A press-pack IGBT sub-module test adapter and test equipment

Abstract

The application provides a press contact type IGBT sub-module test adapter and test equipment, the press contact type IGBT sub-module test adapter includes: an upper clamp and a lower clamp, the lower clamp is adapted to be oppositely arranged with the upper clamp, the upper clamp includes a negative electrode substrate, the lower clamp includes: a conductive substrate, a height-adjustable support assembly on the conductive substrate, one end of the support assembly away from the conductive substrate is adapted to be in contact with the upper clamp, a positioning assembly on the conductive substrate, the positioning assembly is adapted to accommodate an IGBT sub-module, a probe is adapted to be located between the negative electrode substrate and the IGBT sub-module, and the conductive substrate is adapted to be electrically connected with a collector electrode of the IGBT sub-module. The press contact type IGBT sub-module test adapter makes the pressure on the IGBT sub-module more uniform, and can reduce the failure probability of the IGBT sub-module during testing.

Description

Technical Field

[0001] This invention relates to the field of power electronics technology, specifically to a crimp-type IGBT sub-module test adapter and test equipment. Background Technology

[0002] Insulated-gate bipolar transistors (IGBTs), as a typical representative of power electronic devices, have wide applications in modern power electronics. They combine the advantages of metal-oxide-semiconductor field-effect transistors (MOSFETs)—high input impedance, low control power, simple drive circuits, high switching speed, and low switching losses—with the advantages of bipolar junction transistors (BJTs)—high current density, low saturation voltage drop, and strong current handling capability. Therefore, they are ideal switching devices in the field of power electronics and are currently widely used in motor frequency converters, wind power converters, photovoltaic inverters, high-frequency welding machine inverters, and other fields.

[0003] With the continuous increase in capacitance, increasingly higher requirements are being placed on the performance and reliability of insulated-gate bipolar transistors (IGBTs). Electrical characteristic testing of IGBTs can detect their performance and reliability. Existing electrical characteristic testing equipment typically includes an adapter and a pressure application device. During testing, the IGBT sub-module is placed in the adapter, and pressure is applied to the adapter through the pressure application device to achieve electrical connection between the emitter, collector, and gate of the IGBT sub-module and the adapter.

[0004] However, existing adapters exhibit uneven pressure during testing, which can easily lead to IGBT sub-module failure. Summary of the Invention

[0005] Therefore, the technical problem to be solved by the present invention is the defect of poor testing accuracy of existing adapters, thereby providing a crimped IGBT sub-module test adapter and test equipment.

[0006] This invention provides a press-fit IGBT sub-module test adapter, comprising: an upper clamp and a lower clamp, the lower clamp being adapted to be disposed opposite to the upper clamp; the upper clamp including a negative electrode substrate; the lower clamp including: a conductive substrate; a height-adjustable support component located on the conductive substrate, one end of the support component facing away from the conductive substrate being adapted to contact the upper clamp; a positioning component located on the conductive substrate, the positioning component being adapted to accommodate the IGBT sub-module; and a probe adapted to be located between the negative electrode substrate and the IGBT sub-module, the conductive substrate being adapted to be electrically connected to the collector of the IGBT sub-module.

[0007] Optionally, the support assembly includes a support portion and an adjustment portion connected to the support portion, the adjustment portion being adapted to connect to the conductive substrate and adjust the spacing between the support portion and the conductive substrate.

[0008] Optionally, the adjusting part is a stud; a first groove is provided in the conductive substrate, and the sidewall of the first groove is provided with an internal thread, and the adjusting part is adapted to be screwed into the internal thread.

[0009] Optionally, the positioning component includes: a conductive adapter having a second groove, the IGBT sub-module being adapted to be embedded in the second groove; and a first fastener adapted to penetrate the conductive adapter through a side portion of the first groove and extend into the conductive substrate at least a partial depth.

[0010] Optionally, the probe is part of a gate-emitter assembly, and the probe includes an emitter probe and a gate probe; one end of the emitter probe is fixed on the negative substrate, and the emitter probe is adapted to electrically connect the negative substrate and the emitter of the IGBT sub-module; the gate-emitter assembly further includes an insulating connection portion; the insulating connection portion is located between the negative substrate and one end of the gate probe, and the other end of the gate probe away from the insulating connection portion is adapted to contact the gate of the IGBT sub-module.

[0011] Optionally, the press-fit IGBT sub-module test adapter further includes: a test assemblies adapted to be located on the conductive substrate and on the side of the support assembly and the positioning assembly, the test assemblies being adapted to accommodate a test diode; the upper clamp further includes a positive electrode substrate and an inductor connection substrate, the negative electrode substrate, the positive electrode substrate, and the inductor connection substrate being stacked and spaced apart; the positive electrode substrate is adapted to be electrically connected to the cathode of the test diode, and the conductive substrate is also adapted to be electrically connected to the anode of the test diode and the inductor connection substrate.

[0012] Optionally, the press-fit IGBT sub-module test adapter further includes: a first electrical connector, the first electrical connector being adapted to be located between the upper clamp and the lower clamp, the two ends of the first electrical connector being adapted to contact the cathode of the test diode and the positive substrate respectively; and a second electrical connector, the second electrical connector being adapted to be located between the upper clamp and the lower clamp, the two ends of the second electrical connector being adapted to contact the conductive substrate and the inductive connection substrate respectively.

[0013] Optionally, the accompanying test assembly includes: an upper insulating plate and a lower insulating plate arranged at relative intervals, and a second fastener for connecting the upper insulating plate and the lower insulating plate; the upper insulating plate is provided with a first through hole, and the first electrical connector is adapted to pass through the first through hole; the lower insulating plate is adapted to be fixed on the conductive substrate, and the lower insulating plate has a receiving cavity penetrating the lower insulating plate, and the accompanying test diode is adapted to be embedded in the receiving cavity.

[0014] Optionally, the second fastener is adapted to penetrate the upper insulating plate, the lower insulating plate, and the conductive substrate; or, the second fastener is adapted to penetrate the upper insulating plate and a portion of the depth of the lower insulating plate, the conductive substrate being provided with a third groove, and the accompanying testing component being adapted to be embedded in the third groove.

