic connecting part 12. The fixed part 11 is vertically inserted into the circular hole 22, and the movable part 13 is located in the strip hole 21. When the stamp hole PCB board is mounted on the printed circuit board 2, the half-hole of the stamp hole PCB board abuts against the movable part 13 of the test probe 1. After being squeezed by the half-hole of the stamp hole PCB board, the movable part 13 deforms and swings along the length direction of the strip hole 21. The elastic connecting part 12 generates elastic force and reacts to the movable part 13, causing the movable part 13 of the test probe 1 to apply pressure to the half-hole of the stamp hole PCB board, thereby restricting the relative position of the stamp hole PCB board on the printed circuit board 2. The end of the movable part 13 of the test probe 1 is provided with a guide part 14 biased towards the fixed part 11, and the guide part 14 and the movable part 13 form an obtuse angle. When the stamp hole PCB is fixed to the printed circuit board 2 by the test pin 1, the half hole on one side of the stamp hole PCB can be made to abut against the test pin 1 on the corresponding side. Then, the half hole on the opposite side of the stamp hole PCB is pressed down in a direction approximately perpendicular to the printed circuit board 2. Under the action of the guide part 14, the half hole on the opposite side can be easily pressed to the position of the movable part 13 of the corresponding test pin 1, so that the half hole abuts against the test pin 1. Finally, both sides of the stamp hole PCB are correctly abutted against the test pin 1, thus fixing the stamp hole PCB.

[0037] Since the test pin 1 in this embodiment is snapped into the snap-fit ​​hole unit by the tension of its own material, and is not completely rigidly fixed to the printed circuit board 2, the test pin 1 can be disassembled or installed in the snap-fit ​​hole unit at any time. For stamp hole PCBs of different sizes, the assembly size can be changed by changing the installation position of the test pin 1, so as to be suitable for fixing stamp hole PCBs of different sizes. This structure improves the adaptability of the test fixture and makes it more versatile.

[0038] The specific process of fixing the stamp hole PCB board to the printed circuit board 2 using the test pin 1 in this embodiment is as follows:

[0039] First, select the fixing position on the printed circuit board 2 where the stamp hole PCB will be fixed.

[0040] Then, according to the size and edge of the stamp hole PCB board, select several corresponding snap-fit ​​hole units and fix the test needle 1 in the snap-fit ​​hole unit. During the installation of the test needle 1, pinch the fixed part 11 and the movable part 13 in the test needle 1 in the opposite direction beforehand. Insert the movable part 13 into the strip hole 21 first, and then insert the fixed part 11 into the round hole 22. After the fixed part 11 is inserted into the round hole 22, release the movable part 13. At this time, the movable part 13 of the test needle 1 tends to return to its original position. However, since the strip hole 21 has a certain limiting effect on the displacement of the movable part 13, the movable part 13 cannot completely return to its original position. At this time, the elastic connection part 12 between the movable part 13 and the fixed part 11 in the test needle 1 will accumulate a part of elastic force in advance. Under the action of this elastic force, the test needle 1 will be stably snapped into the snap-fit ​​hole unit.

[0041] Then, the stamp hole PCB board is tilted at a certain angle, and one half-hole is brought into contact with the test pin 1 on the same side. The opposite half-holes on the stamp hole PCB board also bring into contact with the test pin 1 on the same side during the pressing process. When the stamp hole PCB board is parallel to the printed circuit board 2, the test pins 1 on both sides are fully in contact with the half-holes of the stamp hole PCB board, thus fixing the stamp hole PCB board to the printed circuit board 2 by the test pins 1. Figure 4 As shown.

[0042] Meanwhile, in this embodiment, an onboard connector 3 is provided on the surface of the printed circuit board 2. In this embodiment, the onboard connector 3 is preferably a board-to-wire connector. The onboard connector 3 can be electrically connected to the snap-fit ​​hole group on which the test pin 1 is fixed. The onboard connector 3 is used to provide a signal transmission port so that the stamp hole PCB board can be electrically connected to other external components to facilitate signal input or output of the stamp hole PCB board.

[0043] It should be noted that, since the stamp perforated PCB board can be fixed by clamping its opposite sides, in this embodiment, each row of snap-fit ​​holes is equally divided into a first hole group A and a second hole group B, and the first hole group A and the second hole group B are symmetrically arranged along the middle position of the printed circuit board 2. The snap-fit ​​hole units in the first hole group A are connected in series using the same microstrip line; the snap-fit ​​hole units in the second hole group B are also connected in series using the same microstrip line. In this structure, each half-hole in the stamp hole PCB board is a circuit interface. To achieve clamping while maintaining the circuit continuity of the stamp hole PCB board, the snap-fit ​​hole group is divided into two parts: the first hole group part A and the second hole group part B. The test pin 1 connected in the first hole group part A abuts against the half-hole on one side of the stamp hole PCB board, while the test pin 1 connected in the second hole group part B abuts against the half-hole on the opposite side of the stamp hole PCB board. The snap-fit ​​hole units in each row of the first hole group part A and the second hole group part B are connected by the same microstrip line. At the same time, the end of each microstrip line is connected to the terminal on the onboard connector 3. Through this structure, each half-hole on the stamp hole PCB board can be connected to a terminal on the onboard connector 3, which can be used for subsequent debugging, measurement, program burning or parameter configuration of the stamp hole PCB board.