[0015] Optionally, the negative electrode substrate, positive electrode substrate, and inductor connection substrate are stacked sequentially, with a first insulating plate between the positive electrode substrate and the negative electrode substrate, and a second insulating plate between the inductor connection substrate and the positive electrode substrate; the upper clamp is provided with a second through hole penetrating the inductor connection substrate and the second insulating plate, and a third through hole penetrating the inductor connection substrate, the second insulating plate, the positive electrode substrate, and the first insulating plate sequentially, the second through hole being adapted to be located directly above the test component, one end of the first electrical connector being adapted to be located in the second through hole, the other end of the first electrical connector being adapted to be located in the first through hole, the third through hole being located directly above the positioning component, and the probe extending along the third through hole.

[0016] Optionally, the first electrical connector is fixedly connected to the positive electrode substrate at one end of the second through hole, and the other end of the first electrical connector facing away from the positive electrode substrate is adapted to be detachably disposed from the test component.

[0017] Optionally, one end of the first electrical connector can be detachably disposed from the positive electrode substrate, and the other end of the first electrical connector is adapted to be fixedly connected to the upper insulating plate.

[0018] Optionally, a first limiting member is provided on the side surface of the positive electrode substrate facing the inductor connection substrate, and the first limiting member is located in the second through hole; the first limiting member has a first limiting hole penetrating through the first limiting member, and the end of the first electrical connector facing away from the upper insulating plate is adapted to be inserted into the first limiting hole.

[0019] Optionally, the second electrical connector is fixedly connected to the conductive substrate, and the other end of the second electrical connector facing away from the conductive substrate is adapted to be separable from the inductive connection substrate; or, the second electrical connector is fixedly connected to the inductive connection substrate, and the other end of the second electrical connector facing away from the inductive connection substrate is adapted to be separable from the conductive substrate.

[0020] Optionally, both the first electrical connector and the second electrical connector are elastic elements; both the first electrical connector and the second electrical connector include a spring probe.

[0021] The present invention also provides a test device for a crimped IGBT sub-module, including the crimped IGBT sub-module test adapter.

[0022] Optionally, the press-fit IGBT sub-module test adapter further includes a positive electrode substrate and an inductor connection substrate, wherein the negative electrode substrate, the positive electrode substrate, and the inductor connection substrate are stacked and spaced apart; the press-fit IGBT sub-module test equipment further includes: an inductor coil, one end of which is electrically connected to the inductor connection substrate; a power supply, the positive terminal of which is electrically connected to the other end of the inductor coil and the positive electrode substrate, and the negative terminal of which is electrically connected to the negative electrode substrate; and a driving unit, which is electrically connected to the gate of the IGBT sub-module and the negative electrode substrate.

[0023] The technical solution of this invention has the following advantages:

[0024] 1. The pressure-fit IGBT sub-module test adapter provided by this invention includes a support component, a positioning component, an IGBT sub-module, and a probe between the negative electrode substrate and the conductive substrate during testing. The positioning component is located on the conductive substrate, the IGBT sub-module is located within the positioning component, and the probe is located between the negative electrode substrate and the IGBT sub-module. One end of the conductive substrate is located on the conductive substrate, and the other end of the conductive substrate contacts the upper clamp. The support component, disposed between the upper and lower clamps, supports the upper clamp, thereby making the pressure on the IGBT sub-module more uniform and reducing the probability of IGBT sub-module failure during testing. Furthermore, the height of the support component can be adjusted according to the height of the IGBT sub-module under test, providing greater flexibility.

[0025] 2. The press-fit type IGBT sub-module test adapter provided by the present invention, by setting a test companion component on a conductive substrate, the test companion component being adapted to accommodate a test companion diode, wherein the cathode of the test companion diode is electrically connected to the positive substrate and the anode of the test companion diode is electrically connected to the conductive substrate, the test companion diode can be placed inside the adapter, and the electrical connection between the test companion diode and the adapter can be achieved without using long leads, thereby reducing the effective length of the power circuit, thereby reducing power parasitic inductance, reducing overvoltage and oscillation phenomena during switching, and improving the accuracy of test results.

[0026] 3. The press-fit type IGBT sub-module test adapter provided by the present invention includes a test-support component comprising: an upper insulating plate and a lower insulating plate arranged at relative intervals, and a second fastener for connecting the upper insulating plate and the lower insulating plate. The lower insulating plate is fixed on the conductive substrate and has a receiving cavity. The test-support diode is adapted to be embedded in the receiving cavity, which avoids horizontal displacement of the test-support diode and improves the stability of the test-support diode on the conductive substrate. This ensures that the anode of the test-support diode maintains a stable electrical connection with the conductive substrate, which is beneficial to ensuring the smooth progress of electrical characteristic testing. The second fastener restricts the test-support diode to the upper insulating plate. Between the upper and lower insulating plates, a test diode is press-fitted for electrical characteristic testing. Because the structure of the test assembly remains constant during testing, the test diode is always under constant pressure, avoiding repeated pressure application and depressurization during electrical characteristic testing, thus improving its lifespan. Simultaneously, the force on the test diode can be controlled by adjusting the distance between the upper and lower insulating plates using a second fastener, providing significant flexibility. Furthermore, the simple structure of the test assembly allows for timely replacement of the test diode in case of failure during testing, improving testing efficiency.

[0027] 4. The press-fit type IGBT sub-module test adapter provided by the present invention has a first electrical connector located at one end of the second through hole and fixedly connected to the positive electrode substrate, and the other end of the first electrical connector facing away from the positive electrode substrate is adapted to be separably disposed from the auxiliary test component; before applying pressure to the adapter, the upper and lower clamps need to be aligned, specifically in the alignment of the first electrical connector with the first through hole in the auxiliary test component, so as to ensure that after the adapter is subjected to force, the first electrical connector passes through the first through hole and contacts the cathode of the auxiliary test diode. At this time, the first electrical connector will not come into contact with other conductive components, ensuring the smooth progress of the test process.

[0028] 5. The press-fit type IGBT sub-module test adapter provided by the present invention has one end of the first electrical connector that is separable from the positive electrode substrate, and the other end of the first electrical connector that is adapted to be fixedly connected to the upper insulating plate. A first limiting member is provided on the side surface of the positive electrode substrate facing the inductor connection substrate, and the first limiting member is located in the second through hole. The end of the first electrical connector away from the upper insulating plate is adapted to be inserted into the first limiting hole of the first limiting member, which serves to fix the first electrical connector and prevent the first electrical connector from tilting when pressure is applied to the adapter, thus avoiding poor contact between the first electrical connector and the positive electrode substrate and ensuring the electrical connection effect between the first electrical connector and the positive electrode substrate.

[0029] 6. The pressure-fitting IGBT sub-module testing equipment provided by the present invention provides a support component on the conductive substrate to support the upper clamp, thereby making the pressure on the IGBT sub-module more uniform and reducing the probability of IGBT sub-module failure during testing. Attached Figure Description

[0030] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0031] Figure 1 This is a front view of the crimped IGBT sub-module test adapter provided in an embodiment of the present invention;

[0032] Figure 2 for Figure 1 The right view of the upper clamp shown;

[0033] Figure 3 for Figure 1 The top view of the upper clamp shown;

[0034] Figure 4 for Figure 1 The front view of the lower clamp is shown;

[0035] Figure 5 for Figure 1 Top view of the lower clamp shown;

[0036] Figure 6 for Figure 1 The diagram shows the structure of the lower clamp.

[0037] Figure 7 for Figure 1 The diagram shows the structure of the test component.

[0038] Figure 8 for Figure 1 The main view of the test component shown;

[0039] Figure 9 for Figure 1 The diagram shows the structural schematic of the support component.

[0040] Figure 10 This is a test circuit diagram of the crimped IGBT sub-module test equipment provided in an embodiment of the present invention;

[0041] Figure 11 This is a schematic diagram of the electrical connection of the crimped IGBT sub-module testing equipment provided in an embodiment of the present invention.

[0042] Explanation of reference numerals in the attached figures:

[0043] 11-Negative electrode substrate; 12-First insulating plate; 13-Positive electrode substrate; 14-Second insulating plate; 15-Inductor connection substrate; 16-Second through hole; 17-Third through hole; 18-Gate-emitter assembly; 181-Emitter probe; 182-Gate probe; 183-Insulating connection part; 19-Insulating pin; 21-Conductive substrate; 22-Support assembly; 221-Support part; 222-Adjustment part; 23-Testing assembly; 231-Upper insulating plate; 232-First through hole; 233-Lower insulating plate; 234-Receiving cavity; 235-Second fastener; 24-Positioning assembly; 241-Conductive adapter; 242-First fastener; 243-Second groove; 3-First electrical connector; 4-Second electrical connector; 5-First limiting member; 6-Second limiting member; 7-Drive unit. Detailed Implementation

[0044] As described in the background section, existing adapters exhibit uneven pressure during testing, which can easily lead to the failure of IGBT sub-modules.

[0045] Existing electrical characteristic testing equipment applies pressure to an adapter during testing to electrically connect the emitter, collector, and gate of the IGBT sub-module to the adapter. Then, leads are used to electrically connect the adapter to other components of the testing equipment for electrical testing. In other words, the adapter is used to establish the electrical connection between the IGBT sub-module and the testing equipment, avoiding direct connection between the IGBT sub-module and other components, thus reducing lead complexity, lead length, and parasitic inductance. However, when the pressure applied to the adapter is concentrated on the IGBT sub-module under test, uneven pressure can easily occur, leading to localized overvoltage and overheating, which can easily cause IGBT sub-module failure.

[0046] Based on this, the present invention provides a press-fit IGBT sub-module test adapter, comprising: an upper clamp and a lower clamp, the lower clamp being adapted to be disposed opposite to the upper clamp; the upper clamp including a negative electrode substrate; the lower clamp including: a conductive substrate; a height-adjustable support component located on the conductive substrate, one end of the support component facing away from the conductive substrate being adapted to contact the upper clamp; a positioning component located on the conductive substrate, the positioning component being adapted to accommodate the IGBT sub-module; and a probe, the probe being adapted to be located between the negative electrode substrate and the IGBT sub-module, the conductive substrate being adapted to be electrically connected to the collector of the IGBT sub-module. The press-fit IGBT sub-module test adapter makes the pressure on the IGBT sub-module more uniform, reducing the probability of IGBT sub-module failure during testing.

[0047] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0048] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0049] See Figure 1 This embodiment provides a press-fit IGBT sub-module test adapter, including: an upper clamp and a lower clamp, the lower clamp being adapted to be disposed opposite to the upper clamp; the upper clamp including a negative electrode substrate 11; the lower clamp including: a conductive substrate 21; a height-adjustable support component 22 located on the conductive substrate 21, one end of the support component 22 facing away from the conductive substrate 21 being adapted to contact the upper clamp; a positioning component 24 located on the conductive substrate 21, the positioning component 24 being adapted to accommodate the IGBT sub-module; and a probe, the probe being adapted to be located between the negative electrode substrate 11 and the IGBT sub-module, the conductive substrate 21 being adapted to be electrically connected to the collector of the IGBT sub-module.

[0050] The aforementioned press-fit IGBT sub-module test adapter includes a support component 22, a positioning component 24, an IGBT sub-module, and a probe between the negative electrode substrate 11 and the conductive substrate 21 during testing. The positioning component 24 is located on the conductive substrate 21, the IGBT sub-module is located within the positioning component 24, and the probe is located between the negative electrode substrate 11 and the IGBT sub-module. One end of the conductive substrate 21 is located on the conductive substrate 21, and the other end contacts the upper clamp. The support component 22, positioned between the upper and lower clamps, supports the upper clamp, thereby ensuring more uniform pressure on the IGBT sub-module and reducing the probability of IGBT sub-module failure during testing. Furthermore, the height of the support component 22 can be adjusted according to the height of the IGBT sub-module under test, providing significant flexibility. Specifically, when the height of the IGBT sub-module under test is large, the height of the support component 22 is increased; when the height of the IGBT sub-module under test is small, the height of the support component 22 is decreased.

[0051] See Figure 9 In this embodiment, the support assembly 22 includes a support portion 221 and an adjustment portion 222 connected to the support portion 221. The adjustment portion 222 is adapted to connect to the conductive substrate 21 and adjust the distance between the support portion 221 and the conductive substrate 21. Specifically, the adjustment portion 222 is a stud; the conductive substrate 21 has a first groove, and the sidewall of the first groove has an internal thread. The adjustment portion 222 is adapted to be screwed into the internal thread. The height of the support assembly 22 is adjusted by screwing the adjustment portion 222 in or out.