[0044] Furthermore, in this embodiment, the onboard connectors 3 are symmetrically distributed on both sides of the printed circuit board 2. In each row of microstrip lines connected in series in the snap-fit ​​hole group, the end of the microstrip line is electrically connected to the onboard connector 3 on the same side. In this embodiment, onboard connectors 3 are distributed on both sides of the printed circuit board 2. Their purpose is to provide connection ports to the outside world for the snap-fit ​​hole groups of the first hole group A and the second hole group B, respectively. For example, each row of snap-fit ​​hole units in the first hole group A can be connected to the onboard connector 3 near the first hole group A through microstrip lines. External circuits or devices can be connected to the stamp-hole PCB board on the printed circuit board 2 through the terminals on the onboard connector 3 to realize signal transmission.

[0045] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Any simple modifications, equivalent changes, or alterations made by those skilled in the art using the disclosed technical content shall fall within the protection scope of the present invention.

Claims

1. A test fixture adapted to PCB boards with multi-specification stamp perforations, characterized in that, Includes several test probes, onboard connectors, and printed circuit boards; The printed circuit board has multiple rows of snap-fit ​​hole groups arranged on it. Each row of snap-fit ​​hole groups includes several snap-fit ​​hole units. Each snap-fit ​​hole unit includes a strip hole and a round hole. The snap-fit ​​hole units are used to fix and connect test probes. The test needle is U-shaped and connected to the snap-fit ​​hole unit. One end of the test needle is fixed in the round hole and the other end is located in the strip hole. The part of the test needle located in the strip hole abuts against the half hole of the stamp hole PCB board. When the test needle located in the strip hole is squeezed by the half hole of the stamp hole PCB board, it will swing and deform along the length of the strip hole. The onboard connector is disposed on the surface of the printed circuit board. The onboard connector is electrically connected to the snap-fit ​​hole group with test probes. The onboard connector is used to provide a signal transmission port to facilitate signal input or output of the stamp hole PCB board. The test probe is made of a strip of conductive material bent into shape. The test probe includes a fixed part, an elastic connecting part, and a movable part. The fixed part and the movable part are located on both sides of the elastic connecting part. The fixed part is vertically inserted into the round hole, and the movable part is located in the strip hole. When the stamp hole PCB board is installed on the printed circuit board, the half hole of the stamp hole PCB board abuts against the movable part of the test probe. After being squeezed by the half hole of the stamp hole PCB board, the movable part deforms and swings along the length of the strip hole. The elastic connecting part generates elastic force and reacts to the movable part, so that the movable part of the test probe applies pressure to the half hole of the stamp hole PCB board, thereby restricting the relative position of the stamp hole PCB board on the printed circuit board.

2. The test fixture according to claim 1, characterized in that, The movable part of the test probe is provided with a guide part that deflects the fixed part, and the guide part and the movable part form an obtuse angle.

3. The test fixture according to any one of claims 1-2, characterized in that, The strip holes and round holes in the same row are arranged in an alternating pattern.

4. The test fixture according to any one of claims 1-2, characterized in that, The onboard connectors are symmetrically distributed on both sides of the printed circuit board.

5. The test fixture according to any one of claims 1-2, characterized in that, Each row of snap-fit ​​holes is equally divided into a first hole group and a second hole group, and the first hole group and the second hole group are symmetrically arranged along the middle position of the printed circuit board.

6. The test fixture according to claim 5, characterized in that, The snap-fit ​​hole units in both the first and second hole groups are distributed in a matrix structure.

7. The test fixture according to claim 5, characterized in that, The snap-fit ​​hole units in the first hole group of the snap-fit ​​hole group are connected in series using the same microstrip line; the snap-fit ​​hole units in the second hole group are connected in series using the same microstrip line.

8. The test fixture according to any one of claims 1-2, characterized in that, The diameter of the strip hole in the snap-fit ​​hole group is greater than the distance between the strip hole and the strip hole in the adjacent snap-fit ​​hole unit.

9. The test fixture according to claim 7, characterized in that, The onboard connector is a board-to-wire connector, and each pair of terminals in the onboard connector is electrically connected to the microstrip line corresponding to a row of snap-fit ​​holes.

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