[0052] See Figure 5In this embodiment, the positioning component 24 includes: a conductive adapter 241, wherein a second groove 243 is provided in the conductive adapter 241, and the IGBT sub-module is adapted to be embedded in the second groove 243; and a first fastener 242, which is adapted to penetrate the conductive adapter 241 through the side of the first groove and extend into the conductive substrate 21 at least partially. The conductive adapter 241 is located on the surface of the conductive substrate 21, realizing an electrical connection between the conductive adapter 241 and the conductive substrate 21; after the IGBT sub-module is embedded in the second groove 243, the collector of the IGBT sub-module is electrically connected to the conductive adapter 241, and then the collector of the IGBT sub-module is electrically connected to the conductive substrate 21. The positioning component 24 not only ensures the electrical connection between the conductive substrate 21 and the collector of the IGBT sub-module, but also defines the position of the IGBT sub-module in the adapter and fixes the IGBT sub-module, so that the IGBT sub-module can be stably fixed in the adapter throughout the entire test process, ensuring the smooth progress of the test.

[0053] In this embodiment, the conductive substrate 21 may be made of copper busbar; further, the conductive substrate 21 may be made of a good conductor with high conductivity, such as copper; the conductive adapter 241 may be made of a good conductor with high conductivity, such as copper.

[0054] Based on the testing principles of electrical testing, electrical characteristic testing equipment requires a test diode, which is electrically connected to the adapter. However, because the test diode is independently located outside the adapter, its electrical connection to the adapter requires a long lead, which generates a large parasitic inductance in the power loop, affecting the accuracy of the test results.

[0055] See Figure 1In this embodiment, the press-fit IGBT sub-module test adapter further includes a test companion component 23, which is adapted to be located on the conductive substrate 21 and on the side of the support component 22 and the positioning component 24. The test companion component 23 is adapted to accommodate the test companion diode. The upper clamp further includes a positive electrode substrate 13 and an inductor connection substrate 15. The negative electrode substrate 11, the positive electrode substrate 13, and the inductor connection substrate 15 are stacked and spaced apart. The positive electrode substrate 13 is adapted to be electrically connected to the cathode of the test companion diode, and the conductive substrate 21 is also adapted to be electrically connected to the anode of the test companion diode and the inductor connection substrate 15. By setting the test companion component 23 on the conductive substrate 21, the test companion diode can be placed inside the adapter, and the electrical connection between the test companion diode and the adapter can be achieved without using long leads. This reduces the effective length of the power circuit, thereby reducing the parasitic inductance of the power circuit, reducing overvoltage and oscillation phenomena during switching, and improving the accuracy of test results.

[0056] See Figure 1 In this embodiment, the press-fit IGBT sub-module test adapter further includes: a first electrical connector 3, adapted to be located between the upper and lower clamps, with both ends of the first electrical connector 3 adapted to contact the cathode of the test diode and the positive substrate 13 respectively, to achieve an electrical connection between the cathode of the test diode and the positive substrate 13; and a second electrical connector 4, adapted to be located between the upper and lower clamps, with both ends of the second electrical connector 4 adapted to contact the conductive substrate 21 and the inductive connection substrate 15 respectively, to achieve an electrical connection between the conductive substrate 21 and the inductive connection substrate 15. Further, both the first electrical connector 3 and the second electrical connector 4 are elastic members; both the first electrical connector 3 and the second electrical connector 4 include spring probes. In this embodiment, the anode of the test diode faces the conductive substrate 21, and the cathode faces the positive substrate 13.

[0057] Furthermore, the number of the first electrical connector 3 is one or more. Preferably, see [reference needed]. Figure 1 The number of first electrical connectors 3 is multiple. If there is only one first electrical connector 3, then if the first electrical connector 3 does not contact the cathode of the test diode and / or the positive substrate 13, then the electrical connection between the cathode of the test diode and the positive substrate 13 cannot be achieved, resulting in the inability to perform electrical characteristic testing normally. Multiple first electrical connectors 33 can reduce the probability of electrical connection failure between the cathode of the test diode and the positive substrate 13, ensuring that electrical characteristic testing can be performed normally.

[0058] Furthermore, the number of the second electrical connector 4 is one or more. See also Figure 1 Preferably, there are multiple second electrical connectors 4. If there is only one second electrical connector 4, then if the second electrical connector 4 does not contact the conductive substrate 21 and / or the inductive connection substrate 15, an electrical connection between the conductive substrate 21 and the inductive connection substrate 15 cannot be achieved, resulting in the inability to perform electrical characteristic tests normally. Multiple second electrical connectors 4 can reduce the probability of electrical connection failure between the conductive substrate 21 and the inductive connection substrate 15, ensuring that electrical characteristic tests can be performed normally. Preferably, the orthographic projection of the second electrical connector 4 on the conductive substrate 21 surrounds the conductive adapter 241.

[0059] As an optional implementation, the surfaces of the first electrical connector 3 and the second electrical connector 4 are plated with gold to reduce contact resistance, thereby reducing the parasitic resistance of the adapter; furthermore, the first electrical connector 3 and the second electrical connector 4 are made of oxygen-free copper material.

[0060] During the electrical characteristic testing of IGBT sub-modules, it is necessary to press the test diode. Existing electrical characteristic testing equipment involves applying and removing pressure to the test diode at the beginning and end of each test. Repeated pressing of the test diode can damage it and affect its service life.

[0061] In this embodiment, see Figures 7-8The accompanying test assembly 23 includes: an upper insulating plate 231 and a lower insulating plate 233 arranged at relative intervals, and a second fastener 235 for connecting the upper insulating plate 231 and the lower insulating plate 233; the upper insulating plate 231 is provided with a first through hole 232, and the first electrical connector 3 is adapted to pass through the first through hole 232; the lower insulating plate 233 is adapted to be fixed on the conductive substrate 21, and the lower insulating plate 233 has a receiving cavity 234 penetrating the lower insulating plate 233, and the accompanying test diode is adapted to be embedded in the receiving cavity 234, which avoids horizontal displacement of the accompanying test diode, improves the stability of the accompanying test diode on the conductive substrate 21, and thus ensures a stable electrical connection between the anode of the accompanying test diode and the conductive substrate 21, which is beneficial to ensuring the smooth progress of electrical characteristic testing; the second fastener 235... 5. The auxiliary diode is confined between the upper insulating plate 231 and the lower insulating plate 233 to press-fit the auxiliary diode for electrical characteristic testing. Since the structure of the auxiliary component 23 remains constant during the test, the auxiliary diode is always in a press-fit state with constant pressure, avoiding repeated pressure application and depressurization of the auxiliary diode during the electrical characteristic test, thus improving the lifespan of the auxiliary diode. At the same time, the force on the auxiliary diode can be controlled by adjusting the distance between the upper insulating plate 231 and the lower insulating plate 233 through the second fastener 235. The smaller the distance between the upper insulating plate 231 and the lower insulating plate 233, the greater the force on the auxiliary diode. In addition, the auxiliary component 23 has a simple structure, and when problems such as auxiliary diode failure occur during the test, the auxiliary diode can be replaced in time, which helps to improve the test efficiency.

[0062] Further, see Figure 7 The second fastener 235 is multiple and arranged around the center of the auxiliary testing component 23 to make the pressure distribution of the auxiliary testing diode more uniform. Specifically, as shown in... Figures 7-8 As shown, the second fastener 235 is located at the four corners of the test component 23. In one embodiment, the second fastener 235 is adapted to penetrate the upper insulating plate 231, the lower insulating plate 233, and the conductive substrate 21; in other embodiments, the second fastener 235 is adapted to penetrate the upper insulating plate 231 and a portion of the depth of the lower insulating plate 233, the conductive substrate 21 is provided with a third groove, and the test component 23 is adapted to be embedded in the third groove. The second fastener 235 can be a bolt.

[0063] Furthermore, such as Figure 8As shown, the upper insulating plate 231 has a third groove of a certain depth on the side facing the lower insulating plate 233. The top of the auxiliary diode is embedded in the third groove. The third groove further restricts the auxiliary diode, improves the stability of the auxiliary diode, and reduces the distance between the upper insulating plate 231 and the lower insulating plate 233, thereby reducing the longitudinal dimension of the auxiliary component 23. This is beneficial for reducing the longitudinal dimension of the adapter and realizing the miniaturization of the adapter.

[0064] In this embodiment, see Figure 3 The probe is part of the gate-emitter assembly 18, and includes an emitter probe 181 and a gate probe 182. One end of the emitter probe 181 is fixed to the negative substrate 11, and the emitter probe 181 is adapted to electrically connect the negative substrate 11 and the emitter of the IGBT sub-module. The gate-emitter assembly 18 also includes an insulating connection portion 183. The insulating connection portion 183 is located between the negative substrate 11 and one end of the gate probe 182, and the other end of the gate probe 182 away from the insulating connection portion 183 is adapted to contact the gate of the IGBT sub-module. The insulating connection portion 183 is used to isolate the gate probe 182 and the negative substrate 11, preventing the gate probe 182 and the emitter test probe from being electrically connected to the negative substrate 11 simultaneously. Specifically, the insulating connection portion 183 is embedded in the negative electrode substrate 11, and one end of the gate probe 182 is embedded in the insulating connection portion 183 to a certain depth. The gate probe 182 can be fixed in the insulating connection portion 183 by bolts. Further, one end of the emitter probe 181 is welded to one side surface of the negative electrode substrate 11.

[0065] It is important to understand that the relative positions and numbers of the emitter probe 181 and gate probe 182 are adapted to the relative positions and numbers of the emitter and gate of the IGBT sub-module, and the lengths of the emitter probe 181 and gate probe 182 are adapted to ensure that when the emitter probe 181 contacts the emitter of the IGBT sub-module, the gate probe 182 contacts the gate of the IGBT sub-module. Specifically, when the insulating connection portion 183 protrudes from the surface of the negative electrode substrate 11, the length of the compressed gate probe 182 is less than that of the compressed emitter probe 181. The height of the support assembly 22 is adjusted according to the height of the compressed emitter probe 181 and gate probe 182 to ensure uniform pressure in the IGBT sub-module and to ensure the electrical connection effect of the emitter probe 181 and gate probe 182. To further ensure uniform pressure in the IGBT sub-module, the shape and size of the emitter probe 181 are the same as those of the emitter of the IGBT sub-module, and the shape and size of the gate probe 182 are the same as those of the gate of the IGBT sub-module.

[0066] In one embodiment, such as Figures 1-2 As shown, the negative electrode substrate 11, the positive electrode substrate 13, and the inductor connection substrate 15 are stacked sequentially. A first insulating plate 12 is disposed between the positive electrode substrate 13 and the negative electrode substrate 11, and a second insulating plate 14 is disposed between the inductor connection substrate 15 and the positive electrode substrate 13. The upper clamp is provided with a second through hole 16 penetrating the inductor connection substrate 15 and the second insulating plate 14, and a third through hole 17 penetrating the inductor connection substrate 15, the second insulating plate 14, the positive electrode substrate 13, and the first insulating plate 12 in sequence. The second through hole 16 is adapted to be located directly above the test component 23. One end of the first electrical connector 3 is adapted to be located in the second through hole 16, and the other end of the first electrical connector 3 is adapted to be located in the first through hole 232. The third through hole 17 is located directly above the positioning component 24, and the probe extends along the third through hole 17. Specifically, the emitter probe 181 is disposed on the surface of the negative electrode substrate 11 facing the positive electrode substrate 13 and does not contact the positive electrode substrate 13 or the inductor connection substrate 15. The end of the emitter probe 181 facing away from the negative electrode substrate 11 is adapted to contact the emitter of the IGBT sub-module. The first insulating plate 12 insulates the negative electrode substrate 11 from the positive electrode substrate 13, and the second insulating plate 14 insulates the positive electrode substrate 13 from the inductor connection substrate 15 to avoid leakage current affecting the test results during the test. It should be understood that the structure of the upper clamp includes, but is not limited to, the above-described structure.

[0067] Specifically, such as Figures 1-2 As shown, the negative electrode substrate 11 is connected to the first insulating plate 12, the first insulating plate 12 is connected to the positive electrode substrate 13, the positive electrode substrate 13 is connected to the second insulating plate 14, and the second insulating plate 14 is connected to the inductor connection substrate 15 via insulating pins 19. The negative electrode substrate 11, the positive electrode substrate 13, and the inductor connection substrate 15 can be made of copper busbars; furthermore, the negative electrode substrate 11, the positive electrode substrate 13, and the inductor connection substrate 15 can be made of high-conductivity conductors such as copper. Since copper not only has good conductivity and high hardness but also high temperature resistance, when the conductive substrate 21, the negative electrode substrate 11, the positive electrode substrate 13, and the inductor connection substrate 15 are all made of copper, the adapter has good high-temperature resistance and is suitable for high-temperature testing of IGBT sub-modules. The first insulating plate 12 and the second insulating plate 14 can be made of high-insulation materials with high temperature resistance; furthermore, the first insulating plate 12 and the second insulating plate 14 are made of phenolic resin.

[0068] Furthermore, the sum of the compressed length of the first electrical connector 3 and the thickness of the test diode is equal to the thickness of the inductor connection substrate 15, the thickness of the second insulating plate 14, the distance from the bottom of the second groove 243 in the conductive adapter 241 to the upper surface of the conductive substrate 21, and the compressed length of the second electrical connector 4.

[0069] As a first implementation method, such as Figure 4 As shown, one end of the first electrical connector 3 is detachably disposed from the positive electrode substrate 13, and the other end of the first electrical connector 3 is adapted to be fixedly connected to the upper insulating plate 231. Specifically, one end of the first electrical connector 3 is fixed in the first through hole 232. When pressure is applied to the adapter, one end of the first electrical connector 3 contacts the cathode of the auxiliary diode, and the other end contacts the positive electrode substrate 13; after the pressure is unloaded, the first electrical connector 3 separates from the positive electrode substrate 13 and the cathode of the auxiliary diode.

[0070] Furthermore, to prevent the first electrical connector 3 from becoming misaligned when pressure is applied to the adapter, thus causing poor contact between the first electrical connector 3 and the positive electrode substrate 13, such as... Figure 3 As shown, a first limiting member 5 is provided on the surface of the positive electrode substrate 13 facing the inductor connection substrate 15, and the first limiting member 5 is located in the second through hole 16; the first limiting member 5 has a first limiting hole penetrating the first limiting member 5, and the end of the first electrical connector 3 facing away from the upper insulating plate 231 is adapted to be inserted into the first limiting hole, which serves to fix the first electrical connector 3 and ensure the electrical connection effect between the first electrical connector 3 and the positive electrode substrate 13. The first limiting member 5 can be a spring contact finger.

[0071] Furthermore, the cross-sectional area of ​​the second through hole 16 is greater than or equal to the area of ​​the orthographic projection of the test component 23 onto the conductive substrate 21. Before applying pressure to the adapter, the upper and lower clamps need to be aligned so that the end of the first electrical connector 3 facing away from the upper insulating plate 231 passes through the second through hole 16 and contacts only the positive electrode substrate 13. By limiting the cross-sectional area of ​​the second through hole 16 as described above, the risk of the first electrical connector 3 contacting the inductor connection substrate 15 while in contact with the positive electrode substrate 13 is effectively reduced, thereby ensuring the smooth progress of the test process.

[0072] In a second embodiment, the first electrical connector 3 is fixedly connected to the positive electrode substrate 13 at one end of the second through hole 16, and the other end of the first electrical connector 3 facing away from the positive electrode substrate 13 is adapted to be detachably disposed from the auxiliary testing component 23. Before applying pressure to the adapter, the upper and lower clamps need to be aligned, specifically the alignment of the first electrical connector 3 with the first through hole 232 in the auxiliary testing component 23, to ensure that after the adapter is subjected to force, the first electrical connector 3 passes through the first through hole 232 and contacts the cathode of the auxiliary testing diode. At this time, the first electrical connector 3 will not come into contact with other conductive components, ensuring the smooth progress of the test process. When pressure is applied to the adapter, the other end of the first electrical connector 3 facing away from the positive electrode substrate 13 contacts the cathode of the auxiliary testing component 23; after the pressure is unloaded, the other end of the first electrical connector 3 facing away from the positive electrode substrate 13 separates from the cathode of the auxiliary testing component 23.

[0073] As an optional implementation, the accompanying test assembly 23 further includes a voltage-conducting block embedded in the third groove. The side surface of the voltage-conducting block facing away from the upper insulating plate 231 is adapted to contact the cathode of the accompanying test diode to achieve an electrical connection, and the side surface of the voltage-conducting block facing the upper insulating plate 231 is adapted to be electrically connected to the first electrical connector 3. When one end of the first electrical connector 3 located in the second through hole 16 is fixedly connected to the positive substrate 13 and the other end is detachably connected to the auxiliary testing component 23, as long as the other end of the first electrical connector 3 facing away from the positive substrate 13 contacts the voltage-conducting block after pressure is applied to the adapter, the first electrical connector 3 can be electrically connected to the cathode of the auxiliary testing diode and the positive substrate 13. When one end of the first electrical connector 3 is detachably connected to the positive substrate 13 and the other end is fixedly connected to the upper insulating plate 231, the other end of the first electrical connector 3 is embedded in the voltage-conducting block. As long as one end of the first electrical connector 3 contacts the positive substrate 13 after pressure is applied to the adapter, the first electrical connector 3 can be electrically connected to the cathode of the auxiliary testing diode and the positive substrate 13. The voltage-conducting block serves as an intermediate material to facilitate the electrical connection between the cathode of the auxiliary testing diode and the first electrical connector 3.

[0074] As an optional implementation, the upper insulating plate 231 has a fourth groove on the side opposite to the lower insulating plate 233. The second fastener 235 is located in the fourth groove, penetrates the upper insulating plate 231, and extends to at least a portion of the depth of the lower insulating plate 233. Specifically, when the second fastener 235 is a bolt, the head of the bolt is located in the fourth groove, and the bolt shank penetrates the upper insulating plate 231 and extends to at least a portion of the depth of the lower insulating plate 233. When the size of the second through hole 16 is greater than or equal to the size of the orthographic projection of the test component 23 on the positive electrode substrate 13, if the pressure applied to the adapter is large, the upper part of the test component 23 can be embedded in the second through hole 16 during the test, so that the end of the second fastener 235 protruding from the upper insulating plate 231 contacts the positive electrode substrate 13; however, if the second fastener 235 penetrates the lower insulating plate 233 and the conductive substrate 21, then the positive electrode substrate 13 and the conductive substrate 21 are electrically connected through the second fastener 235. This causes the current to no longer flow through the test diode when the IGBT sub-module under test is turned off, but directly through the second fastener 235, which may lead to overvoltage breakdown of the IGBT sub-module under test; by setting the fourth groove, the second fastener 235 does not protrude from the upper insulating plate 231, avoiding contact between the second fastener 235 and the positive electrode substrate 13, thereby avoiding electrical connection between the positive electrode substrate 13 and the conductive substrate 21, and ensuring the smooth progress of the test.

[0075] In a first embodiment, the second electrical connector 4 is fixedly connected to the conductive substrate 21, and the other end of the second electrical connector 4 facing away from the conductive substrate 21 is adapted to be separably disposed from the inductive connection substrate 15. When pressure is applied to the adapter, the other end of the second electrical connector 4 facing away from the conductive substrate 21 contacts the inductive connection substrate 15; after the pressure is released, the other end of the second electrical connector 4 facing away from the conductive substrate 21 separates from the inductive connection substrate 15. Further, a second limiting member 6 is provided on the inductive connection substrate 15, and the second limiting member 6 has a second limiting hole penetrating through the second limiting member 6. The end of the second electrical connector 4 facing away from the conductive substrate 21 is adapted to be inserted into the second limiting hole.

[0076] As a second implementation method, see Figures 1-2The second electrical connector 4 is fixedly connected to the inductor connection substrate 15, and the other end of the second electrical connector 4 facing away from the inductor connection substrate 15 is adapted to be separable from the surface of the conductive substrate 21. When pressure is applied to the adapter, the other end of the second electrical connector 4 facing away from the inductor connection substrate 15 contacts the surface of the conductive substrate 21; after the pressure is released, the other end of the second electrical connector 4 facing away from the inductor connection substrate 15 separates from the surface of the conductive substrate 21. Further, as... Figure 5 As shown, a second limiting member 6 is provided on the surface of the conductive substrate 21. The second limiting member 6 has a second limiting hole that penetrates through the second limiting member 6. The end of the second electrical connector 4 facing away from the inductor connection substrate 15 is adapted to be inserted into the second limiting hole.

[0077] Specifically, the second limiting member 6 serves to fix the second electrical connector 4, ensuring the electrical connection between the second electrical connector 4 and the inductor connection substrate 15; the second limiting member 6 can be a spring contact finger.

[0078] In one embodiment, the number of positioning components 24 is one, and the auxiliary testing component 23 is located between the support component 22 and the positioning component 24. It should be understood that the pressure applied by the auxiliary testing diode during the test comes from the limiting effect of the auxiliary testing component 23. Therefore, the first electrical connector 3 does not bear pressure but mainly serves an electrical connection function. The main pressure-bearing components are the IGBT sub-module, the gate-emitter assembly 18, and the support component 22. The support component 22 makes the pressure on the IGBT sub-module more uniform, thereby improving the test accuracy.

[0079] This embodiment also provides a crimp-type IGBT submodule testing device, including the aforementioned crimp-type IGBT submodule testing adapter. The crimp-type IGBT submodule testing device possesses all the advantages of the crimp-type IGBT submodule testing adapter, which will not be elaborated further here.

[0080] In this embodiment, see Figure 11 The press-fit IGBT sub-module testing equipment further includes: an inductor coil, one end of which is electrically connected to the inductor connection substrate 15; a power supply, the positive terminal of which is electrically connected to the other end of the inductor coil and the positive substrate 13, and the negative terminal of which is electrically connected to the negative substrate 11; a driving unit 7, which is electrically connected to the gate of the IGBT sub-module and the negative substrate 11; a pressure applying device for applying pressure to the adapter; and a heating device adapted to be located below the conductive substrate 21 for heating the IGBT sub-module during high-temperature testing.

[0081] Specifically, a lead is used to connect one end of the inductor coil to the inductor connection substrate 15, a lead is used to connect the positive terminal of the power supply to the other end of the inductor coil and the positive terminal of the power supply to the positive terminal substrate 13, a lead is used to connect the negative terminal of the power supply to the negative terminal substrate 11, and a lead is used to connect the driving unit 7 to the gate probe 182 and the driving unit 7 to the negative terminal substrate 11.

[0082] During testing, the auxiliary test component 23 and the auxiliary test diode are first fixed into the first groove by the second fastener 235, and the pressure applied by the auxiliary test diode is controlled by the second fastener 235. The IGBT sub-module is then placed in the second groove 243. The upper and lower clamps are then aligned so that after pressure is applied to the adapter, the gate probe 182 can contact the gate, the emitter probe 181 can contact the emitter, the first electrical connector 3 can contact the positive substrate 13 and the cathode of the auxiliary test diode, and the second electrical connector 4 can contact the conductive substrate 21 and the inductive connection substrate 15. Then, pressure is applied to the adapter by the pressure application device.

[0083] The test circuit of the press-fit type IGBT sub-module test equipment in this embodiment is as follows: Figures 10-11 As shown, the drive circuit provides drive signals to the IGBT sub-module, and the power circuit provides voltage to the IGBT sub-module for various electrical characteristic tests of the IGBT, such as switching tests and RBSOA tests. Specifically, the drive circuit is: drive unit 7—negative substrate 11—emitter probe 181 in the gate-emitter assembly 18—emitter of the IGBT sub-module—gate of the IGBT sub-module—gate probe 182 in the gate-emitter assembly 18—drive unit 7; the power circuit is: positive power supply—inductor coil—inductor connection substrate 15—second electrical connector 4—conductive substrate 21—collector of the IGBT sub-module—emitter of the IGBT sub-module—emitter probe 181 in the gate-emitter assembly 18—negative substrate 11—negative power supply; the auxiliary test circuit is: inductor coil—inductor connection substrate 15—second electrical connector 4—conductive substrate 21—anode of the auxiliary test diode—cathode of the auxiliary test diode—first electrical connector 3—positive substrate 13—inductor coil. During the test, the test diode is connected in parallel with the inductor coil. The current in the test diode is opposite to the current in the IGBT sub-module. During the switching process, the test diode and the IGBT sub-module are in a complementary coaxial state, which effectively cancels the stray inductance from the adapter itself and reduces interference from external signals.

[0084] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. A crimp-type IGBT sub-module test adapter, characterized in that, The system includes an upper clamp, a lower clamp, and a test assembly. The lower clamp is adapted to be disposed opposite to the upper clamp. The upper clamp includes a negative electrode substrate, a positive electrode substrate, and an inductor connection substrate that are stacked and spaced apart. The lower clamp includes: Conductive substrate; A height-adjustable support assembly located on the conductive substrate, wherein one end of the support assembly facing away from the conductive substrate is adapted to contact the upper clamp. A positioning component located on the conductive substrate, the positioning component being adapted to accommodate an IGBT sub-module; A probe, the probe being adapted to be located between the negative electrode substrate and the IGBT sub-module, the conductive substrate being adapted to be electrically connected to the collector of the IGBT sub-module; The companion testing component is located on the conductive substrate. The companion testing component is adapted to accommodate the companion testing diode. The positive electrode substrate is adapted to be electrically connected to the cathode of the companion testing diode. The conductive substrate is adapted to be electrically connected to the anode of the companion testing diode and the inductor connection substrate.

2. The crimp-type IGBT sub-module test adapter according to claim 1, characterized in that, The support assembly includes a support portion and an adjustment portion connected to the support portion. The adjustment portion is adapted to connect to the conductive substrate and adjust the spacing between the support portion and the conductive substrate.

3. The crimp-type IGBT sub-module test adapter according to claim 2, characterized in that, The adjusting part is a stud; a first groove is provided in the conductive substrate, and the sidewall of the first groove is provided with an internal thread, and the adjusting part is adapted to be screwed into the internal thread.

4. The press-fit type IGBT sub-module test adapter according to claim 1, characterized in that, The positioning component includes: a conductive adapter having a second groove, the IGBT sub-module being adapted to be embedded in the second groove; and a first fastener adapted to penetrate the conductive adapter through a side portion of the first groove and extend into the conductive substrate at least partially.

5. The crimp-type IGBT sub-module test adapter according to claim 1, characterized in that, The probe is part of the gate-emitter assembly, and the probe includes an emitter probe and a gate probe; one end of the emitter probe is fixed on the negative electrode substrate, and the emitter probe is adapted to electrically connect the negative electrode substrate and the emitter of the IGBT sub-module; The gate-emitter assembly further includes an insulating connection portion; the insulating connection portion is located between the negative electrode substrate and one end of the gate probe, and the other end of the gate probe away from the insulating connection portion is adapted to contact the gate of the IGBT sub-module.

6. The crimp-type IGBT sub-module test adapter according to claim 1, characterized in that, The accompanying testing component is located on the side of the support component and the positioning component.

7. The press-fit type IGBT sub-module test adapter according to claim 6, characterized in that, Also includes: A first electrical connector is adapted to be located between the upper clamp and the lower clamp, and both ends of the first electrical connector are adapted to contact the cathode of the test diode and the positive electrode substrate, respectively. A second electrical connector is adapted to be located between the upper clamp and the lower clamp, and both ends of the second electrical connector are adapted to contact the conductive substrate and the inductive connection substrate, respectively.

8. The press-fit type IGBT sub-module test adapter according to claim 7, characterized in that, The accompanying test assembly includes: an upper insulating plate and a lower insulating plate arranged at relative intervals, and a second fastener for connecting the upper insulating plate and the lower insulating plate; the upper insulating plate is provided with a first through hole, and the first electrical connector is adapted to pass through the first through hole; the lower insulating plate is adapted to be fixed on the conductive substrate, and the lower insulating plate has a receiving cavity penetrating the lower insulating plate, and the accompanying test diode is adapted to be embedded in the receiving cavity.

9. The press-fit type IGBT sub-module test adapter according to claim 8, characterized in that, The second fastener is adapted to penetrate the upper insulating plate, the lower insulating plate, and the conductive substrate; or, the second fastener is adapted to penetrate the upper insulating plate and a portion of the depth of the lower insulating plate, the conductive substrate being provided with a third groove, and the accompanying testing component being adapted to be embedded in the third groove.

10. The press-fit type IGBT sub-module test adapter according to claim 8, characterized in that, The negative electrode substrate, positive electrode substrate, and inductor connection substrate are stacked sequentially. A first insulating plate is disposed between the positive electrode substrate and the negative electrode substrate, and a second insulating plate is disposed between the inductor connection substrate and the positive electrode substrate. The upper clamp is provided with a second through hole penetrating the inductor connection substrate and the second insulating plate, and a third through hole penetrating the inductor connection substrate, the second insulating plate, the positive electrode substrate, and the first insulating plate sequentially. The second through hole is adapted to be located directly above the test component. One end of the first electrical connector is adapted to be located in the second through hole. The third through hole is located directly above the positioning component, and the probe extends along the third through hole.

11. The crimped IGBT sub-module test adapter according to claim 10, characterized in that, The first electrical connector is fixedly connected to the positive electrode substrate at one end of the second through hole, and the other end of the first electrical connector facing away from the positive electrode substrate is adapted to be detachably disposed from the test component.

12. The crimp-type IGBT sub-module test adapter according to claim 10, characterized in that, One end of the first electrical connector is separable from the positive electrode substrate, and the other end of the first electrical connector is adapted to be fixedly connected to the upper insulating plate.

13. The crimped IGBT sub-module test adapter according to claim 12, characterized in that, A first limiting member is provided on the side surface of the positive electrode substrate facing the inductor connection substrate, and the first limiting member is located in the second through hole; the first limiting member has a first limiting hole that penetrates the first limiting member, and the end of the first electrical connector facing away from the upper insulating plate is adapted to be inserted into the first limiting hole.

14. The press-fit type IGBT sub-module test adapter according to claim 7, characterized in that, The second electrical connector is fixedly connected to the conductive substrate, and the other end of the second electrical connector facing away from the conductive substrate is adapted to be detachably disposed from the inductive connection substrate; or, the second electrical connector is fixedly connected to the inductive connection substrate, and the other end of the second electrical connector facing away from the inductive connection substrate is adapted to be detachably disposed from the conductive substrate.

15. The press-fit IGBT sub-module test adapter according to claim 7, characterized in that, Both the first electrical connector and the second electrical connector are elastic elements; both the first electrical connector and the second electrical connector include a spring probe.

16. A testing device for a press-fit type IGBT sub-module, characterized in that, The test adapter for the crimped IGBT sub-module as described in any one of claims 1 to 15.

17. The crimped IGBT sub-module testing equipment according to claim 16, characterized in that, The press-fit IGBT sub-module test adapter further includes a positive electrode substrate and an inductor connection substrate, wherein the negative electrode substrate, the positive electrode substrate, and the inductor connection substrate are stacked and spaced apart; the press-fit IGBT sub-module test equipment further includes: An inductor coil, one end of which is electrically connected to the inductor connection substrate; A power supply, wherein the positive terminal of the power supply is electrically connected to the other end of the inductor coil and the positive terminal substrate, and the negative terminal of the power supply is electrically connected to the negative terminal substrate. A driving unit is electrically connected to the gate of the IGBT sub-module and the negative electrode substrate.

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